Sony HCD-C5 User Manual

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Page 1

HCD-C5

SERVICE MANUAL

Ver 1.1 2001. 09

HCD-C5 is the Amplifier, CD player, MD Deck and Tuner section in CMT-C5.

Section

AEP Model

UK Model

E Model

Australian Model

Model Name Using Similar Mechanism New

CD Mechanism Type TN-CCD1001Z

Base Unit Name TT BASE ASSY

Optical Pick-up Name OPTIMA-720L1E

Model Name Using Similar Mechanism New

MD Mechanism Type MDM-7B4M

Optical Pick-up Name KMS-260E/Z-NP

Amplifier section

European model:

DIN power output (rated): 15 + 15 W Continuous RMS power output (reference):

Music power output (reference):

Australian model:

The following measured at 230 V AC, 60 Hz DIN power output (rated): 15 + 15 W

Continuous RMS power output (reference):

Other models:

The following measured at 220 V AC, 60 Hz DIN power output (rated): 15 + 15 W

Continuous RMS power output (reference):

Inputs TAPE IN (stereo minijack):

DIGITAL OPTICAL IN (Supported sampling frequencies: 32 kHz, 44.1 kHz and 48 kHz)

Outputs TAPE OUT (stereo minijack):

PHONES (stereo minijack):

(6 ohms at 1 kHz, DIN) 20 + 20 W

(6 ohms at 1 kHz, 10% THD)

45 + 45 W

(6 ohms at 1 kHz, DIN) 20 + 20 W

(6 ohms at 1 kHz, 10% THD)

(6 ohms at 1 kHz, DIN) 20 + 20 W

(6 ohms at 1 kHz, 10% THD)

Sensitivity 250 mV, impedance 47 kilohms

Sensitivity 250 mV, impedance 1 kilohmes

Accepts headphones with an impedance of 8 ohms or more

SPECIFICATIONS

CD player section

System Compact disc and digital Laser Semiconductor laser

Frequency response 2 Hz – 20 kHz

MD deck section

System MiniDisc digital audio Laser Semiconductor laser

Sampling frequency 44.1 kHz Frequency response 5 Hz – 20 kHz

Tuner section

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range 87.5 – 108.0 MHz Antenna FM wire antenna

Antenna terminals 75 ohm unbalanced Intermediate frequency 10.7 MHz

AM tuner section

Tuning range European model: 531 – 1,602 kHz

Other models: 530 – 1,710 kHz

Antenna AM loop antenna, external Intermediate frequency 450 kHz

audio system (λ = 780 nm)

Emission duration: continuous

system (λ=780 nm)

Emission duration: continuous

(50-kHz step)

(with the tuning interval set at 9 kHz)

(with the tuning interval set at 10 kHz) 531 – 1,602 kHz (with the tuning interval set at 9 kHz)

antenna terminal

General

Power requirements European model: 230 V AC, 50/60 Hz Australian model: 230 V AC, 50/60 Hz Other models: 220 V AC , 50/60 Hz

Power consumption European model: See the nameplate

Other models: See the nameplate Dimensions (w/h/d) Approx. 145 × 125 ×

Mass Approx. 4.5 kg Supplied accessories Remote commander (1)

Design and specifications are subject to change without notice.

0.5 W (at the power saving mode)

273 mm incl. projecting parts and controls

AM loop antenna (1) FM wire antenna (1)

9-873-244-02

2001I1600-1

MICRO HI-FI COMPONENT SYSTEM

Sony Corporation

Home Audio Company

Shinagawa Tec Service Manual Production Group

Page 2

HCD-C5

The self-diagnosis function consists of error codes for customers, which are displayed automatically when errors occur, and error codes, which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.

SELF-DIAGNOSIS FUNCTION

Self-diagnosis display

This system has a Self-diagnosis display function to let you know if there is a system malfunction. The display shows a code made up of 3 or 5 letters and a message alternately to show you the problem. To solve the problem refer to the following list. If any problem persists, consult your nearest Sony dealer.

C11/Protected

The MD is protected against erasure. cRemove the MD and slide the tab to close the

slot (see page 18).

C12/Cannot Copy

You tried to record a CD or MD with a format that the system does not support, such as a CD-ROM.

cRemove the disc and turn off the system once,

then turn it on again.

C13/REC Error

Recording could not be performed properly. cMove the system to a stable place, and start

recording over from the beginning. The MD is dirty or scratched, or the MD does not meet the standards. cReplace the MD and start recording over from

the beginning.

C13/Read Error

The MD deck cannot read the disc information properly.

cRemove the MD once, then load it again.

C14/Toc Error

The MD deck cannot read the disc information properly.

cReplace the MD.

Erase all the recorded contents of the MD using All Erase Function (see page 29).

C41/Cannot Copy

The sound source is a copy of a commercially available music software, or you tried to record a CD-R (Recordable CD).

cThe Serial Copy Management System prevents

making a digital copy (see page 48). You cannot record a CD-R.

C71/Check OPT-IN

This appears momentarily because of the signal of the digital broadcast during recording.

cThere is no affect on the recorded contents. No component is connected to the DIGITAL OPTICAL IN jack, or a digital component is not

connected properly. cConnect a digital component to the DIGITAL

OPTICAL IN jack properly using a digital

connecting cable (not supplied, see page 43). The connected digital component is not turned on. cSee the operating instructions supplied with the

connected component and confirm whether the

component is turned on. The digital connecting cable connected to the

DIGITAL OPTICAL IN jack is pulled out, or the connected digital component is turned off during digital recording.

cConnect the cable, or turn on the digital

component.

E0001/MEMORY NG

There is an error in the internal data that the system needs in order to operate.

cConsult your nearest Sony dealer.

E0101/LASER NG

There is a problem with the optical pickup. cThe optical pickup may have failed. Consult your

nearest Sony dealer.

Page 3

TABLE OF CONTENTS

SELF-DIAGNOSIS FUNCTION..................................... 2

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 7

3. DISASSEMBLY ......................................................... 9

4. TEST MODE ............................................................... 24

5. ELECTRICAL ADJUSTMENTS

CD Section ...................................................................... 33

MD Section ..................................................................... 34

6. DIAGRAMS

6-1. NOTE FOR PRINTED WIRING BOARDS AND

SCHEMATIC DIAGRAMS ............................................ 45

– Wav e forms................................................................... 45

– Circuit Boards Location............................................... 45

6-2. Block Diagram – CD Servo Section –............................ 46

6-3. Block Diagram – MD Servo Section –........................... 47

6-4. Block Diagram – MAIN Section –................................. 48

6-5. Printed Wiring Boards – CD Section – .......................... 49

6-6. Schematic Diagram – CD Section –............................... 50

6-7. Printed Wiring Board – BD (MD) Board – .................... 51

6-8. Schematic Diagram – BD (MD) Board (1/2) –.............. 52

6-9. Schematic Diagram – BD (MD) Board (2/2) –.............. 53

6-10. Printed Wiring Board – MD DIGITAL Board – ............ 54

6-11. Schematic Diagram – MD DIGITAL Board – ............... 55

6-12. Printed Wiring Board – UCOM Board –........................ 56

6-13. Schematic Diagram – UCOM Board –........................... 57

6-14. Printed Wiring Boards – AUDIO Section –.................... 58

6-15. Schematic Diagram – AUDIO Section –........................ 59

6-16. Printed Wiring Board – PANEL Board – ....................... 60

6-17. Schematic Diagram – PANEL Board – .......................... 61

6-18. Printed Wiring Boards – POWER Section – .................. 62

6-19. Schematic Diagram – POWER Section – ...................... 63

6-20. IC Block Diagrams ......................................................... 64

6-21. IC Pin Function Description ........................................... 68

HCD-C5

7. EXPLODED VIEWS ................................................ 76

8. ELECTRICAL PARTS LIST .............................. 86

Page 4

HCD-C5

SECTION 1

SERVICING NOTE

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

FOR CD

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

FOR MD

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the bottom exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Page 5

SERVICE POSITION OF THE CD MECHANISM DECK

UCOM BOARD

HCD-C5

CD MECHANISM DECK (TN-CCD1001Z)

BD (CD) BOAR

CN101

STAND

CN204

SERVICE POSITION OF THE MD MECHANISM DECK

BD (CD) BOARD

CN204

CN101

CN201

PANEL BOARD

CN702

CN703

CN701

CN203

CN201

UCOM BOARD

CN102

AUDIO BOARD

CN601

CN103

CN102

BD (MD) BOARD

MD DIGITAL BOARD

MD MECHANISM (MDM-7B4M)

Page 6

HCD-C5

JIG FOR CHECKING BD (MD) BOARD WAVEFORM

The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of ter minals and the checking items to be performed are shown as follows.

I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser) IOP : For measuring IOP (Check the deterioration of the optical pick-up laser) GND : Ground TE : Tracking error signal (Traverse adjustment) FE : Focus error signal VC : Reference level for checking the signal RF : RF signal (Check jitter)

I+3V

GND

IOP

I+3V

IOP

GND

FE VC RF

CN105

I+3V IOP GND

for 7

TE FE VC RF

Page 7

SECTION 2

GENERAL

Parts Identification

The items are arranged in alphabetical order. Refer to the pages indicated in parentheses () for details.

Main unit

HCD-C5

This section is extracted from instruction manual.

CD SYNC HIGH 7 (19, 51) CD SYNC NORMAL 8 (19) CD Z 2 (10, 51) FUNCTION qa (9, 11, 13, 14, 16,

21–37, 44) MD Z 6 (15, 18, 26) REC/REC IT 8 (20, 21, 24, 26,

44, 51) Remote sensor 9 TUNING +/– 5 (36, 37) VOL +/– q; (40)

3 4

678

BUTTON DESCRIPTIONS

@/1 (power) 1 (7, 18, 26, 27, 37,

40, 42)

u 3 (9–11, 14–16, 19, 20, 25,

44)

x 4 (10, 11, 15, 16, 19–21, 26,

44)

. > 5 (10, 11, 13, 15, 16,

22–35)

m M 5 (10, 15, 30, 32)

Page 8

HCD-C5

Remote control

wh wg wf wd

ws wa

Parts Identification

1 234

5 6 7 8

9 0

qa qs

qf qg

qhqjqkql

CD x qh (10) CD X ws (10) CD N wd (9, 11, 20) CLEAR 9 (11, 16, 28, 38) CLOCK/TIMER SELECT 6

(41, 42)

CLOCK/TIMER SET 7 (8, 40,

41) CURSOR T/t wh (8, 13, 28) DBFB qf (39) DISPLAY wk (8, 12, 17, 38) ENTER/YES 8 (8, 11, 13, 14,

16, 21–36, 38, 40–42) FM MODE qj (37) FUNCTION w; (9, 11, 13, 14, 16,

19, 21–37, 44) Letter/Number buttons wj (10,

13, 15, 16, 27, 28, 37)

Setting the time

Turn on the system.

Press CLOCK/TIMER SET on the remote.

If you are setting the clock for the first time, go to step 5.

Press – or + (. or >) on the remote repeatedly until “CLOCK SET?” appears in the display.

Press ENTER/YES on the remote.

The day indication flashes.

Press – or + (. or >) on the remote repeatedly to set the day, and then press ENTER/YES or CURSORt on the remote.

The hour indication flashes.

MD x qs (15) MD X wf (15) MD N wg (14, 16, 19, 20, 25) MENU/NO q; (13, 14, 22–26,

28–36)

NAME EDIT/SELECT 3 (13,

27, 28, 38)

PLAY MODE qk (9, 11, 14, 16,

26, 34, 35) PRESET EQ qg (39) REPEAT qj (10, 15) SCROLL 5 (12, 14, 17, 28) SLEEP 1 (39) TIME 2 (8, 11, 12, 16, 17) TUNER BAND wa (36, 37) TUNING MODE qk (36, 37) TUNING +/– ql (36, 37) VOL +/– qd (40)

Press – or + (. or >) on the remote to set the hour, and then press ENTER/YES or CURSORt on the remote.

The minute indication flashes.

Press – or + (. or >) on the remote repeatedly to set the minute, and then press ENTER/YES on the remote.

If you made a mistake

Press TCURSOR or CURSORt on the remote until the indication you wish to change (day, hour, minute) flashes, and then change the setting.

To reset the time

Start over from step 1.

BUTTON DESCRIPTIONS

@/1 (power) 4 (7, 18, 26, 27, 37,

40, 42)

. > qa (10, 11, 13–16, 22–

35, 40–42) –/+ qa (8, 40, 42) m M wh (10, 15, 30, 32, 42)

Page 9

• This set can be disassembled in the order shown below.

BOTTOM PLATE, CASE

(Page 10)

JACK BOARD, HP BOARD,

REAR COVER

(Page 18)

OVER WRITE HEAD

(Page 23)

SET

LOADING MOTOR (M703),

SPINDLE MOTOR (M701),

SLED MOTOR (M702)

(Page 22)

PANEL BOARD

(Page 10)

UCOM BOARD,

AMP POWER BOARD

(Page 19)

AUDIO BOARD,

POWER BOARD,

POWER TRANSFORMER

(T900) (1) (Page 20)

CD MECHANISM DECK

(TN-CCD1001Z), BD (CD) BOARD

(Page 11)

AUDIO BOARD,

POWER BOARD,

POWER TRANSFORMER

(T900) (2) (Page 20)

MD MECHANISM DECK

(MDM-7B4M),

MD DIGITAL BOARD

(Page 21)

CONNECTOR BOARD

(Page 12)

FEED MOTOR ASSY (M903)

(Page 15)

REAR DAMPER BRACKET

(Page 15)

SW BOARD

(Page 14)

FRONT BRACKET SECTION,

LOADING MOTOR ASSY

(M902)

(Page 13)

SPINDLE MOTOR ASSY

(M904)

(Page 18)

BASE SECTION

(Page 17)

OPTICAL PICK-UP (OPTIMA-720L1E),

SCREW GUIDE,

FEED SCREW ASSY, etc.

(Page 16)

OPTICAL PICK-UP

(OPTIMA-720L1E)

(Page 16)

HOLDER ASSY

(Page 21)

OP-SUB SECTION

(Page 23)

BD (MD) BOARD

(Page 22)

TUNER PACK,

D. C. FAN (M901)

(Page 19)

• The dotted square with arrow ( →) prompts you to move to the ne xt job when all of the w or ks within the dotted square ( ) are

completed.

HCD-C5

SECTION 3

DISASSEMBLY

Page 10

HCD-C5

)

Note: Follow the disassembly procedure in the numerical order given.

3-1. BOTTOM PLATE, CASE

case

claw

screw

(+BVTT 3 x 5)

bottom plate

three screws

3-2. PANEL BOARD

screw (+K 3 x 6)

two claws

PANEL board

four screws

(+BVTT 3 x 5)

wire (flat type)

(16 core) (CN201)

screw

(+K 3 x 6)

six screws

(+B 2 x 6)

two screws

(+BVTT 3 x 5)

ground wire

screw

(+BVTT 3 x 5

Page 11

3-3. CD MECHANISM DECK (TN-CCD1001Z), BD (CD) BOARD

CN1

CD mechanism deck

(TN-CCD1001Z)

board to board connector

two screws

(+BVTT 2.6 x 5)

CN103

cushion (A)

screw

(+BVTT 2 x 5)

bracket (CD), foot (felt)

HCD-C5

BD (CD) boar

four screws

(+BVTT 3 x 5)

two screws

(+BVTT 3 x 5)

screw

(+BVTT 3 x 5)

wire (flat type) (29 core)

(CN204)

screw

(+BVTT 3 x 5)

two screws

(+BVTT 3 x 5)

Page 12

HCD-C5

3-4. CONNECTOR BOARD

(+P 2 x 2.5)

wire clamper

screw

FPC holder

CONNECTOR boar

Remove solderings

starting from the left LOADING (+), (–), red and black.

Remove solderings starting from the left

green, yellow, orange, red and brown.

Remove solderings starting from

the top left SPINDLE (+), (–), FD MOTOR (+), (–) and the LIMIT switch that has no polarity.

Remove the soldering.

Page 13

3-5. FRONT BRACKET SECTION, LOADING MOTOR ASSY (M902)

Remove it in the direction of

Remove the two

hang-up springs (FZ).

the arrow when viewed from the rear of the front bracket.

(M 2 x 4)

screw

from the left side

(M 2 x 2.5)

screw

HCD-C5

screw

(+P 2 x 3)

three claws

Note during re-assembling

When re-assembling, align the positions as shown.

FPC holder

Raise the

CONNECTOR board.

Move down the gear mount bracket in the direction of the arrow

wire clamper

loading motor assy (M902)

screw

(+P 2 x 3.0)

loading belt

Remove two solderings.

front backet section

Page 14

HCD-C5

3-6. SW BOARD

Release it from

the detents.

eleven claws

(BRN)

(RED) (ORG)

(YEL)

(GRN)

switch (S3)

(Disc Existence, Chucking, Releasing detect)

Remove two solderings.

SW board

Remove two solderings.

Remove five solderings.

switch (S4)

(8cm Disc Eject End detect)

Remove two solderings.

switch (S2) (12cm Disc/12cm Disc Eject End detect)

switch (S1)

(Disc IN/8cm Disc detect)

Page 15

3-7. FEED MOTOR ASSY (M903)

two screws

(+P 2 x 10)

Remove the

soldering.

pulley gear

screw

(+P 2 x 3.0)

feed motor assy

(M903)

FD gear bracke

HCD-C5

3-8. REAR DAMPER BRACKET

screw

(+P 2 x 2.5)

screw

(+P 2 x 3)

wire clamper

two screws

(+P 2 x 3)

rear damper bracket

Page 16

HCD-C5

3-9. OPTICAL PICK-UP (OPTIMA-720L1E), SCREW GUIDE, FEED SCREW ASSY, etc.

screw

(+P 2 x 10)

optical pick-up (OPTIMA-720L1E), screw guide, feed screw assy, etc.

two screws

(+P 2 x 10)

pick-up flexible board

Slant the CONNECTOR board

in the direction of the arrow

feed motor assy (M903),

FD gear bracket, etc.

3-10. OPTICAL PICK-UP (OPTIMA-720L1E)

pulley M

screw guide

(OPTIMA-720L1E)

detent spring

optical pick-up

screw

(+P 1.7 x 6)

feed screw assy

pulley guide spring

screw

(+P 1.4 x 2)

Page 17

3-11. BASE SECTION

pick-up flexible

board

two screws

(+P2 x 5)

Remove solderings from

the damper pins.

springs (FZ) as shown.

Remove the two hang-up

Move the holder (L) in the

direction of the arrow

HCD-C5

Remove the two damper

pins toward inside.

Remove the two hang-up

springs (R) as shown.

base section

(

Remove the base block while the

mechanism is in the Loading IN state.)

Slant the base block in the direction of the arrow and remove the base block from the main unit in a manner that the lock pin passes through the groove of the holder (L) as shown.

holder (L)

lock pin

Remove solderings.

Page 18

HCD-C5

3-12. SPINDLE MOTOR ASSY (M904)

open to direction of the arrow

clip arm spring (L)

clip arm spring

two screws

(+P 1.7 x 2.2)

turn table

washer

spindle motor assy

(M904)

3-13. JACK BOARD, HP BOARD, REAR COVER

screw

(+BVTT 3 x 5)

four screws

(+BV 3 x 12)

three screws

(+BV 3 x 8)

connector

(CN109)

two nuts

(N4)

spindle motor

connector

(CN110)

screw

(+PTPWH 3 x 8)

connector

(CN107)

HP board

JACK board

two screws

(+BV 3 x 8)

two screw

(+B 4 x 16)

D.C.fa (M901)

rear cover

Note for re-installation-1

When installing the rear cover, be careful that the three harnesses coming from

Connector (CN107)”,

“

Connector (CN109)”,

“

Connector (CN110)”,

“ and the harness coming from the DC fan (M901) must not contact the heat sink (IC902) and the diode (D981) and the heat sink (IC904).

POWER board

heat sink (IC902)

diode (D981)

Note for re-installation-2

When installing the rear cover, be careful that the three harnesses coming from

Connector (CN107)”,

“

Connector (CN109)”,

“

Connector (CN110)”,

“ and the harness coming from the D.C. fan (M901) must not be pinched by the rear cover, the UCOM board, power transformer (T900) and tuner pack.

Page 19

3-14. TUNER PACK, D. C. FAN (M901)

Note for re-installation

When installing the tuner pack, insert the three harnesses connected to CN105 and connected to CN106 and connected to CN108 of the AUDIO board, in between the flat cable (11 core or 15 core) and the tuner pack in the direction of the arrow so that the flat cable (11 core or 15 core) must be inserted.

CN108

D.C.fan (M901)

CN105

CN106

wire (flat type)

(11 core or 15 core)

(CN105)

HCD-C5

connector

(M901)

screw

(+BV 3 x 8)

D.C. fa

wire (flat type)

AUDIO board

(11 core or 15 core)

tuner pack

3-15. UCOM BOARD, AMP POWER BOARD

AMP POWER baord

CN852

Note for re-installation (routing the harnesses)

Be careful that the two harnesses between CN995 and CN992 of the power transformer (T900) and the POWER board must not contact the heat sink (IC902) on the POWER board and the flat cable (19 core) that is inserted to CN203 on the UCOM board.

heat sink (IC902)

CN995

POWER baord

wire (flat type) (19 core)

CN203

AMP POWER board

(After slanted toward outside, remove it straight up toward outside.)

board to board

connector

wire (flat type)

(19 core) (CN203)

tuner pack

CN206

CN901

connector

(CN851)

wire (flat type)

(19 core) (CN101)

CN205

board to board

connector

(+BVTT 3 x 5)

wire (flat type)

(16 core) (CN201)

UCOM board

two screws

UCOM board

CN851

CN992 power transformer (T900)

Page 20

HCD-C5

3-16. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (1)

AUDIO board, POWER boad,

power transformer (T900 ), etc.

two screws

(+BVTT 3 x 5)

connector

(CN102)

(+BV 3 x 8)

four screws

two screws

(+BVTT 3 x 5)

3-17. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (2)

insulated plates (POWER)

nylon rivet (DIA 3.5)

D.C.fan (M901)

connector (CN105)

AUDIO board

POWER board

board to board

connector

screw

insulated plates (POWER) 2

connector (CN992)

clamp

connector (CN995)

CN103

wire (flat type) (11 core)

(from tuner pack)

CN902

tuner pack

connector (CN991)

power transforme

(T900)

power cord

Page 21

3-18. MD MECHANISM DECK (MDM-7B4M), MD DIGITAL BOARD

two screws

(+BVTT 3 x 5)

shield (MD2)

two screws

(+BVTT 3 x 5)

ground

wire

MD DIGITAL board

four screws

(+BVTT 3 x 5)

shield (MD1)

HCD-C5

four screws, step

Slant the shield (MD1), shield (MD2) and the MD DIGITAL board in the direction of the arrow and remove the two screws (+BVTT 3 x 5).

3-19. HOLDER ASSY

tension spring (holder)

screw

(+BTN 1.7 x 3)

holder assy

four insulators

ground wire

wire (flat type)

(17 core) (CN703)

wire (flat type)

(27 core) (CN702)

MD mechanism deck

(MDM-7B4M)

hoo

Page 22

HCD-C5

)

3-20. BD (MD) BOARD

Remove two solderings.

(spindle)

Remove two solderings.

(sled)

M702

M701

(CN101)

two screws

(+BP TRI 2 x 6 CZN)

flexible board

BD (MD) board

connector (CN104)

Remove two solderings. (loading)

M703

S102

Remove three solderings.

3-21. LOADING MOTOR (M703), SPINDLE MOTOR (M701), SLED MOTOR (M702)

torsion spring (spindle)

belt (loading)

lever (head)

two screws

(+PWH 1.7 x 3.5)

loading motor (M703)

spindle motor (M701)

three tapping screws (M1.7)

two screws

(+PWH 1.7 x 3.5

sled motor (M702

Page 23

3-22. OVER WRITE HEAD

)

over write hrad

(HR901)

screw (+P 1.7 x 6)

HCD-C5

3-23. OP-SUB SECTION

screw

(+BP TRI 2 x 6 CZN)

base (BU-D)

main shaft

flexible board

optical pick-up (for MD)

screw

(+BP TRI 2 x 6 CZN

base (BU-A)

screw (+KTP 2 x 6)

Page 24

HCD-C5

SECTION 4

TEST MODE

[Factory Preset Mode]

∗ This mode clears all data including preset data stored in the

RAM to initial conditions. Excute this mode when returning the set to the customer.

Procedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the CD function. (except the TUNER function)

3. Press three buttons VOL + , CD Z and MD Z simultaneously.

4. The message “COLD RESET” blinks and the present contents are reset to the default values.

[Version and Destination Display Mode]

∗ The version or destination is displayed.

Procedure:

1. Press the ?/1 button to turn the power on.

2. To enter the test mode, press the three buttons VOL + , x and MD Z simultaneously.

3. The model and destination are displayed.

4. Press the REC/REC IT/NORMAL and u buttons simul- taneously.

5. The version is displayed as “STR/CD V . ”.

6. Press the REC/REC IT/NORMAL and u buttons simul- taneously.

7. The version is displayed as “MD V . ”.

8. Press the REC/REC IT/NORMAL and u buttons simul- taneously, then the mode returns to step 3.

9. To exit from this mode, press the ?/1 button to turn the power off.

[FL Tube Test Mode]

∗ All fluorecent segments and LEDs are tested.

Procedure:

1. Press the ?/1 button to turn the power on.

2. To enter the test mode, press three buttons VOL + , x and ./m TUNING - simultaneously.

3. All segments and LEDs are turned on.

4. Press the REC/REC IT/NORMAL and u buttons simul- taneously.

5. All segments are turned off (All LEDs still lit).

6. Press the REC/REC IT/NORMAL and u buttons simul- taneously.

7. Almost half segments are turned on. (PATTERN 1)

[Key Test Mode]

∗ Keyboard check.

Procedure:

1. Press the ?/1 button to turn the power on.

2. To enter the test mode, press three buttons VOL + , x and >/M TUNING + simultaneously.

3. In the key test mode, the fluorecent indicator displays “KEY00”.

4. Each time a button is pressed, “KEY ” value increases. However, once a button is pressed, it is no longer taken into account.

