MCE-SV7 is the Video CD/CD play er
section in MHC-SV7AV.
E Model
Model Name Using Similar Mechanism NEW
CD Mechanism TypeCDM63B
Base Unit NameBU-30BD61A
Optical Pick-up NameOP Assy (A-MAX.3)
SPECIFICATIONS
VIDEO CD/CD player section
SystemCompact disc and digital
LaserSemiconductor laser
Frequency response2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise ratioMore than 90 dB
Dynamic rangeMore than 90 dB
Video color system format
OPTICAL OUT
(Square optical connector jack, rear panel)
General
Dimensions (w/h/d)
MassApprox. 2.8 kg
Design and specifications are subject to change
without notice.
audio system
(λ=795 nm)
Emission duration:
continuous
NTSC, PAL
Approx. 280 x 108 x 330 mm
9-873-155-01Sony Corporation
2001F0500-1Home Audio Company
C 2001.6Shinagawa Tec Service Manual Production Group
VIDEO CD/CD PLAYER
MCE-SV7
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objectiv e lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIA GRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
7-3. CD Mechanism Deck Section-1 (CDM63B).................. 43
7-4. CD Mechanism Deck Section-2 (CDM63B).................. 44
7-5. Base Unit Section (BU-30BD61A) ................................ 45
8.ELECTRICAL PARTS LIST ............................... 46
3
MCE-SV7
SECTION 1
SERVICING NOTES
This set is a component of the MHC-SV7AV.
The MHC-SV7AV system configuration is as shown below, and
therefore it does not operate normally unless all four components
are connected.
In performing the repair, connect all components with the system
cables.
Note: The precaution to the users is described on the label stuck
on the back panel (Video CD player) and in the troubleshooting
section in the Operation Manual.
System Configuration:
AC IN
TA
POWER SUPPLY
ST
MASTER & GRAPHIC µcon
DISPLAY
MCE
HTC & VMP µcon
TC
TC µcon
CD-TEXT TEST DISC
This unit is able to display the test data (character information)
written in the CD on its fluorescent indicator tube.
The CD-TEXT TEST DISC (TGCS-313:4-989-366-01) is used
for checking the display.
To check, perform the following procedure.
Checking Method:
1. Press the I/1 button to turn the power on, set the disc to the
disc table with the “test disc” label facing up, and chuck the
disc.
2. Press the [CD] button to set CD function, and press the
N button to playback the disc.
3. The following will be displayed on the liquid crystal display.
Display : 1KHZ/0DB/L R
4. Pressing the [-- ] or [ +] button, select the track. The text
data of each track will be displayed.
For details of the displayed contents for each track, refer to “Table
1 : CD-TEXT TEST DISC TEXT Data Contents”.
Restrictions in CD-TEXT Display
In this unit, some special characters will not be displayed properly. These will be displayed as a space or a character resembling
it.
Table 1 : CD-TEXT TEST DISC TEXT Data Contents
(TRACKS No. 1 to 20:Normal Characters)
20, 21)
ON SCREEN wk (18)
PICTURE EFFECT wl (21)
PRESET –/+, PREV/NEXT ea
(14, 15, 20, 22)
REPEAT q; (15, 16)
RETURN Oeg (15)
PLAY MODE qa (14, 16, 17, 25)
SELECT CD N es (14–17, 19,
21)
SET UP w; (11, 13, 30, 32, 33)
SLEEP 1 (34)
SPECIAL MENU e; (19, 20, 21)
SPECTRUM ANALYZER rf
(33)
SUR wj (30)
TAPE A nNef (23)
TAPE B nNqf (23, 24)
TUNER/BAND ed (22)
TUNING –/+ qh (22)
TV CH +/– 7 (10)
TV VOL +/– 6 (10)
TV @/14 (10)
TV/VIDEO rg (10)
VIDEO ra (36)
VOL +/– ws
BUTTON DESCRIPTIONS
@/1 (power) 5
X (pause) qj
x (stop) qg
./> (go back/go forward)
ea
m/M (rewind/fast forward)
qh
O/o/P/pwg
>10 eh
5
MCE-SV7
• This set can be disassembled in the order shown below.
3-1.DISASSEMBLY FLOW
SET
3-2. COVER
(Page 7)
SECTION 3
DISASSEMBLY
3-3. CD MECHANISM DECK
(CDM63B)
(Page 7)
3-4. MAIN BOARD
(Page 8)
3-5. FRONT PANEL SECTION
(Page 8)
3-6. PANEL BOARD,
SUB PANEL BOARD
(Page 9)
3-7. LID (CD)
(Page 9)
6
Note: Follow the disassembly procedure in the numerical order given.
