SONY DSC W200 Diagram

DSC-W200
SERVICE MANUAL
Ver. 1.2 2008.06
Revision History
Revision History
How to use
How to use
Acrobat Reader
Acrobat Reader
Internal memory
Internal memory
ON BOARD
ON BOARD
Link
Link
SERVICE NOTE
PRINTED WIRING BOARDS
LEVEL 3
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Japanese Model
Tourist Model
REPAIR PARTS LIST
SCHEMATIC DIAGRAMS
Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.
DIGITAL STILL CAMERA
DSC-W200_L3
Sony EMCS Co.
2008F0800-1
© 2008.06
Published by Kohda TEC9-852-201-11
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type.
CAUTION
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges.
2. Check the interboard wiring to ensure that no wires are "pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. FLEXIBLE Circuit Board Repairing
Keep the temperature of the soldering iron around 270°C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40°C higher than
ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
DSC-W200_L3
— 2 —

TABLE OF CONTENTS

Section Title Page
1. SERVICE NOTE
1-4. Method for Copying or Erasing the Data in Internal
Memory (Internal Memory/Music) ································· 1-3
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. Schematic Diagrams ························································4-2 4-3. Printed Wiring Boards ··················································· 4-16 4-4. Mounted Parts Location ················································ 4-24
5. REPAIR PARTS LIST
5-2. Electrical Parts List ························································· 5-8
DSC-W200_L3
— 3 —
1. SERVICE NOTE
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
(INTERNAL MEMORY/MUSIC)
The data can be copied/erased by the operations on the Setup screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-178 board, erase the data in internal memory of the board before replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “Memory Stick Duo”.
1 Insert a “Memory Stick Duo” having 64 MB or larger capacity. 2 Select [Copy] with / / / on the control button, then press .
The message “All data in internal memory will be copied” appears.
3 Select [OK] with , then press .
Copying starts.
To cancel the copying
Select [Cancel] in step 3, then press .
•Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in [ Internal Memory Tool ] .
•When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied.
Yo u cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be copied.
•Even if you copy data, a DPOF (Print order) mark is not copied.
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Format
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1 Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be erased Ready?” appears.
2 Select [OK] with v, then press z.
The format is complete.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
Method for Formatting the Music
Format Music
If you cannot play back a Music file for the Slide Show, the Music file might be corrupted. If this happens, perform [Format Music]. When [Format Music] is performed, all the Music files are erased. Use the supplied software “Music Transfer” to activate [Download Music].
1 Select [OK] with v on the control button, then press z.
The message “All data will be erased Ready?” appears.
2 Select [OK] with v, then press z.
All the Music files are erased.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
DSC-W200_L3
1-3
Link
Link
4-2. SCHEMATIC DIAGRAMS
CD-705 FLEXIBLE BOARD (CCD IMAGER)
SY-178 BOARD (1/8) (DC/DC CONVERTER)
SY-178 BOARD (2/8) (POWER/ENABLE SIG CONTROLLER)
SY-178 BOARD (3/8) (CAMERA DSP, MODE CONTROL)
SY-178 BOARD (4/8) (CAMERA DSP, LENS CONTROL, FRONT CONTROL)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
SY-178 BOARD (5/8) (CCD SIGNAL PROCESS, TIMING GENERATOR)
SY-178 BOARD (6/8) (LENS DRIVER)
SY-178 BOARD (7/8) (OPTICAL IMAGE STABILIZATION DRIVE)
SY-178 BOARD (8/8) (AUDIO, VIDEO AMP)
DSC-W200_L3
