Sony XDS-PD2000, XDS-PD2000C, XDS-PD1000, XDS-PD1000C Users guide

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Page 1

PROFESSIONAL MEDIA STATION

XDS-PD2000 XDS-PD2000C XDS-PD1000 XDS-PD1000C

OPTIONAL POWER SUPPLY

XDBK-101

OPTIONAL RAID DRIVE

XDBK-102

LINEAR EDIT UPGRADE KIT

XDBK-104

OPTIONAL SSD DRIVE

XDBK-107

MAINTENANCE MANUAL Volume 1 1st Edition (Revised 6)

Page 2

警告

このマニュアルは，サービス専用です。お客様が，このマニュアルに記載された設置や保守，点検，修理などを行うと感電や火災，人身事故につながることがあります。危険をさけるため，サービストレーニングを受けた技術者のみご使用ください。

WARNING

This manual is intended for qualiﬁed service personnel only. To reduce the risk of electric shock, ﬁre or injury, do not perform any servicing other than that contained in the operating instructions unless you are qualiﬁed to do so. Refer all servicing to qualiﬁed service personnel.

WARNUNG

Die Anleitung ist nur für qualiﬁziertes Fachpersonal bestimmt. Alle Wartungsarbeiten dürfen nur von qualiﬁziertem Fachpersonal ausgeführt werden. Um die Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung dazu besitzen.

AVERTISSEMENT

Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Aﬁn de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les réparations indiquées dans le mode d’emploi à moins d’être qualiﬁé pour en effectuer d’autres. Pour toute réparation faire appel à une personne compétente uniquement.

安全のために，周辺機器を接続する際は，過大電圧を持つ可能性があるコネクターを以下のポートに接続しないでください。

：NETWORK コネクター

上記のポートについては本書の指示に従ってください。

For safety, do not connect the connector for peripheral device wiring that might have excessive voltage to the following port(s). : NETWORK connector Follow the instructions for the above port(s).

For kundene i Norge

Dette utstyret kan kobles til et IT-strømfordelingssystem.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 3

CAUTION

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. When you dispose of the battery, you must obey the law in the relative area or country.

ATTENTION

Il y a danger d’explosion s’il y a remplacement incor-

rect de la batterie. Remplacer uniquement avec

une batterie du même type ou d’un type équivalent

recommandé par le constructeur. Lorsque vous mettez la batterie au rebut, vous devez respecter la législation en vigueur dans le pays ou la

région où vous vous trouvez.

VORSICHT

Explosionsgefahr bei Verwendung falscher Batterien. Batterien nur durch den vom Hersteller empfohlenen

oder einen gleichwertigen Typ ersetzen.

Wenn Sie die Batterie entsorgen, müssen Sie die

Gesetze der jeweiligen Region und des jeweiligen

Landes befolgen.

注意

指定以外の電池に交換すると，破裂する危険があります。

必ず指定の電池に交換してください。

使用済みの電池は，国または地域の法令に従って

処理してください。

FÖRSIKTIGHET!

Fara för explosion vid felaktigt placerat batteri.

Byt endast mot samma eller likvärdig typ av batteri,

enligt tillverkarens rekommendationer.

När du kasserar batteriet ska du följa rådande lagar

för regionen eller landet.

PAS PÅ

Fare for eksplosion, hvis batteriet ikke udskiftes

korrekt.

Udskift kun med et batteri af samme eller tilsvarende

type, som er anbefalet af fabrikanten.

Når du bortskaffer batteriet, skal du følge

lovgivningen i det pågældende område eller land.

HUOMIO

Räjähdysvaara, jos akku vaihdetaan virheellisesti.

Vaihda vain samanlaiseen tai vastaavantyyppiseen,

valmistajan suosittelemaan akkuun.

Noudata akun hävittämisessä oman maasi tai

alueesi lakeja.

FORSIKTIG

Eksplosjonsfare hvis feil type batteri settes i.

Bytt ut kun med samme type eller tilsvarende

anbefalt av produsenten.

Kasser batteriet i henhold til gjeldende avfallsregler.

⊼ᛣ

བᵰ᳈ᤶⱘ⬉∴ϡℷ⹂ˈህӮ᳝⟚⚌ⱘ䰽Ǆ

া᳈ᤶৠϔ㉏ൟ៪ࠊ䗴ଚ᥼㤤ⱘ⬉∴ൟোǄ

໘⧚⬉∴ᯊˈᖙ乏䙉ᅜⳌ݇ഄ៪೑ᆊⱘ⊩ᕟǄ

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Attention-when the product is installed in Rack:

1. Prevention against overloading of branch circuit

When this product is installed in a rack and is supplied power from an outlet on the rack, please make sure that the rack does not overload the supply circuit.

2. Providing protective earth

When this product is installed in a rack and is supplied power from an outlet on the rack, please confirm that the outlet is provided with a suitable protective earth connection.

3. Internal air ambient temperature of the rack

When this product is installed in a rack, please make sure that the internal air ambient temperature of the rack is within the specified limit of this product.

4. Prevention against achieving hazardous condition due to uneven mechanical loading

When this product is installed in a rack, please make sure that the rack does not achieve hazardous condition due to uneven mechanical loading.

5. Install the equipment while taking the operating temperature of the equipment into consideration

For the operating temperature of the equipment, refer to the specifications of the Operation Manual.

6. When performing the installation, keep the following space away from walls in order to obtain proper exhaust and radiation of heat.

Right, Left: 4 cm (1.6 inches) or more Rear: 10 cm (4 inches) or more

When installing the installation space must be secured in consideration of the ventilation and service operation.

. Do not block the ventilation slots at the left side and right side panels, and vents of the fans.

. Leave a space around the unit for ventilation. . Leave more than 10 cm of space in the rear of the unit

to secure the operation area. When the unit is installed on the desk or the like, leave

at least 4 cm of space in the left and right sides. Leaving 40 cm or more of space above the unit is recommended for service operation.

WARNING

When installing the unit, incorporate a readily accessible disconnect device in theﬁxed wiring, or connect the power cord to a socket-outlet which must be provided near the unit and easily accessible, so that the user can turn off the power in case a fault should occur.

WARNUNG

Beim Einbau des Geräts ist daher im Festkabel ein leicht zugänglicher Unterbrecher einzufügen, oder das Netzkabel muß mit einer in der Nähe des Geräts befindlichen, leicht zugänglichen Wandsteckdose verbunden werden, damit sich bei einer Funktionsstörung die Stromversorgung zum Gerät jederzeit unterbrechen läßt.

警告

万一，異常が起きた際に，お客様が電源をきることができるように，設置の際には，機器近くの固定配線内に専用遮断装置を設けるか，機器使用中に，容易に抜き差しできるコンセントに電源プラグを接続してください。

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Laser Diode Properties Wavelength: 400 to 410 nm Emission duration: Continuous Laser output power: 280 mW (max. of

pulse peak), 150 mW (max. of CW)

Standard:

CAUTION

Use of controls or adjustments or performance of procedures other than those speciﬁed herein may result in hazardous radiation exposure.

CAUTION

The use of optical instruments with this product will increase eye hazard.

The XDS-PD2000/PD2000C/PD1000/PD1000C are classified as a CLASS 1 LASER PRODUCT.

This label is located on the top cover of the drive unit.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Manual Structure

Purpose of this manual....................................................................................................................7

Related manuals...........................................................................................................................7

Trademarks...............................................................................................................................7

1. Service Overview

1-1. Circuit Function...............................................................................................................1-1

1-2. Location of Main Parts........................................................................................................1-2

1-2-1. Location of Printed Circuit Boards.....................................................................................1-2

1-2-2. Location of Main Mechanical Parts....................................................................................1-3

1-3. Function and Location of Sensors.............................................................................................1-5

1-4. How to Eject a Cartridge Manually...........................................................................................1-7

1-5. Functions of Onboard Switches/LED Indicators..............................................................................1-8

1-5-1. Functions of Onboard Switches........................................................................................1-8

1-5-2. Functions of Onboard LED Indicators................................................................................1-12

1-6. Circuit Protection Parts......................................................................................................1-16

1-6-1. Circuit Protection Element............................................................................................1-16

1-6-2. Replacing Fuse........................................................................................................1-16

1-7. Equipment and Fixtures List for Check/Adjustment........................................................................1-18

1-7-1. Fixtures................................................................................................................1-18

1-8. Internal Video Test Signal...................................................................................................1-19

1-9. Service Action after Replacing or Repairing the Block and Board..........................................................1-20

1-9-1. Optical Block Assembly..............................................................................................1-20

1-9-2. BD-42 Board..........................................................................................................1-20

1-9-3. SE-1004 Board........................................................................................................1-20

1-9-4. HPR-32/41 Board.....................................................................................................1-21

1-9-5. AU-325 Board.........................................................................................................1-21

1-9-6. SY-388 Board.........................................................................................................1-21

1-10. Replacing EEPROMs and Backup Battery..................................................................................1-22

1-10-1. EEPROMs.............................................................................................................1-22

1-10-2. EEPROMs of Optical Drive Assembly...............................................................................1-22

1-10-3. Backup Battery........................................................................................................1-23

1-11. Circuit Description...........................................................................................................1-24

1-11-1. Video Signal Processing Block.......................................................................................1-24

1-11-2. Audio Signal Processing System......................................................................................1-27

1-11-3. Sync Signal Processing System.......................................................................................1-29

1-11-4. I/O System Control System...........................................................................................1-29

1-11-5. I/O Interface System..................................................................................................1-30

1-11-6. Optical Drive System..................................................................................................1-30

1-12. Connecting and Disconnecting Flexible Card Wires........................................................................1-33

1-12-1. Connecting/Disconnecting Flexible Card Wire (Type A)............................................................1-33

1-12-2. Connecting/Disconnecting Flexible Card Wire (Type B).............................................................1-34

1-12-3. Connecting/Disconnecting Flexible Card Wire (Type C).............................................................1-34

1-12-4. Connecting/Disconnecting Flexible Card Wire (Type D)............................................................1-35

1-13. Cautions on Handling the Optical Block Assembly.........................................................................1-36

1-14. Lead-free Solder.............................................................................................................1-38

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 8

2. Error Messages

2-1. Error Message Overview......................................................................................................2-1

2-2. Error Code List................................................................................................................2-2

2-2-1. Error 0X................................................................................................................2-2

2-2-2. Error 20.................................................................................................................2-4

2-2-3. Error 3X................................................................................................................2-4

2-2-4. Error 5X................................................................................................................2-5

2-2-5. Error 6X................................................................................................................2-5

2-2-6. Error 71.................................................................................................................2-6

2-2-7. Error 91.................................................................................................................2-6

2-2-8. Error 92.................................................................................................................2-7

2-2-9. Error 95.................................................................................................................2-7

2-3. Alarms (Warning)............................................................................................................2-10

2-3-1. When the Unit is Powered on.........................................................................................2-10

2-3-2. When a Memory Card is Inserted.....................................................................................2-11

2-3-3. When a Disc is Inserted...............................................................................................2-12

2-3-4. During Front Panel Operations........................................................................................2-14

2-3-5. During Recording Operations.........................................................................................2-15

2-3-6. During Playback Operations..........................................................................................2-17

2-3-7. During Operations in the Clip List Screen/Thumbnail Search/EDL Edit/Copy ......................................2-17

2-3-8. Alarms Relating to Audio and Video Signals.........................................................................2-19

2-3-9. Alarms Relating to Sensors and Drivers..............................................................................2-20

2-3-10. Alarms Relating to the Internal Storage...............................................................................2-21

2-3-11. Other Alarms..........................................................................................................2-23

3. XDCAM Web Site

3-1. XDCAM Web Site Overview.................................................................................................3-1

3-1-1. Making a Connection to the XDCAM Website........................................................................3-1

3-2. Status Menu...................................................................................................................3-2

3-2-1. Software Version.......................................................................................................3-2

3-3. Maintenance Menu............................................................................................................3-4

3-3-1. Network.................................................................................................................3-4

3-3-2. Account.................................................................................................................3-5

3-3-3. Setup Menu.............................................................................................................3-6

3-3-4. Software Update........................................................................................................3-7

3-3-5. Log....................................................................................................................3-12

4. Maintenance Mode

4-1. Maintenance Menu Overview.................................................................................................4-1

4-1-1. Operation Keys.........................................................................................................4-1

4-1-2. Activating the Maintenance Mode......................................................................................4-2

4-1-3. Exiting Maintenance Mode.............................................................................................4-2

4-1-4. Maintenance Mode Access Prohibiting Switch (S501-1/KY-656 Board)..............................................4-2

4-2. Maintenance Menu List.......................................................................................................4-3

4-3. ADJUST (M1).................................................................................................................4-6

4-3-1. VPR VR (A20).........................................................................................................4-6

4-3-2. CP VR (A23)...........................................................................................................4-6

4-3-3. APR VR (A27).........................................................................................................4-7

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 9

4-3-4. NV-RAM CONTROL (A2F)...........................................................................................4-8

4-4. SERVICE SUPPORT (M2)...................................................................................................4-9

4-4-1. ERROR LOG (M20)...................................................................................................4-9

4-4-2. DIAG CONTROL (M21)...............................................................................................4-9

4-4-3. OPTION SETTING (M22).............................................................................................4-9

4-4-4. OPTION KEY (M23).................................................................................................4-10

4-5. OTHERS (M3)...............................................................................................................4-11

4-5-1. GPIO SETUP (M3A)..................................................................................................4-11

4-5-2. FACTORY SETUP (M3F)............................................................................................4-11

4-6. DRIVE MAINTENANCE (D0).............................................................................................4-13

4-6-1. TEMPERATURE SENSOR..........................................................................................4-13

4-6-2. FAN MOTOR.........................................................................................................4-13

4-6-3. ACCELERATION SENSOR.........................................................................................4-14

4-6-4. LOADER..............................................................................................................4-16

4-6-5. SLIDER AUTO TEST................................................................................................4-22

4-6-6. SLIDER IN-LIM TEST...............................................................................................4-23

4-6-7. SPINDLE MOTOR AUTO TEST....................................................................................4-24

4-6-8. SA ACTUATOR......................................................................................................4-25

4-6-9. LASER................................................................................................................4-26

4-6-10. LCD ATT.............................................................................................................4-28

4-6-11. SKEW.................................................................................................................4-29

4-6-12. LENS CLEANING....................................................................................................4-32

4-6-13. LD IL ADJUST.......................................................................................................4-32

4-6-14. TRK/TLT DRV OFFSET.............................................................................................4-33

4-6-15. SKEW.................................................................................................................4-33

4-6-16. ERROR LOGGER....................................................................................................4-33

4-6-17. VERSION.............................................................................................................4-35

4-6-18. SERIAL NO...........................................................................................................4-36

4-6-19. UPLOAD TO EEPROM..............................................................................................4-36

4-6-20. UPLOAD TO FLASH.................................................................................................4-37

5. Periodic Maintenance and Inspection

5-1. Periodic Maintenance.........................................................................................................5-1

5-1-1. Digital Hours Meter....................................................................................................5-1

5-1-2. Periodic Replacement Parts.............................................................................................5-2

5-2. Cleaning.......................................................................................................................5-4

5-2-1. General Information for Cleaning Using Cleaning Cloth..............................................................5-4

5-2-2. Cleaning the Loader Assembly.........................................................................................5-4

5-2-3. Cleaning the Spindle Motor............................................................................................5-4

5-2-4. Cleaning the Pickup Lens...............................................................................................5-5

6. Replacement of Main Parts

6-1. General Information for Parts Replacement..................................................................................6-1

6-1-1. Cautions before Installation............................................................................................6-1

6-1-2. Index....................................................................................................................6-1

6-2. Removing Cabinet.............................................................................................................6-6

6-2-1. Top Plate Assembly....................................................................................................6-6

6-2-2. Rear Panel Assembly...................................................................................................6-6

6-2-3. Front Panel Assembly..................................................................................................6-7

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 10

6-3. Control Panel Assembly.......................................................................................................6-9

6-4. Hinge (L)/(R) Assembly.....................................................................................................6-11

6-5. Power Assembly.............................................................................................................6-13

6-6. HDD Assembly (XDS-PD1000/PD1000C)..................................................................................6-14

6-7. SSD Assembly (XDS-PD2000/PD2000C)..................................................................................6-17

6-8. Optical Drive.................................................................................................................6-20

6-9. Loader Assembly............................................................................................................6-23

6-10. Loading Motor Assembly....................................................................................................6-27

6-11. BU Assembly/Seek Motor...................................................................................................6-29

6-12. Optical Block Assembly.....................................................................................................6-31

6-13. Spindle Motor................................................................................................................6-34

6-14. DC Fan.......................................................................................................................6-35

6-14-1. DC Fan (60 Square/80 Square)........................................................................................6-35

6-14-2. DC Fan (50 Square)...................................................................................................6-36

6-15. Front Frame Assembly.......................................................................................................6-38

6-16. CPU Board...................................................................................................................6-39

6-17. 4.3 Inch LCD and FP-166 Board............................................................................................6-41

6-18. Search Dial Assembly.......................................................................................................6-45

6-19. Lithium Battery..............................................................................................................6-47

6-20. Compact Flash Card.........................................................................................................6-48

6-21. Replacement of Plug-in Boards..............................................................................................6-49

6-21-1. HPR-32/HPR-41 Board, ENC-132/ENC-143 Board and SY-388 Board.............................................6-49

6-21-2. AU-325 Board.........................................................................................................6-50

6-21-3. DIF-194 Board and EC-70 Board.....................................................................................6-51

6-21-4. KY-656 Board.........................................................................................................6-53

6-21-5. MB-1152 Board.......................................................................................................6-54

6-22. Replacement of Other Boards................................................................................................6-59

6-22-1. CN-3243 Board........................................................................................................6-59

6-22-2. BD-42 Board, SY-400 Board.........................................................................................6-60

6-22-3. KY-666 Board.........................................................................................................6-65

6-22-4. LDR-35 Board.........................................................................................................6-66

6-22-5. LDR-36 Board.........................................................................................................6-67

6-22-6. SE-1004 Board........................................................................................................6-68

6-22-7. SE-1005 Board........................................................................................................6-69

7. Adjustment of Optical Drive System

7-1. General Information for Adjustment of Optical Drive System...............................................................7-1

7-1-1. Precautions..............................................................................................................7-1

7-1-2. Tools....................................................................................................................7-1

7-1-3. Preparation for Adjustment.............................................................................................7-1

7-2. LD IL Adjustment.............................................................................................................7-2

7-3. TRK/TLT DRV OFFSET Adjustment........................................................................................7-4

7-4. SKEW Adjustment............................................................................................................7-6

7-5. Actions to be Taken after Adjustment.......................................................................................7-10

8. Electrical Alignment

8-1. Electrical Alignment Overview ...............................................................................................8-1

8-1-1. Precautions .............................................................................................................8-1

8-1-2. Tools/Fixtures..........................................................................................................8-1

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 11

8-1-3. Displaying the Adjustment Item........................................................................................8-1

8-2. HD Free-Running Frequency Adjustment....................................................................................8-3

8-2-1. Adjustment Overview..................................................................................................8-3

8-2-2. HD Free-Running Frequency Adjustment..............................................................................8-3

8-3. SD Free-Running Frequency Adjustment.....................................................................................8-5

8-3-1. Adjustment Overview..................................................................................................8-5

8-3-2. SD Free-Running Frequency Adjustment..............................................................................8-5

8-4. Video System Alignment/AU-325 Board.....................................................................................8-7

8-4-1. Adjustment Overview..................................................................................................8-7

8-4-2. Preparation in 59.94 Hz Mode..........................................................................................8-8

8-4-3. Composite Video Output Adjustment (59.94 Hz Mode)...............................................................8-8

8-4-4. Preparation in 50 Hz Mode............................................................................................8-10

8-4-5. Composite Video Output Adjustment (50 Hz Mode).................................................................8-11

8-4-6. Termination of 50 Hz Mode...........................................................................................8-13

8-5. Audio System Adjustment...................................................................................................8-14

8-5-1. Adjustment Overview.................................................................................................8-14

8-5-2. Analog Audio Output System Adjustment............................................................................8-14

8-5-3. Analog Audio Input System Adjustment..............................................................................8-16

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 13

Manual Structure

Purpose of this manual

This manual is the maintenance manual Volume 1 for Professional Media Station XDS-PD2000/PD2000C/PD1000/

PD1000C.