5. To exit from this mode, press three buttons simultaneously as step 2 , or disconnect the power cord.

[Amp Test Mode]

Procedure:

1. Press the ?/1 button to turn the power on.

2. Press three buttons VOL - , CD Z and MD Z simulta- neously.

3. Press two buttons REC/REC IT/NORMAL and x simulta- neously.

4. The message “7 [TESTMIN]” is displayed for a few seconds.

5. Press two buttons REC/REC IT/NORMAL and x simulta- neously again.

6. Each time two buttons are depressed, the display changes as “8 [TESTMID]” , “9 [TESTMAX]”, and “10 [TESTSUR]” .

7. Press the VOL + button, the display changes “VOLUME 21” to “VOLUME MAX”.

8. Press the VOL - button, the display changes “VOLUME 21” to “VOLUME MIN”.

9. To exit from this mode, press the ?/1 button to turn the power off and cold reset is executed.

[CD Test Mode]

∗ The CD system versions are displayed.

Procedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the CD function.

3. Press three buttons of VOL + , x and CD SYNC HIGH simultaneusly.

4. The message “dut CD VER” is displayed.

5. Press the CD Z button and the version “CD played.

6. Press the >/M TUNING + button and “CDSYS ” is displayed.

7. Each time the >/M TUNING + button is depressed , the display changes as “CDMA S”, “CDBD O”, “CDCD M”.

8. By depressing the ./m TUNING - button the versions are displayed in reverse.

9. To exit this mode, press the ?/1 button to turn the power off .

. ” is dis-

8. Press the REC/REC IT/NORMAL and u buttons simul- taneously.

9. The segments which are turned on in step 7 are turned off, then remaining segments are turned on. (PATTERN 2)

10. Press the REC/REC IT/NORMAL and u buttons simul- taneously, the mode returms to step 3 and all segments are turned on.

11. To exit from this mode, press the ?/1 button to turn the power off.

Page 25

HCD-C5

[CD Aging Mode]

Procedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the CD function, and insert a disc.

3. Press three buttons of VOL - , CD Z and >/M TUNING + simultaneusly.

4. The message “Eject” is displayed, a disc is ejected and inserted again automatically.

5. The sequence during the CD aging mode is following as below.

CD aging mode sequence:

CD disc eject

CD disc in

TOC reading

Playback the first track

Playback the last track

Display the number of aging

MD SECITON

Note 1: About “R”

As this unit has only a few buttons, some operations require the use of remote commander (RM-SC5BEN/provided with unit: 1-476-649-21) buttons. These operations are indicated as “R” in this manual. Example: MENU/NO “R” ...Press the MENU/NO b utton of the remote commander.

Note 2: Incorrect operations may be performed if the MD test mode

is not entered properly. In this case, press the ?/1 button to turn the po wer of f, and retry to enter the MD test mode.

1. PRECAUTIONS FOR USE OF TEST MODE

• As operations related to loading will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the MD Z button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating. Therefore, it will be ejected while rotating. Be sure to press the MD Z button after pressing the MENU/NO “R” button and the rotation of disc is stopped.

6. To exit this mode , press the ?/1 button to turn the power off.

[CD/MD Aging Mode]

∗ Aging of CD and MD is performed at the same time.

Procedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the CD function.

3. Insert a disc (CD) and a recordable disc (MD).

4. Press three buttons of VOL + , u and MD Z simultaneusly.

5. The message “Eject” is displayed and aging started.

6. The sequence of CD aging is same as the CD aging mode, however the MD aging is r epetition of changing the track after a few seconds recording.

7. The number of aging is displayed in hexadecimal. For example, AGING00000011 means the 17th rouine of aging.

8. To exit this mode, press the ?/1 b utton to turn the power of f, or press three buttons of VOL + , CD Z and MD Z simul- taneously and cold reset is executed.

1-1. Recording laser emission mode and operating

buttons

• Continuous recording mode (CREC 1MODE)

• Laser power check mode (LDPWR CHECK)

• Laser power adjustment mode (LDPWR ADJUST)

• Comparison with initial Iop value written in nonv olatile memory

(Iop Compare)

• Write current Iop value in read nonvolatile memory using microprocessor (Iop NV Save)

• Traverse (MO) check (EF MO CHECK)

• Traverse (MO) adjustment (EF MO ADJUST)

• When pressing the REC/REC IT button.

2. SETTING THE TEST MODE

The following is the method of entering the test mode. Procedure: 1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the MD function.

3. Press three buttons of VOL - , x , and CD SYNC HIGH (MD) simulta neously. When the test mode is set, “[Check]” will be displayed. Pressing the . “R” or > “R” button between the following three groups; ··· Tt [Check] Tt [Service] Tt [Develop] Tt ···.

Note: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the MENU/NO “R” button immediately to exit the [Develop] group.

3. RELEASING THE TEST MODE

Procedure 1: Press the REPEAT “R” button to display “Initial-

ize”, then release the MD test mode.

Procedure 2: Press two button of VOL - and MD Z to display

“Intialize”, then release the MD test mode.

Page 26

HCD-C5

4. BASIC OPERATIONS OF THE TEST MODE

All operations are performed using the . “R” , > “R” , ENTER/YES “R” and MENU/NO “R” . The functions of these buttons are as follows.

Function name Function

. “R” , > “R” buttons Changes parameters and modes

ENTER/YES “R” button Proceeds onto the next step. Finalizes input MENU/NO “R” button Returns to previous step. Stops operations

5. SELECTING THE TEST MODE

There are 26 types of test modes as shown below. The groups can be switched by pressing the . “R” or > “R” button. After selecting the group to be used, press the ENTER/YES “R” button. After setting a certain group, pressing the . “R” or > “R” button switches modes shown belo w. Refer to “Group” in the table for details can be selected. All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.

Note: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the MENU/NO “R” button immediately to exit the [Develop] group.

Display

AUTO CHECK Err Display TEMP ADJUST LDPWR ADJUST Iop Write Iop NV Save EF MO ADJUST EF CD ADJUST FBIAS ADJUST AG Set (MO) AG Set (CD) TEMP CHECK LDPWR CHECK EF MO CHECK EF CD CHECK FBIAS CHECK ScurveCHECK VERIFYMODE DETRK CHECK 0920 CHECK Iop Read Iop Compare ADJ CLEAR INFORMATION CPLAY1MODE CREC 1MODE

No.

Automatic self-diagnosis

C01

Error history display, clear

C02

Temperature compensation offset adjustment

C03

Laser power adjustment

C04

Iop data writing

C05

Writes current Iop value in read nonv olatile memory using microprocessor

C06

Traverse (MO) adjustment

C07

Traverse (CD) adjustment

C08

Focus bias adjustment

C09

Auto gain output level adjustment (MO)

C10

Auto gain output level adjustment (CD)

C11

Temperature compensation offset check

C12

Laser power check

C13

Traverse (MO) check

C14

Traverse (CD) check

C15

Focus bias check

C16

S-curve check

C17

Nonvolatile memory check

C18

Detrack check

C19

Most circumference check

C25

Iop data display

C26

Comparison with initial Iop value written in nonvolatile memory

C27

Initialization of nonvolatile memory for adjustment values

C28

Display of microprocessor version, etc.

C31

Continuous playback mode

C34

Continuous recording mode

C35

Details

Mark

Group

Check Service

• For details of each adjustment mode, refer to “5. Electrical Adjustments”. For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.

• If a different mode has been selected by mistake, press the MENU/NO “R” button to release that mode.

• Modes with (×) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set

accidentally, press the MENU/NO “R” button to release the mode immediately.

Page 27

HCD-C5

“CREC 1MID” t “CREC 1OUT” t “CREC 1IN”

5-1. Operating the Continuous Playback Mode

1. Entering the continuous playback mode

(1) Set the disc in the unit. (Whichev er recordable discs or discs

for playback only are available)

(2) Press the . “R” or > “R” button to display

“CPLAY1MODE” (C34).

(3) Press the ENTER/YES “R” button to change the display

to “CPLAY1MID”.

(4) When access completes, the display changes to “C =

AD = )”.

Note: The numbers “ ” displayed show you error rates and ADER.

2. Changing the parts to be played back

(1) Press the ENTER/YES “R” button during continuous play-

back to change the display as below.

“CPLAY1MID” t “CPLAY1OUT” t “CPLAY1IN”

When pressed another time, the parts to be played back can be moved.

(2) When access completes, the display changes to “C =

AD = )”.

Note: The numbers “ ” displayed show you error rates and ADER.

3. Ending the continuous playback mode

(1) Press the MENU/NO “R” button. The display will change

to “CPLAY1MODE” (C34).

(2) Press the MD Z button and take out the disc.

Note: The playback start addresses for IN, MID, and OUT

are as follows. IN : 40h cluster MID : 300h cluster OUT : 700h cluster

5-2. Operating the Continuous Recording Mode (Use

only when performing self-recording/palyback check)

1. Enter ing the continuous recording mode

(1) Set a recordable disc in the unit. (2) Press the . “R” or > “R” button to display “CREC

1MODE” (C35).

(3) Press the ENTER/YES “R” b utton to change the display to

“CREC 1MID”.

(4) When access completes, the display changes to “CREC 1(

)” and “ REC ” is displayed.

Note: The numbers “ ” displa yed shows you the recording posi-

REC

tion addresses.

2. Changing the parts to be recorded

(1) When the ENTER/YES “R” button is pressed during con-

tinuous recording, the display changes as below.

When pressed another time, the parts to be recorded can be changed. “ REC ” goes off.

REC

(2) When access completes, the display changes to “CREC 1(

)” and “ REC ” is displayed.

Note: The numbers “ ” displayed shows you the recording posi-

tion addresses.

REC

3. Ending the continuous recording mode

(1) Press the MENU/NO “R” button. The display changes to

“CREC 1MODE” (C35) and “ REC ” goes off.

REC

(2) Press the MD Z button and take out the disc.

Note 1: The recording start addresses for IN, MID, and OUT are

as follows.

IN : 40h cluster MID : 300h cluster OUT : 700h cluster

Note 2: The MENU/NO “R” button can be used to stop recording

Note 3: Do not perform continuous recording for long periods of

Note 4: During continuous recording, be careful not to apply vi-

anytime.

time above 5 minutes.

bration.

Page 28

HCD-C5

6. FUNCTIONS OF OTHER BUTTONS

Function

x M “R” m “R” x + >/M TUNING +

VOL - + CD Z MD Z REPEAT “R”

Sets continuous playback when this is pressed in the STOP state. When this is pressed during continuous playback, playback position moves.

Stops continuous playback and continuous recording The sled moves to the outer circumference only when this is pressed The sled moves to the inner circumference only when this is pressed Switches the spindle servo mode (CLV S y CLV A) Switches the displayed contents each time the button is pressed Ejects the disc Releases the test mode

7. AUTOMATIC SELF-DIAGNOSIS FUNCTION

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform AUTO CHECK after the laser power check and Iop Compare.

Procedure:

1. Press the . “R” or > “R” button to display “AUTO CHECK” (C01).

2. Press the

performed. In this case, perform the laser power check and Iop Compare, and then repeat from enter the MD test mode.

3. If a disc is in the mechanical deck, it will be ejected forcibly.

“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.

4. If a disc is loaded at step 3, the check will start automatically.

5. When “XX CHECK” is displayed, the item corresponding to XX will be performed.

When “060 CHECK” completes, the disc loaded at step 3 will be ejected. “DISC IN” will be displayed. Load the check disc (TDYS-1).

6. When the disc is loaded in step 5, the check will automatically be resumed from “07 CHECK”.

7. After completing to test item 12 (“oC CHECK”), check OK or NG will be displayed. If all items are OK, “CHK ALL OK” will

be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

ENTER/YES “R” button. If “LDPWR ” is displayed, it means that the laser power check has not been

Contents

When “CHK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of other parts (spindle motor, sled motor, etc.). When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

8. INFORMATION

Display the software version.

Procedure:

1. Press the . “R” or > “R” button to display “INFORMATION” (C31).

2. Press the ENTER/YES “R” button.

3. The software version will be displayed.

4. Press the MENU/NO “R” button to end this mode.

Page 29

HCD-C5

IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF BD (MD) BOARD) ARE REPLACED

The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory . By recording the v alue, it will eliminate the need to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD (MD) board), record the IOP value on the optical pick-up according to the following procedure.

Record Procedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the MD function.

3. Press three buttons of VOL - , x and CD SYNC HIGH , simultaneously to enter the MD test mode and display “[Check]”.

4. Press the . “R” or > “R” button to display “[Service]”.

5. Press the ENTER/YES “R” button to display “AUTO CHECK”, and press the > “R” button to display “Iop Write”.

6. Press the ENTER/YES “R” button.

7. The display becomes “Ref= @@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.

8. Input the IOP value written on the optical pick-up. To select the number : Press the

. “R” or > “R” button.

To select the digit : Press two buttons of VOL - and

CD Z simultaneously.

9. When the ENTER/YES “R” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

10. As the adjustment results are recorded for the step 9 value. Leave it as it is and press the ENTER/YES “R” button.

11. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write”.

12. Press the REPEAT “R” button, or press two buttons of VOL - and MD Z simultaneously. to complete. “Initializ e” will be displayed and release the MD test mode.

WHEN MEMORY NG IS DISPLAYED

If the nonvolatile memory data is abnormal, “E001 MEMOR Y NG” will be displayed so that the MD deck does not continue operations. In this case, set the test mode promptly and perform the following procedure.

Procedure:

1. Enter the MD test mode.

2. Normally a message for selecting the test mode will be displayed. However if the nonvolatile memory is abnormal, the following will be displayed “INIT EEP?”.

3. Press the x and MD Z buttons simultaneously.

4. Press the . “R” or > “R” button to display “MDM-7B4M”.

5. Press the ENTER/YES “R” button. If the nonvolatile memory is successfully overwritten, the normal MD test mode will be set and a message to select the MD test mode will be displayed.

Display Precedure:

1. Press the ?/1 button to turn the power on.

2. Press the FUNCTION z button to set the MD function.

3. Press three buttons of VOL - , x , and CD SYNC HIGH simultaneously to enter the MD test mode and display “[Check]”.

4. Press the . “R” or > “R” button to display “[Service]”.

5. Press the ENTER/YES “R” button to display “AUTO CHECK”, and press the > “R” button to display “Iop Read”.

6. Press the ENTER/YES “R” button.

7. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ : Indicates the Iop value labeled on the pick-up. ##.# : Indicates the Iop value after adjustment.

8. Press the REPEAT “R” button to complete. “Initialize” will be displayed and release the MD test mode.

Page 30

HCD-C5

CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD

Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”.

Criteria for Determination

(Unsatisfactory if specified value is not satisfied)

Laser power check

(6-2 : See page 37)

Auto check

(6-4 : See page 38)

Temperature compensation offset check

(6-1 : See page 37)

Note:

The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments. When performing adjustments, use the specified values for adjustments.

• 0.9 mW power Specified value : figure1

• 7.0 mW power Specified value : figure2

Iop (at 7.0mW)

• Labeled on the optical pick-up Iop value ± 10mA

• Unsatisfactory if displayed as “NG: XXXX” (X is an arbitrary number)

• Unsatisfactory if displayed as “T=@@ (##) [NG]” (@@, ## are both arbitrary numbers)

• Clean the optical pick-up

• Adjust again

• Replace the optical pick-up

• Check for disconnection of the circuits around D101

(BD (MD) board)

• Check the signals around IC101, IC151, CN102, CN103 (BD (MD) board)

Measure if unsatisfactory

Figure1:

SPECIFIED VALUE

KMS-260B KMS-260E

0.85 to 0.91 mW

0.90 to 0.96 mW

Figure2:

SPECIFIED VALUE

KMS-260B KMS-260E

6.8 to 7.2 mW

7.0 to 7.5 mW

RETRY CAUSE DISPLAY MODE IN MD

• In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit.

• The following will be displayed : During recording and stop : Retry cause, number of retries, and number of retry errors. During playback : Information such as type of disc played, part played, copyright. These are displayed in hexadecimal.

Precedure:

1. Load a recordable disc whose contents can be erased into the unit.

2. Press the MENU/NO “R” button. When “Edit Menu” is displayed on the fluorescent indicator tube, press the

. “R” or > “R” button to display “All Erase?”.

3. Press the ENTER/YES “R” button.

4. When “All Erase??” is displayed on the fluorescent indicator tube.

5. Press the ENTER/YES “R” button to display “Complete!”.

6. Press the REC/REC IT button to start recording. Then press the u button and start recording. If recording cannot be performed,

press the FUNCTION z button and set a different function.

7. Press three buttons of VOL - , u and CD SYNC HIGH simultaneously to enter the retry cause display mode.

8. To check the “track mode”, press the u button to start playback.

9. To release this mode, press the ?/1 button to turn the power of f. W hen “TOC” goes off, disconnect the power plug from the

outlet. If the test mode cannot be released, refer to “Factory Preset” on page 24.

Page 31

HCD-C5

Fig. 1 Reading the Test Mode Display

(During recording and stop)

RTs@@c##e

fluorescent indicator tube

@@ : Cause of retry ## : Number of retries

: Number of retry errors

Reading the Retry Cause Display

Higher Bits Hexadecimal Bit Binary

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001 00000010 00000100

00001000 00010000 00100000 01000000 10000000

Lower Bits

Hexadecimal

02 04

08 10 20 40 80

Fig. 2 Reading the Test Mode Display

(During playback)

@@ ###

fluorescent indicator tube

@@: Parts No. (name of area named on TOC) ## : Cluster

: Sector

$$ : Track mode (Track information such as

Cause of Retry

shock ader5 Discontinuous address

DIN unlock FCS incorrect IVR rec erraor CLV unlock Access fault

When track jump (shock) is detected When ADER was counted more than five times continuously When ADIP address is not continuous When DIN unlock is detected When not in focus When ABCD signal level exceeds the specified range When CLV is unlocked When access operation is not performed normally

Occurring conditions

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example

When 42 is displayed: Higher bit: 4 = 0100 t b6 Lower bit : 2 = 0010 t b1 In this case, the retry cause is combined of “CLV unlock” and “ader5”.

When A2 is displayed: Higher bit: A = 1010 t b7 + b5 Lower bit : 2 = 0010 t b1 The retry cause in this case is combined of “Access fault”, “IVR rec error”, and “ader5”.

Page 32

HCD-C5

Reading the Retry Cause Display

Higher Bit Hexadecimal Bit Binary

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example When 84 is displayed:

Higher bit: 8 = 1000 t b7 Lower bit : 4 = 0100 t b2 In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis OFF”, “Monaural”, “Original”, “Copyright”, and “Write allowed”.

Lower Bits

Hexadecimal

01 02 04 08 10 20 40 80

When 0

Emphasis OFF Monaural

This is 2-bit display. Normally 01. 01:Normal audio. Others:Invalid

Audio (Normal) Original Copyright Write prohibited

Details

When 1

Emphasis ON Stereo

Invalid Digital copy No copyright Write allowed

Example When 07 is displayed:

Higher bit: 0 = 0000 t All 0 Lower bit : 7 = 0111 t b0 + b1 + b2 In this case, as b0, b1, and b2 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis ON”, “Stereo”, “Original”, “Copyright”, and “Write prohibited”.

Hexadecimal t Binary Conversion Table

Hexadecimal Binary Hexadecimal Binary

0 0000 8 1000 1 0001 9 1001 2 0010 A 1010 3 0011 B 1011 4 0100 C 1100 5 0101 D 1101 6 0110 E 1110 7 0111 F 1111

Page 33

SECTION 5

(RFAC)

(DVC 1.65V)

IC103

IC101

ELECTRICAL ADJUSTMENTS

HCD-C5

CD SECTION

Note 1:

1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.

2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MΩ impedance.

4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.

Note 2:

As the laser diode in the optical pick-up (OPTIMA-720L1E) is easily damaged by static electricity, solder the laser tap of the flexible board when handling it. Before disconnecting the connector, solder first. Before connecting the connector, be careful not to remo ve the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

Checking Location:

– BD (CD) BOARD –

laser tap

frexible board

RF Level Check

Connection:

oscilloscope

(AC range)

BD (CD) board

TP (RFAC)

TP (DVC 1.65V)

+ –

Procedure:

1. Connect an oscilloscope to test point TP (RFAC) and TP (DVC

1.65V) on the BD (CD) board.

2. Turn the power on.

3. Put the disc (YEDS-18) in to playback the number five track.

4. Confirm that oscilloscope waveform is clear and check RF signal level is correct or not.

Note: A clear RF signal waveform means that the shape “◊” can be clearly

distinguished at the center of the waveform.

RF signal waveform

Checking Location: BD (CD) board

VOLT/DIV: 200 m TIME/DIV: 500 ns

level: 1.1

0.3 Vp-p

Page 34

HCD-C5

MD SECTION

Note 1:About “R”

As this unit has only a few buttons, some operations require the use of remote commander (RM-SC5BEN/provided with unit: 1-476-649-11) buttons. These operations are indicated as “R” in this manual. Example: MENU/NO “R” ...Press the MENU/NO button of the remote commander.

Note 2:Incorrect operations may be performed if the MD test mode is not entered properly.

In this case, press the ?/1 button to turn the power off, and retry to enter the MD test mode.

1. PARTS REPLACEMENT AND ADJUSTMENT

If malfunctions caused by optical pick-up such as sound skipping are suspected, follow the following check.

Check before replacement

Start

6-2.

Laser Power Check

(See page 37)

6-3.

Iop Compare

(See page 37)

6-4.

Auto Check (See page 38)

Other faults are suspected. Check the mechanism parts (spindle motor, sled motor, etc.).

Replace optical pick-up or MDM-7B4B

Page 35

Adjustment flow

Start

HCD-C5

• Abbreviation OP: optical pick-up

Replace IC195

Replace OP or IC195

Replace IC101, IC195, or D101

Replace OP, IC190, or IC195

YES

After turning off and then on the power, initialize the EEPROM For details, refer to “WHEN MEMORY NG IS DIS- PLAYED” in Section 4. TEST MODE (See page 29)

7.INITIAL SETTING OF ADJUSTMENT VALUE (See page 40)

9.TEMPERATURE COMPENSATION OFFSET ADJUSTMENT (See page 40)

10. LASER POWER ADJUSTMENT (See page 40)

Replace OP, IC102, IC190,

or IC195

Replace OP, IC101, IC151,

or IC195

Replace OP

6-4. Auto Check (See page 38)

End adjustments

YES

11. Iop NV SAVE (See page 41)

12.TRAVERSE ADJUSTMENT (See page 41)

13.FOCUS BIAS ADJUSTMENT (See page 43)

16.AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT (See page 44)

8.RECORDING AND DISPLAYING THE IOP INFORMATION (See page 40)

Page 36

HCD-C5

2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION

T o check the emission of the laser diode dur ing adjustments, ne ver view directly from the top as this may lose your eye-sight.

PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260B/260E)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when handling it. Before disconnecting the connector, solder first. Befor e connecting the connector, be careful not to remov e the solder. Also take adequate measures to prevent damage by static electricity . Handle the flexible board with care as it breaks easily.

pick-up

flexible boar

4. PRECAUTIONS FOR ADJUSTMENTS

1. When replacing the following parts, perform the adjustments and checks with

2. Set the MD test mode when performing adjustments. After completing the adjustments, exit the MD test mode. Perform the adjustments and checks in “Group Service” of the MD test mode.

3. Perform the adjustments to be needed in the order shown.

4. Use the following tools and measuring devices.

• Check Disc (TDYS-1) (Part No. : 4-963-646-01)

• Test Disk (MDW-74/GA-1) (Part No. : 4-229-747-01)

• Laser power meter LPM-8001 (Part No. : J-2501-046-A)

or MD Laser power meter 8010S (Part No. : J-2501-145-A)*

• Oscilloscope (Measure after performing CAL of prove.)

• Digital voltmeter

• Thermometer

• Jig for checking BD (MD) board waveform

(Part No. : J-2501-196-A)

5. When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscilloscope. (VC and ground will become short-circuited.)

6. Using the above jig enables the waveform to be check ed without the need to solder. (Refer to Servicing Notes on page 6.)

7. As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

in the order shown in the following table.

Optical pick-up flexible board

Adjustment

7. Initial setting of adjustment value

8. Recording of Iop information

9. Temperature compensation offset adjustment

10. Laser power adjustment

11. Iop NV Save

12. Traverse adjustment

13. Focus bias adjustment

16. Auto gain control output level adjustment

6-4.AUTO CHECK

laser tap

Optical Pick-up

*1Laser power meter

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (Part No. J-2501-145-A) instead of the conventional laser power meter is convenient. It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of optical pick-up.

Parts to be replaced

IC101 IC102 IC151 IC190 IC195 D101

Page 37

HCD-C5

KMS260B

20101 H0576

lOP = 57.6 mA in this case lOP (mA) = Digital voltmeter reading (mV)/1 (

Ω

)

(Optical pick-up label)

For details of the method for checking this value, refer to “8. Recording and Displaying the Iop Information”

5. USING THE CONTINUOUSLY RECORDED DISC

* This disc is used in focus bias adjustment and error rate check.

The following describes how to create a continuous recording disc.

1. Insert a disc (blank disc) commercially available.

2. Press the . “R” or > “R” button and display “CREC 1MODE” (C35).

3. Press the ENTER/YES “R” button again to display “CREC 1 MID”. Display “CREC 1(0300)” and start to recording.

4. Complete recording within 5 minutes.

5. Press the MENU/NO “R” button and stop recording .

6. Press the MD Z button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note: Be careful not to apply vibration during continuous recording.

6. CHECKS PRIOR TO REPAIRS

These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments in MD” (see page 30).

Procedure:

1. Set the laser power meter on the objective lens of the optical pick-up. (When it cannot be set properly, press the m “R” button or M “R” button to move the optical pick-up.) Connect the digital volt meter to CN105 pin 1 (I+3V) and CN105 pin 2 (IOP).

2. Then, press the . “R” or > “R” button and display “LDPWR CHECK” (C13).

3. Press the ENTER/YES “R” button once and display “LD 0.9mW$

”. Check that the reading of the laser power meter becomes

specified value.

SPECIFIED VALUE

KMS-260B KMS-260E

0.85 to 0.91 mW

0.90 to 0.96 mW

4. Press the ENTER/YES “R” button once more and display “ LD

7.0mW$ ”. Check that the reading the laser power meter and digital volt meter satisfy the specified value.

