Sony SCDXE-670 Service manual

SCD-XE670

SERVICE MANUAL

Ver 1.0 2001.07

SPECIFICATIONS

When a super audio CD is played

Playing frequency range 2 Hz to 100 kHz Frequency response 2 Hz to 50 kHz (–3 dB) Dynamic range 103 dB or more Total harmonic distortion rate 0.0020 % or less Wow and flutter Value of measurable limit

When a CD is play ed

Frequency response 2 Hz to 20 kHz Dynamic range 98 dB or more Total harmonic distortion rate 0.0025 % or less Wow and flutter Value of measurable limit

Output connector

Jack type

ANALOG OUT

DIGITAL (CD) OUT OPTICAL *

PHONES

*Output only the audio signals of the CD

Phono jacks

Square optical output connector

Stereo phone jack

(±0.001 % W. PEAK) or less

Output level

2 Vrms (at 50 kilohms)

–18 dBm

10 mW

Load impedance

Over 10 kilohms

Wave length: 660 nm

32 ohms

US Model

Canadian Model

AEP Model

UK Model

Model Name Using Similar Mechanism NEW CD Mechanism Type CDM66B-DVBU6A Base Unit Name DVBU6A Optical Pick-up Name KHM-230AAA

General

Laser: Semiconductor laser

(SACD: λ = 650 nm) (CD: λ = 780 nm)

Emission duration: continuous Power requirements 120 V AC, 60 Hz Power consumption 26 W Dimensions (w/h/d) 430 × 95 × 285 mm (w/h/d) (17 x 3 3/4 x 11 1/4 in.)

incl. projecting parts

Mass (approx.) 3.9 kg (9 lbs 5 oz)

Supplied accessories

This player comes with the following items:

• Audio connecting cord

phono jack × 2 (Red and White) y phono jack × 2 (Red and White) (2) phono jack × 1 (Black) y phono jack × 1 (Black) (2)

• Remote commander RM-SX700 (1)

• Size AA (R6) batteries (2)

Design and specifications are subject to change without notice.

SUPER AUDIO CD PLAYER

9-873-176-01 Sony Corporation

2001G0500-1 Home Audio Company C 2001.7 Shinagawa Tec Service Manual Production Group

SCD-XE670

TABLE OF CONTENTS

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 6

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 8

3-2. Case (408226) ................................................................. 9

3-3. Front Panel Section ......................................................... 9

3-4. AUDIO Board, MAIN Board .......................................... 10

3-5. Mechanism Deck (CDM66B-DVBU6A) ....................... 10

3-6. Base Unit (DVBU6A) ..................................................... 11

4. TEST MODE.............................................................. 12

5. DIAGRAMS

5-1. Block Diagram – RF/SERVO Section –........................ 26

5-2. Block Diagram – SERVO Section – .............................. 27

5-3. Block Diagram – MAIN Section – ................................ 28

5-4. Block Diagram – AUDIO Section – .............................. 29

5-5. Block Diagram – DISPLAY/KEY CONTROL/

POWER SUPPLY Section – ........................................... 30

5-6. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 31

5-7. Schematic Diagram – RF Board – ................................. 32

5-8. Printed Wiring Boards – RF/LOADING Boards – ....... 33

5-9. Printed Wiring Board

– MAIN Board (Component Side) – .............................. 34

5-10. Printed Wiring Board

– MAIN Board (Conductor Side) – ................................ 35

5-11. Schematic Diagram

– MAIN (1/5)/LOADING Boards – .............................. 36

5-12. Schematic Diagram – MAIN Board (2/5) – .................. 37

5-13. Schematic Diagram – MAIN Board (3/5) – .................. 38

5-14. Schematic Diagram – MAIN Board (4/5) – .................. 39

5-15. Schematic Diagram – MAIN Board (5/5) – .................. 40

5-16. Schematic Diagram

– AUDIO/HEADPHONE Boards – ................................ 41

5-17. Printed Wiring Board

– AUDIO Board (Component Side) – ............................ 42

5-18. Printed Wiring Boards – AUDIO (Conductor Side)/

HEADPHONE Boards – ................................................. 43

5-19. Printed Wiring Boards – DISPLAY/KEY Boards –...... 44

5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 45

5-21. Printed Wiring Boards

– POWER/POWER SW/PT Boards – ............................ 46

5-22. Schematic Diagram

– POWER/POWER SW/PT Boards – ............................ 47

5-23. IC Pin Function Description ........................................... 55

6. EXPLODED VIEWS

6-1. Case Section .................................................................... 70

6-2. Front Panel Section ......................................................... 71

6-3. Chassis Section ............................................................... 72

6-4. Mechanism Deck Section (CDM66B-DVBU6A) .......... 73

6-5. Base Unit Section (DVBU6A)........................................ 74

7. ELECTRICAL PARTS LIST ............................... 75

SCD-XE670

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester , such as the Simpson 229 or RCA

WT -540A. Follo w the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a

VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate lowvoltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V A C range are suitable. (See Fig. A)

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

This label is located on the LEFT exterior.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

The following caution label is located inside the unit.

To Exposed Metal Parts on Set

1.5 k

0.15 µF

Fig. A. Using an AC voltmeter to check AC leakage.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Ω

Earth Ground

AC voltmete (0.75 V)

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQ UE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

SCD-XE670

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objecti ve lens.

CLEANING OF OPTICAL PICK-UP LENS

In cleaning the lens of optical pick-up, use the air blower. Never use a cotton swab for cleaning the lens of optical pick-up, which otherwise causes a trouble.

MODEL IDENTIFICATION

– Rear Panel –

PART No.

MODEL PART No.

AEP and UK models 4-234-033-0 US model 4-234-033-2[] Canadian model 4-234-033-4

RESETTING OPERATION AT POWER ON

If the power is turned on with a disc loaded in the set, a sequence of operation as shown below will be performed. (The operation varies depending on the type of disc) Condition: continue mode

[]

(1) CD

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for CD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

(2) SACD (single layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

(3) SACD (dual layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on (layer 0)

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment (layer 0)

12. Tracking & sled servo on (layer 0)

13. Focus bias auto adjustment (layer 0)

14. Focus servo gain auto adjustment (layer 0)

15. Tracking servo gain auto adjustment (layer 0)

16. Jump to lead-in area

17. Read TOC

18. Focus jump (layer 0tlayer 1)

19. E-F balance auto adjustment (layer 1)

20. Tracking & sled servo on (layer 1)

21. Focus bias auto adjustment (layer 1)

22. Focus servo gain auto adjustment (layer 1)

23. Tracking servo gain auto adjustment (layer 1)

24. Focus Jump (layer 1tlayer 0)

25. Stop

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURNS OFF

)

tray

cam (66)

1 Insert a tapering driver (3 mm in diameter)

in the hole at the bottom of the unit, turn the cam (66) fully in the direction of arrow A.

SCD-XE670

tapering driver

DISPLAY BOARD SERVICE POSITION

In checking the DISPLAY board, prepare jig (extension cable J-8000-024-A : 1.00 mm Pitch, 12 cores, Length 300 mm.)

DISPLAY board (CN801)

MAIN board (CN706)

Connect jig (extension cable J-8000-024-A to the DISPLAY board (CN801) and MAIN board (CN706).

SCD-XE670

Front Panel

SECTION 2

GENERAL

This section is extracted from instruction manual.

