Sony MDCT-1000 Service manual

MDCT-1000

SERVICE MANUAL

Ver 1.0 2001. 05

US and foreign patents licensed from Dolby Laboratories Licensing Corporation

SPECIFICATIONS

US Model

Model Name Using Similar Mechanism MDCC-2000 MD Mechanism Type CCMD-2000 Optical Pick-up Mechanism Type KMS-250A

Laser diode properties

Material: GaAlAs Wavelength: 780 nm Emission duration: Continuous Laser output: Less than 44.6 µW (This output is the value measured at a distance of about 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.)

Revolutions

400 rpm to 1,800 rpm (CLV)

Error correction

Advanced Cross Interleave Reed Solomon Code (ACIRC)

Sampling frequency

44.1 kHz

Coding

ATRAC 3 (Adaptive TRansform Acoustic Coding 3)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 or 4 monaural channels

Frequency response

50–10,000 Hz

Speaker

Approx. 5.0 cm (2 inches) dia.

Power output

600 mW (at 10% distortion)

Output

EAR (minijack)

Other connector

Power requirements

Dimensions

Mass

Accessories supplied

Design and specifications are subject to change without notice.

for 8–300 Ω earphones

CONTROL UNIT connector

12 V DC DC IN 12V jack accepts the supplied AC power adaptor for use on 120 V AC, 60 Hz

Approx. 320 x 280 x 118 mm (w/h/d)

(12

⁄8 x 111⁄8 x 43⁄4 inches)

including projecting parts and controls

Approx. 3.7 kg (8 lb 3 oz)

AC power adaptor (1) AC power cord (1)

9-873-186-01

MD CONFER-TRANSCRIBER

Sony Corporation

Personal Audio Company Shinagawa Tec Service Manual Production Group

MDCT-1000

1. GENERAL ·········································································· 4

2. DISASSEMBLY

2-1. Cabinet(Upper) Section················································ 6 2-2. Switch Section······························································ 7 2-3. LCD Section································································· 7 2-4. MD Section ·································································· 8 2-5. Volume Section ···························································· 8 2-6. Main Board ·································································· 9 2-7. Door ··········································································· 10 2-8. MD Board ·································································· 10 2-9. Base Unit Section······················································· 11 2-10. BUM-F1 Board ·························································· 11 2-11. REC/PB Head Assy (HR901) Section ······················ 12 2-12. Holder Assy, Cartridge Section ·································· 12 2-13. Holder Assy, Cartridge Installation ···························· 13 2-14. Optical Pick-Up (KMS-250A) Section ······················ 13

3. TEST MODE···································································· 14

4. ELECTRICAL ADJUSTMENTS ······························· 26

5. DIAGRAMS

5-1. Circuit Boards Location ············································· 27 5-2. Block Diagrams·························································· 28

MD Section ································································ 28 I/O Section ································································· 29 FIFO Section ······························································ 30 CPU Section ·······························································31

LCD Section······························································· 32 5-3. Printed Wiring Board MD Section ···························33 5-4. Schematic Diagram MD Section (1/4)····················· 34 5-5. Schematic Diagram MD Section (2/4)····················· 35 5-6. Schematic Diagram MD Section (3/4)····················· 36 5-7. Schematic Diagram MD Section (4/4)····················· 37 5-8. Schematic Diagram BUM Section ···························38 5-9. Printed Wiring Board BUM Section ························ 39

5-10. Schematic Diagram Main Section (1/11)················· 40 5-11. Schematic Diagram Main Section (2/11)················· 41 5-12. Schematic Diagram Main Section (3/11)················· 42 5-13. Schematic Diagram Main Section (4/11)················· 43 5-14. Schematic Diagram Main Section (5/11)················· 44 5-15. Schematic Diagram Main Section (6/11)················· 45 5-16. Schematic Diagram Main Section (7/11)················· 46 5-17. Schematic Diagram Main Section (8/11)················· 47 5-18. Schematic Diagram Main Section (9/11)················· 48 5-19. Schematic Diagram Main Section (10/11)··············· 49 5-20. Schematic Diagram Main Section (11/11)··············· 50 5-21. Printed Wiring Board Main Section ························· 51

Main Section (1/4) ····················································· 52 Main Section (2/4) ····················································· 53 Main Section (3/4) ····················································· 54

Main Section (4/4) ····················································· 55 5-22. Schematic Diagram Audio Section ·························· 56 5-23. Printed Wiring Board Audio Section························ 57 5-24. Schematic Diagram Level Meter Section················· 58 5-25. Printed Wiring Board Level Meter Section·············· 59 5-26. Schematic Diagram LCD Section ···························· 60 5-27. Printed Wiring Board LCD Section ························· 61 5-28. Schematic Diagram Switch Section ························· 62 5-29. Printed Wiring Board Switch Section ······················ 63 5-30. Schematic Diagram Foot Switch Section················· 64 5-31. Printed Wiring Board Foot Switch Section ·············· 65 5-32. IC Pin Function Description ······································ 66 5-37. IC Block Diagrams····················································· 69

6. EXPLODED VIEWS

6-1. Cabinet Section ·························································· 76 6-2. Key Section ································································ 77 6-3. LCD Section······························································· 78 6-4. MD Mechanism Section (CCMD-2000)···················· 79

7. ELECTRICAL PARTS LIST ······································· 80

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

• Nev er reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Unleaded solder

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flo w) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

MDCT-1000

Location and Function of Controls

For details, refer to the pages indicated in ( ).

SECTION 1

GENERAL

This section is extracted from instruction manual.

1 LCD display 23Built-in speaker

MONITOR VOL control

4 LCD CONTRAST control

Adjusts the contrast of the display.

5 MONITOR select buttons (ALL/1/2/3/4) (8) 6 STANDBY switch 7 MD insertion slot 8 Z EJECT button

Left side

Rear

9 FUNCTION button q; DISP MODE button (10) qa Arrow buttons qs ENTER button qd Jog dial qf x STOP button qg m REW/BS button qh u PLAY/PAUSE button qj M FF/FS button

qk CONTROL UNIT connector (11) ql EAR jack (8)

w; DC IN 12V jack (7)

Display Window (Information screen)

2 3

4 5

MDCT-1000

1 Status display (17)

Indicates the disc inserted in or the status of deck as follows:

BLANK: a blank disc NO DISC: no disc PB ONLY: a commercially available recorded disc (for playback only) PROTECTED: a protected disc RECORDED: a recorded disc

23TIME display

Indicates the recorded time at the current location for each index item.

(copied) display Indicates that a disc digitally copied on MDCC2000 is inserted.

4 INDEX counter

Lights up when a disc is inserted. Blinks during an index search. (9)

5 END display

This shows the end of the disc.

6 Disc status display

Indicates the status of the disc with pictures.

7 Message display

Indicates various data by characters and various error messages. (17)

8 Disc position display

Indicates the current playback location on the disc by a white box. Already recorded parts are indicated in black. The further it is to the right, the closer the disc is to the end. Depending on the condition of the disc, the black part might not reach the far right even if the disc is full.

MDCT-1000

)

SECTION 2

DISASSEMBLY

• The equipment can be removed using the following procedure. • Disassemble the unit in the order as shown below.

Set

Cabinet (upper) section

Switch section

LCD section

MD section Main board

Volume section

Door

MD board

Base unit section

BUM-F1 board

REC/PB head assy (HR901) section

Holder assy, cartridge installation Optical pick-up (KMS-250A) section

Note : Follow the disassembly procedure in the numerical order given.

