SONY GT262 Service Manual
CDX-505RF/EXCD-3RF
US Model
SERVICE MANUAL
Ver 1.1 2001.08
Photo: CDX-505RF
Model Name Using Similar Mechanism NEW
CD Drive Mechanism Type
Optical Pick-up Name
Canadian Model
CDX-505RF/EXCD-3RF
AEP Model
UK Model
E Model
CDX-505RF
MG-250A-137
KSS-521A/J2RP
CD changer
System Compact disc digital audio system
Laser Diode Properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a distance of 200
mm from the objective lens surface on the Optical Pick-
up Block.
Frequency response 10-20,000 Hz
Wow and flutter Below than the measurable limit
Signal-to-noise ratio 94 dB
Outputs terminals BUS control output terminal (8 pin)
Analog audio output terminal (RCA pin)
Current drain 800 mA (at playback)
800 mA (at disc loading/ejecting)
Operating temperature
–10 ºC to +55 ºC (14 ºF to 131 ºF)
Dimensions Approx. 262 × 90 × 181.5 mm
(12 1/8 × 3 5/8 × 7 1/8 in.) (w/h/d)
Mass Approx. 2.1 kg (4 lb. 10 oz.)
SPECIFICATIONS
Hideaway unit / Wired remote (RM-X57) (CDX-505RF) / Wired
remote (RM-X64) (EXCD-3RF) / Wireless remote (RM-X58)
(CDX-505RF ONLY)
Frequency 88.3 MHz/88.5 MHz/
88.7 MHz/88.9 MHz/
89.1 MHz/89.3 MHz/
89.5 MHz/89.7 MHz/
89.9 MHz/ (switchable)
Dimension Hideaway unit :
Approx. 124.8 × 30.0 × 99.8 mm
(5 × 1 3/16 × 4 in.) (w/h/d)
Wired remote:
Approx. 148 × 30 × 15 mm
(5 7/8 × 1 3/16 × 9/32 in.) (w/h/d)
Wireless remote:
Approx. 38.4 × 6.4 × 84.4 mm
(1 9/16 × 9/32 × 3 3/8 in.) (w/h/d)
Mass Hideaway unit:
Approx. 330 g (11.64 oz.)
Wired remote:
Approx. 120 g (4.2 oz.)
Wireless remote:
Approx. 20 g (0.7 oz.)
Supplied accessories
Disc magazine (1)
Parts for installation and connections (1 set)
Lithium battery (CR2025) (1)
Design and specifications subject to change without notice.
COMPACT DISC CHANGER SYSTEM
9-925-526-12 Sony Corporation
2001H0500-1 e Vehicle Company
C 2001.8 Shinagawa Tec Service Manual Production Group
SERVICING NOTES
TABLE OF CONTENTS
1. GENERAL
Installation ......................................................................... 4
Connections ....................................................................... 5
Location and Function of Controls .................................... 8
2. DISASSEMBLY............................................................ 9
3. ELECTRICAL ADJUSTMENTS ........................... 15
4. DIAGRAMS
4-1. Printed W iring Board – RF Section –................................ 17
4-2. Schematic Diagram – RF Section –................................... 19
4-3. Schematic Diagram – MAIN Section –............................. 23
4-4. Printed W iring Board – MAIN Section – .......................... 27
4-5. IC Pin Function Description.............................................. 33
5. EXPLODED VIEWS ................................................... 35
6. ELECTRICAL PARTS LIST .................................... 41
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE !
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
– 2 –
SECTION 1
GENERAL
This section is extracted from
CDX-505RF’s instruction manual.
DISC MAGAZINE GETTING OUT PR OCEDURE ON THE
POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) assy to arrow direction.
2) Removal the magazine assy.
Note: T ake out the magazine only when the tray is completely within
the magazine. If the disk or tray is sticking out, turn on the
power and eject the magazine.
Lever (stop) ass’y
Magazine ass’y
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
– 3 – – 4 –
– 5 – – 6 –
– 7 –
– 8 –
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER), FRONT PANEL ASS’Y
1
screw
(PTT2.6 × 6)
3
lever (FL)
1
screw
(PTT2.6
×
6)
1
screw
(PTT2.6
×
6)
2
case (upper)
3
1
screw
(PTT2.6
lever (FL)
×
6)
MECHANISM DECK
1
two dampers (250)
4
front panel ass’y
2
spring (FL)
1
screw
(PTT2.6 × 6)
4
mechanism deck
2
spring (FL)
3
jack flexible board
(CN901)
– 9 –
1
two dampers (250)
JACK BOARD
Remove the jack board of
the arrow.