This manual describes the information items that premise the service overview, error messages, periodic maintenance

and inspection, replacement of main parts, and etc, assuming use of system and service engineers.

Related manuals

Besides this maintenance manual Volume 1 the following manual is available for this unit.

• Operation Manual (Supplied with this unit)

This manual describes the application and operation of this unit.

• Installation Manual (Supplied with this unit)

This manual describes the information on installing this unit.

• Maintenance Manual volume 2 (Available on request)

Describes the parts list, block diagrams, schematic diagrams and board layouts of this unit.

Trademarks

Trademarks and registered trademarks used in this manual are follows.

• Ethernet is a registered trademark of Xerox Corporation.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Page 14

Page 15

Section 1

Service Overview

1-1. Circuit Function

System Board name Circuit function Location

No.

Digital process and Video process HPR-32/41 Video, TC, REF, I/O core process (7)

ENC-132/143 MPEG HD encode (5)

SY-388 System Host (11)

AU-325 Video process (1)

Audio process AU-325 Analog and Digital audio I/O (1)

KY-656 Headphone VR and connector (8)

IT and Network and Remote I/O MB-1152 CPU, IT process, Network and Remote I/O (9)

SxS IF DIF-194 SxS process IF (3)

EC-70 SxS connector (4)

Control panel FP-166 Control panel (LCD/SW/JOG/SHUTTLE) (6)

PTC-105 Search control (10)

Other CN-3243 Connection board (2)

Optical drive assembly

System Board name Circuit function Location No.

Drive unit/Sensor BD-42 Drive main (1)

KY-666 Front panel (2)

LDR-35 Cartridge sensor (3)

LDR-36 Loading position sensor (4)

SE-1004 Angular velocity sensor Cartridge sensor (5)

SE-1005 OP position sensor Cartridge sensor (6)

SY-400 CN-BD connection (7)

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-1

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1-2. Location of Main Parts

(11)

(1)

(2)

(3)

(4)

(10)

(5)

(6)

(7)

(8)

(9)

1-2-1. Location of Printed Circuit Boards

Location No. Board name

(1) AU-325

(2) CN-3243

(3) DIF-194

(4) EC-70

(5) ENC-132/143

(6) FP-166

(7) HPR-32/41

(8) KY-656

(9) MB-1152

(10) PTC-105

(11) SY-388

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-2

Page 17

Optical drive assembly

(5)

(3)

(2)

(1)

(6)

(4)

(7)

Location No. Board name

(1) BD-42

(2) KY-666

(3) LDR-35

(4) LDR-36

(5) SE-1004

(6) SE-1005

(7) SY-400

1-2-2. Location of Main Mechanical Parts

Location No. Part name

(1) Power assembly

(2) Fan assembly (60 square)

(3) Fan assembly (80 square)

(4) LCD module

(5) HDD assembly

(6) CPU board (COMe module)

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-3

Page 18

(1)

(5)

(4)

(3)

(2)

(6)

Optical drive assembly

(1)

(6)

(4)

(7)

(3)

(5)

(2)

Location No. Part name

(1) Loader assembly

(2) Cleaner assembly

(3) Loading motor

(4) Optical block assembly

(5) Seek motor assembly

(6) Spindle motor

(7) DC fan

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-4

Page 19

1-3. Function and Location of Sensors

(1)

HPR-32/41 board (Side A)

MB-1152 board (Side A)

(2)

(3)

Location No. Part Name Ref. No. Function

(1) Temperature sensor IC1402 (D-3) —

(2) Temperature sensor IC4013 (G-2) Controls the temperature alarm

(3) Temperature sensor IC4014 (C-2) Controls the temperature alarm

Location No. Part Name Function

(1) OP position sensor Detects position of the optical block assembly.

(2) REC INH sensor Detects status of the recording prohibition tab of the cartridge.

(3) Cartridge Down sensor Detects down position of the cartridge.

(4) Cartridge IN sensor Detects insertion of the cartridge.

(5) Cartridge type sensor Detects type of the inserted cartridge (single-layer disc to quad-

layer disc).

(6) Angular speed sensor Detects angular speed applied to the optical block assembly.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-5

Page 20

(1)

(4)

(6)

(3)

(5)

(2)

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-6

Page 21

1-4. How to Eject a Cartridge Manually

Phillips screwdriver

Optical drive assembly

Manual eject mechanism

When the power of the unit does not turn on or the loader assembly does not operate, eject the cartridge in the following

steps.

1. Turn off the power of the unit.

2. Remove the front panel assembly. （Refer to Section6-2-3.）

3. Vertically insert a phillips screwdriver 4 mm or less in diameter or the like to the manual eject mechanism.

4. Push the internal manual eject lever 10 mm or so, and release it.

Note

Be careful not to insert the screwdriver at an oblique angle or use excessive force to push the lever.

5. Repeat Step 4 until the disc is ejected.

Tip

• You may need to repeat the step about 80 times.

• After ejecting the disc, it is not necessary to return the lever to its original position. The next time the unit is

powered on, normal operation will resume.

Note

If the disc stops near the disc slot even after above retries, turn off and on the power in that state. The disc is

automatically ejected after power is turned on.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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1-5. Functions of Onboard Switches/LED Indicators

AU-325 Board/Side A

BCD

S200 S100

600Ω OFF ON

( :Knob position)

BD-42 Board/Side A

1-5-1. Functions of Onboard Switches

AU-325 board

Ref. No. (address) Name Bit Description Factory setting

S100 (C-5) CH1 terminator — Turns ON/OFF the 600 Ω terminal for the Ch1

analog input

S200 (C-5) CH2 terminator — Turns ON/OFF the 600 Ω terminal for the Ch2

analog input

OFF

BD-42 Board

Note

Do not change the setting of "Factory use" switch.

Ref. No. Name Bit Description Factory Setting

S1 System Reset - Factory use -

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 23

HPR-32/41 board

HPR-32/41 Board/Side B

ABCD

EFGHJ

S401

S501

S702

KY-656 Board/Side A

BCDEFG

Ref. No. (address) Name Bit Description Factory setting

S401 (J-8) — 1 Not used OFF

— 2 ON: ROVA short EE Mode OFF

OFF: Normal operation

— 3 Not used OFF

— 4 Not used OFF

KY-656 board

Note

Never change the setting of the factory use switches.

Ref. No. (address) Name Bit Description Factory setting

S501 (E-5) — 1 ON: Disables accesses to the Maintenance

S702 (D-1) CPU RESET — Factory use —

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

OFF

mode.

OFF: Normal operation

— 2 ON: Starts forcibly in recovery boot. OFF

OFF: Normal operation

— 3 Factory use OFF

— 4 Factory use OFF

1-9

Page 24

MB-1152 board

S2005

S2002

S3001

S3002

S2001

MB-1152 Board/Side A

BCDEFGH

Note

Never change the setting of the factory use switches.

Ref. No. (address) Name Bit Description Factory setting

S2001 (H-1) POWER ON — Factory use —

S2002 (H-1) IT RESET — Factory use —

S2005 (H-4) DBGSW0 0 ON: bit0 COM-E identification setting

(b2, b1, b0)

1 ON: bit1 COM-E identification setting

(b2, b1, b0)

2 ON: bit2 COM-E identification setting

(b2, b1, b0)

3 ON: Reserved OFF

4 ON: Reserved OFF

5 Uplink PCIe_SW PORT Config OFF

ON: x16

OFF: x8

6 ON: Enables switch S2001 on the MB

board.

OFF: Enables the power secondary switch

on the KY board.

7 ON: Debug signal display OFF

OFF: Normal display

S3001 (A-2) BATTERY — Coin battery ON/OFF (for storage) ON

ON: Normal operation

OFF: Storage

S3002 (A-2) CMOS CLR — COMe CMOS CLR OFF

ON: CMOS CLR

OFF: Normal operation

OFF

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 25

SY-388 board

SY-388 Board/Side A

S401

S101 S201 S202

S203

ABCDEF

XDS-PD2000 OFF OFF OFF OFF

OFF OFF OFF ON

OFF OFF ON OFF

XDS-PD1000 XDS-1000 4(SW4) 3(SW3) 2(SW2) 1(SW1)

XDS-PD2000C OFF ON OFF OFF

OFF

OFF ON ON OFF

XDS-PD1000C

XDS-1000C 4(SW4) 3(SW3) 2(SW2) 1(SW1)

Note

Never change the setting of the factory use switches.

Ref. No. (ad-

Name Bit Description Factory setting

dress)

S101 (F-1) IRQ — Factory use —

S201 (E-1) ITRON SW 2 1 OFF： HPR_STAT0 OFF

2 OFF： HPR_STAT1 OFF

3 ON： Starts IO CPU forcibly in normal

OFF

boot.

OFF： Normal operation

4 Not used OFF

S202 (E-1) ITRON SW 1 1 Not used OFF

2 Factory use OFF

3 ON： Starts IO CPU forcibly in recovery

OFF

boot.

OFF： Normal operation

4 ON： Starts IO CPU forcibly in recovery

OFF

boot.

OFF： Normal operation

5 ON： Serial No. writable OFF

OFF： Normal operation

6 Factory use OFF

7 Factory use OFF

8 Factory use OFF

S203 (C-1) PWR RESET — Factory use —

S401 (D-4) MODEL SEL 1-4

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 26

1-5-2. Functions of Onboard LED Indicators

DIF-194 Board/Side A

D203

BCD

D403

D130

HPR-32/41 Board/Side B

ABCD

EFGHJ

D1508

D2003

•

D2001

D2005

•

D2008

D404

•

D401

DIF-194 board

Ref. No. (address) Name Color Description Normal

state

D130 (D-2) — Green Lights when voltage +12 V is detected. Lights

D203 (C-2) — Blue Lights when FPGA settings are completed. Lights

D403 (B-3) — Blue Lights when FPGA settings are completed. Lights

HPR-32/41 board

Ref. No. (address) Name Color Description Normal

D401 (J-8) — Green ROVA —

D402 (J-8) — Green ROVA —

D403 (J-8) — Green ROVA —

D404 (J-8) — Green ROVA —

D1508 (G-1) PWR OK Green PEX8112 POWER OK LED: Lit while power is turned

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

state

Lights

on.

Continued

1-12

Page 27

Ref. No. (address) Name Color Description Normal

KY-656 Board/Side A

BCDEFG

D504

•

D501

MB-1152 Board/Side A

BCDEFGH

D5020

•

D5017

D2051

D3017

D3016

D3018

D3015

D5014

D5013

D5009

state

D2001 (H-4) REC Green AU REC DSP LED: Blinks while the unit is operating. —

D2002 (H-4) PB/M0 Green AU PBMONI0 DSP LED: Blinks while the unit is oper-

—

ating.

D2003 (H-4) PB/M1 Green AU PBMONI1 DSP LED: Blinks while the unit is oper-

—

ating.

D2005 (H-4) L0 Green AU LRZ0 DSP LED: Blinks while the unit is operating. —

D2006 (H-4) L1 Green AU LRZ1 DSP LED: Blinks while the unit is operating. —

D2007 (H-4) L2 Green AU LRZ2 DSP LED: Blinks while the unit is operating. —

D2008 (J-4) L3 Green AU LRZ3 DSP LED: Blinks while the unit is operating. —

KY-656 board

Ref. No. (address) Name Color Description Normal

state

D501 (D-5) — Green CPU LED Blinks

D502 (D-5) — Green Lights while recovery boot is being executed. Off

D503 (D-5) — Green Not used Off

D504 (D-5) — Green CPU LED Blinks

MB-1152 board

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-13

Page 28

Ref. No. (address) Name Color Description Normal

state

D2051 (C-5) 5V OVP FLT Red Lights when +5V-STANBY voltage is higher than the

set OVP voltage (5.375 V).

D3015 (D-1) POWER ON Blue Lights when power is supplied to COMe. Lights

D3016 (C-1) RESET ON Red Lights when Board RESET is received from COMe. Off

D3017 (C-1) THRMTRIP Red Lights when a temperature error from COMe and two

thermometer ICs on the MB board is present.

D3018 (D-1) SATA AC-

TIVE

D5009 (G-2) SW PG 0 Blue PEX SW LSI Port 0 (up link side) status Blinks

D5013 (G-2) SW PG 4 Blue PEX SW LSI Port 4 (down link side: CN6002) status Off

D5014 (G-2) SW PG 5 Blue PEX SW LSI Port 5 (down link side: CN6001) status Off

D5017 (G-2) SW PG 8 Blue PEX SW LSI Port 8 (down link side: HDD #3) status Blinks

D5018 (G-2) SW PG 9 Blue PEX SW LSI Port 9 (down link side: HPR board) status Blinks

D5019 (G-2) SW PG 10 Blue PEX SW LSI Port 10 (down link side: HDD #2) status Blinks

D5020 (H-2) SW PG 11 Blue PEX SW LSI Port 11 (down link side: HDD #1) status Blinks

Blue Blinks while SATA-IF of COMe is working. Blinks

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Blinks: Connected to Gen1.

Lights: Connected to Gen2.

Off: No link is established.

Off

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 29

SY-388 board

SY-388 Board/Side A

ABCDEF

D201

•

D204

D205

D402 D401

Ref. No. (address) Name Color Description Normal

state

D201 (F-2) — Green CPU LED —

D202 (F-2) — Green CPU LED —

D203 (F-2) — Green CPU LED —

D204 (F-1) — Green CPU LED —

D205 (B-1) — Red POWER RESET LED Off

D401 (B-4) — Green FPGA LED Lights

Lights: FPGA CONFIG OK

Off: FPGA CONFIG NG

D402 (B-4) — Green CPU CLOCK LED —

Blinks: CPU CLOCK (33 MHz) COUNTER

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 30

1-6. Circuit Protection Parts

1-6-1. Circuit Protection Element

This unit is provided with positive thermistors for power circuit. If an overcurrent flows in a positive thermistor or it

heats up to a certain degree with the increase of the ambient temperature, its internal resistance increases sharply to limit

the current fl owing in the circuit. When a thermistor is activated, turn off the power and check the circuit of the unit.

After the cause of the problem is removed and the device cools down, turn on the power again. The unit will work

normally. It takes about one minute for the device to cool down after power-off.

Board Ref. No. Address Part No.

CN-3243 THP100 B-3/Side A

THP101 E-2/Side A

THP102 H-2/Side A

THP103 B-3/Side A

THP104 E-3/Side A

THP105 H-2/Side A

THP106 G-1/Side A

DIF-194 THP130 D-2/Side A

FP-166 THP201 A-2/Side B

KY-656 THP901 H-5/Side A

MB-1152 TH201 E-1/Side B

TH202 D-1/Side A

TH4001 C-1/Side A

TH4002 C-1/Side B

TH4003 B-1/Side A

TH4004 B-1/Side B

TH4005 B-1/Side A

TH4006 A-5/Side B

TH4007 A-5/Side B

TH4008 G-5/Side A

TH4009 A-3/Side A

1-802-264-11

1-802-108-11

1-803-353-21

1-802-108-11

1-533-817-21

1-802-108-11

1-6-2. Replacing Fuse

WARNING

The fuse is essential parts for safe operation. Replace the components with Sony parts whose part numbers appear in the manual published by Sony. If the components are replaced with any parts other than the specified ones, this may cause a fire or electric shock.

CAUTION

If the fuse is replaced while the main power is kept on, this may cause electric shock. Before replacing the fuse, not only turn off the POWER switch but also disconnect the cable that is connected to the AC IN connector.

This unit is equipped with fuses.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-16

Page 31

The fuses blow if an excessive current flows due to abnormality inside the equipment. If fuses blow, turn off the main

power of the equipment once, and inspect inside of the equipment and remove the cause of excessive current. After that,

replace the fuses.

Board Ref. No. Address Name Part No.

AU-325 F1300 B-1/Side A Fuse (5 A/125 V)

CN-3243 F100 F-1/Side B Fuse (5 A/125 V)

FP-166 F101 E-1/Side B Fuse (3.15 A/125 V)

HPR-32/41 F2201 H-1/Side B Fuse (10 A/125 V)

KY-656 F1101 B-4/Side A Fuse (1 A/125 V)

MB-1152 F2001 C-5/Side A Fuse (15 A/65 V)

F2002 B-5/Side A Fuse (2A/125V)

1-533-627-21

1-576-269-21

1-576-329-21

1-533-998-21

1-576-566-21

1-533-999-21

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 32

1-7. Equipment and Fixtures List for Check/Adjustment

(1) (2)

(4) (5)

(3)

1-7-1. Fixtures

Fig. No.

(1) J-6325-110-A Torque screwdriver’s bit (M1.4/M1.7) Screw tightening

(2) J-6325-400-A Torque screwdriver (3 kg·cm) (0.3 N·m) Screw tightening

(3) 3-184-527-01 Cleaning cloth (15 cm x 15 cm) Cleaning

(4) 7-432-114-11 Locking compound 200 g Inhibits loosening of screws

(5) 7-600-000-48 Sony bond (SC608LVZ2) 180ML Bonding

— 7-640-009-57 Grease (FLOIL G-902) Lubrication of hinge assembly

— J-6570-130-A Alignment disc (PFD23A-RS) Skew adjustment

Part No. Description Usage

J-6325-380-A Torque screwdriver’s bit (M2)

J-6323-430-A Torque screwdriver’s bit (M3)

J-6252-510-A Torque screwdriver (6 kg·cm) (0.6 N·m)

J-6252-520-A Torque screwdriver (10 kg·cm) (1.0 N·m)

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 33

1-8. Internal Video Test Signal

This unit has the internal video test signal generator.

The test signals output from the video test signal generator can be recorded.

Use “710: INTERNAL VIDEO SIGNAL GENERATOR” in the Setup menu to output the test signals. For operating

the Setup menu, refer to the Operation Manual.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 34

1-9. Service Action after Replacing or Repairing the Block and Board

Note

Upgrade the firmware to the latest version after replacing any of the following boards or optical block assembly. （Refer to Section 3-3-4.）

• BD-42 board

• DIF-194 board

• KY-656 board

• SE-1004 board

• SY-388 board

1-9-1. Optical Block Assembly

Note

The ROM in the optical block assembly contains firmware. After replacing the optical block assembly, upgrade the

firmware to the latest version. (Refer to Section 3-3-4.)

After the optical block assembly has been replaced, make adjustments in the following procedure. (Refer to Section 7.)

1. LD IL adjustment

(Refer to Section 7-2.)

2. TRK/TLT driver offset adjustment

(Refer to Section 7-3.)

3. Skew adjustment

(Refer to Section 7-4.)

1-9-2. BD-42 Board

The BD-42 board contains an EEPROM (IC709) in which error logger data and other data are stored. To retain the

EEPROM data, replace IC709 after this board has been replaced.

Note

If IC709 is not replaced, execute “CLEAR LOG” in “ERROR LOGGER” of the Maintenance menu referring to “4-6-16.