)
r
3-2.COVER
3
cover
1
two screws
(case 3 TP2)
2
screw
(BVTT3 × 6)
MCE-SV7
3-3.CD MECHANISM DECK (CDM63B)
4
CD mechanism deck
(CDM63B)
1
two screws
(case 3 TP2
2
connecto
(CN701)
3
four screws
(BVTP3
1
wire (flat type) (25 core)
(CN501)
×
8)
7
MCE-SV7
)
3-4.MAIN BOARD
1
wire (flat type) (13 core)
(CN301)
2
connector
(CN401)
2
two connectors
(CN101, 102)
5
3
screw
(BVTP3 × 8)
MAIN board
3
two screws
(BVTP3 × 8
3-5.FRONT PANEL SECTION
3
4
front panel section
claw
2
connector
(CN701)
3
1
connector
(CN401)
4
lug
screw
(BVTP3 × 8)
3
two claws
2
three screws
(BVTP3
×
8)
8
3-6.PANEL BOARD, SUB PANEL BOARD
d
)
4
6
SUB PANEL board
5
two claws
four screws
(BVTP2.6
MCE-SV7
×
8)
1
five screws
(BVTP2.6
3
×
8)
PANEL boar
3-7.LID (CD)
4
spring (CD)
2
two claws
2
bracket (LID) assy
1
screw
(BVTP2.6 × 8
3
lid (CD)
9
MCE-SV7
SECTION 4
TEST MODE
Note: Use following buttons in the test mode.
no mark: Button of video CD unit (MCE-SV7)
*1 : Button of amplifier unit (TA-SV7AV)
*2 : Button of tuner unit (ST-SV7)
[CD Delivery Mode]
• This mode moves the optical pick-up to the position durable to
vibration. Use this mode when returning the set to the customer
after repair.
Procedure:
1. Press the I/1 *1 button to turn the power on.
2. Turn the [FILE SELECT] *1 knob to set the CD function.
3. While pressing the [EQ ON/OFF] *1 button, press the I/1 *
button.
4. The message “LOCK” is displayed on the fluorescent indica-
tor tube of tuner unit and turn the power off automatically , and
the CD delivery mode is set.
[GC Test Mode]
Enter the GC Test Mode
Procedure 1:
1. Press the I/1 *1 button to turn the power on.
2. While pressing the both [PLAY MODE] and [ ] buttons, press
Z
the [ ] (DISC 1) button.
x
3. LEDs and fluorescent indicator tube are all turned on of all
units.
Procedure 2:
1. Press the I/1 *1 button to turn the power on.
2. While pressing the both [STEREO/MONO] *2 and
[CINEMA STUDIO C] *
1
buttons, press the [CLOCK/TIMER]
*2 button.
3. LEDs and fluorescent indicator tube are all turned on of all
units.
[CD Service Mode]
• This mode can run the CD sled motor optionally. Use this mode,
for instance, when cleaning the optical pick-up.
Procedure:
1. Press the I/1 *1 button to turn the power on.
2. Turn the [FILE SELECT] *1 knob to set the CD function.
3. While pressing the both [PLAY MODE] and [ ] buttons, press
.
the [ ] button.
x
4. Set to the CD service mode.
5. With the CD in stop status, press the [ ] button to move the
M
optical pick-up to outside track, or press the [ ] button to
1
inside track.
6. To release from this mode, perform as follows.
1) Move the optical pick-up to the most inside track.
2) Disconnect the power cord.
Notes: • Always move the optical pick-up to most inside track when
releasing from this mode. Otherwise, a disc will not be unloaded.
• Do not run the sled motor excessively, otherwise the gear can
be chipped.
[CD Cancellation Mode of Repeat Limitation]
• This mode can cancel the CD repeat limitation (5 times).
Procedure:
1. Press the I/1 *1 button to turn the power on.
2. Turn the [FILE SELECT] *1 knob to set the CD function.
3. While pressing the both [PLAY MODE] and [ ] buttons, press
x
the [REPEAT] button.
4. CD repeat limitation is canceled.
5. To release this mode, disconnect the power cord.
m
Version Display Mode
Procedure:
1. Enter the GC test mode.
2. Each time the
[DISC 1] or [TUNER MEMORY] *
2
button is
pressed, microcomputer or mechanism deck version is displayed of each unit.
3. Press the [DISC 3] or [TUNING +] *2 button to detail is displayed the version.
Key Check Mode
Procedure:
1. Enter the GC test mode.
2. Press the [DISC 2] or [TUNING --] *2 button to set the key
check mode, and displays “K 0 J 0 V 0” on the fluorescent
indicator tube of tuner unit.
3. All buttons are pressed of video CD unit, all LEDs are blinking of video CD unit. (not change the display of fluorescent
indicator tube)
Releasing the GC Test Mode
T o release from this mode, press three buttons in the same manner
as entering this mode or disconnect the power cord.
10
SECTION 5
r
)
TP (DVC)
TP (FEO)
TP (XPCK)
TP (TEO)
TP (RFDC)
TP (VC)
TP
(RFAC)
IC103
IC101
TP (FEI)
R120
r
ELECTRICAL ADJUSTMENTS
MCE-SV7
CD SECTION
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated .
