MSGC-US10
SERVICE MANUAL
Ver 1.0 2001. 01
Ver 1.0 2001. 07
SPECIFICATIONS
MG Memory Stick Reader/Writer
Interface: USB interface
Operating voltage 5 V DC (supplied from USB cable)
Current consumption Action Max. 100 mA
External dimensions Approx. 68 × 20 × 108 mm (w/h/d)
Mass Approx. 65 g
Operating environment 0 °C to 40 °C (condensation not allowed)
Standby Max. 500 µA
AEP Model
Hong Kong Model
Design and specifications are subject to change
without notice.
MAGICGATE MEMORY STICK
READER/WRITER
9-873-246-01
2001G0400-1
© 2001. 7
Sony Corporation
Personal Audio Company
Shinagawa Tec Service Manual Production Group
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MSGC-US10
Program©2000 Sony Corporation
Documentation©2001 Sony Corporation
OpenMG and its logo are trademarks of Sony Corporation.
“MagicGate Memory Stick,” , “Memory Stick, ” , are trademarks of
Sony Corporation.
“MagicGate ” and are trademarks Sony Corporation.
IBM and PC/AT are registered trademarks of International Business
Machines Corporation.
Microsoft, Windows, Windows NT and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States and/or
other countries.
Copyright©1995 Microsoft Corporation. All Right Reserved.
Portion Copyright©1995 Microsoft Corporation.
MMX and Pentium are registered trademarks or trademarks of Intel
Corporation.
All other trademarks and registered trademarks are trademarks or registered
trademarks of their respective holders.
TABLE OF CONTENTS
1. GENERAL
Before You Begin ................................................................. 3
Basic Operations .................................................................. 6
Enjoying Digital Music with OpenMG™ Jukebox ............. 6
Other information................................................................. 8
2. DISASSEMBLY
2-1. Case (Lower) ...................................................................... 10
3. DIAGRAMS....................................................................... 11
3-1. Printed Wiring Board –Main Section– ............................... 12
3-2. Schematic Diagram –Main Section–.................................. 13
4. EXPLODED VIEW
4-1. Main Section ...................................................................... 15
5. ELECTRICAL PARTS LIST ........................................ 16
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
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SECTION 1
GENERAL
MSGC-US10
This section is extracted from
instruction manual.
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