ERROR LOGGER”.

After the BD-42 board has been replaced or repaired, perform the Drive Maintenance menu in the following procedure.

1. LD IL adjustment

(Refer to Section 7-2.)

2. TRK/TLT driver offset adjustment

(Refer to Section 7-3.)

3. Skew adjustment

(Refer to Section 7-4.)

4. UPLOAD TO FLASH

(Refer to Section 4-6-20.)

1-9-3. SE-1004 Board

The SE-1004 board contains an EEPROM (IC3) in which adjustment data, hours meter data, and other data are stored.

When this board is replaced when maintaining hours meter data, replace IC3.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-20

Page 35

Note

If IC3 is not replaced, execute “UPLOAD TO EEPROM” of the Maintenance menu referring to “4-6-19. UPLOAD TO

EEPROM”.

After the SE-1004 board has been replaced or repaired, perform the Drive Maintenance menu in the following procedure.

1. LD IL adjustment

(Refer to Section 7-2.)

2. TRK/TLT driver offset adjustment

(Refer to Section 7-3.)

3. Skew adjustment

(Refer to Section 7-4.)

1-9-4. HPR-32/41 Board

After the HPR-32/41 board has been replaced, make adjustments in the following procedure.

1. HD free-running frequency adjustment.

(Refer to Section 8-2.）

2. SD free-running frequency adjustment.

(Refer to Section 8-3.）

1-9-5. AU-325 Board

After the AU-325 board has been replaced, make adjustments in the following procedure.

1. Video system alignment/AU-325 board.

(Refer to Section 8-4.）

2. Audio system adjustment.

(Refer to Section 8-5.）

1-9-6. SY-388 Board

Note

• The ROM in the SY-388 board contains firmware. After replacing this board, upgrade the firmware to the latest

version. (Refer to Section 3-3-4.)

• When replacing the SY-388 board, set Switch S401 according to the unit to which the SY-388 board is to be installed.

(Refer to Section 1-5-1.)

• A serial number is stored in the FRAM (IC310) on the SY-388 board. After the board has been replaced, turn on

the serial number write enable switch S202-5 on the SY-388 board and then set a serial number with the Maintenance

menu M31: SERIAL NUMBER. Then turn off S202-5 on the SY-388 board.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-21

Page 36

1-10. Replacing EEPROMs and Backup Battery

1-10-1. EEPROMs

The following EEPROMs are mounted in this unit.

These EEPROMs retain system setting data, adjustment data, and other data.

These data cannot be set again by replacing only relevant EEPROMs. When an EEPROM needs to be replaced, replace

the board that contains the EEPROM.

• IC683/AU-325 board

• IC204/DIF-194 board

• IC404/DIF-194 board

• IC1401/HPR board

• IC2/KY-656 board

• IC306/SY-388 board

• IC307/SY-388 board

• IC310/SY-388 board

• IC3008/MB-1152 board

• IC5004/MB-1152 board

• IC7009/MB-1152 board

1-10-2. EEPROMs of Optical Drive Assembly

Adjustment data and other data are stored in the EEPROMs of the optical drive assembly.

If any of the following EEPROMs is replaced, data in the EEPROM is initialized. (Adjustment data and hours meter

data are reset to zero. History data of error logger is initialized.)

Board Name Ref. No. Stored Data

BD-42 IC709 Error logger information

SE-1004 IC3 Adjustment values of the drive maintenance menu

Hours meter data

• Laser Parameter

• Seek Counter

• Spindle Running Hours

• Loading Counter

Replacing EEPROM (IC709/BD-42 Board)

Note

• When replacing the BD-42 board, refer to “1-9-2. BD-42 Board”.

• When the EEPROM (IC709) is replaced, error logger is cleared.

1. Turn off the power of the unit.

2. Remove the BD-42 board.

(Refer to Section 6-22-2.)

3. Replace IC709 (side A).

4. Execute "CLEAR LOG" in "ERROR LOGGER" of the Maintenance menu.

(Refer to Section 4-6-16.)

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-22

Page 37

Replacing EEPROM (IC3/SE-1004 Board)

Note

• When replacing the SE-1004 board, refer to “1-9-3. SE-1004 Board”.

• When the EEPROM (IC3) is replaced, adjustment data and hours meter data are reset to zero.

1. Turn off the power of the unit.

2. Remove the SE-1004 board.

(Refer to Section 6-22-6.)

3. Replace IC3 (side A).

4. Execute "UPLOAD TO EEPROM" of the Maintenance menu.

(Refer to Section 4-6-19.)

5. Execute service action after replacing the optical block assembly. (Refer to Section 1-9-1.)

1-10-3. Backup Battery

A backup battery is mounted on the MB-1152 board.

The backup battery retains date/time information. This backup battery retains date/time information, but this information

is erased when the battery is replaced. In that case, re-set date and time using the following procedure.

1. Press the [MENU] button while pressing the [PAGE/HOME] and [SHIFT] buttons.

2. Select “M3D:DATE/TIME PRESET” in “M3:OTHERS”.

3. Set date and time using the arrow buttons and the [PUSH SET] knob.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

1-23

Page 38

1-11. Circuit Description

This circuit description describes circuits of the following categories. The overall block diagrams will help you

understand the circuits well.

1. Video signal processing system

2. Audio signal processing system

3. Sync signal processing system

4. I/O system control system

5. I/O interfaces system

6. Optical drive system

Tip

Information on the following serial numbers is described in [ ]

• 10001 to 11000 (SY)

• 50001 to 51000 (CN)

1-11-1. Video Signal Processing Block

Recording System

HD-SDI input

The HD-SDI signal input from the SD/HD-SDI INPUT connector (CN201/HPR board) is equalized by SDI EQ (IC201)

on the HPR board. Then the serial signal is converted to parallel signal by ROVA (FPGA: IC301) and is separated into

video signal and audio signal and extracted.

The ANC data (LTC, VITC, UMID, and essence mark) of the separated HD digital video signal is read, and is then sent

to LVIS0 (IC901) for recording.

In LVIS0, the HD digital video signals are divided into the one that is sent to the ENC board as the record signal

processing system and the one that is returned to the ROVA again as the HD video output system of the E-E image.

HD digital video signals are encoded and compressed by the MPEG HD encoder NATH (IC500) on the ENC-143 board.

[On the ENC-132 board, the amount of encoding is estimated as the pre-encoding processing by the MPEG HD encoder

TORINO (IC201) and the encoding and compression processing is performed by TORINO (IC401, IC601) based on

the estimated value. ]

The digital encoded and compressed stream signal is sent to PIERe (FPGA: IC1601) on the HPR board to be written

into the PIERe SDRAM (IC1702 to IC1705).

In addition, the signals are down-converted in LVIS0 and divided into the one that is returned to ROVA again as the

SD video output signal of the E-E image and the one for creating the proxy video data in LVIS0. The encoded and

compressed proxy video data is sent to PIERe to be written into the PIERe SDRAM.

SD-SDI input

The SD-SDI signal input from the SD/HD-SDI INPUT connector (CN201/HPR board) is equalized by SDI EQ (IC201)

on the HPR board. Then the serial signal is converted to parallel signal by ROVA (FPGA: IC301) and is separated into

video signal and audio signal and extracted.

The ANC data (LTC, VITC, UMID, and essence mark) of the separated SD digital video signal is read, and is then sent

to LVIS0 (IC901) for recording.

When recording format is HD (HD422, HD420), the SD digital video signal is up-converted in LVIS0, and is divided

into the one that is sent to the ENC board as the record signal processing system and the one that is returned to ROVA

again as the HD video output system of the E-E image.

HD digital video signals are encoded and compressed by the MPEG HD encoder NATH (IC500) on the ENC-143 board.

[On the ENC-132 board, the amount of encoding is estimated as the pre-encoding processing by the MPEG HD encoder

TORINO (IC201) and the encoding and compression processing is performed by the TORINO (IC401, IC601) based

on the estimated value.]

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 39

The digital encoded and compressed stream signal is sent to PIERe (FPGA IC1601) on the HPR board and is written

into the PIERe SDRAM (IC1702 to IC1705).

When recording format is IMX, the SD digital video signal is divided in the LVIS0 into the one that is sent to the MPEG

IMX encoder MIKE (IC1202) as the record signal processing system and the one that is up-converted and returned to

ROVA again as the HD video output system of the E-E image.

The digital stream signal that is encoded and compressed by MIKE is sent to PIERe and is written into the PIERe

SDRAM.

When recording format is DVCAM, the digital video signal is divided in LVIS0 into the one that is sent to the internal

DVCAM encode processing block and the one that is up-converted and returned to the OVA again as the HD video

output system of the E-E image.

The digital stream signal that is encoded and compressed by the DVCAM encode processing block in LVIS0 is sent to

PIERe and is written into the PIERe SDRAM.

Furthermore, regardless of the recording format, the SD digital video signal that is input to LVIS0 is divided into the

one that is returned to ROVA again as the SD video output system of E-E image and the one for creating the proxy video

data in LVIS0. The proxy video data that is encoded and compressed inside LVIS is sent to PIER to be written into the

PIER SDRAM.

The proxy video data that is internally encoded and compressed is sent to PIERe and is written into the PIERe SDRAM.

The digital stream signal and the proxy video data stored in the PIERe SDRAM are sent from PIERe through the CN-3243

board to the MB-1152 board with the PCI-Express interface.

Playback System

The playback video/audio data and the playback proxy video/audio data are sent from the MB-1152 board

through the PCI-Express interface to PIERe (FPGA: IC1601) on the HPR board to be written into the PIERe SDRAM

(IC1702 to IC1705).

When the playback video data is HD format (HD422, HD420), the playback video data stored in the PIERe SDRAM is

sent to the ENC board from PIERe, decoded into the HD playback video signal by the MPEG HD decoder NATH

(IC1000) [TORINO (IC801, IC1001)] and is then sent to LVIS1 (IC1101) for playback on the HPR board as the HD

playback video signal.

When the playback video data is IMX format (HD422, HD420), the playback video data is sent from PIERe to the ENC

board in the same manner as the HD-format data. The data is decoded into the SD playback video signal by the MPEG

HD decoder NATH (IC1000) [TORINO (IC801, IC1001)] and is then sent to LVIS1 on the HPR board.

When the playback video data is DVCAM format, the playback video data is directly sent to LVIS0 (IC1101) from

PIERe and is decoded into the SD playback video signal by the DVCAM decoder processing block in LVIS.

Because the proxy video data is used as video signal during the search operation, it is sent from the SDRAM to LVIS1

through PIERe. The proxy video data is decoded in LVIS1 and is then up-converted to the HD playback video signal.

HD-SDI OUTPUT 1 [HD-SDI 1, 2] output

The HD playback video signal and the HD playback video signal that is up-converted from the SD playback video signal

in the LVIS1 are sent to ROVA (FPGA: IC301) after the HD video processing is performed in LVIS1 (IC1101).

After characters for superimposing are added in ROVA, and the video signal, audio signal, and the ANC data (LTC,

VITC, UMID, and essence mark) are multiplexed, the HD playback video signal undergoes parallel/serial conversion

and is output from ROVA as 1.5 Gbps serial HD-SDI signal.

The serial HD-SDI signal is driven by the SDI driver (IC202, IC203), and is then output to the outside from the connector

(CN201) on the rear panel.

HD-SDI MONITOR/OUTPUT 2 [MONITOR HD-SDI] output

The HD recording video signal and the HD video signal that is up-converted from the SD recording video signal in

LVIS0 (IC901) are sent to ROVA (FPGA: IC301) as the HD video signal of E-E image after the HD video processing

is performed in LVIS0.

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When the PORT SELECT button on the front panel is set to REC, the HD video signal of E-E image that is output from

LVIS0 is selected in ROVA. When the PORT SELECT button is set to PB, the HD video signal of playback image that

is output from LVIS1 (IC1101) is selected in ROVA.

After characters for superimposing are added in ROVA, and the video signal, audio signal, and the ANC data (LTC,

VITC, UMID, and essence mark) are multiplexed, the HD recording video signal undergoes parallel/serial conversion

and is output from ROVA as 1.5 Gbps serial HD-SDI signal.

The serial HD-SDI signal is driven by the SDI driver (IC206, IC207), and is then output to the outside from the connector

(CN210 [CN203]) on the rear panel.

LCD monitor output

The HD video signal that is the same as the MONITOR HD-SDI output signal is converted in pixel from HD video

signal to SD video signal by the resizer in ROVA (FPGA: IC301), and then characters for superimposing are added to

the signal.

After that, the signal is sent from the connector (CN422) on the HPR board through the CN-3243 board to the Graphic

Display Controller (IC1) on the KY-656 board. Then the signal receives OSD processing and is displayed and monitored

on the LCD.

SD-SDI OUTPUT 1 [SD-SDI 1, 2] , composite 1 output

The SD playback video signal and the SD playback video signal that is down-converted from the HD playback video

signal receive SD video processing in LVIS1 (IC1101), and are then sent to ROVA (FPGA: IC301).

After characters for superimposing are added in ROVA, and the video signal, audio signal, and the ANC data (LTC,

VITC, UMID, and essence mark) are multiplexed, the SD playback video signal undergoes parallel/serial conversion

and is output from ROVA as 270 Mbps serial SD-SDI signal.

The serial SD-SDI signal is driven by the SDI driver (IC204, IC205), and is then output to the outside from the connector

(CN202) on the rear panel.

The multiplexed parallel data is sent to the AU-325 board through the CN-3243 board, and is then converted to the

composite video signal by the digital encoder (IC600). After that, the composite video signal is transferred to the video

driver (IC605), and is then output to the outside from the composite video connector (CN11).

SD-SDI MONITOR/OUTPUT 2 [MONITOR SD-SDI] , composite 2 output

The SD recording video signal and the SD video signal that is down-converted from the HD recording video signal in

LVIS0 (IC901) receive SD video processing in LVIS0, and are then sent to ROVA (FPGA: IC301) as SD video signal

of E-E image.

When the PORT SELECT button on the front panel is set to REC, the SD video signal of E-E image that is output from

LVIS0 is selected in ROVA. When the PORT SELECT button is set to PB, the SD video signal of playback image that

is output from LVIS1 (IC1101) is selected in ROVA.

After characters for superimposing are added in ROVA, and the video signal, audio signal, and the ANC data (LTC,

VITC, UMID, and essence mark) are multiplexed, the SD recording video signal undergoes parallel/serial conversion

and is output from ROVA as 270 Mbps serial SDS-DI signal.

The serial SD-SDI signal is driven by the SDI driver (IC208 to 210), and is then output to the outside from the connector

(CN211 [CN204]) on the rear panel.

The multiplexed parallel data is sent to the AU-325 board through the CN-3243 board, and is then converted to the

composite video signal by the digital encoder (IC700). After that, the composite video signal is transferred to the video

driver (IC705), and is then output to the outside from the composite video connector (CN11).

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1-11-2. Audio Signal Processing System

Recording System

Analog audio input

The analog audio signals input from the AUDIO IN connectors (CN5, CN6) on the AU-325 board are converted to 2-

channel serial digital audio signals by the audio A/D converter (IC107) on the AU-325 board, and are then sent from

the connector (CN310) on the AU-325 board through the CN-3243 board to APROC (FPGA: IC801) on the HPR board.

Digital audio (AES/EBU) input

The 8-channel serial digital audio signals (4-channel) input from the AES/EBU IN connectors (CN1, CN2) on the

AU-325 board are level-converted by the line receiver (IC1200, IC1201) on the AU-325 board, and are then sent from

the connector (CN310) on the AU-325 board through the CN-3243 board to APROC (FPGA: IC801) on the HPR board.

After the serial digital audio signals are decoded in APROC, they are processed as AES/EBU input signals when

extension menu 815 is set to OFF.

On the other hand, when extension menu 815 is set to ON, the serial digital audio signals decoded in APROC are

synchronized with the recording video clock by the sampling rate converter (lC804 to IC807). Then the signals are

selected in APROC and processed as AES/EBU input signals.

SD-SDI/HD-SDI input

The digital audio signal contained in the SDI signal that is input from the SD/HD-SDI IN connector (CN201/HPR board)

is separated and extracted in ROVA (FPGA: IC301) on the HPR board, and is then input into APROC (FPGA: IC801).

(The HD-SDI audio signal and the SD-SDI audio signal are input into APROC as different signals.)

The above input signals input into APROC (FPGA: IC801) on the HPR board are selected with the AUDIO INPUT

SEL button on the front panel for each recording channel, are multiplexed, and are sent to REC AUDIO DSP (IC1901).

The REC AUDIO DSP performs signal processing, such as delay processing, recording level control, and muting, and

then sends the signal back to APROC as the digital audio signal for recording and E-E audio signal. The returned data

is sent from APROC to PIERe (FPGA: IC1601) as digital audio signal for recording to be written into the PIERe SDRAM

(IC1702 to IC1705).

The proxy audio data for recording is compressed by the ENC PROXY AUDIO DSP (IC2403, IC2404) based on the

digital audio signal for recording of the PIERe SDRAM to be written into the PIERe SDRAM as proxy audio data for

recording.

The digital audio signal for recording and the proxy audio data for recording stored in the PIERe SDRAM are sent from

PIERe through the CN-3243 board to the MB-1152 board with the PCI-Express interface.

Playback System

The playback video/audio data and playback proxy video/audio data are sent from the MB-1152 board through the

CN-3243 board with the PCI-Express interface to PIERe (FPGA: IC1601) on the HPR board to be written into the PIERe

SDRAM (IC1702 to IC1705).

The playback audio data stored in the PIERe SDRAM is sent to APROC (FPGA: IC801) in which channel- 1 to channel-8

audio signals are multiplexed with the playback audio data. Then the multiplexed data is sent to PB/MONI AUDIO

DSP1 (IC2002) for signal processing such as digital JOG sound processing, playback level control, delay processing,

and muting.

The processed playback audio signals are sent back to APROC from PB/MONI AUDIO DSP1 as audio signals for HD-

SDI OUT1, HD-SDI OUT2, SD-SDI OUT1, SD-SDI OUT2, AES/EBU OUT, and ANALOG AUDIO OUT.

Furthermore, the recording audio signals and the playback audio signals sent back to APROC from PB/ MONI AUDIO

DSP1 are multiplexed with channel-1 to channel-8 audio signals. Then the multiplexed data is sent to PB/MONI AUDIO

DSP0 (IC2001) for signal processing such as level control, delay processing, and muting.

The processed audio signals are sent back to APROC from PB/MONI AUDIO DSP0 as audio signals for MONITOR

HD-SDI OUT, MONITOR SD-SDI OUT, MONITOR ANALOG AUDIO OUT, and HEADPHONES OUT.

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The playback proxy audio data stored in the PIERe SDRAM is sent to DEC PROXY AUDIO DSP (IC1903, IC1904),

is expanded (opposite to the time it was recorded), and is then sent to APROC. The signal is then multiplexed and is

input to PB/MONI AUDIO DSP1 to be used by switching with the mainline playback digital audio signal as required

for shuttle playback, for example.

Analog audio output

The playback digital audio data is sent from APROC (FPGA: IC801) through the CN-3243 board to the audio D/A

converter (IC501) on the AU-325 board for conversion to analog audio signal. The converted analog audio signal is

output from the AUDIO OUT connectors (CN7, CN8).

Digital audio (AES/EBU) output

The playback digital audio data is encoded in APROC (FPGA: IC801), and the 8-channel serial audio data is sent from

APROC through the CN-3243 board to the AES/EBU driver (IC1202 to IC1205) on the AU-325 board, and is then

output from the AES/EBU OUT connectors (CN1 to CN4).

