Sony SCDXA-3000-ES Service manual

SCD-XA3000ES

SERVICE MANUAL

Ver. 1.1 2005.05

SPECIFICATIONS

AEP Model

Korean Model

Model Name Using Similar Mechanism SCD-XB780 CD Mechanism Type CDM66B-DVBU6B Base Unit Name DVBU-6B Optical Pick-up Name KHM-234AMA

When a super audio CD is played

Playing frequency range 2 Hz to 100 kHz Frequency response 2 Hz to 50 kHz (–3 dB) Dynamic range 105 dB or more Total harmonic distortion rate

Wow and flutter Value of measurable limit (±0.001 %

When a CD is played

Frequency response 2 Hz to 20 kHz Dynamic range 99 dB or more Total harmonic distortion rate

Wow and flutter Value of measurable limit (±0.001 %

0.0017 % or less

W. PEAK) or less

0.0019 % or less

W. PEAK) or less

Output connector

Jack type

Output level

Phono

ANALOG OUT

DIGITAL (CD) OUT OPTICAL*

DIGITAL (CD) OUT COAXIAL*

PHONES

*Output only the audio signals of the CD

jacks Square

optical output connector

Coaxial output connector

Stereo phone jack

2 Vrms (at 50 kilohms)

–18 dBm

0.5 Vp-p

10 mW

Load impedance

Over 10 kilohms

Light emitting wave length:

( )

660 nm

75 ohms

32 ohms

General

Laser Semiconductor laser

Laser radiant power: 5.47 uW at 650 nm

*These output is the value measured at a distance of about 200mm from the objective lens surface on the optical pick-up.

Power requirements AEP model: 230 V AC, 50/60 Hz

Power consumption 24 W Dimensions (w/h/d) 430 × 124 × 390 mm incl. projecting

Mass (approx.) 8.2 kg

Supplied accessories

• Audio connecting cord phono jack×2 (Red and White) ↔ phono jack×2 (Red and White) (2) phono jack×1 (Black) ↔ phono jack×1 (Black) (2)

• Remote commander RM-SX700 (1)

• R06 (size-AA) batteries (2)

Design and specifications are subject to change without notice.

(Super Audio CD: λ = 650 nm) (CD: λ = 780 nm) Emission duration: continuous

Korean model: 220 V AC, 60 Hz

parts

9-961-016-02 Sony Corporation

2005E05-1 Audio Group C 2005.05 Published by Sony Engineering Corporation

SUPER AUDIO CD PLAYER

SCD-XA3000ES

Notes on chip component replacement

•Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

SCD-XA3000ES

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 9

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 11

3-2. Case ................................................................................. 11

3-3. Loading Panel Assy......................................................... 12

3-4. Mechanism Deck (CDM66B-DVBU6B) ....................... 12

3-5. AUDIO Board ................................................................. 13

3-6. MAIN Board ................................................................... 13

3-7. POWER Board ................................................................ 14

3-8. Front Panel Assy ............................................................. 14

3-9. Base Unit (DVBU-6B).................................................... 15

4. TEST MODE.............................................................. 16

5. DIAGRAMS

5-1. Block Diagram – RF/SERVO Section – ........................ 24

5-2. Block Diagram – SERVO Section –.............................. 25

5-3. Block Diagram – MAIN Section – ................................ 26

5-4. Block Diagram – AUDIO Section – .............................. 27

5-5. Block Diagram – DISPLAY/KEY CONTROL/

POWER SUPPLY Section – ........................................... 28

5-6. Notes for Printed Wiring Boards and

Schematic Diagrams ....................................................... 29

5-7. Printed Wiring Boards – RF Section – .......................... 30

5-8. Schematic Diagram – RF Section –............................... 31

5-9. Printed Wiring Board

– MAIN Section (Component Side) – ............................ 32

5-10. Printed Wiring Board

– MAIN Section (Conductor Side) –.............................. 33

5-11. Schematic Diagram – MAIN Section (1/5) – ................ 34

5-12. Schematic Diagram – MAIN Section (2/5) – ................ 35

5-13. Schematic Diagram – MAIN Section (3/5) – ................ 36

5-14. Schematic Diagram – MAIN Section (4/5) – ................ 37

5-15. Schematic Diagram – MAIN Section (5/5) – ................ 38

5-16. Schematic Diagr am – AUDIO Section – ....................... 39

5-17. Printed Wiring Board

– AUDIO Section (Component Side) – .......................... 40

5-18. Printed Wiring Board

– AUDIO Section (Conductor Side) – ............................ 41

5-19. Printed Wiring Boards – PANEL Section – .................. 42

5-20. Schematic Diagr am – PANEL Section –....................... 43

5-21. Printed Wiring Board

– POWER Section (Component Side) –......................... 44

5-22. Printed Wiring Board

– POWER Section (Conductor Side) –........................... 45

5-23. Printed Wiring Boards

– AC Section (Component Side) –.................................. 46

5-24. Printed Wiring Boards

– AC Section (Conductor Side) – ................................... 47

5-25. Schematic Diagr am – POWER Section – ..................... 48

5-26. Printed Wiring Board – HP Section – ........................... 49

5-27. Schematic Diagram – HP Section – .............................. 49

5-28. IC Pin Function Description ........................................... 57

6. EXPLODED VIEWS

6-1. Overall Section................................................................ 69

6-2. Front Panel Section-1...................................................... 70

6-3. Front Panel Section-2...................................................... 71

6-4. Chassis Section-1 ............................................................ 72

6-5. Chassis Section-2 ............................................................ 73

6-6. Mechanism Deck Section (CDM66B-DVBU6B) .......... 74

6-7. Base Unit Section (DVBU-6B) ....................................... 75

7. ELECTRICAL PARTS LIST ............................... 76

SCD-XA3000ES

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objectiv e lens.

CLEANING OF OPTICAL PICK-UP LENS

In cleaning the lens of optical pick-up, use the air blower. Never use a cotton swab for cleaning the lens of optical pick-up, which otherwise causes a trouble.

HOW TO OPEN THE LOADING PANEL ASSY WHEN POWER SWITCH IS OFF

cam (66)

Pull out the loading panel assy.

Rotate the cam (66) with a screw driver.

NOTE FOR INSTRUCTION

• When installing two wires (flat type) (19 core) as shown in the figure.