2-1. CABINET(UPPER) SECTION

Holder assy, cartridge section

Cabinet (upper) assy

Four claws

Connector

(CN9102)

Three s

crews (+PSW4

× 1

Two s

crews (+PSW4

× 1

2-2. SWITCH SECTION

SWITCH board

Seven s

(STEP M2)

(+PSW 3

crews

Five screws

Seven

(+PS 3

screws

Key switch block assy

MDCT-1000

2-3. LCD SECTION

Cable, flexible flat

(70mm)

Cable, flexible flat (90mm)

Plate (LCD), transparent

Holder (LCD)

Claws

Eight s

(STEP M2)

crews

Four

(+PSW 3

Four

Connector

(CN4002)

screws

screws (+PS 2

(+PS 3

Three

screws

LCD bracket

LCD board

LCD

Light unit, back

Connector

(CN4001)

MDCT-1000

2-4. MD SECTION

Three screws

(+PS 3

MD mechanism

Connector(CN9101)

Cable, flexible flat

(295mm)

Screw

(+PS 3

Two screws

(+PSW 3

× 8

)

AUDIO I/O board

2-5. V OLUME SECTION

Screws

(+PSW 3

(CN9001)

Connector

FOOT SWITCH board

Two screws (+PS 3

(CN9202)

Two screws

(+PSW 3

Knob(VOL)

Two nuts

Spacer

Level meter bracket

Connector

(CN8001)

Connector

Three screws (+PS 3

Connector(CN6002)

LEVEL METER board

Screw

(+PSW 3

VOLUME board

2-6. MAIN BOARD

Four screws

(+PSW 3

MAIN board

MDCT-1000

Connector(CN111)

Cable, flexible flat

(295mm)

Cabinet (lower)

MDCT-1000

2-7. DOOR

2-8. MD BOARD

spring, door return

Release the hook.

Tw o

screws

(M 2

Door

Release the boss.

MD board

Tw o

screws

(M 2

Flexible wire

(18 core, CN5)

Flexible board

(CN3)

Flexible board

(CN1)

2-9. BASE UNIT SECTION

Two screws (step)

Base unit

Two screws (step)

crew

(toothed lock M 2

MDCT-1000

3.5)

2-10. BUM-F1 BOARD

Two s

(precision +M 1.7

crews

Claw

2.2)

BUM-F1 board

Lug, 2

Claw

Flexible board

(CN302)

Flexible board

(CN304)

Plam flexible board

(CN303)

MDCT-1000

2-11. REC/PB HEAD ASSY (HR901) SECTION

Lug, 2

crew

(toothed lock M 2

3.5)

uide, screw

crew

(toothed lock M 1.4)

Tw o

screws

(M 1.7

2.8)

Motor, DC geared

(M903)

2-12. HOLDER ASSY, CARTRIDGE SECTION

While releasing the four bosses, remove the cartridge holder assembly in the direction of the arrow

REC/PB head assy (HR901)

the arrows

Boss

Removed hook

Push it in the direction of

and B with fingers.

Boss

2-13. HOLDER ASSY, CARTRIDGE INSTALLATION

When installing the cartridge holder, coat the portion grease (EM-30L).

shown in the illustration with

Position

MDCT-1000

2-14. OPTICAL PICK-UP (KMS-250A) SECTION

Spring, g

uide shaft retainer

Two screws

(Precision, +P 1.7

2.2)

Two screws

(M 1.7

Position

4.5)

Two washers

Motor, stepping

(M902)

Two screws

(Precision, +P 1.7

2.2)

Optical pick-up (KMS-250A)

MDCT-1000

SECTION 3

TEST MODE

NOTE

This machine does not have either DECK B nor the recording function.

3-1. Description

3-1-1. How to Enter the Test Mode

Pressing the G G ENTER g g g g g ENTER G G ENTER F buttons.

3-1-2. How to Exit the Test Mode

While pressing the G button, rotate the JOG dial and set “k_test_h” to “0”.

3-1-3. How to Cancel the ENTER key

The numeric keys that have been input up to the moment can be canceled at the following so that the machine does not enter the test mode unless otherwise needed.

1. When the interval of pressing the previous numeric key and the next key exceeds one second or more.

2. When the deck select key is pressed.

3. When the k_mode changes.

4. When the selected deck has changed.

5. When the test mode is set.

3-1-4. How to Select the Test Item

The test item can be selected by “k_test_h” and “k_test_l”.

1. Displaying the selected item The selected item is displayed on LCD as follows.

Value of “k_test_h” (Displayed in hexadecimal number) Value of “k_test_l” (Displayed in hexadecimal number)

3-1-5. T est Display

01 - 00 (Top menu)

00 - 00 EXIT (Exit) 01 - 00 THIS MENU (Top menu) 02 - 00 AUDIO (Audio firmware test) 03 - 00 MECH (Mechanism test) 04 - 00 DISPLAY (Display system test) 05 - 00 KEY (Key test) 06 - 00 COMMUNICATION (Communication test) 07 - 00 AUDIO HW (Audio hardware test) 08 - 00 DIGITAL HW (Digital hardware test) 09 - 00 NVRAM (NVRAM test)

3-1-6. Communication with Mechanism Deck

Communication with the mechanism deck is performed using programs such as “Hyper terminal” or the like that have been started up on a PC. Refer to 3-3-3. “Selecting the Terminal”. (Communication control with the log system or trace monitor is not possible.)

3-1-7. Circuit Block

General purpose port

KEY

CPU

CPU bus

1809

NVRAM

ROM

CLOCK

SRAM

FIFO8655

DRAM

LCD

05 - 01

/* KEY INCREMENT TEST */

2. How to select the test item using the JOG dial

1. While pressing G b utton, rotate the JOG dial. “k_test_h” changes. When “k_test_h” changes, “k_test_l” is set to “0”. Select the desired test category using “k_test_h”.

2. While pressing g button, rotate the JOG dial. “k_test_l” changes. Select the desired test item using “k_test_l”.

3. Sets the selected test item either by pressing g button after selecting “k_test_l” or by pressing the ENTER button.

3. How to select the test item with the use of the PC remote command The desired test item can be selected by sending the remote command of rewriting “k_test_h” and “k_test_l” from the PC to the machine. When the “k_test_h/l” change command is sent from a PC to the machine while the “k_test_h/l” change inhit bit is being set, the machine returns NAK and the machine does not chanage “k_test_h/l”.

DECK A

CODEC

AD/DA

3-2. Audio Firmware Test: [AUDIO]

SF data storage method in the DRAM.

• Test program is stored as shown below. (Operations start in the order starting from channel 1, channel 2, channel 3, and up to channel 4 under the ordinary operation conditions but the test mode starts from channel 1, channel 3, channel 2, and channel 4 in this order.)

0123

1chSF

3ch 2ch 4ch

FIF012 CXD1858 1.2ch

FIF034 CXD1858 3.4ch

LCD: Types, conditions and others of the test are displayed on the LCD during each test. Channel selector and channel selector LED: Select the channel selector by manual operation. Voice mirror: Change the input level by manual operation.

• Perform the following tests after the machine is set in the “STOP” mode.

02-00 /* AUDIO-F TEST MENU */

02-00 AUDIO-F MENU

MDCT-1000

3-2-1. Audio Recording and Playback Test without Disc

• The audio signal (up to the full memory capacity of the DRAM at a maximum) is recorded in the ATRAC data recording area in the DRAM and is played back.

• Note: If the audio sources of channel 1 to channel 4 are all the same,

• Playback is slower than normal if the 4 channels are recorded and 2 channels are played back. (The pitch of the playback remains unchanged and the playback speed of it is half of normal.)

• Playback is faster than normal if the 2 channels are recorded and 4 channels are played back. (The pitch of the playback remains unchanged and the speed of it is double of normal.)

02-01 4ch-REC on DRAM 02-02 4ch-PLAY on DRAM 02-03 2ch-REC on DRAM 02-04 2ch-PLAY on DRAM 02-05 reserve 02-06 reserve

3-2-2. Microphone Sound Monitoring from Speaker during Stop

• Application: For testing “ripping” sound of speak er (Sweep sound is input from external source.)

• Application: For testing the voice mirror LED (sound is input from external source.)

02-07 REC_MONI, SP, 1-4ch

3-2-5. Audio Muting T est

• ROM_PB (990Hz, -0.2dB, 1 to 4ch)

02-19 XMUTE=on, MODE=00, (During ROM_PB, circuit playback + mute) 02-1A XMUTE=on, MODE=01, (During ROM_PB, circuit recording + mute) 02-1B XMUTE=on, MODE=10, (During ROM_PB, circuit STOP + mute) 02-1C XMUTE=on, MODE=11, (During ROM_PB, circuit STANDBY + mute) 02-1D XMUTE=off, MODE=00, (During ROM_PB, circuit is in playback.) 02-1E XMUTE=off, MODE=01, (During ROM_PB, circuit is in record.) 02-1F XMUTE=off, MODE=10, (During ROM_PB, circuit is STOP.) 02-20 XMUTE=off, MODE=11, (During ROM_PB, circuit is STANDBY.)