HD-SDI OUTPUT 1 [HD-SDI 1, 2] output

The playback digital audio data output from APROC (FPG: IC801) is input to ROVA (FPGA: IC301) in which the data

is multiplexed with the playback HD digital video signal, and is then converted to serial data. The serial data is output

from ROVA as 1.5 Gbps serial HD-SDI signal.

The serial HD-SDI signal is driven by the SDI driver (IC202, IC203), and is then output to the outside from the connector

(CN201) on the rear panel.

SD-SDI OUTPUT 1 [SD-SDI 1, 2] output

The playback digital audio data output from APROC (FPG: IC801) is input to ROVA (FPGA: IC301) in which the data

is multiplexed with the playback SD digital video signal, and is then converted to serial data. The serial data is output

from ROVA as 270 Mbps serial SD-SDI signal.

The serial SD-SDI signal is driven by the SDI driver (IC204, IC205), and is then output to the outside from the connector

(CN202) on the rear panel.

HD-SDI MONITOR/OUTPUT 2 [MONITOR HD-SDI] output

The digital audio signal for monitoring output from APROC (FPG: IC801) is input to ROVA (FPGA: IC301) in which

the signal is multiplexed with the MONITOR HD digital video signal, and is then converted to serial data. The serial

data is output from ROVA as 1.5 Gbps serial HD-SDI signal.

The serial HD-SDI signal is driven by the SDI driver (IC206, 207), and is then output to the outside from the connector

(CN210 [CN203]) on the rear panel.

SD-SDI MONITOR/OUTPUT 2 [MONITOR SD-SDI] output

The digital audio signal for monitoring output from APROC (FPG: IC801) is input to ROVA (FPGA: IC301) in which

the signal is multiplexed with the MONITOR SD digital video signal, and is then converted to serial data. The serial

data is output from ROVA as 270 Mbps serial SD-SDI signal.

The serial SD-SDI signal is driven by the SDI driver (IC208 to 210), and is then output to the outside from the connector

(CN211 [CN204]) on the rear panel.

MONITOR AUDIO output

The digital audio signal for monitoring is sent from APROC (FPGA: IC801) through the CN-3243 board to the audio

D/A converter (IC502) on the AU-325 board to be converted to analog audio signal. The analog audio signal is then

output from the MONITOR AUDIO OUT connectors (CN9, CN10).

HEADPHONES output

The digital audio signal for headphone monitoring is sent from APROC (FPGA: IC801) through the CN-3243 board to

the audio D/A converter (IC911) on the KY-656 board to be converted to analog audio signal. The analog audio signal

is then output from the PHONES connector (CN34).

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1-11-3. Sync Signal Processing System

The reference video signal input from the REF.VIDEO INPUT connector (CN702) on the HPR board

is transferred to the SYNC SEP circuit (IC709) for separating the sync signals. The separated sync signals are input into

PHOT (IC1301).

PHOT generates the following reference clock signals in synchronization with the reference video signal or the sync

signal extracted from the SD/HD-SDI input signal.

• 74.25 MHz reference clock/74.1758 MHz reference clock

• 27 MHz reference clock

In addition, APROC (FPGA: IC801) generates the following reference clock signals in synchronization with the sync

signal and clock generated by PHOT.

• 24.576 MHz (512 FS) reference clock

With these reference clock signals, PHOT generates sync timing signals such as HD, VD, and Frame, and supplies them

to devices together with clock signals.

When no signals are input into the REF.VIDEO INPUT connector or SD/HD-SDI INPUT connector, sync timing signals

are generated from the 74 MHz or 27 MHz clock of free-running oscillation.

1-11-4. I/O System Control System

This unit mounts a RISC microprocessor (referred to as CPU: IC101/SY-388 board hereafter) as an I/O system control

CPU compatible with a real-time OS “iTRON.” The CPU provides the following functions.

PCI bus interface

The CPU is connected to PIERe (FPGA: IC1601) and PHOT (IC1301) on the HPR board through the PCI bus interface

to control them and for mutual data transfer.

The CPU sends/receives data to/from the following devices through PIERe.

• DEC/ENC Proxy Audio DSP (IC2001, IC2002, IC2403, IC2404/HPR board )

• LVIS0, 1 (IC901, IC1101/HPR board)

• MIKE (IC1205/HPR board)

Furthermore, the CPU also sends/receives data to/from the following devices through PHOT.

• ROVA (IC301/HPR board )

• APROC (IC801/HPR board )

• Temperature sensor (IC1402/HPR board)

• D/A converter for adjusting free-running frequency and SC phase (IC1401/HPR board)

• REC AUDIO DSP ， PB/MONI AUDIO DSP0, 1 (IC1901, IC2001, IC2002/HPR board )

• Character generator (IC605 to IC608/HPR board)

• NATH (IC500, IC1000/ENC-143 board)

• NECO (IC200/ENC-143 board)

• [TORINO (IC201, IC401, IC601, IC801, IC1001/ENC-132 board )]

• Analog audio control (AU-325 board)

• D/A converter for adjusting composite video level (IC683/AU-325 board)

• Nios2 FPGA (TSI-60 board)

In addition, the CPU sends control data to the MB-1152 board (IT system board, Linux OS) through PCI-PCI Bridge

installed in PHOT and PCI-PCI EXPRESS (IC1501).

Memory controller

• SDRAM (IC102 to IC105/SY-388 board) control (64 bits, 128 Mbytes)

• FLASH MEMORY (IC306, IC307/SY-388 board) control (32 bits, 64 Mbytes)

• FRAM (IC310/SY-388 board) control (8 bits, 32 Kbytes)

Serial interface

• 9-pin REMOTE control (x2)

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• VIDEO REMOTE control

External control signal

• GPIO port control (4 INPUT ports, 4 OUTPUT ports)

• Parallel port control

RESET signal output of devices, board detection, switch settings read, etc.

• PIERe/PHOT/ROVA/APROC configuration

1-11-5. I/O Interface System

REMOTE (9P)

The REMOTE1 and REMOTE2 signals are connected to the driver/receiver (IC202) from the REMOTE (9P) connectors

(CN206, CN207/MB-1152 board). Then these signals are connected through the CN-3243 and HPR boards to the CPU

(IC101) on the SY-388 board. The REMOTE1 and REMOTE2 signals are used to control the recording system and

playback system, respectively.

VIDEO CONTROL (9P)

The VIDEO CONTROL signal is connected to the driver/receiver (IC203) from the VIDEO CONTROL (9P) connector

(CN208/MB-1152 board). Then this signal is connected through the CN-3243 and HPR boards to the CPU (IC101) on

the SY-388 board to be controlled.

Time code

TC input

The time code input signal is input from the BNC connector TIME CODE IN (CN703/HPR board), and is then connected

through the buffer/amplifier circuit (IC712, IC713) to PHOT (IC1301) on the HPR board.

TC output

The time code output signal is output from PHOT (IC1301) on the HPR board, and is then output through the buffer/

amplifier circuit (IC715, IC716) from the BNC connector TIME CODE OUT (CN703/HPR board).

SYSTEM TC input

The SYSTEM TC input signal is input from the BNC connector SYSTEM TC IN (CN205/MB-1152 board), and is then

connected through the buffer/amplifier circuit (IC204, IC205/MB-1152 board) and the CN-3243 board to PHOT

(IC1301) on the HPR board.

1-11-6. Optical Drive System

Playback System

Data playback system

The RF signal of channel 0a played back from the disc is transferred from the optical block to the Disc Drive LSI (IC100)

on the BD-42 board where AGC and equalizing correction is applied to the signal. Then the RF signal is converted to

a digital signal by the read clock generated in synchronization by the Read PLL.

After that, PR equalization, Viterbi decoding, 1-7PP demodulation, descrambling, error correction, and other processing

are applied to the signal, and then the processed signal is sent to BRIDGE (IC700) with the SATA Interface. In the same

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way, the RF signal of channel 0b is also processed by the Disc Drive LSI (IC200) on the BD-42 board, and is then sent

to BRIDGE (IC700).

BRIDGE (IC700) controls Read system of two channels individually to produce the maximum transfer rate, integrates

it to a single system, and then sends it to the MB-1152 board.

Address playback system

The address information played back from the disc is sent from the optical block to the Disc Drive LSI (IC100, IC200)

on the BD-42 board. The Disc Drive LSI detects a wobble signal and decodes the address. The detected analog wobble

signal is converted to a digital signal, and a wobble clock (WCK) signal is generated by the digital PLL.

Data recording system

The recording signal that is transferred from MB-1152 board to BRIDGE (IC700) on the BD-42 board. BRIDGE (IC700)

controls distribution of Write system of two channels individually to produce the maximum transfer rate.

Each distributed recording signal is input to the Disc Drive LSI (IC100, IC200) of each channel where scrambling and

1-7PP modulation processing are applied to the signal. Then the processed signal is sent to the LDD in the optical block

with the Write Strategy that meets each media type, and then the signal is recorded in the disc.

Servo System

Three-axis actuator and SA actuator

The objective lens in the optical block is controlled by the 3-axis actuator in the focus direction, in the track direction,

and for tilt.

The disc reflected light is converted to an electrical signal by the optical block, and the electrical signal is input to the

Disc Drive LSI (IC100, IC200) of each channel on the BD-42 board where a focus error signal and a track error signal

are generated. This error signal is internally converted to a digital signal and the Digital Servo control is applied to the

digital signal.

The control amount is output from the Disc Drive LSI (IC100, IC200) to the driver (IC104, IC204) to control the focus/

track/tilt/SA actuators.

The tilt actuator is controlled to be at an appropriate angle to the disc based on the tilt adjustment result where the

playback signal jitter becomes minimal and the angular speed sensor output.

The SA actuator is controlled at the position where the best spherical aberration correction is made during startup

adjustment when a disc is inserted.

For multilayer discs, the SA actuator is controlled at the best position each time layer jump is made.

Spindle motor

The FG generated by the spindle motor is amplified and reshaped on the SE-1005 board, and is then input to the Disc

Drive LSI (IC100) on the BD-42 board.

The Disc Drive LSI (IC100) compares the FG frequency with the target frequency and outputs the control amount to

the driver (IC500) to control the spindle motor.

Seek motor

The seek motor drives the entire optical unit so that the a track that records and plays data on the disc is maintained

within the objective lens drive range.

Driving of the seek motor is controlled by the Disc Drive LSI (IC100) of channel 0a through the driver (IC500).

System Control

The CPU in the Disc Drive LSI (IC100, IC200) on the BD-42 board performs system control of the drive section for

each channel.

• Channel 0a: IC100

• Channel 0b: IC200

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The CPU in the Disc Drive LSI (IC100, IC200) of channel 0a controls LSIs in the spindle, seek, loader, and optical

blocks through PERIPHERAL (IC600).

The CPU in BRIDGE (IC700) performs system control of the BRIDGE section. It also controls LED panel display,

eject switch, maintenance, and error log.

The Drive firmware and the source of the PERIPHERAL FPGA are stored separately in the flash memory in the Disc

Drive LSI (IC100, IC200) and in the external flash memory (IC101, IC201) and are loaded when the unit is powered

on.

The BRIDGE firmware is stored in the flash memory (IC701) and is loaded when the unit is powered on.

Adjustment data and hours meter data are stored in the EEPROM (IC3) on the SE-1004 board.

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1-12. Connecting and Disconnecting Flexible Card Wires

Locking tab

Disconnection Connection

Connector

Flexible card wire

OK NG

Flexible card wire

Locking tab

Note

• Bending a flexible card wire significantly shortens its lifetime. Handle flexible card wires very carefully.

• A flexible card wire consists of conductive part and insulated part. Note that the circuit does not work if a flexible

card wire is connected in wrong orientation of conductive part and insulated part.

• Insert flexible card wires straight.

• Make sure that the conductive part of flexible card wires is free of dust and dirt.

1-12-1. Connecting/Disconnecting Flexible Card Wire (Type A)

Disconnection

1. Open the locking tab to release the lock.

Note

Do not open the locking tab 90 degrees or more so as not to damage the connector.

2. Pull out the flexible card wire.

Connection

1. Insert the flexible card wire fully into the connector.

2. Close the locking tab to lock the flexible card wire.

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1-12-2. Connecting/Disconnecting Flexible Card Wire (Type B)

Disconnection Connection

Flexible card wire

Locking tab

Flexible card wire

Conductive part

Locking tab

Disconnection

Connector

Flexible card wire

Locking tab

Connection

Connector

Flexible card wire

OK NG

Disconnection

1. Pull out the locking tab to release the lock.

2. Pull out the flexible card wire.

Connection

1. Insert the flexible card wire fully into the connector.

2. Close the locking tab to lock the flexible card wire.

1-12-3. Connecting/Disconnecting Flexible Card Wire (Type C)

Disconnection

1. Open the locking tab to release the lock.

Note

Do not open the locking tab 90 degrees or more so as not to damage the connector.

2. Pull out the flexible card wire.

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Connection

Locking tab

Connector

Flexible card wire

Disconnection

Locking tab

Connector

Connection

OK NG

1. Insert the flexible card wire fully into the connector.

2. Push the locking tab to lock the flexible card wire.

1-12-4. Connecting/Disconnecting Flexible Card Wire (Type D)

Disconnection

1. Open the locking tab to release the lock.

Note

Do not open the locking tab 90 degrees or more so as not to damage the connector.

2. Pull out the flexible card wire in the arrow A direction.

Connection

1. Set the flexible card wire in the arrow B direction into the connector.

2. Close the locking tab to lock the flexible card wire.

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1-13. Cautions on Handling the Optical Block Assembly

Ground wrist strap

Optical block assembly

Earth mat

When handling the optical block assembly, perform grounding as described below to prevent electrostatic breakdown.

Grounding human body

Be sure to wear a grounded wrist strap (108 Ω or less) to discharge static electricity charged in the human body.

Note

Since static electricity charged in clothes is not discharged from the wrist strap, keep your clothes away from the optical

block assembly.

Grounding the workbench

Be sure to put the optical block assembly on a grounded earth mat (109 Ω or less recommended) or a copper plate.

Precautions

• The optical block assembly has been precisely adjusted. Do not give impact to it due to fall or careless handling.

• Do not touch the objective lens.

• When handling the optical block assembly, hold the slide base (die-casting). If a part of human body or another

object directly touches the circuit on the printed circuit board, it may deteriorate.

• The actuator has a strong magnet. If a magnetic substance comes close to the optical block assembly, the actuator

characteristics change. Contacting a metal part such as a screwdriver with the actuator may damage the objective

lens. Do not bring a magnetic substance close to the optical block assembly.

• Be careful so that any foreign matter does not enter the clearance of the actuator cover.

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Hold the shaded portions.

Keep away a screwdriver

Objective lens

Actuator

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1-14. Lead-free Solder

All boards mounted in this unit use lead-free solder. Be sure to use lead-free solder when repairing the boards of this

unit. A lead free mark (LF) indicating that the solder contains no lead is printed on each board. (Caution: Some printed

circuit boards may not come printed with the lead free mark due to their particular size.)

: LEAD FREE MARK

Note

• The lead-free solder melts at a temperature about 40 °C higher than the ordinary solder, therefore, it is recommended

to use the soldering iron having a temperature regulator.

• The ordinary soldering iron can be used but the iron tip has to be applied to the solder joint for a slightly longer

time. The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 53

Section 2

ERROR

AN ERROR HAS BEEN

DETECTED. INFORM SERVICE

OF FOLLOWING CODE :

XX-XXX

Error Messages

2-1. Error Message Overview

This unit has a self-diagnosis function to detect internal errors.

When the unit detects an error, its error code and information are displayed on the following display units. (XX-XXX

shows an error code.)

• Information bar (at the lower part of the LCD on the front panel)

• Video monitor connected to the MONITOR connector

When an error occurs, its error code information is recorded in the error logger (maintenance logger) of the main unit

and also in the error logger (drive logger) of the drive unit.

For whether to record log or not, refer to each list of “Error xx.”

Note

Maintenance logger column, Drive logger column:

• “○” : Error is recorded in the maintenance logger and drive logger.

• “×” : Error is not recorded in the maintenance logger and drive logger.

Fig. 2-1. Example error in video monitor screen

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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2-2. Error Code List

XX-XXX

Main code Sub code

An error code consists of a 2-digit main code and a 3-digit sub code.

Main code Main error description

0X Optical drive control errors and device errors

02: Optical device (LD, liquid crystal) errors

03: 2-axis optical drive (FCS, TRK) errors

04: Optical drive seek errors

06: Optical drive SA actuator errors

08: Optical drive spindle errors

20 Loader assembly errors

3X Sensor system errors in the optical drive

5X Read data errors

6X Startup errors

71 Internal storage errors

91 CPU - peripheral devices interface errors

92 Synchronization system errors

95 Video/audio signal processing device errors

For details of sub codes, refer to respective error tables.

If multiple errors occur simultaneously

The highest-priority error is displayed.

When a higher-priority error is cleared, the following-priority error code is displayed.

Protection mode

When the unit detects an error, it enters the special state (protection mode) to prevent breakdown or failure of the cartridge

disc, optical drive, and other parts.

The protection mode varies depending on errors. If a cartridge is loaded in the unit, press the EJECT button and remove

the cartridge.

Depending on the situation of error occurrence, a cartridge cannot be inserted after the EJECT command is received. In

that case, turn off and on the power.

2-2-1. Error 0X

When an optical drive control error or a device error is detected, one of the following error codes is displayed.

Main code

02 020 ○ ○ Optical block assembly Ch-A is recording data with the maximum

025 ○ ○ Optical block assembly Ch-A detected a laser output error.

026 ○ ○ Laser output adjustment could not be made in optical block assembly

027 ○ ○ Laser drive overcurrent was detected in optical block assembly Ch-A.

Sub code Mainte-

nance logger

Drive logger

Description

laser output. Clean the pickup lens as a measure. (Refer to 4-6-12.)

Ch-A.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-2

Page 55

Main code

028 ○ ○ It was decided that no cartridge is present in optical block assembly

037 ○ ○ The liquid crystal attenuator could not work in optical block assembly

0A0 ○ ○ Optical block assembly Ch-B is recording data with the maximum

0A5 ○ ○ Optical block assembly Ch-B detected a laser output error.

0A6 ○ ○ Laser output adjustment could not be made in optical block assembly

0A7 ○ ○ Laser drive overcurrent was detected in optical block assembly Ch-B.

0A8 ○ ○ It was decided that no cartridge is present in optical block assembly

0B7 ○ ○ The liquid crystal attenuator could not work in optical block assembly

820 ○ ○ Data was played with the maximum laser output in optical block as-

8A0 ○ ○ Data was played with the maximum laser output in optical block as-

A26 ○ ○ Dynamic adjustment could not be made in optical block assembly Ch-

AA6 ○ ○ Dynamic adjustment could not be made in optical block assembly Ch-

F2E × ○ It was decided that laser is deteriorated in optical block assembly Ch-

F2F × ○ It was decided that laser has reached its life in optical block assembly

FAE × ○ It was decided that laser is deteriorated in optical block assembly Ch-

FAF × ○ It was decided that laser has reached its life in optical block assembly

03 054 ○ ○ A signal from the disc required for focus servo of optical block as-

04 07C ○ ○ Optical block assembly Ch-A cannot move to the innermost circum-

06 049 ○ ○ The SA actuator of optical block assembly Ch-A cannot detect the

Sub code Mainte-

nance logger

058 ○ ○ Control overcurrent was detected in focus tracking servo of optical

0D4 ○ ○ A signal from the disc required for focus servo of optical block as-

0D8 ○ ○ Control overcurrent was detected in focus tracking servo of optical

0FC ○ ○ Optical block assembly Ch-B cannot move to the innermost circum-

0C9 ○ ○ The SA actuator of optical block assembly Ch-B cannot detect the

E41 ○ ○ The SA actuator of optical block assembly Ch-A cannot move to the

EC1 ○ ○ The SA actuator of optical block assembly Ch-B cannot move to the

Drive logger

Description

Ch-A and laser output is stopped.

