Sony SRF H11 Service Manual
SRF-H11
SERVICE MANUAL
Ver 1.0 2003.04
SPECIFICATIONS
Frequency range
FM:87.5 – 108 MHz
AM:530 – 1 710 kHz
Power output
6 mW + 6 mW (at 10% harmonic distortion)
Headphone type
Dynamic
Power requirements
1.5 V DC, one R03 (size AAA) battery
Mass Approx. 115 g (4 oz) incl. a battery
French Model
Design and specifications are subject to change without notice.
FM STEREO / AM HEADPHONE RADIO
9-877-300-01 Sony Corporation
2003D0200-1 Personal Audio Company
C 2003.04 Published by Sony Engineering Corporation
SRF-H11
TABLE OF CONTENTS
Specifications ............................................................................ 1
1. SERVICING NOTE ................................................... 3
2. GENERAL
Location and Function of Controls ................................. 4
3. DISASSEMBLY
3-1. Belt Removal ........................................................... 5
3-2. Driver (Headphone) (R) Removal ........................... 5
3-3. Driver (Headphone) (L) Removal ........................... 5
3-4. Main Board Removal .............................................. 6
3-5. Audio Board Removal ............................................. 6
4. GEAR (TUNING CAPACITOR)
INSTALLATION ........................................................ 7
5. ELECTRICAL ADJUSTMENTS .......................... 8
6. DIAGRAMS
6-1. Printed Wiring Boards ............................................. 11
6-2. Schematic Diagram ................................................. 12
7. EXPLODED VIEW .................................................... 14
• UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
8. ELECTRICAL PARTS LIST .................................. 15
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
2
SECTION 1
SERVICING NOTE
DRIP-PROOF TREATMENT
Be sure to execute the following, when the cabinet is removed
during service.
Apply the SONY coating sealant TSE392-W (7-432-950-03) to
the hatched portion shown in figure using an applicator, etc.
SRF-H11
Poly-slider washer
Lever
Cabinet (rear) R Cabinet (rear) L
Cabinet (rear) R
Knob (band)
TSE392-W TSE392-W
TSE392-W TSE392-W
Knob
(tune)
Cabinet (rear) R
Knob (power)
Cabinet (rear) L
Knob
(volume)
Lever
Cabinet (rear) L
3
SRF-H11
P
O
W
E
R
O
F
F
O
N
VOL
F
M
D
X
A
M
B
A
N
D
L
O
C
A
L
Location and function of controls
SECTION 2
GENERAL
This section is extracted from
instruction manual.
Battery compartment
L
Light reflector (R, L)
This reflector reflects car
lights at night for your safety.
TUNE
Driver units
BAND
FM DX/LOCAL•AM
R
Neck band/Bandeau/
A
R03 (size AAA) x 1
B
L
L
f
f
POWER OFF•ON•
MEGA BASS
VOL
*
C
Left ear/Oreille gauche/ Linkes
Neck band
4
SECTION 3
)
r
DISASSEMBLY
r
The equipment can be removed using the following procedure.
Set
Note : Follow the disassembly procedure in the numerical order given.
3-1. BELT REMOVAL
Belt
DRIVER (Headphone) (R) Main board
DRIVER (Headphone) (L)
Audio board
SRF-H11
3
Claws
Cap (R)
4
Tapping screw
(B1.7x8)
1
Claws
2
Hook (R)
1
Claws
2
Belt
Lead wire
Hook (L)
4
Tapping screw (B1.7x8
Cap (L)
3
Claws
Main (L) assyMain (R) assy
3-2. DRIVER (HEADPHONE) (R) REMOVAL
Main (R) assy
3
Driver
(headphone)
2
(+BVTP1.7x 6)
4
screw
1
5
Remve solde
Ear pad (R)
3-3. DRIVER (HEADPHONE) (L) REMOVAL
Main (L) assy
Driver
2
screw
(+BVTP1.7 x 6)
1
Ear pad (L)
(headphone)
4
3
5
Remve solder
5
SRF-H11
)
L
3-4. MAIN BOARD REMOVAL
Cabinet (front) R
4
Remve solder
2
5
Claw
Main board
2
Claw
1
Three screws
(+BVTT1.7 x 8
3
3-5. AUDIO BOARD REMOVAL
3
Screw
(+BVTT1.7 x 8)
Lid,
battery case
2
Cabinet (rear) R
Audio board
Cabinet (front)
6
5
1
Knob
(volume)
4
3
Two screws
(+BVTT1.7 x 8)
Cabinet (rear) L
Remve solder
6
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