Sony SPP-933, SPP-934 Service manual
SPP-933/934
SERVICE MANUAL
Ver 1.0 2000. 01
SPECIFICATIONS
US Model
SPP-933
Canadian Model
Mexican Model
SPP-934
MICROFILM
CORDLESS TELEPHONE
TABLE OF CONTENTS
1. GENERAL
Identifying the Parts ........................................................ 3
Setting Up the Base Phone ............................................. 3
Preparing the Battery Pack ............................................. 4
Making Calls ................................................................... 5
Receiving Calls ............................................................... 5
Telephone Features ......................................................... 6
2. DISASSEMBLY ......................................................... 9
3. TEST MODE
Base Unit ......................................................................... 12
Handset ............................................................................ 14
4. ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 15
Handset ............................................................................ 17
5. DIAGRAMS
5-1. Block Diagram – BASE UNIT Section (1/2) –............. 19
5-2. Block Diagram – BASE UNIT Section (2/2) –............. 21
5-3. Block Diagram – HANDSET Section – ........................ 23
5-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
5-5. Printed Wiring Board – BASE RF Section – ................ 26
5-6. Schematic Diagram – BASE RF Section – ................... 27
5-7. Printed Wiring Boards – BASE MAIN Section – ......... 29
5-8. Schematic Diagram – BASE MAIN Section – ............. 31
5-9. Printed Wiring Board – BASE KEY Section – ............. 34
5-10. Schematic Diagram – BASE KEY Section – ................ 35
5-11. Printed Wiring Board – HAND RF Section –............... 36
5-12. Schematic Diagram – HAND RF Section – .................. 37
5-13. Printed Wiring Board – HAND MAIN Section – ........ 39
5-14. Schematic Diagram – HAND MAIN Section – ............ 41
5-15. IC Pin Function Description ........................................... 45
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
6. EXPLODED VIEWS ................................................ 47
7. ELECTRICAL PARTS LIST ............................... 49
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIA GRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
– 2 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
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– 4 –
– 5 –
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– 8 –
SECTION 2
d
)
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
HAND CABINET (REAR)
5 Remove the hand cabinet (rear)
in the direction of arrow B.
4 claw
B
3 two claws
HAND MAIN BOARD, SPEAKER (SP801)
3 two claws
2 two screws
(BTP3 × 12)
1 Remove the battery case li
in the direction of arrow A.
A
7 holder (SP)
8 speaker
(SP801)
6 three screws
(BTP2.6 × 8)
3 screw
(BTP2.6 × 8)
1 knob
2 two screws
(BTP2.6 × 12)
4 charge terminal (L
4 charge terminal (R)
5 HAND MAIN board
– 9 –
CABINET (LOWER) ASSY
y
2 three claws
1 four screws
(BTP2.6 × 12)
3 cabinet (lower) ass
BASE KEY BOARD
3 two screws
(BTP2.6 × 8)
5 speaker
(SP701)
4 holder (SP)
1 eight screws
(BTP2.6 × 8)
2 BASE KEY board
– 10 –
BASE MAIN BOARD
6 two screws
(BTP2.6 × 8)
7 BASE MIC board
3 seven screws
(BTP2.6 × 8)
2 flat cable
1 knob (VR)
3 four screws
(BTP2.6 × 8)
4 spring washer
5 BASE MAIN board
– 11 –
SECTION 3
TEST MODE
BASE UNIT
[Setting the Test Mode]
1. Power on with pressing the [*] and [#] keys for a second.
2. When the test mode is set, it beeps confirm tone and SPEAKERPHONE LED turns on for 50 msec.
Note: If setting the test mode with the status that [TONE] position is selected at [DIAL MODE] switch, the unit cold stars next time when the power is
turned on.
[Releasing the Test Mode]
To release the test mode, perform as follows:
• Turn the power off (disconnect the AC adapter plug).
• Set the handset to charge on the base unit.
• Bell in.
• Press the [SPEAKERPHONE] key.
• Press the [INTERCOM] key.
[Changing the Test Mode No.]
Press each key of the test mode No.
[Changing the Channel]
Press the [REDIAL/PAUSE] key.