Ch-A.

laser output. Clean the pickup lens as a measure. (Refer to 4-6-12.)

Ch-B.

Ch-B and laser output is stopped.

Ch-B.

sembly Ch-A.

sembly Ch-B.

Ch-A.

Ch-B.

sembly Ch-A cannot be detected.

block assembly Ch-A.

sembly Ch-B cannot be detected.

block assembly Ch-B.

ference of the disc.

target position.

reference position.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 56

Main code

08 091 ○ ○ The spindle motor does not work (or there is no FG signal) after the

Sub code Mainte-

nance logger

095 ○ ○ The spindle motor cannot be stopped and continues to rotate (or the

292 ○ ○ Spindle motor rotation was detected during vertical movement of

992 ○ ○ Spindle motor rotation was detected during unchucking.

Drive logger

Description

specified time period has passed.

FG signal is abnormal).

2-2-2. Error 20

When a loader assembly error is detected, one of the following error codes is displayed.

Main code

20 018 ○ ○ Abnormal current was detected in the loading motor.

111 ○ ○ Horizontal movement of loading did not end within the specified time

117 ○ ○ Displacement of cartridge was detected in the loader during horizontal

118 ○ ○ Abnormal current was detected in the loading motor during horizontal

211 ○ ○ Vertical movement of loading did not end within the specified time

213 ○ ○ Cartridge could not be detected even after loading.

217 ○ ○ Displacement of cartridge was detected in the loader during vertical

218 ○ ○ Abnormal current was detected in the loading motor during vertical

811 ○ ○ Eject operation did not end within the specified time period.

818 ○ ○ Abnormal current was detected in the loading motor during eject oper-

911 ○ ○ Unchucking operation did not end within the specified time period.

918 ○ ○ Abnormal current was detected in the loading motor during unchucking

F10 ○ ○ A loader alarm was detected during boot sequence.

Sub code Mainte-

nance logger

Drive logger

Description

period.

movement of loading.

period.

movement of loading

movement of loading.

ation.

operation.

2-2-3. Error 3X

When a sensor system error in the optical drive is detected, one of the following error codes is displayed.

Main code

34 900 ○ ○ Disc Drive LSI (IC100: BD-42 board) detected error of the loader po-

909 ○ ○ Disc Drive LSI (IC100: BD-42 board) detected error of the sensor hole

*1: Vertical movement of loading/unloading is also performed by executing STBY ON/OFF.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Sub code Mainte-

nance logger

Drive logger

Description

sition sensor (LDR-36 board).

(SE-1004 board, SE-1005 board).

Continued

2-4

Page 57

Main code

A00 ○ ○ Disc Drive LSI (IC200: BD-42 board) detected error of the loader po-

A09 ○ ○ Disc Drive LSI (IC200: BD-42 board) detected error of the sensor hole

37 900 × ○ The temperature sensor of optical block assembly Ch-A detected an

3D 901 ○ ○ The 5V-SAG detection function was activated disabling the system to

Sub code Mainte-

nance logger

A00 × ○ The temperature sensor of optical block assembly Ch-B detected an

Drive logger

Description

sition sensor (LDR-36 board).

(SE-1004 board, SE-1005 board).

alarm.

start.

2-2-4. Error 5X

When a read data error is detected, one of the following error codes is displayed.

Main code

50 010 × ○ BCA area data cannot be read.

51 020 × ○ PIC area data cannot be read.

52 00B × ○ No address can be read from the disc in optical block assembly Ch-A.

53 500 × ○ Recording to disc was attempted with no available spare area.

54 000 × ○ Unsupported REC mode was detected in the recording disc.

Sub code Mainte-

nance logger

011 × ○ BCA area data is invalid.

021 × ○ PIC area data is invalid.

500 × ○

08B × ○ No address can be read from the disc in optical block assembly Ch-B.

001 × ○ Unsupported PAC is used in the recording disc.

002 × ○ Unsupported spare area is used in the recording disc.

003 × ○ Unsupported DFL entry was detected in the recording disc.

200 × ○ A TDMA area error was detected during write-back to the recording

201 × ○ A disc error was detected during finalizing of the recording disc.

Drive logger

Description

An unspecified disc was inserted.

disc or formatting.

2-2-5. Error 6X

When a startup error or a pre-writing adjustment error is detected, one of the following error codes is displayed.

Main code

61 000 × ○ Depletion of OPC area in the disc was detected.

6F E00 × ○ Startup adjustment or OPC cannot be finished in optical block assembly

E03 × ○ Adjustment failed in starting optical block assembly Ch-A.

E80 × ○ Startup adjustment or OPC cannot be finished in optical block assembly

*1: For discs that can be read and written in this unit, refer to the Operation Manual.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Sub code Mainte-

nance logger

Drive logger

Description

Ch-A.

Ch-B.

Continued

2-5

Page 58

Main code

E83 × ○ Adjustment failed in starting optical block assembly Ch-B.

Sub code Mainte-

nance logger

Drive logger

Description

2-2-6. Error 71

When an internal storage error is detected, the following error code is displayed.

Main code

71 102 ○ × Number of the active drive is not enough. RAID cannot be configured.

Sub code Mainte-

nance logger

Drive logger

Description

2-2-7. Error 91

When interface (between CPU and peripheral devices) errors are detected, the following error codes are displayed.

Note

IT CPU: COM Express CPU Module/MB-1152 board

IO CPU: IC101/SY-388 board

FP CPU: IC1/KY-656 board

Main code

91 125 ○ × Communication between IT CPU and FP CPU is interrupted (detected

145 ○ × Communication between IT CPU and IO CPU is interrupted (detected

155 ○ × Communication between IT CPU and optical drive is interrupted (de-

215 ○ × Communication between FP CPU and IT CPU is interrupted (detected

415 ○ × Communication between IO CPU and IT CPU is interrupted (detected

430 ○ × IO CPU detects a flash memory (IC306, IC307/SY-388 board) error.

43A ○ × IO CPU detects a serial number area error.

43C ○ × IO CPU detects an adjustment data area (EEPROM: IC1401/HPR

43D ○ × IO CPU detects an hours meter area (FRAM: IC310/SY-388 board)

557 ○ ○ A firmware alarm or startup of the recovery firmware was detected.

595 ○ ○ Communication between Disc Drive LSI (IC100: BD-42 board) and

597 ○ ○ Failure in Disc Drive LSI (IC100: BD-42 board) firmware upgrade was

5A5 ○ ○ Communication between Disc Drive LSI (IC200: BD-42 board) and

5A7 ○ ○ Failure in Disc Drive LSI (IC200: BD-42 board) firmware upgrade was

Sub code Mainte-

nance logger

Drive logger

Description

by IT CPU).

by IT CPU)

tected by IT CPU).

by FP CPU).

by IO CPU).

board, IC683/ AU-325 board) error.

error.

BRIDGE (IC700: BD-42 board) cannot be established in optical block assembly Ch-A during startup.

detected in optical block assembly Ch-A during startup.

BRIDGE (IC700: BD-42 board) cannot be established in optical block assembly Ch-B during startup.

detected in optical block assembly Ch-B during startup.

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Page 59

2-2-8. Error 92

When synchronization system errors are detected, the following error codes are displayed.

Tip

IO CPU: IC101/SY-388 board

Main code

92 101 ○ × IO CPU detects a REF FOE error (except 24P).

102 ○ × IO CPU detects a REC FOE error.

104 ○ × IO CPU detects a 24P REF FOE error.

Sub code Mainte-

nance logger

Drive logger

Description

2-2-9. Error 95

When interface (between device ICs) errors are detected, the following error codes are displayed.

Tip

IO CPU: IC101/SY-388 board

Main code

95 102 ○ × An error in communication between IT CPU and SxS Slot A (DIF-194

103 ○ × An error in communication between IT CPU and SxS Slot B (DIF-194

404 ○ × An error in communication between IO CPU and MPEG IMX encoder

405 ○ × An error in communication between IO CPU and video encoder 0

406 ○ × An error in communication between IO CPU and video encoder 1

407 ○ × An error in communication between IO CPU and MPEG encoder device

408 ○ × An error in communication between IO CPU and MPEG encoder device

409 ○ × An error in communication between IO CPU and MPEG decoder device

40A ○ × An error in communication between IO CPU and MPEG decoder device

40B ○ × IO CPU detects a signal processing device ROVA (IC301/HPR board)

40C ○ × IO CPU detects a signal processing device LVIS0 (IC901/HPR board)

40D ○ × IO CPU detects a signal processing device LVIS1 (IC1101/HPR board)

40E ○ × IO CPU detects a signal processing device AUPR (IC801/HPR board)

411 ○ × IO CPU detects a PB DSP0 (IC2001/HPR board) error.

Sub code Mainte-

nance logger

Drive logger

Description

board) is detected.

(MIKE: IC1205/HPR board) is detected.

(IC600/AU-325 board) is detected.

(IC700/AU-325 board) is detected.

(NATH: IC500/ENC-143 board) [(TORINO: IC201, IC401, IC601/ ENC-132 board)] is detected. (detected by IO CPU)

(NATH: IC500/ENC-143 board) [(TORINO: IC201, IC401, IC601/ ENC-132 board)] error is detected (reported by NATH [TORINO]).

(NATH: 1000/ENC-143 board) [(TORINO: IC801, IC1001/ENC-132 board)] is detected. (detected by IO CPU)

(NATH: 1000/ENC-143 board) [(TORINO: IC801, IC1001/ENC-132 board)] error is detected (reported by NATH [TORINO]).

error.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Main code

412 ○ × IO CPU detects a PB DSP1 (IC2002/HPR board) error.

413 ○ × IO CPU detects a REC DSP0 (IC1901/HPR board) error.

414 ○ × IO CPU detects an LRZ DSP0 (IC1903/HPR board) error.

415 ○ × IO CPU detects an LRZ DSP1 (IC1904/HPR board) error.

416 ○ × IO CPU detects an LRZ DSP2 (IC2403/HPR board) error.

417 ○ × IO CPU detects an LRZ DSP3 (IC2404/HPR board) error.

418 ○ × IO CPU detects a HDMI (IC701/HPR board) error.

419 ○ × IO CPU detects a TS optional module error.

41A ○ × IO CPU detects an NRFIFO (IC626/HPR board) error.

41C ○ × IO CPU detects an NECO (IC200/ENC-143 board) error.

50D ○ ○ BRIDGE (IC700: BD-42 board) temperature alarm was detected.

50E × ○ BRIDGE (IC700: BD-42 board) temperature exceeded 80 degrees.

50F × ○ Abnormal BRIDGE (IC700: BD-42 board) fan stop was detected.

510 ○ ○ No data can be read from the SPI-EEPROM (IC709: BD-42 board).

511 ○ ○ An SPI-EEPROM (IC709: BD-42 board) error was detected.

512 ○ ○ A BPI-FLASH (IC701: BD-42 board) data error was detected.

513 ○ ○ No data can be written to the BPI-FLASH (IC701: BD-42 board) during

514 ○ ○ An RTC (IC710: BD-42 board) read data error was detected.

907 ○ ○ Adjustment data cannot be read from the EEPROM in optical block

908 ○ ○ Hours meter data cannot be read from the EEPROM in optical block

909 ○ ○ Ch-A Disc Drive LSI (IC100: BD-42 board) cannot read adjustment

90A ○ ○ Ch-A Disc Drive LSI (IC100: BD-42 board) cannot read hours meter

90C ○ ○ Ch-A Disc Drive LSI (IC100: BD-42 board) detected a configuration

930 ○ ○ Optical block assembly Ch-A cannot initialize PERIPHERAL device.

940 ○ ○ IL adjustment has not been completed in optical block assembly Ch-A.

941 ○ ○ No data can be written to the EEPROM in optical block assembly Ch-

942 ○ ○ Ch-A Disc Drive LSI (IC100: BD-42 board) cannot write data to the SE

960 ○ ○ A system error was detected in Ch-A Disc Drive LSI (IC100: BD-42

A07 ○ ○ Adjustment data cannot be read from the EEPROM in optical block

A08 ○ ○ Hours meter data cannot be read from the EEPROM in optical block

A09 ○ ○ Ch-B Disc Drive LSI (IC200: BD-42 board) cannot read adjustment

A0A ○ ○ Ch-B Disc Drive LSI (IC200: BD-42 board) cannot read hours meter

A0C ○ ○ Ch-B Disc Drive LSI (IC200: BD-42 board) detected a configuration

A30 ○ ○ Optical block assembly Ch-B cannot initialize PERIPHERAL device.

A40 ○ ○ IL adjustment has not been completed in optical block assembly Ch-B.

Sub code Mainte-

nance logger

Drive logger

Description

firmware upgrade.

assembly Ch-A.

data from the SE EEPROM (IC3: SE-1004 board).

error of PERIPHERAL (IC600: BD-42 board).

EEPROM (IC3: SE-1004 board).

board).

assembly Ch-B.

data from the SE EEPROM (IC3: SE-1004 board).

error of PERIPHERAL (IC600: BD-42 board).

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 61

Main code

A41 ○ ○ No data can be written to the EEPROM in optical block assembly Ch-

A42 ○ ○ Ch-B Disc Drive LSI (IC200: BD-42 board) cannot write data to the SE

A60 ○ ○ A system error was detected in Ch-B Disc Drive LSI (IC200: BD-42

Sub code Mainte-

nance logger

Drive logger

Description

EEPROM (IC3: SE-1004 board).

board).

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 62

2-3. Alarms (Warning)

ALARM

HIGH TEMPERATURE.

An alarm (warning message) appears in the status display area when an operation is attempted which is inappropriate

for the settings on this unit or the state of a media. Both the alarm message and the action to take to resolve the problem

appear on the video monitor screen or on a PC monitor connected to the MONITOR connector.

When an error occurs, its error code information is recorded in the error logger (maintenance logger) of the main unit.

Fig. 2-2. Example alarm in video monitor screen

2-3-1. When the Unit is Powered on

LOG Alarm message in

W20-010 Exchg batt! BATTERY NEEDS REPLAC-

W30-010 ILL. SETUP! INVALID SETTINGS SELEC-

W40-044 FS ERR! FILE SYSTEM ERROR.

W90-003 PSU detect OPTIONAL REDUNDANT

W90-004 DVB-ASI detect OPTIONAL DVB-ASI I/O

W90-005 SSD detect OPTIONAL SSD HAS BEEN

— Run Software Update

status display area

Program.

Alarm message in video monitor screen

ING. PLEASE CONTACT SERVICE.

TED IN SETUP MENU. SET ITEMS IN THE SETUP MENU TO THE APPROPRIATE VALUES. CONTACT SERVICE IF THIS ALARM APPEARS AGAIN AFTER ABOVE PROCEDURE.

AFTER COPY ALL CLIPS, FORMAT INTERNAL STORAGE.

POWER SUPPLY UNIT HAS BEEN DETECTED. PLEASE CHECK AND SET MAINTENANCE MENU ITEM M22.

UNIT HAS BEEN DETECTED. PLEASE CHECK AND SET MAINTENANCE MENU ITEM M22.

DETECTED. PLEASE CHECK AND SET MAINTENANCE MENU ITEM D11.

RUN SOFTWARE UPDATE PROGRAM.

Description/action

The battery of the internal clock is exhausted.

This alarm message appears in the case of failure in reading of menu set value or abnormal data. Set the Setup menu again.

A file system error of the internal storage occurred. Copy all clips and then format the storage.

An optional power supply unit has been detected. Set the maintenance menu item M22: OPTION SETTING.

An optional DVB-ASI I/O unit has been detected. Set the maintenance menu item M22: OPTION SETTING.

An optional SSD has been detected. Set the maintenance menu item D11: RAID.

The software update is not properly performed. Update the software version again.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 63

2-3-2. When a Memory Card is Inserted

LOG Alarm message in

status display area

W40-021 Over DUR!(A) EXCESSIVE DURATION IS

W40-022 Over DUR!(B) EXCESSIVE DURATION IS

W40-060 Unknown Media(A) UNKNOWN MEDIA (A).

W40-061 Unknown Media(B) UNKNOWN MEDIA (B).

W40-062 Memory(A) needs Re-

storing.

W40-063 Memory(B) needs Re-

storing.

W40-067 Memory(A) Error! MEDIA(A) CANNOT BE RE-

W40-068 Memory(B) Error! MEDIA(B) CANNOT BE RE-

W60-032 Under Repair of Me-

dia(A)

W60-033 Under Repair of Me-

dia(B)

W60-034 Repair Failed(A) REPAIR FAILED The memory card is damaged, and recording and

W60-035 Repair Failed(B) REPAIR FAILED The memory card is damaged, and recording and

W60-036 Unknown FS!(A) CANNOT USE MEDIA (A).

W60-037 Unknown FS!(B) CANNOT USE MEDIA (B).

Alarm message in video monitor screen

IN MEDIA (A).

IN MEDIA (B).

PLEASE CHANGE.

MEDIA ERROR. MEDIA (A) NEEDS TO BE RESTORED.

MEDIA ERROR. MEDIA (B) NEEDS TO BE RESTORED.

STORED. PLEASE RESTORE IT USING THE RECORDED EQUIPMENT.

MEDIA(A) IS BEING REPAIRED.

MEDIA(B) IS BEING REPAIRED.

UNSUPPORTED FILE SYSTEM.

Description/action

A clip with a duration that exceeds 12 hours is recorded on a memory card.

The inserted memory card has been partitioned, or it contains more clips that the maximum that can be handled by this unit. Insert a memory card that has not been partitioned, or one that contains fewer than the maximum number of clips.

A memory card must be restored because an error has occurred in the card. Perform a Update/Restore Memory of the Clip Menu.

An error occurred in the memory card and it must be repaired. Restore the memory card using the equipment that recorded the memory card.

Automatic repair for the management area of the memory card is in progress. Wait until the automatic repair is complete.

playback are not possible. Replace the memory card.

The inserted memory card is formatted with an unsupported file system, or it is not formatted. Format the memory card, or exchange the memory card for one that is formatted with a file system supported by this unit.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Page 64

LOG Alarm message in

status display area

W60-038 R/W Limit(A) MEDIA REACHED REWRITE

W60-039 R/W Limit(B) MEDIA REACHED REWRITE

Alarm message in video monitor screen

LIMIT. CHANGE MEDIA (A).

LIMIT. CHANGE MEDIA (B).

2-3-3. When a Disc is Inserted

Description/action

The memory card has reached its lifetime rewriting limit. Copy clips on the memory card to internal storage as required, and then exchange the memory card.

Note

If you continue to use the memory card, normal recording and playback may not be possible.

The memory card has reached its lifetime rewriting limit. Copy clips on the memory card to internal storage as required, and then exchange the memory card.

Note

If you continue to use the memory card, normal recording and playback may not be possible.

LOG Alarm message in

status display area

W40-010 Unknown FS! UNKNOWN FILE SYSTEM.

W40-020 Over DUR! EXCESSIVE DURATION IS

W40-023 Over DUR! EXCESSIVE DURATION IS

W40-024 Over DUR! EXCESSIVE DURATION IS

W40-031 No Support! FORMAT NOT SUPPORTED.

