Sony MSGCUS-10 Service manual

MSGC-US10

SERVICE MANUAL

Ver 1.0 2001. 01

Ver 1.0 2001. 07

SPECIFICATIONS

MG Memory Stick Reader/Writer

Interface: USB interface

Operating voltage 5 V DC (supplied from USB cable)
Current consumption Action Max. 100 mA

External dimensions Approx. 68 × 20 × 108 mm (w/h/d)
Mass Approx. 65 g
Operating environment 0 °C to 40 °C (condensation not allowed)

Standby Max. 500 µA

AEP Model

Hong Kong Model

Design and specifications are subject to change
without notice.

MAGICGATE MEMORY STICK
READER/WRITER

9-873-246-01

2001G0400-1
© 2001. 7

Sony Corporation

Personal Audio Company
Shinagawa Tec Service Manual Production Group

1

MSGC-US10

Program©2000 Sony Corporation
Documentation©2001 Sony Corporation

OpenMG and its logo are trademarks of Sony Corporation.
“MagicGate Memory Stick,” , “Memory Stick, ” , are trademarks of
Sony Corporation.
“MagicGate ” and are trademarks Sony Corporation.
IBM and PC/AT are registered trademarks of International Business
Machines Corporation.
Microsoft, Windows, Windows NT and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States and/or
other countries.
Copyright©1995 Microsoft Corporation. All Right Reserved.
Portion Copyright©1995 Microsoft Corporation.
MMX and Pentium are registered trademarks or trademarks of Intel
Corporation.
All other trademarks and registered trademarks are trademarks or registered
trademarks of their respective holders.

TABLE OF CONTENTS

1. GENERAL

Before You Begin ................................................................. 3

Basic Operations .................................................................. 6

Enjoying Digital Music with OpenMG™ Jukebox ............. 6

Other information................................................................. 8

2. DISASSEMBLY

2-1. Case (Lower) ...................................................................... 10

3. DIAGRAMS....................................................................... 11

3-1. Printed Wiring Board –Main Section– ............................... 12

3-2. Schematic Diagram –Main Section–.................................. 13

4. EXPLODED VIEW

4-1. Main Section ...................................................................... 15

5. ELECTRICAL PARTS LIST ........................................ 16

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

2

SECTION 1

GENERAL

MSGC-US10

This section is extracted from
instruction manual.

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SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. CASE (LOWER)

claws

2 P 2x6

3

1 P 2x6

4 case (lower)

10

SECTION 3

p

p

DIAGRAMS

MSGC-US10

THIS NOTE IS COMMON FOR PRINTED WIRING
BOARD AND SCHEMATIC DIAGRAM.
(In addition to this, the necessary note is
printed in each block.)

for schematic diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• % : indicates tolerance.

f

•

• C : panel designation.

• A : B+ Line.

• Power voltage is dc 5V and fed with regulated dc power

• Voltages are taken with a VOM (Input impedance 10 MΩ).

• Voltage and waveforms are dc with respect to ground

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

for printed wiring boards:

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

: internal component.

supply from USB connector (CN102).
Voltage variations may be noted due to normal produc-

tion tolerances.
under no-signal conditions.

no mark : Standby

Voltage variations may be noted due to normal produc­tion tolerances.

(The other layer’s patterns are not indicated.)

4

W or less unless otherwise

• Waveforms

1V AC/div, 20nsec/div

1

20 MHz

IC101

1V AC/div, 20nsec/div

2

IC101

1V AC/div, 20nsec/div

3

20 MHz

IC106

rs

48 MHz

th

6

(SCK0)

(X0)

(XT)

1.85 Vp-

1.65 Vp-p

1.85 Vp-

• Semiconductor
Location

Ref. No. Location
D001 I-13

D002 B-5
IC101 C-4

IC102 C-6
IC103 E-2
IC104 C-2
IC105 E-6
IC106 C-3
IC107 F-6
IC108 G-6
IC109 G-6

Q101 G-2
Q102 G-2
Q104 D-3

• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in­cluded in this diagrams.