SCD-XA3000ES

two wires (flat type) (19 core)

CN701 CN702

audio board

CN302CN303

main board

OK NG

• When installing the cables from power transformers as shown in the figure.

audio board

CN302CN303

CN701 CN702

main board

Primary power cables and secondary power cables should not contact.

power board

AC board

power transformer (T991)

power transformer (T990)

SCD-XA3000ES

SERVICE POSITION

– Mechanism deck –

– Display board –

mechanism deck

RF board (CN005)

connect jig (J-2501-068-A) to main board (CN708) and RF board (CN005).

main board (CN708)

connect jig (J-2501-242-A) to main board (CN706) and key board.

display board

front panel section

main board (CN706)

key-A board (CN801)

– Main board, Audio board –

main board

Note: Be careful not to connect with the mistaken connector.

audio board

CN302 CN303

CN701

CN702

connect jig (J-2501-086-A) to main board (CN701, 702) and audio board (CN302, 303).

audio board (CN302)

audio board (CN303)

main board (CN702)

main board (CN701)

SCD-XA3000ES

RESETTING OPERATION AT POWER ON

If the power is turned on with a disc loaded in the set, a sequence of operation as shown below will be performed. (The operation varies depending on the type of disc) Condition: continue mode

(1) CD

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for CD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

(2) SACD (single layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

(3) SACD (dual layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on (layer 0)

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment (layer 0)

12. Tracking & sled servo on (layer 0)

13. Focus bias auto adjustment (layer 0)

14. Focus servo gain auto adjustment (layer 0)

15. Tracking servo gain auto adjustment (layer 0)

16. Jump to lead-in area

17. Read TOC

18. Focus jump (layer 0tlayer 1)

19. E-F balance auto adjustment (layer 1)

20. Tracking & sled servo on (layer 1)

21. Focus bias auto adjustment (layer 1)

22. Focus servo gain auto adjustment (layer 1)

23. Tracking servo gain auto adjustment (layer 1)

24. Focus Jump (layer 1tlayer 0)

25. Stop

Front Panel Parts

qa MENU

Press to enter the menu. Press to exit from the menu and return to the normal display.

qs MULTI/2CH button

Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.

qd Remote sensor qf Display window

Shows various information.

qg . AMS > dial (AMS: Automatic Music Sensor)

Descriptions

POWER

PHONES

PHONE LEVEL

MIN MAX

TIME/TEXT

SCD-XA3000ES

SECTION 2

GENERAL

MULTI/2CH

SACD/CD

This section is extracted from instruction manual.

AMS

PUSH ENTER

1 POWER switch

Press to turn on the player.

2 TIME/TEXT button

Each time you press the button, the playing time of the track, the total remaining time on the disc, or TEXT information appears in the display.

3 SACD/CD button

Each time you press the button while playing back a hybrid disc, the layer to be played back switches between the HD (Super Audio CD) layer and the CD layer.

4 Disc tray

Press A OPEN/CLOSE to open/close the disc tray.

Rear Panel Parts Descriptions

ANALOG

2CH OUT 5. 1CH OUT

FRONT

SURROUND CENTER

5 A OPEN/CLOSE button

Press to open the disc tray.

6 H button

Press to start play.

7 X button

Press to pause play.

8 x button

Press to stop play.

9 PHONES

Connect the headphones. During playback of a Multi-channel Super Audio CD, the same signal that is output from the ANALOG

5.1CH FRONT L/R jacks is output from the PHONES jack.

0 PHONE LEVEL

Adjust the headphones volume.

DIGITAL(CD)

OUT

COAXIAL OPTICAL

SUB

WOOFER

When you turn the . AMS > dial counterclockwise by one click, you go back to the preceding track; when you turn the . AMS > dial clockwise by one click, you go to the succeeding track.

1 ANALOG 2CH OUT L/R jacks

Connect to an audio component (stereo/2 channel) using the audio connecting cord.

2 ANALOG 5.1CH OUT jacks

Connect to an amplifier equipped with the 5.1CH input jacks (Multi-channel amplifier, AV amplifier, etc.) using the audio connecting cords.

3 DIGITAL (CD) OUT COAXIAL connector

Connect to an audio component using the coaxial digital cable.

4 DIGITAL (CD) OUT OPTICAL connector

Connect to an audio component using an optical digital cable.

Note

Only the audio signals of the CD can be output from the DIGITAL (CD) OUT connectors shown in 3 and 4. Those of the Super Audio CD cannot be output through DIGITAL (CD) OUT.

SCD-XA3000ES

Remote Parts Descriptions

1 CONTINUE button

Press to resume normal play from Shuffle Play or Programme Play.

SHUFFLE button

Press to select Shuffle Play.

PROGRAM button

Press to select Programme Play.

2 DISPLAY MODE button

Press to turn off the information.

3 TIME/TEXT button

Each time you press the button, the playing time of the track, the total remaining time on the disc, or TEXT information appears in the display.

4 Number buttons

Press to enter the track numbers.

10 button

Press to locate a track numbered over 10.

6 REPEAT button

Press repeatedly to play all tracks or only one track on the disc.

7 AyB button

Press to select Repeat A-B Play.

8 H button

Press to start play.

X button

Press to pause play.

x button

Press to stop play.

9 AMS ./> (AMS: Automatic Music Sensor)

buttons

Press to locate a specific track.

0 m/M buttons

Press to locate a portion you want to play within a track.

qa INDEX >/. buttons

Press to locate a specific point marked with an index signal when you play a disc that has index signals.

qs SACD/CD button

Each time you press the button while playing back a hybrid disc, the layer to be played back switches between the HD (Super Audio CD) layer and the CD layer.

qd MULTI/2CH button

Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.

qf ENTER button

Press to decide the selection.

qg CLEAR button

Press to delete a programmed track number.

qh LEVEL ADJ button

Press to adjust the output level balance for the Multichannel management function.

qj CHECK button

Press to check the programmed order.

PLAY MODE

CONTINUE SHUFFLE

PROGRAM

DISPLAY/

SACD/CD

MODE

TIME/TEXT

MULTI/2CH

123

456

>10 ENTER

10/0

REPEAT

CLEAR

CHECK

LEVEL

ADJ

AMS

INDEX

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET

3-2. CASE

(Page 11)

SCD-XA3000ES

SECTION 3

DISASSEMBLY

3-3. LOADING PANEL ASSY

(Page 12)

3-4. MECHANISM DECK

(CDM66B-DVBU6B) (Page 12)

3-9. BASE UNIT

(DVBU-6B) (Page 15)

Note: Follow the disassembly procedure in the numerical order given.

3-8. FRONT PANEL ASSY

(Page 14)

3-7. POWER BOARD

(Page 14)

3-2. CASE

case

3-5. AUDIO BOARD

(Page 13)

3-6. MAIN BOARD

(Page 13)

two screws (TP)

screw (TP)

two screws (TP)

SCD-XA3000ES

3-3. LOADING PANEL ASSY

loading panel assy

four claws

cam (66)

3-4. MECHANISM DECK

(CDM66B-DVBU6B)

mechanism deck (CDM66B-DVBU6B)

three screws (BVTT3

Rotate the cam (66) with a screw driver in the direction of arrow A.

wire (flat type) (30 core) (CN708)

connector (CN703)

3-5. AUDIO BOARD

two wires (flat type) (19 core) (CN302, 303)

screw (BVTT3

two connectors (CN308, 313)

connector (CN312)

screw (BVTT3

SCD-XA3000ES

connector (CN311)

two connectors (CN305, 307)

screw (BVTT3

harness

connector (CN306)

connector (CN310)

screw (BVTT3

3-6. MAIN BOARD

connector (CN703)

harness

screw (BVTT3

harness

three screws (BV/ring)

audio board

wire (flat type) (30 core) (CN708)

wire (flat type) (11 core) (CN706)

two screws (BVTT3

main board

two connectors (CN704, 707)

screw (BVTT3 × 8)

harness

SCD-XA3000ES

3-7. POWER BOARD

two connectors (CN912, 923)

two screws (PTTWH3

harness

two connectors (CN901, 992)

connector (CN900)

two connectors (CN952, 960)

two screws (PTTWH3

two connectors (CN940, 951)

power board

screw (PTTWH3

connector (CN307)

3-8. FRONT PANEL ASSY

two wire holders

two screws (BVTT3

lead wire

connector (CN993)

connector (CN900)

connector (CN306)

wire (flat type) (11 core) (CN706)

connector (CN305)

front panel assy

five screws (BV/ring)

lead wire

two wire holders

screw (BVTT3

harness

3-9. BASE UNIT (DVBU-6B)

)

– BOTTOM VIEW –

cam (66)

base unit (DVBU-6B)

SCD-XA3000ES

floating screw (DIA. 12)

base unit (DVBU-6B

SCD-XA3000ES

SECTION 4

TEST MODE

In this set, various checks are automatically performed by executing the commands in the test mode.