CHECK qg (18) CLEAR qh (18) Disc tray 6 (10) Display w; (11) MENU qj (10, 20) MULTI/2CH qk (9, 11) Multi-Channel indicator 7 PHONE LEVEL qf (25)

PHONES jack qd PLAY MODE 2 (17, 18) POWER 1 (10) Remote sensor ql (6) REPEAT 3 (16) SACD/CD 5 (9, 11) TIME/TEXT 4 (11)

Rear Panel

ANALOG 2CH OUT L/R jacks 1 (8) ANALOG 5.1CH OUT jacks 2 (6)

DIGITAL (CD) OUT OPTICAL jack 3 (8) Mains lead 4 (8)

BUTTON DESCRIPTIONS

lAMSL dial qs (10, 11, 14,

15, 19, 20)

A OPEN/CLOSE 8 (10, 18) H 9 (10, 15, 16, 17, 18) X 0 (11) x qa (11, 16, 19) m/M wa (15)

Remote Control

SCD-XE670

AyB 8 (16) AMS ./> qa (14, 15, 17,

22)

CHECK 9 (18) CLEAR qk (18) CONTINUE 2 (17, 18) DISPLAY MODE 3 (12) ENTER qj (22) INDEX >/. qd (15)

LEVEL ADJ ql (22) MULTI/2CH qh (9, 11) Number buttons 5 (14, 18) PROGRAM qf (18) REPEAT 7 (16) SACD/CD qg (9, 11) SHUFFLE 1 (17) TIME/TEXT 4 (11)

BUTTON DESCRIPTIONS

>10 6 (14, 18)

H w; (10, 15, 16, 17, 18) X 0 (11) x wa (11, 16, 19) m/M qs (15)

SCD-XE670

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET

3-2. CASE (408226)

(Page 9)

SECTION 3

DISASSEMBLY

3-3. FRONT PANEL SECTION

(Page 9)

3-4. AUDIO BOARD,

MAIN BOARD (Page 10)

3-5. MECHANISM DECK

(CDM66B-DVBU6A) (Page 10)

3-6. BASE UNIT

(DVBU6A) (Page 11)

Note: Follow the disassembly procedure in the numerical order given.

3-2. CASE (408226)

two screws

(case 3 TP2)

case (408226)

two screws (BVTP3

SCD-XE670

3-3. FRONT PANEL SECTION

three connectors (CN453, 454, 881)

front panel section

screw (BV/RING)

– BOTTOM VIEW –

two claws

two screws (case 3 TP2)

wire (flat type) (12 core) (CN706)

lead with connector

two claws

tapering driver

loading panel assy

Note:When the power supply does not turn on,

rotate the cam with tepering driver (∅3 mm) as the figure shows, and the loading panel assy will be moved.

three screws (BVTP3 × 6)

SCD-XE670

)

3-4. AUDIO BOARD, MAIN BOARD

wire (flat type) (12 core) (CN706)

wire (flat type) (30 core) (CN708)

connector (CN703)

two connectors (CN704, 707)

screw (BVTT3

MAIN board

two wires (flat type) (19 core) (CN302, 303)

four connectors



(CN301, 304, 305, 306)

PC board holder

AUDIO board

three screws (BVTT3

screw (BVTT3

four screw (BV/RING)

3-5. MECHANISM DECK (CDM66B-DVBU6A)

CD mechanism deck (CDM66B-DVBU6A)

– BOTTOM VIEW –

tapering driver

loading panel assy

three screws (BVTP3

connector (CN151)

wire (flat type) (30core (CN708)

two claws

Note:When the power supply does not turn on,

rotate the cam with tepering driver ( and the loading panel assy will be moved.

∅

3 mm) as the figure shows,

3-6. BASE UNIT (DVBU6A)

– BOTTOM VIEW –

cam (66)

base unit (DVBU6A)

SCD-XE670

floating screw (DIA. 12)

base unit (DVBU6A)

SCD-XE670

SECTION 4

TEST MODE

This set automatically executes self-diagnosis and various checks by entering the test mode.

Note: This set automatically makes various adjustments according to the

type of disc, thereby not requiring adjustment of the set when parts were replaced. However, be sure to execute 4-1. IC AND FLUORESCENT DISPLAY TUBE CHECK, 4-2. AUTO CHECK and 4-

7. WAVEFORMS CHECK.

Disc for Test Mode

Various checks of this set require the following discs.

Model Type *1 Category Application

MODEL SATD-S5 (J-2501-215-A) SL SATD-S4 Optical waveform check (J-2501-184-A)

Not specified DL 12 cm disc Operation check PATD-012

(4-225-203-01) YEDS-18 Reference disc (3-702-101-01)

Not specified HYBRID 12 cm disc Operation check

12 cm disc Reference disc

12 cm disc

Adjusted value check, Operation check,

Adjusted value check, Operation check, Optical waveform check

*1 SL: Single Layer

DL: Dual Layer

Setting Method of Test Mode

Turn the [POWER] switch on while pressing the [ AMS ]

dial and the [MENU] button. Release the [MENU] button and the

[ AMS ] dial in this order when “Test Mode Menu” is

displayed on the fluorescent indicator tube. (If the [ AMS ]

dial is released first, the test mode becomes active b ut “T est Mode Menu” is not displayed)

Releasing Method of Test Mode

To release the test mode, turn the

[POWER] switch off.

Selection/Entry of Test Mode

To select and enter the “Test Mode Menu”, operate as follows.

1. Rotate the [ AMS ] dial to select the menu, and press the [ AMS ] dial to enter.

2. The test is switched on or off alternately each time the

[ AMS ] dial is pressed.

3. To return to the previous step, rotate the [ AMS ] dial to select the desired item, and press the [ AMS ] dial

to enter.

Test Mode Command List

The contents of test mode are as follows.

Note: Wrong operation in the test mode causes a trouble, thus requiring extreme care.

LINE command (1X): Use mainly for a manufacturing line.

No. Name Description Remarks

05 DSP MON1 XUGF, XPCK, C2PO outputted from IC509 (CD DSP) Not used for the servicing 06 DSP MON2 MNT0, MNT1, MNT2, MNT3 outputted from IC509 (CD DSP) Not used for the servicing 07 DSP MON3 RFCK, XPCK, XROF, GTOP outputted from IC509 (CD DSP) Electrical measurement,

CD CLV jitter measurement

STANDARD command (1X): Use when the servo is applied by manual operation.

No. Name Description Remarks

12 LD ON/OFF The laser diode is turned on or off On or off are switched alternately 13 SPIN ON/OFF The spindle motor is rotated with the regulated voltage On or off are switched alternately 14 FSRV ON/OFF The focus servo is turned on or off On or off are switched alternately 15 TSRV ON/OFF The tracking servo is turned on or off On or off are switched alternately 16 CLV ON/OFF The spindle SLV servo is turned on or off On or off are switched alternately

17 SSRV ON/OFF The sled servo is turned on or off On or off are switched alternately

18 ALL SRV ON All servos are turned on 19 ALL SRV OFF All servos are turned off Stop command in the test mode

Focus and tracking servos must be already turned on

Focus, tracking and spindle servos must be already turned on

SCD-XE670

FOCUS command (2X): Focus related. (All servos must be already turned on (except command 21))

No. Name Description Remarks

21 FSRCH ON/OFF The continuous vertical motion of the optical pick-up lens is turned on or Avoid a long-time use

22 F-BIAS UP Increase focus bias Focus bias value 23 F-BIAS DOWN Decrease focus bias Focus bias value 24 ADJ FCSBIAS The focus bias is adjusted automatically

25 FGAIN UP/DW The focus servo gain is switched between normal and down Normal or down are switched alternately 26 FJMP UP/DWN Focus jump is executed Valid only for DL

27 FOCUS AGC The focus servo gain is adjusted automatically 28 DISP FBdata The focus bias adjusted value is displayed Hexadecimal display 9 bit data

Note: On or off and up or down are switched alternately

OFFSET (PI, FE, TE) command (3X): Adjusts the offset of PI, FE and TE signals.

No. Name Description Remarks

31 PI/FE OFSET Adjusts the offset of PI, FE and TE signals TE offset adjustment is executed for the CD

TRACKING command (4X): Tracking servo related.

No. Name Description Remarks

41 TGAIN NM/UP The tracking servo gain is switched between normal and up Normal or up are switched alternately 44 ADJ TRK DSP The traverse AGC and E-F balance adjustment is performed 45 TRACKING AGC T he tracking servo gain is adjusted automatically

off

Both + and - directions are searched to search for best jitter point

UP: layer 0t1, DOWN: layer 1t0

This adjustment must be executed after 61 DISC DETECT only

SEARCH command (5X): Track search related. (Nos. 51 through 53 are not used for the servicing.)

No. Name Description Remarks

51 1-TRCK JUMP One-track jump is performed 52 M-TRCK MOVE M-track movement is performed 53 FINE SEARCH Fine search is performed

DISC DETECT command (6X): Disc type check related.