1
screw
(BVTT2.6 × 5)
2
jack board
MAIN BOARD
5
two screws
(P2 × 2.5)
1
main flexible board
(CNJ12)
6
three screws
(ground)
4
heat sink
7
main board
2
connector
(CNP301)
3
screw
(B2 × 3)
– 10 –
ELEVATOR MOTOR ASS’Y (M104)
screw
1
(P2 × 2.2)
2
bracket (ELV motor)
3
elevator motor ass’y
ESCUTCHEON
2
Remove the claw
of the arrow A.
4
Remove the ditch
of the arrow B.
5
Remove the escutcheon
of the arrow C.
B
A
4
C
ditch
1
3
screw
(M2 × 3)
two claws
– 11 –
CASE (UPPER) ASS’Y
1
three screws
(B2
×
3)
4
Remove the case
(upper) ass’y of the
arrow B.
1
screw
(B2 × 3)
2
B
A
3
Remove the edge
of the arrow
A
.
1
two screws
(B2 × 3)
CHASSIS ASS’Y
3
chassis ass‘y
1
polyethylene washer
2
2
1
two polyethylene washers
– 12 –
RF BOARD
5
connector
(CNP52)
2
two screws
(P2 × 2.5)
1
OP flexible board
(CNJ11)
3
5
two screws
×
3)
(P2
4
RF board
two connectors
(CNP11, 503)
SLED MOTOR ASS’Y (M102), OPTICAL PICK-UP (KSS-521A/J2RP)
2
sled motor ass‘y
4
Turn at the direction of the
arrow, then remove
shaft (sled) ass‘y
1
two screws
(P2 × 3)
3
optical pick-up
(KSS-521A/J2RP)
– 13 –
SW BOARD, SPINDLE MOTOR ASS’Y (M101)
8
two screws
(P1.7
×
2.2)
1
screw
×
2.2)
(P2
2
SW board
7
3
spring (chucking)
6
5
bracket (CP)
9
Remove the spindle motor ass‘y (M101)
of the arrow.
4
retainer (disc)
screw
(P2 × 2.2)
CHUCKING MOTOR ASS’Y (M103)
3
bracket
(load motor)
2
two screws (P2 × 2.5)
1
connector
(CNP51)
4
chucking motor ass‘y
(M103)
– 14 –
SECTION 3
n
ELECTRICAL ADJUSTMENTS
• FOCUS GAIN ADJUSTMENT
(COARSE ADJUSTMENT)
This adjustment is to be performed when replacing the following
parts.
• Optical Pick-up Block
• RV14
Procedure:
[RF BOARD] – Conductor Side –
CNJ12
IC51
RV14
IC11
1. Set RV14 (RF board) to the standard position.
2. Check that there is not an abnormal amount of operation noise
(white noise) from the 2-axis devise. If there is, turn RV14
slightly clockwise.
• When gain is lowered...
The set does not play because of no focus operation.
• When gain is highered...
Operation noise is heard due to a scratch or a dust, then operation will be unstable.
[RF BOARD] – Conductor Side –
MIN side
(low gain)
MAX side
(high gain)
RV14 standard positio
– 15 – – 16 –
• IC Block Diagrams
IC101 CXD2530Q
TES6
VDD
VSS
EXCK
79 78
80
77
NC
81
82
VSS
VDD
83
NC
84
85
TES7
86
NC
VSS
87
XVDD
88
XTAI
89
XTAO
90
91
XVSS
92
VSS
NC
93
TES8
94
NC
95
VDD
96
97
VSS
98
NC
NC
XRST
99
100
TIMING
LOGIC
SBSO
SCOR
76 75 74
INTERFACE
WFCK
TES5
EMPH
73 72
EFM
DEMODULATOR
SUB CODE
PROCESSOR
CPU
71
DOUT
70
C4M
69 68
FSTT
XTSL
CORRECTOR
SERVO
AUTO
SEQUENCER
MNT0
MNT1
66 65 64
67
ERROR
16K RAM
MNT3
XROF
63 62
C2PO
RFCK
61
INTERFACE
DIGITAL OUT
GFS
60
D / A
XPCK
XUGF
GTOP
59 58
DIGITAL CLV
VDD
57
VSS
TES4
56 55 54
BCK
TES3
PCMD
535251
ASYMMETRY
CORRECTOR
DIGITAL
PLL
OSC
CLOCK
GENERATOR
TES9
LRCK
50
49
WDCK
48
ASYE
47
ASYO
ASYI
46
BIAS
45
RF
44
AVDD
43
42
CLTV
AVSS
41
40
FILI
39
FILO
PCO
38
VCTL
37
V16M
36
35
VCKI
34
VPCO1
33
VPCO2
32
TES1
31
TES0
1 234
VDD
VSS
56789 10
TES2