Note: This set makes adjustment every optical pick-up and stores its result

in the EEPROM (IC903) on the MAIN board. Accor dingly, if a combination of optical pick-up and EEPROM is changed, be sure to perform 4-3. SET CHECK. Also, perform 4-1. IC INTERFACE CHECK, 4-2. DISPLA Y CHECK, and 4-6. WAVEFORMS CHECK.

Disc for Test Mode

Various checks of this set require the following discs.

Model Type *1 Category Application

MODEL SATD-S5 (J-2501-215-A) SL SATD-S4 Optical waveform check (J-2501-184-A)

Not specified DL 12 cm disc Operation check PATD-012

(4-225-203-01) YEDS-18 Reference disc (3-702-101-01)

Not specified HYBRID 12 cm disc Operation check

12 cm disc Reference disc

12 cm disc

Adjusted value check, Operation check,

Adjusted value check, Operation check, Optical waveform check

Setting Method of Test Mode

Turn the dial and the [MENU] button. Release the [MENU] button and the

[ AMS ] dial in this order when “DIAG MODE” is displayed

on the fluorescent indicator tube.

Releasing Method of Test Mode

To release the test mode, turn the [POWER] switch off.

Selection/Entry of Test Mode

To select and enter the “DIAG MODE”, operate as follows.

1. Rotate the [ AMS ] dial to select the menu, and press

2. The test is switched on or off alternately each time the

3. To return to the previous step, rotate the [ AMS ] dial

*1 SL: Single Layer

DL: Dual Layer

Test Mode Command List

The contents of test mode are as follows.

Note: Wrong operation in the test mode causes a trouble, thus requiring extreme care.

[POWER] button on while pressing the [ AMS ]

the [ AMS ] dial to enter.

[ AMS ] dial is pressed.

to select the desired item, and press the [ AMS ] dial

to enter.

LINE command (0X): Use mainly for a manufacturing line.

No. Name Description Remarks

00 RFAmp Read Each register set value of the IC001 (RF AMP) is displayed via RS-232C Not used for the servicing 05 DSP MON1 XUGF, XPCK, C2PO outputted from IC509 (CD DSP) Not used for the servicing 06 DSP MON2 MNT0, MNT1, MNT2, MNT3 outputted from IC509 (CD DSP) Not used for the servicing

07 DSP MON3 RFCK, XPCK, XROF, GTOP outputted from IC509 (CD DSP)

Electrical measurement, CD CLV jitter measurement

STANDARD command (1X): Use when the servo is applied by manual operation.

No. Name Description Remarks

12 LD ON/OFF The laser diode is turned on or off On or off are switched alternately 13 SPIN ON/OFF The spindle motor is rotated with the regulated voltage On or off are switched alternately 14 FSRV ON/OFF The focus servo is turned on or off On or off are switched alternately 15 TSRV ON/OFF The tracking servo is turned on or off On or off are switched alternately

16 CLV ON/OFF

17 SSRV ON/OFF

18 ALL SRV ON All servos are turned on 19 ALL SRV OFF All servos are turned off Stop command in the test mode

The spindle SLV servo is turned on or off Focus and tracking servos must be already turned on

The sled servo is turned on or off Focus, tracking and spindle servos must be already turned on

On or off are switched alternately

FOCUS command (2X): Focus related. (All servos must be already turned on (except command 21))

No. Name Description Remarks

21 FSRCH ON/OFF

22 F-BIAS UP Increase focus bias Focus bias value 23 F-BIAS DOWN Decrease focus bias Focus bias value

24 ADJ FCSBIAS

25 FGAIN UP/DW The focus servo gain is switched between normal and down Normal or down are switched alternately 27 FOCUS AGC The focus servo gain is adjusted automatically

The continuous vertical motion of the optical pick-up lens is turned on or Avoid a long-time use off On or off are switched alternately

The focus bias is adjusted automatically Both + and - directions are searched to search for best jitter point

OFFSET (PI, FE, TE) command (3X): Adjusts the offset of PI, FE and TE signals.

No. Name Description Remarks

31 PI/FE OFSET

Adjusts the offset of PI, FE and TE signals TE offset adjustment is executed for the CD This adjustment must be executed after 61 DISC DETECT only

SCD-XA3000ES

TRACKING command (4X): Tracking servo related.

No. Name Description Remarks

41 TGAIN NM/UP The tracking servo gain is switched between normal and up Normal or up are switched alternately 44 ADJ TRK DSP The traverse AGC and E-F balance adjustment is performed 45 TRACKING AGC The tracking servo gain is adjusted automatically

SEARCH command (5X): Track search related. (Nos. 51 through 53 are not used for the servicing.)

No. Name Description Remarks

51 1-TRCK JUMP One-track jump is performed 52 FINE SEARCH Fine search is performed 53 M-TRCK MOVE M-track movement is performed

DISC DETECT command (6X): Disc type check related.

No. Name Description Remarks

Disc type check is executed Display after judgment

61 DISC DETECT

62 CD SETTING Enter disc type CD setting CD forced setting 63 SL SETTING Enter disc type SL setting SL forced setting 64 DL SETTING Enter disc type DL setting DL forced setting 6F Download Not used for the servicing

DSKMOD CD: Judged as CD Refer to how to apply servo by manual DSKMOD SL: Judged as SACD (SL) operation (See page 18) DSKMOD DL: Judged as SACD (DL) DSKMOD HYB: Judged as HYBRID

LASER command (7X): Laser of optical pick-up related.

No. Name Description Remarks

7A ADDTIME CD

7B ADDTIME HD

7C FJUMP TEST Not used for the servicing

Cumulative light emission time of the laser for CD is displayed (Initialized by 8D command)

Cumulative light emission time of the laser for SACD is displayed (Initialized by 8D command)

TOOLS command (8X): Performs aging, reads adjusting parameters, etc.

No. Name Description Remarks

81 VERSION Firmware version is displayed Example: Ver 1.00 83 TRAY AGING Tray open-close aging is performed Not used for the servicing 87 DISP ADJ DT Automatic adjusting parameters are displayed via RS-232C Not used for the servicing 8A FL CHECK Display of fluorescent indicator tube and keys are checked

8D SETUP MODE

Set to factory shipping mode Set when repair completed PLAY MODE, etc. are initialized Refer to 4-5. SHIPPING MODE (See page 21)

QA command (9X)

No. Name Description Remarks

91 FJUMP CHECK The focus jump is checked Not used for the servicing 92 SET CHECK The set is checked Refer to 4-3. SET CHECK (See page 19) 93 WATER MARK Not used for the servicing

94 SET AGING

95 FJMP CHK BU The focus jump is checked (for jig) Not used for the servicing 9A MIRR MES For measurement of mirror offset value Not used for the servicing

9C BU DENCHO

9D PLAY&RFD ON

9E RFD ON/OFF

The set aging is performed Repeat by the specified number of times or until an error occurred

The S curve waveform, traverse waveform, and RF waveform can be Refer to 4-6.WAVEFORMS CHECK checked successively (See page 21)

SACD playback, RFD output SACD jitter measuring mode

RFD output is turned on or off SACD jitter measuring mode

Not used for the servicing

IC command (AX)

No. Name Description Remarks

A0 IC SELF CHK Each IC and its communication are checked Normal or up are switched alternately

SCD-XA3000ES

How to Apply Servo by Manual Operation

In analyzing failures of the set, the servo may be applied by manual operation. To apply servo in the test mode, use the following method.

