Sony-Ericsson V800 Service Manual WORKING INSTRUCTION

Working Instruction, Electrical

Working Instruction, Electrical

Applicable for V800/ 802se

INDEX

1 LEAD FREE SOLDERING..........................................................................................................................................2

1.1 INTRODUCTION.........................................................................................................................................................2

1.1.1 Environment.....................................................................................................................................................2

1.1.2 Soldering temperature .....................................................................................................................................3

2 BGA EQUIPMENT REFLOW PROFILES ...............................................................................................................5

2.1 TEMPERATURE MEASUREMENT ................................................................................................................................5

2.1.1 Reflow Profiles ................................................................................................................................................6

3 REPLACEMENT OF PARTS......................................................................................................................................7

3.1 EQUIPMENT ..............................................................................................................................................................7

3.2 INSTRUCTION HOW REPLACING PARTS ......................................................................................................................7

3.2.1 External Antenna Connector ...........................................................................................................................8

3.2.2 30 PIN BTB Female Connector, behind the System Connector.......................................................................8

3.2.3 30 PIN BTB Female Connector.......................................................................................................................9

3.2.4 50 PIN BTB Female Connector.......................................................................................................................9

3.2.5 Battery Connector..........................................................................................................................................10

3.2.6 USB Connector ..............................................................................................................................................10

3.2.7 MS Duo and SIM Reader...............................................................................................................................11

3.2.8 Hall Element..................................................................................................................................................11

3.2.9 IrDa Module ..................................................................................................................................................12

3.2.10 Coax Connector.............................................................................................................................................12

4 REVISION HISTORY................................................................................................................................................13

3/000 21-2/FEA 209544/88 C

Company Internal

 Sony Ericsson Mobile Communications AB

Approved according to 000 21-LXE 107 42/1

Working Instruction, Electrical

1 Lead free soldering

In this chapter there is an introduction that will explain what is important to think about when
working with the product.

1.1 Introduction

This products soldering process is lead-free. It is important that all contact surfaces are kept
clean from dirt and hand-grease. During electrical repair, it is critical to make sure that no
lead is introduced.

1.1.1 Environment

The introduction of the environment is as follow:

Information text

1 This symbol indicates that the product is lead

free.

2 All lead free PCB will be marked with this

symbol, according to the arrow.

3/000 21-2/FEA 209544/88 C

Company Internal

 Sony Ericsson Mobile Communications AB

2(13)

Working Instruction, Electrical

Information text

3 A lead free work area must be set up that is

completely separated from work areas that are
used to make leaded repairs.

The lead-free work area must also be clearly
marked with the lead free symbol as shown in
the figure beside.

The items in this table must remain lead free.
They must be adequately marked to make their
lead free status clearly and easily recognized.

1.1.2 Soldering temperature

The characteristics of Lead Free Solder paste is:

• High melting point (Typically 220°C)

• Low wet ability

• High surface tension

• Difficult to spread

Recommended tip temperature 370°C

When servicing PCB´s that is produced with Lead Free Solder paste this paste must
Otherwise there is a high risk for unreliable soldering joints.

A smaller introduction of the solder temperature, with pictures, is as follow:

Information text

1 Lead Free Solder joints are more difficult to

inspect because they do not have shiny surfaces
like leaded solders joints.

Lead Free Solder does not flow as well as
leaded solder. Some of the solder pad area may
remain exposed.

The picture shows an example of Lead Free
Solders joints.

be used.

3/000 21-2/FEA 209544/88 C

Company Internal

 Sony Ericsson Mobile Communications AB

3(13)

Working Instruction, Electrical

Information text

2 The picture shows an example of solder joints

with lead.

3 The picture shows an example of lead free

solder joints.

4 The picture shows an example of solder joints

with lead.

3/000 21-2/FEA 209544/88 C

Company Internal

 Sony Ericsson Mobile Communications AB

4(13)