Sony XM-1505SX, XM-1805GX Service manual

XM-1505SX/1805GX
SERVICE MANUAL
Ver 1.1 2001.06
Photo: XM-1805GX
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION 40 watts/150 watts per channel minimum continuous average power into 4 ohms, 5channels driven from 50 Hz (1505SX), 20 Hz (1805GX) to 20 kHz/20 Hz to 300 Hz (subwoofer) with no more than 0.04% total harmonic distortion per Car Audio Ad Hoc Committee standards.
US Model
Canadian Model
XM-1505SX/1805GX
E Model
XM-1505SX
Other Specifications
Circuit system OTL (output transformerless) circuit
Pulse power supply Inputs RCA pin jacks Outputs Speaker terminals
Through out pin jacks Speaker impedance 2 – 8 (stereo)
4 – 8 (when used as a bridging amplifier)
1.3 – 8 (only for subwoofer output) (XM-1805GX) Maximum outputs 80 watts × 4 + 300 watts × 1 (at 4 Ω) Rated outputs (supply voltage at 14.4 V)
5 Speakers: 1505SX:
40 watts × 4 (50 Hz – 20 kHz, 0.04% THD, at 4 ) + 150 watts × 1 (20 – 300 Hz, 0.04% THD, at 4 Ω) 60 watts × 4 (50 Hz – 20 kHz, 0.1% THD, at 2 ) + 180 watts × 1 (20 – 300 Hz, 0.1% THD, at 2 Ω) 1805GX: 40 watts × 4 (Front: 50 Hz – 20 kHz, Rear: 20 Hz – 20 kHz, 0.04% THD, at 4 ) + 150 watts × 1 (20 – 300 Hz,
0.04% THD, at 4 Ω)
60 watts × 4 (Front: 50 Hz – 20 kHz, Rear: 20 Hz – 20 kHz, 0.1% THD, at 2 ) + 180 watts × 1 (20 – 300 Hz,
0.1% THD, at 2 Ω)
3 Speakers: 120 watts × 2 (50 Hz – 20 kHz, 0.1%
THD, at 4 ) + 150 watts × 1 (20 – 300 Hz, 0.04% THD, at 4 Ω)
Frequency response 5 Hz – 50 kHz ( dB) Harmonic distortion 0.005% or less (at 1 kHz, 4 Ω) Input level adjustment range
0.2 – 6.0 V (RCA pin jacks) High-pass filter 50 – 300 Hz, –12 dB/oct Low-pass filter 50 – 300 Hz, –12 dB/oct Phase shift adjustment range (XM-1805GX)
0° – 180° (at 40 Hz) (only for subwoofer output)
Power requirements 12 V DC car battery
(negative ground) Power supply voltage 10.5 – 16 V Current drain at rated output : 42 A
Remote input : 1.0 mA Dimensions Approx. 358 × 50 × 264 mm
(w/h/d) (14
projecting parts and controls Mass Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories Supplied accessories Mounting screws (4)
Design and specifications are subject to change without notice.
+0 –3
1/8 × 2 1/4 × 10 1/2 in.) not incl.
9-870-240-12
2001F0400-1
© 2001.6
Sony Corporation
e Vehicle Company
Shinagawa Tec Service Manual Production Group
1
SECTION 1

SERVICE NOTE

TABLE OF CONTENTS
1. SERVICE NOTE................................................................. 2
2. GENERAL
Location and Function of Controls.......................................... 3
Connections ............................................................................. 4
3. DISASSEMBLY
3-1. Plate, Bottom ....................................................................... 6
3-2. Amp Board Section ............................................................. 6
3-3. Amp Board, HPF Board, LPF Board................................... 7
3-4. LED Board........................................................................... 7
4. ELECTRICAL ADJUSTMENT...................................... 8
5. DIAGRAMS
5-1. Block Diagram..................................................................... 9
5-2. Printed Wiring Board –Amp Section– ............................... 11
5-3. Schematic Diagram –Amp Section (1/2)–......................... 12
5-4. Schematic Diagram –Amp Section (2/2)–......................... 13
5-5. Printed Wiring Boards –HPF, LPF, LED Section– ............ 14
5-6. Schematic Diagram –HPF, LPF, LED Section– ................ 15
6. EXPLODED VIEWS
6-1. Heat Sink (Main) Section .................................................. 16
6-2. Amp Board Section ........................................................... 16
7. ELECTRICAL PARTS LIST......................................... 17
NOTE FOR REPLACEMENT OF Q510 AND Q512
When replacing Q510 and Q512, remove C937 and then remove the screw securing the heat sink (retainer plate).
heat sink (retainer plate)
C937
Notes on Chip Component Replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Q512
Q510
2
SECTION 2

GENERAL

This section is extracted from instruction manual.
3
456
SECTION 3

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.
3-1. PLATE, BOTTOM
4 P 2.6x2.8
3 BTP 3x6
6
2 BTP 3x6
1 BTP 3x6
5 plate, bottom
7 sheet, insulating
3-2. AMP BOARD SECTION
6 CNP808
1 B.TT. 3x14
2 B.TT. 3x14
3 B.TT. 3x14
5 AMP board section
4
3-3. AMP BOARD, HPF BOARD, LPF BOARD
)
2 P 3x8
6 HPF board
5 CNP806
4 BVTT 3x5
7 BVTT 3x5
9 LPF board
0 AMP board
8 CNP807
3-4. LED BOARD
1 P 3x8
3 panel (5ch), front
1 BTP 3x6
2 LED board
heat sink (main
7
SECTION 4

ELECTRICAL ADJUSTMENT

Bias Adjustment
Note : The Bias adjustment should be performed only if any of
Q106, Q107, Q206, Q207, Q306, Q307, Q406, Q407, Q506 Q507 and Q509 to Q512 are replaced.
Setting :
Stabilized
Power supply
B+,REM terminals
set
GND terminal test points
Procedure :
1. Rotate the variable resistors VR101, VR201, VR301, VR401 and VR501 fully in the clockwise direction to minimize the idling current of the stabilized power supply.
2. The input signal is to be no signal.
3. Set the power voltage to +14.4 V, and turn the remote mode ON (Connect between the REM terminal and B+ terminal).
4. Connect on digital voltmeter between each test points.
5. Adjust VR101, VR201, VR301 and VR401 so that the digital voltmeter reading is 5 ± 0.5 mV.
6. Adjust VR501 so that the digital voltmeter reading is
3.5 ± 0.5 mV.
RV Ref. No. Test points
VR101 TP101 and TP102 VR201 TP201 and TP202 VR301 TP301 and TP302 VR401 TP401 and TP402 VR501 TP501 and TP502
Digital
Voltmeter
+ _
Adjustment Location :
– AMP BOARD (COMPONENT SIDE) –
BIAS ADJUSTMENT
BIAS ADJUSTMENT
BIAS ADJUSTMENT
Test Point Location :
– AMP BOARD (CONDUCTOR SIDE) –
TP502
TP501
VR401
BIAS ADJUSTMENT
VR301
VR201
VR101
VR501
BIAS ADJUSTMENT
TP401TP402
TP301 TP302
TP201
TP202
TP101
TP102
8
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