No. Name Description Remarks

61 DISC DETECT Disc type check is executed Refer to how to apply servo by manual

62 SetDiscMode Enter disc type CD setting CD forced setting 63 Enter disc type SL setting SL forced setting 64 Enter disc type DD setting DD forced setting 65 Enter disc type HYBRID HD setting HD forced setting 66 Enter disc type HYBRID CD setting CD forced setting 6F Download Not used for the servicing

Display after judgment operation (page 14) DSKMOD CD: Judged as CD DSKMOD SL: Judged as SACD (SL) DSKMOD DL: Judged as SACD (DL) DSKMOD HLHD: Judged as HYBRID HD DSKMOD CDRW: Judged as CD-RW

SCD-XE670

TOOLS command (8X): Performs aging, reads adjusting parameters, etc.

No. Name Description Remarks

81 VERSION Firmware version is displayed Example: Ver 1.00 83 TRAY AGING Tray open-close aging is performed Number of times and eccentricity

Not used for the servicing measurement Not used in this set. 84 JITTER Jitter measurement Not used for the servicing 85 ERROR RATE Error rate measurement Error rate

86 ALL SRV ON Apply all servos Use when applying the servo by

87 DISP ADJ DT Automatic adjusting parameters are displayed Refer to auto check items (page 17)

8A FL TEST Not used for the servicing 8d Set Up Init Set to factory shipping mode Set when repair completed

8F 49 TRCK JIT Used for jitter measurement of 49th music on SACD-S4 For manufacturing line

QA command (9X)

No. Name Description Remarks

91 F.JMP CHECK Not used for the servicing 92 SET CHECK The set is checked Refer to 4-2. AUTO CHECK (page 17) 93 WATER MARK Not used for the servicing 94 SET AGING The set aging is performed Refer to 4-5. AGING MODE (page 21)

95 DISP ERROR The content of error recorded to the set is read and displayed Refer to Error Display list (page 22)

96 D-OUT OnOff Digital out of CD is turned on or off Not used in this set. 98 APDD JITTER Not used for the servicing 9C BU DENCHO The content of error recorded to the set is read, and then the S curve Refer to 4-7.WAVEFORMS CHECK

9D P-ON HOUR Approximate cumulative power supplying time is displayed In unit of 1 hour

9E RFD OUT RFD output is turned on or off Not used for the servicing

CD: C1, C2 Not used for the servicing

SACD: PO, PI1, PI2

Full automatic measurement including PI, FE and TE offset adjustment is manual operation

performed Refer to STANDARD command (page 12)

The offset adjusted values are scroll-displayed in order of RF, VC, FE and

TE Refer to auto check items (page 17)

PLAY, REPEAT, DIGIFIL, etc. are initialized Refer to 4-6. SHIPPING MODE (page 21)

Not used for the servicing

Repeat by the specified number of times or until an error occurred

(Error recording) Only one item is recorded

waveform, traverse waveform, and RF waveform can be checked (page 23)

successively

(Initialized by 8d command)

SACD jitter measuring mode

How to Apply Servo by Manual Operation

In analyzing failures of the set, the servo may be applied by manual operation. To apply servo in the test mode, use the following method.

1. After setting the test mode, rotate the [ AMS ] dial to select a command, and press the [ AMS ] dial to enter.

lL lL

2. “61 DISC DETECT” (Disc type check)t“86 ALL SRV ON” (All servos on + auto adjustment)

3. If applying servo while checking the condition one by one, “61 DISC DETECT” (Disc type check)t“31 PI/FE OFSET” (Offset automatic adjustment)t“14 FSRV ON/OFF” (Focus servo on)t“16 CLV ON/OFF” (CLV servo on) t“44 ADJ TRK DSP ” (E-F balance adjustment)t“15 TSRV ON/OFF” (Tracking servo on)t“17 SSRV ON/OFF” (Sled servo on)t“24 ADJ FCSBIAS” (Focus bias adjustment)t“27 FOCUS AGC” (Focus auto gain adjustment)t“45 TRACKING AGC” (Tracking auto gain adjustment).

Note: 1. On and off are alternately switched in the same command.

2. For a stop, select “19 ALL SRV OFF” and press the [ AMS ] dial.

SCD-XE670

Set Check

92. SET CHECK SET TEST START 10. TOTAL CHECK 120. MANUAL CHK

0. IC&FL CHECK ? 11. AUTO CHECK ?

1. TOTAL CHECK ? 12. MANUAL CHK ? 122. SPIN UP ?

2. F.JUMP CHECK ?

3.HYB CHECK ? TOTAL CHK END ? 124.

4. DISP ERROR ? 125. 1/3 SEEK ?

END ?? 126. 1-M SEEK ?

13. DISP RSLT ? 123. PARAMETER ?

121. LOAD IN ?

READ TOC & PSP ?

127. ERR RATE ?

128. HENSHIN ?

129. SPIN DOWN ?

12A. LOAD OUT ?

MAN. CHK END?

Press the [ AMS ] dial when No.sssss sssss*1 is displayed, and a checking for that display will start or the lower layer will be selected. For the selection on the same layer, rotate the [ AMS ] dial. It is looped on the same layer, and when “END?” is displayed, press the [ AMS ] dial to return to the upper layer.

*1 s denotes a displayed character.

Manual Check Method

In the “12. MANUAL CHK”, individual checks (121. LOAD IN to 12A. LOAD OUT) are possible.

Example: If 124. READ TOC & PSP of 12. MANUAL CHECK is to be checked.

Setting Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “92. SET CHECK” and press the [ AMS ] dial to enter.

2. When “SET TEST START” is displayed, rotate the [ AMS ] dial clockwise by 2 clicks to select “1. TOTAL CHECK?” and press the [ AMS ] dial to enter.

3. When “10. TOTAL CHECK” is displayed, rotate the [ AMS ] dial clockwise by 2 clicks to select “12. MANUAL CHK?" and press the [ AMS ] dial to enter.

4. When “120. MANUAL CHK” is displayed, rotate the [ AMS ] dial clockwise by 4 clicks to select “124. READ TOC & PSPS?” and press the [ AMS ] dial to enter.

5. A checking will start automatically.

Note: In making a chec k, the disc must be loaded. Immediately when a check started, the tray is drawn into the set. Also, the tray can be opened/closed

even during the set check mode.

SCD-XE670

4-1. IC AND FLUORESCENT DISPLAY TUBE CHECK

(SELF-DIAGNOSIS)

The communication between microcomputer and main ICs (selfdiagnosis) and the fluorescent display tube all lit are checked.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “92. SET CHECK” and press the [ AMS ] dial

to enter.

2. When “SET TEST START” is displayed, rotate the

[ AMS ] dial clockwise by 1 click to select “0. IC&FL

CHECK?” and press the [ AMS ] dial to enter.

3. A checking will start automatically, and “0. IC&FL CHECK” will be displayed. (Checking time is about 3 seconds)

4. After IC communication check, all segments of fluorescent display tube will be lit. At this time, check visually for a skipped character.

5. At successful completion of check, “0. IC CHECK OK” is displayed. In this case, no error exists in the IC interface. Proceed to 4-2. AUTO CHECK.

Note: The check mentioned above tests the communication from micro-

computer to main ICs. Even if the check successfully finished, the IC to be checked is not always normal. Consider it for reference only.

6. In case of an IC communication error, the following display will be given during the checking. Possible causes of error are as listed below.

Error display Causes (typical example)

DVD DEC. ERROR 1. IC701 (SACD decoder) is faulty

DVD DRAM ERR 1. IC706 (D-RAM) is faulty

CD DSP ERROR 1. IC509 (CD DSP) is faulty

EEPROM ERROR 1. IC903 (EEPROM) is faulty

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin ts (XDIS) does not go “H”

• IC902 (expander) is faulty

3. 768fs (33.86688 MHz) is not present to IC701 pin <znm (XTAL)

• IC811 (3-multiplying circuit) is faulty

• Clock signal 256fs is not sent from

AUDIO board (CN702 pin 0)

• CN701 pin 3 (GND) and pin 2

(+3.3V-D) are open or shorted

• CN701, 702 and FFC connection is loose,

or FFC is disconnected

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin ts (XDIS) does not go “H”

• IC902 (expander) is faulty

3. Faulty communication line between IC701 and IC706

• Data line, address line, WE, etc.

