Sony MD Walkman MZ-E33 Service Manual

MZ-E33

SERVICE MANUAL

PORTABLE MINIDISC PLAYER

SPECIFICATIONS

US Model

Canadian Model

AEP Model

E Model

Model Name Using Similar Mechanism MZ-E55
MD Mechanism Type MT-MZE55-150
Optical Pick-up Mechanism Type ODX-1A/1B

US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.

System

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material : GaAlAs
Wavelength : λ =790 nm
Emission duration : continuous

Laser output : less than 44.6 µW*
* This output is the value measured at a distance of 200 mm from the

objective lens surface on the optical pick-up block with 7 mm aperture.

Revolutions

400 rpm to 900 rpm (CLV)

Error correction

Advanced Cross Interleave Reed Solomon Code (ACIRC)

Sampling frequency

44.1kHz

Coding

Adaptive TRansform Acoustic Coding (ATRAC)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels
1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limit

Outputs

Headphones : stereo mini-jack, maximum output level 5mW+5mW,
load impedance 16 ohm

General

Power requirements

One LR6 (size AA) alkaline battery (not supplied)
Ni-MH rechargeable battery NH-9WM/NH-14WM
(not supplied)
R-6 sized Ni-MH rechargeable battery NH-MDAA (supplied)
Sony AC Power Adaptor AC-MZR55 (supplied) connected at the
DC IN 3V jack

Battery operation time

Batteries Playback
LR6 (SG) (size AA) Approx. 9.5 hours
Sony alkaline battery
R-6 sized Ni-MH Approx. 8 hours
rechargeable battery
NH-MDAA
Chewing gum type Approx. 7 hours
Ni-MH rechargeable
battery NH-14WM
Chewing gum type Approx. 6.5 hours
Ni-MH rechargeable
battery NH-9WM (N)

Dimensions

Approx. 80 × 17.3 × 92 mm (w/h/d)
(3 1/4 × 11/16 × 3 5/8 in.)
not including projecting parts and controls

MICROFILM

– Continued on next page –

Ver 1.1 1999. 01

– 2 –

1. SERVICING NOTE....................................................... 3

2. GENERAL....................................................................... 4

3. DISASSEMBLY

3-1. Bottom Panel Assy .............................................................. 5

3-2. Upper Panel Assy ................................................................ 5

3-3. Main Board ......................................................................... 6

3-4. MD Assy ............................................................................. 6

3-5. OP Service Assy.................................................................. 6

4. TEST MODE................................................................... 7

5. ELECTRICAL ADJUSTMENTS............................ 11

6. DIAGRAMS

6-1. IC Pin Description............................................................. 13

6-2. Block Diagram .................................................................. 15

6-3. Printed Wiring Board ........................................................ 18

6-4. Schematic Diagram ........................................................... 21

7. EXPLODED VIEWS

7-1. Panel Section ..................................................................... 29

7-2. Main Board Section .......................................................... 30

7-3. Mechanism Deck Section.................................................. 31

8. ELECTRICAL PARTS LIST.................................... 32

TABLE OF CONTENTS

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENT AL OR CONSEQ UENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OF ANY PRODUCT.

“MD WALKMAN” is a trademark of Sony
Corporation.

This MiniDisc player is classi­fied as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior.

Mass

Approx. 113 g (4.0 oz.) the player only
Approx. 155 g (5.5 oz.) incl. a premastered MD and a Sony
alkaline LR6 (SG) battery

Supplied accessories

AC power adaptor AC-MZR55 (1)
R-6 sized Ni-MH rechargeable battery NH-MDAA (1)
Rechargeable battery carrying case (1)
Headphones with a remote control
MDR-A34SP + RM-MZE33 (1) (US model)
MDR-E805SP + RM-MZE33 (1) (Canadian, AEP, E model)
MDR-E838SP + RM-MZE33 (1) (Hong Kong model)
Carrying pouch (1)

Design and specifications are subject to change without notice.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
P AR T NUMBERS APPEAR AS SHO WN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE ! SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

– 3 –

SECTION 1

SERVICING NOTE

1. When repairing this de vice with the po wer on, if you remo ve the main boar d, this de vice stops w orking.
In this case , you w ork without the de vice stopping b y fastening the hook of the DOOR OPEN/CLOSE s witc h (S801) with tape .

S801

2. The electrical components diff er accor ding to the ver sion of the system contr ol IC (IC801). When replacing the IC801, chec k its model
name and ad d or remo ve D1001 and/or R1001 as sho wn belo w. For detailed inf ormation, see the Printed Wiring Boar d on pa ge 18 and
the Schematic Diagram on page 21.

RU6815MF-0004 (V er. 3.0) .... Add D1001 and R1001

RU6815MF-0005 (V er. 3.2) and later .... Remo ve D1001 and R1001

– 4 –

SECTION 2

GENERAL

This section is extracted
from instruction manual.

– 5 –

SECTION 3

DISASSEMBLY

3-1. BOTTOM PANEL ASSY

Note : When installing, fit the knobs and switches.

3-2. UPPER PANEL ASSY

• The equipment can be removed using the following procedure.

Bottom panel assy Main board

Upper panel assy Main board MD assy OP service assy

Note : Follow the disassembly procedure in the numerical order given.