Specified V alue:

Laser power meter reading :

KMS-260B KMS-260E

7.0 to 0.2 mW

7.25 to 0.25 mW

Digital voltmeter reading : Optical pick-up displayed value ± 10%

6-1. Temperature Compensation Offset Check

When performing adjustments, set the internal temperature and room temperature to 22 to 28ºC.

Procedure:

1. Press the

. “R” or > “R” button to display “TEMP

CHECK” (C12).

2. Press the ENTER/YES “R” button.

3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]” is displayed, it means that the results are bad. (@@ indicates the current value set, and ## indicates the value written in the non-volatile memory.)

6-2. Laser Power Check

Before starting adjustment; The laser power adjustment value changes depending upon the types of the optical pick-up (KMS-260B or KMS-260E). Check the type of the optical pick-up before starting adjustment. (See the illustrations “The method of identifying the optical pickup” on page 41) Before checking, check the Iop value of the optical pick-up. (Refer to 8. Recording and Displaying the Iop Information (see page

40))

Connection:

laser power mete

5. Press the MENU/NO “R” button and display “LDPWR CHECK” (C13) and stop the laser emission. (The MENU/NO “R” b utton is ef fecti v e at all times to stop the laser emission.)

Note: After step 4, each time the ENTER/YES “R” button is pressed, the

display will be switched to “LD 0.7W$ ”and “LD 6.2mW$ ” “LD WP $ ”. Nothing needs to be performed here.

Checking Location: BD (MD) board (see page 44)

6-3. Iop Compare

The current Iop value at laser power 7.0 mW output and reference Iop value (set at shipment) written in the nonvolatile memory are compared, and the rate of increase/decrease will be displayed in percentage.

Note: Perform this function with the optical pick-up set at room tempera-

ture.

Optical pick-up objective lens

BD (MD) board

CN105 pin 1 (I+3V)

CN105 pin 2 (IOP)

Procedure:

1. Press the . “R” or > “R” button to display “Iop Compare” (C27).

2. Press the ENTER/YES “R” button and start measurements.

digital voltmete

3. When measurements complete, the display changes to “± xx% yy”. xx is the percentage of increase/decrease, and OK or NG is displayed at yy to indicate whether the percentage of increase/

–

decrease is within the allowable range.

4. Press the MENU/NO “R” button to end.

Page 38

HCD-C5

–

oscilloscope

(DC range)

V: 0.1 V/div H: 10 ms/div

BD (MD) board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

6-4. Auto Check

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. T o perform this test mode, the laser power must first be check ed. Perform Auto Check after the laser power check and Iop compare.

Procedure:

1. Press the . “R” or > “R” button to display “AUTO CHECK” (C01).

2. Press the ENTER/YES “R” button. If “LDPWR ” is displayed, it means that the laser power check has not been performed. In this case, perform the laser power check and Iop Compare, and then repeat from enter the MD test mode.

3. If a disc is in the mechanical deck, it will be ejected forcibly. “DISC IN” will be displayed in this case. Load a test disc (MDW 74/GA-1) which can be recorded.

4. If a disc is loaded at step 3, the check will start automatically.

5. When “XX CHECK” is displayed, the item corresponding to XX will be performed. When “06 CHECK” completes, the disc loaded at step 3 will be ejected. “DISC IN” will be displayed. Load the check disc (TDYS-1).

6. When the disc is loaded in the step 5, the check will automatically be resumed from “07 CHECK”.

7. After completing to test item 12 (“oC CHECK”), check OK or NG will be displayed. If all items are OK, “CHK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

When “CHK ALL OK” is displayed, it means that the optical pickup is normal. Check the operations of other parts (spindle motor, sled motor, etc.). When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

6-5. Other Checks

All the following checks are performed by the Auto Check mode. They therefore need not be performed in normal operation. 6-6. Traverse Check 6-7. Focus Bias Check 6-8. C PLAY Check 6-9. Self-Recording/Playback Check

6-6. Traverse Check

Note 1:Data will be erased during MO reading if a recorded disc is

used in this adjustment.

Note 2:If the traverse waveform is not clear, connect the oscilloscope

as shown in the following figure so that it can be seen more clearly.

oscilloscope

(DC range)

BD (MD) board

CN105 pin 4 (TE)

CN105 pin

(VC)

330 k

Ω

–

10 pF

Connection:

Procedure:

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) on the BD (MD) board.

2. Load a disc (any available on the market). (Refer to Note 1)

3. Press the M “R” button to move the optical pick-up outside the pit.

4. Press the . “R” or > “R” button to display “EF MO CHECK”(C14).

5. Press the ENTER/YES “R” button to display “EFB = MOR”. (Laser power READ power/Focus serv o ON/tracking servo OFF/spindle (S) servo ON)

6. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the . “R” or

> “R” button.

(Read power traverse checking)

Traverse Waveform

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

7. Press the ENTER/YES “R” button to display “EFB = MO- W”.

8. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the . “R” or

> “R” button. (Write power traverse checking)

Traverse Waveform

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

Page 39

HCD-C5

9. Press the ENTER/YES “R” button to display “EFB = MO- P”. Then, the optical pick-up moves to the pit area automatically and servo is imposed.

10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the . “R” or

> “R” button.

Traverse Waveform

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

11. Press the ENTER/YES “R” button to display “EF MO CHECK” (C14). The disc stops rotating automatically.

12. Press the MD Z button and take out the disc.

13. Load the check disc (TDYS-1).

14. Press the . “R” or > “R” button and display “EF CD CHECK” (C15).

15. Press the ENTER/YES “R” button to display “EFB = CD”. Servo is imposed automatically.

16. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the . “R” or

> “R” button.

Traverse Waveform

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

17. Press the ENTER/YES “R” button to display “EF CD CHECK” (C15).

18. Press the MD Z button and take out the check disc (TDYS-1).

Checking Location: BD (MD) board (see page 44)

6-7. Focus Bias Check

Change the focus bias and check the focus tolerance amount.

Procedure:

1. Load the test disc (MDW-74/GA-1).

2. Press the . “R” or > “R” button to display “CPLAY 1MODE” (C34).

3. Press the ENTER/YES “R” button to display “CPLA Y 1MID”.

4. Press the MENU/NO “R” button when “C = AD =

” is displayed.

5. Press the . “R” or > “R” button to display “FBIAS CHECK” (C16).

6. Press the ENTER/YES “R” button to display “ / c = ”.

The first four digits indicate the C1 error rate, the two digits after [/] indicate ADER, and the 2 digits after [c =] indicate the focus bias value. Check that the C1 error is below 20 and ADER is below 2.

7. Press the ENTER/YES “R” button to display “ / b = ”.

Check that the C1 error is about 100 and ADER is below 2.

8. Press the ENTER/YES “R” button to display “ / a = ”.

Check that the C1 error is about 100 and ADER is below 2.

9. Press the MENU/NO “R” button, then press the MD Z button

and take out the test disc.

6-8. C PLAY Check

MO Error Rate Check

Procedure:

1. Load the test disc (MDW-74/GA-1).

2. Press the . “R” or > “R” button to display “CPLAY

1MODE” (C34).

3. Press the ENTER/YES “R” button to display “CPLA Y 1MID”.

4. The display changes to “C = AD = ”.

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the MENU/NO “R” button to stop playback, then press

the MD Z button and take out the test disc.

CD Error Rate Check

Procedure:

1. Load the check disc (TDYS-1).

2. Press the . “R” or > “R” button to display “CPLAY

1MODE” (C34).

3. Press the ENTER/YES “R” button to display “CPLA Y 1MID”.

4. The display changes to “C =

AD = )”.

5. Check that the C1 error rate is below 20.

6. Press the MENU/NO “R” button to stop playback, then press

the MD Z button and take out the check disc.

6-9. Self-Recording/playback Check

Prepare a continuous recording disc using the unit to be repaired and check the error rate.

Procedure:

1. Load a recordable disc (blank disc).

2. Press the . “R” or > “R” button to display “CREC

1MODE” (C34).

3. Press the ENTER/YES “R” button to display “CREC 1MID”.

4. When recording starts, “ REC ” and display “CREC 1 @@@@”

REC

(@@@@ is the address).

5. About 1 minute later, press the MENU/NO “R” button to stop

continuous recording.

6. Press the . “R” or > “R” button to display “CPLAY

1 MODE” (C34).

7. Press the ENTER/YES “R” button to display “CPLAY 1

MID”.

8. “C = AD = )” will be displayed.

9. Check that the C1 error becomes below 20 and the AD error

below 2.

10. Press the MENU/NO “R” button to stop playback, then press

the MD Z button and take out the disc.

Page 40

HCD-C5

–

BD (MD) board

digital voltmeter

CN105 pin 1 (I+3V)

CN105 pin

(IOP)

7. INITIAL SETTING OF ADJUSTMENT VALUE

Note:

Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “4. Precautions for Adjustments” (See page 36) and execute the initial setting before the adjustment as required.

Procedure:

1. Press the . “R” or > “R” button to display “ADJ CLEAR” (C28).

2. Press the ENTER/YES “R” button. “Complete!” will be displayed momentarily and initial setting will be executed, after which “ADJ CLEAR” (C28) will be displayed.

8. RECORDING AND DISPLAYING THE IOP INFORMATION

The IOP data can be recorded in the non-volatile memory . The IOP value on the optical pick-up label and the IOP value after the adjustment will be recorded. Recording these data eliminates the need to read the label on the optical pick-up.

Recording Procedure:

1. Press the . “R” or > “R” button to display “Iop Write” (C05), and press the ENTER/YES “R” button.

2. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.

3. Input the IOP value on the optical pick-up label. To select the number : Press the . “R” or > “R” b utton. To select the digit : Press two buttons of VOL - and

CD Z simultaneously.

4. When the ENTER/YES “R” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

5. As the adjustment results are recorded for the step 4 value. Leave it as it is and press the ENTER/YES “R” button.

6. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).

Procedure:

1. Press the . “R” or > “R” button to display “TEMP ADJUST” (C03).

2. Press the ENTER/YES “R” button to select the “TEMP ADJUST” mode.

3. “TEMP = [OK]” and the current temperature data will be displayed.

4. To save the data, press the ENTER/YES “R” button. When not saving the data, press the MENU/NO “R” button.

5. When the ENTER/YES “R” button is pressed, “TEMP = SAVE” will be displayed and turned back to “TEMP ADJUST” (C03) display then. When the MENU/NO “R” button is pressed, “TEMP ADJUST” (C03) will be displayed immediately.

Specified V alue:

The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 0F”, “10 - 1F” and “20 - 2F”.

10.LASER POWER ADJUSTMENT

Before starting adjustment; The laser power adjustment value changes depending upon the types of the optical pick-up (KMS-260B or KMS-260E). Check the type of the optical pick-up before starting adjustment. (See the illustrations “The method of identifying the optical pickup on page 41.) Check the IOP value of the optical pick-up before adjustments. (Refer to 8. Recording and Displaying the Iop Information)

Connection:

Optical pick-up objective lens

laser power meter

Display Procedure:

1. Press the . “R” or > “R” button to display “Iop Read”(C26) and press the ENTER/YES “R” button.

2. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ indicates the IOP value on the optical pick-up label. ##.# indicates the IOP value after adjustment

3. To end, press the MENU/NO “R” button to display “Iop Read” (C26).

9. TEMPERATURE COMPENSATION OFFSET

ADJUSTMENT

Save the temperature data at that time in the non-volatile memory as 25 ˚C reference data.

Note:

1. Usually, do not perform this adjustment.

2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. Per-

form it immediately after the power is turned on when the internal temperature of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.

3. When D101 has been replaced, perform this adjustment after the tem-

perature of this part has become the ambient temperature.

Procedure:

1. Insert the laser power meter probe into the disc insertion slot and set it on top of the objective lens of the optical pick-up. (When it cannot be set properly, press the

M “R” button to move the optical pick-up)

m “R” button or

Connect the digital voltmeter to CN105 pin 1 (I+3V) and CN105pin 2 (IOP) on the BD (MD) board.

2. Press the . “R” or > “R” button to display “LDPWR ADJUST” (C04). (Laser power : For adjustment)

3. Press the ENTER/YES “R” button once to display “LD 0.9 mW $ ”.

4. Press the . “R” or > “R” button until the laser power meter reading matches with the specified value as described in the following table.

SPECIFIED VALUE

KMS-260B KMS-260E

0.85 to 0.91 mW

0.90 to 0.96 mW

Press the ENTER/YES “R” button after setting the range knob of the laser power meter, and save the adjustment results. (“LD SAVE $ ” will be displayed for a moment)

5. Then “LD 7.0 mW $ ” will be displayed.

Page 41

HCD-C5

UV adhesive agent

Optical pick-up

(KMS-260B/260E)

Pink : KMS-260B White : KMS-260E

UV adhesive agent =

–

oscilloscope

(DC range)

10 pF

330 k

Ω

CN105 pin 4 (TE)

CN105 pin

(VC)

BD (MD) board

6. Press the . “R” or > “R” button so that the reading of the laser power meter becomes the specified value, pr ess the ENTER/YES “R” button to save it.

SPECIFIED VALUE

Note: Do not perform the emission with 8.4 mW more than 15 seconds

continuously.

KMS-260B KMS-260E

6.9 to 7.1 mW

7.2 to 7.3 mW

7. Then, press the . “R” or > “R” button to display “LDPWR CHECK” (C13).

8. Press the ENTER/YES “R” button once to display “LD

0.9mW$ ”. Check that the reading of the laser power meter matches with the specified value as described in the following table.

SPECIFIED VALUE

KMS-260B KMS-260E

0.85 to 0.91 mW

0.90 to 0.96 mW

9. Press the ENTER/YES “R” button once more to display “LD

8.4mW$ ”. Check that the reading the laser power meter and digital voltmeter satisfy the specified value. Note down the digital voltmeter reading value.

Specified V alue:

Laser power meter reading :

SPECIFIED VALUE

Digital voltmeter reading :

(Optical pick-up label)

KMS260B

20101

H0576

lOP = 57.6 mA in this case lOP (mA) = Digital voltmeter reading (mV)/1 (

KMS-260B KMS-260E

Value on the optical pick-up label ±10%

For details of the method for checking this value, refer to “8. Recording and Displaying the Iop Information”

7.0 to 0.2 mW

7.25 to 0.25 mW

Ω

)

10. Press the MENU/NO “R” button to display “LDPWR CHECK” (C13) and stop the laser emission. (The MENU/NO “R” button is effecti ve at all times to stop the laser emission)

11. Press the . “R” or > “R” button to display “Iop Write” (C05).

12. Press the ENTER/YES “R” button. When the display becomes “Ref=@@@.@” (@ is an arbitrary number), press the ENTER/YES “R” button to display “Measu=@@@.@” (@ is an arbitrary number).

13. The numbers which can be changed will blink. Input the Iop value noted down at step 9. T o select the number : Press the . “R” or > “R” button. T o select the digit :Press two buttons of VOL - and

CD Z simultaneously.

14.

When the ENTER/YES “R” button is pressed, “Complete!” will be displayed momentarily. The value will be recorded in the nonvolatile memory and the display will become “Iop Write” (C05).

Note: After step 9, each time the ENTER/YES “R” button is pressed, the

display will be switched to “LD 0.7mW$ ”, “LD 6.2mW$ ” and “LD WP ” Nothing needs to be performed here.

The method of identifying the optical pick-up (KMS-260B/260E)

11.Iop NV SAVE

Write the reference values in the nonvolatile memory to perform “Iop compare”. As this involves rewriting the reference values, do not perform this procedure except when adjusting the laser power during replacement of the optical pick-up and when replacing the IC102. Otherwise the optical pick-up check may deteriorate.

Note:

Perform this function with the optical pick-up set at room temperature.

Procedure:

Press the . “R” or > “R” button to display “Iop NV Save” (C06).

2. Press the ENTER/YES “R” button and display “Iop [stop]”.

3. After the display changes to “Iop =xxsave?”, press the ENTER/YES “R” button.

4. After “Complete!” is displa yed momentarily, the display chang es to “Iop 7.0 mW”.

5. After the display changes to “Iop=yysave?”, press the ENTER/YES “R” button.

6. When “Complete!” is displayed, it means that Iop NV saving has been completed.

12. TRAVERSE ADJUSTMENT

Note 1: Data will be erased during MO reading if a recorded disc is

used in this adjustment.

Note 2: If the traverse waveform is not clear, connect the oscilloscope

as shown in the following figure so that it can be seen more clearly.

Connection:

oscilloscope

(DC range)

BD (MD) board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

–

V: 0.1 V/div H: 10 ms/div

Page 42

HCD-C5

Procedure:

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) on the BD (MD) board.

2. Load a disc (any available on the market). (Refer to Note 1)

3. Press the M “R” button to move the optical pick-up outside the pit.

4. Press the . “R” or > “R” button to display “EF MO ADJUST” (C07).

Press the ENTER/YES “R” button to display “EFB = MOR”.

(Laser power READ power/Focus serv o ON/tracking servo

OFF/spindle (S) servo ON)

6. Press the . “R” or > “R” button so that the waveform of the oscilloscope becomes the specified value. (When the . “R” or > “R” button is pressed, the of “EFB= ” changes and the waveform changes) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Read power traverse adjustment)

Traverse Waveform

Specification A = B

7. Press the ENTER/YES “R” button and save the result of adjustment to the non-volatile memory (“EFB = SAVE” will be displayed for a moment. Then “EFB = MO-W” will be displayed).

8. Press the . “R” or > “R” button so that the waveform of the oscilloscope becomes the specified value. (When the . “R” or > “R” b utton is pressed, the

of “EFB= ” changes and the waveform changes) In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified v alue is satisf ied as much as possible. (Write power traverse adjustment)

Traverse Waveform

11. Press the . “R” or > “R” button until the waveform of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

Traverse Waveform

Specification A = B

12. Press the ENTER/YES “R” button, and save the adjustment results in the non-volatile memory. (“EFB = SAVE” will be displayed for a moment) Next “EF MO ADJUST” (C07) is displayed. The disc stops rotating automatically.

13. Press the MD Z button and take out the disc.

14. Load the check disc (TDYS-1).

15. Press the . “R” or > “R” button to display “EF CD ADJUST” (C08).

16. Press the ENTER/YES “R” button to display “EFB = CD”. Servo is imposed automatically.

17. Press the . “R” or > “R” button so that the waveform of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

Traverse Waveform

Specification A = B

18. Press the ENTER/YES “R” button, display “EFB = SA VE” for a moment and save the adjustment results in the non-volatile memory. Next “EF CD ADJUST” (C08) will be displayed.

19. Press the MD Z button and take out the check disc.

Specification A = B

9. Press the ENTER/YES “R” button, and save the adjustment results in the non-volatile memory . (“EFB = SA VE” will be displayed for a moment)

10. “EFB = MO-P” will be displayed. The optical pick-up moves to the pit area automatically and servo is imposed.

Adjustment Location: BD (MD) board (see page 44)

Page 43

HCD-C5

13. FOCUS BIAS ADJUSTMENT

Procedure:

1. Load the continuously-recorded disc. (Refer to “5. USING THE CONTINUOUSLY RECORDED DISC” (See page 37))

2. Press the . “R” or > “R” button to display “CPLAY 1 MODE” (C34).

3. Press the ENTER/YES “R” button to display “CPLA Y 1MID”.

4. Press the MENU/NO “R” button when “C = = ” is displayed.

5. Press the . “R” or > “R” button to display “FBIAS ADJUST” (C09).

6. Press the ENTER/YES “R” button to display “ / a =

T”. The first four digits indicate the C1 error rate, the two digits after “/ ” indicate ADER, and the 2 digits after “a =” indicate the focus bias value.

7. Press the > “R” button and find the focus bias value at which the C1 error rate becomes about 220 (refer to Note 2).

8. Press the ENTER/YES “R” button to display “ / b =

T”.

9. Press the . “R” button and find the focus bias value at which the C1 error rate becomes about 220.

10. Press the ENTER/YES “R” button to display “ / c =

T”.

11. Check that the C1 error rate is below 20 and ADER is 00. Then press the ENTER/YES “R” button.

12. If the “( )” in “ - - ( )” is above 20, press the ENTER/YES “R” button. If below 20, press the MENU/NO “R” button and repeat the adjustment from step 2.

13. Press thet MD Z button and take out the disc.

Note 1: The relation between the C1 error and focus bias is as shown in

Note 2: As the C1 error rate changes, perform the adjustment using the

the following figure. Find points A and B in the follo wing figure using the above adjustment. The focal point position C is automatically calculated from points A and B.

average value.

C1 error

about 220

Focus bias value

14. ERROR RATE CHECK

14-1. CD Error Rate Check

Procedure:

1. Load the check disc (TDYS-1).

2. Press the . “R” or > “R” button and display “CPLA Y 1 MODE” (C34).

3. Pr ess the ENTER/YES “R” button and display “CPLAY 1 MID”.

4. The display changes to “C = AD = )”.

5. Check that the C1 error rate is below 20.

6. Press the MENU/NO “R” button to stop playback, then press the MD Z button and take out the check disc.

14-2. MO Error Rate Check

Procedure:

1. Load the continuously-recorded disc. (Refer to “5. USING THE CONTINUOUSLY RECORDED DISC” (See page 37))

2. Press the . “R” or > “R” button to display “CPLAY 1 MODE” (C34).

3. Press the ENTER/YES “R” button to display “CPLA Y 1MID”.

4. The display changes to “C1 = AD = )”.

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the MENU/NO “R” button to stop playback, then press the MD Z button and take out the disc.

15. FOCUS BIAS CHECK

Change the focus bias and check the focus tolerance amount.

Procedure:

1. Load the continuously-recorded disc. (Refer to “5. USING THE CONTINUOUSLY RECORDED DISC” (See page 37))

2. Press the . “R” or > “R” button to display “CPLAY 1 MODE” (C34).

3. Press the ENTER/YES “R” button twice to display “CPLAY 1 MID”.

4. Press the MENU/NO “R” button when “C1 =

)” is displayed.

5. Press the . “R” or > “R” button to display “FBIAS CHECK” (C16).

6. Press the ENTER/YES “R” button to display “ / c =

”. The first four digits indicate the C1 error rate, the two digits after “/ ” indicate ADER, and the 2 digits after “c =” indicate the focus bias value. Check that the C1 error is below 20 and ADER is below 2.

7. Press the ENTER/YES “R” button and display “ / b = ”. Check that the C1 error is about 100 and ADER is below 2.

8. Press the ENTER/YES “R” button and display “ / a = ”. Check that the C1 error is about 100 and ADER is below 2

9. Press the MENU/NO “R” button, then press the MD Z button and take out the disc.

AD =

Note: If the C1 error and ADER are above other than the specified

value at points a (step 8. in the above) or b (step 7. in the abov e), the focus bias adjustment may not have been carried out properly. Adjust from the beginning again.

Page 44

HCD-C5

16. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT

Be sure to perform this adjustment when the optical pick-up is replaced. If the adjustment results becomes “Adjust NG!”, the optical pick-up may be faulty or the servo system circuits may be abnormal.

16-1. CD Auto Gain Control Output Level Adjustment

Procedure:

1. Load the check disc (TDYS-1).

2. Press the . m “R” or M > “R” button to display “AG Set (CD)” (C11).

3. When the ENTER/YES “R” button is pressed, the adjustment will be performed automatically. “Complete!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (CD)” (C11).

4. Press the MD Z button and take out the check disc.

16-2. MO Auto Gain Control Output Level Adjustment

Procedure:

1. Load the test disc (MDW-74/GA-1).

2. Press the . “R” or > “R” button to display “AG Set (MO)” (C10).

4. Press the MD Z button and take out the test disc.

Adjustment and checking Loacation:

– BD (MD) BOARD (Component Side) –

D101

CN101

Note: It is useful to use the jig for checking the waveform. (Refer to Servicing Notes on page 6)

– BD (MD) BOARD (Conductor Side) –

IC190

IC151

IC101

CN105

1 7

1. I+3V

2. IOP

3. GND

4. TE

5. FE

6. VC

7. RF

Page 45

SECTION 6

DIAGRAMS

HCD-C5

Ver 1.1 2001.09

6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

(In addition to this, the necessary note is printed in each block)

Note on Printed Wiring Boards:

• X : parts extracted from the component side.

•

• Y : parts extracted from the conductor side.

• b : Pattern from the side which enables seeing.

Caution: Pattern face side: Parts on the pattern face side seen from (Conductor B) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component A) the parts face are indicated.

(The other layers' patterns are not indicated.)

• Indication of transistor.

• Abbreviation

: Through hole.

C Q

AUS : Australian model HK : Hong Kong model KR : Korean model

These are omitted.

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

• 5 : fusible resistor.

• C : panel designation.

• A : B+ Line.

• B : B– Line.

Note: The components identified by mark 0 or dotted line

with mark 0 are critical for safety. Replace only with part number specified.

• Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances.

• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F : FM J : CD (ANALOG) c : CD (DIGITAL) p : PB (MD) l : REC (MD) I : DIGITAL IN (OPTICAL) E : PB (TAPE) G : REC (TAPE)

W or less unless otherwise

• Circuit Boards Location

POWER board

PANEL board

HP board

JACK boar

AUDIO board

• Waveforms

IC101 us XTAO

29.5 µs

IC151 o; (FS4)

176.4kHz

4.0Vp-p

VOLT/DIV : 1V AC TIME/DIV : 20 nsec

3.5Vp-p

IC101 ek (RF)

IC701 qd XOUT

100 ns

1.3Vp-p

3.2 Vp-p

VOLT/DIV : 1V AC TIME/DIV : 40 nsec

IC101 ef (FE)

(Play mode)

IC501 eh XT2

30.5 µs

VOLT/DIV : 1V AC TIME/DIV : 20

0.2Vp-p

3.2Vp-p

IC101 wh (TE)

(Play mode)

IC501 ek X2

sec

50 ns

VOLT/DIV : 1V AC TIME/DIV : 40 nsec

1.6Vp-p

3.1 Vp-p

SW board

CONNECTOR board

AMP POWER boardUCOM board

BD (CD) boar

BD (MD) board MD DIGITAL board

4545

Page 46

HCD-C5

6-2. BLOCK DIAGRAM – CD SERVO SECTION –

• Signal Path

: CD (DIGITAL)

:DIGITAL IN (OPTICAL)

OPTICAL PICK-UP

BLOCK

OPTIMA-720L1E

1/2VCC

VCC

GND

F+

FOCUS

COIL

TRACKING

COIL

F-

TR+

TR-

+5V

Q101

DRIVE

M903

FEED

MOTOR

M904

SPINDLE

MOTOR

RV101

27 25

7 6 8

9 10 11

VCC

19 TE_BAL

MOTOR/COIL DRIVER

VO1(+)

VO1(-)

VO2(+)

VO2(-)

SD+

VO4(+)

SD-

VO4(-)

SP+

VO3(-)

SP-

VO3(+)

VC VFC B A C D E F

IC103

RF AMP

RFAC

RFDCO

RFDCI

IC102

OPIN1(+)

OPIN1(-)

OPIN2(+)

OPIN(2-)

OPIN4(+)

OPIN4(-)

OPIN3(-)

+5V

Q102

SWITCH

RFC

15 28

16FE 18TE

FEI

LIMIT

23 MDP

SWITCH

IC221

D OUT

XTSL

DATA CLOK

XLAT

SQSO

SENS SCLK SQCK

SCOR

XRST

XTAI

XTAO

DIGITAL

OPTICAL

4 6 5

8 77 15

DIGITAL

OPTICAL

INPUT

IC101

DIGITAL SERVO,

DIGITAL SIGNAL PROCESSOR

RFAC

RFDC

26 SSTP

FFDR

FRDR

TFDR

TRDR

SFDR

SRDR

CTRL1(1-2)

DATA

CLK XLT

SQSO

SENS SCLK

SCOR

XRST

X201

33.8688MHz

LDON

IC222

SELECTOR

S1 (Disc IN/8cm Disc Detect)

(12cm Disc/12cm Disc Eject End Detect)

S3 (Disc Existence, Chacking, Releasing Detect)

S4 (8cm Disc Eject End Detect)

DIN, OPTO

OPTO

IC501(1/2)

MASTER CONTROL

CTRL1

CXD-DATA

CXD-CLK

CXD-XLT

SUBQ

SENSE

SCLK

SCOR

BDRST

SW1

SW2

SW3

SW4

LDON

LODPOS

LODNEG

SERVO

SECTION

(Page 47)

LOADING MOTOR DRIVER

FIN

RIN

IC1102

OUT1

OUT2

M902

(LOADING)

PWM1

PWM2

PWM3

4646

PWM1

PWM2

PWM3

+3.3V

Q103,D101

+3.3V

REG

+5V

Page 47

6-3. BLOCK DIAGRAM – MD SERVO SECTION –

HCD-C5

OPTICAL PICK-UP

I J

LASER DIODE

2-AXIS

DEVICE

(TRACKING)

HF MODULE

(KMS-260B)

C B

DETECTOR

LDPD

FCS+

(FOCUS)

FCS– TRK+ TRK–

MOD

HR901

OVER WRITE HEAD

VC VC

ILCC

POWER CONTROL

LASER ON

SWITCH

FOCUS/TRACKING COIL DRIVER,

M701

(SPINDLE)

M702

(SLED)

IC141

SPINDLE/SLED MOTOR DRIVER

LD+3V

Q121, 122

AUTOMATIC

Q101

OUT4F

OUT4R

OUT2F

OUT2R

OUT1F

21 23

OUT1R

OUT3F

12 10

OUT3R

D101

TEMP

SENSOR

PSB

1 2

4 5 6 7

8 9

IN4R

IN4F

IN2F

IN2R

IN1F

IN1R

IN3F

IN3R

I J

TEMPR

TEMPI

A B C D

E F

APC

AMP

3 4

29 30

19 18

14 15

48 47

MORFO

RF AMP

I-V

LD/PD

AMP

SPFD SPRD

IC181, Q181 182

OVER WRITE HEAD DRIVE

MORFI

RFO

46 40

B.P.F.

TEMP

B.P.F.

AMP

ABCD

AMP

SERIAL/PARALLEL

CONVERTER,

APCREF

83 13 67 65 66 75 74 63 64

APCREF

SFDR

SRDR

FFDR

FRDR

TFDR

TRDR

SCTX

WBL

ADFM

FOCUS

ERROR AMP

TRACKING

ERROR AMP

COMMAND

DECODER

SWDT

SCLK

XLAT

181716

XRST

AUTOMATIC

POWER

CONTROL

DIGITAL SERVO

SIGNAL

PROCESS

PWM GENERATOR

SIGNAL PROCESSOR

IC151 (1/2)

DIGITAL SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

ATRAC ENCODER/DECODER

IC101

RF AMP,

FOCUS/TRACKING ERROR AMP

AGCI

RF AGC

& EQ

WBL

PEAK &

BOTTOM

ADIN

3029

WBL

V-I

CONVERTER

RECP

AUX1

ABCD

A/D CONVERTER

FROM CPU INTERFACE

AUTO

SEQUENCER

IC151 (2/2)

DIGITAL SERVO

AUX

PEAK

BOTM

ADFG

ABCD

TE SE

F0CNT

ANALOG MUX

37 36

26 28

PEAK

XLRF CKRF DTRF

BOTM

FILTER

BUP+3.3V

80 81 82

XLAT SCLK

SWDT

100

60 59 62 61

54 57

EFMO

FILI PCO CLTV FILO

ASYO

ASYI

COMPA-

RFI

RATOR

ADFG

DEMODULATOR/

DECODER

F0CNT

IC861

RESET

Q131 - 134

HF MODULE

SWITCH

PLL

ADIP

SWITCH

Q861

SPINDLE

SERVO

SPFD

94 93

15 68

SHOCK PROOF

EFM/ACIRC

SUBCODE

PROCESSOR

SPRD

DQSY

12 11 14 9 8 5 6 7 1 2 3 4

MEMORY CONTROLLER

ENCODER/DECODER

SQSY

XINT

INTERFACE

SENS

SRDT

ATRAC

ENCODER/DECODER

CPU

SWDT

SCLK

XLAT

20 25 58 32 33 50 59 48 1931

DQSY

S-RST

LDON

DIG-RST

WRPWR

MOD

IC871

MOTOR DRIVER

SQSY

XINT

67 66

9 7

OUT1

4 2

LOAD-IN

LOAD-OUT

FIN

RIN

VREF

OUT2

SENS

VCC

SRDT

SWDT

SCLK

M703

(LOADING)

(REFLECT

-A

IC102

WAVEFORM

LD+3.3V

SHAPER

IC151 (1/2)

SAMPLING

CONVERTER

DIGITAL

INTERFACE

XLAT

VOLTAGE SWITCH

(LIMIT IN)

→ PROTECT)

DADTI

RATE

XBCKI LRCKI

AUDIO

FS256

CLOCK

GENERATOR

INTERNAL BUS

MONITOR CONTROL

MNT0

MNT1

MNT2

SHOCK (MNT1)

IC701

MASTER CONTROLLER

Q871, 872

REFERENCE

(OUT)

(PLAY)

(REC)

IOP

ADDT

22 24 23

DIN0

DIN1

DOUT

DADT

XBCK

LRCK

27 29

MNT3

XBUSY (MNT2)

M+7V

S101

S103

S104

S105

S102

DADTI

XBCKI LRCKI

DIN

DOUT

PDOWN

P-DOWN

65 55

61 44

LOAD-LO LIMIT-IN

OUT-SW PLAY-SW

REC-SW

REFLECT PROTECT IOP

OSCI

OSCO

D0 – D3

A00 – A09

XOE

XWE XRAS XCAS

XIN-T

XOUT-T

XIN

XOUT

OPTSEL

ADPDWN

EEP-WP

EEP-CLK

EEP-DATA

MUTE

SLICER-SEL

DA-RESET

SPDIF-LOCK

I2C-BUSY

I2C-CLK I2C-DAT

SPDIF-CUT

IC190

+3.3V

3 1

REG

X171

90MHz

16 17

48, 49, 50, 51

34 – 31, 36 – 40, 45

43 47 46 44

11 15

81 82

47 45 60

79 78 80

23 29 30

I2C-BUSY I2C-CLK I2C-DATA

+5VLD+3.3 V

1, 2, 24, 25

DQ1 – DQ4

A0 – A9

5, 9 – 12, 14 – 18

OE WE

RAS

CAS

X717 32kHz

X720 10MHz

OPTO

IC195

EEPROM

WP SCL

SDA

Q211

SWITCH

IC153

D-RAM

MUTE

DOUT

DIN

15 16 33 37 29

SPDIF0

MUTE

SLICER-SEL

RESET LOCK

+3.3V

DIN

XBCKI

SPDIF1

IIS-OUT-BCK

IC211

D/A

CONVERTER

Q201,202

SWITCH

DATAI

XBCKI

13 1211

BCK

DATAO

PWON

LRCKI

IIS-OUT-WS

VDDA (DAC)

LRCKI

• Signal Path : PB (MD) : REC (MD) : CD (DIGITAL) : CD (ANALOG)

IC201

A/D

CONVERTER

VINL

VINR

SYSCLK

CLKOUT

VOUTL

VOUTR

R-CH

DIN , OPTO

PDOWN , MUTE

REC-L

MD-L

I2C-DATA,I2C-CLK, I2C-BUSY

SERVO

SECTION

(Page 46)

MAIN

SECTION

(Page 48)

MAIN

SECTION

(Page 48)

MAIN

SECTION

(Page 48)

4747

Page 48

HCD-C5

6-4. BLOCK DIAGRAM – MAIN SECTION –

TAPE

J102

J101

OUT

ANTENA

FM75Ω

R-CH

TUNER PACK

L-CH

R-CH

TUNED

STEREO

MUTE

R-CH

PC LINK

SERVO

SECTION

(Page 47)

CN207

+5V

SOUND PROCESSOR

CD/MD

PCLINK-INSERTED

I2C-DATA, I2C-CLK, I2C-BUSY

CLK

DATA

IC301

I2C BUS BUFFER

LAT

CLK

22 21

IC212

SYS +5V

REC

OUT

B-O

B-I

V-O

DATA

IC602

REMOTE SENSOR

S602-605

FUNCTION

KEY

S606-609

FUNCTION

KEY

S610-613

FUNCTION

KEY

D942

IC941

RESET

D941

Q211

SWITCH

Q212

SWITCH

MUTING

Q311 DBFB

SWITCH

Q101

POWERKEY

AC-DET

I2C-CLK

I2C-DATA

I2C-BUSY

Q221-224

SIRCS/

DETECT

SWITCH

MD-L

REC-L

Q102

SWITCH

Q941

RESET

SERVO

SECTION

(Page 47)

MUTING

D343

IC501 (2/2)

MASTER CONTROL

REC-MUTE

VOL-DATA

VOL-CLK

VOL-CE

PLL-CLK

PLL-DI(ST UCOM)

PLL-DO(UCOM ST)

PLL-CE

TUNED

STEREO

ST-MUTE

PCPON

SCL

SDA

KBD-CHK

HELP

SIRCS

KEY-RM

KEY1

KEY2

KEY3

AC-CUT

RESET

Q331

PRE-MUTE

SPK-RELAY

FL-DATA

FL-CLK

FL-CE

FL-RST

ON/STANDBY

BDPWR

PWR-RELAY

MD-PWR

DMUTE

HEADPHONE AMP

XT1

XT2

LED

70 24

IC302

–

PDOWN

MUTE

X502

32.768kHz

X501 20MHz

SDATA

SCK

RST

Q604

LED

DRIVER

Q202 MUTING SWITCH

IC601

FL DRIVER

DIG0 16G

DIG1

DIG14

DIG15 01G

SEG0

SEG34

•

BACKUP

+5V/+2.7V

SYS +5V

SERVO

SECTION

(Page 47)

Q601

SWITCH

Q602

SWITCH

FLUORESCENT

INDICATOR TUBE

(STANDBY)

(KEY BACK LIGHT)

CD+5V

A +3.3V

MD D+3.3V

BUP +3.3V

D925

A-MUTE

FL601

15G

02G

P01

P35

D601

D602-610

Q341

MUTING

`/1

Q911,912

B+

SWITCH

(RECHARGEABLE)

BT921

POWER AMP

FL -30V

CD+10V

ST+10V

MDM+5V

LED+5V

CD+7V

PRE+7V

CDM+5V

MD H/M+5V

IC906

+4V

3 1

REG

D926

D927

AMP-L

A-MUTE

RELAY

Q232

H/P

DETECT

-B

Q971

-30V REG

IC901

+10V

3 1

REG

IC902

+5V

3 1

REG

IC903

+7V

3 1

REG

IC904

+5V

3 1

REG

IC905

+5V

3 1

REG

IC907 +5.6V

REG

CN208

R-CH

D851

D992

D993

D971-974

D982-985

D981

D961-964

SPEAKER

T900

MAIN

TRANSFORMER

Q991

RELAY

DRIVER

Q103

FAN

DRIVER

T901

SUB

TRANSFORMER

J103

PHONES

• R-CH is omitted due to same as L-CH.

• Signal Path

: FM

: CD(ANALOG)

: PB(MD)

: REC(MD)

: PB(TAPE)

: REC(TAPE)

RY991

M901

(D.C. FAN)

AC IN

4848

Page 49

HCD-C5

6-5. PRINTED WIRING BOARDS – CD SECTION –

IC1102

• See page 45 for Circuit Boards Location.

IC102

IC103

SW BOARD

(8cm Disc Eject End Detect)

(Disc IN/8cm Disc Detect)

(12cm Disc/12cm Disc

Eject End Detect)

1-682-099-

CONNECTOR BOARD

GRN YEL

ORG RED BRN

• Semiconductor

Location

Ref. No. Location

D101 D-2

IC101 D-3 IC102 A-2

S3 (Disc Existence, Chacking, Releasing Detect)

IC103 A-4 IC1102 B-1

Q101 B-4 Q102 A-3 Q103 D-2

M902

LOADING MOTOR

GRN

YEL

ORG

RED

BRN

(Page 56)

IC101

RFAC

DVC1.65V

(OPTIMA-720L1E)

CN1

1-682-100-

M904 SPINDLE MOTOR

M903 FEED

(LIMIT IN)

MOTOR

4949

Page 50

HCD-C5

6-6. SCHEMATIC DIAGRAM – CD SECTION –

• See page 45 for Wavefoms. • See page 64 for IC Pin Function Description.

IC B/D

(Page 57)

IC B/D

TRTR+ FF+

(8cm Disc Eject End Detect) (Disc Existence, Chacking, Releasing Detect) (Disc IN/8cm Disc Detect)

(12cm Disc/12cm Disc Eject End Detect)

5050

Page 51

HCD-C5

6-7. PRINTED WIRING BOARD – BD (MD) BOARD –

OPTICAL PICK - UP

BLOCK

BD (MD) BOARD (SIDE A)

(KMS-260E/Z-NP)

• See page 45 for Circuit Boards Location.

BD (MD) BOARD (SIDE B)

S102

PROTECT REFLECT

M703

IC141

M701

IC151

IC101

IC102

• Semiconductor

Location Side A

Ref. No. Location

D101 A-1

Q101 B-1 Q131 B-1 Q132 B-1 Q133 B-1 Q134 B-1

• Semiconductor

Location Side B

Ref. No. Location

4E5

IC153

D181 D-3 D183 D-3

IC101 A-3 IC102 B-3 IC141 C-1 IC151 C-2 IC153 C-3 IC181 D-3 IC190 D-1 IC195 D-2

HR901

OVER

WRITE HEAD

R162

R153

C174

X171

IC190

R177

IC195

D C

MD DIGITAL

BOARD

CN703

(Page 54)

C173

MD DIGITAL

BOARD

(Page 54)

Q121 B-3 Q122 B-3 Q181 C-3 Q182 D-3

IC181

M702

CN702

5151

Page 52

HCD-C5

6-8. SCHEMATIC DIAGRAM – BD (MD) BOARD (1/2) –

(MD

)

(KMS-260E/Z-NP)

• See page 45 for Wavefoms. • See page 65 for IC Block Diagrams. • See page 68 for IC Pin Function Description.

(MD)

(Page 53)

(MD)

(Page 53)

M701

BH6519FS-E2

IC B/D

M702

(MD)

(Page 53)

5252

Page 53

HCD-C5

6-9. SCHEMATIC DIAGRAM – BD (MD) BOARD (2/2) –

(MD)

(Page 52)

• See page 45 for Wavefoms. • See page 69 for IC Pin Function Description.

153

4400D

702

(Page 55)

(MD)

(Page 52)

(MD)

(Page 52)

EFM /ACIRC EONCODER / DECODER, SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER / DECODER

M703

703

(Page 55)

5353

Page 54

HCD-C5

6-10. PRINTED WIRING BOARD – MD DIGITAL BOARD –

(Page 58)

IC201

IC211

• See page 45 for Circuit Boards Location.

(Page 51)

• Semiconductor

Location

Ref. No. Location

D211 A-3

IC201 B-1 IC211 B-2 IC701 D-2 IC861 D-5 IC871 D-5

Q201 D-7 Q202 C-7 Q211 A-2 Q861 D-5 Q871 D-3 Q872 C-3

IC701

(Page 56)

(Page 51)

IC871

IC861

5454

Page 55

HCD-C5

6-11. SCHEMATIC DIAGRAM – MD DIGITAL BOARD –

• See page 45 for Wavefoms. • See page 65, 66 for IC Block Diagrams. • See page 72 for IC Pin Function Description.

(Page 57)

10K 1/16W

10K

1/16W

(Page 59)

IC B/D

(2/2)(2/2)

(Page 53)(Page 53)

5555

Page 56

HCD-C5

Ver 1.1 2001.09

6-12. PRINTED WIRING BOARD – UCOM BOARD –

IC221

DIGITAL

OPTICAL

INPUT

IC222

• See page 45 for Circuit Boards Location.

(Page 54)

• Semiconductor Location

Ref. No. Location

D214 B-1 D221 C-9 D222 B-9 D232 D-1 D513 B-9 D910 D-3 D923 B-3 D924 B-3 D925 D-4 D926 D-4 D927 D-4 D941 D-4 D942 D-4 D943 D-5

IC212 C-3

Ref. No. Location

IC221 A-1 IC222 A-1 IC501 D-6 IC941 D-5

Q202 D-4 Q211 C-3 Q212 C-3 Q221 B-9 Q222 C-9 Q223 C-9 Q224 B-9 Q232 D-2 Q911 B-4 Q912 B-4 Q941 D-4

SPEAKERS

IC212

(Page 62)

IC941

(Page 58)

IC501

(Page 49)

(HK,KR,AUS)

(AEP,UK)

(Page 60)

(Page 58)

(Page 62)

5656

Page 57

6-13. SCHEMATIC DIAGRAM – UCOM BOARD –

HCD-C5

Ver 1.1 2001.09

• See page 45 for Wavefoms. • See page 67 for IC Block Diagrams. • See page 74 for IC Pin Function Description.

IC B/D

(Page 50)

(Page 55)

(Page 59)

(AEP,UK)

R538 10k

(HK,KR,AUS)

(Page 61)

DIGITAL

OPTICAL INPUT

(Page 59)

SPEAKER

(Page 63)

D232

ISS355

TE-17

1000

470 1/16W

C241

4.7 16V

6.3V

FB537

BLM21B102S

(Page 63)

5757

Page 58

HCD-C5

Ver 1.1 2001.09

6-14. PRINTED WIRING BOARDS – AUDIO SECTION –

• See page 45 for Circuit Boards Location.

(Page 56)

• Semiconductor Location

Ref. No. Location

D101 B-6 D111 D-5 D301 C-4 D103 B-6 D343 B-5 D393 B-5

IC301 B-2 IC302 B-4

Ref. No. Location

Q101 B-6 Q102 B-6 Q103 A-7 Q151 C-6 Q311 C-1 Q331 B-3 Q361 B-3 Q381 B-3

IC301

(AEP,UK)

IC302

(AEP,UK)

(Page 54) (Page 62)

(AEP,UK)

(Page 56)

OUT

TAPE

(AEP,UK,KR)

5858

Page 59

6-15. SCHEMATIC DIAGRAM – AUDIO SECTION –

OUT

HCD-C5

Ver 1.1 2001.09

• See page 64 for IC Block Diagrams.

TAPE

(AEP,UK,KR)

D111

MTZJ-T-77-5.1B

C111

10 10V

IC B/D

RDS DATA

+5V FM SIGNAL OUT RDS INT RDS DATA

R111

330

(AEP,UK)

RDS INT

RDS DATA

(Page 55)

(Page 63)

(Page 57)

D301 1SS355TE

-17

RDS INT

(AEP,UK)

5959

Page 60

HCD-C5

6-16. PRINTED WIRING BOARD – PANEL BOARD –

• See page 45 for Circuit Boards Location.

IC601

• Semiconductor

Location

Ref. No. Location

D601 A-5 D602 B-5 D603 B-5 D604 C-5 D605 A-1 D606 B-1 D607 B-1 D608 C-1 D609 C-1 D610 D-1

IC601 B-3 IC602 C-5

Q601 C-3 Q602 B-3 Q604 D-3

(Page 56)

IC602

6060

Page 61

HCD-C5

6-17. SCHEMATIC DIAGRAM – PANEL BOARD –

• See page 67 for IC Block Diagrams.

IC B/D

(Page 57)

6161

Page 62

HCD-C5

6-18. PRINTED WIRING BOARDS – POWER SECTION –

(Page 56)

IC901

• See page 45 for Circuit Boards Location.

(Page 56)

IC902

T900

MAIN

TRANSFORMER

SUB

TRANSFORMER

EB902 EB901

IC905

IC906

IC903

IC904

IC907

(Page 58)

12 12

• Semiconductor Location

Ref. No. Location

D906 D-4 D921 E-5 D961 D-3 D962 D-3 D963 D-3 D964 D-3 D971 A-2

D972 B-2 D973 A-2 D974 B-2 D975 A-2 D976 A-1 D981 A-5 D982 A-3 D983 A-3 D984 A-2

Ref. No. Location

D985 A-2 D991 C-2 D992 E-3 D993 E-2

IC901 B-2 IC902 A-3 IC903 B-4 IC904 C-4 IC905 D-4 IC906 D-4 IC907 E-5

Q971 B-2 Q991 E-3

6262

Page 63

6-19. SCHEMATIC DIAGRAM – POWER SECTION –

T4AL/250V

HCD-C5

Ver 1.1 2001.09

(Page 57)

1.8k

1/10W

(Page 59)

(Page 57)

6363

Page 64

HCD-C5

OPIN2 +

OPIN2 –

OPOUT2

GND

STBY1

BIAS IN

OPIN1 +

OPIN1 –

OPOUT1

PowVcc1

VO2 (–)

VO2 (+)

VO1 (–)

VO1 (+)

OPIN3 +

OPIN3 –

OPOUT3

GND

STBY2

PreVcc

OPIN4 +

OPIN4 –

OPOUT4

PowVcc2

VO3 (–)

VO3 (+)

VO4 (–)

VO4 (+)

Vcc

STAND BY

CH1 2 3

Level

Shift

Level

Shift

Level Shift

Vcc

STAND BY

CH4

Vcc

Level Shift

10k

20k

10k

6-20. IC BLOCK DIAGRAMS

VREFI

SUR R

SUR C

IN1A

IN1B

IN1C

IN1D

REC OUT1

INBAS1

NFBAS1

FBAS1

FTRE1

TONE OUT1

VOL IN1

FBB1

NFBB1

INBB1

OUT1

DGND

LATCH

DATA

IC301 M62428AFP600C (AUDIO BOARD)

AVDD

REF AMP

1 2

SURROUND SW

–

13 14 15 16

19 20

BASS BOOST SW

–

AMP1

–

BASS AMP1

BUFF

AMP1

MIX

AMP1

–

TONE AMP1

–

FIN

AMP1

CPU

INTERFACE

AMP2

FIN

AMP2

AAB

–

TONE

AGND

MIX

AMP2

–

BUFF

AMP2

BASS AMP2

BASS BOOST SW

VREF

AMP2

AGND

VREFO

MIC

–

AMP

–

MIC IN

IN2A

IN2B

IN2C

IN2D

REC OUT2

INBAS2

NFBAS2

FBAS2

FTRE2

TONE OUT2

VOL IN2

FBB2

NFBB2

–

INBB2

OUT2

AVDD

DVDD

CLK

FSTO

CAM

RFAC

ASYI ASYO ASYE

BIAS

XPCK

FILO

PCO

CLTV

MDP LOCK PWMI

SENS DATA

XLAT

CLOK

SCOR

SBSO EXCK SCSY

SQSO SQCK

RFDC

IGEN

FILI

CE TE SE FE VC

IC101 CXD3068Q (BD (CD) BOARD)

FCK

XTSL

XTAO

XTAI

CLOCK

GENERATOR

ASYMMETRY CORRECTOR

DIGITAL

PLL

DIGITAL

CLV

CPU

INTERFACE

OPAMP

ANALOG SW

V16M

VPCO

VCTL

CONVERTER

XUGF

EFM

DEMODURATOR

INTERFACE

A/D

ADIO

GFS

SERVO

AUTO

EMPH

SUB CODE

PROCESSOR

CORRECTOR

SERVO

INTERFACE

MIRR DFCT

FOK

SERVO DSP FOCUS

SERVO

TRACKING

SERVO

SLED

SERVO

ERROR

32K RAM

C2PO

LRCK

WDCK

D/A

INTERFACE

DIGITAL

SERVO BLOCK

PWM GENERATOR

FOCUS PWM GENERATOR

TRACKING PWM

GENERATOR

SLED PWM

GENERATOR

PCMD

OUT

BCK

MUTE

TES1 TEST XRST

MD2 DOUT

SOUT SOCK XOLT SCLK COUT SSTP ATSK

MIRR DFCT FOK

FFDR FRDR

TFDR TRDR

SFDR SRDR

AC SUM

IC103 CXA2581N-T4 (BD (CD) BOARD)

RW/ROM

–

B C

DVC

APC AMP

A B C D

APC-OFF

RW/ROM

(Hi-Z)

(H/L)

–

SUMMING

RFAC

AMP

BCD

B D A C

VOFST

RW/ROM

EQ ON/OFF

RW/ROM

–

A D

RW/ROM RW/ROM

–

RW/ROM RW/ROM

–

RW/ROM

EQ IN

GND

DVCC

DVC

RFAC

DVC

VOFST

DC OFST

RFDCI

–

DVC VCC

RFAC

VCA

VCC

–

DVC

–

DVC

RFDCO

RFC

VFC

BST

RFG

VCC

CEI

TE BAL

FEI

IC102 BA5982FP-E2 (BD (CD) BOARD)

6464

Page 65

IC1102 BA6956AN (BD (CD) BOARD) IC871 BA6956AN (MD DIGITAL BOARD)

HCD-C5

IC201 µDA1360TS (MD DIGITAL BOARD)

TSD

CONTROL LOGIC

1 2 3 4 5 6 7 8 9

VREF

OUT2

RNF

OUT1

VCC

FIN

GND

IC141 BH6519FS-E2 (BD (MD) BOARD)

CAPA–

CAPA+

IN2R

IN2F

VM2

OUT2F

PGND2

OUT2R

VM12

CHARGE

PUMP.

