5-12. IC Pin Function Description ........................................... 31
6.EXPLODED VIEWS
6-1. General Section ............................................................... 39
6-2. MAIN Board Section ...................................................... 40
7.ELECTRICAL PARTS LIST ............................... 41
Other features
•Compact size, light weight.
•Skip-proof: you can enjoy uninterrupted enjoyment of music during physical activities such as
jogging or commuting.
•Approximately 10 hours of continuous playback with a rechargeable nickel hydride battery.
•Recordable time: up to 60 min., 80 min., 120 min.**, on the supplied 64MB “MagicGate Memory
Stick.”
•Backlight LCD screen: song titles and artist names can be displayed.
•High speed data transfer using the supplied USB cable.
•OpenMG Jukebox software enables you to record compact discs using the ATRAC3 format
(high sound quality, high compression) to the hard drive.
* The copyright protection technology of Network Walkman conforms to the SDMI (Secure Digital Music
Initiative) specifications.
**Differs according to the bit rate when recording. In this case, the figures for the recordable time are when
recording on a 64MB “MagicGate Memory Stick” at 132kbps, 105kbps, and 66kbps.
NOTES:
• The recorded music is limited to private use only. Use of the music beyond this limit requires permission
of the copyright holders.
• Sony is not responsible for music files that are not saved on your computer due to unsuccessful recording
from CD or music downloading.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQ UE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky , less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
• NOTE FOR REPLACING THE EEPROM (IC6002)
In case of replacing the EEPROM (IC6002) when repairing this
set, it is necessary to write the setting for destination.
When replacing the EEPROM (IC6002), write the setting for
destination, referring to “4. TEST MODE, Items to Check in
the Test Mode, 3-2. Writing Destination”.
• Replacement of MBM29LV400BC-90PBT (IC5000),
HY62UF16201ALLF (IC5600), CXD9534BGG (IC7001) and
CXD1859GA (IC8000) used in this set requires a special tool.
• To check the operation when the MAIN board and SUB board
are removed, check it after connecting CN100 on the MAIN
board and CN200 on the SUB board with the servicing jig (relay
board between the MAIN board and SUB board) as shown below .
MAIN board
NW-MS9
console unit
SUB board
servicing jig
(MAIN/SUB relay board)
3
NW-MS9
Looking at the
controls
SECTION 2
GENERAL
(rear)
6
This section is extracted from
instruction manual.
There are following two methods of entering the test mode.
Method 1:
Short the short lands (SL0120) on the MAIN board with a solder bridge, then turn on the power.
Method 2:
Turn on the po wer with the [HOLD] switch OFF. If the set is left as it is, the LCD display becomes on, and after for a while, it changes into
the sleep status (LCD off). Before the status of the display changes into the sleep status, turn ON the [HOLD] switch and press Hs t
[MEGA BASS] t Hs t [VOLUME--] t Hs t [VOLUME+] keys in this order.
[Releasing the Test Mode]
There are following two methods of releasing the test mode.
In case of enter the test mode with the method 1:
Turn off the power and open the solder bridge on the short lands (SL0120) on the MAIN board.
In case of enter the test mode with the method 2:
Turn off the power.
10
[Flow Chart of Operations in the Test Mode]
Enter the test mode
1. ROM/RAM Self-check
2. Display of version
and destination
[VOLUME+]
key
NW-MS9
[VOLUME--]
key
[DISPLAY]
LCD all lit
[DISPLAY]
LCD all off
[DISPLAY]
key
key
key
[Items to Check in the Test Mode]
3. Writing destination
(Checking voltage and
consumed electric current)
[MENU]
key
4. Checking the rated
voltage
[MENU]
key
5. Checking the LOW BATT
voltage
[MENU]
6. USB self-check
[MENU]
7. RTC self-check
[MENU]
key
key
key
(Checking consumed electric current)
8. Sleep mode
any key
Waking up with the normal mode
(Waking up with the test mode, if
the short lands (SL0120) have
been short)
1. ROM/RAM Self-check
After entering the test mode, ROM/RAM self-check is performed automatically in the first place. By entering the test mode with ke y input,
however, no RAM check is performed.
1 Result of the ROM/RAM check is OK:
The LCD back light turns on, and version and destination is displayed automatically.
2 Result of the ROM check is NG:
“BAD ROM” is displayed on the LCD, and the LCD back light keeps blinking.
3 Result of the RAM check is NG:
Nothing is displayed on the LCD, and the LCD back light keeps blinking
2. Display of Version and Destination
Version and destination are displayed as follows.
display example
v0.09.05JP
Every time the [DISPLAY] key is pressed, the display changes as “version and destination t LCD all lit t LCD all off t version and
destination...”.
Also, pressing the [VOLUME+] key changes the mode to writing destination, and if pressing the [VOLUME--] key, the unit goes into the
sleep mode.
11
NW-MS9
3. Writing Destination (Checking Voltage and Consumed Electric Current)
After entering this mode, display of version and destination blinks. (The LCD back light turns off)
3-1. Checking voltage and consumed electric current
Note: Perform checking voltage and consumed electric current with the LCD back light off.