1. After setting the test mode, rotate the [ AMS ] dial to select a command, and press the [ AMS ] dial to enter .

2. “61 DISC DETECT” (Disc type check)t“18 ALL SRV ON” (All servos on + auto adjustment)

3. If applying servo while checking the condition one by one, “61 DISC DETECT” (Disc type check)t“31 PI/FE OFSET” (Offset automatic adjustment)t“14 FSRV ON/OFF” (Focus servo on)t“16 CLV ON/OFF” (CLV servo on)t“44 ADJ TRK DSP ” (E-F balance adjustment)t“15 TSRV ON/OFF” (Tracking servo on)t“17 SSRV ON/OFF” (Sled servo on)t“24 ADJ FCSBIAS” (Focus bias adjustment)t“27 FOCUS AGC” (Focus auto gain adjustment)t “45 TRACKING AGC” (Tracking auto gain adjustment).

Note: 1. On and off are alternately switched in the same command.

2. For a stop, select “19 ALL SR V OFF” and press the [ AMS ] dial.

4-1. IC INTERFACE CHECK

The communication between microcomputer and main ICs is checked.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “A0. IC SELF CHECK” and press the [ AMS ]

dial to enter.

2. A checking will start automatically. (Checking time is about 3 seconds)

3. At successful completion of check, “IC CHECK OK” is displayed. In this case, no error exists in the IC interface.

Note: The check mentioned above tests the communication from micro-

computer to main ICs. Even if the check successfully finished, the IC to be checked is not always normal. Consider it for reference only.

4. In case of an IC communication error, the following display will be given during the checking. Possible causes of error are as listed below.

Error display Causes (typical example)

DVD DEC. ERROR 1. IC701 (SACD decoder) is faulty

DVD DRAM ERR 1. IC706 (D-RAM) is faulty

CD DSP ERROR 1. IC509 (CD DSP) is faulty

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin ts (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

3. 768fs (33.8688 MHz) is not present to IC701 pin <znm (XTAL)

• IC811 (3-multiplying circuit) is faulty

• Clock signal 256fs is not sent from AUDIO board (CN701 pin qg)

• CN702 pin 6 (GND) and pin 7 (+3.3V-D) are open or shorted

• CN701, 702 and FFC connection is loose, or FFC is disconnected

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin ts (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

3. Faulty communication line between IC701 and IC706

•Data line, address line, WE, etc.

4. D903 (1SS367) is faulty D+3.3V is not present to IC706

2. 768fs (33.8688 MHz) is not present to

IC509 pin ua (XTAL)

Same as cause 3 of DVD DEC. ERROR

3. IC509 pin 2 (XRST) does not go “H”

• IC901 pin ts (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

Error display Causes (typical example)

EEPROM ERROR 1. IC903 (EEPROM) is faulty SAMBA DRAM ERR 1. IC808 (D-RAM) is faulty

(DSD decoder is also 2. IC801 (DSD decoder) is faulty checked) 3. 768fs (33.8688 MHz) is not present to

RF AMP ERROR 1. IC001 (RF AMP) is faulty

SD BUS ERROR 1. IC701 SD bus and IC801 AV decoder

IC801 pin qa (MCKI)

Same as cause 3 of DVD DEC. ERROR

4. IC801 pin 9 (XRST) does not go “H”

• IC901 pin ts (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

5. Faulty communication line between IC801 and IC808

•Data line, address line, WE, etc.

6. D904 (1SS367) is faulty D+3.3V is not present to IC808

2. Loose connection between CN708 on MAIN board and CN005 on RF board, or FFC disconnection CN708 pin qj (CLK RF), pin qh (DATA RF) and pin qg (SDEN) must be checked

interface is faulty

2. IC812 to 814 are faulty

Causes Common to Each IC:

1. Faulty communication line between microcomputer and each IC. Disconnected patterns, floating series resistors, bridge, etc.

2. Faulty IC supply voltage. Particularly, check D+3.3V voltage.

3. Faulty microcomputer communication port to each IC

Note: In case of more than two errors, the error display is switched over

one after another, thus making the reading difficult. In such a case, press again the [ AMS ] dial to make a recheck for error reading.

4-2. DISPLAY CHECK

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “8A. FL CHECK” and press the [ AMS ] dial to

enter.

2. Respective segments of fluorescent indicator tube will automatically light up in order, and therefore check that there is no chipped character.

3. The “INPUT REMOCON” will be displayed after the segment check finished successfully, and then press a proper key on the remote commander.

4. After “JOG CHECK” is displayed, the numbers of calendar will be displayed from 1 to 15 each time the [ AMS ]

dial is rotated clockwise.

5. After display up to 15, the numbers of calendar will disappear in order each time the [ AMS ] dial is

rotated counterclockwise.

6. “TTX-1514?” will be displayed when all are cleared, and then press the [ AMS ] dial.

7. Upon display of “KEY CHECK”, if a key on the display is pressed, the corresponding segment of fluorescent indicator tube will light up.

Note: The keys include the [ AMS ] dial. If the segment that

corresponds to the pressed key does not light up, that key is faulty.

8. Press the [POWER] button to turn the power off.

SCD-XA3000ES

4-3. SET CHECK (AUTOMATIC VARIOUS MEASUREMENTS)

The operational stability of the set is checked. The check and OK/NG judgment are performed automatically.

Note: In the set check using the CD, besides a checking, the MIRR time used for the disc check is measured every optical pick-up, and from the measured

result, the threshold value is calculated and it is stored in the EEPROM (IC903) on the MAIN board. Accordingly, if a combination of optical pickup and EEPROM is changed (for example, the optical pick-up or MAIN board is replaced), be sure to perform the set check using the following CD. As the data stored in the EEPROM are overwritten every set check, retry if failed. For the set check using the SACD, only checking is made.

Set Check

92. SET CHECK AUTO CHECK SP?

The set check is executed to judge OK or NG. (For the CD, the threshold value is stored in the EEPROM)

AUTO CHECK?

DISP RESULT S?

DISP RESULT F?

CHECH END?

The set check of measurement only is executed.

The measured result is displayed via RS-232C.

The measured result is displayed on the fluorescent indicator tube.

The set check is finished.

CD and SACD (SL) Disc Operation Check

Checking method:

1. After setting the test mode, rotate the [ AMS ] dial to select “SET CHECK” and press the [ AMS ] dial to enter.

2. Upon display of “AUTO CHECK SP?”, further press the [ AMS ] dial.

3. The tray will open automatically, and then set the test disc*1 of CD or SACD.

4. With the “DISC IN&JOG ON” displayed, press the [ AMS ] dial, and the check will be executed automatically.

5. “SPEC OK!” will be displayed if the measured result is within the specification. Faulty item name and the measured result will be displayed if any measured item is NG.

