Sony NWMS-77-DR Service manual

NW-MS77DR

SERVICE MANUAL

Ver 1.2 2004. 07

SPECIFICATIONS

Maximum recording time

When using the built-in flash memory only:

ATRAC3 ATRAC3plus 4 hr. 10 min. (132 kbps) 2 hr. (256 kbps)

5 hr. 20 min. (105 kbps) 8 hr. 40 min. (64 kbps)

8 hr. 30 min. (66 kbps) 11 hr. 40 min. (48 kbps)

When using “Memory Stick” (64MB):

ATRAC3 ATRAC3plus 60 min. (132 kbps) 30 min. (256kbps)

80 min. (105 kbps) 130 min. (64 kbps)

120 min. (66 kbps) 170 min. (48 kbps)

When using “Memory Stick” (128MB):

ATRAC3 ATRAC3plus 120 min. (132 kbps) 60 min. (256kbps)

160 min. (105 kbps) 260 min. (64 kbps)

240 min. (66 kbps) 350 min. (48 kbps)

Sampling frequency

44.1 kHz

Audio compression technology

Adaptive Transform Acoustic Coding3 (ATRAC3) Adaptive Transform Acoustic Coding3plus (ATRAC3plus)

Frequency response

20 to 20,000 Hz (single signal measurement during playback)

Output

Headphone: Stereo mini-jack

Signal-to-noise ratio (S/N)

79 dB or more (excluding ATRAC3 66 kbps)

Canadian Model

AEP Model

UK Model

Tourist Model

Dynamic range

85 dB or more (excluding ATRAC3 66 kbps)

Operating temperature

5°C to 35°C (67°F to 95°F)

Power source

• DC IN 1.2 V (from built-in rechargeable battery)

• DC IN 4.5 V (from AC power adaptor)

• USB power (from a computer through supplied USB cable)

Battery life (continuous playback)

ATRAC3 format: Approximately 44 hours ATRAC3plus format: Approximately 36 hours

Dimension

36.4 x 48.5 x 18 mm (1 7/16 x 1 15/16 x 23/32 inches) (w/h/d, projecting parts not included)

Mass

Approx. 54 g (1.9 oz) (“Memory Stick Duo” not included)

Supplied accessories

Recording USB cradle (1) Headphones (1) Dedicated USB cable (1) AC power adaptor (for the supplied USB cradle) (1) Carrying pouch (1) Extension headphone cord (1) Optical Digital cable (1) Neck strap (1) CD-ROM (1) Operating Instructions (1) SonicStage Operating Instructions (1)

Design and specifications are subject to change without notice.

NETWORK WALKMAN

9-877-781-03

Sony Corporation

Personal Audio Company

Published by Sony Engineering Corporation

NW-MS77DR

Ver 1.1

“Memory Stick” and “Memory Stick Duo” and are trademarks of Sony Corporation. “MagicGate” and are trademarks of Sony Corporation. ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks of Sony Corporation. Microsoft, Windows and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries. US and foreign patents licensed from Dolby Laboratories. All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders. In this manual, TM and R marks are not specified.

Unleaded solder

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

z

USABLE FORMAT

Use ISO9660 Level 1 format.

• IC401 (microcomputer), IC451 (frash RAM) on Main board cannot be replaced individually. Replace it with Main board assembly for service.

• IC461, 463 (frash RAM) on NAND board cannot be replaced individually. Replace it with NAND board assembly for service.

• When exchanging NAND board sub ASSY (for service), SL701 of the B-side may be open. In this case, please perform the solder bridge of SL701.

are trademarks of Sony Corporation.

2

NW-MS77DR

Locating controls

For details about each part, refer to the pages in parentheses.

Network Walkman

Rear sideFront side

1 VOL (+/–) control 2 Headphone plug 3 Plug cover 4 SOUND/AVLS button 5 “Memory Stick” Eject button

6 Display

7 Shuttle switch 8 Play/Stop button

9 RESET button 0 USB cradle connector

qa HOLD (Locking controls) switch

qs MENU button

You can switch to the Time display by pressing the MENU button for a while.

qd Access lamp

qf “Memory Stick” slot

SECTION 1

SERVICING NOTES

[ Notes on using “Memory Stick Duo” ]

• Do not remove “Memory Stick Duo” during reading or writing data.