4-2. SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS (In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in µF unless otherwise noted. pF : µ µF. 50 V or less are not indicated except for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted. k=1000 , M=1000 k.
• Caution when replacing chip parts. New parts must be attached after removal of chip. Be careful not to heat the minus side of tantalum capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example C541 L452
22U 10UH TA A 2520
Kinds of capacitor
External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX indicate that they are not used. In such cases, the unused circuits may be indicated.
•Parts with differ according to the model/destination. Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic curve B, unless otherwise noted.
• Signal name XEDIT EDIT PB/XREC PB/REC
2: non flammable resistor
5: fusible resistor
C: panel designation
A: B+ Line
B: B– Line
J : IN/OUT direction of (+,–) B LINE.
C: adjustment for repair.
A: not use circuit
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the measurement points and ground when camera shoots color bar chart of pattern box. They are reference values and reference waveforms. (VOM of DC 10 M input impedance is used)
•Voltage values change depending upon input impedance of VOM used.)
1. Connection
Pattern box
Pattern box PTB-450 J-6082-200-A or Small pattern box PTB-1450 J-6082-557-A
L = 24 cm (PTB-450) L = 11 cm (PTB-1450)
Pattern box
Color bar chart
L
For PTB-450: J-6020-250-A
For PTB-1450: J-6082-559-A
Front of the lens
Camera
2. Adjust the distance so that the output waveform of Fig. a and the Fig. b can be obtain.
H
Yellow
Cyan
White
Magenta
Green
AABBA=B
Fig. a (Video output terminal output waveform)
Fig.b (Picture on monitor TV)
Red
Blue
Electronic beam scanning frame
CRT picture frame
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments for the camera section.
• As the imager may be damaged by static electricity from its structure, handle it carefully like for the MOS IC. In addition, ensure that the receiver is not covered with dusts nor exposed to strong light.
DSC-W200_L3
When indicating parts by reference number, please include the board name.
The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.
Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifie.
4-2
1
2
3
4
56
7
8
9
10
11
12
:Voltage measurement of the CSP ICs
CD-705 FLEXIBLE BOARD
A
CCD IMAGER
and the Transistors with mark,are not possible.
Voltage of IC002 and IC003 can not
Note:
be measured, because they are mounted by the side of the lens.
XX MARK:NO MOUNT
LND045
LND044
LND043
B
C
D
SY-178
(5/8)
CN301
PAGE 4-8
of LEVEL3
E
F
G
LND042
LND041
LND040
LND039
LND038
LND037
LND036
LND035
LND034
LND033
LND032
LND031
LND030
LND029
LND028
LND027
LND026
LND025
LND024
LND023
LND022
LND021
LND020
LND019
LND018
LND017
LND016
LND015
LND014
LND013
LND012
LND011
LND010
LND009
LND008
LND007
LND006
LND005
LND004
LND003
LND002
LND001
CAM_VL_CD
CAM_VH_CD
HGND
LH1
HGND
HGND
HGND
H2A
H1B
H1A
HGND
HGND
CONT
VGND
VHLD1
CSUB
VHLD2
SHT
VGND
VGND
VGND
V1A
V1B
V3A
V3B
V3C
V5A
V5B
V5C
V6S1
V6S2
VST2
VST1
TEST
VGND
VGND
AGND
AGND
CCD_OUT
CCD_GND
AGND
45
44
43
RG
42
41
40
39
38
37
36
35
34
33
32
LV
31
30
29
28
27
26
25
24
23
22
21
V2
20
19
18
V4
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
LV
VHLD1
VHLD2
V1A
V1B
V2
V3A
V3B
V3C
V4
V5A
V5B
V5C
V6S1
V6S2
VST2
VST1
C007
0.1u
C003
0.22u
C005
0.1u
C008
0.22u
VST1
VST2
LV
26
AGND
LH1
27
28
AGND
29
HGND
30
VDD2
31
CSUB
24RG25
23
NC
VDD
22
VOUT
21
32H333
CONT
34
H2
H1
35VL36
37
LV
NC
VHLD1
VHLD2
SUB
VHLD1
38
VHLD2
39
40
IC003
CCD IMAGER
IC003
ICX612CQZ-13
AGND
20
VST1
19
VST2
18
V5C
12
V5B
V5AV4V3C
V5A13V5B14V5C15V6S1
V3B
V3AV2V1B
V6S2
NC
16
17
V6S2
V6S1
5
V1A
V1A6V1B7V28V3A9V3B10V3C11V4
3
VGND
1
TEST
2
NC4VOG
H
I
08
DSC-W200_L3
IN
1
GND
2
R006
0
OUT
3
IC002
HIGH SPEED BUFFER AMP
CXA3691EN-T9
IC002
ISF
VCC
IDRV
C006
0.01u
6
R007 180k
5
4
C001
0.01u
R003 220k
4-3