3. Use an oscilloscope with more than 10MΩ impedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S-Curve Check
Oscilloscope
BD board
TP(FEO)
TP(DVC)
Procedure :
1. Connect an oscilloscope to TP (FEO) and TP (DVC).
2. Connect between TP (FEI) and TP (VC) by lead wire.
3. Turn Power switch on.
4. Load the disc (YEDS-18) and actuate the focus search. (In
consequence of open and close the disc tray, actuate the focus
search)
5. Confirm that the oscilloscope waveform (S-curve) is
symmetrical between A and B. And confirm peak to peak level
within 4 ±1 Vp-p.
S-curve waveform
symmetry
Note: Clear RF signal wav eform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
RF signal waveform
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.1 ± 0.3Vp-p
E-F Balance (1 Track jump) Check
oscilloscope
BD board
TP (TEO)
TP (DVC)
+
–
Procedure:
1. Connect an oscilloscope to TP (TEO) and TP (DVC).
2. Turn Power switch on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Press the X button. (Becomes the 1track jump mode.)
5.Confirm that the level B and A (DC v oltage) on the oscilloscope
waveform.
1 track jump waveform
Center of
waveform
Checking Location :
[ BD BOARD ] — SIDE B —
VIDEO SECTION
Video Frequency Adjustment
Connection:
frequency counte
VMP board
TP (27MHz)
TP (GND)
Procedure:
1. Connect a frequency counter to TP (27MHz) and TP (GND).
2. Turn power switch on.
3. Turn the [FUNCTION] knob of amplifier unit (TA-SV7AV) to
set the CD function.
4. Adjust CT503 on the VMP board so that the frequency counter
reading 27.0 MHz ± 80 Hz at stop status.
Adjustment Location:
[VMP BOARD] (SIDE A)
J301
IC507
A
within 4 ±1Vp-p
B
7. After check, remove the lead wire connected in step 2.
Note : • Try to measure several times to make sure than the ratio
of A : B or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
oscilloscope
BD board
TP (RFAC) or TP(RFDC)
TP(DVC)
Procedure :
1. Connect an oscilloscope to TP (RFAC) and TP (DVC).
2. Turn Power switch on.
3. Load the disc (YEDS-18) and playback.
4. Confirm that the oscilloscope waveform is clear and check RF
5. Measure the RFDC in the same way.
signal level is correct or not.
B
0V
level=1.3 ±0.6Vp-p
Specification level: x 100=less than ±22%
A
B
Symmetry
A (DC voltage
6. After check, remove the lead wire connected in step 1.
RF PLL Free-run Frequency Check
Procedure :
1. Connect a frequency counter to TP (XPCK) and GND.
BD board
TP (XPCK)
frequency counte
+
–
2. Turn Power switch on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Confirm that the reading on frequency counter is 4.3218MHz.
6-4.NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
f
•
•
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Side A)the parts face are indicated.
• Indication of transistor.
: internal component.
: Pattern from the side which enables seeing.
C
B
B
Q
E
Q
CE
These are omitted.
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
Note: The components identified by mark 0 or dotted line
• A : B+ Line.
• H : adjustment for repair.
• Voltages are taken with a V OM (Input impedance 10 MΩ).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
: internal component.
with mark 0 are critical for safety.
Replace only with part number specified.
Voltage var iations may be noted due to normal production tolerances.
Voltage var iations may be noted due to normal production tolerances.
J: CD PLAY (ANALOG)
c : CD PLAY (DIGITAL)
g : VIDEO
4
• Circuit Boards Location
VIDEO board
VMP board
W or less unless otherwise
REG board
SUB PANEL board
MAIN board
PANEL board
IN OUT SW board
TRAY SENSOR board
BD board
DRIVER boar
MOTOR board
DISC SENSOR board
1515
MCE-SV7
6-5.PRINTED WIRING BOARD – BD Section – • See page 15 for Circuit Boards Location.
12345678910111213
A
B
IC102
C
D
E
TP (DVC)
TP (FEI)
IC103
IC104
TP (RFAC)
TP (TEO)
TP (RFDC)
TP (FEO)
IC101
TP (XPCK)
A
VMP
BOARD
CN501
(Page 20)
F
TP
(VC)
25
G
H
• Semiconductor
Location
Ref. No. Location
D101F-10
IC101E-10
IC102B-11
IC103E-8
IC106H-11
Q101F-8
Q103G-10
IC106
(A-MAX.3)
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
1616
6-6.SCHEMATIC DIAGRAM – BD Section –• See page 28 for Waveforms. • See page 29 for IC Block Diagrams.
TP (RFAC)
IC 106
OSC BUFFER
3.2
(TEO)
MCE-SV7
TP
(FEI)
TP (RFDC)
Q101
AUTOMATIC
POWER CONTROL
TP
(VC)
TP
(FEO)
TP
TP (DVC)
RF AMP,
FOCUS/TRACKING ERROR AMP
Q101
2SB710A
A
VMP
BOARD (1/3)
CN501
(Page 21)
Q103
2SD1664
+3.3V
REGULATOR
DIGITAL SIGNAL PROCESSOR,
DIGITAL SERVO PROCESSOR
IC101
CXD3068Q
TP
(XPCK)
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
M102
(SLED)
M101
(SPINDLE)
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
1717
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