4. D903 (1SS367) is faulty D+3.3V is not present to IC706

2. 768fs (33.86688 MHz) is not present to IC509 pin ua (XTAL) Same as cause 3 of DVD DEC. ERROR

3. IC509 pin 2 (XRST) does not go “H”

• IC901 pin ts (XDIS) does not go “H”

• IC902 (expander) is faulty

Error display Causes (typical example)

PRAWN DRAM ERR 1. IC808 (D-RAM) is faulty *1 2. IC801 (DSD decoder) is faulty

RF AMP ERROR 1. IC001 (RF AMP) is faulty

3. 768fs (33.86688 MHz) is not present to IC801 pin qa (MCKI) Same as cause 3 of DVD DEC. ERROR

4. IC801 pin 9 (XRST) does not go “H”

• IC901 pin ts (XDIS) does not go “H”

• IC902 (expander) is faulty

5. Faulty communication line between IC801 and IC808

• Data line, address line, WE, etc.

6. D904 (1SS367) is faulty D+3.3V is not present to IC808

2. Loose connection between CN708 on MAIN board and CN005 on RF board, or FFC disconnection CN708 pin qj (CLK RF), pin qh (DATA RF) and pin qg (SDEN) must be checked

*1 DSD decoder is also checked.

Causes Common to Each IC:

1. Faulty communication line between microcomputer and each IC. Disconnected patterns, floating series resistors, bridge, etc.

2. Faulty IC supply voltage. Particularly, check D+3.3V voltage. (D+5V for display microcomputer)

3. Faulty microcomputer communication port to each IC

Note: In case of more than two errors, the error display is switched over

one after another, thus making the reading difficult. In such a case, press again the [ AMS ] dial to make a recheck for error reading.

SCD-XE670

4-2. AUTO CHECK (AUTOMATIC VARIOUS MEASUREMENTS)

The auto check is performed to check if the set operates stably . Though a checking is made automatically, whether the measured data are within the specification is evaluated by the service person. The auto check results in NG immediately, if the check itself causes an error.

Setting Method of Auto Check Mode:

1. After setting the test mode, rotate the [ AMS ] dial to select “92. SET CHECK” and press the [ AMS ] dial to enter.

2. When “SET TEST START” is displayed, rotate the [ AMS ] dial clockwise by 2 clicks to select “1. TOTAL CHECK?” and press the [ AMS ] dial to enter.

3. When “10. TOTAL CHECK” is displayed, rotate the [ AMS ] dial clockwise by 1 click to select “11. AUTO CHECK?”.

CD and SACD (SL) Disc Operation Check

Checking method:

1. Press the [OPEN/CLOSE ] button to open the tray and place the test disc *1. The [OPEN/CLOSE ] key is disabled immediately

A A

after setting the test mode. Be sure to initialize the table.

2. Press the [ AMS ] dial, and the following check will be performed automatically.

3. Finally, the test disc will be ejected and the auto check will finish.

4. “AUTO CHECK OK” will be displayed at successful completion of auto check.

5. Recheck is enabled if the [ AMS ] dial is pressed in step 4. (Also, use this operation when exchanging the test disc)

6. In case of an error during the checking, the check is interrupted automatically and the error is displayed. (Error display example: “DISC DETECT ERROR”) After err or display, “CONT?STOP (J/S)” is displayed. In this case, if the [ AMS ] dial is pressed, the check where the error occurred is skipped and you can proceed to the next check. Also, x if button is pressed, the check finishes and “AUTO CHECK NG” is displayed when even one NG item exists.

*1 Use PATD-012 or YEDS-18 for CD, and SATD-S5 or SATD-S4 for SACD (SL). Using another disc will result in a checking failure.

Check Items:

Items Description Remarks

LOAD IN TIME (msec) Time until a disc is chucked from the state where loading tray is out Loading in switch HtL SPIN UP TIME (msec) Time from spindle kick to PLL lock Lock signal LtH RF/VC/FE/TE (ORG) Offset values before RF (PI), VC, FE, TE signal offset adjustment At offset 0

RF/VC/FE/TE (ADJ) Offset values after RF (PI), VC, FE, TE signal offset adjustment VC offset is not adjusted

PI/TRVS PP (ORG/ADJ) PI (ORG): PI value at disc type check (decimal data) PI level conversion

PIOR/CCR/TRCR PIOR: Set value of PI offset coarse adjusting register Registers in RF amplifier

FOCUS/TRK GAIN Auto gain adjusted values of focus and tracking servos Reference: 30h

FBIAS/TRVSC/TRCR2/CFR FBIAS: Focus bias set value (9 bit data in hex notation) TRCR2 adjusts the E-F gain

MIN JITTER AT F.BIAS Minimum jitter value in focus bias adjustment (CD only) Correlative with RF jitter READ TOC TIME (msec) Time required for TOC reading PSP AMPLITUDE SACD only 1/3 SEEK TIME Seek time between 1/3LBA and 2/3LBA of the disc LBA: Absolute ad dress

F) A VE/MIN/MAX (msec): 1/3LB At2/3LBA average/minimum/maximum R) AVE/MIN/MAX (msec): 2/3LBAt1/3LBA average/minimum/maximum

1-MAX TRK SEEK Seek time between most inward track (0LBA) and most outward track max

F) A VE/MIN/MAX (msec): most inwardtmost outward average/minimum/maximum R) A VE/MIN/MAX (msec): most outwartmost inward average/minimum/maximum

ERROR RATE Error rate measurement Measure for 10 sec at track No.5

RF (8 bit data in hex notation) RF: A0h VC, FE, TE (9 bit data in hex notation) VC, FE, TE: 00h

(Less than ORG value if offset correction is normal) (Measurement only) RF (8 bit data in hex notation) Also, for SACD, the TE offset is VC, FE, TE (9 bit data in hex notation) not measured and adjusted

PI (ADJ): PI value after PI offset adjustment Read value × 12.9mV

(read value at microcomputer A/D) (decimal data)

TRVS PP (ORG):Traverse level before level correction (AGC) Traverse level conversion

(decimal data) Read value × 12.9mV

TRVS PP (ADJ):Traverse level after level correction (AGC)

(decimal data) 12.9mV=3.3V ÷ 256 (8 bit)

CCR: Set value of FE offset coarse adjusting register TRCR: Set value of TE offset coarse adjusting register

(8 bit data in hex notation)

TRVSC: Traverse center value (9 bit data in hex notation) balance and used for CD only TRCR2: Set value of E-F balance coarse adjusting register (Fixed to 06 for SACD) CFR: Set value of traverse level adjusting register TRCR2 and CFR are registers in

RF amplifier

LBA

For CD: Average value/Maximum value of C1 and C2 For the SACD, 160 block data For SACD: Average value/Maximum value of PO, PI1 and PI2 except the data under tracking jump

SCD-XE670

Items Description Remarks

HENSHIN RYOU Eccentricity measurement For the CD only are measured

SPIN DOWN TIME (msec) Time from spindle brake application to rotation stop FG (IC901 pin ys) monitoring LOAD OUT TIME (msec) Time until loading table comes out from the state where a disc is in chuck Loading out switch HtL

Measured Data Reading Method:

To judge the check result, the measured data must be read.

1. When “AUTO CHECK OK” is displayed, rotate the [ AMS ] dial clockwise by 2 clicks.

2. When “13. DISP RSLT?” is displayed, press the [ AMS ] dial to enter.

3. “PLEASE WAIT” will be displayed and in several seconds, “13. DISP RESULT” will be displayed.

4. Rotate the [ AMS ] dial clockwise by 1 click, and the “LOAD IN” will be displayed.

5. Press the [ AMS ] dial to enter. The LOAD IN TIME measured value will be dsiplayed.

6. Compare the displayed value with the following specified value.

7. Hence, repeat step 4 to 6 (display is variable) and read the measured data respectively.

8. Compare the measured data with the specified value to check for NG item.

Note: Blank display of measured value means that an error occurred during the checking or no measurement was taken place.

Specified Value:

(1) SACD (Use the test disc SATD-S5 or SATD-S4)

Note: Measured values in check items are typical ones.