LMUT
RMUT
IC204 BA8272F-E2
VCC
BUS ON
LINK OFF
CLK OUT
GND
BUS ON IN
11
5 6 7
4
VREF
BUS CLK
14 13 12
2 3
1
BUS ON OUT
CKOUT
DATA OUT
10
BUS DATA
SQCK
SQSO
SENS
DATA
DATA IN
12 13
11
XLAT
RESET
89
RESET
SWITCH
BUS RESET
CLOK
14
SEIN
15 16 17
CNIN
DATO
XLTO
18 19 20
CLKO
SPOA
SPOB
21
SPOC
22 23
SPOD
XLON
FOK
24
VDD
25 26 27
VSS
MON
28 29 30
MDP
MDS
LOCK
PWMI
– 31 –
IC301 BA6287F
1
OUT1
IC401 TC9404FN-EL
SH
LRCK
BCK
8
GND
DATA
ATT
HS
(SM)
20
21222324
LA
(BS)
VDXXOXI
(EMP)
19 18 17 16 15 14 13
GNDX
MCK
VM
VCC
FIN
INTERFACE
CIRCUIT
2
DRIVER DRIVER
TSD
3
POWER
SAVE
4
CONTROL LOGIC
7
OUT2
DIGITAL FILTER CIRCUIT
ATTENUATOR OPERATIONAL CIRCUIT
6
VREF
5
RIN
DEEMPHASIS FILTER CIRCUIT
D-∆ MODULATION CIRCUIT
TEST
CIRCUIT
2 3
1
T1
VDD
MICROCOMPUTER
INTERFACE
CIRCUIT
OUTPUT
CIRCUIT
ANALOG
FILTER
5 6 7 8 9
4
RO
P/S
VDA
GNDA
VR
OSC
TIMING
GENERATOR
OUTPUT
CIRCUIT
ANALOG
FILTER
GNDA
10
11
12
LO
VDA
ZD
GNDD
– 32 –
SECTION 6
DIAGRAMS
4-5. IC PIN FUNCTION DESCRIPTION
MAIN BOARD IC302 CXP84124-066Q (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Function
1 LIM.SW I Input of limit switch
2 BUSON I Input of Bus on control signal from SONY bus interface (IC204) “H”: Bus on
3 EJECT I Input of EJECT key (SW303) “H”: Eject on
4 LOAD 1 I Input of LOAD OUT switch
5 LOAD 2 I Input of LOAD IN switch
6 A.MUTE O Output of audio output mute on/off control signal “H”: Mute on
7 EMPH O Output of emphasis mode for disc playing “L”: on
8 CH.R O
Output of control signal to
9 CH.F O
10 ——Not used
11 ELV.R O Output of control signal to elevator motor drive (IC301)
12 ELV.ON O Output of mechanical deck power supply control signal “H”: on
13 CD RST O Servo system resetting
14 CD ON O Output of servo power supply control signal “H”: on
15 GBON — Not used
16 EEON — Not used
17-23 ——Not used
24 TEST1 I
25-29 ——Not used
30 RESET I Input of system reset signal “L”: Reset
31 EXTAL I Input of system clock (8 MHz)
32 XTAL O Output of system clock (8 MHz)
33 VSS — Ground pin
34 TX — Not used
35 TEX I Connected to ground
36 AVSS — Ground pin of A/D converter
37 AVREF I Input of A/D converter reference voltage
38 ATRIBT I Selection of custom file, D-BASS, etc.
39 MCK I Input of signal for fine adjustment of elevator position
40 EHS I Input of elevator position (RV302)
41 HTMP — Not used
42 ——Not used
43 MODE1 O Output of D-BASS control signal Not used
44 MODE2 O Output of D-BASS control signal Not used
45 MODE3 O Output of D-BASS control signal Not used
46, 47 ——Not used
48 SCK O Output of serial clock signal from SONY bus interface (IC204)
49 SI I Input of serial data signal from SONY bus interface (IC204)
50 SO O Output of serial data signal to SONY bus interface (IC204)
the chucking motor drive (IC52)
Automatic adjustment selection “L”: Automatic adjustment “H”: Manual adjustment (Solder across
the BP302 terminal)
CH.R L H H
CH.F H L H
FWD REV Brake
Forward : Load chucking
Reverse : Save
– 33 –
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