• Data may be damaged in the following cases. – The Network Walkman is removed from the USB cradle or the dedicated USB cable is unplugged while reading or writing data. – The “Memory Stick” is used in a location subject to static electricity or electric noise.

• Creating backup copies of important data is recommended.

[ Notes on formatting (initializing) ]

“Memory Stick Duo” is shipped with a FAT format as the standard format. To format “Memory Stick”, please use devices conformable with the “Memory Stick”. If “Memory Stick” is formatted using Windows Explorer, “FORMAT ERROR” will be displayed and audio files cannot be played on the Network Walkman. On Windows XP, you can format “Memory Stick” properly. When you format “Memory Stick”, always perform either one of the following:

• Follow the instructions of “Formatting memory”.

• Format using the supplied Sonic Stage software.

For details on how to format using the Sonic Stage software, refer to “Sonic Stage Online Help: Initializing an MG Memory Stick”.

[ Displaying on Windows Explorer ]

When you connect Network Walkman to your computer with the supplied USB cable, you can display the data stored on “Memory Stick” or built-in flash memory as an external drive (for example, as the D drive) using Windows Explorer.

• Data transferred with the Sonic Stage software will be stored in a “HIFI” folder. Do not edit data stored in the “HIFI” folder using

Windows Explorer. Data copied or edited using Windows Explorer cannot be played on your Network Walkman.

•You can display data that has been stored on other “Memory Stick” compatible devices (JPEG,MPEG format, etc.,).

For information on how to handle data except in the “HIFI” folder, refer to the instruction manual that comes with the equipment with which the recording has been done.

SECTION 2

GENERAL

This section is extracted from instruction manual.

3

NW-MS77DR

SECTION 3

TEST MODE

• STANDING PROCEDURE

Procedure 1: In HOLD state, while pushing Nx button,

push [RESET] button.

Procedure 2: Insert the memory stick written “testmode.ind” to

NW-MS77DR.

• Preparation “testmode.ind” Create a random text file in the root directory of Memory Stick Duo on Windows, file it as the name “testmode” and rename it as “testmode.ind”.

After starting up test mode, the following contents can be checked.

• TEST MODE

• Nx button The KEY test mode is activated. All key inputs are completed, then Nx button is pressed, restart. (Be aware that the initialization is included on all key input.)

• [MENU] button EL1 (blue) lights on/off.

• > / . h [GROUP +] / [GROUP -] EL2 (green) lights on/off.

• > button Charge control port=H (CN504 3, 4, 5 pin), ACCESS LED lights on.

• . button Charge control port=L (CN504 3, 4, 5 pin), ACCESS LED lights off.

• [GROUP +] button All LCD lights on.

• [GROUP -] button All LCD lights off.

• [VOL +] button BEEP turns on.

• [VOL -] button BEEP turns off.

• [SOUND] button Initialized. (Turns to the factory preset state, time, volume setting and so on.) The music data, files and so on in the memory are not changed.

4

SECTION 4

)

DISASSEMBLY

• The equipment can be removed using the following procedure.

4-1. DISASSEMBLY FROW

SET

NW-MS77DR

4-2 Case (R) ASSY

(Page 5)

4-4. Button (MS) ASSY, chassis (R) ASSY

4-2 Case (U) sub ASSY, play unit

(Page 5)

4-4. Case (R) sub ASSY (Page 6)

(Page 6)

4-5. MI-MH battery, POWER board (Page 7)

Note : Follow the disassembly procedure in the numerical order given.

4-6. NAND board, MAIN board (Page 7)

4-2. CASE (U) SUB ASSY, PLAY UNIT

1

screw (M1.4)

4

cable, flexible flat (20 core)

4-3 LCD board (Page 6)

case (R) assy

0

shaft (play)

6

case (U) sub assy

8

7

9

play unit

3

5

hold bumper

2

screw (M1.4

5

NW-MS77DR

y

d

4-3. LCD BOARD

case (U) sub assy

1

four craws

2

3

LCD boar

4-4. BUTTON (MS) ASSY, CHASSIS (R) ASSY

5

spring (shutter)

6

two screws (M1.4x3)

1

button (MS) assy

2

4

shutter (MS)

case (R) sub ass

3

screw (M1.4)

7

bracket (shutter)

8

chassis (R) ASSY

6

d

4-5. NI-MH BATTERY, POWER BOARD

y

Note on assembling POWER board

On assembling POWER board, secure it to the gap on the chassis (R) assembly.