Replacement of IC107 on main board

*

requires a special tool.

• Lead Layouts

Lead layout of conventional IC

CSP (chip size package)

surface

11 11

MSGC-US10

3-1. PRINTED WIRING BOARD — MAIN SECTION — • Refer to page 11 for Note. Refer to page 11 for Semiconductor Locations.

A

B

C

D

E

1

234567891011121314

CN102

MAIN BOARD (SIDE B)

TP001

C109

C110

C121

1

32

IC104

C105

C106

TP002

C122

IC103

TP003

21

3

C107

C108

L104

C137

L103

C119

C120

R119

L102

4

6

L107

C117

TP007

IC106

X102

3

1

R164

R155

Q104

SDG

R123

R154

R162

C138

R156

R161

10

R165

15

20

R163

25

30
32

TP005

PS101

C118

1

5

L105

125128

3335 40

R113
R112

R110
R111
R140

R101

R104

C126

FB102

IC101

R105

TP008

R107

X101

100105110115120

R114

FB101

C129

97

6455 6045 50

R106

L106

R147
R153
R144
R143

D002

R139

R137

R135

R133

96

R131

R129

90

R127

85

R125

80

C128

75

70

C127

65

R151
R150
R149

R118

C123

R136

R134

R117

R138

R132

R130

R128

R126

R124

R145

3

4

R166

1

5

TP009

IC105

R146

152024

C134

IC102

C115

510

4540353025

L101

1

46

C116

MAIN BOARD (SIDE A)

142

3

F

G

H

Q102

ECB

C102

C103

R108

C104

R109

Q101

BCE

C101

R141

15

CN101

TP006

10

IC107

*

C132

C133

C131

IC108

R158

5

1

R157

4

3

TP004

R120

C130

C136

D001

ACCESS

C135

5

1

IC109

4

3

I

J

1-679-144-

13

(13)

1-679-144-

1212

13

(13)

3-2. SCHEMATIC DIAGRAM — MAIN SECTION — • Refer to page 11 for Note and Waveforms. Refer to page 14 for IC Block Diagram.

MEMORY STICK

)

(

CONNECTOR

MSGC-US10

13 13

IC B/D

MSGC-US10

• IC BLOCK DIAGRAM

IC108 TC7SH32FU

INB

VCC OUT Y

5 4

1 2 3

INA GND

MEMO

1414

NOTE:

• The mechanical parts with no reference
number in the exploded views are not supplied.

• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.

4-1. MAIN SECTION

not supplied

SECTION 4

EXPLODED VIEW

• -XX and -X mean standardized parts, so
they may have some difference from the
original one.

• Color Indication of Appearance Parts
Example :

KNOB, BALANCE (WHITE) ... (RED)

R

Parts Color Cabinet’s Color

• Accessories and packing materials are
given in the last of this parts list.

MSGC-US10

R

CN102

1

CN101

2

3

3

4

Ref. No. Part No. Description Remark
* 1 A-3323-662-A MAIN BOARD, COMPLETE

2 3-220-912-01 CASE (LOWER)
3 7-685-104-14 SCREW +P 2X6 TYPE2 NON-SLIT

Ref. No. Part No. Description Remark

4 3-226-838-01 FOOT, RUBBER
CN101 1-793-111-21 CONNECTOR, MEMORY STICK

* CN102 1-784-010-11 CONNECTOR, USB (B)

15

MSGC-US10

SECTION 4

MAIN

NOTE:

• Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the
components used on the set.

• -XX and -X mean standardized parts, so
they may have some difference from the
original one.

• RESISTORS
All resistors are in ohms.
METAL:Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F:nonflammable

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

* A-3323-662-A MAIN BOARD, COMPLETE

*********************

< CAPACITOR >

ELECTRICAL PARTS LIST

• CAPACITORS
uF : µF

• COILS
uH : µH

• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.

• SEMICONDUCTORS
In each case, u : µ, for example:
uA.. : µA.. uPA.. : µPA..
uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..