6. After that, “AUTO CHECK SP?” will be again displayed, and then rotate the [ AMS ] dial to select “CHECK END?”. Further, press the [ AMS ] dial, and the test mode selection display will be back, and then press the A button and take the test disc out.

*1 Use PATD-012 or YEDS-18 for CD, and SATD-S5 or SATD-S4 for SACD (SL). Using another disc will result in a checking failure.

Measured Items:

Items Description Remarks

RF/VC/FE/TE (ORG) RF (8 bit data in hex notation) RF: A0h

RF/VC/FE/TE (ADJ)

PI/TRVS PP (ORG/ADJ) TRVS PP (ORG): Traverse level before level correction (AGC) Traverse level conversion

PIOR/CCR/TRCR CCR: Set value of FE offset coarse adjusting register

FOCUS/TRK GAIN

FBIAS/TRVSC/TRCR2/CFR

PSP AMPLITUDE SACD only 1-LAST TRK SEEK (msec) Average seek time from first track to last track of disc

ERROR RATE For CD: Average value/Maximum value of C1 and C2

Offset values before RF (PI), VC, FE, TE signal offset adjustment At offset 0

VC, FE, TE (9 bit data in hex notation) VC, FE, TE: 00h Offset values after RF (PI), VC, FE, TE signal offset adjustment VC offset is not adjusted

(Less than ORG value if offset correction is normal) (Measurement only) RF (8 bit data in hex notation) Also, for SACD, the TE offset is VC, FE, TE (9 bit data in hex notation) not measured and adjusted

PI (ORG): PI value at disc type check (decimal data) PI level conversion PI (ADJ): PI value after PI offset adjustment Read value × 12.9mV

TRVS PP (ADJ):Traverse level after level correction (AGC)

PIOR: Set value of PI offset coarse adjusting register Registers in RF amplifier

TRCR: Set value of TE offset coarse adjusting register Auto gain adjusted values of focus and tracking servos

(8 bit data in hex notation) FBIAS: Focus bias set value (9 bit data in hex notation)

TRVSC: Traverse center value (9 bit data in hex notation) TRCR2: Set value of E-F balance coarse adjusting register CFR: Set value of traverse level adjusting register

Error rate measurement

For SACD: Average value/Maximum value of PO, PI1 and PI2

(read value at microcomputer A/D) (decimal data)

(decimal data) Read value × 12.9mV

(decimal data) 12.9mV=3.3V ÷ 256 (8 bit)

TRCR2 adjusts the E-F gain balance and used for CD only (Fixed to 06 for SACD) TRCR2 and CFR are registers in RF amplifier

For the CD, Measure for 7 sec at track No.5 For the SACD, calculation from 100block data at track No.5

SCD-XA3000ES

Specified Value:

Specified value used for OK/NG judgment when executing 92. SET CHECKtAUTO CHECK SP?

Measured Items Specified value

RF AVRG (ADJ) 8Ch to ABh VC AVRG (ADJ) 1F7h to09h

FE AVRG (ADJ)

TE AVRG (ADJ) 1E2h to 1Eh TRVS PP (ADJ) 45h to 73h FCS GAIN 10h to 60h TRK GAIN 10h to 60h

ERROR RATE C2 0

PSP AMPLITUDE (SACD onl y) 1000 to 4000 1-LAST TRK SEK 3500 or less

Note: The specified values attached with “h” are hexadecimal numbers, and others are decimal numbers.

RF, VC, FE, and TE measured values are hexadecimal data with positive and negative signs. When comparing the measured value with the specified value, refer to the following.

(1) CD 1EEh to 12h (2) SACD 1F1h to 0Fh

(1) CD

(2) SACD

C1 20 or less

PI1 NUM 100 or less PI1 FRAME 5 or less

Hexadecimal (hex) display 9 bit data

FF 011111111 (+255) FE 011111110 (+254)

01 000000001 (+1) 00 000000000 (0) 1FF 111111111 (-1)

101 100000001 (-255) 100 100000000 (-256)

MAX

(+) Side

(-) Side

MIN

Hexadecimal (hex) display 8 bit data

7F 01111111 (+127) 7E 01111110 (+126)

02 00000010 (+2) 01 00000001 (+1) 00 00000000 (0) FF 11111111 (-1) FE 11111110 (-2)

81 10000001 (-127) 80 10000000 (-128)

SCD-XA3000ES

4-4. SACD (DL) DISC OPERATION CHECK

(• Perform as necessary) This checking performs the focus jump using a DL disc, which is a dual-layer HD disc, to verify the stability of the set. A set of layer 0 most-outside track access (only once)tone-second tracetfocus jump (layer 0t1)tone-second tracetfocus jump (layer 1t0) are repeated 5 times.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “91 FJUMP CHECK” and press the [ AMS ] dial

to enter.

2. The tray will open automatically, and then set the DL disc.

3. With “DISC IN&JOG ON” displayed, press the [ AMS ]

dial.

4. The tray will be loaded in automatically, and then the test will start.

5. During the test, “NOW TESTiiii” is displayed.

6. Upon successful completion of the check, “OK!” will be displayed and the tray will open automatically. (In case of NG, “NG! ERR FJ-UP” or “NG! ERR FJ-DWN” is displayed)

7. Take the DL disc out and press the A button, and the test mode selection display will be back

4-5. SHIPPING MODE

The repaired set must be initialized, and for this purpose the set should be set to the shipping mode.

Setting Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “8D SETUP MODE” and press the [ AMS ] dial

to enter.

2. “INITIAL OK” is displayed and the test mode selection display will be back immediately.

“8D 000000000 00” will be displayed, and if the scroll starts in

the left direction, the set initialization has completed

3. Press the

[POWER] button to turn the power off.

The following setups are established in the shipping mode

1. Initialization of EEPROM (IC903)

• PLAY MODE CONTINUE

• LAYER SELECT SACD

• M/2CH SELECT MULTI

• 2ch SPK MODE 2ch DIRECT

• Mch SPK MODE Mch DIRECT

• Resetting the cumulative light emission time of the laser

Note: Even if the shipment mode setting mentioned above is made, the

disc check threshold value attained in the 3. SET CHECK is not cleared.

2. The optical pick-up moves to the home position (most-inside track)

Error List

Display Description

Toc Error * Error during the time from auto adjustment to TOC

Toc Error **** Illegal SACD (Such as a pirated version)

reading, Different type of disc (Such as a DVD disc), Disc is dirty

4-6. WAVEFORMS CHECK BU Electrical Adjustment Mode

The BU electrical adjustment mode is used to check the S curve waveform, traverse waveform, RF wa veform, and CL V jitter . After a disc is placed on the tray, each time the [ AMS ] dial is

pressed, the check mode is switched in order for S curve waveformt tra verse wa veformtRF waveformtCLV jitter (for the CD).

S Curve Check

Connection:

oscilloscop

MAIN board

TP506 (FE)

TP504 (AVC)

+ –

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to

select “9C. BU DENCHO” and press the A button. Place the test disc (PATD-012 or YEDS-18 or SATD-S5 or SATD-S4) on the tray and close the tray, then press the [ AMS ]

dial.