3-3. Mechanism Deck: [MECH]

03-00 /* MD TEST MENU */

01-0E .....etc

10-1F DECK-A Only (Check & Setting) 20-2F DECK-B Only (Check & Setting) 30-3F DECK-A Only (Display Log) 40-4F DECK-B Only (Display Log) 50-57 Laser Check

3-3-1. Displaying the Number of Times of Using the Lasers

The number of times of using the lasers of the deck-A and deckB is displayed. The number of times of using the lasers is stored in the NVRAM, and the number of times that the laser power has entered the MO write (number of clusters), is displayed.

3-2-3. ROM Playback 1

• The pseudo ATRAC data on the EPROM is copied to the 1SG area on the DRAM and is played back repeatedly.

• Application: Level/Frequency response test

02-08 990Hz, -0.2db, 1-4ch (For playback of the reference level) 02-09 43Hz, -0.2db, 1-4ch 02-0A 10KHz, -0.2db, 1-4ch 02-0B 990Hz, -12db, 1-4ch 02-0C Infinity, 0, 1-4ch (For S/N test)

3-2-4. ROM Playback 2

• The pseudo ATRAC data on the EPROM is copied to the 1SG area on the DRAM and is played back repeatedly.

• Application: Separation/Frequency response test

• Other channels : No sound

02-0D 990Hz, -0.2db, 1ch 02-0E 990Hz, -0.2db, 2ch 02-0F 990Hz, -0.2db, 3ch 02-10 990Hz, -0.2db, 4ch 02-11 43Hz, -0.2db, 1ch 02-12 43Hz, -0.2db, 2ch 02-13 43Hz, -0.2db, 3ch 02-14 43Hz, -0.2db, 4ch 02-15 10KHz, -0.2db, 1ch 02-16 10Hz, -0.2db, 2ch 02-17 10Hz, -0.2db, 3ch 02-18 10Hz, -0.2db, 4ch

03-01

DECK-A Laser Cnt = xxxxxxxx DECK-B Laser Cnt = xxxxxxxx

3-3-2. Displaying Temperature of Mechanism

The temperatures of the mechanism of deck-A and deck-B are displayed. The temperature of mechanism indicates the temperature inside the RF amplifier mounted on this machine. However, use this temperature as a reference value because it is not highly accurate.

03-02

Thermo

DECK-A 35˚C [Result] = [55] [0B] [58] [62] [07] [09] [09]

DECK-B 31˚C [Result] = [55] [0B] [58] [5F] [06] [06] [06]

3rd byte of the above [Result] data string : Initial value of the temperature sensor at 25˚C 4th byte of the above [Result] data string : Present temperature sensor value

3-3-3. Selecting the Terminal

Select the PC terminals (RS-232C) on the rear of this machine. Either one of the two patterns “Other” and “Mech”, can be selected. Other : For checking contents, etc of the system memory Mech : For checking status of the mechanism operation

03-0A

Terminal Mode = Mech

MDCT-1000

The PC should use the terminal software (such as Hyper-T erminal or Tera-Term). Sets the communication as follows.

Baud rate : 9600 bps Data length : 8 bits Parity : None Stop bit : 1 Flow control : None

3-3-4. Dump List

Displays the Dump-List of the specified address. Sets the address value (Adrr) and number (Num) of display bytes by rotating the JOG dial and pressing ENTER button.

03-0D

Adrr = 00000000 Num = 00

3-3-5. Deleting (Deck-A/Deck-B)

Performs deletion of the disc data.

03-14 (DECK-A) 03-24 (DECK-B)

3-3-6. OA (Inner track, Middle track and Outer track) (Deck-A/

Deck-B) Performs the OA (overall) test against the inner track (UTOC area)/Middle track/Outermost track. Performs “Write”, “Read”, and “Verify” for every 1 cluster as many as 10 clusters in each area.

03-15 (DECK-A) 03-25 (DECK-B)

Result display

When the OA test of each area has ended with success, the following message appears on the LCD.

When the “Mech” position of the terminal is selected, the test status can be checked as follows. Description of the contents displaying the test status

Example of display

$$ TEST-drv [CNT] (W/R/D/S) (TW/TR) (Result)

drv : Drive No. CNT : Number of times of test W : Number of times of “Write” error

Number of times of the write failure for the single write command (“Seek” error is not included.)

R : Number of times of “Read” error

Number of times of the read failure for the single read command (“Seek” error is not included.)

D : Number of times of alternation

Number of times of giving-up to write into the specified cluster

S : Number of times of “Seek” error

Number of times that “Seek” error has occurred

TW : Number of times of TOC “Write” error

Number of times of the TOC write failure for the single TOC “Write” command (“Seek” error is no included.)

TR : Number of times of TOC “Read” error

Number of times of the TOC read failure for the single TOC “Read” command (“Seek” error is no included.)

Result : Test result up to present (1 : OK, 0 : NG)

Result display

When the OA test has ended with success, the following message appears on the LCD.

***

Total OK

***

3-3-8. Checking Operations of Mechanism (Deck-A/Deck-B)

Operations of the mechanism are checked using the terminal.

***

Total OK

***

• After the above message appears with normal end, the disc is ejected automatically.

3-3-7. OA (Overall Test for Normal Recording ) (Deck-A/Deck-B)

The OA test in the same operation as the normal recording is performed. The process of “Write”, “Read” and “Verify” is performed for every 1 cluster starting from the innermost track of the recording area to the outermost track. Then the “UTOC Write” is performed for every 10 clusters.

03-16 (DECK-A) 03-26 (DECK-B)

03-17 (DECK-A) 03-27 (DECK-B)

Dedicated for

mechanism

Waiting for ’ . ’

Mechanism test Prompt

:MON>

Waiting for mdmon

Waiting for exit Waiting for command

Operation step

Step 1 : Enters the test mode of the mechanism. Step 2 : Type in “mdmon” against “MON>” and set it. Step 3 : Press the ENTER button several times until the

machine enters the test mode dedicated for mechanism.

Step 4 : Performs the operation check in accordance with

the display output. Step 5 : Type in “.” to return to “Prompt”. Step 6 : Type in “exit” to set the operation and exit the

test mode of the mechanism.

MDCT-1000

3-3-9. Eject (Deck-A/Deck-B)

Ejects the disc.

03-18 (DECK-A) 03-28 (DECK-B)

3-3-10. Clearing the Number of Times of Using the Laser

(Deck-A/Deck-B) The number of times of using the laser is stored, and is cleared as follows. It is necessary to clear the number of times data of using the laser whenever the laser is replaced.

03-19 (DECK-A) 03-29 (DECK-B)

DECK-B Laser Count Clear

NV-RAM Save OK

3-3-11. OA (Overall Test for Random Recording )

(Deck-A/Deck-B) The (OA) overall test is performed using the same operation as that of the normal recording. The “write”, “read”, and “verify” are performed at every cluster at random within the recording area. The “UTOC write” is performed at every ten clusters. The test ends after the specified time has passed.

When the “Mech” position of the terminal is selected, the test status can be checked as follows. Description of the contents displaying the test status

Example of display

$$ TEST-drv [CNT] (W/R/D/S) (TW/TR) (Result)

drv : Drive No. CNT : Number of times of test W : Number of times of “Write” error

Number of times of the write failure for the single write command (“Seek” error is not included.)

R : Number of times of “Read” error

Number of times of the read failure for the single read command (“Seek” error is not included.)

D : Number of times of alternation

Number of times of giving-up to write into the specified cluster

S : Number of times of “Seek” error

Number of times that “Seek” error has occurred

TW : Number of times of TOC “Write” error

Number of times of the TOC write failure for the single TOC “Write” command (“Seek” error is no included.)