Note: Channel will be back to initial channel (19CH), when the test mode step is changed.
• Channel Rotation
21CH 40CH 1CH 2CH 3CH 39CH 40CH20CH19CH
. . .
– 12 –
[Test Mode Execution]
Press each key for the desired test mode No. to execute any of the following tests:
No.
1 VCO/TX FREQ. ADJ 1 L L H H L H
2 TX MOD CHECK 2 H L H H L L
3 TX DATA 3 L L H H L H *1
4 RX SENS 4 L H H H L L
5 SQ SENS 5 L H/L H H L/H L *2
6 BELL CHECK 6 L L H H L/H H *3
7 DTMF DUAL TONE 7 L L H H L L *4
8 DATA IN CHECK 8 L L H H L L *5
9 CHANNEL DATA 9 L L H H L H *6
10 DUPLEX 0 H H H H L L
11 INTERCOM PGM H H L L H H
Test Mode
Name
KEY
TX MUTE (IC8 pin qj)
SP MUTE1 (IC8 pin ef)
SP MUTE2 (IC8 pin rh)
LINE MUTE (IC8 pin rg)
MIC MUTE (IC8 pin qg)
RX MUTE (IC8 pin eh)
*Initial Channel of each test mode No.: 19CH
*1. Test Mode 3: Continue output TX data as “ 0000……”.
*2. Test Mode 5: When signal is detected, it rings bell tone.
*3. Test Mode 6: Output level of the bell can be changed by the [RINGER] switch (S2).
*4. Test Mode 7: Press the [FLASH] key.
DTMF will be changed.
1 → 2 → 3 → 4 → 5 → 6 → 7 → 8 → 9 → 0 → → # → 1 → …… .
*
*5. Test Mode 8: When locked receiving data is “ 0000……”, it rings bell tone.
*6. Test Mode 9: Continue output data as “ 1111……” from CHG CONT(IC8 pin qh).
Remarks
– 13 –
HANDSET
[Setting the Test Mode]
1. Power on with press the [*] key and the [#] key simultaneously for one second.
2. It beeps confirm tone, and the test mode is set.
Note: If the [PGM] key is pressed, the unit cold starts next time when the power is turned on.
[Releasing the Test Mode]
To release the test mode, perform as follows:
• Press the [TALK] key.
• Turn the power off (remove the battery pack).
• Set the handset to charge on the base unit (except Test Mode 9).
[Changing the Test Mode No.]
Press the each key of the test mode No.
[Changing the Channel]
Press the [CHANNEL] key.
Note: The channel is back to initial channel (21CH), when test mode No. is changed.
• Channel Rotation
19CH 40CH 1CH 2CH 3CH 39CH 40CH20CH21CH
[Test Mode Execution]
Press the each key for the desired test mode No. to execute any of the following tests:
No.
1 VCO/TX FREQ. ADJ 1 L H L L H
2 TX MOD CHECK 2 L H H L L
3 TX DATA 3 L H L L L *1
4 RX SENS 4 H H L H L
5 SQ SENS 5 L H L *A L
6 RECEIVE DATA CHECK 6 L H L L H *2
7 BELL CHECK 7 L L L L H *3
8 BAT. LOW CHECK 8 L L L L H *4
9 CHARGE CHECK 9 L L L L H *5
10 DUPLEX 0 L H H H L
Test Mode
Name
KEY
SC (IC603 pin qd)
TX B (IC603 pin rs)
RX MUTE (IC603 pin qs)
TX MUTE (IC603 pin qa)
CONV (IC603 pin ej)
*Initial Channel of each test mode No.: 21CH
. . .
Remarks
*A. SQ on: H
SQ off: L
*1. Test Mode 3: Continue output TX data as “ 0000……”.
*2. Test Mode 6: When locked receiving data is “ 0000……”, it beeps confirm tone. (1 kHz)
*3. Test Mode 7: It rings with “ H” level.
*4. Test Mode 8: When BATT LOW (IC603 pin eg) is “ L” (battery low), it beeps confirm tone.
*5. Test Mode 9: When CHG IN (IC603 pin eh) is “ L” (charge on), it beeps confirm tone.
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