2. At the completion of disc type check, “CD DETECT” will be displayed (for PATD-012 or YEDS-18).

Note: For the SATD-S5 or SATD-S4, “SL DETECT” is displayed.

3. Press again the [ AMS ] dial, and the S curve waveform

check mode will become active and “S-CURVE MODE” will be displayed.

4. Connect an oscilloscope to the TP506 (FE) and TP504 (AVC) on the MAIN board.

5. Check that the level A and B of waveform on the oscilloscope satisfy the specification.

Specified Value:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

S curve waveform

Note: For easier observation of this waveform, extend the sweep time

and raise the brightness.

0.7 to 1.7 Vp-p –0.1 to +0.1V

Checking and Connecting Location : See page 23.

SCD-XA3000ES

Traverse Check

Connection:

oscilloscope

MAIN board

TP513 (TE)

TP504 (AVC)

+ –

Checking Method:

1. Under the condition of S curve waveform check mode in step 5, press the [ AMS ] dial.

2. After “W AIT” is displayed, the tra verse wav eform check mode will become active and “TRV MODE ON” will be displayed.

3. Connect an oscilloscope to the TP513 (TE) and TP504 (AVC) on the MAIN board.

4. Check that the level A and B of waveform on the oscillo- scope satisfy the specification.

Specified Value:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

Traverse waveform

0.9 to 1.4 Vp-p –0.1 to +0.1V

Center of the waveform

Checking and Connecting Location : See page 23.

RF Level Check

Connection:

oscilloscope

MAIN board

TP703 (RFAC)

TP704 (AGND)

+ –

Checking Method:

1. Under the condition of traverse wavefor m check mode in step 4, press the [ AMS ] dial.

2. Connect an oscilloscope to the TP703 (RFAC) and TP704 (AGND) on the MAIN board.

3. After “W AIT” is displayed, the RF wa veform check mode will become active and “PLAY 5th TRACK” (for the SACD, “RF MODE ON”) will be displayed, and the 5th music on the disc will be played.

4. Check that the RF waveform is clear and the lev el satisfies the specification.

5. Press the [ AMS ] dial (for the SACD, “RF JITTER

(5th)” will be displayed, and further press the AMS dial), and “OUTSIDE TRACK” will be displayed and the outward track of the disc will be played.

6. Check that the RF waveform is clear and the lev el satisfies the specification.

7. Press the [ AMS ] dial, and “INSIDE TRACK” will be

displayed and the inward track of the disc will be played.

8. Check that the RF waveform is clear and the lev el satisfies the specification.

9. After checking, press the [ AMS ] dial, and the test is

over when “BU MEASURE” is displayed.

10. Press the A button to open the tray , and remov e the test disc.

11. Using each type of disc, repeat from step 1 of S curve waveform check up to step 10 of RF level check.

12. When the check is over , press the

[POWER] button to turn the

power off.

Note: Take care not to leave the test disc in the set.

Specified Value:

Disc A

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

RF signal waveform

Note: Clear RF waveform refers to the waveform where ◊ shapes should

be distinctively observed in the center.

0.9 to 1.4 Vp-p

VOLT/DIV: 200 m TIME/DIV: 500 ns

Checking and Connecting Location : See page 23.

CLV Jitter Check (CD only)

Connection:

oscilloscop

MAIN board

TP516 (RFCK) TP517(WFCK)

TP808 (DG)

(CH1)

(CH2)

+ –

Checking Method:

Under the condition of RF level check mode in step 3, connect the oscilloscope to the TP516 (RFCK) (CH1), TP517 (WFCK) (CH2), and the TP808 (DG) (GND) on the MAIN board to check that the value A of the waveform satisfies the specification.

Note: Take care not to leave the test disc in the set.

Specified V alue:

Disc A

PATD-012 or YEDS-18

CLV jitter waveform

35 µsec or less

SCD-XA3000ES

Checking and Connecting Location:

– MAIN Board (Component Side) –

TP506

(FE)

TP513

(TE)

TP504

(AVC)

IC509

TP704

(AGND)

TP514

(RFCK)

TP517

(WFCK)

TP703

(RFAC)

IC701

IC703

TP808 (DG)

IC801

2323

SCD-XA3000ES

SECTION 5

DIAGRAMS

5-1. BLOCK DIAGRAM – RF/SERVO Section –

DETECTOR

OPTICAL PICK-UP

BLOCK

(KHM-234AMA)

MODULE CIRCUIT

DEVICE FOCUS/

TRACKING

(Page 25)

2AXIS

COIL

DVD LD

CD LD

DVD/CD PD

DVD VR

CD VR

FCS+ FCS–

TRK+ TRK–

SP ERR

A B C D

CONTROL SWITCH

(+2.5V)

PHOTO DIODE

(FOR SACD)

Q005

PHOTO DIODE

(FOR CD)

Q004

(SLED)

(SPINDLE)

M151

(LOADING)

SUMMING AMP

IC004 (1/4)

SUMMING AMP

IC004 (2/4)

AUTOMATIC POWER

CONTROL (FOR SACD)

Q001

AUTOMATIC POWER CONTROL (FOR CD)

Q003

DVDPDSW

FOCUS/TRACKING COIL DRIVE,

12 5 11 6

14 2 13 3

17 24 18 23

CBA

A B C D

CDPDSW

SLED MOTOR DRIVE

IC502

FOCUS COIL

DRIVE

TRACKING COIL

DRIVE

SLED MOTOR

DRIVE

SPINDLE MOTOR

DRIVE

3 4 5 6

16 15 14 13

23 24

DVDRFP

RFSIN

A2 B2 C2 D2

CD E

CD F

CD A CD B CD C CD D

DVDLD

CDLD

DVDPD

CDPD

STBY1

STBY2

MUX ATT

GCA,

GCA

MUX

DUAL

APC

27 26

IC512

DRIVE

AIP

AIN

PHASE

DETECTOR

+ +

1 241 2

ATON

ATOP

COMPARATOR MUX

+ –

GCA

L. P. F.

TRACKING COIL DRIVE

CONTROL SWITCH

IC501

SPINDLE/LOADING MOTOR DRIVE

SPINDLE MOTOR

LOADING MOTOR

INPUT

BIAS,

AGC

+ –

SACD/CD RF AMP,

FOCUS/TRACKING ERROR AMP

16 17

CLAMP&

ENVELOPE

LEVEL DAC

GCA

IC001

BUFFER

PROGRAMMABLE

DIFFERENTIATOR

MUTE2

MUTE1

EQ FILTER

AGCO

+ –

L. P. F.

+ –

+ +

TRACKING COIL DRIVE

SEL

SUB GCA

L. P. F.

CONTROL SWITCH

IC505

MUTE 2D

SP ON

MUTE LOAD

LOAD OUT

LOAD IN

FNP

FNN

AGCO

535254

OFFSET

CANCEL

OFFSET

CANCEL

OFFSET

CANCEL

BOTTOM

ENVELOPE

F JMP1

F JMP2

SPDA

DIP

DIN

FULL WAVE

RECTIFER

CHARGE PUMP

FFDR

FRDR

TFDR

TRDR

SFDR

SRDR

AGC

SERIAL

PORT

GCA

MUX

INPUT

BUFFER

PEAK/

BOTTOM

HOLD

DIGITAL SERVO

PROCESSOR

IC509 (1/2)