TR : Number of times of TOC “Read” error

Number of times of the TOC read failure for the single TOC “Read” command (“Seek” error is no included.)

Result : Test result up to present (1 : OK, 0 : NG)

3-3-12. Rescue (2-channel Mode) (Deck-A/Deck-B)

When the UTOC information shows error, the disc can be recovered as follows.

03-1E (DECK-A) 03-2E (DECK-B)

DECK-A Rescue 2Ch Mode Disc-Input!!

Result display

Index structure : Only 1 index is used over the entire area

of a disc. Recording mode : 2-channel mode Original : Original Name information : Invalid Time information : Invalid

3-3-13. Rescue (4-channel Mode) (Deck-A/Deck-B)

When the UTOC information shows error, the disc can be recovered as follows.

03-1F (DECK-A) 03-2F (DECK-B)

DECK-A Rescue 4Ch Mode Disc-Input!!

Contents of recovery

Index structure : Only 1 index is used over the entire area

of a disc. Recording mode : 4-channel mode Original : Original Name information : Invalid Time information : Invalid

3-3-14. Laser Power OFF (Deck-A/Deck-B)

Turns off the laser power.

03-50 (DECK-A) Laser Power (DECK-A) = OFF

[Result] = [01] [1D] [00] [00] [00] [00] [00]

03-54 (DECK-B) Laser Power (DECK-B) = OFF

[Result] = [01] [1D] [00] [00] [00] [00] [00]

3-3-15. Laser Power MO-WRITE (Deck-A/Deck-B)

Sets the laser power to the “MO-WRITE”.

03-51 (DECK-A) Laser Power (DECK-A) = MO-WRITE

[Result] = [01] [1D] [00] [18] [00] [01] [00]

03-55 (DECK-B) Laser Power (DECK-B) = MO-WRITE

[Result] = [01] [1D] [00] [18] [00] [01] [00]

Result display

When the OA test has ended with success, the following message appears on the LCD.

***

Total OK

***

3-3-16. Laser Power CD-READ (Deck-A/Deck-B)

Sets the laser power to the “CD-READ”.

03-52 (DECK-A) Laser Power (DECK-A) = CD READ

[Result] = [01] [1D] [00] [08] [00] [02] [00]

03-56 (DECK-B) Laser Power (DECK-B) = CD READ

[Result] = [01] [1D] [00] [08] [00] [02] [00]

MDCT-1000

3-3-17. Laser Power MO-READ (Deck-A/Deck-B)

Sets the laser power to the “MO-READ”.

03-53 (DECK-A) Laser Power (DECK-A) = MO READ

[Result] = [01] [1D] [00] [08] [00] [03] [00]

03-57 (DECK-B) Laser Power (DECK-B) = MO READ

[Result] = [01] [1D] [00] [08] [00] [03] [00]

3-4. Display System Test: [DISPLAY]

04-00 /* DISPLAY TEST MENU */ 04-01 [LCD_cntr] - [u_com] : connection check

[LCD_cntr] - [h_sram] : connection check

[LCD_cntr] - [LCD] : connection check 04-02 LCD DOT all set 04-03 LCD DOT all clear 04-04 character check on h_sram (SAG1) [1] 04-05 character check on h_sram (SAG1) [2] 04-06 [u_com - [LCD_cntr] : test signal 04-07 transmission of character data 04-08... content of global_area_address

• Connecting the Microprocessor with LCD Controller

Microprocessor

XRD

XHWR

XCS4

16MHz

D15 D14 D13 D12 D11 D10

D9 D8

XRES

Divide-by-2

Reset IC

LCD controller

AO XRD XWR XCS

8MHz

XRES

• Connecting the LCD Controller with SRAM

LCD controller

VA15

VA14

VA13

VA12

VWR

VRD

VA14 VA13 VA12 VA11 VA10

VA9 VA8 VA7 VA6 VA5 VA4 VA3 VA2 VA1 VA0

D7 D6 D5 D4 D3 D2 D1 D0

ADDRESS

0000 to 6FFF 7000 to EFFF F000 to FFFF

123

AND

AND OR

Buff

[SRAM]

• 1st layer (Character screen) 0 (0000h) to 9999 (270Fh)

• 2nd layer (Graphic screen) 10000 (2710h) to 19999 (4E1Fh)

• SAG1 (Character storage) 61440 (F000h) to (FFFFh)

AND

VCE

MDCT-1000

• Connecting the LCD Controller with LCD

LCD controller LCD

XSCL

YDIS

D0 D1 D2 D3

XRES

Reset IC

PA4 (Microprocessor)

DELAY

AND

LOAD

FRAME

DISP

3-4-1. Connection Check between Microprocessor and LCD

Controller, and between LCD Controller and SRAM

• Check the checksum of the font and the graphic data that are transferred to SAG1 (F000h to FFFFh) of the SRAM for display when releasing the STANDBY mode.

[Calculation is under way.] 04-01

(data read from LCD cntr) = ????????

• When [OK] appears: Connection between the microprocessor and LCD controller and the connection between LCD controller and SRAM are correct.

04-01

(data read from LCD cntr) = xxxxxxxx

3-4-2. LCD Dot Check (Lighting All Dots)

Lighting all dots of LCD (Graphic data: By 0xff transfer)

04-02

3-4-3. Checking the LCD Dot (Turning off all dots)

All dots of LCD are turned off. (Graphic data : By 0x00 transfer)

04-03

3-4-4. Test Signal Output from Microprocessor to LCD Controller

Test signal output is under preparation.

04-06

NOW test signal loading...

Test signal is under preparation.

0xff and 0x00 are output repeatedly to the microprocessor ports D15 to D8 as follows.

About 0.25 S 0.25 0.25 0.25

About 30 seconds

The test signal output ends.

04-06

finished test signal output

3-5. Key Test: [KEY]

05-00 /* KEY TEST MANU */

05-01 KEY INCREMENT TEST 05-02 ANY KEY TEST 05-03 K_mode LOG

[OK]

• When [NG] appears:

1. If the following *NG display is recognized, “XRD” is

suspected.

2. If the following *NG display is not recognized (upon

confirmation through trace monitor), either one of the connections between microprocessor and LCD controller or the connection between LCD controller and SRAM or the connection between LCD controller and LCD is defective. (At this time, if the test signal is output from the microprocessor to LCD controller in step 04-06, whether the connection is OK or NG can be confirmed, and also which of the connections between LCD controller and SRAM or the connection between LCD controller and LCD is NG.)

04-01

(data read from LCD cntr) = KKKKKKKK

[NG]

Mabye read pattern NG. or. [LCD_cntr]-[u_com],[h_sram]: connect NG

3-5-1. Key Test by Pressing Keys in Order

05-01 /* KEY INCREMENT TEST */

Turn ON ⇒ DISPLAY(A)

When the specified “DISPLAY (A)” key is pressed correctly, the following messages appear.

05-10 /* KEY INCREMENT TEST */

⇒ DISPLAY(A)

Turn OFF

MDCT-1000

When releasing your finger from the key , the next ke y to be pressed is specified. When an incorrect key that is different from the specified one is pressed, following messages appear.

05-10 /* KEY INCREMENT TEST */

⇒ DISPLAY(A)

Turn OFF

The test cannot be advanced unless the correct key is pressed.

The “Key Test by Pressing Keys in Order” is complete. (Normally end)

When all of the key pressings are correct,

“COMPLETE”

appears on the LCD screen and type in 05-42.

(Abnormally end)

When the incorrect key is pressed more than once,

“xxxxx

at FAULT” appears on the LCD screen. An incorrect key that was detected at first in the order of pressing keys, is displayed in “xxxxx”.

3-5-2. Key Test by Pressing Arbitrary Key

05-02 /* KEY TEST */

PUSH KEY : OFF (FF/F5-FF) AD CODE : FF FF FF FF FF FF FF TRANSCRIBE : A POW : ON SEARCH MODE : INDEX JOG : 00

Displays the name of the pressed key.

Example : When the STOP button of the deck-A is pressed,

05-05

PUSH KEY : STOP (A) (00/00-09)

appears.