OSC

INTERFACE

AMP

RIN

AMP

OUT1R

PGND1

OUT1F

AMP

VM1

PREDRIVEPREDRIVE

VINL

VREF

VINR

IN1F

INTERFACE

4VREF (N) 5VREF (P)

6SFOR 7PWON 8SYSCLK

IN1R

VDDA

VSSA

–

ADC

( )

ADC

( )

DECIMATION

FILTER

CLOCK

CONTROL

DC-

CANCELLATION

FILTER

DIGITAL

INTERFACE

14 FSEL

13 DATAO 12 WS 11 BCK

10 VSSD

9 VDDD

PREDRIVEPREDRIVE

INTERFACE

GND

IN4R

AMP

IN4F

VM4

OUT4F

PGND4

OUT4R

VM34

OUT3R

PGND3

AMPAMPAMP

OUT3F

VM3

INTERFACE

IN3F

IN3R

PSB

Page 66

HCD-C5

IC211 µDA1350AH (MD DIGITAL BOARD)

RESET

VDDD (C)

VSSD

RTCB43VDDD42PREEM041NC40NC

2 3 4VSSD (C)

5L3DATA 6L3CLOCK

7DATAI

8BCKI

9WSI

10L3MODE

11NC

INTERFACE

IEC 958

DECODER

14NC15

TEST238NC

DATA

OUTPUT

INTERFACE

WSO36DATAO

SELSTATIC

DATA

INPUT

INTERFACE

AUDIO FEATURE PROCESSOR

INTERPOLATOR NOISE SHAPER

DAC DAC

TEST1

CLOCK

AND

TIMING

CIRCUIT

BCKO

VDDA (PLL)

32 31 VSSA (PLL)

PREEM1

CLKOUT

28 NC

27 VDDA 26 VSSA 25 VSSA (DAC)

24 VREF

MUTE

SELCHAN

SPDIF016SPDIF1

VOUT L

VDDA (DAC)

SELCLK

SELSPDIF

IC861 M62016L (MD DIGITAL BOARD)

COM

–

COM

–

GND INT RESET CD VCC

2 3

INTERRUPT SIGNAL

GENERATING BLOCK

RESET SIGNAL

GENERATING BLOCK

LOCK

VOUT R

Page 67

DIG11

DIG0

RES

HCD-C5

IC601 M66004M8FP-200D (PANEL BOARD)

DIGITAL OUTPUT CIRCUIT

DIG12

DIG15

CLK

DATA

P1 P0

XOUT

XIN

SEG35

SEG27

14 15 16

17 18

SERIAL RECEIVE CIRCUIT

OUTPUT

PORT

(2BIT)

CLOCK

GENERATOR

CIRCUIT

DECODER

(35BIT x 16)

RAM WRITE

CODE

WRITE

INDICATION

CODE

RESISTOR

(8BIT x 16)

SEGMENT OUTPUT CIRCUIT

INDICATION

CONTROLLER

INDICATION

CONTROL RESISTOR

CODE/COMMAND

CONTROL

CIRCUIT

CODE SELECT

DECODER

(35BIT x 16)

SEG0

SEG26

IC212 BA8274F-E2 (UCOM BOARD)

Vcc

N.C.

Buffer

N.C.

GND

Page 68

HCD-C5

6-21. IC PIN FUNCTION DESCRIPTION

• IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) (BD (MD) BOARD)

I/OPin NamePin No. Description

1 2 3

4 to 9

10 11 12 13 14 15 16 17 18 19

21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

I J

A to F

APC

APCREF

GND

TEMPI

TEMPR

SWDT

SCLK

XLAT

XSTBY

F0CNT

VREF

EQADJ

3TADJ

VCC

WBLADJ

CSLED

ADFM

ADIN

ADAGC

ADFG

AUX

FE ABCD BOTM

PEAK

RFAGC

AGCI COMPO COMPP

ADDC

OPO OPN RFO

MORFI

MORFO

I-V converted RF signal I input from the optical pick-up block detector

I-V converted RF signal J input from the optical pick-up block detector

Middle point voltage (+1.65V) generation output terminal

Signal input from the optical pick-up detector

Light amount monitor input from the optical pick-up block laser diode

—

Laser amplifier output terminal to the automatic power control circuit

Reference voltage input for setting laser power from the CXD2662R (IC151)

Ground terminal

Connected to the temperature sensor

Output terminal for a temperature sensor reference voltage

Writing serial data input from the CXD2662R (IC151)

Serial data transfer clock signal input from the CXD2662R (IC151)

Serial data latch pulse signal input from the CXD2662R (IC151)

Standby signal input terminal “L”: standby (fixed at “H” in this set) Center frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input

from the CXD2662R (IC151)

Reference voltage output terminal Not used (open)

Center frequency setting terminal for the internal circuit (EQ)

Center frequency setting terminal for the internal circuit (BPF3T)

—

Power supply terminal (+3.3V)

Center frequency setting terminal for the internal circuit (BPF22)

Tracking error signal output to the CXD2662R (IC151)

Connected to the external capacitor for low-pass filter of the sled error signal

Sled error signal output to the CXD2662R (IC151)

FM signal output of the ADIP

Receives a ADIP FM signal in AC coupling

Connected to the external capacitor for ADIP AGC

ADIP duplex signal (22.05 kHz ± 1 kHz) output to the CXD2662R (IC151)

Auxiliary signal (I3 signal/temperature signal) output to the CXD2662R (IC151)

Focus error signal output to the CXD2662R (IC151)

Light amount signal (ABCD) output to the CXD2662R (IC151)

Light amount signal (RF/ABCD) bottom hold output to the CXD2662R (IC151)

Light amount signal (RF/ABCD) peak hold output to the CXD2662R (IC151)

Playback EFM RF signal output to the CXD2662R (IC151)

Connected to the external capacitor for RF auto gain control circuit

Receives a RF signal in AC coupling

User comparator output terminal Not used (open)

User comparator input terminal Not used (fixed at “L”)

Connected to the external capacitor for cutting the low band of the ADIP amplifier

User operational amplifier output terminal Not used (open)

User operational amplifier inversion input terminal Not used (fixed at “L”)

RF signal output terminal

Receives a MO RF signal in AC coupling

MO RF signal output terminal

Page 69

HCD-C5

• IC151 CXD2662R

• (DIGITAL SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER,

ATRAC ENCODER/DECODER) (BD (MD) BOARD)

I/OPin NamePin No. Description

1 2 3 4 5 6 7 8 9

14 15 16 17

19 20 21 22

24 25 26 27 28 29 30

31 to 34

36 to 40

41 42 43 44 45 46 47

* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.

MNT0 (FOK)

MNT1 (SHCK)

MNT2 (XBUSY)

MNT3 (SLOC)

SWDT

SCLK

XLAT

SRDT SENS XRST

SQSY

DQSY

RECP

XINT

OSCI

OSCO

XTSL

DIN0 DIN1

DOUT

DATI

LRCKI

XBCKI

ADDT DADT LRCK XBCK FS256

DVDD

A03 to A00

A10

A04 to A08

A11

DVSS

XOE

XCAS

A09

XRAS

XWE

O O O O

I I (S) I (S)

O (3) O (3)

I (S)

O O

O O O O

—

O O O O

—

O O O O O

Focus OK signal output terminal “H” is output when focus is on (“L”: NG) Not used (open) Track jump detection signal output to the MD mechanism controller (IC1001) Busy monitor signal output to the MD mechanism controller (IC1001) Spindle servo lock status monitor signal output to the MD mechanism controller (IC1001) (open) Writing serial data signal input from the MD mechanism controller (IC1001) Serial data transfer clock signal input from the MD mechanism controller (IC1001) Serial data latch pulse signal input from the MD mechanism controller (IC1001) Reading serial data signal output to the MD mechanism controller (IC1001) Internal status (SENSE) output to the MD mechanism controller (IC1001) Reset signal input from the MD mechanism controller (IC1001) “L”: reset Subcode Q sync (SCOR) output to the MD mechanism controller (IC1001) “L” is output every 13.3 msec Almost all, “H” is output Digital In U-bit CD format subcode Q sync (SCOR) output to the MD mechanism controller (IC1001) “L” is output every 13.3 msec Almost all, “H” is output Laser power selection signal input from the MD mechanism controller (IC1001) “L”: playback mode, “H”: recording mode Interrupt status output to the MD mechanism controller (IC1001) Magnetic head on/off signal output to the over write head drive (IC181) System clock signal (90.3168 MHz) input terminal System clock signal (512Fs=90.3168 MHz) output terminal Not used (open) Input terminal for the system clock frequency setting “L”: 45.1584 MHz, “H”: 90.3168 MHz (fixed at “H” in this set) Digital audio signal input terminal when recording mode Not used Digital audio signal input terminal when recording mode Digital audio signal output terminal when playback mode Recording data input from the A/D converter (IC1005) L/R sampling clock signal (44.1 kHz) input from the D/A converter (IC1006), A/D converter (IC1005) Bit clock signal (2.8224 MHz) input from the D/A converter (IC1006), A/D converter (IC1005) Recording data input terminal Not used (fixed at “L”) Playback data output terminal Not used (open) L/R sampling clock signal (44.1 kHz) output terminal Not used (open) Bit clock signal (2.8224 MHz) output terminal Not used (open) Clock signal (11.2896 MHz) output terminal Not used (open) Power supply terminal (+3.3V) (digital system) Address signal output to the D-RAM (IC152) Address signal output to the D-RAM (IC152) (open) Address signal output to the D-RAM (IC152) Address signal output to the external D-RAM Not used (open) Ground terminal (digital system) Output enable signal output to the D-RAM (IC152) “L” active Column address strobe signal output to the D-RAM (IC152) “L” active Address signal output to the D-RAM (IC152) Row address strobe signal output to the D-RAM (IC152) “L” active Write enable signal output to the D-RAM (IC152) “L” active

Page 70

HCD-C5

I/OPin NamePin No. Description

48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82

84 85 86 87 88 89 90 91 92 93

* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.

D1 D0 D2

D3 MVCI ASYO

ASYI

AVDD

BIAS

RFI

AVSS

PCO

FILI

FILO CLTV PEAK

BOTM ABCD

AUX1

ADIO

AVDD

ADRT

ADRB

AVSS

TE DCHG TEST4

ADFG

F0CNT

XLRF CKRF DTRF

APCREF

TEST0

TRDR TFDR

DVDD

FFDR

FRDR

FS4

SRDR

SFDR SPRD

I/O I/O I/O I/O

I (S)

I (A)

—

I (A) I (A)

—

O (3)

I (A)

O (A)

I (A) I (A) I (A) I (A) I (A) I (A) I (A)

O (A)

—

I (A) I (A)

—

I (A) I (A) I (A)

I (S)

O O O O

O O O

—

O O O O O O

Two-way data bus with the D-RAM (IC152)

Digital in PLL oscillation input from the external VCO Not used (fixed at “L”) Playback EFM full-swing output terminal Playback EFM asymmetry comparator voltage input terminal Power supply terminal (+3.3V) (analog system) Playback EFM asymmetry circuit constant current input terminal Playback EFM RF signal input from the CXA2523AR (IC101) Ground terminal (analog system) Phase comparison output for master clock of the recording/playback EFM master PLL Filter input for master clock of the recording/playback master PLL Filter output for master clock of the recording/playback master PLL Internal VCO control voltage input of the recording/playback master PLL Light amount signal (RF/ABCD) peak hold input from the CXA2523AR (IC101) Light amount signal (RF/ABCD) bottom hold input from the CXA2523AR (IC101) Light amount signal (ABCD) input from the CXA2523AR (IC101) Focus error signal input from the CXA2523AR (IC101) Auxiliary signal (I3 signal/temperature signal) input from the CXA2523AR (IC101) Middle point voltage (+1.65V) input from the CXA2523AR (IC101) Monitor output of the A/D converter input signal Not used (open) Power supply terminal (+3.3V) (analog system) A/D converter operational range upper limit voltage input terminal (fixed at “H” in this set) A/D converter operational range lower limit voltage input terminal (fixed at “L” in this set) Ground terminal (analog system) Sled error signal input from the CXA2523AR (IC101) Tracking error signal input from the CXA2523AR (IC101) Connected to the +3.3V power supply nput terminal for the test Not used (fixed at “H”) ADIP duplex FM signal (22.05 kHz ± 1 kHz) input from the CXA2523AR (IC101) Filter f0 control signal output to the CXA2523AR (IC101) Serial data latch pulse signal output to the CXA2523AR (IC101) Serial data transfer clock signal output to the CXA2523AR (IC101) Writing serial data output to the CXA2523AR (IC101) Control signal output to the reference voltage generator circuit for the laser automatic power control Input terminal for the test Not used (open) Tracking servo drive PWM signal (–) output to the BH6511FS (IC141) Tracking servo drive PWM signal (+) output to the BH6511FS (IC141) Power supply terminal (+3.3V) (digital system) Focus servo drive PWM signal (+) output to the BH6511FS (IC141) Focus servo drive PWM signal (–) output to the BH6511FS (IC141) Clock signal (176.4 kHz) output terminal (X’tal system) Not used (open) Sled servo drive PWM signal (–) output to the BH6511FS (IC141) Sled servo drive PWM signal (+) output to the BH6511FS (IC141) Spindle servo drive PWM signal (–) output to the BH6511FS (IC141)

Page 71

I/OPin NamePin No. Description

94 95 96 97 98 99

100

* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.

SPFD

FGIN TEST1 TEST2 TEST3

DVSS

EFMO

I (S)

I I I

—

Spindle servo drive PWM signal (+) output to the BH6511FS (IC141)

Input terminal for the test (fixed at “L”)

Ground terminal (digital system) EFM signal output terminal when recording mode

HCD-C5

Page 72

HCD-C5

• IC701 M30803MG-A03FP MASTER CONTROLLER (MD DIGITAL BOARD)

I/OPin NamePin No. Description

1 2 3 4

5 to 7

9 10 11 12 13 14 15 16 17 18 19

21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49

(FLDT)

(FLCK) (LEVEL-L) (LEVEL-R)

—

BYTE

CNVSS

XIN-T

XOUT-T

S-RST

XOUT

VSS

XIN VCC NMI

DQSY

P-DOWN

SQSY

(KB-CLK)

(KB-DATA)

I2C-BUSY

(A1-OUT)

XINT (BEEP) (XELT)

(I2C-POWER)

I2C-CLK I2C-DAT

SWDT

SRDT

SCLK

(KB-CLK-CTL)

(CLIP-TX0) (CLIP-RX0)

(CLIP-CLK0)

(MUTE)

(ADA-RESET)

(ADA-LATCH)

EPM

(CLIP-SEL)

—

PROTECT

EEP-CLK

EEP-WP

XBUSY(MNT2)

OUT-SW

—

Not used

—

Not used

—

Not used

—

Not used

—

Not used

—

Data bus changed signal input (Connected to ground)

—

Processor mode selection terminal

Not used

System reset input

Main clock output (10MHz)

Ground

Main clock input (10MHz)

—

Power supply

Fixed at H (Pull-up)

—

Digital in sync signal input (Record system)

Power down detection signal input (L:Power down) ADIP (MO) sync signal or subcode Q (PIT) sync signal input from the CXD2662R

(Playback system)

Not used

—

I2C cable connect check signal output

—

Not used

Interrupt status signal input from the CXD2662R

—

Not used

—

Not used

—

I2C serial clock input/output

—

I2C serial data input/output

I/O

Writing data signal output to the serial bus

I/O

Reading data signal input from the serial bus

Clock signal output to the serial bus

Not used

—

Not used

—

Not used

—

Not used

—

Not used

—

Not used

—

Not used (Pull-down)

—

Not used

—

Not used

Recording protection tab detection signal input from the protection detection switch (H:Protect)

Clock signal output to the EEP-ROM

Fixed at H (Pull-up)

Write protect signal output to the EEP ROM (L:Write enable)

Busy signal input from the CXD2662R

Detection signal input from the loading out detection switch

Page 73

50 51 52 53 54 55 56 57 58 59 60

62 63 64 65 66 67 68 69 70 71 72

73 to 75

76 77 78 79 80 81 82

83 to 84

85 86 87 88 89

90 to 95

96 97 98 99

100

XLATCH

PLAY-SW

D-RESET

REC—SW

WRPWR

LIMIT—IN

MOD

LDON

SENS

SHOCK(MNT1)

EEP—DATA

REFLECT

VCC

—

VSS

LOAD—LO

LOAD—OUT

LOAD—IN

(MODEL0) (MODEL1)

MODEL2 MODEL3

SPDIF—CUT

—

DAC—MUTE

LINE—MUTE

DA—RESET

SLICER—SEL

SPDIF—LOCK

OPTSEL

ADPDWN

—

TP1 TP2 TP3 TP4 IOP

—

AVSS

—

VREF

AVCC

—

I/OPin NamePin No. Description

Lacth signal output to the DSP IC

Detection signal input from the playback position detection switch (L:PLAY)

Digital reset signal output to the CXD2662R and the motor driver (L:Reset)

Detection signal input from the recording position detection switch (L:REC)

Write power ON/OFF signal output (L:OFF, H:ON)

Detection signal input from the limit switch (L:Sled limit-in, H:Sled limit-out)

Modulation signal output to the laser diode (L:OFF, H:ON)

Laser ON/OFF control signal output (H:Laser ON)

SENS signal input from the CXD2662R

Track jump signal input from the CXD2662R

I/O

Data signal input/output terminal with the EEP-ROM Disc reflection rate detection input from the reflect detection switch

(H:Disc with low reflection rate)

—

Power supply (+3.3V)

—

Not used

—

Ground

Loading motor voltage control signal output (L:High voltage, H:Low voltage)

Loading motor control signal output (H:Out)

Loading motor control signal output (H:In)

—

Not used

—

Not used

Model setting input terminal

Power control signal output for the PLL power supply of the D/A converter

—

Not used

Muting signal output to the D/A converter

—

Not used

Reset signal output to the D/A converter (L:Active)

IEC958 input select signal output to the D/A converter

LOCK signal input from the D/A converter

Optical input selection signal output

Power control signal output to the A/D converter

—

Not used

—

Not used

—

Not used

—

Not used

—

Not used

Optical pick-up voltage (current) detect signal input

—

Not used

—

Ground (Analog)

—

Not used

Reference voltage input terminal

—

Power supply (Analog)

—

Not used

HCD-C5

Page 74

HCD-C5

• IC501 µPD703032AYGF-M01-3BA MASTER CONTROL (UCOM BOARD)

I/OPin NamePin No. Description

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

SW3(ENC-A) SW4(ENC-B)

PLL-DO(µCOM-ST)

PLL-DI(ST-µCOM)

FL-DATA

FL-CLK

SDA

FL-CE

SCL

FL-RST

CXD-DATA

CXD-CLK

EVDD

EVSS

CXD-XLT

PWM1 LDON

SENSE

SUBQ

CHECK

SCLK

CTRL1

PWM2 PWM3

VPP

SP-MUTE

1-4 DMUTE AMUTE

LODNEG

LODPOS

BDPWR

BDRST

SW1 SW2

RESET

XT1 XT2

REGC

X2 X1

VSS

VDD

CLKOUT

PLL-CLK

PLL-CE

ST-MUTE

STEREO

TUNED

RDS-DATA

FL tube data signal output

FL tube clock signal output

I/O

IIC data signal input or output

FL tube enable signal output

I/O

IIC clock signal input or output

FL tube reset signal output

Data signal output to DSP

Clock signal output to DSP

—

Power supply for I/O port

—

Ground for I/O port

Latch signal output to DSP

PWM1 signal output

Laser power control signal output

CD SENSE signal input

CD SUBQ signal input

Not used (open)

CD SUBQ clock signal output

CTRL1 (setting double speed) signal output

PWM2 signal output

PWM3 signal output

—

Not used

Not used (open)

Muting signal output to DAC

Not used (open)

Loading motor control signal output

CD power control signal output

CD reset signal output

Loading switch signal input

Systen reset input

Sub clock input

—

Sub clock output

—

Terminal for regulator clock

—

Main system clock output

Main system clock input

—

Ground

—

Power supply

Clock output (open)

Tuner clock signal output

Tuner data signal output

Tuner data signal input

Tuner chip enable signal output

Tuner muting signal output

Stereo tuning signal input

TUNED detect signal input

RDS data signal input

Page 75

51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99

100

PROTECT

PRE-MUTE

PWR-MUTE

REC-MUTE

HP-MUTE

SPK-RELAY

HELP

BVDD

BVSS

KBD-CHK

KBD-DATA

VOL-CE

VOL-CLK

VOL-DATA

LED

FAN-ON

HP-IN

IO-RST

PWR-RELAY

MD-PWR

FL-ON

ON/STANDBY

DIMMER

AVDD

AVSS

AVREF

KEY1 KEY2 KEY3

ADJ DEST1 DEST2 DEST3 DEST4

MODEL1

MODEL2 DEVICE1 DEVICE2

KBD-CLKO

KBD-CLKI

AC-CUT

PCPON

KEY-RM

SIRCS

SCOR

RDS-CLK

IO-DI

IO-DO

IO-CLK

IO-CE

I/OPin NamePin No. Description

Not used (pull-up)

Pre-amplifier muting signal output

Not used (open)

REC output muting signal output

Not used (open)

Speaker relay control signal output

I/O

IIC busy signal input or output

—

Power supply for bus interface

—

Ground for bus interface

PC LINK inserted detect signal input

Key board data input (pull-up)

Volume latch signal output to the sound processor

Volume clock signal output to the sound processor

Volume data signal output to the sound processor

LED control signal output

Not used (open)

Headphone detect signal input (pull-down)

Not used (open)

Power relay control signal output

MD power control signal output

Not used (open)

STANDBY LED control signal output

Not used (open)

—

Analog power supply

—

Analog ground

—

Analog reference voltage

Key input signal from function switch

Adjust mode input (pull-up)

Destination setting input

Model setting input

Device setting input

Keyboard clock output (pull-up)

Keyboard clock input (pull-up)

AC off detect signal input

PC power detect signal input for PC LINK

Remote control receiver or power key detect signal input

Remote control receiver data signal input

CD Q-data request signal input

RDS clock signal input

—

Not used (open)

—

Not used (open)

—

Not used (open)

—

Not used (open)

HCD-C5

Page 76

HCD-C5

Ver 1.1 2001.09

NOTE:

• -XX, -X mean standardized parts, so they may have some differences from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

7-1. OVERALL SECTION

SECTION 7

EXPLODED VIEWS

• Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.

• Abbreviation AUS : Australian model HK : Hong Kong model KR : Korean model

TM-CCD1001Z

not supplied

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

front panel section

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1 1-757-791-11 WIRE (FLAT TYPE) (16 CORE) 2 4-233-859-01 CASE 3 4-886-865-01 CUSHION (A) 4 A-4476-934-A BD BOARD, COMPLETE 5 4-235-553-01 SPACER (A)

6 1-773-289-11 WIRE (FLAT TYPE) (29 CORE)

7 7-685-903-21 SCREW +PTPWH 3X8 (TYPE2) 8 1-681-712-11 HP BOARD 9 4-233-862-11 COVER, REAR (AEP,UK,KR) 9 4-233-862-21 COVER, REAR (AUS,HK) 10 1-681-381-11 JACK BOARD

∗ 11 4-930-336-71 FOOT (FELT)

chassis section

not supplied

Page 77

7-2. FRONT PANEL SECTION

HCD-C5

not supplied

#10

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

51 X-4953-691-1 PANEL ASSY (B), FRONT 52 4-942-636-01 EMBLEM (NO.3.5), SONY 53 4-233-846-01 ESCUTCHEON (MD) 54 4-233-847-01 ESCUTCHEON (CD)

55 4-233-840-01 PANEL, FRONT 56 A-4476-936-A PANEL BOARD, COMPLETE 57 4-228-323-01 SPRING (MD) 58 4-228-335-11 LID (MD)

Page 78

HCD-C5

Ver 1.1 2001.09

7-3. CHASSIS SECTION-1

101

108

112

not supplied

114

102

111

104

103

105

106

107

M901

109

110

T900

113

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

101 A-4476-947-A UCOM BOARD, COMPLETE (AEP,UK) 101 A-4727-413-A UCOM BOARD, COMPLETE (AUS, HK.KR) 102 1-681-380-11 AMP POWER BOARD 103 3-703-244-00 BUSHING (2104), CORD

0 104 1-696-847-11 CORD, POWER (AUS)

0 104 1-769-079-21 CORD, POWER (KR) 0 104 1-777-071-21 CORD, POWER (AEP,UK,HK)

105 1-769-943-11 WIRE (FLAT TYPE) (11CORE) (AUS, HK.KR) 105 1-773-007-11 WIRE (FLAT TYPE) (15 CORE) (AEP,UK) 106 1-693-529-11 TUNER PACK (FM/AM) (AEP,UK)

107 A-4727-414-A POWER BOARD, COMPLETE (HK,KR) 108 1-773-110-11 WIRE (FLAT TYPE) (19 CORE) 109 A-4476-938-A AUDIO BOARD, COMPLETE (AUS,HK,KR) 109 A-4476-949-A AUDIO BOARD, COMPLETE (AEP,UK) 110 3-701-748-00 CLAMP

111 4-812-134-31 RIVET (DIA. 3.5), NYLON 112 4-234-235-01 INSULATED PLATE (POWER) 113 4-937-971-01 CUSHION 114 4-237-035-01 INSULATED PLATE (POWER) 2 M901 1-698-997-11 FAN, D.C.