FOCUS/TRACKING/SLED

RFAC

TE TE

SDATA

SCLK SDEN

MEVO

MIN

MIRR

LDON

PWM GENERATOR

SDATA

47 46 48 42MNTR

PI ERROR AMP

40 41 39 43

A/D

CONVERTER

FOCUS

TRACKING/SLED

SERVO DSP

D+3.3V

SCLK

SDEN

IC004 (3/4)

RFDC

SSTP

PIFETE

DFCT, FOK

DETECTOR

SERVO

INTERFACE

SERVO AUTO

SEQUENCER

TO CPU INTERFACE

(LIMIT)

FOK

MIRR

DFCT

COUT SCLK

RFAC

(Page 25)

• SIGNAL PATH

: SACD PLAY

: CD PLAY

TE, FE, PI

SDATA, SCLK, SDEN

22 20 21

FOK

MIRR

COUT SCLK

AVC

(+1.65V)

WAVRB

DRVC

(+2.5V)

AVC BUFFER

IC004 (4/4)

WAVRB BUFFER

IC503 (1/2)

DRVC BUFFER

IC503 (2/2)

MUTE 2D, SP ON, MUTE LOAD

A+3.3V

D+5V

LDON

DVDPDSW, CDPDSW

TRKSW

FOK, MIRR,

COUT, SCLK

LIM SW

SPDA, F JMP1/2

SPIN

LOAD IN/OUT

(Page 26)

(Page 25)

(Page 26)

(Page 25)

(Page 26)

2424

5-2. BLOCK DIAGRAM – SERVO Section –

SCD-XA3000ES

(Page 24)

(Page 26)

RFAC

SPIN

LDON

SP ERR

SPDA, F JMP1/2

D0 – D7

XHRD, XHWR

DVC

(+1.65V)

CPU

IC901 (1/3)

LD ON

100

ADDRESS BUS

DVC BUFFER

IC703 (2/2)

DIGITAL SIGNAL

PROCESSOR

RFAC

ASYI

ASYO

SP ERR

DATA BUS

IC509 (2/2)

ASYMMETRY

CORRECTOR

FCS JMP1

FCS JMP2

7 8

F JMP1

F JMP2

A+3.3V

FILTER

53 55 52 54 12

FILI

PCO

FILO

CLTV

XPCK

DIGITAL PLL

TO SERVO AUTO

SEQUENCER

DIGITAL CLV PROCESSOR

LOCK

MDP

25 4 6 5 7 15 79 80 76 77 10 11 13

LOCK CD

SPDA

APDO

43 44 64 58 85 84 12 22 23

SPDA

CPU INTERFACE

DATA

SENS

XLAT

CLOK

34 35 36 9 26 33 37 71

XLAT CD

DATA CD

CLOK CD

JITTER

GFS DVD

INTEGRATOR

IC703 (1/2)

DEMODULATOR

PROCESSOR

SBSO

SCOR

SENS CD

SCOR CD

XRD

XWR

XHRD

XHWR

XCS

EFM

SUBCODE

SQSO

EXCK

SQSO CD

XCS DVD

INIT0 DVD

XINT0

XINT1

SQCK

WFCK

RFCK

SQCK CD

A0 – A7 D0 – D7

INIT1 DVD

89 – 96 14 – 21

INTERNAL BUS

EMPH

GFS

GFS CD

C4M

32K

RAM

ERROR

CORRECTOR

DATA BUS

ADDRESS BUS

RFAC

D+3.3V

6916

XTSL

CLOCK

GENERATOR

D/A

DIGITAL

INTERFACE

MUTE

RFIN

117

ASSYMMETRY

DASYO

ASF1

ASF2

111

113 114 115

FILTER

XHRD XHWR XCS

XINT0

XINT1

DASYI

DIGITAL

OUT

MD2

XTAO

XTAI

PCMD

BCK LRCK C2PO

WDCK

DOUT

XRST

DOCTRL

PLL

D0 – D7

A0 – A7

5, 7, 9 – 14 172 – 176, 1, 2, 4

XRD

XWR

XCS

XINT0

XINT1

XWAIT

107

GFS

109

APEO

72 71

66 67 65 14 17

XRST CD

MUTE CD

IC708 (1/2)

FFM

DEMODULATOR

CPU

INTERFACE,

DMA

CONTROLLER

AUTHENTICATION

XTL2

XTAL

169167

SPINDLE MOTOR DRIVE

IC708 (2/2)

138

ANALOG

BUFFER

XTL1

170

MIXER

142 144 140

135

66 – 69, 71,

2 – 5, 7 – 10

MDIN1

MDSOUT MDPOUT

CLVS

SPO

MDB0 – MDB7

73 – 75

MDIN2

SPINDLE

CONRTOL

MAIN DATA ECC & EDC

DVD-ROM CD-ROM

MDB8, MDB9,

MDBA – MDBF

96, 97, 99, 101,

102, 104 – 106

41 – 44, 46 – 49

D-RAM

IC706

WFCK

SCOR

SBSO

EXCK

147148150151137 153 146 155 163 158 160 164

WFCK

SCOR

SBIN

EXCK

XRCI

GSCOR

C2PO

LRCK

CD DSP INTERFACE

SYNC

CONTROL

DESCRAMBLE

DMA CONTROLLER

(PRIORITY RESOLVE & SEQUENCER)

MA0 – MA9

79, 80, 82 – 87,

89, 91

21 – 24, 27 – 32

A0 – A9I/O8 – I/O15I/O0 – I/O7

BCLK

MDAT

SUBCODE

DEINTERLEAVE & ECC

XRAS

XMWR

MA10/MNT1

XMOE

XCAS

3334

171835

RAS

LCAS

UCAS

MDAT

BCLK LRCK

XRST DVD

XRST

INTERFACE

MA11/MNT2

SACD DECODER

CD ESP

DAC

DBCK

DLRC

DDAT

162

157159939294767895

WAVE SHAPER

Q602

IC701

DMA

FIFO

ATAPI

PACKET FIFO

OPTICAL

TRANSCEIVER

IC601

XRST CD, MUTE CD, XRST DVD

HDB0 – HDB7

HDB8

HDB9

HDBA – HDBF

HOST INTERFACE

• SIGNAL PATH

: SACD PLAY

: CD PLAY (ANALOG)

: CD PLAY (DIGITAL OUT)

768FS (33.8688MHz)

MDAT, BCLK, LRCK

44, 41, 39, 35,

26 29

31, 34, 37,

HA0 – HA2

XSAK

REDY

HINT

HCS0

HCS1

XSHD

XDCK

XSRQ

XHRS

DIGITAL (CD) OUT OPTICAL

J602

DIGITAL (CD) OUT COAXIAL

SD0 – SD7

32, 30, 27, 24

40, 43, 45

59, 56, 60

XSAK

XSHD XDCK XSRQ

SDEF

XSAK, XSHD, XDCK, XSRQ

WPK

XTAL

(Page 26)

(Page 27)

(Page 26)

2525

SCD-XA3000ES

5-3. BLOCK DIAGRAM – MAIN Section –

(Page 24)

(Page 25)