The first 2-digit “00” of (00/00-09) indicate the value that the pressed key after it is conv erted by AD con verter. The digits “00- 09” indicate the range when the key is judged as “STOP (A)”.

Allocation of key groups and keys

Application

Type

Group

Allocation of Kn

Application

Type

Group

Allocation of Kn

Application

Type

Group

Allocation of Kn

Foot switch operation

FS_PLAY

FS_FS

FS_BS 3 4 5 6 7 8 9

Operation of the mechanism

STOP(A)

STOP(B)

PLAY/PAUSE(A)

REW/REV(A)

FF/CUE(A)

MARK(A)

MARK_OFF(A) 7 8 9

FUNCTION

DEL

<(LEFT)

>(RIGHT)

5 6 7 8 9

ANALOG

Function

ANALOG

Operation of the mechanism

ANALOG

REC(A) REC(B) PLAY/PAUSE(B) REW/REV(B) FF/CUE(B) MARK(B) MARK_OFF(B)

Function

ANALOG

ENTER DISP_MODE(A) DISP_MODE(B)

Operation of the mechanism

ANALOG

INDEX EJECT(A) EJECT(B)

DECK_A DECK_B SEARCH

Function

ANALOG

REC_PAUSE

ANALOG

0 1 2 3 4 5 6 7 8 9

Power supply, etc.

DIGITAL

Use is prohibited Use is prohibited A/B(FS) INDEX/TIME STANDBY/ON

AD CODE

Displays values when the key inputs are converted by AD converter, in the order starting from 0 up to 7 from the left of the LCD screen.

05-05

Group 0

AD CODE : FF FF FF FF FF FF FF

Group 7

MDCT-1000

3-6. Communication Test: [COMMUNICATION]

• RS232-C connector When the pin-2 and pin-3 of the RS232-C connectors are connected, two values are displayed in the 2-digit hexadecimal values respectively on the LCD screen, one is the send data and the other is data that have been received by the loop-back.

Display example

Tx DATA 57 ← Send data. Rx DATA 57 ← Received data.

The value of the receiv ed data follows a little bit delayed after the send data. The send data increments at every about 0.5 seconds.

• Modular jack When pin-2 and pin-3 of the modular jack are connected to pin3 of the RS232-C connector, the same test can be done.

• Communication packet The status packet is used. Packet size = 38 bytes

06-00 /* PC_I/F LOOP BACK */

Tx DATA = xx Rx DATA = xx

3-7. Audio Hardware Test: [AUDIO HW]

• The following test should be performed while the machine is set in the “STOP” mode.

07-00 /* AUDIO-H TEST MENU */ 07-00 AUDIO-H MENU

07-01 RESERVE

3-7-1. Testing the Alarm Sound

07-02 XMUTE=on, MODE=00 (During alarm, circuit playback + mute) 07-03 XMUTE=on, MODE=01 (During alarm, circuit recording + mute) 07-04 XMUTE=on, MODE=10 (During alarm, circuit STOP + mute) 07-05 XMUTE=on, MODE=11 (During alarm, circuit STANDBY + mute) 07-06 XMUTE=off, MODE=00 (During alarm, circuit is in playback.) 07-07 XMUTE=off, MODE=01 (During alarm, circuit is in record.) 07-08 XMUTE=off, MODE=10 (During alarm, circuit is STOP) 07-09 XMUTE=off, MODE=11 (During alarm, circuit is STANDBY)

3-7-2. T esting LED

07-0A LED=4ch, LED=on 07-0B LED=2ch, LED=off

3-7-3. Stopping FINT Information

07-0C FINT INFORMATION

3-8. Digital Hardware System Test: [DIGITLAL HW]

• Performs the menu display of the digital system test items.

• SRAM test

Write/read test of the SRAM area is performed at the startup when the main power is turned on. 0x5555, 0xAAAA and 0x0000 are used as the write data. After completion of the writing the respective data, the data are read-out and are collated. The test area is 0x200000 to 0x207FFF in the area 1. When an error occurs during reading and collating, the REC LED on the deck-A will blink permanently. (The REC LED on the deck-A is connected to the pin-11 (PC0) of the IC1077 HD64003TF16.

• DRAM test Write/read test of the DRAM area is performed at the startup when the main power is turned on. 0x5555, 0xAAAA and 0x0000 are used as the write data. After completion of the writing the respective data, the data are read-out and are collated. The test area is 0x600000 to 0x7FFFFF in the area 3. The test is performed at every 257 bytes. When an error occurs during reading and collating, the REC LED on the deck-B will blink permanently. (The REC LED on the deck-B is connected to the pin-12 (PC1) of the IC1077 HD64003TF16.)

3-8-1. The Menu Display

08-01 /* DIGITAL HW TEST */

08-01 THIS MENU 08-02 ROM VERSION & DATE 08-03 ROM CHECK SUM 08-04 JOG INPUT 08-05 PULSE 10 mSEC 08-06 CXD-8655 WRITE/READ 08-07 CLOCK IC 08-08 CLOCK IC (power on) 08-09 LED ON/OFF 08-0A NMI 08-0B MODEL 08-0C LOCAL

3-8-2. ROM Version

Displays the release version of the programmed ROM.

08-02 /* ROM VERSION & DATE */

ROM: Ver No.0017 DATE: 2001.02.21

DECK A ROM : V 2.33 DECK B ROM : V 2.33

3-8-3. Check Sum of the ROM

Checksum of the programmed ROM is calculated. The checksum area is 0x00000 to 0x07FFFF in the area 0. Displays the address under calculation in hexadecimal number.

08-03 /* ROM CHECK SUM */

CHECK SUM = xxxx

MDCT-1000

Displays the calculation result in the 2 bytes hexadecimal number .

The result indicates the value which is the same as checksum calculated by the ROM writer.

08-FF /* ROM CHECK SUM */

CHECK SUM = 9375 COMPLETED

3-8-4. Entry by JOG Operation

The input data of the JOG operation is sampled by 1 msec. cycle. When the input data agree twice continuously, the data are confirmed as the input data. The confirmed input data pass through the chattering processing. Then the resultant input data is displayed.

08-04 /* JOG INPUT */

JOG-1 = 1 JOG-2 = 0 or 1

Displays the input status of the pin-2 of the CPU in the JOG-1. Displays the input status of the pin-3 of the CPU in the JOG-2. The JOG-1 is the input at pin-2 (PB0) connector of the IC1077 HD64003TF16. The JOG-2 is the input at pin-3 (PB1) connector of the IC1077 HD64003TF16.

3-8-5. PULSE Output

• Connection between the CXD-1809 and the CPU bus can be checked by this test.

08-05 /* PULSE 10mSEC */

The pulse for confirming the clock oscillation of the microprocessor is output. This pulse is output to pin-73 (RA03) terminal TP1058 of the IC1033 CXD-1809. The pulse width is 10 msec and the tolerance is less than 1/100.

10 mSEC 10 mSEC

3-8-6. Write/Read Test of CXD-8655

After writing 0x55 in the “Interrupt Timing Register” of the CXD8655 (IC1021), the value in the same register is read out and is checked whether the data is 0x55 or not.

3-8-7. Watch IC Test I

Displays the inside data of the watch IC and performs the error correction of the oscillation clock.

08-07 /* CLOCK DATA */

SECOND = 54 CORRECT = 10 MINUTE = 37 CRTL_1 = 20 OCLOCK = 14 CTRL_2 = 00 WEEK = 00 DAY = 02 SET CORRECT (JOG & ENTER) MONTH = 91 32769.500 - 32769.599 (10) YEAR = 00

“MONTH = 91” means a status that the 100-yaer bit is on. It becomes November by masking MSB.

1. Contents of displays

Items Contents of display

SECOND Displays the value of the “second” count register in 2-digit BCD. MINUTE Displays the value of the “minute” count register in 2-digit BCD. OCLOCK Displays the value of the “hour” count register in 2-digit BCD using

24-hour display.