106 1-693-531-11 TUNER PACK (FM/AM) (AUS,HK) 106 1-693-536-11 TUNER PACK (FM/AM) (KR) 107 A-4476-948-A POWER BOARD, COMPLETE (AEP,UK,AUS)

0 T900 1-437-239-11 TRANSFORMER, POWER (AEP,UK,AUS) 0 T900 1-437-241-11 TRANSFORMER, POWER (HK,KR)

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 79

7-4. CHASSIS SECTION-2

154

155

not supplied

HCD-C5

156

157

158

151

not supplied

152

MDM-7B4M

not supplie

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

151 4-231-555-01 INSULATOR 152 4-228-643-21 SCREW (+BVTTWH M3), STEP 154 1-773-138-11 WIRE (FLAT TYPE) (19 CORE)

155 A-4725-732-A MD DIGITAL BOARD, COMPLETE 156 1-757-079-11 WIRE (FLAT TYPE) (17 CORE) 157 1-757-080-11 WIRE (FLAT TYPE) (27 CORE) 158 4-231-113-01 SCREW (1.7X3), BTN

Page 80

HCD-C5

7-5. CD MECHANISM DECK SECTION (TN-CCD1001Z)

#11

404

not supplied

405

#11

front bracket section

M902

#11

401

#13

402

#12

403

base section

404

not supplied

chassis section

#12

not supplied

409

401

406

407

#14

408

402

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

401 4-236-062-01 PIN, DAMPER 402 4-236-087-01 SPRING (FZ), HANG UP 403 4-236-114-01 BELT, LOADING 404 4-236-088-01 SPRING (R), HANG UP 405 4-236-101-01 DAMPER (J)

406 1-682-100-11 CONNECTOR BOARD 407 4-236-105-01 HOLDER, FPC 408 1-682-101-11 PICK-UP FLEXIBLE BOARD 409 1-815-750-11 CONNECTOR M902 X-4954-023-1 MOTOR ASSY, LOADING

Page 81

7-6. CD MECHANISM DECK SECTI – FRONT BRACKET SECTION (TN-CCD1001Z)

not supplied

460

not

458

461

supplied

459

458

HCD-C5

462

454

455

457

456

453

#11

not supplied

452

451

not supplied

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

451 4-236-112-01 SPRING (R), LOADING PULLEY 452 4-236-115-01 BRACKET (J), FRONT 453 4-236-111-01 SPRING (L), LOADING PULLEY 454 4-236-106-01 BRACKET, GEAR MOUNT 455 4-236-108-01 GEAR (3), LOADING

457 4-236-118-01 WASHER (117) 458 4-236-116-01 WASHER (113) 459 4-236-110-01 ROLLER, LOADING 460 X-4954-024-1 SHAFT ASSY, LOADING ROLLER 461 4-236-117-01 WASHER, WAVE

456 4-236-107-01 GEAR (2), LOADING

462 4-236-109-01 GEAR (5), LOADING

Page 82

HCD-C5

7-7. CD MECHANISM DECK SECTION – BASE SECTION (TN-CCD1001Z)

#15

#19

510

511

not supplied

513

not supplied

M904

#17

not supplied

504

#17

507

#20

509

502

503

#18

512

508

506

505

501

514

515

507

516

#17

M903

517

518

#17

#16

519

#13

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

501 X-4954-022-1 SCREW ASSY, FEED 502 4-236-104-01 SPRING, PULLEY GUIDE

0 503 1-758-631-11 OPTICAL PICK-UP BLOCK (OPTIMA-720L1E)

504 4-236-092-01 GUIDE, PULLEY 505 4-236-094-01 PULLEY (M)

506 4-236-095-01 SPRING, DETENT 507 4-236-101-01 DAMPER (J) 508 X-4954-025-1 BASE ASSY, TT 509 4-236-097-01 CLAMP 510 4-236-100-01 PLATE, CLAMP

511 4-236-099-01 RETAINER, 8CM STOPPER

512 4-236-102-01 SPRING (L), CLIP ARM 513 4-236-098-01 STOPPER, 8CM 514 4-236-096-01 SPRING, CLIP ARM 515 4-236-103-01 GUIDE, SCREW 516 4-236-090-01 BASE, FM

517 4-236-091-01 BRACKET, FD GEAR 518 4-236-093-01 SPRING, THRUST 519 4-236-089-01 GEAR, PULLEY S5 1-786-212-11 SWITCH (DETECTION) (LIMIT IN) M903 X-4954-020-1 MOTOR ASSY, FEED

M904 X-4954-021-1 MOTOR ASSY, SPINDLE

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 83

7-8. CD MECHANISM DECK SECTION – CHASSIS SECTION (TN-CCD1001Z)

HCD-C5

565

558

564

563

554

562

559

561

555

560

#11

554

not supplied

566

567

568

569

553

557

552

556

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

551 4-236-085-01 ARM, SLIDE 552 4-236-086-01 SPRING, SLIDE ARM 553 4-236-073-01 ARM (R), S 554 4-236-074-01 SPRING, S ARM 555 4-236-064-01 HOLDER, S ARM

556 4-236-063-01 HOLDER, UPPER 557 4-236-113-01 ACTUATOR, SWITCH 558 1-682-099-11 SW BOARD 559 4-236-065-01 ARM (L), S 560 4-236-080-01 ARM (R), HOLDER

561 4-236-082-01 HOLDER (R) 562 4-236-084-01 SPRING, LOADING GEAR 563 4-236-083-01 GEAR (6), LOADING

564 4-236-081-01 HOLDER (L) 565 4-236-079-01 ARM (L), HOLDER 566 4-236-077-01 SPRING, TRIGGER 567 4-236-076-01 TRIGGER (Z) 568 4-236-078-01 ARM, TRIGGER

569 4-236-075-01 LEVER, TRIGGER S1 1-786-214-11 SWITCH (DETECTION)

S2 1-786-213-11 SWITCH (DETECTION)

S3 1-786-213-11 SWITCH (DETECTION)

S4 1-786-214-11 SWITCH (DETECTION) (8cm Disc Eject detect)

551

(Disc IN/8cm Disc detect)

(12cm Disc/12cm Disc Eject End detect)

(Disc Existence, Chucking, Releasing detect)

Page 84

HCD-C5

7-9. MD MECHANISM DECK SECTION-1 (MDM-7B4M)

721

not supplied

704

703

711

702

710

705

not supplied

#21

708

707

706

717

713

718

714

715

716

707

719

720

702

701

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks ∗ 701 4-996-267-01 BASE (BU-D)

702 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 703 4-226-994-01 GUIDE (L) 704 A-4735-075-A HOLDER ASSY 705 X-4952-665-1 SPRING (SHT) ASSY, LEAF

706 4-227-002-01 GEAR, PULLEY 707 3-372-761-01 SCREW (M1.7), TAPPING 708 4-2270-250-1 BELT (LOADING) 710 4-229-533-01 SPRING (STOPPER), TORSION 711 4-227-012-01 SPRING (HOLDER), TENSION

713 4-226-995-01 SLIDER (EJ) 714 4-227-013-01 SPRING (EJ), TENSION 715 4-226-996-01 LIMITTER (EJ) 716 4-226-997-04 SLIDER 717 4-226-998-01 LEVER (CHG)

718 4-227-007-01 GEAR (SB) 719 4-227-006-01 GEAR (SA) 720 4-226-999-01 LEVER (HEAD) 721 A-4680-638-B PLATE (HOLDER) ASSY, RETAINER

Page 85

7-10. MD MECHANISM DECK SECTION-2 – (MDM-7B4M)

HCD-C5

759

753

751

S102

758

757

760

754

761

M701

756

763

761

HR901

764

762

#22

765

756

752

766

752

751

767

755

M702

752

M703

752

768

751

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

751 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 752 3-372-761-01 SCREW (M1.7), TAPPING 753 4-227-008-01 GEAR (SC) 754 4-227-009-01 GEAR (SD) 755 4-226-989-01 CHASSIS

756 4-232-270-01 SCREW (1.7X3.5), +PWH 757 4-226-993-01 RACK 758 4-227-014-01 SPRING (RACK), COMPRESSION 759 1-678-514-11 FLEXIBLE BOARD

0 760 A-4672-541-A MINI DISK OPTICAL PICK-UP (KMS-260B)

763 4-226-992-01 BASE, SL 764 4-227-023-01 SPRING (SPINDLE), TORSION 765 4-227-004-01 GEAR (LC) 766 4-227-005-01 GEAR (LD) 767 4-226-990-01 BASE (BU-A)

768 A-4726-344-A BD (MD) BOARD, COMPLETE HR901 1-500-670-11 HEAD, OVER WRITE M701 A-4672-898-A MOTOR ASSY, SPINDLE M702 A-4735-076-A MOTOR ASSY, SLED M703 A-4735-074-A MOTOR ASSY, LOADING

761 4-988-560-01 SCREW (+P 1.7X6) 762 4-996-265-01 SHAFT, MAIN

S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFLECT→PROTECT)

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 86

HCD-C5

Ver 1.1 2001.09

AMP AUDIO

NOTE:

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX, -X mean standardized parts, so they may have some difference from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• CAPACITORS: uF: µF

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1-681-380-11 AMP POWER BOARD

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C851 1-136-165-00 FILM 0.1uF 5.00% 50V C852 1-136-165-00 FILM 0.1uF 5.00% 50V C853 1-128-549-11 ELECT 3300uF 20.00% 35V C854 1-128-549-11 ELECT 3300uF 20.00% 35V

< CONNECTOR >

ELECTRICAL PARTS LIST

• RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable

• COILS uH: µH

• SEMICONDUCTORS In each case, u: µ, for example: uA...: µA... , uPA... , µPA... , uPB... , µPB... , uPC... , µPC... , uPD..., µPD...

SECTION 8

• Abbreviation AUS : Australian model HK : Hong Kong model KR : Korean model

When indicating parts by reference number, please include the board name.

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

C310 1-124-261-00 ELECT 10uF 20% 50V C311 1-124-261-00 ELECT 10uF 20% 50V C312 1-136-165-00 FILM 0.1uF 5.00% 50V C313 1-124-464-11 ELECT 0.22uF 20% 50V C314 1-137-365-11 MYLAR 0.0015uF 5.00% 50V

C315 1-124-261-00 ELECT 10uF 20% 50V C316 1-136-165-00 FILM 0.1uF 5.00% 50V C317 1-136-165-00 FILM 0.1uF 5.00% 50V C321 1-124-261-00 ELECT 10uF 20% 50V C322 1-124-261-00 ELECT 10uF 20% 50V

CN851 1-564-506-11 PLUG, CONNECTOR 3P CN852 1-779-939-11 CONNECTOR, BOARD TO BOARD 7P

< DIODE >

D851 8-719-028-23 DIODE D3SBA20-4101

< FUSE >

0 F851 1-533-471-11 FUSE, GLASS TUBE (DIA. 5) T4AL/250V 0 F852 1-533-471-11 FUSE, GLASS TUBE (DIA. 5) T4AL/250V

< FUSE HOLDER >

FH851 1-533-293-11 FUSE HOLDER FH852 1-533-293-11 FUSE HOLDER FH853 1-533-293-11 FUSE HOLDER FH854 1-533-293-11 FUSE HOLDER

< RESISTOR >

R851 1-260-107-11 CARBON 4.7K 5% 1/2W

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4476-938-A AUDIO BOARD, COMPLETE (AUS,HK,KR) A-4476-949-A AUDIO BOARD, COMPLETE (AEP,UK)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C323 1-124-261-00 ELECT 10uF 20% 50V C324 1-128-057-11 ELECT 330uF 20.00% 6.3V C325 1-137-367-11 MYLAR 0.0033uF 5.00% 50V C326 1-162-960-11 CERAMIC CHIP 220PF 10% 50V C331 1-124-257-00 ELECT 2.2uF 20% 50V

C332 1-119-772-11 ELECT 47uF 20% 25V C333 1-119-772-11 ELECT 47uF 20% 25V C334 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C335 1-119-772-11 ELECT MELF 47uF 20.00% 35V C336 1-124-257-00 ELECT 2.2uF 20% 50V

C344 1-124-465-00 ELECT 0.47uF 20% 50V C351 1-124-257-00 ELECT 2.2uF 20% 50V C352 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C353 1-124-257-00 ELECT 2.2uF 20% 50V C354 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V

C355 1-124-257-00 ELECT 2.2uF 20% 50V C359 1-124-261-00 ELECT 10uF 20% 50V C360 1-124-261-00 ELECT 10uF 20% 50V C361 1-124-261-00 ELECT 10uF 20% 50V C362 1-136-165-00 FILM 0.1uF 5.00% 50V

C363 1-124-464-11 ELECT 0.22uF 20% 50V C364 1-137-365-11 MYLAR 0.0015uF 5.00% 50V C365 1-124-261-00 ELECT 10uF 20% 50V C366 1-136-165-00 FILM 0.1uF 5.00% 50V C367 1-136-165-00 FILM 0.1uF 5.00% 50V

C102 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C111 1-124-227-00 ELECT 10uF 20% 10V

C121 1-164-156-00 CERAMIC CHIP 0.1 25V C152 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C301 1-124-257-00 ELECT 2.2uF 20% 50V

C302 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C303 1-124-257-00 ELECT 2.2uF 20% 50V C304 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V C305 1-124-257-00 ELECT 2.2uF 20% 50V C309 1-124-261-00 ELECT 10uF 20% 50V

(AEP,UK)

C381 1-124-257-00 ELECT 2.2uF 20% 50V C382 1-119-772-11 ELECT 47uF 20% 25V C383 1-119-772-11 ELECT 47uF 20% 25V C384 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

< CONNECTOR >

CN101 1-784-780-11 CONNECTOR, FFC 19P

∗ CN102 1-568-936-11 PIN, CONNECTOR 9P

CN103 1-778-240-11 CONNECTOR, BOARD TO BOARD 5P CN104 1-568-830-11 CONNECTOR, FFC 11P (AUS,HK,KR) CN104 1-784-776-11 CONNECTOR, FFC 15P (AEP,UK)

Page 87

HCD-C5

Ver 1.1 2001.09

AUDIO BD (CD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

CN105 1-564-506-11 PLUG, CONNECTOR 3P

∗ CN106 1-568-934-11 PIN, CONNECTOR 7P ∗ CN108 1-568-943-11 PIN, CONNECTOR 5P

< DIODE >

R321 1-216-839-11 METAL CHIP 33K 5% 1/16W R322 1-216-857-11 METAL CHIP 1M 5% 1/16W R323 1-216-821-11 METAL CHIP 1K 5% 1/16W R324 1-216-821-11 METAL CHIP 1K 5% 1/16W R325 1-216-821-11 METAL CHIP 1K 5% 1/16W

D101 8-719-200-82 DIODE 11ES2-TA1B D103 8-719-988-61 DIODE 1SS355TE-17 D111 8-719-923-34 DIODE MTZJ-T-77-5.1B (AEP,UK) D301 8-719-988-61 DIODE 1SS355TE-17 D343 8-719-988-61 DIODE 1SS355TE-17

D393 8-719-988-61 DIODE 1SS355TE-17

< TERMINAL >

EPT102 1-537-771-21 TERMINAL BOARD, GROUND

< IC >

IC301 8-759-494-40 IC M62428AFP600C IC302 8-759-167-88 IC NJM4565D (AEP,UK)

< CONDUCTOR >

JR303 1-216-864-11 METAL CHIP 0 5% 1/16W JR304 1-216-864-11 METAL CHIP 0 5% 1/16W JR305 1-216-864-11 METAL CHIP 0 5% 1/16W JR306 1-216-864-11 METAL CHIP 0 5% 1/16W

< TRANSISTOR >

Q101 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q102 8-729-424-08 TRANSISTOR UN2111-TX Q103 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF Q151 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q311 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6

Q331 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q361 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q381 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO

R326 1-216-831-11 METAL CHIP 6.8K 5% 1/16W R327 1-249-433-11 CARBON 22K 5% 1/4W R331 1-216-821-11 METAL CHIP 1K 5% 1/16W R332 1-216-833-11 METAL CHIP 10K 5% 1/16W R333 1-216-833-11 METAL CHIP 10K 5% 1/16W

R334 1-216-821-11 METAL CHIP 1K 5% 1/16W R335 1-216-835-11 METAL CHIP 15K 5% 1/16W R336 1-216-833-11 METAL CHIP 10K 5% 1/16W R338 1-216-845-11 METAL CHIP 100K 5% 1/16W

0 R339 1-249-405-11 CARBON 100 5% 1/4WF

R340 1-216-845-11 METAL CHIP 100K 5% 1/16W R341 1-216-845-11 METAL CHIP 100K 5% 1/16W R343 1-216-845-11 METAL CHIP 100K 5% 1/16W R344 1-247-903-00 CARBON 1M 5% 1/4W R352 1-216-821-11 METAL CHIP 1K 5% 1/16W

R353 1-216-845-11 METAL CHIP 100K 5% 1/16W R354 1-216-821-11 METAL CHIP 1K 5% 1/16W R359 1-216-845-11 METAL CHIP 100K 5% 1/16W R362 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R363 1-218-296-11 RES-CHIP 75K 5% 1/16W

R364 1-216-839-11 METAL CHIP 33K 5% 1/16W R365 1-216-857-11 METAL CHIP 1M 5% 1/16W R366 1-249-441-11 CARBON 100K 5% 1/4W R367 1-216-837-11 METAL CHIP 22K 5% 1/16W R381 1-216-821-11 METAL CHIP 1K 5% 1/16W

R382 1-216-833-11 METAL CHIP 10K 5% 1/16W R383 1-216-833-11 METAL CHIP 10K 5% 1/16W R384 1-216-821-11 METAL CHIP 1K 5% 1/16W R385 1-216-835-11 METAL CHIP 15K 5% 1/16W R386 1-216-833-11 METAL CHIP 10K 5% 1/16W

< RESISTOR >

R102 1-216-821-11 METAL CHIP 1K 5% 1/16W R103 1-216-833-11 METAL CHIP 10K 5% 1/16W R104 1-216-821-11 METAL CHIP 1K 5% 1/16W R105 1-216-845-11 METAL CHIP 100K 5% 1/16W R111 1-247-819-11 CARBON 330 5% 1/4W

(AEP,UK)

R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R152 1-216-821-11 METAL CHIP 1K 5% 1/16W R153 1-216-833-11 METAL CHIP 10K 5% 1/16W R154 1-216-821-11 METAL CHIP 1K 5% 1/16W R155 1-216-845-11 METAL CHIP 100K 5% 1/16W

R302 1-216-821-11 METAL CHIP 1K 5% 1/16W R303 1-216-845-11 METAL CHIP 100K 5% 1/16W R304 1-216-821-11 METAL CHIP 1K 5% 1/16W R309 1-216-845-11 METAL CHIP 100K 5% 1/16W R312 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R313 1-218-296-11 RES-CHIP 75K 5% 1/16W R314 1-216-839-11 METAL CHIP 33K 5% 1/16W R315 1-216-857-11 METAL CHIP 1M 5% 1/16W R316 1-249-441-11 CARBON 100K 5% 1/4W R317 1-216-837-11 METAL CHIP 22K 5% 1/16W

R388 1-216-845-11 METAL CHIP 100K 5% 1/16W R393 1-216-845-11 METAL CHIP 100K 5% 1/16W

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4476-934-A BD (CD) BOARD, COMPLETE

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

7-685-852-04 SCREW +BVTT 2X5 (S)

< CAPACITOR >

C101 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V C102 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C103 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V C104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V C107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V

C108 1-164-360-11 CERAMIC CHIP 0.1uF 16V C109 1-164-360-11 CERAMIC CHIP 0.1uF 16V C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C111 1-124-589-11 ELECT 47uF 20% 16V C112 1-124-589-11 ELECT 47uF 20% 16V

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 88

HCD-C5

BD (CD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C113 1-124-584-00 ELECT 100uF 20% 10V C114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C115 1-124-589-11 ELECT 47uF 20% 16V C117 1-164-360-11 CERAMIC CHIP 0.1uF 16V C118 1-115-156-11 CERAMIC CHIP 1uF 10V

D101 8-719-056-77 DIODE UDZ-TE-17-3.9B

< DIODE >

< FERRITE BEAD >

C119 1-115-156-11 CERAMIC CHIP 1uF 10V C120 1-126-513-11 ELECT 47uF 20.00% 6.3V C154 1-164-360-11 CERAMIC CHIP 0.1uF 16V C159 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C161 1-164-360-11 CERAMIC CHIP 0.1uF 16V

C162 1-162-974-11 CERAMIC CHIP 0.01uF 50V C164 1-128-499-11 ELECT 220uF 20.00% 16V C180 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C181 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C182 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C183 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C184 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C185 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C186 1-126-934-11 ELECT 220uF 20.00% 10V C187 1-164-360-11 CERAMIC CHIP 0.1uF 16V

C188 1-162-974-11 CERAMIC CHIP 0.01uF 50V C191 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C192 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C193 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C194 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V

C201 1-126-934-11 ELECT 220uF 20.00% 10V C202 1-164-360-11 CERAMIC CHIP 0.1uF 16V C203 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V C204 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V C205 1-164-360-11 CERAMIC CHIP 0.1uF 16V

C206 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C211 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C212 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V C213 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V

C215 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V C216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C221 1-164-360-11 CERAMIC CHIP 0.1uF 16V C222 1-164-360-11 CERAMIC CHIP 0.1uF 16V C224 1-164-360-11 CERAMIC CHIP 0.1uF 16V

C227 1-164-360-11 CERAMIC CHIP 0.1uF 16V C228 1-115-156-11 CERAMIC CHIP 1uF 10V C229 1-164-360-11 CERAMIC CHIP 0.1uF 16V C230 1-126-382-11 ELECT 100uF 20.00% 6.3V C231 1-126-934-11 ELECT 220uF 20.00% 10V

C234 1-162-974-11 CERAMIC CHIP 0.01uF 50V C235 1-162-974-11 CERAMIC CHIP 0.01uF 50V C236 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V C237 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V C240 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C1109 1-164-360-11 CERAMIC CHIP 0.1uF 16V C1110 1-126-934-11 ELECT 220uF 20.00% 10V C1111 1-162-974-11 CERAMIC CHIP 0.01uF 50V

< CONNECTOR >

CN101 1-784-751-11 CONNECTOR, FFC 29P CN103 1-815-510-11 CONNECTOR, BOARD TO BOARD 26P

FB101 1-500-445-21 FERRITE 0uH

< IC >

IC101 8-752-408-73 IC CXD3068Q IC102 8-759-536-50 IC BA5982FP-E2 IC103 8-752-089-74 IC CXA2581N-T4 IC1102 8-759-598-69 IC BA6956AN

< CONDUCTOR >

JR201 1-216-864-11 METAL CHIP 0 5% 1/16W

< TRANSISTOR >

Q101 8-729-049-31 TRANSISTOR 2SB710A-RTX Q102 8-729-015-74 TRANSISTOR UN5111-TX Q103 8-729-920-85 TRANSISTOR 2SD1664-T100-QR

< RESISTOR >

R102 1-216-835-11 METAL CHIP 15K 5% 1/16W R103 1-216-845-11 METAL CHIP 100K 5% 1/16W R104 1-216-835-11 METAL CHIP 15K 5% 1/16W R105 1-216-821-11 METAL CHIP 1K 5% 1/16W R109 1-216-846-11 METAL CHIP 120K 5% 1/16W

R111 1-216-846-11 METAL CHIP 120K 5% 1/16W R113 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R114 1-216-845-11 METAL CHIP 100K 5% 1/16W R115 1-216-841-11 METAL CHIP 47K 5% 1/16W R116 1-216-841-11 METAL CHIP 47K 5% 1/16W

R117 1-216-847-11 METAL CHIP 150K 5% 1/16W R118 1-216-835-11 METAL CHIP 15K 5% 1/16W R120 1-216-849-11 METAL CHIP 220K 5% 1/16W R122 1-216-845-11 METAL CHIP 100K 5% 1/16W R123 1-216-797-11 METAL CHIP 10 5% 1/16W

R124 1-216-798-11 RES-CHIP 12 5% 1/16W R125 1-216-834-11 METAL CHIP 12K 5% 1/16W R126 1-216-834-11 METAL CHIP 12K 5% 1/16W R158 1-216-833-11 METAL CHIP 10K 5% 1/16W R159 1-216-841-11 METAL CHIP 47K 5% 1/16W

R162 1-216-847-11 METAL CHIP 150K 5% 1/16W R180 1-216-845-11 METAL CHIP 100K 5% 1/16W R181 1-216-846-11 METAL CHIP 120K 5% 1/16W R182 1-216-843-11 METAL CHIP 68K 5% 1/16W R183 1-216-843-11 METAL CHIP 68K 5% 1/16W

R184 1-216-849-11 METAL CHIP 220K 5% 1/16W R185 1-216-849-11 METAL CHIP 220K 5% 1/16W R186 1-216-843-11 METAL CHIP 68K 5% 1/16W R187 1-216-843-11 METAL CHIP 68K 5% 1/16W R188 1-216-849-11 METAL CHIP 220K 5% 1/16W

R189 1-216-849-11 METAL CHIP 220K 5% 1/16W R190 1-216-837-11 METAL CHIP 22K 5% 1/16W R191 1-216-837-11 METAL CHIP 22K 5% 1/16W R192 1-216-837-11 METAL CHIP 22K 5% 1/16W R193 1-216-837-11 METAL CHIP 22K 5% 1/16W

Page 89

HCD-C5

BD (CD) BD (MD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R196 1-216-839-11 METAL CHIP 33K 5% 1/16W R197 1-216-839-11 METAL CHIP 33K 5% 1/16W R198 1-216-839-11 METAL CHIP 33K 5% 1/16W R199 1-216-839-11 METAL CHIP 33K 5% 1/16W R201 1-216-839-11 METAL CHIP 33K 5% 1/16W

C111 1-117-720-11 CERAMIC CHIP 4.7uF 10V C112 1-110-563-11 CERAMIC CHIP 0.068uF 10.00% 16V C113 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C114 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V C115 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V