5

POWER Board

2

1

connector (CN502)

3

connector (CN501)

NW-MS77DR

4

NI-MH batter

4-6. NAND BOARD, MAIN BOARD

Note on assembling NAND board

On assembling NAND board, secure it to the gap on the chassis (R) assembly.

1

chassis (R)

2

connector (CN465)

3

4

NAND Board

5

MAIN Boar

shassis (R)

1

Note on assembling MAIN board

On assembling MAIN board, secure it to the gap on the chassis (R) assembly.

7

NW-MS77DR

p

Ver 1.2

SECTION 5

DIAGRAMS

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise specified.

•%: indicates tolerance.

• C : panel designation.

• A : B+ Line.

• Power voltage is dc1.2V and fed with regulated dc power supply from battery terminal.

•Voltages and waveforms are dc with respect to ground under nosignal (detuned) conditions. no mark : PLAY

* : Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MW). Voltage variations may be noted due to normal production tolerances.

•Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F : PLAY E : CHECK OUT j : CHECK IN

• IC401 (microcomputer), IC451 (frash RAM) on Main board cannot be replaced individually. Replace it with Main board assembly for service.

• IC461, 463 (frash RAM) on NAND board cannot be replaced individually. Replace it with NAND board assembly for service.

• IC801 (DSP) on CRADLE MAIN board cannot be replaced individually. Replace it CRADLE MAIN board assembly for service.

Note on Printed Wiring Board:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated.

• Main boards is six-layer pritnted board. However, the patterns of layer 2 to 5 have not been included in this diagrams.

• IC401 (microcomputer), IC451 (frash RAM) on Main board cannot be replaced individually.

Replace it with Main board assembly for service.

• IC461, 463 (frash RAM)) on NAND board cannot be replaced individually.

Replace it with NAND board assembly for service.

• IC801 (DSP) on CRADLE MAIN board cannot be replaced individually.

Replace it CRADLE MAIN board assembly for service.

•WAVEFORMS

– MAIN BOARD –

IC731 8 OSCOUT

1

32KHz

1.1 Vp-

VOL/DIV : 0.5 V AC TIME/DIV : 10 µsec

8

5-1. BLOCK DIAGRAMS

NW-MS77DR

USB

CONNECTOR

+5VDC

1

DATA -

2

DATA +

3

GND

4

CN504 STAND

CONNECTOR

+2.3V

VUSB

+5V

DD+ USB GND

VCORE

VIO

XCHG_USB LED_CHG CHG/XDIS_CHG

BATT+ BATT-

+BATT

VBUS DET

IC512

VOUT

VDD

AC DETECT

IC509

VDD

4

VOUT

1

AC

DETECT

Q507, 516

VCC

R/B

FRB0

CE

FCE0

FLASH RAM

IC463

CE

R/B

79

FCE1

FRB1

PI3

AOUTL

AOUTR

PF3

MSBS

MSDIO

MSINS

MSSCLK

ANO

PI7

XPWR NAND

174

134

133

84

167 166 169 168

98

170

Q461

XSTBY

+1.2V

2.8V

5 3

2

8

7

+2.8V REG.