LOAD IN TIME (msec) : 2110 1300 to 2000 SPIN UP TIME (msec) : 1993 1800 to 2450 PF/VC/FE/TE AVRG (ORG) : 8E, E, 1E2, 12 RF: 91-C8, VC: 1F8-8, FE: 1D1-30, TE: 198-75 PF/VC/FE/TE AVRG (ADJ) : 9D, E, 6, 2 RF: 91-AF, VC : 1F8-8, FE: 1EE-12, TE: 1EA-16 PI/TRVS PP (ORG/ADJ) : 80, 129, 100, 90 PI ORG: 80-100, PI ADJ: 80-95, TRVS ORG: 53-118, TRVS ADJ: 45-132 PIOR/CCR/TRCR : 1B, 31, 1F No specified value given FOCUS/TRK GAIN : 29, 35 FOCUS: 1E-35, TRK: F-40 FBIAS/TRVSC/TRCR2 : 2FE, 14, 6 F.BIAS: 1E2-3A, TRVSC: 1E4-4D TRCR2: no specified value given READ TOC TIME (msec) : 1098 1350 to 2050 PSP AMPLITUDE : 2387 1450 to 2150 1/3 SEEK TIME : 2268581, 625121, <_>, 1446850

F) AVE/MIN/MAX (msec) : 926, 909, 938 AVE: 1150 msec or less, MAX: 1300 msec or less R) AVE/MIN/MAX (msec) : 919, 901, 937 AVE: 1150 msec or less, MAX: 1300 msec or less

1/MAX SEEK TIME : 2268581, 0, <_>, 2268581 F) AVE/MIN/MAX (msec) : 1846, 1819, 1879 AVE: 2250 msec or less, MAX: 2500 msec or less R) AVE/MIN/MAX (msec) : 1837, 1829, 1849 AVE: 2250 msec or less, MAX: 2500 msec or less

ERROR RATE PO MAX/AVE FRAME : 0, 0 MAX: 0, AVE: 0 PO MAX/AVE NUM : 480, 28 MAX: 1500 or less, AVE: 200 or less PI1 MAX/AVE FRAME : 0, 0 MAX: 0, AVE: 0 PI1 MAX/AVE NUM : 320, 11 MAX: 1500 or less, AVE: 200 or less PI2 MAX/AVE FRAME : 0, 0 MAX: 0, AVE: 0 PI2 MAX/AVE NUM : 41, 0 MAX: 1500 or less, AVE: 200 or less

SPIN DOWN TIME (msec) : 1312 1300 to 2100 LOAD OUT TIME (msec) : 1934 1300 to 1850

Eccentricity (actual eccentric amount) of disc, disc pulley total • Read by dividing by 10

• 0 may be displayed if eccentricity is small (10um or less) (Due to measurement reason)

Check items Specified value

* Items are not used in the

SATD-S5.

SCD-XE670

(2) CD (Use the test disc PATD-012 or YEDS-18)

Note: Measured values in check items are typical ones.

Check items Specified value

LOAD IN TIME (msec) : 2108 1300 to 2000 SPIN UP TIME (msec) : 1354 1300 to 1600 RF/VC/FE/TE AVRG (ORG) : 8E, D, 1E3, 12 RF: 91-C8, VC: 1F8-8, FE: 1D1-30, TE: 198-75 RF/VC/FE/TE AVRG (ADJ) : 9C, C, 6, 2 RF: 91-AF, VC: 1F8-8, FE: 1EE-12, TE: 1EA-16 PI/TRVS PP(ORG/ADJ) : 84, 128, 100, 90 PI ORG: 80-100, PI ADJ: 80-95, TRVS ORG: 55-155, TRVS-ADJ: 50-120 PIOR/CCR/TRCR : 1B, 11, 1E No specified value given FOCUS/TRK GAIN : 33, 28 FOCUS: 24-53, TRK: 1A-4E FBIAS/TRVSC/TRCR2 : 10, 0, 5 F.BIAS: 1D9-2A, TRVSC: 1E2-19 TRCR2: no specified value given MIN JITTER AT F.BIAS : 147 700 or less READ TOC TIME (msec) : 827 1150 to 3150 1/3 SEEK TIME : 311660, 103786, <_>, 207722

F) AVE/MIN/MAX (msec) : 794, 699, 908 AVE: 1200 msec or less, MAX: 1300 msec or less R) AVE/MIN/MAX (msec) : 824, 661, 920 AVE: 1200 msec or less, MAX: 1300 msec or less

1/MAX SEEK TIME : 311660, 0, <_>, 311660 F) AVE/MIN/MAX (msec) : 1991, 1964, 2015 AVE: 2200 msec or less, MAX: 2500 msec or less R) AVE/MIN/MAX (msec) : 1711, 1701, 1726 AVE: 2200 msec or less, MAX: 2500 msec or less

ERROR RATE C1 MAX/AVE : 3, 0 C1 MAX: 15 or less C2 MAX/AVE : 0, 0 C2 MAX: 0

HENSHIN RYOU (1/10um) : 168 800 or less (100 um or less) SPIN DOWN TIME (msec) : 1342 450 to 1500 LOAD OUT TIME (msec) : 1962 1300 to 1850

Note: RF, VC, FE, TE, FBIAS and TRVSC measured values are hexadecimal data with positive and negative signs. When comparing the measured

value with the specified value, refer to the following.

Hexadecimal (hex) display 9 bit data

FF 011111111 (+255)

FE 011111110 (+254)

01 000000001 (+1)

00 000000000 (0)

1FF 111111111 (-1)

101 100000001 (-255)

100 100000000 (-256)

MAX

(+) Side

(-) Side

MIN

Hexadecimal (hex) display 8 bit data

7F 01111111 (+127)

7E 01111110 (+126)

02 00000010 (+2)

01 00000001 (+1)

00 00000000 (0)

FF 11111111 (-1)

FE 11111110 (-2)

81 10000001 (-127)

80 10000000 (-128)

SCD-XE670

4-3. SACD (DL) DISC OPERATION CHECK

(• Perform as necessary) The stability of the set can be checked by repeating the combined operation of focus jump (layer 0t1, layer 1t0) and access to the most inward trackymost outward track by the set number of times or until an error occurs using the dual layer HD disc, DL disc. A set of operation including an access to the layer 0 (most inward track)tlayer 0 (most outward track)t focus jump (layer 0t1)tlayer 1 (most outward track)tlayer 1 (most inward track)tfocus jump (layer 1t0) is carried out repeatedly by the set number of times.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “92. SET CHECK” and press the [ AMS ] dial

to enter.

2. When “SET TEST START” is displayed, rotate the

[ AMS ] dial clockwise by 3 clicks to display “2.

F.JMP CHECK?”.

3. Press the [OPEN/CLOSE ] button to open the tray , and place

the DL disc.

4. Press the [ AMS ] dial to load the tray into the set.

5. “NOW SET UP” will be displayed and the DL disc setup will start. (It takes about ten and several seconds to set up the disc as two layers of layer 0 and layer 1 are adjusted)

6. At the completion of setup, “F.JUMP TIMES” will be displayed.

7. Rotate the [ AMS ] dial clockwise by 5 clicks to display

“5”. (If 5 sets of operation is executed *1)

8. Press the [ AMS ] dial, and the check will start.

9. Immediately when the check finished, “UP MAX

ssss”t“UP A VE ssss”t“DW MAX ssss”t“DW AVE ssss”t “F.JMP OK

[TIMES]”

will be displayed repeatedly. (s denotes the measured value in msec) UP MAX: Max time required for layer 0 (most inward

track)tlayer 0 (most outward track)tfocus jump (layer 0t1)

UP AVE: Average time required for layer 0 (most inward

track)tlayer 0 (most outward track)tfocus jump (layer 0t1)

DW MAX:Max time required for layer 1 (most outward

track)tlayer 1 (most inward track)tfocus jump (layer 1t0)

DW AVE: Average time required for layer 1 (most outward

track)tlayer 1 (most inward track)tfocus jump

(layer 1t0) Specified value: 7000 msec or less (if no error occurred) If an error occurred due to defocusing during the checking, refer to the following error list. (page 21)

10. Press the [OPEN/CLOSE ] button, and the disc will be ejected and the check will finish. Also, if the [ AMS ] dial is

pressed in step 9, “2. F.JUMP CHK OK” will be displayed. Then, if the [ AMS ] dial is again pressed, “2. F.JMP

CHECK” will be displayed instantaneously and a recheck is enabled from the step 5 in the same manner.

