Debug interface when using embedded applications with GT 47
LZT 123 7717 R1B 6
To solder the wires for the GT47 debug interface, the GT47 SIM-card
needs to be removed and four wires must be soldered to the main PCB as
shown in the picture above.
2.2 Solder pads description:
The solder pads are described as pad 1 - 4 in the picture above. The
following signals are available on the solder pads:
• Pad 1 - The GT47 internal power supply of 3.8V (Note: This does
not have short circuit protection).
• Pad 2 - Enable input for activating the debug mode. This pad must
be connected to the 3.8V supply for activation.
• Pad 3 - Debug data stream from GT47 UART RD pin.
• Pad 4 - GT47 system ground.
2.3 Operation description:
For the operation of the GT47 debug port the following interface should be
soldered to the GT47:
Connect pad 1 directly to pad 2.
Attach a RS232 level shifter (e.g. MAX3232) to pad 3 for converting 2.7V
RD signal to RS232 signal levels. The supply voltage of 3.8V and GND
can be used for supplying the level shifter.
The connections to the Sony Ericsson RS232 level shifter are as follows:
T1 ---------------------- Pad 3 on GT47 (RD3)
T2 ---------------------- Pad 1 and 2 on the GT47 (3.8v and debug pads)
T5 ---------------------- Pad 5 on the GT47 (Ground)
A level shifter is recommended in the application note ‘RS232 interface for
GT47-GT48 Embedded applications UART’ with a provisional part number
of ROA - 1280000.
Note: The current consumption on pad 1 must not exceed 50mA.
These modifications should only be performed by skilled and trained
personal.
All signals on the pads are not short circuit proof and are not ESD
protected.