FB101 1-469-083-21 INDUCTOR, FERRITE BEAD 600uH
FB102 1-469-083-21 INDUCTOR, FERRITE BEAD 600uH

When indicating parts by reference
number, please include the board.

< FERRITE BEAD >

C101 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C102 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C103 1-124-779-00 ELECT CHIP 10uF 20% 16V
C104 1-124-779-00 ELECT CHIP 10uF 20% 16V
C105 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C106 1-124-779-00 ELECT CHIP 10uF 20% 16V
C107 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C108 1-124-779-00 ELECT CHIP 10uF 20% 16V
C109 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C110 1-124-779-00 ELECT CHIP 10uF 20% 16V

C115 1-124-779-00 ELECT CHIP 10uF 20% 16V
C116 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C117 1-124-779-00 ELECT CHIP 10uF 20% 16V
C118 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C119 1-124-779-00 ELECT CHIP 10uF 20% 16V

C120 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C121 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C122 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C123 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 16V
C126 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C127 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C128 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C129 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C130 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C131 1-107-820-11 CERAMIC CHIP 0.1uF 16V

< IC >

IC101 8-759-695-24 IC F731791CPBK-TEB
IC102 X-3380-692-1 IC ROM (MBM29LV200BC-90PFTN-MG3)
IC103 8-759-829-80 IC XC62FP1802MR
IC104 8-759-486-73 IC XC62FP3302PR
IC105 8-759-593-23 IC S-80928ANMP-DDR-T2

IC106 8-759-486-57 IC XC2141C21AMR

@ IC107 8-752-399-04 IC CXD3450GG

IC108 8-759-196-97 IC TC7SH32FU-TE85R
IC109 8-759-196-97 IC TC7SH32FU-TE85R

< COIL >

L101 1-410-381-11 INDUCTOR CHIP 10uH
L102 1-410-381-11 INDUCTOR CHIP 10uH
L103 1-410-381-11 INDUCTOR CHIP 10uH
L104 1-469-324-21 FERRITE, EMI (SMD)
L105 1-414-226-21 FERRITE, EMI (SMD)

L106 1-414-226-21 FERRITE, EMI (SMD)
L107 1-469-324-21 FERRITE, EMI (SMD)

< IC LINK >

PS101 1-533-606-21 LINK, IC (500mA)

< TRANSISTOR >

C132 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C133 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C134 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C135 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C136 1-124-779-00 ELECT CHIP 10uF 20% 16V

C137 1-234-494-21 FILTER, EMI REMOVAL (SMD)
C138 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 16V

< CONNECTOR >

CN101 1-793-111-21 CONNECTOR, MEMORY STICK

* CN102 1-784-010-11 CONNECTOR, USB (B) (USB CONNECTOR)

< DIODE >

D001 8-719-082-95 LED TLO220 (ACCESS)
D002 8-719-078-01 DIODE NNCD6.8LG-T1

16

Q101 8-729-051-23 TRANSISTOR 2SA2018TL
Q102 8-729-907-00 TRANSISTOR DTC114EU
Q104 8-729-032-62 FET 2SJ347-TE85L

< RESISTOR >

R101 1-218-939-11 RES-CHIP 68 5% 1/16W
R104 1-218-977-11 RES-CHIP 100K 5% 1/16W
R105 1-218-977-11 RES-CHIP 100K 5% 1/16W
R106 1-218-977-11 RES-CHIP 100K 5% 1/16W
R107 1-218-981-11 RES-CHIP 220K 5% 1/16W

R108 1-218-955-11 RES-CHIP 1.5K 5% 1/16W
R109 1-218-977-11 RES-CHIP 100K 5% 1/16W
R110 1-218-981-11 RES-CHIP 220K 5% 1/16W
R111 1-218-981-11 RES-CHIP 220K 5% 1/16W
R112 1-208-643-11 RES-CHIP 22 5% 1/16W

@Replacement of CXD3450GG (IC107) used in this

set requires a special tool.
Therefore, it cannot be replaced.