W40-032 ILL. Index! INDEX FILE ERROR.

W40-040 REC INHI.! AUTO FORMATTING WAS

W40-043 No Support! FORMAT NOT SUPPORTED

W40-059 DISC frequency mis-

match!

Alarm message in video monitor screen

PLEASE FORMAT DISC OR EJECT.

IN DISC.

RECORDING AND PLAYBACK IS NOT POSSIBLE.

PLEASE FORMAT DISC OR EJECT.

NOT COMPLETED. THE DISC WRITE PROTECT TAB IS SET TO SAVE. PLEASE EJECT DISC.

IN VFAM2.3 MODE. DISC CANNOT BE RECORDED.

RECORDING AND PLAYBACK IS NOT POSSIBLE. SYSTEM SETTINGS DIFFERENT FROM DISC.

Description/action

Format the disc or eject it.

A clip longer than the specified time is recorded in the disc.

A clip longer than the specified time is recorded in the UserData > XDROOT folder.

A clip longer than the specified time is recorded in the UserData > BPAV folder.

This appears when a disc recorded in an unsupported recording format has been inserted. Use a disc that is supported by this unit.

Format the disc or eject it.

Set the Write Inhibit tab on the disc so as to enable recording.

The disc is recorded in a format that is not supported by the VFAM2.3 mode. Use a disc that is recorded in a format supported by the VFAM2.3 mode.

This appears when the system frequency setting of this unit and the system frequency of the inserted disc do not coincide. Replace the disc with one that is compatible with the system frequency setting of this unit, or change the system frequency setting of this unit.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-12

Page 65

LOG Alarm message in

status display area

W40-05A 1080/23.98P DISC DISC CANNOT BE RECOR-

W40-064 Disc/XDROOT needs

Restoring

W40-065 DISC Error DISC ERROR.

W40-066 BPAV Error! USERDATA BPAV ERROR. You cannot use clips in the UserData > BPAV

W50-010 BCA Read Error! CANNOT READ DISC BCA

W50-011 BCA Read Error! CANNOT READ DISC BCA

W51-020 DI Read Error! CANNOT READ DISC IN-

W51-021 DI Read Error! CANNOT READ DISC IN-

W51-500 ILL. Disc! IRREGULAR DISC IS USED.

W52-00B Read err CANNOT READ DISC DATA.

W52-08B Read err CANNOT READ DISC DATA.

W54-000 ILL. Disc! IRREGULAR DISC IS USED.

W54-001 ILL. Disc! IRREGULAR DISC IS USED.

W54-002 ILL. Disc! IRREGULAR DISC IS USED.

W54-003 ILL. Disc! IRREGULAR DISC IS USED.

W60-013 No FS! NO FILE SYSTEM.

W60-017 FORMAT NG! AUTO FORMATTING WAS

Alarm message in video monitor screen

DED. SYSTEM SETTINGS DIFFERENT FROM DISC.

DISC USERDATA XDROOT NEEDS TO BE RESTORED.

DISC NEEDS TO BE RESTORED.

AREA. PLEASE EJECT DISC.

FORMATION. PLEASE EJECT DISC.

PLEASE EJECT DISC.

NOT COMPLETED.

Description/action

This appears when the system frequency setting of this unit and the system frequency of the inserted disc do not coincide. Only pulldown playback is possible. Replace the disc with one that is compatible with the system frequency setting of this unit, or change the system frequency setting of this unit.

An error occurred in USERDATA XDROOT of the disc, and USERDATA XDROOT must be restored. Restore USERDATA XDROOT.

The inserted disc requires to be restored. Eject the disc, and restore it or format it on another XDCAM device.

folder.

Data in the BCA area cannot be read. Once eject the disc and then insert it again or insert another disc.

An error is present in the BCA area data.

Data in the PIC area cannot be read. Eject the disc and insert it again or insert another disc.

An error is present in the PIC area data. Eject the disc and insert it again or insert another disc.

An unsupported disc was inserted.

Failed to read addresses from the disc in ChA. Once eject the disc and then insert it again or insert another disc.

Failed to read addresses from the disc in ChB. Once eject the disc and then insert it again or insert another disc.

Unsupported REC MODE was detected in the R media.

Unsupported PAC is used in the R media.

Unsupported SpareArea is used in the R media.

Unsupported DFL Entry was detected in the R media.

Eject the disc.

Failed in automatic formatting.

Note

Once eject the disc and then insert it again or insert another disc.

W6F-E00 DRV ADJ err CANNOT PERFORM AUTO

DRIVE ADJUSTMENT.

Startup adjustment or OPC of ChA cannot be terminated.

Note

Once eject the disc and then insert it again or insert another disc.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-13

Page 66

LOG Alarm message in

status display area

W6F-E03 DRV ADJ err CANNOT PERFORM AUTO

W6F-E80 DRV ADJ err CANNOT PERFORM AUTO

W6F-E83 DRV ADJ err CANNOT PERFORM AUTO

Alarm message in video monitor screen

DRIVE ADJUSTMENT.

2-3-4. During Front Panel Operations

Description/action

Failed in startup adjustment of ChA.

Note

Once eject the disc and then insert it again or insert another disc.

Startup adjustment or OPC of ChB cannot be terminated.

Note

Once eject the disc and then insert it again or insert another disc.

Failed in startup adjustment of ChB.

Note

Once eject the disc and then insert it again or insert another disc.

LOG Alarm message in

status display area

— KEY INHI.! — This appears when the KEY INHI switch is “ON”.

— Not Open Clip! — This appears when a clip operation is attempted

— Clip End! — During playback, this appears if you execute a for-

— Clip Top! — During playback, this appears if you execute a re-

— EDL Top! — During EDL playback, this appears if you press the

— EDL End! — During EDL playback, this appears if you press the

— MAX # Clips — No more clips can be recorded because the maxi-

— Media Full! — Recording or copying is not possible because the

— TC EXT! — This appears when TCG is set to “EXT” and PRST/

— REGEN mode! — This appears when PRST/RGN is set to “TC” or

Alarm message in video monitor screen

Description/action

Set the KEY INHI switch to “OFF”.

with no clip selected. Select a clip in the clip list screen and try the operation again.

ward search when the unit is stopped at the last frame of a clip. To move to another clip, press the PREV, NEXT, SHIFT + PREV, or SHIFT + NEXT button, or perform a thumbnail search.

verse search when the unit is stopped at the first frame of a clip. To move to another clip, press the PREV, NEXT, SHIFT + PREV, or SHIFT + NEXT button, or perform a thumbnail search.

PREV button at the first frame of the first sub clip of an EDL.

NEXT button at the last frame of the last sub clip of an EDL.

mum number of clips has been recorded. Delete unneeded clips.

internal storage is full. Delete unneeded clips.

RGN to “PRESET” in order to preset time code or user bits, on page P4 TC of the function menu. Set TCG to “INT”.

“VITC” in order to preset time code or user bits, on page P4 TC of the function menu. Set PRST/RGN to “PRESET”.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-14

Page 67

LOG Alarm message in

status display area

— REC mode! — Stop recording and try again.

— STOP ONCE! — This appears when an attempt is made to change

— Exit THUMBNAIL

mode!

— REMOTE! — Press the REMOTE button and turn off the light,

— No Media! — Try again after inserting an SxS memory card.

— No Disc! — No Disc! Insert a Professional Disc before operate.

— PORT SELECT mis-

match. Select PB Port.

— Media Top! — An attempt has been made to execute a reverse

— Media End! — An attempt has been made to execute a forward

— REC INHI.! — Set the Write-Inhibit tab on the disc so as to enable

— No EM Space — This appears when any essence mark was not re-

— EM Full! — This appears when no more essence marks can be

— Illegal Operation! — This appears when an attempt is made to carry out

— Media is not Ready. — The media is in the course of being mounted or has

Alarm message in video monitor screen

— This appears when an attempt is made to change

— This appears when you have selected an SxS mem-

Description/action

media during recording or playback. Stop the recording or playback and try the operation again.

media while the clip list screen is displayed. Switch to the basic operation screen or the video monitor screen and try the operation again.

to put this unit into LOCAL mode.

ory card as media and have attempted to specify the index picture by pressing the INDEX function button (F1) on page P5 OTHER of the function menu.

search when the unit is stopped at the first frame of the first clip after disc playback.

search when the unit is stopped at the last frame of the last clip after disc playback.

recording.

corded because there is no space before and after the desired position. Delete unneeded shot marks 0 to 9 in the chapter thumbnail screen.

recorded. Delete unneeded shot marks 0 to 9 in the chapter thumbnail screen.

an invalid operation.

not been loaded.

2-3-5. During Recording Operations

LOG Alarm message in

status display area

W10-030 Input Sig! VIDEO INPUT SIGNAL DOES

W10-031 ILL. REC! ENCODING DOES NOT SYN-

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Alarm message in video monitor screen

NOT MATCH SYSTEM SETUP.

CHRONIZE WITH REF VIDEO.

Description/action

This alarm message appears when a signal that does not conform to the system frequency and the set number of lines of this unit is input or when HD-SDI or i.LINK TS was selected for video input during the SD recording setting. Input a signal that matches the system frequency, or change this unit’s system frequency setting.

Check the signals being input to this unit.

Continued

2-15

Page 68

LOG Alarm message in

status display area

W40-041 MEM. Full! MEMORY FULL !! Recording on a media is not possible because a

W40-042 Verify ERR! DISC ERROR DETECTED. The Verify function detected abnormality in sig-

W40-071 REC STOP WITHIN

2MIN

W40-072 REC STOP WITHIN

2MIN

W41-001 No Disc! No Disc!

W41-002 No Media(A) No Media(A)!

W41-003 No Media(B) No Media(B)!

W41-004 REC INHI! REC IHNI!

W41-005 Copy Running! Copy Running! Failed to start copy because copy operation from

W41-006 Replace Media Replace the media to continue

W41-007 Simul REC not Per-

formed.

W50-015 Index File! UNSUPPORT INDEX FILE.

W53-500 Disc Damage DISC CANNOT BE RECOR-

W54-200 Disc Damage DISC CANNOT BE RECOR-

W54-201 Disc Damage DISC CANNOT BE RECOR-

Alarm message in video monitor screen

RECORDING IS TERMINATED WITHIN 2 MINUTES AUTOMATICALLY. BECAUSE THE CLIP IS REACHED TO MAXIMUM DURATION.

RECORDING IS TERMINATED WITHIN 2 MINUTES AUTOMATICALLY. BECAUSE OF INTERNAL LIMITATION.

Insert a recordable disc to continue the recording.

Insert a recordable memory to continue the recording.

Insert a recordable media to continue the recording.

the recording.

Simul REC was not Performed Data is recorded only in the internal storage device

DISC CANNOT BE RECORDED TO.

DED TO. USE ANOTHER DISC FOR RECORDING.

Description/action

buffer overflow has occurred in the recording buffer memory. Check the disc to be recorded on this unit.

nals recorded on the disc. Replace the disc.

The length of the clip has reached the maximum limit during recording. Recording will stop within the next two minutes.

The total recording time has reached the maximum limit during recording. Recording will stop within the next two minutes.

Failed to start copy to disc because no disc was loaded at the start of simultaneous recording. Copy starts by inserting a recordable medium.

Failed to start copy to SxS (A) because SxS (A) was not loaded at the start of simultaneous recording. Copy starts by inserting a recordable medium.

Failed to start copy to SxS (B) because SxS (B) was not loaded at the start of simultaneous recording. Copy starts by inserting a recordable medium.

Failed to start copy because an unrecordable medium was loaded at the start of simultaneous recording. Copy starts by inserting a recordable medium.

an external device was in progress at the start of simultaneous recording. Stop copying from the external device or start copy after the ongoing copy has been completed.

Failed to continue copy due to media full or ejection or other reasons. Copy can be continued by replacing the medium with a recordable one.

because simultaneous recording is disabled. Completion of copying several clips after a while enables simultaneous recording.

Use another disc.

Recording was attempted for a disc with no spare area. Use another disc.

No available space is left in the TDMA area of the quad-layer disc. Use another disc.

Disc error during quad-layer disc Finalize. (No available space is left in the DMA area.) Use another disc.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-16

Page 69

LOG Alarm message in

status display area

W60-040 Disc Damage DISC CANNOT BE RECOR-

W61-000 Disc Damage DISC CANNOT BE RECOR-

— PORT SELECT mis-

match. Select REC Port.

— Disc Busy! — A copy operation is being performed, so simulta-

— Recording to internal

storage only, as DISC or MEMORY is busy.

Alarm message in video monitor screen

DED TO. USE ANOTHER DISC FOR RECORDING.

— An attempt has been made to carry out a recording

— Simultaneous recording or termination processing

Description/action

An unrecoverable defect occurred during recording. Use another disc.

Depletion of the OPC area in the R media was detected. Use another disc.

operation when the playback port is selected. Select the recording port.

neous recording is impossible at present.

for it is being performed.

2-3-6. During Playback Operations

LOG Alarm message in

status display area

W10-042 MEM. Empty! MEMORY EMPTY !! Playback is not possible because a buffer under-

W10-050 ILL. PLAY! ILLEGAL PLAYBACK. Normal playback is not possible.

W60-023 Media Data Error! MEDIA DATA ERROR DE-

— This Clip cannot be

Played back.

— No MEMORY-(A/B)! — No memory card is inserted.

— MEMORY Busy! — Playback is not possible because the memory card

— Operation is not Sup-

ported for EDL.

— Disc Busy! NET-

WORK

— MEMORY Busy!

NETWORK

Alarm message in video monitor screen

TECTED.

— This clip cannot be played back because its format

— An EDL cannot be played back.

— The disc cannot be played as it is currently being

— The memory card cannot be played as it is currently

Description/action

flow has occurred in the playback buffer memory. Check the disc to be played back on this unit.

A media error has been detected. Replace the media.

is not supported by this unit. No clips in the USER folder can be played back.

is being used.

Select a clip.

used on the network.

being used on the network.

2-3-7. During Operations in the Clip List Screen/Thumbnail Search/EDL Edit/

Copy

LOG Alarm message in

status display area

— Clip is Locked. — The clip is locked.

— Copy Running! — A copy operation is in progress, so another copy

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Alarm message in video monitor screen

Description/action

This appears when an attempt is made to delete a clip, or set or clear a clip flag when the clip is locked.

operation is not allowed.

Continued

2-17

Page 70

LOG Alarm message in

status display area

— Operation Failed! — The operation failed because of an internal error.

— Not Supported Format. — The format is not supported by this unit, so copy

— Copy Aborted. — The copy operation was aborted.

— Some Clip(s) are

Locked.

— Clip Error. — The clip is substandard, so the copy operation

— The Disc Protect TAB

is Set to Save.

— Irregular Disc is in Use.

Use Professional Disc.

— Set Appropriate

IN/OUT Points.

— No Clip! — The clip selected for expansion or chapter display

— Cannot Expand Clip

any Further.

— Clip is not Ready. — Chase copy cannot be performed because record-

— Delete is Prohibited.

This Clip is in Use.

— Delete is Prohibited.

Referring EDL is in Use.

— Delete is Prohibited. — Deletion of the specified clip has failed.

— Lock/Unlock is Pro-

hibited. This Clip is in Use.

— Lock/Unlock is Pro-

hibited.

— Set Clip Flag was not

Performed.

— One Clip is being Re-

corded. Use Single Selection.

— Operation is not Sup-

ported for EDL.

— Operation is not sup-

ported for this Folder.

— Adding EM was not

Performed.

Alarm message in video monitor screen

— Some of the selected clips are locked (protected).

— You have attempted to format a disc whose Write

— The inserted disc cannot be recorded/played back

— The settings of IN and OUT points for partial copy

— The selected clip cannot be divided any further to

— The specified clip is in use, so it cannot be deleted.

— The EDL which refers to the specified clip is in

— The specified clip is in use, so it cannot be locked/

— Lock/unlock of the specified clip has failed.

— Set Clip Flag function has failed.

— One of the selected clips was being recorded.

— You cannot select EDL to delete an essence mark

— You cannot delete or lock/unlock any clip in the

— Essence mark setting has failed.

Description/action

operation is impossible.

failed.

Inhibit tab is set so as to disable recording. To execute formatting, set the Write Inhibit tab on the disc so as to enable recording.

on this unit. Insert a disc that can be recorded / played back on this unit.

operation are not proper. Check the IN and OUT point settings.

has been deleted. Alternatively, the Professional Disc or memory card has been ejected.

display the expand thumbnails. This alarm appears when the expand thumbnails of a clip divided into the maximum number of blocks are displayed or when the EXPAND function button has been pressed with the expand thumbnail screen displayed in which the duration of each block is one frame.

ing has just started. Wait until the chase copy function is enabled.

use, so the clip cannot be deleted.

unlocked.

To copy a clip which is being recorded, make a single selection of the clip.

or set a shot mark.

DISC >UserData >BPAV folder.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-18

Page 71

LOG Alarm message in

status display area

— Over DUR! — A clip with a duration that exceeds six hours cannot

— Copy to /Clip is not Per-

mitted. Change Dest to /UserData.

— Dest was Changed to /

UserData. Copy to /Clip is not Permitted.

— Cannot Display Chap-

ter of this Clip.

— Chapter was Changed.

Display Again.

— Disc Busy! — The Professional Disc was being used, so copying

— Chapter does not Exist. — Chapter thumbnail screen cannot be displayed be-

— Cannot Expand this

Clip.

— Unable to Parse the

EDL.

— Writing this AV For-

mat to DISC is not Permitted.

— Out of Remain Space! — The remaining capacity of the copy destination

Alarm message in video monitor screen

— The selected clip cannot be copied to the DISC >

— The selected clip was not permitted for copying to

— The selected clip has failed in chapter thumbnail

— The chapter setting information has been updated.

— The clip cannot be expanded because it is being

— The EDL cannot be copied due to existence of an

— This clip cannot be copied to the currently loaded

Description/action

be copied.

Clip folder. Change the copy destination to the DISC > UserData folder.

the DISC >Clip folder, so it was copied to the DISC > UserData folder.

display. Stop recording of a clip if any in progress.

Try again the chapter thumbnail display.

was not possible.

cause no chapters are set on the clip.

recorded.

inhibiting condition such that there is no sub clip.

Professional Disc because of its format.

media is not sufficient.

2-3-8. Alarms Relating to Audio and Video Signals

LOG Alarm message in

status display area

W10-021 REF NON-STD A NON-STANDARD REF

W10-022 REF Not Exist — Input a reference signal.

W10-032 No INPUT! INPUT VIDEO IS NOT DE-

W10-040 EMPHASIS! INPUT AUDIO EMPHASIS IS

Alarm message in video monitor screen

SIGNAL IS BEING USED FOR REF VIDEO. USE A STANDARD SIGNAL.

TECTED. CHECK THE VIDEO INPUT MODE AND SUPPLY A VIDEO SIGNAL TO VIDEO INPUT.

NOT SUPPORTED. CHECK THE EMPHASIS OF THE AUDIO INPUT SIGNAL.

Description/action

Input a standard signal.

• Check the setting of V INPUT on page P1 INPUT of the function menu.

• Input an HD-SDI signal.

Check the emphasis of the audio input signal.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-19

Page 72

2-3-9. Alarms Relating to Sensors and Drivers

LOG Alarm message in

status display area

W02-F2F LASER 0 Lifetime DISC DRIVE LASER 0 LIFE-

W02-FAF LASER 0 Lifetime DISC DRIVE LASER 0 LIFE-

W20-020 FAN1 Warning FAN1 WARNING. Rotating speed of DC fan (60 square) decreased.