R202 1-216-833-11 METAL CHIP 10K 5% 1/16W R203 1-216-845-11 METAL CHIP 100K 5% 1/16W R204 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R205 1-216-821-11 METAL CHIP 1K 5% 1/16W R206 1-216-833-11 METAL CHIP 10K 5% 1/16W

R207 1-216-857-11 METAL CHIP 1M 5% 1/16W R212 1-216-813-11 METAL CHIP 220 5% 1/16W R215 1-216-864-11 METAL CHIP 0 5% 1/16W R216 1-216-813-11 METAL CHIP 220 5% 1/16W R217 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R218 1-216-821-11 METAL CHIP 1K 5% 1/16W R219 1-216-833-11 METAL CHIP 10K 5% 1/16W R220 1-216-864-11 METAL CHIP 0 5% 1/16W R221 1-216-813-11 METAL CHIP 220 5% 1/16W R226 1-216-809-11 METAL CHIP 100 5% 1/16W

R227 1-216-845-11 METAL CHIP 100K 5% 1/16W R228 1-216-853-11 METAL CHIP 470K 5% 1/16W R229 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R230 1-216-789-11 METAL CHIP 2.2 5% 1/16W R231 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

R302 1-216-837-11 METAL CHIP 22K 5% 1/16W R303 1-216-837-11 METAL CHIP 22K 5% 1/16W R304 1-216-837-11 METAL CHIP 22K 5% 1/16W R305 1-216-837-11 METAL CHIP 22K 5% 1/16W R1133 1-216-813-11 METAL CHIP 220 5% 1/16W

C116 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C118 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C119 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C120 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C121 1-164-156-11 CERAMIC CHIP 0.1uF 25V C125 1-117-720-11 CERAMIC CHIP 4.7uF 10V C128 1-164-156-11 CERAMIC CHIP 0.1uF 25V C131 1-117-720-11 CERAMIC CHIP 4.7uF 10V C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V C141 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C142 1-164-156-11 CERAMIC CHIP 0.1uF 25V C143 1-164-156-11 CERAMIC CHIP 0.1uF 25V C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C145 1-164-156-11 CERAMIC CHIP 0.1uF 25V C151 1-117-370-11 CERAMIC CHIP 10uF 10V C152 1-164-156-11 CERAMIC CHIP 0.1uF 25V C153 1-164-156-11 CERAMIC CHIP 0.1uF 25V C154 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C155 1-164-156-11 CERAMIC CHIP 0.1uF 25V C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V C157 1-164-156-11 CERAMIC CHIP 0.1uF 25V C158 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C159 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

R1134 1-216-821-11 METAL CHIP 1K 5% 1/16W

< NETWORK >

RN201 1-233-576-11 RES, CHIP NETWORK 100 RN202 1-233-576-11 RES, CHIP NETWORK 100

< VARIABLE RESISTOR >

RV101 1-238-602-11 RES, ADJ, CARBON 47K

< VIBRATOR >

X201 1-579-834-11 VIBRATOR, CRYSTAL 33.8688MHz

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4726-344-A BD (MD) BOARD, COMPLETE

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C101 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C102 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C104 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C105 1-115-416-11 CERAMIC CHIP 0.001uF 5.00% 25V

C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C107 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C108 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C109 1-164-677-11 CERAMIC CHIP 0.033uF 10.00% 16V C110 1-163-038-00 CERAMIC CHIP 0.1uF 25V

C160 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C163 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V C164 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C165 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C166 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V C167 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V C169 1-164-156-11 CERAMIC CHIP 0.1uF 25V C173 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C174 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C180 1-117-370-11 CERAMIC CHIP 10uF 10V C181 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C182 1-163-038-00 CERAMIC CHIP 0.1uF 25V C183 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C184 1-117-970-11 ELECT CHIP 22uF 20.00% 10V C185 1-131-872-11 CERAMIC CHIP 1000PF 10% 630V C191 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C192 1-164-156-11 CERAMIC CHIP 0.1uF 25V C193 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C194 1-164-156-11 CERAMIC CHIP 0.1uF 25V C195 1-164-156-11 CERAMIC CHIP 0.1uF 25V C196 1-164-156-11 CERAMIC CHIP 0.1uF 25V C1401 1-117-720-11 CERAMIC CHIP 4.7uF 10V

Page 90

HCD-C5

BD (MD)

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< CONNECTOR >

CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P CN102 1-784-835-21 CONNECTOR,FFC(LIF(NON-ZIF))27P CN103 1-784-869-21 CONNECTOR,FFC(LIF(NON-ZIF))17P

∗ CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P

CN105 1-784-859-21 CONNECTOR, FFC(LIF(NON-ZIF))7P

< DIODE >

D101 8-719-988-61 DIODE 1SS355TE-17 D181 8-719-080-81 DIODE FS1J6 D183 8-719-080-81 DIODE FS1J6

< IC >

IC101 8-752-080-95 IC CXA2523AR IC102 8-759-473-51 IC TLV2361CDBV IC141 8-759-836-79 IC BH6519FS-E2 IC151 8-752-404-64 IC CXD2662R IC153 8-759-671-27 IC MSM51V4400D-10TSK-FS

IC181 8-759-481-17 IC MC74ACT08DTR2 IC190 8-759-677-64 IC L88M35T IC195 8-759-640-41 IC BR24C08F-E2

< CONDUCTOR >

JW201 1-216-295-00 SHORT 0 JW202 1-216-295-00 SHORT 0 JW203 1-216-295-00 SHORT 0 JW903 1-216-295-00 SHORT 0 JW904 1-216-295-00 SHORT 0

< CONDUCTOR / FERRITE BEAD >

L101 1-500-245-11 FERRITE 0uH L102 1-500-245-11 FERRITE 0uH L103 1-500-245-11 FERRITE 0uH L105 1-414-235-22 FERRITE 0uH L106 1-500-245-11 FERRITE 0uH

L121 1-500-245-11 FERRITE 0uH L122 1-500-245-11 FERRITE 0uH L131 1-500-245-11 FERRITE 0uH L141 1-216-296-11 SHORT 0 L142 1-216-296-11 SHORT 0

L143 1-216-296-11 SHORT 0 L144 1-216-296-11 SHORT 0 L145 1-216-296-11 SHORT 0 L146 1-469-855-21 FERRITE 0uH L147 1-469-855-21 FERRITE 0uH

L161 1-500-245-11 FERRITE 0uH L171 1-500-245-11 FERRITE 0uH L180 1-469-855-21 FERRITE 0uH L181 1-469-855-21 FERRITE 0uH L182 1-500-245-11 FERRITE 0uH

L183 1-216-296-11 SHORT 0 L184 1-216-296-11 SHORT 0

< TRANSISTOR >

Q101 8-729-403-35 TRANSISTOR UN5113-TX Q121 8-729-403-35 TRANSISTOR UN5113-TX Q122 8-729-101-07 TRANSISTOR 2SB798-T1DK Q131 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR Q132 8-729-903-10 TRANSISTOR FMW1-T-148

Q133 8-729-402-93 TRANSISTOR UN5214-TX Q134 8-729-402-93 TRANSISTOR UN5214-TX Q181 8-729-018-75 TRANSISTOR 2SJ278MYTR Q182 8-729-017-65 TRANSISTOR 2SK1764KYTR

< RESISTOR >

R101 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R102 1-216-853-11 METAL CHIP 470K 5% 1/16W R103 1-216-863-11 RES-CHIP 3.3M 5% 1/16W R104 1-216-853-11 METAL CHIP 470K 5% 1/16W R105 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

R106 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R107 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R108 1-216-833-11 METAL CHIP 10K 5% 1/16W R109 1-216-845-11 METAL CHIP 100K 5% 1/16W R110 1-216-845-11 METAL CHIP 100K 5% 1/16W

R111 1-216-833-11 METAL CHIP 10K 5% 1/16W R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R113 1-216-833-11 METAL CHIP 10K 5% 1/16W R114 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R115 1-216-833-11 METAL CHIP 10K 5% 1/16W

R116 1-216-839-11 METAL CHIP 33K 5% 1/16W R117 1-216-837-11 METAL CHIP 22K 5% 1/16W R118 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W R119 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W R120 1-218-889-11 METAL CHIP 56K 0.5% 1/16W

R121 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W R122 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W R123 1-216-819-11 METAL CHIP 680 5% 1/16W R124 1-216-809-11 METAL CHIP 100 5% 1/16W R125 1-216-815-11 METAL CHIP 330 5% 1/16W

R126 1-216-819-11 METAL CHIP 680 5% 1/16W R127 1-216-845-11 METAL CHIP 100K 5% 1/16W R128 1-219-724-11 METAL CHIP 1 1% 1/4W R129 1-216-298-00 METAL CHIP 2.2 5% 1/10W R130 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R131 1-216-833-11 METAL CHIP 10K 5% 1/16W R132 1-216-839-11 METAL CHIP 33K 5% 1/16W R133 1-216-821-11 METAL CHIP 1K 5% 1/16W R134 1-216-821-11 METAL CHIP 1K 5% 1/16W R135 1-216-821-11 METAL CHIP 1K 5% 1/16W

R136 1-216-302-00 METAL CHIP 2.7 5% 1/10W R138 1-216-833-11 METAL CHIP 10K 5% 1/16W R150 1-216-833-11 METAL CHIP 10K 5% 1/16W R151 1-216-833-11 METAL CHIP 10K 5% 1/16W R153 1-216-833-11 METAL CHIP 10K 5% 1/16W

R155 1-216-864-11 METAL CHIP 0 5% 1/16W R156 1-216-864-11 METAL CHIP 0 5% 1/16W R158 1-216-809-11 METAL CHIP 100 5% 1/16W R162 1-216-833-11 METAL CHIP 10K 5% 1/16W R167 1-216-833-11 METAL CHIP 10K 5% 1/16W

R168 1-216-845-11 METAL CHIP 100K 5% 1/16W R169 1-216-855-11 METAL CHIP 680K 5% 1/16W R170 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R171 1-216-821-11 METAL CHIP 1K 5% 1/16W R173 1-216-821-11 METAL CHIP 1K 5% 1/16W

R174 1-216-811-11 METAL CHIP 150 5% 1/16W R177 1-216-805-11 METAL CHIP 47 5% 1/16W R179 1-216-295-00 SHORT 0 R181 1-216-841-11 METAL CHIP 47K 5% 1/16W R182 1-216-841-11 METAL CHIP 47K 5% 1/16W

Page 91

HCD-C5

Ver 1.1 2001.09

BD (MD) CONNECTOR MD DIGITALHP JACK

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R183 1-216-841-11 METAL CHIP 47K 5% 1/16W R184 1-220-942-11 METAL CHIP 3.3 1% 1/4 R185 1-220-942-11 METAL CHIP 3.3 1% 1/4 R195 1-216-833-11 METAL CHIP 10K 5% 1/16W R196 1-216-833-11 METAL CHIP 10K 5% 1/16W

∗ CN107 1-568-934-11 PIN, CONNECTOR 7P

< CONNECTOR >

< JACK >

R197 1-216-833-11 METAL CHIP 10K 5% 1/16W R218 1-216-864-11 METAL CHIP 0 5% 1/16W

< SWITCH >

S101 1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT-IN) S103 1-771-956-21 SWITCH, PUSH (1 KEY) (OUT) S104 1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY) S105 1-771-955-21 SWITCH, PUSH (1 KEY) (REC)

< VIBRATOR >

X171 1-781-569-21 OSCILLATOR, CRYSTAL 90MHz

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

1-682-100-11 CONNECTOR BOARD

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CONNECTOR >

CN1 1-815-750-11 CONNECTOR

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

1-681-712-11 HP BOARD

∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C337 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C338 1-162-294-31 CERAMIC 0.001uF 10% 50V C339 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

J101 1-793-439-11 JACK (SMALL TYPE) (TAPE OUT) J102 1-793-439-11 JACK (SMALL TYPE) (TAPE IN)

< RESISTOR >

R101 1-216-845-11 METAL CHIP 100K 5% 1/16W R151 1-216-845-11 METAL CHIP 100K 5% 1/16W

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4725-732-A MD DIGITAL BOARD, COMPLETE

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C200 1-124-584-00 ELECT 100uF 20% 10V C201 1-164-156-11 CERAMIC CHIP 0.1uF 25V C202 1-124-589-11 ELECT 47uF 20% 16V C203 1-164-156-11 CERAMIC CHIP 0.1uF 25V C204 1-124-261-00 ELECT 10uF 20% 50V

C205 1-164-156-11 CERAMIC CHIP 0.1uF 25V C207 1-164-156-11 CERAMIC CHIP 0.1uF 25V C208 1-164-156-11 CERAMIC CHIP 0.1uF 25V C211 1-164-156-11 CERAMIC CHIP 0.1uF 25V C212 1-124-584-00 ELECT 100uF 20% 10V

C213 1-164-156-11 CERAMIC CHIP 0.1uF 25V C214 1-124-261-00 ELECT 10uF 20% 50V C215 1-124-261-00 ELECT 10uF 20% 50V C216 1-164-156-11 CERAMIC CHIP 0.1uF 25V C217 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

∗ CN109 1-568-954-11 PIN, CONNECTOR 5P

CN110 1-506-469-11 PIN, CONNECTOR 4P

< JACK >

J103 1-794-702-11 JACK, HEADPHONE (PHONES)

< TRANSISTOR >

Q341 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q391 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO

< RESISTOR >

R337 1-249-407-11 CARBON 150 5% 1/4W F R342 1-249-429-11 CARBON 10K 5% 1/4W R387 1-249-407-11 CARBON 150 5% 1/4W F R392 1-216-833-11 METAL CHIP 10K 5% 1/16W

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

1-681-381-11 JACK BOARD

∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

C101 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C122 1-162-964-11 CERAMIC CHIP 1000PF 50V

(AEP,UK,KR)

C151 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C218 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C219 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C221 1-164-156-11 CERAMIC CHIP 0.1uF 25V C222 1-124-589-11 ELECT 47uF 20% 16V C223 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C701 1-124-584-00 ELECT 100uF 20% 10V C702 1-164-156-11 CERAMIC CHIP 0.1uF 25V C703 1-126-245-11 ELECT 330uF 20.00% 6.3V C704 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C705 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C706 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C707 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C719 1-164-156-11 CERAMIC CHIP 0.1uF 25V C723 1-164-156-11 CERAMIC CHIP 0.1uF 25V C726 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C730 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C738 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C740 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C742 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C743 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C748 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C749 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C751 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C756 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C791 1-164-156-11 CERAMIC CHIP 0.1uF 25V

Page 92

HCD-C5

PANELMD DIGITAL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C843 1-164-156-11 CERAMIC CHIP 0.1uF 25V C861 1-164-156-11 CERAMIC CHIP 0.1uF 25V C862 1-115-869-11 ELECT 0.33uF 20.00% 50V C863 1-164-156-11 CERAMIC CHIP 0.1uF 25V C864 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

R220 1-216-817-11 METAL CHIP 470 5% 1/16W R221 1-216-809-11 METAL CHIP 100 5% 1/16W R222 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R223 1-216-833-11 METAL CHIP 10K 5% 1/16W R701 1-216-817-11 METAL CHIP 470 5% 1/16W

C871 1-124-584-00 ELECT 100uF 20% 10V C872 1-164-156-11 CERAMIC CHIP 0.1uF 25V C873 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

< CONNECTOR >

CN201 1-790-669-21 PIN, CONNECTOR (PC BOARD) 9P CN701 1-784-741-11 CONNECTOR, FFC 19P CN702 1-784-384-11 CONNECTOR, FFC/FPC 27P CN703 1-784-376-11 CONNECTOR, FFC/FPC 17P

< DIODE >

D211 8-719-104-34 DIODE 1S2835-T1

< FERRITE BEAD / CONDUCTOR >

FB217 1-469-116-21 FERRITE 0UH FB701 1-469-324-21 FERRITE 0UH FB702 1-469-324-21 FERRITE 0UH FB703 1-469-324-21 FERRITE 0UH FB704 1-216-864-11 METAL CHIP 0 5% 1/16W

< IC >

IC201 8-759-675-78 IC UDA1360TS/N1.118 IC211 8-759-675-77 IC UDA1350AH IC701 6-800-339-01 IC M30803MG-A03FP IC861 8-759-481-02 IC M62016L IC871 8-759-598-69 IC BA6956AN

R702 1-216-809-11 METAL CHIP 100 5% 1/16W R717 1-216-833-11 METAL CHIP 10K 5% 1/16W R724 1-216-833-11 METAL CHIP 10K 5% 1/16W R726 1-216-831-11 METAL CHIP 6.8K 5% 1/16W R727 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R730 1-216-833-11 METAL CHIP 10K 5% 1/16W R743 1-216-833-11 METAL CHIP 10K 5% 1/16W R749 1-216-833-11 METAL CHIP 10K 5% 1/16W R751 1-216-833-11 METAL CHIP 10K 5% 1/16W R752 1-216-833-11 METAL CHIP 10K 5% 1/16W

R754 1-216-833-11 METAL CHIP 10K 5% 1/16W R767 1-216-833-11 METAL CHIP 10K 5% 1/16W R768 1-216-833-11 METAL CHIP 10K 5% 1/16W R786 1-216-833-11 METAL CHIP 10K 5% 1/16W R787 1-216-833-11 METAL CHIP 10K 5% 1/16W

R815 1-216-837-11 METAL CHIP 22K 5% 1/16W R816 1-216-841-11 METAL CHIP 47K 5% 1/16W R824 1-216-809-11 METAL CHIP 100 5% 1/16W R861 1-216-849-11 METAL CHIP 220K 5% 1/16W R862 1-216-845-11 METAL CHIP 100K 5% 1/16W

R863 1-216-837-11 METAL CHIP 22K 5% 1/16W R871 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R872 1-216-824-11 METAL CHIP 1.8K 5% 1/16W R873 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

< VIBRATOR >

< CONDUCTOR >

JR210 1-216-296-11 SHORT 0

< COIL >

L701 1-412-533-21 INDUCTOR 47uH

< TRANSISTOR >

Q201 8-729-421-22 TRANSISTOR UN2211-TX Q202 8-729-026-49 TRANSISTOR 2SA1037AK-T146-QR Q211 8-729-424-08 TRANSISTOR UN2111-TX Q861 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q871 8-729-421-22 TRANSISTOR UN2211-TX

Q872 8-729-602-36 TRANSISTOR 2SA1602TP-1EF

< RESISTOR >

R201 1-218-272-11 RES-CHIP 5.1K 5% 1/16W R202 1-218-272-11 RES-CHIP 5.1K 5% 1/16W R211 1-216-813-11 METAL CHIP 220 5% 1/16W R213 1-216-833-11 METAL CHIP 10K 5% 1/16W R214 1-216-809-11 METAL CHIP 100 5% 1/16W

R215 1-216-833-11 METAL CHIP 10K 5% 1/16W R216 1-216-833-11 METAL CHIP 10K 5% 1/16W R217 1-216-809-11 METAL CHIP 100 5% 1/16W R218 1-216-809-11 METAL CHIP 100 5% 1/16W R219 1-216-809-11 METAL CHIP 100 5% 1/16W

X720 1-579-175-11 VIBRATOR, CERAMIC 10MHz

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4476-936-A PANEL BOARD, COMPLETE

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

4-233-850-01 HOLDER (FL)

< CAPACITOR >

C603 1-124-247-11 ELECT 10uF 20.00% 35V C623 1-162-306-11 CERAMIC 0.01uF 30.00% 16V C624 1-162-282-31 CERAMIC 100PF 10% 50V C626 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C635 1-124-247-11 ELECT 10uF 20.00% 35V

C636 1-126-153-11 ELECT 22uF 20% 6.3V C637 1-164-156-11 CERAMIC CHIP 0.1uF 25V C640 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C641 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C642 1-162-306-11 CERAMIC 0.01uF 30.00% 16V

C643 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C646 1-165-319-91 CERAMIC CHIP 0.1uF 50V C647 1-162-290-31 CERAMIC 470PF 10% 50V C648 1-162-286-31 CERAMIC 220PF 10.00% 50V C649 1-162-286-31 CERAMIC 220PF 10.00% 50V

C650 1-162-286-31 CERAMIC 220PF 10.00% 50V C651 1-162-286-31 CERAMIC 220PF 10.00% 50V C652 1-162-286-31 CERAMIC 220PF 10.00% 50V C653 1-162-286-31 CERAMIC 220PF 10.00% 50V C654 1-162-286-31 CERAMIC 220PF 10.00% 50V

Page 93

HCD-C5

Ver 1.1 2001.09

PANEL POWER

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C655 1-162-286-31 CERAMIC 220PF 10.00% 50V C656 1-162-286-31 CERAMIC 220PF 10.00% 50V C657 1-162-286-31 CERAMIC 220PF 10.00% 50V C658 1-162-286-31 CERAMIC 220PF 10.00% 50V C659 1-162-286-31 CERAMIC 220PF 10.00% 50V

R624 1-249-433-11 CARBON 22K 5% 1/4W R639 1-216-797-11 METAL CHIP 10 5% 1/16W R640 1-249-413-11 CARBON 470 5% 1/4W R641 1-216-819-11 METAL CHIP 680 5% 1/16W R642 1-216-821-11 METAL CHIP 1K 5% 1/16W

C660 1-162-286-31 CERAMIC 220PF 10.00% 50V C661 1-162-286-31 CERAMIC 220PF 10.00% 50V C662 1-162-286-31 CERAMIC 220PF 10.00% 50V C664 1-124-247-11 ELECT 10uF 20.00% 35V C665 1-124-589-11 ELECT 47uF 20% 16V

< CONNECTOR >

∗ CN601 1-784-738-11 CONNECTOR, FFC 16P

< DIODE >

D601 8-719-300-71 DIODE SEL2210R-TP3 (?/1) D602 8-719-072-76 DIODE SEL5E23C-TP15 (FUNCTIONz) D603 8-719-072-76 DIODE SEL5E23C-TP15 (VOL +) D604 8-719-072-76 DIODE SEL5E23C-TP15 (VOL –) D605 8-719-072-76 DIODE SEL5E23C-TP15 (CDZ)

D606 8-719-072-76 DIODE SEL5E23C-TP15 (u) D607 8-719-072-76 DIODE SEL5E23C-TP15 (x) D608 8-719-072-76 DIODE SEL5E23C-TP15 (>) D609 8-719-072-76 DIODE SEL5E23C-TP15 (.) D610 8-719-072-76 DIODE SEL5E23C-TP15 (MDZ)

< FILTER >

FL601 1-518-755-11 INDICATOR TUBE, FLUORESCENT

< IC >

IC601 8-759-297-23 IC M66004M8FP-200D IC602 8-759-827-69 IC NJL63H400A-1 (g)

R643 1-216-817-11 METAL CHIP 470 5% 1/16W R644 1-216-819-11 METAL CHIP 680 5% 1/16W R645 1-216-821-11 METAL CHIP 1K 5% 1/16W R646 1-216-817-11 METAL CHIP 470 5% 1/16W R647 1-216-819-11 METAL CHIP 680 5% 1/16W

R648 1-216-821-11 METAL CHIP 1K 5% 1/16W

< SWITCH >

S602 1-762-875-21 SWITCH, KEYBOARD

(REC/REC IT/CD SYNC NORMAL) S603 1-762-875-21 SWITCH, KEYBOARD (VOL –) S604 1-762-875-21 SWITCH, KEYBOARD (VOL +) S605 1-762-875-21 SWITCH, KEYBOARD (FUNCTIONz) S606 1-762-875-21 SWITCH, KEYBOARD (?/1)

S607 1-762-875-21 SWITCH, KEYBOARD (CDZ) S608 1-762-875-21 SWITCH, KEYBOARD (u) S609 1-762-875-21 SWITCH, KEYBOARD (x) S610 1-762-875-21 SWITCH, KEYBOARD (CD SYNC HIGH) S611 1-762-875-21 SWITCH, KEYBOARD (MDZ)

S612 1-762-875-21 SWITCH, KEYBOARD (./m/TUNING–) S613 1-762-875-21 SWITCH, KEYBOARD (>/M/TUNING+)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

A-4427-414-A POWER BOARD, COMPLETE (HK,KR) A-4476-948-A POWER BOARD, COMPLETE (AEP,UK,AUS)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

< CAPACITOR >

< TRANSISTOR >

Q601 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF Q602 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF Q604 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF

< RESISTOR >

R601 1-249-441-11 CARBON 100K 5% 1/4W R602 1-249-441-11 CARBON 100K 5% 1/4W R603 1-249-417-11 CARBON 1K 5% 1/4W R604 1-249-417-11 CARBON 1K 5% 1/4W R607 1-249-441-11 CARBON 100K 5% 1/4W

R608 1-216-838-11 METAL CHIP 27K 5% 1/16W R609 1-216-821-11 METAL CHIP 1K 5% 1/16W R610 1-216-821-11 METAL CHIP 1K 5% 1/16W R611 1-216-821-11 METAL CHIP 1K 5% 1/16W R612 1-216-821-11 METAL CHIP 1K 5% 1/16W

R614 1-216-813-11 METAL CHIP 220 5% 1/16W R615 1-216-813-11 METAL CHIP 220 5% 1/16W R616 1-216-813-11 METAL CHIP 220 5% 1/16W R617 1-216-813-11 METAL CHIP 220 5% 1/16W R618 1-216-809-11 METAL CHIP 100 5% 1/16W

R619 1-216-813-11 METAL CHIP 220 5% 1/16W R620 1-216-813-11 METAL CHIP 220 5% 1/16W R621 1-216-813-11 METAL CHIP 220 5% 1/16W R622 1-216-813-11 METAL CHIP 220 5% 1/16W R623 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

C902 1-126-767-11 ELECT 1000uF 20.00% 16V C903 1-126-964-11 ELECT 10uF 20.00% 50V C904 1-126-916-11 ELECT 1000uF 20.00% 6.3V C905 1-126-964-11 ELECT 10uF 20.00% 50V C906 1-126-926-11 ELECT 1000uF 20.00% 10V