1

precision pan

screw (M1.4)

2

precision pan

screw (M1.4)

3

precision pan

screw (M1.4)

4

bottom panel assy

knobs

switches

2

precision pan

screw (M1.4)

4

upper panel assy

3

precision pan

screw (M1.4)

1

button (OPEN)

– 6 –

3-5. OP SERVICE ASSY3-4. MD ASSY

1

claw

2

claw

3

MD assy

1

precision screw

3

main shaf

t

2

OP service assy

3-3. MAIN BOARD

5

toothed lock

screw

3

precision pan

screw (M1.4)

4

step screw

(MD)

2

precision pan

screw (M1.4)

1

battery case lid

9

MAIN board

6

7

CN501

8

CN551

– 7 –

Servo mode

0 0 0

Offset adjustment

0 1 0

Laser power

adjustment

0 2 0

011 to 013

*1

021 to 024

*1

23

1

p key

p key

p key

p key

” key

” key

” key

” key

” key

+, – keys+, – keys

(See page 8)

*1 Repeatedly press ” key

to change the mode.
(Refer to the following list
for a description of each
mode.)

” key

” key

p key

p key

p key

p key

VOL
+ key

VOL
– key

(Start ?)

Overall
adjustment
mode (Auto?)

Adjustment
mode
(Manu ?)

Servo mode

0 0 0

Audio mode

1 0 0

Servo mode

3 0 0

+, – keys

+, – keys

+, – keys

Display when test mode

is set

Displays of the LCD on the remote commander
are shown in parentheses.

V1. 000

ROM version display

LCD on remote commander

SECTION 4

TEST MODE

Outline

• In this set, overall adjustment mode is made a vailab le b y enter -

ing test mode to perform automatic adjustment of CD and MO.
In the overall adjustment mode, the disc is determined whether
it is CD or MO and adjustments are performed in sequence. If a
fault is f ound, the location of the fault is displa yed. Also, in ser vo
mode, each adjustment can be automatically made.

Setting the Test Mode

T o enter the test mode , two methods are a vailab le :

1. Entering method with key input.

T urn off the HOLD s witc h on the set. While holding do wn the
p key on the set, press the f ollo wing remote commander ke ys in
the following order :

+ n + n = n = n + n = n + n
= n P n P

2. Entering method by shorting the test point

Solder bridg e the test point T AP801 (TEST) on the main boar d
(connect IC801 pin #™ to GND), and turn on the PO WER.

Releasing the Test Mode

1. When test mode was entered with ke y input, turn off the PO WER.

2. When test mode was entered b y shor ting the test point, turn off

the PO WER and open the solder bridg e of TAP801 (TEST
MODE) on the main board.

Operation of Setting on Test Mode

When the test mode is set, the LCD displays the following :

• The c ycle - the abo ve R OM ver sion displa y n All lit n All off

- is repeated.
(The ROM version is constantly displayed.)

• When the PLA Y MODE ke y is pressed and hold do wn, the dis-

play at that time is held so that display can be checked.

Configuration of Test Mode

The test mode has the configuration given belo w.

Servo Mode

• Set the test mode , press the V OL – ke y and use the ” key to set
the ser vo mode .

• When the servo mode is set, use the + key and the = key
to move the optical pick-up to the outer circumference and to
the inner cir cumf erence respectivel y.

• When entering another mode, refer to the configuration of test
mode.

1. Structure of Servo Mode

IC801

TAP801

RB801

TP808

Test mode
Short : Test mode
Open : Normal mode

TP819

TP911

C805

C807
C806

R810

R811

R808

– 8 –

(See page 7.)

p key

p key

p key

p key

+, – keys

MO adjustment

0 3 0

031 to 039

*1

” key

p key

p key

+, – keys

CD adjustment

0 5 0

051 to 058

*1

” key

p key

p key

+, – keys

Sled movement

0 6 0

061 , 062

*1

” key

+, – keys

041 to 048

*1

” key

Low reflection

CD adjustment

0 4 0

p key

p key

p key

p key

+, – keys

NV relation

0 9 0

091, 092,

093

*1

” key

” key

” key

” key

” key

” key

” key

+, – keys

071, 072,

073, 074

*1

” key

Automatic

adjustment

0 7 0

23

1

Retern the Offset
adjustment (0 1 0)

*1 : Repeatedly press ” key

to change the mode.
(Refer to the following list
for a description of each
mode.)

2. Description of Each Mode
010 Offset adjustment

Mode Description

011 FE offset
012 TE offset
013 All servo ON

020 Laser power adjustment

Mode Description

021 MO power A
022 MO power E
023 CDL power
024 CD power

030 MO adjustment

Mode Description

031 MO FE balance
032 MO FE gain
033 MO ABCD gain
034 MO focus gain
035 MO tracking gain
036 MO RF gain
037 MO ADIP gain
038 MO focus bias E
039 CD focus bias A

040 Lower reflection CD adjustment

Mode Description

041 Lower reflection CD FE balance
042 Lower reflection CD FE gain
043 Lower reflection CD ABCD gain
044 Lower reflection CD focus gain
045 Lower reflection CD tracking gain
046 Lower reflection CD RF offset
047 Lower reflection CD RF gain
048 Lower reflection CD focus bias

050 CD adjustment

Mode Description

051 CD FE balance
052 CD FE gain
053 CD ABCD gain
054 CD focus gain
055 CD tracking gain
056 CD RF offset
057 CD RF gain
058 CD focus bias