*1 Setting arbitrary number of times instead of 5 allows the check-

ing to be repeated by the set number of times. Also, setting 0 (zero) allows the aging check to be repeated until an error occurs.

4-4. HYBRID DISC OPERATION CHECK

(• Perform as necessary) This test checks the auto adjustment time required when the disc is switched between HD (SACD) layer and CD layer. This test is conducted to check the stability in switching from CD to SACD, or SACD to CD in the HYBRID disc. A set of operation including CD layer stop statetHD layer auto adjustmenttHD layer TOC readingtHD layer stop statetCD layer auto adjustmenttCD layer TOC readingtCD layer stop state is repeated by the set number of times.

Checking Method:

1. After setting the test mode, rotate the select “92. SET CHECK” and press the [ AMS ] dial

[ AMS ] dial to

to enter.

2. When “SET TEST START” is displayed, rotate the

[ AMS ] dial clockwise by 4 clicks to display “3.

HYB CHECK?”.

3. Press the [OPEN/CLOSE ] button to open the tray, and place

the HYBRID disc.

4. Press the [ AMS ] dial to load the tray into the set.

5. “NOW SET UP” will be displayed and the HYBRID disc setup will start. (It takes about several seconds to set up the disc *1)

6. At the completion of setup, “CHANGE TIMES?” will be displayed.

7. Rotate the [ AMS ] dial clockwise by 5 clicks to display

“5” (if 5 sets of operation is executed *2)

8. Press the [ AMS ] dial, and “STAR T” will be displayed

and the check will start. During the check, the following will be displayed. “CD—>HD” display: Time from switching from CD layer to

HD layer up to start of play is measured.

“HD—>CD” display: Time from switching from HD layer to

CD layer up to start of play is measured.

9. Immediately when the check finished, “CD MAX

ssss”t“CD A VE ssss”t“HD MAX ssss”t“HD A VE ssss” will be displayed

repeatedly. (s denotes the measured value in msec) Specified value: 10000 msec or less (if no error occurred) If an error occurred due to defocusing during the checking, refer to the following error list. (page 21)

10. Press the

[OPEN/CLOSE ] button, and the disc will be ejected

and the check will finish. Also, if the [ AMS ] dial is

pressed in step 9, “HYB CHK OK” will be displayed. Then, if

the [ AMS ] dial is again pressed, “HYBRID CHECK” will be displayed instantaneously and a recheck is enabled from the step 5 in the same manner.

*1 “NOW SET UP” display may continue for several minutes

and an error may be displayed depending on the discs. In this case, press the [ AMS ] dial again.

*2 Setting arbitrary number of times instead of 5 allows the check-

ing to be repeated by the set number of times. Also, setting 0 (zero) allows the aging check to be repeated until an error occurs

SCD-XE670

4-5 . AGING MODE

(• Perform as necessary) The aging can be performed to the set in the test mode. The aging can be continued by the set number of times or until an error occurs. In the aging, the following operations are repeated. Table turntDisc chuckingtDisc detectt Servo ontAuto adjustmenttTOC readingtPlay of first track for 5 secondtPlay of last track for 5 secondtPlay of first track for 5 secondtDisc unchucking

Setting Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “94. SET AGING” and press the [ AMS ] dial

to enter.

2. When “AGING TIMES” is displayed, rotate the [ AMS ]

dial to set the number of aging times. (For the number of times, every 10 times can be set. Setting 0 (zero) eliminates the count limitation where the aging is repeated until an error occurs)

Note: Do not perform unmanned overnight aging..

3. Press the [ AMS ] dial, and “A GING START” will be

displayed instantaneously, then “DISC IN & JOG ON” will be displayed and the tray will come out automatically.

4. Place a disc (CD or the SACD SL disc) on the tray, and press

the [ AMS ] dial to start the againg.

5. At the completion of aging by the set number of times, the tray will come out automatically and the check will stop. Typical time required for aging About 1 hour/100 times “AGING SUCCESS!” will be displayed if no error occurred in the aging, or the error will be displayed if an error occurred. (Refer to the following error list)

4-6. SHIPPING MODE

The repaired set must be initialized, and for this purpose the set should be set to the shipping mode.

Setting Method:

1. After setting the test mode, rotate the select “8d Set Up Init” and press the [ AMS ] dial to

[ AMS ] dial to

enter.

2. “8D 000000000 00” will be displayed, and if the scroll starts in the left direction, the set initialization has completed

3. Press the [POWER] button to turn the power off.

Note: Take care not to leave the test disc in the set.

The following setups are established in the SHIPPING MODE

1. Initialization of EEPROM (IC903)

• PLAY MODE ALL DISCS, CONTINUE

• COMMAND MODE CD1

• LAYER SELECT SACD

• M/2CH SELECT MULTI

• DIGITAL FILTER STD

• 2ch SPK MODE 2ch DIRECT

• Mch SPK MODEMch DIRECT

• Resetting the accumulated hours meter.

2. Chucking at the DISC1 position.

Error List

An error occurring during the check in the aging mode of the test mode is displayed automatically (scroll display) immediately when the error occurred.

< How to view the error history >

1. Select “95 DISP ERROR” with the [ AMS ] key, and press the [ AMS ] key once.

lL lL

2. The error that has occurred lastly in the set and the signal status (H = 1, L = 0) at that time are displayed on the FL display by scrolling. (Types of the errors and the signal status that can be checked, are the same as the error display of the aging mode.)

3. Press the [ AMS ] key once again to show the error history repeatedly.

4. When the error history is displayed with scrolling once, the mode returns to the normal test mode.

SCD-XE670

Error display is as follows. Error name, Disc type, IN SW (Sled in switch state), FOK (FOK signal state), LOCK (LOCK signal state), From (Displayed if effective), To (Displayed if effective), Aging times (Displayed in aging mode only) Display example ACCESS MOVE ERROR : SACDSL : IN SW 1 FOK 0 LOCK 0 : FROM 205663 : TO 2461601 : TIMES 5 (Error name) (Disc type) (Sled in switch, FOK, LOCK signal state) (Relative address) (Relative address)(Aging times)

Display Items List:

Display items Description Remarks

Error name tRefer to the error display list IN SW Sled in switch state when an error occurred

FOK FOK signal state when an error occurred

LOCK LOCK signal state when an error occurred.

From Displayed if effective in the error item Disc PSN (relative address) is

To Displayed if effective in the error item Disc PSN (relative address) is

0: switch off Not limit in 1: switch on Limit in (Optical pick-up is at most inward track)

FOK signal Is focus on? 0: FOK L (Focus off), 1: FOK H (Focus on)

LOCK signal Is PLL lock? 0: LOCK L Not lock, 1: LOCK H Lock

tRefer to the error display list displayed in case of access error

Error Display List:

Error display Error description Main causes of errors

DISC DETECT ERROR Disc type error Optical pick-up, RF amplifier or CD

OFFSET ADJUST ERROR Offset adjustment error Optical pick-up, RF amplifier or CD

FCS SRV ON ERROR Focus servo error From:1 means focus search failed

CLV SRV ON ERROR CLV servo error Defocusing E-F BALANCE ERROR E-F balance adjustment error Defocusing TRK SRV ON ERROR Tracking servo error Tracking servo on time out

SLD SRV ON ERROR Sled servo error Sled servo on time out FOCUS BIAS ERROR Focus bias adjustment failed Defocusing during adjustment

FCS AGC ERROR Error at focus gain automatic adjustment Defocusing during adjustment

TRK AGC ERROR Error at tracking gain automatic adjustment Defocusing during adjustment

ACCESS 1TJ ERROR Access Error at one-track jump Access failed

ACCESS FINE ERROR Access Error at fine search Access failed

ACCESS MOVE ERROR Access Error at M-track MOVE Access failed

WHILE PLAYING ERROR Error during disc playing Defocusing

FCS JUMP ERROR Time out error at focus jump Defocusing

MIRR measured time is displayed in From: DSP IC is faulty

DSP IC is faulty

An error code is displayed in From: From:2 means defocusing

Optical pick-up, RF amplifier or CD DSP IC is faulty

An error code is displayed in From: Description of display

An error code is displayed in From From:1 means retry failed 3 times From:2 means abnormal value Optical pick-up, RF amplifier or CD DSP IC is faulty

Optical pick-up, RF amplifier or CD DSP IC is faulty

Effective addresses (PSN) are displayed in From: and To: Defocusing at access, etc

Focusing retry failed

System errors are as follows.

