Sony SPP-M937 Service manual
SPP-M937
SERVICE MANUAL
Ver 1.0 2000.08
SPECIFICATIONS
General
Frequency band
902 - 928 MHz
Operation mode
FM, duplex
Operating channel
30 channels
Dial signal
Tone, 10 PPS (pulse) selectable
Supplied accessories
AC power adapotor (AC-T122)
Handset
Telephone line cords (3)
Wall bracket for base phone
Rechargeable battery pack (BP-T23)
Directories (2)
Belt clip
Handset
Power source
Rechargeable battery pack BP-T23
Battery life
Standby: Approx. 7 days
Talk: Approx. 7 hours
Dimensions
Approx. 55 x 177 x 45 mm (w/h/d),
antenna excluded
US Model
(approx. 2 1⁄4 x 7 x 1 13⁄16 inches)
Antenna: Approx. 30 mm
(approx. 1 1 ⁄4 inches)
Mass
Approx. 250 g
(approx. 8.8 oz), battery included
Base phone
Power source
DC 9 V from AC power adaptor
Battery charging time
Approx. 12 hours
Dimensions
Approx. 187 x 66 x 225 mm
(w/h/d), antenna excluded
(approx. 7 3⁄8 x 2 5⁄8 x 8 7⁄8 inches)
Antenna : Approx. 150 mm
(approx. 6 inches)
Mass
Approx. 598 g (approx. 1 lb 5 oz)
Design and specifications are subject to change without notice.
2-LINE CORDLESS TELEPHONE
TABLE OF CONTENTS
Specifications ........................................................................... 1
1. GENERAL
Identifying the parts ........................................................... 3
Step 2 : Setting up the base phone ..................................... 3
Step 3 : Preparing the battery pack .................................... 4
Making calls....................................................................... 5
Receiving calls ................................................................... 5
Speed dialing...................................................................... 6
Setting the ringer type ........................................................ 7
Switching the phones during a call .................................... 7
Talking between the handset and
the base phone (Intercom)........................................... 8
Transferring a call .............................................................. 8
Having a conference call.................................................... 9
Mounting the base phone on a wall ................................. 10
Carrying the handset by the belt clip ............................... 10
2. DISASSEMBLY
2-1. Hand Rear ................................................................. 11
2-2. Hand Main Board, Hand RF Board .......................... 11
2-3. Base bottom .............................................................. 12
2-4. Base Top ................................................................... 12
2-5. Base Main Board, Base RF Board,
Base Key Board ........................................................ 13
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
NOTE WHEN REPAIRING/REPLACING THE EEPROM
This model is used two EEPROMs of U4(Base unit) and
U3(Handset).
Therefore, the EEPROM must change two pieces together since
it’s supply two pieces in one package as a spare parts (X-3379672-1).
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
3. TEST MODE................................................................ 14
4. ELECTRICAL ADJUSTMENTS
4-1. Base Unit Section ..................................................... 15
4-2. Handset section......................................................... 16
5. DIAGRAMS
5-1. Block Diagrams – Base Unit Section (1/2) – ......... 17
5-2. Block Diagrams – Base Unit Section (2/2) ............ 19
5-3. Block Diagrams – Han Main Section – .................. 21
5-4. Schematic Diagram –Base Unit Section (1/2) –..... 23
5-5. Schematic Diagram – Base Unit Section (2/2) –.... 25
5-6. Printed Wiring Boards – Base Main Section–........ 27
5-7. Schematic Diagram – Hand Main Section – .......... 30
5-8. Printed Wiring Board – Hand Main Section –........ 33
5-9. Printed Wiring Board – Base Key Section – .......... 35
5-10. Schematic Diagram – Base Key Section – ............. 36
5-11. Explanation of IC terminals.................................... 37
6. EXPLODED VIEWS
6-1. Handset Section ........................................................ 41
6-2. Base Unit Section ..................................................... 42
7. ELECTRICAL PARTS LIST.................................... 43
– 2 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
– 3 –
– 4 –
– 5 –
– 6 –
– 7 –
– 8 –
– 9 –
– 10 –
SECTION 2
d
d
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
Hand rearHand set Hand main board Hand RF board
Base bottomBase unit Base top Base main board, Base RF board, Base key board
<HANDSET>
2-1. HAND REAR
4
Claws
3
Claws
3
Claws
Hand front
2-2. HAND MAIN BOARD, HAND RF BOARD
1
Screws (+P 3x10)
5
Hand rear
1
3
Claws
Hand rear
Hand front
2
Screws (+P 3x12)
Lid battery, han
Antenna (ANT 2)
Hand RF board
4
Screws (2x6)
Washer
3
2
Screws (+P 2x5)
Hand main boar
5
Remove solder
– 11 –
<BASE UNIT>
d
2-3. BASE BOTTOM
Base top
Base bottom
2
Claw
3
Base top
2
Claw
Base bottom
1
Screws (+P 3x12)
2-4. BASE TOP
1
Screws (+P 3x12)
Base top
Base main boar
3
– 12 –
2
Screws (+BTP 2.6x8)
Screws (+P 2.6x16)
1
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