C907 1-126-964-11 ELECT 10uF 20.00% 50V C908 1-126-935-11 ELECT 470uF 20.00% 10V C909 1-126-964-11 ELECT 10uF 20.00% 50V C910 1-126-916-11 ELECT 1000uF 20.00% 6.3V C912 1-126-916-11 ELECT 1000uF 20.00% 6.3V

C914 1-126-935-11 ELECT 470uF 20.00% 10V C922 1-126-933-11 ELECT 100uF 20.00% 16V C961 1-136-165-00 FILM 0.1uF 5.00% 50V C962 1-126-944-11 ELECT 3300uF 20.00% 25V C971 1-136-165-00 FILM 0.1uF 5.00% 50V

C974 1-126-968-11 ELECT 100uF 20.00% 50V C975 1-126-964-11 ELECT 10uF 20.00% 50V C976 1-126-964-11 ELECT 10uF 20.00% 50V C981 1-136-165-00 FILM 0.1uF 5.00% 50V C982 1-136-165-00 FILM 0.1uF 5.00% 50V

C983 1-135-933-11 ELECT 22000uF 20% 16V C984 1-128-548-11 ELECT 4700uF 20.00% 25V

0 C991 1-113-925-11 CERAMIC 0.01uF 20.00% 250V

C992 1-126-963-11 ELECT 4.7uF 20.00% 50V

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 94

HCD-C5

Ver 1.1 2001.09

POWER SW UCOM

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< CONNECTOR >

∗ CN901 1-770-732-11 CONNECTOR, BOARD TO BOARD 15P

CN902 1-778-241-11 CONNECTOR, BOARD TO BOARD 5P CN991 1-564-321-00 PIN, CONNECTOR 2P

∗ CN992 1-564-321-21 PIN, CONNECTOR 2P ∗ CN995 1-564-511-11 PLUG, CONNECTOR 8P

< DIODE >

D906 8-719-991-33 DIODE 1SS133T-77 D921 8-719-200-82 DIODE 11ES2-TA1B D961 8-719-200-82 DIODE 11ES2-TA1B D962 8-719-200-82 DIODE 11ES2-TA1B D963 8-719-200-82 DIODE 11ES2-TA1B

D964 8-719-200-82 DIODE 11ES2-TA1B D971 8-719-200-82 DIODE 11ES2-TA1B D972 8-719-200-82 DIODE 11ES2-TA1B D973 8-719-200-82 DIODE 11ES2-TA1B D974 8-719-200-82 DIODE 11ES2-TA1B

D975 8-719-982-24 DIODE MTZJ-T-77-33A D976 8-719-921-40 DIODE MTZJ-T-77-4.7A D981 8-719-028-23 DIODE D3SBA20-4101 D982 8-719-200-82 DIODE 11ES2-TA1B D983 8-719-200-82 DIODE 11ES2-TA1B

D984 8-719-200-82 DIODE 11ES2-TA1B D985 8-719-200-82 DIODE 11ES2-TA1B D991 8-719-991-33 DIODE 1SS133T-77 D992 8-719-991-33 DIODE 1SS133T-77 D993 8-719-991-33 DIODE 1SS133T-77

< BRACKET >

0 R981 1-219-120-81 FUSIBLE 0.15 5% 1/4W 0 R982 1-240-877-11 FUSIBLE 0.15 5% 1/2W

R991 1-249-429-11 CARBON 10K 5% 1/4W R992 1-216-833-11 METAL CHIP 10K 5% 1/16W R993 1-249-413-11 CARBON 470 5% 1/4W

R994 1-249-413-11 CARBON 470 5% 1/4W R995 1-216-055-11 METAL CHIP 1.8K 5% 1/10W R995 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R996 1-247-791-91 CARBON 22 5% 1/4W

< RELAY >

0 RY991 1-755-276-11 RELAY, POWER

< TRANSFORMER >

0 T901 1-437-243-11 TRANSFORMER, POWER (SUB) (AEP,UK,AUS) 0 T901 1-437-245-11 TRANSFORMER, POWER (SUB) (HK,KR)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

1-682-099-11 SW BOARD

∗∗∗∗∗∗∗∗∗

< SWITCH >

S1 1-786-214-11 SWITCH (DETECTION)

(Disc IN/8cm Disc Detect)

S2 1-786-212-11 SWITCH (DETECTION)

(12cm Disc/12cm Disc Eject End Detect)

S3 1-786-213-11 SWITCH (DETECTION)

(Disc Existence, Chaking, Releasing Detect)

S4 1-786-214-11 SWITCH (DETECTION)

(8cm Disc Eject End Detect)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

EB901 4-924-906-21 BRACKET (MT) EB902 4-924-906-21 BRACKET (MT)

< IC >

IC901 8-759-231-57 IC TA7810S IC902 8-759-701-75 IC NJM7805FA IC903 8-759-450-49 IC uPC2907HF IC904 8-759-701-75 IC NJM7805FA IC905 8-759-701-75 IC NJM7805FA

IC906 8-759-686-72 IC uPC29L04J-T IC907 8-759-647-11 IC uPC2905HF

< LINE FILTER >

0 LF991 1-419-625-11 COIL, LINE FILTER

< TRANSISTOR >

Q971 8-729-141-83 TRANSISTOR 2SB1375 Q991 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6

< RESISTOR >

0 R971 1-219-153-11 FUSIBLE 10 5% 1/4W

R972 1-260-103-11 CARBON 2.2K 5% 1/2W R973 1-249-429-11 CARBON 10K 5% 1/4W R974 1-249-413-11 CARBON 470 5% 1/4W R975 1-249-413-11 CARBON 470 5% 1/4W

A-4427-413-A UCOM BOARD, COMPLETE (AUS,HK,KR) A-4476-947-A UCOM BOARD, COMPLETE (AEP,UK)

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

∗ 4-363-146-00 HEAT SINK, V.OUT

7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S

< LITHIUM BATTERY >

BT921 1-528-938-11 BATTERY, LITHIUM ION SECONDARY

< CAPACITOR >

C201 1-126-176-11 ELECT 220uF 20% 10V C202 1-119-774-11 ELECT 100uF 20.00% 16V C203 1-164-159-11 CERAMIC 0.1uF 50V C204 1-104-665-11 ELECT 100uF 20.00% 10V C206 1-119-941-11 ELECT 470uF 20.00% 6.3V

C208 1-164-156-11 CERAMIC CHIP 0.1uF 25V C211 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C212 1-162-294-31 CERAMIC 0.001uF 10% 50V C213 1-162-294-31 CERAMIC 0.001uF 10% 50V C216 1-126-786-11 ELECT 47uF 20.00% 16V

C222 1-164-156-11 CERAMIC CHIP 0.1uF 25V C223 1-164-156-11 CERAMIC CHIP 0.1uF 25V C224 1-136-165-00 FILM 0.1uF 5.00% 50V C225 1-164-156-11 CERAMIC CHIP 0.1uF 25V C226 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 95

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UCOM

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C231 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C241 1-127-820-11 CERAMIC 4.7uF 16V C243 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C244 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C294 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C501 1-126-916-11 ELECT 1000uF 20.00% 6.3V C502 1-164-156-11 CERAMIC CHIP 0.1uF 25V C503 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C504 1-126-160-11 ELECT 1uF 20% 50V C505 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C506 1-164-159-11 CERAMIC 0.1uF 50V C507 1-164-156-11 CERAMIC CHIP 0.1uF 25V C509 1-164-156-11 CERAMIC CHIP 0.1uF 25V C510 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C535 1-162-917-11 CERAMIC CHIP 15PF 5% 50V

C536 1-162-920-11 CERAMIC CHIP 27PF 5% 50V C911 1-164-159-11 CERAMIC 0.1uF 50V C941 1-126-964-11 ELECT 10uF 20.00% 50V C942 1-164-156-11 CERAMIC CHIP 0.1uF 25V C943 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

∗ CN201 1-784-738-11 CONNECTOR, FFC 16P

CN202 1-784-780-11 CONNECTOR, FFC 19P CN203 1-764-698-11 SOCKET, CONNECTOR (NON ZIF)19P CN204 1-568-844-11 CONNECTOR, FFC 29P CN205 1-766-956-11 CONNECTOR, BOARD TO BOARD 15P

∗ CN206 1-774-813-11 CONNECTOR, BOARD TO BOARD 7P

CN207 1-774-136-11 CONNECTOR, ROUND TYPE 6P CN208 1-774-281-11 CONNECTOR (DIN) 8P CN209 1-774-281-11 CONNECTOR (DIN) 8P CN212 1-506-469-11 PIN, CONNECTOR 4P

< DIODE >

FB213 1-216-864-11 METAL CHIP 0 5% 1/16W FB214 1-216-864-11 METAL CHIP 0 5% 1/16W FB222 1-216-864-11 METAL CHIP 0 5% 1/16W FB537 1-414-813-21 EMI FERRITE (SMD)

< IC >

IC212 8-759-683-99 IC BA8274F-E2 IC221 8-749-017-36 IC TORX-179 IC222 8-759-548-57 IC SN74LV00ANSR IC501 6-800-396-01 IC uPD703032AYGF-M01-3BA IC941 8-759-637-58 IC PST592C-T

< CONDUCTOR >

JR200 1-216-864-11 METAL CHIP 0 5% 1/16W JR203 1-216-864-11 METAL CHIP 0 5% 1/16W JR205 1-216-864-11 METAL CHIP 0 5% 1/16W JR208 1-216-864-11 METAL CHIP 0 5% 1/16W JR209 1-216-864-11 METAL CHIP 0 5% 1/16W

JR210 1-216-864-11 METAL CHIP 0 5% 1/16W JR212 1-216-864-11 METAL CHIP 0 5% 1/16W JR213 1-216-864-11 METAL CHIP 0 5% 1/16W JR214 1-216-864-11 METAL CHIP 0 5% 1/16W JR215 1-216-864-11 METAL CHIP 0 5% 1/16W

JR216 1-216-864-11 METAL CHIP 0 5% 1/16W JR217 1-216-864-11 METAL CHIP 0 5% 1/16W JR219 1-216-864-11 METAL CHIP 0 5% 1/16W JR225 1-216-864-11 METAL CHIP 0 5% 1/16W JR226 1-216-864-11 METAL CHIP 0 5% 1/16W

JR227 1-216-864-11 METAL CHIP 0 5% 1/16W

< CONDUCTOR >

L551 1-216-864-11 METAL CHIP 0 5% 1/16W L552 1-216-864-11 METAL CHIP 0 5% 1/16W

D214 8-719-988-61 DIODE 1SS355TE-17 D221 8-719-988-61 DIODE 1SS355TE-17 D222 8-719-988-61 DIODE 1SS355TE-17 D232 8-719-988-61 DIODE 1SS355TE-17 D513 8-719-988-61 DIODE 1SS355TE-17

D910 8-719-921-40 DIODE MTZJ-T-77-4.7B D923 8-719-991-33 DIODE 1SS133T-77 D924 8-719-991-33 DIODE 1SS133T-77 D925 8-719-988-61 DIODE 1SS355TE-17 D926 8-719-988-61 DIODE 1SS355TE-17

D927 8-719-988-61 DIODE 1SS355TE-17 D941 8-719-988-61 DIODE 1SS355TE-17 D942 8-719-988-61 DIODE 1SS355TE-17 D943 8-719-988-61 DIODE 1SS355TE-17

< TERMINAL >

EPT101 1-537-770-21 TERMINAL BOARD, GROUND

< CONDUCTOR / COIL >

FB201 1-216-864-11 METAL CHIP 0 5% 1/16W FB202 1-216-864-11 METAL CHIP 0 5% 1/16W FB205 1-216-864-11 METAL CHIP 0 5% 1/16W FB211 1-412-473-21 INDUCTOR 0uH FB212 1-216-864-11 METAL CHIP 0 5% 1/16W

< TRANSISTOR >

Q202 8-729-424-08 TRANSISTOR UN2111-TX Q211 8-729-025-28 TRANSISTOR 2SK1828TE85L Q212 8-729-025-28 TRANSISTOR 2SK1828TE85L Q221 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q222 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6

Q223 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q224 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q232 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6 Q911 8-729-421-22 TRANSISTOR UN2211-TX Q912 8-729-040-20 TRANSISTOR RT1P137L-TP

Q941 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6

< RESISTOR >

R212 1-249-429-11 CARBON 10K 5% 1/4W R213 1-216-833-11 METAL CHIP 10K 5% 1/16W R214 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R215 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R217 1-216-833-11 METAL CHIP 10K 5% 1/16W

R218 1-216-845-11 METAL CHIP 100K 5% 1/16W R219 1-249-417-11 CARBON 1K 5% 1/4W R221 1-249-413-11 CARBON 470 5% 1/4W R222 1-216-809-11 METAL CHIP 100 5% 1/16W R224 1-216-853-11 METAL CHIP 470K 5% 1/16W

Page 96

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Ver 1.1 2001.09

UCOM

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R225 1-216-841-11 METAL CHIP 47K 5% 1/16W R226 1-216-853-11 METAL CHIP 470K 5% 1/16W R227 1-216-841-11 METAL CHIP 47K 5% 1/16W R228 1-216-841-11 METAL CHIP 47K 5% 1/16W R236 1-249-429-11 CARBON 10K 5% 1/4W

R560 1-249-417-11 CARBON 1K 5% 1/4W R561 1-249-417-11 CARBON 1K 5% 1/4W R562 1-216-809-11 METAL CHIP 100 5% 1/16W R563 1-216-809-11 METAL CHIP 100 5% 1/16W R564 1-216-809-11 METAL CHIP 100 5% 1/16W

R242 1-247-807-31 CARBON 100 5% 1/4W R243 1-216-821-11 METAL CHIP 1K 5% 1/16W R244 1-216-845-11 METAL CHIP 100K 5% 1/16W R245 1-216-845-11 METAL CHIP 100K 5% 1/16W R292 1-247-807-31 CARBON 100 5% 1/4W

R501 1-247-807-31 CARBON 100 5% 1/4W R502 1-247-807-31 CARBON 100 5% 1/4W R503 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R504 1-247-807-31 CARBON 100 5% 1/4W R505 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

R506 1-247-807-31 CARBON 100 5% 1/4W R507 1-247-807-31 CARBON 100 5% 1/4W R508 1-216-809-11 METAL CHIP 100 5% 1/16W R509 1-216-833-11 METAL CHIP 10K 5% 1/16W R510 1-216-833-11 METAL CHIP 10K 5% 1/16W

R511 1-247-807-31 CARBON 100 5% 1/4W R512 1-247-887-00 CARBON 220K 5% 1/4W R513 1-247-807-31 CARBON 100 5% 1/4W R514 1-247-807-31 CARBON 100 5% 1/4W R515 1-247-807-31 CARBON 100 5% 1/4W

R516 1-216-837-11 METAL CHIP 22K 5% 1/16W R517 1-247-807-31 CARBON 100 5% 1/4W R518 1-247-807-31 CARBON 100 5% 1/4W R519 1-247-887-00 CARBON 220K 5% 1/4W R520 1-249-421-11 CARBON 2.2K 5% 1/4W

R521 1-216-833-11 METAL CHIP 10K 5% 1/16W R522 1-216-833-11 METAL CHIP 10K 5% 1/16W R523 1-216-833-11 METAL CHIP 10K 5% 1/16W R524 1-216-809-11 METAL CHIP 100 5% 1/16W R525 1-216-833-11 METAL CHIP 10K 5% 1/16W

R526 1-247-807-31 CARBON 100 5% 1/4W R527 1-247-807-31 CARBON 100 5% 1/4W R528 1-249-429-11 CARBON 10K 5% 1/4W R529 1-247-807-31 CARBON 100 5% 1/4W R530 1-249-417-11 CARBON 1K 5% 1/4W

R565 1-216-835-11 METAL CHIP 15K 5% 1/16W R566 1-216-835-11 METAL CHIP 15K 5% 1/16W R567 1-249-429-11 CARBON 10K 5% 1/4W R568 1-216-835-11 METAL CHIP 15K 5% 1/16W R569 1-216-809-11 METAL CHIP 100 5% 1/16W

R570 1-216-809-11 METAL CHIP 100 5% 1/16W R572 1-216-823-11 METAL CHIP 1.5K 5% 1/16W R577 1-216-821-11 METAL CHIP 1K 5% 1/16W R578 1-216-821-11 METAL CHIP 1K 5% 1/16W R579 1-216-821-11 METAL CHIP 1K 5% 1/16W

R580 1-216-833-11 METAL CHIP 10K 5% 1/16W R581 1-216-833-11 METAL CHIP 10K 5% 1/16W R583 1-216-833-11 METAL CHIP 10K 5% 1/16W R584 1-216-833-11 METAL CHIP 10K 5% 1/16W

(AEP,UK)

R585 1-216-833-11 METAL CHIP 10K 5% 1/16W

R586 1-216-833-11 METAL CHIP 10K 5% 1/16W R587 1-216-833-11 METAL CHIP 10K 5% 1/16W R588 1-216-833-11 METAL CHIP 10K 5% 1/16W R590 1-249-417-11 CARBON 1K 5% 1/4W R591 1-249-437-11 CARBON 47K 5% 1/4W

R592 1-216-821-11 METAL CHIP 1K 5% 1/16W R593 1-216-833-11 METAL CHIP 10K 5% 1/16W R594 1-216-821-11 METAL CHIP 1K 5% 1/16W R595 1-249-417-11 CARBON 1K 5% 1/4W R596 1-216-821-11 METAL CHIP 1K 5% 1/16W

R597 1-216-809-11 METAL CHIP 100 5% 1/16W R910 1-260-103-11 CARBON 2.2K 5% 1/2W R911 1-216-864-11 METAL CHIP 0 5% 1/16W R921 1-216-813-11 METAL CHIP 220 5% 1/16W R941 1-216-817-11 METAL CHIP 470 5% 1/16W

R942 1-216-833-11 METAL CHIP 10K 5% 1/16W R943 1-216-841-11 METAL CHIP 47K 5% 1/16W R946 1-216-837-11 METAL CHIP 22K 5% 1/16W R947 1-216-841-11 METAL CHIP 47K 5% 1/16W

R531 1-249-417-11 CARBON 1K 5% 1/4W R532 1-249-417-11 CARBON 1K 5% 1/4W R533 1-249-417-11 CARBON 1K 5% 1/4W R535 1-249-429-11 CARBON 10K 5% 1/4W R536 1-216-851-11 METAL CHIP 330K 5% 1/16W

R538 1-249-429-11 CARBON 10K 5% 1/4W R543 1-216-809-11 METAL CHIP 100 5% 1/16W R544 1-216-809-11 METAL CHIP 100 5% 1/16W R545 1-216-821-11 METAL CHIP 1K 5% 1/16W R546 1-216-809-11 METAL CHIP 100 5% 1/16W

R547 1-216-809-11 METAL CHIP 100 5% 1/16W R548 1-216-809-11 METAL CHIP 100 5% 1/16W R549 1-216-809-11 METAL CHIP 100 5% 1/16W R550 1-216-809-11 METAL CHIP 100 5% 1/16W R551 1-249-429-11 CARBON 10K 5% 1/4W

R554 1-216-809-11 METAL CHIP 100 5% 1/16W R556 1-249-421-11 CARBON 2.2K 5% 1/4W R557 1-216-833-11 METAL CHIP 10K 5% 1/16W R558 1-216-833-11 METAL CHIP 10K 5% 1/16W R559 1-216-833-11 METAL CHIP 10K 5% 1/16W

< VIBRATOR >

X501 1-760-014-31 VIBRATOR, CERAMIC 20MHz X502 1-567-098-41 VIBRATOR, CRYSTAL 32.768kHz

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

MISCELLANEOUS

∗∗∗∗∗∗∗∗∗∗∗∗∗∗

1 1-757-791-11 WIRE (FLAT TYPE) (16 CORE) 6 1-773-289-11 WIRE (FLAT TYPE) (29 CORE)

0 104 1-696-847-11 CORD, POWER (AUS) 0 104 1-769-079-21 CORD, POWER (KR) 0 104 1-777-071-21 CORD, POWER (AEP,UK,HK)

105 1-769-943-11 WIRE (FLAT TYPE) (11CORE) (AUS,HK,KR) 105 1-773-007-11 WIRE (FLAT TYPE) (15 CORE) (AEP,UK) 106 1-693-529-11 TUNER PACK (FM/AM) (AEP,UK) 106 1-693-531-11 TUNER PACK (FM/AM) (AUS,HK) 106 1-693-536-11 TUNER PACK (FM/AM) (KR)

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 97

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Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

108 1-773-110-11 WIRE (FLAT TYPE) (19 CORE) 154 1-773-138-11 WIRE (FLAT TYPE) (19 CORE) 156 1-757-079-11 WIRE (FLAT TYPE) (17 CORE) 157 1-757-080-11 WIRE (FLAT TYPE) (27 CORE) 408 1-682-101-11 PICK-UP FLEXIBLE BOARD

0 503 1-758-631-11 OPTICAL PICK-UP (OPTIMA-720L1E)

759 1-678-514-11 FLEXIBLE BOARD

0 760 A-4672-541-A OPTICAL PICK-UP (KMS-260B)

HR901 1-500-670-11 HEAD, OVER WRITE M701 A-4672-898-A MOTOR ASSY, SPINDLE

M702 A-4735-076-A MOTOR ASSY, SLED M703 A-4735-074-A MOTOR ASSY, LOADING M901 1-698-997-11 FAN, D.C. M902 X-4954-023-1 MOTOR ASSY, LOADING M903 X-4954-020-1 MOTOR ASSY, FEED

M904 X-4954-021-1 MOTOR ASSY, SPINDLE S1 1-786-214-11 SWITCH (DETECTION)

(Disc IN/8cm Disc detect)

S2 1-786-213-11 SWITCH (DETECTION)

(12cm Disc/12cm Disc Eject End detect)

S3 1-786-213-11 SWITCH (DETECTION)

(Disc Existence, Chucking, Releasing detect)

S4 1-786-214-11 SWITCH (DETECTION) (8cm Disc Eject detect)

#1 7-685-870-01 SCREW +BVTT 3X5 (S) #2 7-685-245-19 SCREW +KTP 3X6 TYPE2 NON-SLIT #3 7-685-852-04 SCREW +BVTT 2X5 (S) #4 7-685-861-01 SCREW +BVTT 2.6X5 (S) #5 7-685-648-79 SCREW +BVTP 3X12 TYPE2 N-S

#6 7-682-565-09 SCREW +B 4X16 #7 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S #8 7-684-024-04 N 4, TYPE 2 #9 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT #10 7-685-504-19 SCREW +BTP 2X6 TYPE2 N-S

#11 7-685-101-11 SCREW +P 2X3 NON-SLIT TYPE2 #12 7-685-103-19 SCREW +P 2X5 TYPE2 NON-SLIT #13 7-627-553-38 SCREW, PRECISION +P 2X3 #14 7-627-553-28 SCREW, PRECISION +P 2X2.5 #15 7-627-553-17 PRECISION SCREW +P 2X2 TYPE 3

#16 7-627-553-78 SCREW, PRECISION +P 2X10 #17 7-627-553-68 SCREW, PRECISION +P 2X6 TYPE3 #18 7-627-552-77 SCREW, PRECISION +P 1.7X6 #19 7-627-552-88 SCREW, PRECISION +P 1.7X2.2 #20 7-627-551-18 SCREW, PRECISION +P 1.4X2

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HARDWARE LIST

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S5 1-786-212-11 SWITCH (DETECTION) (LIMIT IN) S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFLECT→PROTECT)

0 T900 1-437-239-11 TRANSFORMER, POWER (AEP,UK,AUS) 0 T900 1-437-241-11 TRANSFORMER, POWER (HK,KR)

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#21 7-685-850-04 SCREW +BVTT 2X3 (S) #22 7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Page 98

HCD-C5

REVISION HISTORY

Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page.

Ver. Date Description of Revision

1.1 2001.09 Addition of Australian, Hong Kong and Korean models.

1.0 2001.07 New

Sony HCD-C5 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

SERVICING NOTE

GENERAL

DISASSEMBLY

TEST MODE

ELECTRICAL ADJUSTMENTS

CD SECTION

MD SECTION

DIAGRAMS

6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

6-2. BLOCK DIAGRAM – CD SERVO SECTION –

6-3. BLOCK DIAGRAM – MD SERVO SECTION –

6-4. BLOCK DIAGRAM – MAIN SECTION –

6-5. PRINTED WIRING BOARDS – CD SECTION –

6-6. SCHEMATIC DIAGRAM – CD SECTION –

6-7. PRINTED WIRING BOARD – BD (MD) BOARD –

6-8. SCHEMATIC DIAGRAM – BD (MD) BOARD (1/2) –

6-9. SCHEMATIC DIAGRAM – BD (MD) BOARD (2/2) –

6-10. PRINTED WIRING BOARD – MD DIGITAL BOARD –

6-11. SCHEMATIC DIAGRAM – MD DIGITAL BOARD –

6-12. PRINTED WIRING BOARD – UCOM BOARD –

6-13. SCHEMATIC DIAGRAM – UCOM BOARD –

6-14. PRINTED WIRING BOARDS – AUDIO SECTION –

6-15. SCHEMATIC DIAGRAM – AUDIO SECTION –

6-16. PRINTED WIRING BOARD – PANEL BOARD –

6-17. SCHEMATIC DIAGRAM – PANEL BOARD –

6-18. PRINTED WIRING BOARDS – POWER SECTION –

6-19. SCHEMATIC DIAGRAM – POWER SECTION –

6-20. IC BLOCK DIAGRAMS

6-21. IC PIN FUNCTION DESCRIPTION

7-1. OVERALL SECTION

EXPLODED VIEWS

7-2. FRONT PANEL SECTION

7-3. CHASSIS SECTION-1

7-4. CHASSIS SECTION-2

7-5. CD MECHANISM DECK SECTION (TN-CCD1001Z)

7-6. CD MECHANISM DECK SECTI – FRONT BRACKET SECTION (TN-CCD1001Z)

7-7. CD MECHANISM DECK SECTION – BASE SECTION (TN-CCD1001Z)

7-8. CD MECHANISM DECK SECTION – CHASSIS SECTION (TN-CCD1001Z)

7-9. MD MECHANISM DECK SECTION-1 (MDM-7B4M)

7-10. MD MECHANISM DECK SECTION-2 – (MDM-7B4M)

ELECTRICAL PARTS LIST

REVISION HISTORY