Alarm message in video monitor screen

TIME HAS ENDED. PLEASE CONTACT SERVICE.

Description/action

It was decided that the lifetime of the ChA laser has come to an end.

It was decided that the lifetime of the ChB laser has come to an end.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-021 FAN2 Warning FAN2 WARNING. Rotating speed of DC fan (80 square) decreased.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-022 FAN1 Error FAN1 ERROR. Rotation of DC fan (60 square) cannot be detected.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-023 FAN2 Error FAN2 ERROR. Rotation of DC fan (80 square) cannot be detected.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-024 FAN3 Warning FAN3 WARNING. Rotating speed of DC fan (50 square) decreased.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-025 FAN3 Error FAN3 ERROR. Rotation of DC fan (50 square) cannot be detected.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-030 High TEMP! HIGH TEMPERATURE. The unit is being used in a high-temperature envi-

ronment.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-031 High TEMP! HIGH TEMPERATURE. The unit is being used in a high-temperature envi-

ronment.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-20

Page 73

LOG Alarm message in

status display area

W20-032 Low TEMP! LOW TEMPERATURE . The unit is being used in a low-temperature envi-

Alarm message in video monitor screen

Description/action

ronment.

Note

The unit will operate, but the performance of the hard disk drives will decline, possibly affecting recording or playback.

W20-033 Low TEMP! LOW TEMPERATURE . The unit is being used in a low-temperature envi-

ronment.

Note

The unit will operate, but the performance of the hard disk drives will decline, possibly affecting recording or playback.

W20-040 Power Unit(A) Err! POWER SUPPLY UNIT(A)

STATUS IS NOT NORMAL. PLEASE CONTACT SERVICE.

Power supply unit (A) error.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-041 Power Unit(B) Err! POWER SUPPLY UNIT(B)

STATUS IS NOT NORMAL. PLEASE CONTACT SERVICE.

Power supply unit (B) error.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W20-050 CF Warning IT IS NECESSARY TO RE-

PLACE CF DISK. PLEASE CONTACT SERVICE.

W20-060 DC Power Warning DC POWER STATUS IS NOT

NORMAL. PLEASE CONTACT SERVICE.

The unit will operate, but if you continue to use it, the CF disc may be damaged and all information may be lost.

The DC voltage error was detected.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

W37-900 High TEMP! HIGH TEMPERATURE IN

DRIVE.

W37-A00 High TEMP! HIGH TEMPERATURE IN

DRIVE.

W80-020 Unknown USB UNKNOWN USB DEVICE The USB connector on this unit is for maintenance

W95-50E High TEMP! HIGH TEMPERATURE IN

DRIVE.

W95-50F DR-FAN Stop DRIVE FAN MOTOR STOP-

PED.

The temperature sensor in ChA detected an abnormality.

The temperature sensor in ChB detected an abnormality.

or connection to USB devices. Connect an applicable USB device.

The FPGA (IC700: BD-42) temperature exceeded 70℃ .

Rotation of FAN (DRIVE) cannot be detected.

Note

The unit will not stop operating, but if you continue to use it in this state, temperatures inside the unit will rise, possibly resulting in failure or fire.

2-3-10. Alarms Relating to the Internal Storage

LOG Alarm message in

status display area

W40-070 Low Remaining Ca-

pacity

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Alarm message in video monitor screen

— The internal storage has low remaining free space.

Description/action

Delete any unwanted clips.

Continued

2-21

Page 74

LOG Alarm message in

status display area

W70-010 HDD1 Warning ERRORS OCCUR FRE-

W70-011 HDD2 Warning ERRORS OCCUR FRE-

W70-012 HDD3 Warning ERRORS OCCUR FRE-

W70-013 SSD1 Lifetime SSD1 LIFETIME HAS

W70-014 SSD2 Lifetime SSD2 LIFETIME HAS

W70-015 SSD3 Lifetime SSD3 LIFETIME HAS

W70-016 SSD1 Warning ERRORS OCCUR FRE-

W70-017 SSD2 Warning ERRORS OCCUR FRE-

W70-018 SSD3 Warning ERRORS OCCUR FRE-

W70-020 HDD1 Fail HDD1 FAIL.

W70-021 HDD2 Fail HDD2 FAIL.

W70-022 HDD3 Fail HDD3 FAIL.

W70-023 CONFIG MIS INTERNAL STORAGE CON-

Alarm message in video monitor screen

QUENTLY WHILE READING/WRITING HDD NUMBER 1. PLEASE CONTACT SERVICE.

QUENTLY WHILE READING/WRITING HDD NUMBER 2. PLEASE CONTACT SERVICE.

QUENTLY WHILE READING/WRITING HDD NUMBER 3. PLEASE CONTACT SERVICE.

ENDED. PLEASE CONTACT SERVICE.

QUENTLY WHILE READING/WRITING SSD NUMBER

1. PLEASE CONTACT SERVICE.

QUENTLY WHILE READING/WRITING SSD NUMBER

2. PLEASE CONTACT SERVICE.

QUENTLY WHILE READING/WRITING SSD NUMBER

3. PLEASE CONTACT SERVICE.

PLEASE CONTACT SERVICE.

FIGURATION MISMATCH.

Description/action

Errors are occurring frequently when reading or writing an HDD(1). The HDD must be replaced.

Errors are occurring frequently when reading or writing an HDD(2). The HDD must be replaced.

Errors are occurring frequently when reading or writing an HDD(3). The HDD must be replaced.

The lifetime of SSD(1) has come to an end. The SSD must be replaced.

The lifetime of SSD(2) has come to an end. The SSD must be replaced.

The lifetime of SSD(3) has come to an end. The SSD must be replaced.

Errors are occurring frequently when reading from or writing to SSD(1). The SSD must be replaced.

Errors are occurring frequently when reading from or writing to SSD(2). The SSD must be replaced.

Errors are occurring frequently when reading from or writing to SSD(3). The SSD must be replaced.

The HDD(1) had malfunctioned. The HDD must be replaced.

The HDD(2) had malfunctioned. The HDD must be replaced.

The HDD(3) had malfunctioned. The HDD must be replaced.

Check whether the required number of SSD/ HDD is installed.

Continued

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-22

Page 75

LOG Alarm message in

status display area

W70-024 SSD1 Fail SSD1 FAIL.

W70-025 SSD2 Fail SSD2 FAIL.

W70-026 SSD3 Fail SSD3 FAIL.

W70-030 Rebuilding xx% REBUILDING NOW.

W70-031 Reset SSD/HDD CFG INTERNAL STORAGE CON-

Alarm message in video monitor screen

PLEASE CONTACT SERVICE.

PLEASE DO NOT TURN OFF.

FIGURATION MISMATCH. PLEASE CHECK AND SET MAINTENANCE MENU ITEM D12.

2-3-11. Other Alarms

Description/action

The SSD(1) malfunctions. The SSD must be replaced.

The SSD(2) malfunctions. The SSD must be replaced.

The SSD(3) malfunctions. The SSD must be replaced.

Data is being rebuilt. Do not power the unit off until the rebuild has finished.

The internal storage setting is not correct. Refer to installation manual(XDBK-107), execute maintenance menu item D12.

Note

Executing maintenance menu item D12, all clips are lost.

LOG Alarm message in

status display area

W90-001 Turn off/on POWER!! MENU CONFIG WAS

W90-002 Turn off/on POWER!! SYSTEM CONFIGURATION

— Format Disc is Prohibi-

ted. Confirm Mainte Menu:M395.

— Cannot finalize this

Disc. It is available for QLWO disc only.

Alarm message in video monitor screen

CHANGED. PLEASE TURN OFF/ON POWER.

WAS CHANGED. PLEASE TURN OFF/ON POWER.

— An attempt has been made to execute Format Disc

— An attempt has been made to finalize a disc that

Description/action

The setting change of the item in which modification is to be reflected after restart was stored. Restart the unit.

System frequency or destination value differs between IO and IT. The unit must be restarted to enable the IP address allocated by the DHCP server.

when the Format Disc command is disabled by maintenance menu Item M395. Check maintenance menu item M395.

cannot be finalized. Only quad-layer discs can be finalized.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

2-23

Page 76

Page 77

Section 3

XDCAM Web Site

3-1. XDCAM Web Site Overview

Operations such as confirming the settings of the unit and upgrading the firmware are enabled through the NETWORK

connector.

The XDCAM website consists of the following menus.

Status menu

• Software Version

Maintenance menu

• Network

• Account

• Setup Menu

• Software Update

• Log

3-1-1. Making a Connection to the XDCAM Website

Tools/Equipment Required

• Personal computer (referred to as PC hereafter)

• Network cable (crossover or straight-through)

Procedure

1. Connect the unit to the host PC using one of the following ways. (Refer to the Operation Manual)

• Connect the unit to the host PC through a network device (such as a hub).

• Connect the unit directly to the host PC.

2. Start the web browser of the PC. Enter “http://192.168.1.10” in the Address bar. (The underlined part is the IP

address of the unit.)

Note

Use Internet Explorer for the web browser of the PC.

Other web browsers may not function correctly.

3. Enter “admin” for User name and password, and then click “OK”.

User name

• “admin”

Password

• “xds-pd2000” for XDS-PD2000

• “xds-pd2000c” for XDS-PD2000C

• “xds-pd1000” for XDS-PD1000

• “xds-pd1000c” for XDS-PD1000C

Tip

User name and User password can be changed on the Account page.

4. The XDCAM top page appears. Click a menu you want to browse on the left frame.

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3-2. Status Menu

Status

Maintenance

Product Information

Model Name XDS-PD2000 Serial No. 10001 Drive Serial No. 104050

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Software Version

PACKAGE 1.00 IT 1.00 IO 1.00 FP 1.00 DRV 1.00 TS 1.00 DSP0 1.00 DSP1 1.00 DSP2 1.00 PRXA 1.00 PIER 1.00 PHOT 1.00 ROVA 1.00 AUPR 1.00 LVIS 1.00 TSYS 1.00 TBMP 1.00 WNKA 1.00 WNKB 1.00 KVSW 1.00 TSIC 1.00 MMPU 1.00 ISFP 1.00 KMPU 1.00 FPCP 1.00 OPT3 1.00 COME 1.01 BIOS 5A:1.00 RECOVERY 1.05

3-2-1. Software Version

Software versions can be checked on the Software Version page of the Status menu.

Tip

This function is the same as the SOFTWARE VERSION menu in OTHERS of the Maintenance menu of the unit. (Full

version display)

Item Setting Function Description

Product Information

Model Name

Display only

Serial No. Display

Shows the model name.

Shows the serial number.

only

Drive Serial No.

Software

PACKAGE Display

Version

IT Display

IO Display

FP Display

DRV Display

TS Display

DSP0 Display

*1: Can be upgraded by the firmware package file.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

Display only

only

Serial number of the drive.

Shows the firmware version.

Shows the software version in the CF.

Shows the version of ROM (IC306, IC307) on IC101/SY-388 board.

Shows the version of ROM (IC2) on IC1/KY-656 board.

Drive version

PDBK-202 software version（When PDBK-202 is installed）

Shows the version of ROM (IC306, IC307/SY-388 board) on IC1901, IC2001, IC2002, IC2003, IC1903, IC1904, IC2403, IC2404/HPR board.

Continued

3-2

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Item Setting Function Description

DSP1 Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC1901/ HPR board.

only

DSP2 Display

only

PRXA Display

only

PIER Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC2001,IC2002, IC2003/ HPR board.

Shows the version of ROM (IC306, IC307/SY-388 board) on IC1903,IC1904, IC2403, IC2404/HPR board.

Shows the version of ROM (IC306, IC307/SY-388 board) on IC1601/HPR board.

only

PHOT Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC1301/HPR board.

only

ROVA Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC301/HPR board.

only

AUPR Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC801/HPR board.

only

LVIS Display

only

TSYS Display

only

TBMP Display

only

WNKA Display

Shows the version of ROM (IC306, IC307/SY-388 board) on IC901, IC1101/HPR

board.

Shows the version of ROM (IC306, IC307/SY-388 board) on IC500, IC1000/ENC-143 board [IC201, IC401,IC601, IC801, IC1001/ENC-132 board].

Shows the version of ROM (IC204) on IC202/DIF-194 board.

only

WNKB Display

Shows the version of ROM (IC404) on IC402/DIF-194 board.

only

KVSW Display

Shows the version of ROM (IC2) on IC801/KY-656 board.

only

NECO Display

Shows the version of ROM (IC202) on IC200/ENC-143 board.

only

TSIC Display

PDBK-202 firmware version （When PDBK-202 is installed）

only

MMPU Display

Shows the version of IC2002/MB-1152 board.

only

ISFP Display

Shows the version of IC2001/MB-1152 board.

only

KMPU Display

Shows the version of IC701/KY-656 board.

only

FPCP Display

Shows the version of IC401/FP-166 board.

only

OPT3 Display

Shows the version of IC401/SY-388 board.

only

COME Display

only

BIOS Display

Integer part: Version of the CPU board (COMe module) on the MB-1152 board

Fraction part: Version of the Compact Flash on the CPU board (COMe module)

Shows the firmware version of CPU board (COMe module) on MB-1152 board.

only

RECOV-

ERY

Display only

Shows the recovery firmware version.

*1: Can be upgraded by the firmware package file.

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3-3. Maintenance Menu

Status

Maintenance

Network Settings

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Workgroup

DHCP

IP Address

Subnet Mask

Default Gateway

Status

WORKGROUP

enable

192.168.1.10

255.255.255.0

0.0.0.0

Execute Reset

3-3-1. Network

Network settings can be modified on the Network page of the Maintenance menu.

Tip

This function is nearly the same as maintenance menu “M5: NETWORK” of the unit.

Item Setting Function

Network Settings Workgroup Up to 15 alphanumeric

Sets the work group name.

characters/symbols

DHCP Display only Display whether to acquire IP address automatical-

ly from the DHCP server. disable: Does not acquire IP address automatically enable: Acquires IP address automatically

IP Address xxx.xxx.xxx.xxx Sets the IP address.

Subnet Mask xxx.xxx.xxx.xxx Sets the subnet mask.

Default Gateway xxx.xxx.xxx.xxx Sets the default gateway.

Status Display only Success: Setting has been changed.

Note

• Change the DHCP settings with the Maintenance menu (M50: DHCP). For how to change the DHCP settings, refer

to the Operation Manual.

• When the DHCP is enabled, the IP address, subnet mask, and default gateway settings can not be changed. Only

the work group setting can be changed.

Error: Failed in correct setting.

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• After settings have been completed, the reboot confirmation screen opens. Be sure to reboot the unit.

Status

Maintenance

Apply the network settings

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Network settings are valid after power on. Click the “Reboot” button to restart.

Reboot

Quit

To acquire IP address automatically

Procedure

1. Set DHCP to “enable.”

2. Click the “Execute” button.

Note

If no IP address can be acquired, contact the network administrator.

3. Click the “Reboot” button.

The unit is automatically rebooted.

4. The XDCAM top page reopens and the network settings have been completed.

To set IP address

Procedure

1. Set DHCP to “disable.”

2. Set the IP address.

3. Set the subnet mask and default gateway as needed.

4. Click the “Execute” button.

5. Click the “Reboot” button.

The unit is automatically rebooted.

6. The XDCAM top page reopens and the network settings have been.

3-3-2. Account

The user password for the XDCAM website can be changed on the Account page of the Maintenance menu.

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Status

Maintenance

User Registration

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

User Name

Password

Verify Password

Status

admin

Execute Reset

Item Setting Function

User Registration

User Name 31-byte alphanumeric

and hyphen

User Name

Password 31-byte alphanumeric

and hyphen

Verify Password

31-byte alphanumeric and hyphen

New password (Updated password)

New password (Re-enter updated password for verification.)

Status Display only Success: Displayed when the user password is changed.

Error: Displayed when an unusable character is used in

the password or when the verify password is incorrect.

Procedure

1. Enter the new password in the Password box and Verify Password box.

(Clicking “Reset” clears the Input window.)

2. Click “Execute” to change the password.

Note

The set password is also effective for the FTP and CIFS.

3-3-3. Setup Menu

The setup menu of the unit can be uploaded or downloaded on the Setup Menu page of the Maintenance menu.

*1: Case-sensitive

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Status

Maintenance

Upload

XDCAM 䊻 PC

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Download

PC 䊻 XDCAM

File to send

Status

Upload CSV File PC 䊻 XDCAM

Execute

ཧ↷ 㻚㻚㻚

Upload

Save the contents of the setup menu of the unit in the PC.

Procedure

1. Click “Execute” in the Upload field.

2. Save the contents of the setup menu in the PC according to the displayed message.

Download

Return the contents of the setup menu saved in the PC to the unit.

Procedure

1. Click “Browse” and select the file of the setup menu.

2. Click “Execute” in the Download field.

3. When the download is completed, the unit is automatically rebooted.

3-3-4. Software Update

The Software Update page of the Maintenance menu allows batch update using the firmware package file.

This section describes updating the firmware using the web browser (Internet Explorer).

Note

The figures shown in this section are sample of windows. Actual windows may differ from the sample windows due to

the specification change.

Tools/Equipment Required

• Personal computer (referred to as PC hereafter)

• Firmware package file

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• Network cable (crossover or straight-through)

For obtaining the firmware package file, contact your local Sony Sales Office/Service Center.

Preparation

1. Remove the headphones and the audio cable.

2. Connect the unit to the PC using one of the following ways. (Refer to the Operation Manual.)

• Connect the unit to the PC through a network device (such as a hub).

• Connect the unit directly to the PC with a network crossover cable.

3. Copy the obtained firmware package file to an arbitrary directory on the PC.

4. Start the Internet Explorer of the PC.

Note

Use the Internet Explorer to update the software.

Update may not succeed with other web browsers.

5. Select “Tools” - “Internet Options”.

6. Click “Delete files” on the General tab to delete temporary Internet files.

7. The confirmation message appears. Click “OK”.

8. Click “LAN Settings” on the Connections tab.

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9. Confirm that the “Use a proxy server for your LAN” checkbox is not selected.

If the checkbox is selected, clear it.

10. Click “OK”.

11. Click “OK” on the Internet Options window.

Update Procedure

1. Start the Internet Explorer and enter “http://192.168.1.10” in the Address bar. (The underlined part is the IP address

of the unit.)

2. Enter a user name and a password and click "OK".

User Name

• “admin”

Password

• “xds-pd2000” for XDS-PD2000

• “xds-pd2000c” for XDS-PD2000C

• “xds-pd1000” for XDS-PD1000

• “xds-pd1000c” for XDS-PD1000C

The XDCAM top page appears.

3. Click “Software Update” in the Maintenance menu in the left frame.

4. Click “Browse” and select the firmware package file copied in step 3 of “Preparation”.

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5. Click “Next”.

Status

Maintenance

Select Software Package

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Select archived Software file Package file

Next Quit

ཧ↷ 㻚㻚㻚

Status

Maintenance

Update Version

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Click the “Next” button to proceed.

Next Quit

Current version V1.00 New version V1.01

6. The current version and the new version of the firmware appear. To update the firmware, click “Next”.

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7. Firmware update starts and the following window appears.

Status

Maintenance

Software Update Execution

Status:updating [sy1-sy1]

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Status

Maintenance

Software Update Execution

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Status:finished it-fbimage OK if-sy2u OK sy1-ftbl OK sy1-sy1 OK sy1-pier OK sy1-rova OK sy1-phot OK sy1-tsys OK sy1-tmbp OK sy1-dsp0 OK sy1-dsp1 OK sy1-dsp2 OK sy1-dsp3 OK sy1-lvis OK sy1-aprc OK fp OK sxs1-2nd OK sxs1-fpga OK sxs2-2nd OK sxs2-fpga OK pkglist OK

8. When the status turns to "finished", check whether each firmware program has been successfully updated or not

(OK or NG).

