TABLE OF CONTENTS
1. SERVICING NOTES ............................................... 3
2. GENERAL
Before You Begin ............................................................ 4
Features ........................................................................... 4
Precautions ...................................................................... 4
Power Sources ................................................................. 5
Operation ......................................................................... 5
Other features .................................................................. 5
3. DISASSEMBLY ......................................................... 6
4. ELECTRICAL ADJUSTMENTS......................... 7
5. DIAGRAMS
5-1. Block Diagram ................................................................ 9
5-2. Printed Wiring Boards .................................................... 12
5-3. Schematic Diagram ......................................................... 15
5-4. IC Pin Function Description ........................................... 22
6. EXPLODED VIEWS ................................................ 24
7. ELECTRICAL PARTS LIST ............................... 26
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
– 2 –
SECTION 1
SERVICING NOTES
About special screws
Special screws are used for this machine not to be remodeled the
inside by any users. Therefore, repair should be done with the dri ver
described below.
7-721-052-08 special driver
Drip-proof treatment
Always perform the following treatment when the Cabinet was
removed, or the Contact Board (ANT) Assembly was removed
during repair.
1. Apply SONY Grease SGL-505 (7-662-010-04) to entire surface of Cabinet Rear Assembly mark ed with using a swab.
(See Fig. A)
2. Appl y Sealant TSE-392W (7-432-950-03) to entir e surface of
Cabinet Rear Assembly mark ed with using a swab. (See
Fig. A)
3. Apply SONY Grease SGL-505 (7-662-010-04) to entire surface of Cabinet Rear Assembly mark ed with using a swab.
(See Fig. B)
cabinet (front) assy cabinet (rear) assy
Apply grease
(SGL-505).
Apply grease
(SGL-505).
(FIg. A)
Apply sealant
(TSE-392W).
contact plate
(ANT) assy
(FIg. B)
cabinet (rear)
assy
– 3 –
SECTION 2
GENERAL
This section is extracted from
instruction manual.
– 4 –
SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
CABINET (FRONT) ASSY
4
special screw
(2
×
8)
8
cabinet (front) assy
1
clip
3
lid battery case
7
cover (guard)
6
two screws
(1.7 × 5)
2
Open the lock
(battery).
RF BOARD
2
packing (jack)
1
knob (VOL)
5
RF board
5
four special screws
(2
×
6)
MICRO COMPUTER BOARD
micro computer board
3
Open the
packing (MIC/SP).
4
two screws
(P1.7
×
2.5)
3
flexible
board
– 6 –
1
Remove the solder
of two speaker leads.
2
Remove the solder
of two battery leads.