MSGC-US10

MAIN

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

R113 1-208-643-11 RES-CHIP 22 5% 1/16W
R114 1-218-989-11 RES-CHIP 1M 5% 1/16W
R117 1-218-977-11 RES-CHIP 100K 5% 1/16W
R118 1-218-981-11 RES-CHIP 220K 5% 1/16W
R119 1-218-981-11 RES-CHIP 220K 5% 1/16W

R120 1-218-981-11 RES-CHIP 220K 5% 1/16W
R123 1-218-955-11 RES-CHIP 1.5K 5% 1/16W
R124 1-218-981-11 RES-CHIP 220K 5% 1/16W
R125 1-218-981-11 RES-CHIP 220K 5% 1/16W
R126 1-218-981-11 RES-CHIP 220K 5% 1/16W

R127 1-218-981-11 RES-CHIP 220K 5% 1/16W
R128 1-218-981-11 RES-CHIP 220K 5% 1/16W
R129 1-218-981-11 RES-CHIP 220K 5% 1/16W
R130 1-218-981-11 RES-CHIP 220K 5% 1/16W
R131 1-218-981-11 RES-CHIP 220K 5% 1/16W

R132 1-218-981-11 RES-CHIP 220K 5% 1/16W
R133 1-218-981-11 RES-CHIP 220K 5% 1/16W
R134 1-218-981-11 RES-CHIP 220K 5% 1/16W
R135 1-218-981-11 RES-CHIP 220K 5% 1/16W
R136 1-218-981-11 RES-CHIP 220K 5% 1/16W

ACCESSORIES & PACKING MATERIALS

********************************

1-792-826-21 CORD, CONNECTION
3-228-138-31 SOFT (CD-ROM), APPLICATION
3-228-141-11 MANUAL, INSTRUCTION (ENGLISH,FRENCH,

GERMAN)

R137 1-218-981-11 RES-CHIP 220K 5% 1/16W
R138 1-218-981-11 RES-CHIP 220K 5% 1/16W
R139 1-218-981-11 RES-CHIP 220K 5% 1/16W
R140 1-218-981-11 RES-CHIP 220K 5% 1/16W
R141 1-218-945-11 RES-CHIP 220 5% 1/16W

R143 1-218-981-11 RES-CHIP 220K 5% 1/16W
R144 1-218-981-11 RES-CHIP 220K 5% 1/16W
R145 1-218-975-11 RES-CHIP 68K 5% 1/16W
R146 1-218-965-11 RES-CHIP 10K 5% 1/16W
R147 1-218-981-11 RES-CHIP 220K 5% 1/16W

R149 1-218-981-11 RES-CHIP 220K 5% 1/16W
R150 1-218-981-11 RES-CHIP 220K 5% 1/16W
R151 1-218-981-11 RES-CHIP 220K 5% 1/16W
R153 1-218-981-11 RES-CHIP 220K 5% 1/16W
R154 1-218-981-11 RES-CHIP 220K 5% 1/16W

R155 1-218-981-11 RES-CHIP 220K 5% 1/16W
R156 1-218-981-11 RES-CHIP 220K 5% 1/16W
R157 1-218-981-11 RES-CHIP 220K 5% 1/16W
R158 1-218-981-11 RES-CHIP 220K 5% 1/16W
R161 1-218-981-11 RES-CHIP 220K 5% 1/16W

R162 1-218-981-11 RES-CHIP 220K 5% 1/16W
R163 1-218-957-11 RES-CHIP 2.2K 5% 1/16W
R164 1-218-981-11 RES-CHIP 220K 5% 1/16W
R165 1-218-981-11 RES-CHIP 220K 5% 1/16W
R166 1-218-981-11 RES-CHIP 220K 5% 1/16W

< VIBRATOR >

X101 1-795-097-21 VIBRATOR, CERAMIC (48MHz)
X102 1-781-945-21 VIBRATOR, CERAMIC (20MHz)

*************************************************************

17

MSGC-US10

REVISION HISTORY

Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.

Ver. Date Description of Revision

1.0 2001. 07 New

18