Note

If there is no change in the download window for 10 minutes or there is any NG firmware program, the update has

failed.

In this case, retry update from step 1 in “Preparation”. If the update still fails, contact your local Sony Sales Office/

Service Center.

9. When OK appears for all firmware programs, click “Next”.

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10. Click “Reboot”.

Status

Maintenance

Return to normal mode

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

Software update completed successfully. Click the “Reboot” button to restart under the normal mode.

Reboot

Quit

Status

Maintenance

Upload

Software Version

Network

SNMP

Account

Setup Menu

Software Update

Log

XDCAM

SONY

XDCAM 䊻 PC

Execute

The unit is automatically rebooted.

11. The firmware update has been completed and the display returns to the XDCAM top page.

12. Confirm that PACKAGE has been updated on the Software Version page. (Refer to 3-2-1.)

3-3-5. Log

Log data of the unit can be acquired on the Log page of the Maintenance menu.

Procedure

1. Click “Execute” in the Upload field.

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2. Save the log data in the PC according to the displayed message.

Note

If an error occurs during acquisition of the log, restart the unit.

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Section 4

MAINTENANCE MENU

: ADJUST

: SERVICE SUPPORT

: OTHERS

: SETUP MAINTENANCE

: NETWORK

: DRIVE

(6) Function buttons (F1 to F6)

(1) MENU button

(2) PUSH SET knob

(3) Arrow buttons

(5) SHIFT button(4) PAGE/HOME button

Maintenance Mode

4-1. Maintenance Menu Overview

This unit has the MAINTENANCE MENU for unit maintenance.

The MAINTENANCE MENU consists of the following menu items. Each menu is displayed on the video monitor and

on the PC monitor connected to the MONITOR connector.

ADJUST

Used for the audio system, video system, and free-run frequency adjustment. (Refer to Section 4-3.)

SERVICE SUPPORT

Used for the setting of the option. (Refer to Section 4-4.)

OTHERS

Checks the software version and the serial number of this unit, and sets the operation. (Refer to Section 4-5.)

SETUP MAINTENANCE

Used for the setting up of this unit. For details, refer to Operation Manual.

NETWORK

Used for the setting of the network. For details, refer to Operation Manual.

DRIVE

Used for the maintenance of the optical drive and the internal storage device. (Refer to Section 4-6.)

As for the details of the internal storage device, refer to the Operation Manual.

4-1-1. Operation Keys

The following are descriptions of the keys used in maintenance mode.

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Number Name Function

S501

4 3 2 1

KY-656 board

S501-1 MAINTENANCE mode access ON : Disables OFF : Enables

(1) MENU button Used to start the maintenance mode or display the higher menu hierarchy again.

(2) PUSH SET knob Used to move the menu hierarchy, or execute the menu or an item in the menu. Turn

the knob to select items, and press it to confirm the selection.

(3) Arrow buttons Moves the cursor (displayed in reverse video) on the display. Also used to change a set

value.

(4) PAGE/HOME button Used to start the maintenance mode.

(5) SHIFT button Used to switch functions of buttons.

(6) Function buttons

(F1 to F6)

Used to save the setting data and move the menu hierarchy. The function assigned to each button is displayed in the function menu display area.

4-1-2. Activating the Maintenance Mode

Press the [MENU] button while pressing the [PAGE/HOME] button and [SHIFT] button. The MAINTENANCE MENU

appears.

4-1-3. Exiting Maintenance Mode

Press the [MENU] button several times.

4-1-4. Maintenance Mode Access Prohibiting Switch (S501-1/KY-656 Board)

To prohibit the activation of the maintenance mode by the button operation on the control panel, turn on this switch in

advance.

Note

• The factory default setting of the this unit is OFF.

• When operating the switches on the KY-656 board, remove the top plate assembly by referring to section 6-2-1.

Change the DIP switch S501 with the power switch turned off.

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4-2. Maintenance Menu List

The following table lists all MAINTENANCE MENU items.

Menu Item Sub Item 1 Sub Item 2 Sub Item 3 Refer-

ence section

M1: ADJUST A2: AUDIO/VIDEO A20: VPR VR VIDEO OUT 1

LEVEL

　　　 VIDEO OUT 2

LEVEL

　　 A23: CP VR HD 74 MHz VCO ― 4-3-2.

　　　 SD 27 MHz VCO 　　

　　 A27: APR VR A271:INPUT UNI-TYINPUT LEVEL

　　　　 INPUT LEVEL

　　　 A272:OUTPUT

UNITY

　　　　 OUTPUT LEVEL

　　　　 MONITOR LEV-

　　 A2F: NV-RAM

― ― 4-3-4.

CONTROL

M2: SERVICE

M20: ERROR LOG ― ― ― 4-4-1.

SUPPORT

　 M21: DIAG CON-

TROL

　 M22: OPTION SET-

TING

CLEAR ERROR

― ― 4-4-2.

LOG

REDUNDANT PSU ― ― 4-4-3.

　　 DVB-ASI I/O ― ― 4-4-3.

　 M23: OPTION KEY STATUS ― ― 4-4-4.

　　 INSTALL ― ― 4-4-4.

REMOVE ― ― 4-4-4.

M3: OTHERS M30: SOFTWARE

VERSION

　 M31: SERIAL

NUMBER

　 M33: FILE I/F

CONFIG

　 M36: HOURS ME-

TER RESET

　　 H13: SEEK

― ― ― ―

FOLDER STYLE ― ― ―

H11: OPE HOURS ― ― ―

― ― ―

HOURS0

　　 H14: SPDL HOURS ― ― ―

　　 H15: LOAD

― ― ―

COUNT

　 M37: AUDIO CON-

FIG

M370: HEAD ROOM

― ― ―

　　 M371: DATA LEN ― ― ―

― 4-3-1.

4-3-3.

CH1

4-3-3.

CH2

OUTPUT LEVEL

4-3-3.

CH1

4-3-3.

CH2

4-3-3.

EL Lch

4-3-3.

EL Rch

Continued

*1: For details, refer to Operation Manual.

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Menu Item Sub Item 1 Sub Item 2 Sub Item 3 Refer-

ence section

　　 M372: NON-AU-

Tr1/Tr2 ― 　 ―

DIO INPUT

　　　 Tr3/Tr4 ― ―

　　　 Tr5/Tr6 ― ―

　　　 Tr7/Tr8 ― ―

　　 M373: IN LEVEL CH1/ CH 3/ CH 5/

― ―

CH 7

　　　 CH 2/ CH 4/ CH 6/

― ―

CH 8

　　 M377: OUT LEVEL ― ― ―

　 M39: OTHER CON-

FIG

M395: FRMT ME-

M391: VITC REC ― ― ―

― ― ―

DIA

M397: PORT CON-

― ― ―

FIGURATION

M39A: XAVC to

― ― ―

DISC

M3A: GPIO SETUP IN1 to IN4

― ― 4-5-1.

OUT1 to OUT4

　 M3B: VANC RX

PARAMETER

M3B0: VANC RX PACKET

LINE ― ―

　　　　 ― ―

　　　 DID ― ―

　　　 SDID ― ―

　　 M3B1: LINE1 SEL ― ― ―

　　　 ― ― ―

　　 M3B2: LINE2 SEL ― ― ―

　　　 ― ― ―

　 M3D: DATE/TIME

PRESET

　 M3F: FACTORY

SETUP

RESET KEY PASS-

― ― ― ―

HD-SDI AUDIO INPUT MUTING

AUTO ― 4-5-2.

FORCED OFF

― ― 4-5-2.

WORD

M4: SETUP MAINTENANCE

M48: AUTO RE-

M40: EXTENDED MENU

― ― ― ―

CALL

　 M49: RESET ALL

― ― ― ―

SETUP

M5: NETWORK

M50: DHCP ― ― ― ―

　 M51: IP ADDRESS ― ― ― ―

　 M52: SUBNET

― ― ― ―

MASK

　 M53: DEFAULT

― ― ― ―

GATEWAY

　 M54: LINK SPEED ― ― ― ―

Continued

*1: For details, refer to Operation Manual.

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Menu Item Sub Item 1 Sub Item 2 Sub Item 3 Refer-

ence section

　 M56: JUMBO

― ― ― ―

FRAME

　 M5F: RESET NET

― ― ― ―

CONFIG

M6: DRIVE D0: DRIVE MAIN-

TENANCE

D1: SSD/HDD

　　 D12: RESET

― ― ― 4-6-1. to

D11: RAID ― ― ―

― ― ―

4-6-20.

SSD/HDD CFG

D13: FORMAT ― ― ―

D0: DRIVE MAINTENANCE (M6: DRIVE)

Menu Item Sub Item Reference

section

CHECK DEVICE TEMPERATURE SENSOR 4-6-1.

FAN MOTOR 4-6-2.

ACCELERATION SENSOR 4-6-3.

LOADER ― 4-6-4.

SLIDER AUTO TEST 4-6-5.

IN-LIM TEST 4-6-6.

SPINDLE MOTOR AUTO TEST 4-6-7.

OPTICAL BLOCK SA ACTUATOR 4-6-8.

LASER 4-6-9.

LCD ATT 4-6-10.

SKEW ― 4-6-11.

LENS CLEANING ― 4-6-12.

ADJUST LD IL ADJUST ― 4-6-13.

TRK/TLT DRV OFFSET ― 4-6-14.

SKEW ― 4-6-15.

ERROR LOGGER ― ― 4-6-16.

OTHERS VERSION ― 4-6-17.

SERIAL NO ― 4-6-18.

MEMORY SUPPORT UPLOAD TO EEPROM 4-6-19.

UPLOAD TO FLASH 4-6-20.

*1: For details, refer to Operation Manual.

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4-3. ADJUST (M1)

[M1 : ADJUST]

[A2 : AUDIO/VIDEO]

[A20 : VPR VR]

[VIDEO OUT 1 LEVEL] [VIDEO OUT 2 LEVEL]

MAINTENANCE MENU

VIDEO OUT1 LEVEL ADJUST

96 (HEX)

PRESET : 86

INC/DEC : CTRL.KNOB TO MENU : MENU KEY

[M1 : ADJUST]

[A2 : AUDIO/VIDEO]

[A23 : CP VR]

[HD74MHz VCO] [SD27MHz VCO]

This menu is used for the audio system, video system, and free-run frequency adjustment.

4-3-1. VPR VR (A20)

This menu is used for the composite video output adjustment.

(For details, refer to “8-4-3. Composite Video Output Adjustment (59.94 Hz Mode)” or “8-4-5. Composite Video Output

Adjustment (50 Hz Mode)”.)

Menu hierarchy

Procedure

1. Select VIDEO OUT 1 LEVEL or VIDEO OUT 2 LEVEL.

2. Change the set value with the [PUSH SET] knob.

4-3-2. CP VR (A23)

This menu is used for free-run frequency adjustment

Menu hierarchy

Procedure

1. Select HD74MHz VCO or SD27MHz VCO.

Note

HD74MHz VCO : Adjust the HD free-run frequency.(Refer to Section 8-2.)

SD27MHz VCO : Adjust the SD free-run frequency.(Refer to Section 8-3.)

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2. Change the set value with the [PUSH SET] knob.

MAINTENANCE MENU

HD 74MHz VCO ADJUST

80 (HEX)

PRESET : 80

INC/DEC : CTRL.KNOB TO MENU : MENU KEY

[M1 : ADJUST]

[A2 : AUDIO/VIDEO]

[A27 : APR VR]

[A271 : INPUT UNITY]

[INPUT LEVEL CH1] [INPUT LEVEL CH2]

MAINTENANCE MENU

INPUT LEVEL CH1 ADJUST

80 (HEX)

PRESET : 80

INC/DEC : CTRL.KNOB TO MENU : MENU KEY

[M1 : ADJUST]

[A2 : AUDIO/VIDEO]

[A27 : APR VR]

[A272 : OUTPUT UNITY]

[OUTPUT LEVEL CH1] [OUTPUT LEVEL CH2] [MONITOR LEVEL Lch] [MONITOR LEVEL Rch]

4-3-3. APR VR (A27)

This menu is used for the audio system adjustment. (For details, refer to “8-5. Audio System Adjustment”.)

INPUT UNITY

Adjust the analog audio input level. （Refer to Section 8-5-3. )

Menu hierarchy

Procedure

1. Select INPUT LEVEL CH1 or INPUT LEVEL CH2.

2. Change the set value with the [PUSH SET] knob.

OUTPUT UNITY

Adjust the analog audio output level. (Refer to Section 8-5-2.)

Menu hierarchy

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Procedure

MAINTENANCE MENU

OUTPUT LEVEL CH1 ADJUST

80 (HEX)

PRESET : 80

INC/DEC : CTRL.KNOB TO MENU : MENU KEY

[M1 : ADJUST]

[A2 : AUDIO/VIDEO]

[A2F : NV-RAM CONTROL]

MAINTENANCE MENU

NV-RAM CONTROL

SAVE ALL ADJUST DATA ALL DATA PREVIOUS

EXECUTE : SAVE KEY TO MENU : MENU KEY

1. Select OUTPUT LEVEL CH1, OUTPUT LEVEL CH2, MONITOR LEVEL Lch, or MONITOR LEVEL Rch.

2. Change the set value with the [PUSH SET] knob.

4-3-4. NV-RAM CONTROL (A2F)

This menu is used for the saving the various adjustment data.

(For details, refer to “8. Electrical Alignment”.)

Menu hierarchy

Procedure

1. Select NV-RAM CONTROL.

2. Select SAVE ALL ADJUST DATA or ALL DATA PREVIOUS with the [PUSH SET] knob.

Note

SAVE ALL ADJUST DATA：Saves adjustment data. ALL DATA PREVIOUS：Restores pre-adjustment data

3. Press the [F5 (SAVE)] button.

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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4-4. SERVICE SUPPORT (M2)

[M2 : SERVICE SUPPORT]

[M20 : ERROR LOG]

ERROR LOGGER 90-103 20XX-XX-XX XX:XX W90-002 20XX-XX-XX XX:XX W20-030 20XX-XX-XX XX:XX 92-103 20XX-XX-XX XX:XX PB-YLW 20XX-XX-XX XX:XX PB-RED 20XX-XX-XX XX:XX 92-103 20XX-XX-XX XX:XX 92-103 20XX-XX-XX XX:XX 10-022 20XX-XX-XX XX:XX 92-103 20XX-XX-XX XX:XX 95-419 20XX-XX-XX XX:XX

[M2 : SERVICE SUPPORT]

[M21 : DIAG CONTROL]

[CLEAR ERROR LOG]

MAINTENANCE MENU

CLEAR ERROR LOG

ALL CLEAR OK ?

CLEAR : SAVE KEY TO MENU : MENU KEY

4-4-1. ERROR LOG (M20)

This menu is used to display the most recent 50 events of errors, warnings, and playback condition errors that occurred.

Menu hierarchy

• Warning is indicated as a character string of W number - number.

• Playback condition yellow and Playback condition red are indicated as PB-YLW and PB-RED respectively.

• Turning the [PUSH SET] knob clockwise display the new log.

• Turning the [PUSH SET] knob counterclockwise display the old log.

4-4-2. DIAG CONTROL (M21)

This menu allows you to delete registered error logs.

Note

Generally, do not delete the error logs.

The error logs contain important information helpful for resolving or avoiding problems.

Menu hierarchy

Procedure

1. Select CLEAR ERROR LOG.

2. Press the [F5 (SAVE)] button.

4-4-3. OPTION SETTING (M22)

This menu is used to set installation of option board.

For details, refer to Operation Manual.

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Menu hierarchy

[M2 : SERVICE SUPPORT]

[M22 : OPTION SETTING]

[REDUNDANT PSU] [DVB-ASI I/O]

MAINTENANCE MENU M2 : SERVICE SUPPORT M22 : OPTION SETTING REDUNDANT PSU : on

ON OFF

[M2 : SERVICE SUPPORT]

[M23 : OPTION KEY]

[STATUS] [INSTALL] [REMOVE]

Procedure

1. Select REDUNDANT PSU or DVB-ASI I/O.

2. Set to “on” with the [PUSH SET] knob.

4-4-4. OPTION KEY (M23)

This menu is used to set option key. For details, refer to Operation Manual of option key.

Menu hierarchy

XDS-PD2000/XDS-PD2000C/XDS-PD1000/XDS-PD1000C

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Sony XDS-PD2000, XDS-PD2000C, XDS-PD1000, XDS-PD1000C Users guide

Specifications and Main Features

Frequently Asked Questions

User Manual

Table of Contents

Manual Structure

Purpose of this manual

Related manuals

Trademarks

Service Overview

1-1. Circuit Function

1-2. Location of Main Parts

1-2-1. Location of Printed Circuit Boards

1-2-2. Location of Main Mechanical Parts

1-3. Function and Location of Sensors

1-4. How to Eject a Cartridge Manually

1-5. Functions of Onboard Switches/LED Indicators

1-5-1. Functions of Onboard Switches

1-5-2. Functions of Onboard LED Indicators

1-6. Circuit Protection Parts

1-6-1. Circuit Protection Element

1-6-2. Replacing Fuse

1-7. Equipment and Fixtures List for Check/Adjustment

1-7-1. Fixtures

1-8. Internal Video Test Signal

1-9. Service Action after Replacing or Repairing the Block and Board

1-9-1. Optical Block Assembly

1-9-2. BD-42 Board

1-9-3. SE-1004 Board

1-9-4. HPR-32/41 Board

1-9-5. AU-325 Board

1-9-6. SY-388 Board

1-10. Replacing EEPROMs and Backup Battery

1-10-1. EEPROMs

1-10-2. EEPROMs of Optical Drive Assembly

1-10-3. Backup Battery

1-11. Circuit Description

1-11-1. Video Signal Processing Block

1-11-2. Audio Signal Processing System

1-11-3. Sync Signal Processing System

1-11-4. I/O System Control System

1-11-5. I/O Interface System

1-11-6. Optical Drive System

1-12. Connecting and Disconnecting Flexible Card Wires

1-12-1. Connecting/Disconnecting Flexible Card Wire (Type A)

1-12-2. Connecting/Disconnecting Flexible Card Wire (Type B)

1-12-3. Connecting/Disconnecting Flexible Card Wire (Type C)

1-12-4. Connecting/Disconnecting Flexible Card Wire (Type D)

1-13. Cautions on Handling the Optical Block Assembly

1-14. Lead-free Solder

Error Messages

2-1. Error Message Overview

2-2. Error Code List

2-2-1. Error 0X

2-2-2. Error 20

2-2-3. Error 3X

2-2-4. Error 5X

2-2-5. Error 6X

2-2-6. Error 71

2-2-7. Error 91

2-2-8. Error 92

2-2-9. Error 95

2-3. Alarms (Warning)

2-3-1. When the Unit is Powered on

2-3-2. When a Memory Card is Inserted

2-3-3. When a Disc is Inserted

2-3-4. During Front Panel Operations

2-3-5. During Recording Operations

2-3-6. During Playback Operations

2-3-8. Alarms Relating to Audio and Video Signals

2-3-9. Alarms Relating to Sensors and Drivers

2-3-10. Alarms Relating to the Internal Storage

2-3-11. Other Alarms

XDCAM Web Site

3-1. XDCAM Web Site Overview

3-1-1. Making a Connection to the XDCAM Website

3-2. Status Menu

3-2-1. Software Version

3-3. Maintenance Menu

3-3-1. Network