IC510

VOUT CE

IN1

IN2

STB

VIN

HP AMP

IC301

OUT1

OUT2

1

2

9

BATT SENS

BATTERY LEVEL DETECT

IC501

VDD

VOUT

14

MS_BS

MS_DIO MS_INS

MS_SCLK

VCC

J301

(HEADPHONE)

(MEMORY STICK)

I/O1 - 8A0 - 17DQ0 - 15

15 - 22

NAND FLASH RAM

IC461

CLE

ALE

23 24 26 28 27 30 29 32 31

FALE

FCLE

WE

FWE

WP

FWP

RE

FRE

NOR FLASH SRAM

IC451

BES

WE

29 - 36, 38 - 45 111 - 8, 17 - 25, 48 13 14 15 26 28 16 17 18 19 8 7 9

38 - 53

1 4

126

127

128

129 130

89

72 71

174

102 104

VBUS

VDIOUS

UDM UDP TRON

PG3/INT7

PE3/RXD1 PE2/TXD1 PI4

AN4 AN6/INT8

197 - 207, 2 - 8

185

187 184 183 186 182

WE

CSI

OE

BEF

LBS

UBS

LB

RE

UB

CS0

SYSTEM CONTROL LER

MEMORY STICK INTERFACE

IC401

MAGIC GATE CORE

NAND FLASH INTERFACE

USB INTERFACE

A/D, D/A CONVERTER

SERIAL INTERFACE

29 - 37, 41 - 44

FAD0 - 7A1 - 18D0 - 15

+2.3V

S714

SOUND/AVLS

• Signal path.

F : PLAYBACK E : CHECK OUT j : CHECK IN

S705

VOL -

S713

MENU

S704

VOL +

S703 S702

+2.8V

S701

Bx

+2.8V

.>

L801

D801

103 105

83

13

1

20

AN5 AN7/INT9

PF2/INT4

IC801

EL DRIVE

VDD

LDR

CHV

PR4

160 173

10

ENA2

OUT2

OUT1

1518 16

EL PANEL

PI2

11

ENA1

OUTCM

PI5

PC3

SCK0

SO0

176

60 57 58 76

XRST

XCS

SCL

SDA

LCD MODULE

(LCD+LCD DRIVER)

PE7

AN3

SO1

SI1

101

74 75 73

76432

SI

CE

OSCOUT

8910

X731

32kHz

/INTR

SO

OSCIN

SCK1

SCLK

CLOCK

OSC

IC731

VDD

D735

(RTC POWER)

100

TH742 (BATT)

+2.8V

AN2

99 87

TH746

(AIR)

AN1

2.3V

S711

HOLD

PG1/INT5

81

S712

GROUP

+1.2V

+2.8V

PFO/INT3

RST

106

S715

RESET

41

(ACCESS)

VDD

PI1

172

LED

DRIVER

Q781

D781

RESET

Q513, 514

VOUT

PC2

59

CORE DET

IC508

I/O DET

IC511

Q511, 512

+2.8V

+2.3V

+1.2V

5 3

5 2

XPWM

5 3

1

VOUT CE

+2.8V REG.

IC506

VOUT CE

+2.3V REG.

IC505

Q502

VOUT CE

+1.2V REG.

IC504

VOUT

CORE SW

IC513

VIN

VDD

2

+VIO

1

+1.4V

1

4

Q501

SWITCHING

REG.

IC502

3 2

D502

3 2

SWITCHING

CE

VDD

SWITCHING

CE

VDD

Q503

5

Q504

5

L501D501

EXT

L502

SWITCHING

EXT

REG.

IC503

RECHAGEABLE

BATTERY

NI-MH

99

NW-MS77DR

5-2. SCHEMATIC DIAGRAM – MAIN SECTION (1/2) –

C451

0.1

821-13

821-3

(Page 15)