WEEK Displays the value of the “week” count register in 2-digit

hexadecimal number. No. 0 to No. 7 corresponds to Sunday through Saturday respectively. But, because this machine does not use the day of No. 7, the data is different from the actual day of the week.

DAY Displays the value of the “date” count register in 2-digit hexadecimal

number.

MONTH Displays the value of the “month” count register in 2-digit

hexadecimal number. The bit 7 is set to “1” when the “year” count register is capable up to 100 years.

YEAR Displays the value of the “year” count register in 2-digit BCD.

Displays the value of the “CORRECT” error correction register in 2-digit hexadecimal number.

CRTL_1 Displays the value of the control register 1 in 2-digit hexadecimal

number.

Bit name Used for Setup value 7 : WALE Alarm control 0 = Alarm is invalid 6 : DALE Alarm control 0 = Alarm is invalid 5 : 12 24 12-hours/24-hours clock 1 = 24-hours clock 4 : CLEN2 32 kHz output 0 = Valid 3 : TEST IC test 0 = Normal operation

mode 2 : CT2 0 = OFF 1 : CT1 0 = OFF 0 : CT0 0 = OFF

Selecting the periodic interrupt

08-06 /* CXD- 8 6 5 5 WR/RD */

WRITE/READ COMPLETE.

If value is the same, “WRITE/READ COMPLETE” appears. If value differs, “WRITE/READ ERROR!” appears.

MDCT-1000

CRTL_2 Displays the value of the control register 2 in 2-digit

hexadecimal number.

Bit name Used for Setup value 7 : VDSL Power supply monitoring 0 = 2.1V

voltage

6 : VDET Result of power supply 0 = More than

monitoring monitoring

voltage 5 : SCRATCH Scribble bit 4 : XSTP Stops sending data 0 = Normal send

status 3 : CLEN1 32 kHz output 0 = Valid 2 : CTFG Fixed cycle interrupt 0 = OFF

output 1 : WAFG Alarm matches. 0 = Does not match. 0 : DAFG Alarm matches. 0 = Does not match.

SET CORRECT Indicates the method to set the correction value.

32768.500 to Indicates the clock oscillation frequency range.

32768.599 ( ) Indicates the correction value in parenthesis ( ).

2. Error Correction Corrects an error of the clock oscillation frequency of the watch IC.

1. Pull up the clock output (TP1001) of the watch IC to the

Vcc with a resistor (about 10 kΩ).

2. Measure the clock oscillation frequency.

The frequency counter which has the measurement accuracy of eight digits or more should be used.

3. Select the range of the oscillation frequency using the JOG

dial.

4. Press the ENTER button.

When the writing data into the watch IC and the storing data into the NVRAM are complete, “COMPLETE” appears.

5. When the ENTER button pressed once and then the hand

removed from the ENTER button, the value that are set in “CORRECT=” is reflected and stored.

(Note)

In order to return the machine to the customer with the status in which the clock error correction value is being saved, select “SHIPPING” in the test mode of the NVRAM and press the ENTER button, or alternately exit the test mode and enter the STANDBY mode. In the latter method, be careful that the stamp information, password, reverse time, etc are not initialized. (If the NVRAM is initialized or the pattern write test is performed, the clock error correction value that is sav ed in the NVRAM, will also be initialized.)

3-8-8. Watch IC Test II (When power is turned on)

The inside data of the watch IC before executing the backup battery run-out check is displayed at the moment of immediately after the power-on of the machine. Accordingly, the data before resetting the watch IC at the event of backup battery run-out check, etc can be confirmed.

08-08 /* CLOCK IC (Data just before power on) */

SECOND = 54 CORRECT = 10 MINUTE = 37 CRTL_1 = 20 OCLOCK = 14 CTRL_2 = 00 WEEK = 00 DAY = 02 [OSCILLATOR : OK (CONTINUED) ] MONTH = 91 [SECOND-YEAR DATA : LEGAL ] YEAR = 00 [BACKUP BATTERY : OK (MORE THAN 2.1V) ]

“MONTH = 91 becomes November by masking MSB in the status in which the 100-yaer bit is set to on.

1. Contents of displays The contents are the same as those of Section 3-8-7. “Watch IC T est I” except for the following.

Items Contents of displays

[OSCILLATOR : OK (CONTINUED) ] When the oscillation stop

is not detected.

[OSCILLATOR : NG (STOPED) ]

[SECOND-YEAR DATA : LEGAL ]

[SECOND-YEAR DATA : ILLEGAL ]

[BACKUP BATTERY : OK (MORE THAN 2.1V) ] When the backup battery

[BACKUP BATTERY : LESS THAN 2.1V ] When the backup battery

When the oscillation stop is detected. When the data of second, minute, hour, date, month, and year are of the possible values. When the data of second, minute, hour, date, month, and year are of the impossible values.

is normal.

has run out.

3-8-9. LED ON/OFF

The LEDs of the channel 3 and channel 4 of the monitor and those of LINE OUT, the deck-A and deck-B, and the REC button simultaneously blink.

08-09 /* LED ON/OFF */

1. 3ch/4ch

2. DECK A/B

3. REC A/B

The period of blinking is 0.5 seconds for “on” and 0.5 seconds for “off”.

0.5 SEC 0.5 SEC

MDCT-1000

3-8-10. NMI Test

When the NMI starts, “NMI ON” appears.

08-0A /* NMI */

NMI ON

“NMI OFF” appears about one second later.

08-0A /* NMI */

NMI OFF

Outputs the pulse to pin-73 (RA03) terminal TP1058 of the IC1033 CXD-1809. Pulse width is about 1 sec.

IC1002-8 PIN

IC1007-72 PIN

IC1033-72 PIN

1 SEC

3-9-1. Setup for Shipment of the Machine

The data except the watch correction value and the number of times of use of the laser are initialized.

09-01 /* NVRAM INITIALIZE / CHECK */

Setting-up is under way.

Setup for shipment of the machine is under way.

09-10 /* NVRAM SHIPPING */

Result

(Normal completion) Display of completion of setup for shipment of the machine

09-FF /* NVRAM SHIPPING */

COMPLETE.

CUT OFF POWER!

Shut off the power supply after this. (After completion of the test mode by setting k_test_h to 0x00, you may set the [STANDBY] mode.)

LCD display

"NMI OFF" "NMI ON" "NMI OFF"

3-9. NVRAM Test: [NVRAM]

After writing the word data (2 bytes) with 128 words to the evennumbered address from the address 0x00, write 128 words to the odd- numbered address from the address 0x01. After reading and checking at every ev en-numbered address from the address 0x00, read and check at odd-numbered address from the address 0x01.

09-01 /* NVRAM INIIALIZE / CHECK */

09-01 SHIPPING 09-02 INITIALIZE 09-03 PATTERN CHECK

SELECT and ENTER

While pressing the g button, rotate the [JOG] dial, then the setup or test starts by pressing the ENTER button after changed k_test_l.

• Remote selection By sending the remote command for the setup of k_test_h and k_test_l, the test can start to perform directly without operating buttons of g , [JOG], ENTER , etc.

(Abnormal completion)

Display of the abnormal completion of the setup for shipment of the machine

09-10 /* NVRAM SHIP INITIALIZE */

ERROR. REPAIR HARDWARE!

Data of the NVRAM are undefined. Investigation to perform repair, etc is required.

Initialized data of the NVRAM

Marks Items Values Remarks A disp_cnt_A/B 0x11 A=Lower 4-bit, B=Higher 4-bit B deck status 0x00 use, mark_a/b C mark_clust_a 0x00 Cluster address of the mark A D mark_clust_b 0x00 Cluster address of the mark B E mark_sect_a 0x00 Sector address of the mark A F mark_sect_b 0x00 Sector address of the mark B G pb_stop (A/B) 0x00 Playback stop position address H laser (A/B) ? Count of use of the laser I rec_mode 0x01 Record ATARC mode J rev_time 0x00 Reverse time K pass_word 0x00 Password L correct ? Error correction value of the watch M reserve 1 Reserved N crc_int ? CRC of the above O stamp 0x00 Stamp character string P crc_stamp ? CRC in stamp character string

MDCT-1000

3-9-2. Initialization of the NVRAM

09-02 /* NVRAM INITIALIZE/CHECK */

During execution of the initialization, “k_test_l” shows the following values.