Note: This error is not saved in the set.

Display Description

Toc Error * Error during the time from auto adjustment to TOC reading, Different type of disc (Such as a DVD disc), Disc is dirty Toc Error **** Illegal SACD (Such as a pirated version) Read Error Music data read error (Error during disc playing)

SCD-XE670

Center fo the waveform

Traverse waveform

4-7. WAVEFORMS CHECK

This set performs automatic adjustment for each disc, and therefore the set need not be adjusted when parts are replaced, but it requires checking following the description in this section, 4-1. IC AND FLUORESCENT DISPLAY TUBE CHECK and 4-2. AUTO CHECK. For the check, the test mode is used. Wrong setting causes a trouble, thus requiring extreme care.

BU Electrical Adjustment Mode

The BU electrical adjustment mode is used to check the S curve waveform, traverse waveform and RF waveform. After a disc is

placed on the tray, each time the

[ AMS ] dial is pressed,

the check mode is switched in order for S curve waveformt traverse waveformtRF waveform.

Setting Method:

After setting the test mode, rotate the [ AMS ] dial to select “9C BU DENCHO” and press the [ AMS ] dial to enter.

“BU MEASURE” will be displayed if the BU electrical adjustment mode becomes active.

S Curve Check

Connection:

oscilloscop

MAIN board

TP506 (FE)

TP504 (AVC)

+ –

Traverse Check

Connection:

oscilloscope

MAIN board

TP513 (TE)

TP504 (AVC)

–

Checking Method:

1. Under the condition of S curve waveform check mode in step 5, press the [ AMS ] dial.

2. After “WAIT” is displayed, the tra verse wa veform check mode will become active and “TRAVERSE MODE” will be displayed.

3. Connect an oscilloscope to the TP513 (TE) and TP504 (AVC) on the MAIN board.

4. Check that the level A and B of waveform on the oscilloscope satisfy the specification.

Specified Value:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

0.9 to 1.4 Vp-p –0.1 to +0.1V

Checking Method:

1. After setting the BU electrical adjustment, place the test disc (PATD-012 or SATD-S5 or SATD-S4) on the tray and close

[ AMS ] dial.

the tray, then press the

2. At the completion of disc type check, “CD DETECT” will be displayed (for PATD-012 or YEDS-18).

Note: For the SA TD-S5 or SATD-S4, “SACD DETECT“ is displayed.

3. Press again the [ AMS ] dial, and the S curve w aveform

check mode will become active and “S-CURVE MODE” will be displayed.

4. Connect an oscilloscope to the TP506 (FE) and TP504 (AVC) on the MAIN board.

5. Check that the level A and B of wavefor m on the oscilloscope satisfy the specification.

Specified V alue:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

S curve waveform

0.7 to 1.7 Vp-p –0.1 to +0.1V

Checking and Connecting Location : See page 25.

Note: For easier observation of this waveform, extend the sweep time

and raise the brightness.

Checking and Connecting Location : See page 25.

SCD-XE670

RF Level Check

Connection:

oscilloscope

MAIN board

TP703 (RFAC)

TP704 (AGND)

–

Checking Method:

1. Under the condition of traverse waveform check mode in step 4, press the [ AMS ] dial.

2. Connect an oscilloscope to the TP703 (RFAC) and TP704 (AGND) on the MAIN board.

3. After “WAIT” is displayed, the RF wa veform check mode will become active and “PLAY 5th TRACK” will be displayed, and the 5th music on the disc will be played.

4. Check that the RF waveform is clear and the level satisfies the specification.

5. Press the [ AMS ] dial, and “OUTSIDE TRA CK” will be

displayed and the outward track of the disc will be played.

6. Check that the RF waveform is clear and the level satisfies the specification.

7. Press the [ AMS ] dial, and “INSIDE TRACK” will be

displayed and the inward track of the disc will be played.

8. Check that the RF waveform is clear and the level satisfies the specification.

9. After checking, press the [ AMS ] dial, and the test is

over when “BU MEASURE” is displayed.

10. Press the [OPEN/CLOSE ] button to open the tray, and re-

move the test disc.

11. Using each type of disc, repeat from step 1 of S curve waveform check up to step 10 of RF level check.

12. When the check is over, press the

[POWER] button to turn the

power off.

Note: Take care not to leave the test disc in the set.

CLV Jitter Check (CD only)

Connection:

oscilloscop

MAIN board

TP516 (RFCK) TP517(WFCK)

TP808 (DG)

(CH1)

(CH2)

–

Checking Method:

1. Set the test mode.

2. Connect an oscilloscope to the TP516 (RFCK) (CH1), TP517 (WFCK) (CH2) and TP808 (DG) (GND) on the MAIN board.

3. Place the test disc PATD-012 or YEDS-18 on the tray, and close the tray.

4. Rotate the [ AMS ] dial to select “61 DISC DETECT”, and press the [ AMS ] dial to enter. Then, the disc type

will be judged.

5. Check that the disc type has been judged. (For the P ATD-012, “DSKMOD CD” will be displayed. Refer to the test mode, DISC DETECT command (page 13))

6. Rotate the [ AMS ] dial to select “86 ALL SRV ON”, and press the [ AMS ] dial. Then, the disc will rotate,

automatic adjustment will be carried out, and all servos will be turned on.

7. Rotate the [ AMS ] dial to select “07 DSP MON3”, and press the [ AMS ] dial to enter.

8. Check that the value A of waveform on the oscilloscope satisfies the specification.

9. Rotate the [ AMS ] dial to select “19 ALL SRV OFF”, and press the [ AMS ] dial. Then, all servos will be

turned off and the disc rotation will stop.

10. Press the

[OPEN/CLOSE ] button to open the tray, and re-

move the test disc.

11. Press the [POWER] button to turn the power off.

Note: Take care not to leave the test disc in the set.

Specified Value:

Disc A

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

RF signal waveform

Note: Clear RF waveform refers to the waveform where ◊ shapes should

be distinctively observed in the center.

0.9 to 1.4 Vp-p

VOLT/DIV: 200 m TIME/DIV: 500 ns

Checking and Connecting Location : See page 25.

Specified Value:

Disc A

PATD-012 or YEDS-18

CLV jitter waveform

35 µsec or less

Checking and Connecting Location : See page 25.

Checking and Connecting Location:

– MAIN Board (Component Side) –

TP704

TP506

(FE)

TP513

(TE)

TP504

(AVC)

IC509

(AGND)

TP516

(RFCK)

TP703

(RFAC)

SCD-XE670

IC703

TP808

(DG)

TP517

(WFCK)

IC701

IC801

2525

SCD-XE670

SECTION 5

DIAGRAMS

5-1. BLOCK DIAGRAM – RF/SERVO Section –

DETECTOR

OPTICAL PICK-UP

BLOCK

(KHM-230AAA)

LASER DIODE

(FOR CD)

LASER DIODE

(FOR SACD)

MODULE

CIRCUIT B+

CD LD

CD PD

DVD LD

DVD PD

VMOD

A B C D

SUMMING AMP

(+2.5V)

AUTOMATIC POWER

CONTROL (FOR CD)

AUTOMATIC POWER

CONTROL (FOR SACD)

B+ SWITCH

IC004 (1/4)

IC004 (2/4)

Q003

Q001

Q002, 005

CBA

A B C D

A +5V

3 4 5 6

16 15 14 13

DVDRFP

RFSIN

A2 B2 C2 D2

CD E

CD F

CD A CD B CD C CD D

CDLD

CDPD

DVDLD

DVDPD

MUX ATT

GCA,

GCA

MUX

DUAL

APC

ATOP

ATON

COMPARATOR MUX

+ –

GCA

L. P. F.

DETECTOR

PHASE

AIP

INPUT

BIAS,

AIN

AGC

CLAMP&

ENVELOPE

–

LEVEL DAC

GCA

SACD/CD RF AMP,

FOCUS/TRACKING ERROR AMP

PROGRAMMABLE

DIFFERENTIATOR

IC001

EQ FILTER

+ –

L. P. F.

+ –

+ +

OFFSET

CANCEL

OFFSET

CANCEL

OFFSET

CANCEL

BOTTOM

ENVELOPE

DIP

DIN

FULL WAVE

RECTIFER

AGC

CHARGE PUMP

SERIAL

BUFFER

BOTTOM

FNP

535254

FNN

AGCO

SEL

SUB GCA

L. P. F.

AGCO

PORT

GCA

MUX

INPUT

PEAK/

HOLD

RFAC

SDATA

SCLK SDEN

MEVO

MIN

MIRR

LDON

RFAC

(Page 27)