7

6

5

5 1

D

A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE NC

VDD RTC

VDD IO

KEY XHOLD

VDD IO

KEY XRST

FAD0

LED USB

FAD1

FAD2

FAD3

AGND

FAD4

GND

FAD5

SGND

FAD6

GND FAD7 FRB0 XFRE FRB1

XFWE

FCLE

XFCE0

FALE

XFCE1

XFWP

C

16

N

A

S B

ES

U

B

1

B

S

U

C

X

TH

D

5

7

S

1

Q

S

Q

V

D

IC451

SST32HF402-70-4

NOR FLASH SRAM

S

C

17

N

A

LB

18

LB

A

X

CN461

11P

1

5

10

15

20

25

30

TTA B

A17

A16 A15 A14 A13 A12 A11 A10 A9

E W

X

ADC KEY MENU

PWR XNAND

4

3

2

1

D

1

0

9

7

8

5

6

3

4

1

2

4

3

5

6

D

7

6

5

4

3

2

A

8

7

6

5

4

3

A

FAD0

FAD1

FAD2

FAD3

FAD4

FAD5

FAD6

FAD7

2

A

FRB0 XFRE FRB1

XFWE

FCLE

XFCE0

FALE

XFCE1

XFWP

SOUND/AVLS

S712

GROUP

C762 100p

A

C T

R D D V

1 A

DQ11

DQ10

S714

DQ3

DQ2 DQ9 DQ1 DQ8 DQ0

VSS BEF

R453 100k

D11

D3

D10

D2 D9 D1 D8 D0

R452 100k

XRE

XCS0

1 A

R451

D705

MAZS

120008S0

A12 A13 A14 A15 A16 A17 A18

FAD0

D704 MAZS

120008S0

R712 470k

FAD1 FAD2 FAD3 FAD4 FAD5 FAD6 FAD7

FCLE FALE

XFWE XFRE XFWP XFCE0 FRB0 XFCE1 FRB1

C402

C401

0.1

D0

0.1

D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14

D15

EL D

VD

0

OE

A0

D

1

14

Q

D

Q

D

V

D

1

A

821-10

821-11

821 B

2

A

VDR403

TP401

TP402

821-12

M W

P X

731 B

404 TP

504-4

504 B

VDR402

1

0

S

S C X

XC

TP405

MEMORY STICK INTERFACE

MAGIC GATE CORE

NAND FLASH INTERFACE

USB INTERFACE

A/D,D/A CONVERTER

SERIAL INTERFACE

1-2

1-4

1-3

73

504-5

E

B U

W

X

IC401

CXR704060

1-7 73

E

B

R

XL

X

C405

C406

0.1

5 70

k

TP704

TP

10k

16 7 R

10

0

21

15

7

R

4 1-1

TP706

82

EP

/T3

E B

F3 P

.1 0

3 40

C

VDR710

K

S

R

IO

L

BS

W

IN

D

C

S

M

S P

M

X

XM

C734

0

94 7 R

0.01

R742 100k

C736

0.01

C429

0.1

TH742

C733

0.01

R791

VDR711

22k

R741

100k

R714

22k

R784

10k

3 G P

S EN

TT S A B

R713

R720

10k

R719

10k

TP702

R552

TP703

7

5

4-3

1-1

50

82

R718

10k

22k

R551

33k

TP410 TP409 TP408 TP407

R402

220

C411

1

R783

TP512

R545

1M

R411

1k

C764 1000p

R717

10k

C763

0.01

10k

X401

16MHz

R782

C409

R415

10k

R414

10k

R413

10k

R412

10k

C408

0.1

C426

0.1

C413

C414

10p

C407

0.1

R403

R404

X402

4.7

VDR401

0

C419

0.1

22.58MHz

R781

R407

TP406

R410

10k

R502

2.2M

C416

6p

R405

C421

4.7

10V

22

0

R503 470k

R416

10k

1M

C412

1

1.5k

22

C454

1000p

0.1

C422

4.7 10V

C420

10V

C423

1000p

TP509

C415

6p

22

504-10

504-9 504-8

NC

VDD

VSS

VOUT

IC512

S-80828CNBB-B8N

VBUS DET

2

1

IO

ST

D

.3V

D

R

D

2

N

V

G

D

2 D N G

821-4

R

L

T

U

O

A

1 74

B

(Page 11)