SDATA, SCLK, SDEN

FOK, MIRR, COUT, SCLK

TE, FE, PI

REAC

WPK

SDEF

XASK, XSHD, XDCK, XSRQ

SD0 – SD7

XSAK

XSHD

XDCK

XSRQ

LEVEL SHIFT

IC813

2 18

3 17

5 15

LEVEL SHIFT

IC814

LEVEL SHIFT

A1 – A8

2 – 9

IC812

D-RAM

IC808

B1 – B8

DQ0 – DQ7

11 – 18

2, 3, 5, 6,

8, 9, 11, 12

126 WARFI

123

WCK

168

SDEF

167

XSAK

165

XSHD

SDCK

166

164

XSRQ

169 – 176

SD0 – SD7

134 – 131

139 – 136,

DSD DECODER

IC801

DSALS

MSDATO

MSDATI

XMSLAT

SMUTE

MSREADY

DQ0 – DQ7A0 – A11

DSAL

66DSAR 74 76DSARS 69DSAC 71DSASW

61PHREFI 59BCKAI

MCKI

11 12

6 4

MSCK

3 2

3-MULTIPLYING

IC811

13 1

10 4

9 5

SDATAL

SDATAR

SDATALS

SDATARS

SDATAC

SDATALF

2 3

64FS

128FS

• SIGNAL PATH

: SACD PLAY

256FS

SDATAL, SDATAR, SDATALS, SDATARS,

SDEN

SDATA SCLK

FOK MIRR COUT SCLK

TE FE

X901

20MHz

DATA RF

CLK RF

FOK CD

MIRR RF

COUT CD

SCLK CD

66PIPI

40 XTAL

41 EXTAL

SIN DSD

SOUT DSD

SCK DSD

XLAT DSD

MUTE DSD

RDY DSD LATCH DF

98 97

INIT DF

CPU

IC901 (2/3)

LOAD IN

LOAD OUT

IN SW

OUT SW

EEPSIO

EEPSCL

XRST

XCS IO

XDIS IO

45 46

78 79

LOAD IN

LOAD OUT

S152

(LOADING IN)

S151

(LOADING OUT)

SDA

5 6

SCL

EEPROM

IC903

RESET SIGNAL

GENERATOR

IC905

64FS

FS64

128FS

SDEN

XCS

RST

FS128

XRD

XWR

ZEROL ZEROR

LMUTE RMUTE

5YO

D0 – D7

12 – 16, 19 – 21

22A

10 11

38 37

34MULTI

XHRD

XHWR

ZEROL

ZEROR

LMUTE

RMUTE

SDATAC, SDATALF, 64FS

DATA BUS

LOAD IN/OUT

D0 – D7

XHRD, XHWR

ZEROL, ZEROR

LMUTE, RMUTE

MULTI

(Page 27)

(Page 24)

(Page 25)

(Page 27)

(Page 25)

(Page 24)

(Page 25)

XTAL

768FS (33.8688MHz)

MUTE 2D, SP ON, MUTE LOAD

XRST CD, MUTE CD, XRST DVD

20, 19

A0 – A11

21 – 24, 27 – 32,

CAS

RAS

CKE

34 35CLK DCLK

152, 151, 149, 148

162 – 159, 157 – 154,

XCAS

144

XRAS

145

XWE

143

DCKE

142 141

ZDFL ZDFR

TEST1

XRST

MUT 2D6SP ON1MUT LOAD

DATA

CLK

LATCH

INIT

63 65

115

SP ON

MUTE 2D

MUTE LOAD

MUTE CD

XRST DVD XRST CD

42 ZDFL 43 ZDFR

36 ISBTEST 25

RST DSD

RST DVD

RST CD

RST DP

PROGRAMMABLE

LOGIC DEVICE

IC904

DVDPDSW

CDPDSW

DVDPDSW

33 23

44LIM SW

CDPDSW

1TRKSW

XRST DP

DATA, CLK,

LATCH, INIT

DVDPDSW, CDPDSW

TRKSW

LIMSW

(Page 28)

(Page 27)

(Page 24)

2626

5-4. BLOCK DIAGRAM – AUDIO Section –

HEADPHONE

AMP

IC308 (1/2)

RV601

PHONE LEVEL

SCD-XA3000ES

R-CH

J601

PHONES

(Page 26)

(Page 25)

(Page 26)

SDATAL, SDATR, SDATALS, SDATARS, SDATAC, SDATALF, 64FS

MDAT, LRCK, BCLK

ZEROL, ZEROR

256FS

SDATAL

SDATAR

SDATALS SDATARS

SDATAC SDATALF

64FS

MDAT LRCK BCLK

DSD1

DSD3

DSD2

DSD4

DSD5

DSD6

DSD7

DSD8

DBCK

PDATA1

PDATA2

PLRCK

PBCK

LOW-PASS FILTER

CLOCK BUFFER

IC304

65 3

DSD

INTERFACE

PCM

INTERFACE

DIGITAL FILTER,

D/A CONVERTER,

IC301

DSD

FILTER

PCM

FILTER

ZERO

DETECT

ZERO17ZERO2

ZEROL

ZEROR

ENHANCED

MULTI LEVEL

DELTA-SIGMA

MODULATOR

SYSTEM

CLOCK

PSCK34DSCK

D/A

CONVERTER

FUNCTION CONTROL

MDIMCMS

2 4 3 36

DATA

CLK

LATCH

OUTPUT

AMP &

LOW-PASS

FILTER

XRST

INIT

VOUT3 VOUT1

VOUT4 VOUT2

VOUT5 VOUT6

VOUT7 VOUT8

MUTING

Q403

10 12

31 30

29 28

MIX AMP

IC315 (2/2)

R-CH R-CH

R-CH

ANALOG

LOW-PASS

FILTER

IC305 (2/2)

ANALOG

LOW-PASS

FILTER

IC306 (2/2)

MUTING

Q401

MUTING

Q421

R-CH

MUTING

Q402

MUTING

Q422

R-CH

J301

J302

CENTER

ANALOG 2CH OUT

FRONT

SURROUND

ANALOG

5.1CH OUT

(Page 26)

DATA, CLK, LATCH, INIT

LMUTE, RMUTE

MULTI

X301

11.2895MHz

ANALOG

LOW-PASS

FILTER

IC307

MUTING

CONTROL

SWITCH

Q301

LMUTE

R-CH

MUTING

CONTROL

SWITCH

Q304

RMUTE

MUTING

Q441

MUTING

Q541

MUTING

CONTROL

SWITCH

Q303

MUTING

Q442

MUTING

Q542

• R-ch is omitted due to same as L-ch.

• SIGNAL PATH

: SACD PLAY

: CD PLAY (ANALOG)

SUB WOOFER

2727

+ 63 hidden pages

Sony SCDXA-3000-ES Service manual

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

3-1. DISASSEMBLY FLOW

3-2. CASE

DISASSEMBLY

3-3. LOADING PANEL ASSY

mechanism deck (CDM66B-DVBU6B)

3-5. AUDIO BOARD

3-6. MAIN BOARD

3-7. POWER BOARD

3-8. FRONT PANEL ASSY

3-9. BASE UNIT (DVBU-6B)

TEST MODE

DIAGRAMS

5-1. BLOCK DIAGRAM – RF/SERVO Section –

5-2. BLOCK DIAGRAM – SERVO Section –

5-3. BLOCK DIAGRAM – MAIN Section –

5-4. BLOCK DIAGRAM – AUDIO Section –