Specified value :
VDDCORE voltage: 1.8 to 2.0 V (voltage between TP9002 (VDDCORE) and TP (GND))
VDDIO2 voltage: 2.7 to 2.9 V (voltage between TP9003 (VDDIO2) and TP (GND))
Consumed electric current : below 200 mA
Connecting Location:
– MAIN BOARD (Conductor Side) –
TP9002
(VDDCORE)
IC8000
TP (GND)
3-2. Writing destination
Note: When the displayed destination is correct, writing destination is no needed. But when the EEPROM check is performed, leave the display as it is and
press the [DISPLAY] key to perform this check.
After replacing the EEPROM, make it sure to write destination.
Every time the [MEGA BASS] key is pressed, the display changes as t “JP t US t EU t X t JP t...”.
Select the destination*, and press the [DISPLAY] key to fix. Then the LCD display changes from blinking to being on. Also at the same
time, checking destination written on the EEPROM is performed, and when the result is OK, the LCD back light turns on, and if n ot, starts
blinking.
*) JP: Japanese modelEU: AEP, UK, E, Hong Kong, Korean models
US: US modelX: French model
IC5000
TP9003
(VDDIO2)
4. Checking the Rated Voltage
Note: Before entering this mode , check that the input voltage is the specified value (1.23 V).
Press the [MENU] key after “3-2. Writing Destination” to enter this mode. The check is started automatically.
display
1.HLFBT >
When the result is OK, “1. HLFBT >OK” is displayed on the LCD. And if the result is NG, “1. HLFBT >NG” is displayed.
5. Checking LOW BATT Voltage
Note: Before entering this mode, adjust the input voltage to the LOW BATT voltage value (0.95 V).
Press the [MENU] key after “4. Checking the rated voltage” to enter this mode. The check is started automatically.
display
2.LOWBT >
When the result is OK, “2. LOWBT >OK” is displayed on the LCD. And if the result is NG, “2. LOWBT >NG” is displayed.
Press the [MENU] key to go to the next USB self-check.
12
NW-MS9
6. USB Self-check
The indication is displayed as below after entering this mode.
display
3.USB >
This mode is not used in servicing.
Press the [MENU] key to go to the next RTC self-check.
7. RTC Self-check
The indication is displayed as below after entering this mode.
display
4.RTC >
The check on writing/reading real time clock is performed automatically and when the result is OK, “4. RTC >OK” is displayed on the
LCD and LCD back light turns on. If the result is NG, “4. RTC >NG” is displayed and the LCD back light blinks.
Press the [MENU] key to go back to “2. Display of Version and Destination”.
8. Sleep Mode (Checking Consumed Electric Current)
When the [VOLUME--] key is pressed at “2. Display of Version and Destination”, the unit goes into sleep mode.
Once entering this mode, the LCD turns off and the unit goes into the sleep (standby) status. After being into the sleep status, check that
consumed electric current is within the specified value.
Specified value : below 1 mA
The unit is waked up with normal mode with pressing any key. If the short lands (SL0120)) has been short, howe v er, waked up and enters
this test mode again.
5-3.NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
e
NW-MS9
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the par ts face side seen from
(Component Side) the parts face are indicated.
• MAIN board and SUB board are six-layer printed boards.
Howev er , the patterns of la yers 2 to 5 ha v e not been included
in these diagrams.
* Replacement of C5000, IC5600, IC7001and IC8000 used
in this set requires a special tool.
• Lead Layouts
surfac
Lead layout of conv entional ICCSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
•%: indicates tolerance.
• A : B+ Line.
• Power v oltage is dc 1.2 V and f ed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• no mark : PLAYBACK
() : when USB connection
• Voltages are tak en with a V OM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: PLAYBACK
E: Check-out
j: Check-in
* Replacement of IC5000, IC5600, IC7001and IC8000
used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
4
W or less unless otherwise
17
NW-MS9
2 Vp-p
22.8 µs
• Waveforms
– MAIN board –
1 IC7001 <zb/ (XTO)
500 mV/DIV, 20 ns/DIV
6 IC9005 wk, es (L1)
2 V/DIV, 2 µs/DIV
– SUB board –
qa IC3100 1 (MCLK)
1 V/DIV, 50 ns/DIV
44.2 ns
2 IC7001 <z.m (FS256)
500 mV/DIV, 50 ns/DIV
89 ns
3 IC1001 8 (OSCOUT)
500 mV/DIV, 10 µs/DIV
1.7 Vp-p
1.9 Vp-p
1.2 Vp-p
5.7 µs
7 IC9005 th (CLK)
1 V/DIV, 2 µs/DIV
µ
s
5.7
8 Q9005 (drain) (USB connection)
2 V/DIV, 2 µs/DIV
2.8 Vp-p
2.3 Vp-p
5.8 Vp-p
2.6 Vp-p
89 ns
qs IC3100 3 (BICK)
1 V/DIV, 200 ns/DIV
2 Vp-p
352 ns
qd IC3100 5 (LRCK)
1 V/DIV, 10 µs/DIV
30.6 µs
4 IC8000 9 (XTAL1)
1 V/DIV, 50 ns/DIV
83 ns
5 IC9005 qs, qh (L2)
2 V/DIV , 2 µs/DIV
2.6 Vp-p
4.3 Vp-p
3.5 µs
9 Q9008 (drain)
2 V/DIV, 2 µs/DIV
3.5 Vp-p
4.2 µs
18
5.7
µ
s
5-4.PRINTED WIRING BOARDS – MAIN Section – :Uses unleaded solder.