1010

5-3. SCHEMATIC DIAGRAM – MAIN SECTION (2/2) –

NW-MS77DR

CRADLE

MEMORY

STICK

BATT+

BATT-

CHG/XDIS CHG

LED CHG

XCHG USB

VCORE

VIO

VUSB

USB GND

CN504

11P

VSS

MS BS

NC

MS DIO

RESERVE

MS INS

RESERVE

MS CLK

VCC VSS

IC509

S-80828CNBB-B8N

AC DET

VSS VOUT

DD+

CN761

10P

TP518

R765

10k

AC DRIVER

Q507,516

NC VDD

TP513

TP514 TP515 TP516

TP517

TP519 TP520

D701

D702

MAZS120008SO

MS BS

MS DIO

XMS INS

MS CLK

R558

1M

R501

2.2M

D703

MAZS120008SO

2SA2029T2L

R559

2.2M

504-3 504-4 504-5

504-8 504-9

504-10

XMS PWR

Q516

R528 470k

Q507

BLM01S-TL

R560

2.2M

C529

0.001

R731 470k

731-4

731-3

731-2

R557

1M

R556

0

NC

VSS

CE

IC731

RS5C348A-E2

CLOCK OSC

32KOUT SCLK SO SI VSS

C761

10

10V

VOUT

XC6204D282MR

VIN

C528

0.1

R408

0

C522

4.7

6.3V

VDD

OSCIN

OSCOUT

CE

/INTR

IC510

+2.8V

REG.

IC505

XC62HR2301MR

+2.3V

REG.

VOUT

VIN

NC

C518

0.1

C732

0.1

VSS

CE

X731

32kHz

731-7

TP701

TP511

R409

0

C523

100

6.3V

2SC5658T2L

VOUT

NC

Q514

RESET

VIN

VSS

CE

XC62HR2802MR

C519

0.1

Q513

2SA2029T2L

RESET

R544 470k

R301

C103

0.22

R103

10

IC506

+2.8V

REG.

C530

0.01

0

TP510

C301

0.33

C302

Q511,512

+B SWITCH

DRVER

Q512

2SA2029T2L

R530 470k

R532

1M

Q511

2SC5658T2L

R540 100k

R543

1M

R541 470k

C102 100p

C101

0.22

C303

10

10V

R542

1M

R101

47k

R102

33k

V+2 OUT1 IN1 STB TC V+1

R201

R202

IC301

NJM2776RB2

HP AMP

OUT2

VREF

47k

33k

GND

IN2

STB

C527

0.022

0.1

R529

S-80810CNBB-B90

VOUT VSS

S-80824CNBB-B8J

VOUT VSS

C201

0.22

C202 100p

C304

0.1

C305

22 4V

R522 470k

1M

IC508

CORE DET

IC511

I/O DET

C516

1000p

R561

C306

10

10V

C203

0.22

R203

10

VDD

0

VDD

VOUT

NC

S-80810CNBB-B90

VSS

R526

1M

R303

47k

IC513

CORE SW

R525 470k

R538

0

R302

0

D301

MAZS120008S0

C204

220

2.5V

C104

220

2.5V

R763 470k

R406

CN503

20P

1

VCORE XPWM REG CE ULOW BATT

5

VDD CORE NC VDD CORE GND CORE VIO

10

GND CORE VIO GND 10 BATT SENS GND 10

15

5

470k

10k

20

BATT+ BATTBATT+ BATTBATT+ BATT-

20

1

VDD EL GND EL EL CE1 EC CE2 GND GND SGND SGND VDD IO

10

LCD SDA LCD SCL LCD XCS LCD XRST KEY XPLAY

15

INT XKEY1 GND HP ADC KEY1 GND HP R L

VDR501

CN821

20P

TP851 821-3 821-4

TP852

TP403

TP854

4.7k

TP855 TP856

R792

C205

0.022

C105

0.022

TP853

R795

R721

1k

821-10 821-11 821-12 821-13 821-14 821-15

821-17

TP857

0

TP858

R204

R104

(Page 17)

(Page 13)

B 741

B 504

PG3

VDIO

B 731

VDD RTC

2.3V GND 2

GND 1

RST

AOUTL

AOUTR

(Page 10)

PF3/T3

DVDD2

XPWM

VDD EL

BATT-

BATT SENS

B 821

BEEP

1111

Sony NWMS-77-DR Service manual

SPECIFICATIONS

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

TEST MODE

DISASSEMBLY

4-2. CASE (U) SUB ASSY, PLAY UNIT

4-3 LCD board (Page 6)

4-4. BUTTON (MS) ASSY, CHASSIS (R) ASSY

4-6. NAND BOARD, MAIN BOARD

DIAGRAMS

5-1. BLOCK DIAGRAMS

5-2. SCHEMATIC DIAGRAM – MAIN SECTION (1/2) –

5-3. SCHEMATIC DIAGRAM – MAIN SECTION (2/2) –