Value of k_test_l Status

0x21 During write. 0x22 During read. 0xFF Completion of the check

Display during initialization

09-20 /* NVRAM INITIALIZE */

NOW NVRAM INITIALIZE.

Result (Normal completion of the initialization)

If nv_error=0, the initialization has normally ended.

09-FF /* NVRAM INITIALIZE */

COMPLETE. CUT OFF POWER.

3-9-3. 4-Pattern Check

09-03 /* NVRAM INITIALIZE / CHECK */

During execution of the check, “k_test_l” shows the following values.

Value of k_test_l Status

0x31 Data write is in progress. Both even number and odd number

are 0x0000. 0x32 Data read and data check are in progress. 0x33 Data write is in progress. Even number is 0x5555 and odd

number is 0xAAAA. 0x34 Data read and data check are in progress. 0x35 Data write is in progress. Even number is 0xAAAA and odd

number is 0x55555. 0x36 Data read and data check are in progress. 0x37 Data write is in progress. Both even number and odd number

are 0xFFFF. 0x38 Data read and data check are in progress. 0xFF Check is complete.

Display during check

09-31 /* NVRAM PATTERN CHECK */

1. NOW 00-00 PATTERN CHECK

All data of the NVRAM are set up to 0xFFFF (the initial value of the device). After this, shut off the power supply. (Note) The correction information of the watch is set up to “No correction (0)”.

(Abnormal completion of the initialization)

If nv_error=0x10, the initialization has ended with failure.

09-FF /* NVRAM INITIALIZE */

ERROR. REPAIR HEARDWARE!

The data of the NVRAM are undefined. Investigation to perform repair, etc is required. (Note) The correction information of the watch is set up to “No correction (0)”.

Result of the check (In the normal case)

If nv_error=0, the result is normal.

09-FF /* NVRAM CHECK */

1. 00-00 PATTERN CHECK OK.

2. 55-AA PATTERN CHECK OK.

3. AA-55 PATTERN CHECK OK.

4. FF-FF PATTERN CHECK OK. CHECK END. CUT OFF POWER.

All data of the NVRAM are set up to 0xFFFF (the initial value of the device). After this, shut off the power supply. (Note) The correction information of the watch is set up to “No

correction (0)”.

(In the abnormal case)

If nv_error>0, the result is abnormal.

09-FF /* NVRAM CHECK */

1. 00-00 PATTERN CHECK OK.

2. 55-AA PATTERN CHECK OK.

3. AA-55 PATTERN CHECK ERROR.

4. FF-FF PATTERN CHECK OK.

REPAER THE HEARDWARE!

Example : An error in write and read of the AA-55 pattern Investigation to perform repair, etc is required. (Note) The correction information of the watch is set up to “No correction (0)”.

MDCT-1000

SECTION 4

ELECTRICAL ADJUSTMENTS

4-1. LASER POWER ADJUSTMENT

1. Enter the test mode of Checking Operations of Mechanism, and start up the adjustment program. (Refer to section 3-3-13. Checking Operations of Mechanism.)

:MON>mdmon

MD DRIVE TEST MODE MONITOR Wait..... Hit ’.’ to exit

>>>PDMD-7 TEST MODE V2.14 [Feb. 16 1998] >>

2. When the return key is pressed, the menu is displayed.

>>>PDMD-7 TEST MODE V2.14 P)Play A)Access N)Info E)Eject R)Rec K)Erase V)Volum !)Reset X)Cmd L)Laser F)Focus W)Switch S)Spindl J)Jump G)FGSV D)Sled M)EEPROM U)Adjust C)Spec T)Still Y)Sync 1)Mon 2)Aging >>

3. Select U)Adjust.

>>u

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>

4. Select 2) LASER.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>2

--- READJUST?

5. Set the laser power meter (J-2501-046-A) and press the return key.

>>WRITE POWER : 6.85 mW

1)- 2)+ [DA] FD [00ED]

6. Adjust the laser power by pressing [1] key (decreasing the laser power), [2] key (increasing the laser power) until the laser po wer measurement value is as close as possible to 6.85 mW. Press the return key to set the adjustment value. (Do not take to long time for adjustment. If it takes too long time, the laser power will fluctuate due to temperature increase.)

1)- 2)+ [DA] FD [00ED]

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>

7. Eject the probe of the laser power meter.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>e

4-2. SERVO ADJUSTMENT

1. Set the MD data disk (recordable disk).

2. Select 3) EFBL/SERVO/FBIAS.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>3

---MO PIT (FBIAS)---------FBIAS [10]

---MO GROOVE (EFBL)---------EFBL [0F]

---MO WRITE (EFBL)---------EFBL [0F]

---MO GROOVE (FOCUS)---------K13 [4D]

---MO GROOVE (TRACKING)---------K23 [43] K07 [43]

---MO GROOVE (FBIAS)---------FBIAS [2F]

T=6774(msec)

3. Press the [ESC] key to terminate the adjustment menu.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >> >>

4. Eject the MD data disk (recordable disk).

>>e

5. Select U)Adjust.

>>u

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>

6. Set the MD data disk (read only disk).

7. Select 3) EFBL/SERVO/FBIAS.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >>

---CD DISC (EFBL)---------EFBL[10]

---CD DISC (FOCUS)---------K13[38]

---CD DISC (TRACKING)---------K23[30] K07[30]

---CD (FBIAS)---------FBIAS[00]

T=3143(msec)

8. Press the [ESC] key to terminate the adjustment menu.

1)TEMP 2)LASER 3)EFBL/SERVO/FBIAS

5)EFBL 6)SERVO 7)FBIAS E)Eject >> >>

9. Eject the MD data disk (read only disk).

>>e

10. Press the period [.] key to exit the adjustment program.

>>.

:MON>

11. Turn off the main power of this machine.

:MON>pwof

Note :

If discs are replaced while the machine is left in the U/Adjust mode in the machines up to Ver 2.14, the disk types may be incorrectly recognized and adjustment may not be possible. In such a case, press the [ESC] key to terminate the U)Adjust mode once and then select U)Adjust again.

SECTION 5

DIAGRAMS

MDCT-1000

5-1. CIRCUIT BOARDS LOCATION

Note on Printed Wiring Boards: MAIN SECTION

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

• : Pattern of the rear side.

Note on Schematic Diagram: MAIN SECTION

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/

•

Note: The components identified by mark 0 or dotted line with

• : B+ Line.

• Power voltage is dc 12 V and fed with regulated dc power supply

• Voltages and waveforms are dc with respect to ground under no-

• Voltages are taken with a VOM (Input impedance 10 MΩ).

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

: internal component.

mark 0 are critical for safety. Replace only with part number specified.

from battery terminal.

signal conditions. no mark : PLAY

Voltage variations may be noted due to normal production tolerances.

E : PB

W or less unless otherwise specified.

