Sony SSCT-100-D, SSWGV-100-D, SSZX-100-D, SSZX-100-DP, SSZX-80-DP Service manual

SS-CT100D/WGV100D/ZX80DP/

ZX100D/ZX100DP

SERVICE MANUAL

Ver. 1.0 2006.05

Photo: SS-CT100D Photo: SS-WGV100D Photo: SS-ZX100D

• SS-CT100D is center speaker in FST-ZX80D/ZX100D/LBT-ZX80D/ZX100D.

• SS-WGV100D is subwoofer in FST-ZX100D/LBT-ZX100D.

• SS-ZX100D is front and surround speakers in FST-ZX80D/ZX100D/LBT-ZX80D/ZX100D.

• SS-ZX80DP is package speaker of front and surround speakers in FST-ZX80D/LBT-ZX80D.

• SS-ZX100DP is package speaker of front and surround speakers in FST-ZX100D/LBT-ZX100D.

SS-ZX80DP SS-ZX100DP Front Speaker SS-ZX100D Surround Speaker SS-ZX100D

E Model

Front/Surround speaker SS-ZX100D

Speaker system 2-way, bass-reflex type,

magnetically shielded Speaker units Woofer 22 cm, cone type Tweeter 5 cm, cone type × 2 Nominal impedance 6 ohms Dimensions (w/h/d) Approx. 308 × 365 ×

480 mm Mass Approx. 10.0 kg net per

speaker

Center Speaker SS-CT100D

Speaker system Full range, 2-unit,

bass-reflex type,

magnetically shielded Speaker units Full range 8 cm, cone type × 2 Nominal Impedance 16 ohms Dimensions (w/h/d) Approx. 268 × 107 ×

117 mm Mass Approx. 1.6 kg

SPECIFICATIONS

Subwoofer SS-WGV100D

Subwoofer system 1-way, 1-unit,

bass-reflex type,

magnetically shielded Speaker units Subwoofer: 20 cm, cone type Nominal impedance 8 ohms Dimensions (w/h/d) (Approx.)

281 × 362 × 338.5 mm Mass (Approx.) 6.8 kg

Design and specifications are subject to change without notice.

• JIG When disassembling the set, use the following jig (for speaker removal). Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL

9-887-256-01

SPEAKER SYSTEM

Sony Corporation

Home Audio Division Published by Sony Techno Create Corporation

SS-CT100D/WGV100D/ZX80DP/ZX100D/ZX100DP

Subwoofer (SS-WGV100D)

SUBWOOFER ON/OFF 1 SUBWOOFER LEVEL 2

ALPHABETICAL ORDER

A – Z

SECTION 1

GENERAL

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

This section is extracted from instruction manual.

1 2

SS-CT100D/WGV100D/ZX80DP/ZX100D/ZX100DP

SECTION 2

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.

2-1. FRONT PANEL BLOCK (SS-WGV100D)

Insert a flat-tip screwdriver into a recess in the bottom of the set to raise the front panel assy a little.

Raise the front panel assy a little by little from bottom to top of the set.

Insert the jig (J-2051-238-A) into a space made by inserting the screwdriver, and raise the front panel assy gradually.

front panel block

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