• SIGNAL PATH

: SACD PLAY

: CD PLAY

SDATA, SCLK, SDEN

A+3.3V

D+5V

47 46 48 42MNTR

SDATA

SCLK

SDEN

PI ERROR AMP

IC004 (3/4)

FE/PI

PIFETE

AVC

(+1.65V)

DRVC

(+2.5V)

AVC BUFFER

IC004 (4/4)

DRVC BUFFER

IC503

TE, FE

LDON

VMOD

(Page 28)

(Page 27)

(Page 28)

2AXIS DEVICE FOCUS/

TRACKING

COIL

FCS+ FCS–

TRK+ TRK–

(SLED)

(SPINDLE)

M151

(LOADING)

40 41 39 43

FOCUS/TRACKING COIL DRIVER,

SLED MOTOR DRIVER

IC502

12 5 11 6

14 2 13 3

17 24 18 23

8 9

6 5

FOCUS COIL

DRIVE

TRACKING COIL

DRIVE

SLED MOTOR

DRIVE

SPINDLE MOTOR

DRIVE

LOADING MOTOR

DRIVE

STBY1

STBY2

16 17

SPINDLE/LOADING MOTOR DRIVE

IC512

BUFFER

MUTE2

MUTE1

21 22

MUTE 2D

SP ON

MUTE LOAD

LOAD OUT

LOAD IN

SPDA

FJMP2

FJMP1

FFDR

FRDR

TFDR

TRDR

SFDR

SRDR

DIGITAL SERVO

PROCESSOR

IC509 (1/2)

PWM GENERATOR

FOCUS/TRACKING/SLED

RFDC

A/D

CONVERTER

FOCUS

TRACKING/SLED

SERVO DSP

SSTP

D+3.3V

DFCT, FOK

DETECTOR

SERVO

INTERFACE

SERVO AUTO

SEQUENCER

TO CPU INTERFACE

(LIMIT)

FOK

MIRR

DFCT

COUT SCLK

FOK, MIRR,

FOK

MIRR

20 21

COUT

SCLK

MUTE 2D, SP ON, MUTE LOAD

COUT, SCLK

LIM SW

SPDA, FJMP1/2

SPIN

LOAD IN/OUT

(Page 28)

(Page 27)

(Page 28)

2626

5-2. BLOCK DIAGRAM – SERVO Section –

SCD-XE670

(Page 26)

(Page 28)

RFAC

SPIN

LDON

SPDA, FJMP1/2

D0 – D7

A0 – A2

XHRD, XHWR

DVC

(+1.65V)

49 48

CPU

IC901 (1/3)

LDON

DATA BUS

ADDRESS BUS

CENTER VOLTAGE

GENERATOR

IC703 (2/2)

DIGITAL SIGNAL

PROCESSOR

IC509 (2/2)

RFAC

ASYMMETRY CORRECTOR

ASYI ASYO

FCS JMP 1

FCS JMP 2

7 8

FJMP1

FJMP2

A+3.3V

FILTER

53 55 52 54 12

FILI

PCO

FILO

CLTV

XPCK

DIGITAL PLL

TO SERVO AUTO

SEQUENCER

DIGITAL CLV PROCESSOR

LOCK

MDP

25 4 6 5 7 15 79 80 76 77 10 11 13

LOCK CD

SPDA

APDO

43 44 64 58 85 84 12 22 23

SPDA

APDO

CPU INTERFACE

DATA

SENS

XLAT

CLOK

26 37 27 9 34 33 35 71

LAT CD

DATA CD

CLOK CD

JIT

GFS DVD

JIT

INTEGRATOR

IC703 (1/2)

DEMODULATOR

PROCESSOR

SBSO

SCOR

SENS CD

XRD

XWR

XHRD

XHWR

XCS

EFM

SUBCODE

SQSO

EXCK

SUBQ

XCS DVD

INIT0 DVD

XINT0

XINT1

SQCK

WFCK

RFCK

XQCK

A0 – A7 D0 – D7

INIT1 DVD

89 – 96 14 – 21

INTERNAL BUS

EMPH

GFS

GFS CD

C4M

32K

RAM

ERROR

CORRECTOR

DATA BUS

ADDRESS BUS

RFAC

D+3.3V

6916

XTSL

CLOCK

GENERATOR

D/A

DIGITAL

INTERFACE

MUTE

RFIN

117

ASSYMMETRY

DASYO

ASF1

ASF2

111

113 114 115

FILTER

XHRD XHWR XCS

XINT0

XINT1

DASYI

DIGITAL

OUT

XTAO

XTAI

PCMD

LRCK C2PO

WDCK

DOUT

MD2

DOCTRL

PLL

D0 – D7

A0 – A7

5, 7, 9 – 14 172 – 176, 1, 2, 4

XRD

XWR

XCS

XINT0

XINT1

XWAIT

107

GFS

109

APEO

72 71

BCK

67 65 14 17

XRST

DEMODULATOR

AUTHENTICATION

XRST CD

MUTE CD

FFM

CPU

INTERFACE,

DMA

CONTROLLER

XTL2

XTAL

169167

SPINDLE MOTOR DRIVE

IC708 (2/2)

ANALOG

MIXER

BUFFER

IC708 (1/2)

66 – 69, 71,

2 – 5, 7 – 10

XTL1

170

138

142 144 140

135

MDB0 – MDB7

73 – 75

MDIN1

MDSOUT MDPOUT

CLVS

SPO

MDIN2

SPINDLE

CONRTOL

MAIN DATA ECC & EDC

MDB8, MDB9,

MDBA – MDBF

96, 97, 99, 101,

102, 104 – 106

41 – 44, 46 – 49

D-RAM

IC706

WFCK

SCOR

SBSO

EXCK

147148150151137 153 146 155 163 158 160 164

WFCK

SCOR

SBIN

EXCK

CD DSP INTERFACE

SYNC

CONTROL

DVD-ROM CD-ROM

DESCRAMBLE

(PRIORITY RESOLVE & SEQUENCER)

MA0 – MA9

79, 80, 82 – 87,

89, 91

21 – 24, 27 – 32

A0 – A9I/O8 – I/O15I/O0 – I/O7

XRCI

GSCOR

C2PO

LRCK

BCLK

DEINTERLEAVE & ECC

DMA CONTROLLER

XCAS

UCAS

MDAT

SUBCODE

XRAS

RAS

LCAS

XMWR

171835

XRST CD, MUTE CD

MA10/MNT1

XMOE

3334

MDAT

BCLK LRCK

XRST DVD

XRST

INTERFACE

DDAT

MA11/MNT2

WPK

SACD DECODER

CD ESP

DAC

DLRC

DBCK

162

157159939294767895

IC701

PACKET FIFO

DMA FIFO

ATAPI

• SIGNAL PATH

768FS (33.8688MHz)

MDAT, BCLK, LRCK

OPTICAL

TRANSCEIVER

IC309

XRST CD, MUTE CD, XRST DVD

HDB0 – HDB7

HDB8

HDB9

HDBA – HDBF

HA0 – HA2

HOST INTERFACE

HDRQ

REDY

HCS0 HCS1 XHRD

XHWR

XHAC XHRS

HINT

DIGITAL (CD) OUT OPTICAL

SD0 – SD7

32, 30, 27, 24

44, 41, 39, 35,

26 29

40, 43, 45

31, 34, 37,

59, 56, 60

XSAK

46 51 54 62 63

XSHD

XDCK

XSAQ

53 23

: SACD PLAY

: CD PLAY (ANALOG OUT)

: CD PLAY (DIGITAL OUT)

SDEF

XSAK, XSHD, XDCK, XSAQ

WPK

XTAL

(Page 28)

(Page 29)

(Page 28)

2727

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