• Waveforms

IC1009 pin4 (TP1006)

62.5 ns (16MHz)

IC1018 pin4

22.1 ns (45.1584MHz)

IC38 eh (CL25)

39.4 ns (25.4MHz)

IC2 pinya (CL18)

5.4 Vp-p

7.4 Vp-p

4.6 Vp-p

VOLUME board

LEVEL METER board

LCD board

SWITCH board

100 ns (10MHz)

4.6 Vp-p

AUDIO I/O board

FOOT SWITCH board

BUM-F1 board

MD board

MAIN board

2727

MDCT-1000

5-2. BLOCK DIAGRAMS

MD SECTION

HR901

OVER WRITE HEAD

OPTICAL PICK-UP

KMS-250A

(J2N)

ILCC

FCS+

FCS-

TRK+

TRK-

MOD

MD BOARD

I-V AMP

IC22

IC23

Q3,4

AUTOMATIC

POWER

CONTROL

IC13

IC24

SUM

RF MATRIX AMP

APC

IC14

FOCUS/TRACKING COIL DRIVER

SPINDLE MOTOR DRIVER

RO4

FO1

RO1

FO3

RO3

LDON

IC15

IC37

RI4

FI1

RI1

FI3

RI3

CLK

XRST XRST

IC21

FFDR

FRDR

TFDR

TRDR

FS4

VREF

PEAK

BOTM

ABCD

AUX

ADFG

APCREF

SWDT

SCLK XLAT

XSHOCK LMOD

LPF,PHASE SHIFT

21 38

37 36 35 33 32

16 17 18

IC17

IC26

SPSW

SPFD

FGSV

Q11-14

OVER WRITE

HEAD DRIVER

IC12

IC9

IC10

IC35

LPF

IC34

SHOCK DETECT

Q6-8

B+

SWITCH

CHUT

IC33

6 7

LMOD XSHOCK

+2.8V REG

IC29

DRIVER

I2I1Y2

I7Y7

I8G2Y8

EFM/ACIRC ENCODER/DECODER

VC RFI

PEAK

BOTM

ABCD

AUX1

ADFG

LDDR

IC36

IC20

SPFD

FFDR FRDR TFDR TRDR FS4

IC39

SPFD

FFDR

FRDR

TFDR

TRDR

FS4

XMGON

Q15,16

RF MOD

SWITCH

IC28

IC38 DSP,

5 4 1 2

VCC

WRPWR

EFMO

DTI

DTO

C2PO

BCK

LRCK

REC FOK

SENS

SQSY COUT SRDT

XTAI

XTAO

SPRD

SWDT

SCLK

XLAT

XRST

UNREG

• Signal Path

: PB

IC2

MD MECHANISM

CONTROLLER

29 30 31 32 33

14 99 11

99 10

DTI

DTO

C2PO

BCK

LRCK

25.4MHz

SPDL

DIR

TEMP

SENSOR

REC FOK

SENS

WRPWR

SQSY TCNT SRDT

10MHz

IC18

FGDR

SPSW FGSV

AD1

AD2

AD3

CSV

PS2

PS0

P74 P75

83 87

IRQ0

IRQ1 PA3

96 15

RXD1

EXTL

XTL

P45

P44 TCA4

TXD1

CLK1 P94

PB4

IRQ3

LDON

PB7

9 63

MLON

PB5

IC5

PB6

RECS

PB3

TXD0

RXD0

D0-D7 D0-D7

A0-A15 A0-A15

XRD

XWR XWE

CSO

P42 P41

P40 PS1

P43

IRQ2

TCA0

PA0

TCKB

PA1

TCA3

PA7 PA6 PA4

RES

27-34

36-43 45-52

70 71 91

20 19

18 59

21 89 95 93

100

99 97

IC6

RESET

TXD

RXD

XRST

DIR

PVCC

IC3

EEPROM

DAT

SCK

XRST2

UNREG

FLASH MEMORY

21-23 25-29

20-13 3,2,31 1,12,4

5,11

XOE

XCE

DSCPRO

RFLCT

DISCIN

EJECT

LIMIT

MOB

OEB

STOP

STBY

IC1

IC11

DTI

IC40

BUM-F1 BOARD

S301

S302

S303

S304

PVCC

MVCC

3.5V

VCC

3.5V

1 2

SPINDLE MOTOR DRIVER

+3.5V REG

IC302

COM

VS BK– FG STBY

IC301

MOB CK OEB CW STOP

IC19

IC30

IC4

1 2

SLED MOTOR DRIVER

27 28

4 3 1

SWITCH

+5V REG

Q10

SWITCH

UNREG

XRST2

(6.4V)

Q301-302

MOTOR DRIVER

C2PO LRCK BCK DTO DTI RECS

TXD

RXD XRST

D6.4V

(SPINDLE)

M903

(EJECT)

M902

(SLED)

M901

MAIN BOARD (3/3)

2828

I/O SECTION

MDCT-1000

LEVEL METER BOARD

IC9201

D9201-9203

D9204-9206

LED LEVEL

METER DRIVER

VC5

VC3

VC1

IC9202

LED LEVEL

METER DRIVER

VC5

VC3

VC1

D9207-9209

MON LEV 1

D9210-9212

MON LEV 2

MAIN BOARD (1/3)

MAIN BOARD (3/3)

IC9203

LED LEVEL

METER DRIVER

VC5

VC3

VC1

IC9204

LED LEVEL

METER DRIVER

VC5

VC3

VC1

MON LEV 4

MAIN BOARD (2/3)

XDEM MODE0 MODE1 XMUTE BEEP ON 2CH X4CH

MON LEV 3

D9207

-9212

MONITOR

XDEM MODE0 MODE1 XMUTE BEEP ON 2CH X4CH

A5V

Q9201-9203

B+ SWITCH

S9201,D9215-9219

MONITOR SELECTOR

MCLK XPD DADT12 LRCK SCLK

MAIN BOARD (2/3)

MCLK XPD DADT34 LRCK SCLK

MON SEL 1 MON SEL 2 MON SEL 3 MON SEL 4

17 20 12 10 11

3.3V (IC105) (IC305)

17 20 12 10 11

2CH X4CH

MON LEV 1

MON LEV 2

MON LEV 3

MON LEV 4

IC105

AD/DA CONVERTER

SDTO

MCKI

AOUTL

XPD STDI LRCK

AOUTR

SCLK

DEM0

ADDT12

XDEM

IC703

+3.3V

REG

IC305

AD/DA CONVERTER

SDTO

MCKI

AOUTL

XPD STDI LRCK

AOUTR

SCLK

DEM0

,ADDT34

A5V

2CH X4CH

ADDT12

ADDT34

IC107

AMP

IC307

AMP

IC106

BUFFER

IC306

BUFFER

SWITCH BOARD (2/2)

S9401

STANDBY

• Signal Path

: PB

MODE0 MODE1

BEEP ON

11 12

MON SEL 1

MON SEL 2

MON SEL 3

MON SEL 4

XMUTE

IC705(1/2)

Q701

SWITCH

IC501

MONITOR SWITCH

IC705(2/2)

B12V

2 8

MAIN BOARD (3/3)

Q1002

SWITCH

Q1003,1004

SWITCH

IC706(1/2)

BEEP OSC

IC1002

RESET

1110

IC706(2/2)

BUFFER

BEEP

IC505

AMP

VOLUME BOARD(2/2)

IC1006

REG ON

IC1063

XSTANDBY

XPDOWN

Q502

SWITCH

NMI

IC704

Q508,510

MUTING

RV6002

MONITOR

VOL

B12V

D5VCPU

D5V

D6.4V

D1006

IC506(2/2)

BUFFER

IC506(1/2)

AMP

Q509,510

MUTING

Q1005

SWITCH

Q1006

SWITCH

A9V

A5V

MUTE SP1

IC509

EARPHONE AMP

IN+1

OUT1

IN+2

OUT2

IN-1

IN-2

IC507

POWER AMP

B+IN

OUTA

A+IN

OUTB

B-IN

A-IN

IC1064

SWITCHING REG

OUT1

VCC

OUT1

CTL

IC701

+9V

REG

IC702

+5V

REG

XMUTE SP0

Q514,515

MUTING

Q506,507

MUTING

D1007

FOOT SWITCH BOARD (2/2)

J9001

EAR

AUDIO I/O BOARD

(SPEAKER)

J1001

DC IN 12V

2929

+ 65 hidden pages

Sony MDCT-1000 Service manual

TABLE OF CONTENTS

2-1. CABINET(UPPER) SECTION

2-2. SWITCH SECTION

2-3. LCD SECTION

2-4. MD SECTION

2-5. V OLUME SECTION

2-6. MAIN BOARD

2-7. DOOR

2-8. MD BOARD

2-9. BASE UNIT SECTION

2-10. BUM-F1 BOARD

2-11. REC/PB HEAD ASSY (HR901) SECTION

2-12. HOLDER ASSY, CARTRIDGE SECTION

2-13. HOLDER ASSY, CARTRIDGE INSTALLATION

2-14. OPTICAL PICK-UP (KMS-250A) SECTION

5-1. CIRCUIT BOARDS LOCATION

5-2. BLOCK DIAGRAMS

MD SECTION

I/O SECTION