CD-705

Ver. 1.1 2007.05
• Refer to page 4-2 for mark 0.
1
SY-178 BOARD(1/8)
A
DC/DC CONVERTER
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
B
C
D
(8/8)
(3/8)
(4/8)
2
(8/8)
(3/8)
@001
@002
@003
E
F
@004
G
(2/8)
H
(2/8) (5/8)
@005
I
(3/8) (4/8) (6/8)
(7/8) (8/8)
@006
(2/8)
J
(2/8) (3/8) (4/8) (5/8)
(6/8) (7/8) (8/8)
(4/8) (6/8) (7/8) (8/8)
K
ACV_UNREG
BATT_UNREG
XACV_DET
XACV_IN
REG_GND
BL_H
BL_L
BL_EN1
BL_EN2
EVER_PSB
VSU_EN
DDC5PSW_EN
CAMDD_EN
DDC2P9_EN
MAX_5.0V
DDC1P8_EN
DDC1P2_EN
DISW2P9_EN
DISW1P8_EN
D_3.0V
A_3.0V
16
ST_UNREG
UNREG
TI_5.0V
DDCPV_EN
17
(3/8)
(2/8)
(2/8) (3/8) (4/8) (5/8)
@007
(2/8)
CAM_12V
CAM_-7.5V
D_1.2V
EVER_3.0V
(5/8)
(3/8) (4/8)
(2/8)
1.2V_INT
D_1.8V
(2/8) (4/8) (7/8)
R038 2200
0
3.0
DDR_1.8V
SW_1P8_EN
(4/8)
@008
LDO_1P8_EN
(2/8)
3.0
5.0
3
0.5
6
R074 4700
3.0
1
2
1.9
15
R075
47k
6
5
2
1
4
1.8
DTC144TMT2L
1.8V SELECT SW
C037
XX
Q012
C063
0.0047u
0
3
R037 220k
P_GND
10
SW
9
PS
8
LBI
7
VBAT
6
L008
4.7uH
D010
MA2SD32008S0
D_1.2V
12
IC002
DC/DC CONVERTER
IC002
SN0510064DRCR
P_PAD
11
C027
4.7u
L009
4.7uH
C028
C024
22u
10u
IC003
1.8V REG IC003
TK63718AB1G0B
C046
13
3.7
EN
1
5.0
VOUT
2
FB
3
LBO
4
C032
GND
C030
4.7u
C026
1u
R028
22u
2.2u
5
R030
R031 120k
C044
4.7u
24k
R029 100k
3.0
1.2
C034
C061
0.1u
0.1u
B2
Vin
Vcont
A2
GND
A1
TI_5.0V
C033
47u 10V
20k
VOLTAGE DETECTOR
Vin
4
Vsen
3
Vout
1411
5.0
0.5
IC007
IC007
XC6108C10BGR
Vss
5
1.8V SELECT SW
B1
Q014
SSM6E01TU
SW
4
5
1
2
Vout
NC
Q010
SCH1302-TL-E
C035
4.7u
10
1u
C016
3.7
12.0
12.0
3.7
30
31
32
33
PG2
LXLED
LXBST
SWBST
IC001
DC/DC CONVERTER
IC001
MAX8611VETM+TG069
1.8
3.0
L006
4.7uH
C048
10u
D007
MA2SD32008S0
C021 10u
1.0
0
26
27
28GD29
25
FBINV
FBBST
PVBST
SEQCCD
0
1.0
3.7
3.0
D_1.8V
R019
47k
C018
1u
C019
22u
Q007
MCH6604-K-TL-E
1.8V/3.0V DISCHARGE
C020
0
2
22u
C022
10u
CCAUX
ONBST
DRVAUX
ONAUX
R020
100
3.1
L002
4.7uH
FBAUX
LXINV
PVINV
PGSD
LXSD
ONSD
PVSD
C047
22u
3.7
3.0
3.7
R042 680k
R049
51k
R024 2700
24
CAM_-7.5V
23
3.0
22
-7.5
21
5.0
20
19
PG1
18
17
1.2
16
3.7
15
14
3.7
13
R022
56k
R021
100
1.9
6
3
0
5
1
4
R050
C009
C008
4.7u
47u
R014
7
0
XX
C011
MA2SD32008S0
Q006
3LN01SS-TL
SW
R015
0.2
R016
100k
C012
22u
D006
C010
22u
A_3.0V
27
20
0.22u
3
R002 470k
R003
1M
MA2SD32008S0
5.1 5.1
4
MAZS120008SO
C004
1u
2.5
D002
MA2SD32008S0
D003
Q003
SSM6E01TU
5V LOAD SW
4
5
1
2
ACV POWER SELECT SW
D004
R009 470k
0
3
0.60.6
6
R008 470k
R005
3.0
47k
5
Q013
FDW2508PB
3.8
2 3 7 6
Q004
SSM3K03FE(TPL3)
ACV DETECT SW
C060
0.22u
6
:Voltage measurement of the CSP ICs and the Transistors with mark,are not possible.
F001
(0.8A/32V)
0
4
1
8
5
0
R012 330k
R013
82k
R010
R011
47k
F002
(2A/32V)
C057
4.7u
1M
MAX_5.0V
C062
10u
C050
47u
L007
2.4uH
C001
22u
8
MA2SD32008S0
L001 22uH
0.2
0.4
1.0
1.3
0.4
5.0
5.0
3.7
3.8
D011
37
38
39
40
41
42
43
44
45
0
46
47
48
49
FBLLED
FBHLED
REXT
REF
GND
FBSU
SU
PVSU
BATT
ONSU
LXSU
PGSU
EP(PAD)
9
L004
4.7uH
CAM_12V
C013
1u
L003
4.7uH
BL_H
3.7
3.7
34
35
36
PVLED
ONLED
SWLED
ONINV2FBM3ONM4PVM5LXM6PGM7PGAFE8LXAFE9PVAFE10ONAFE11FBAFE12FBSD
1
0
0
1.003.1
C015
1u
D_3.0V
L005
4.7uH
R017
68k
C014
10u
R018
33k
18
L
08
DSC-W200_L3
4-4

SY-178 (1/8)

1
2
SY-178 BOARD(2/8)
A
POWER/ENABLE SIG CONTROLLER
XX MARK:NO MOUNT
NO MARK:REC/PB MODE R:REC MODE P:PB MODE
3
4
5
:Voltage measurement of the CSP ICs and the Transistors with mark,are not possible.
6
7
8
9
10
12
13
1411
15
16
(1/8)
@009
EVER_3.0V
UNREG
TI_5.0V
VSU_EN
EVER_PSB
BL_EN1
BL_EN2
DDC5PSW_EN
CAMDD_EN
SW_1P8_EN
LDO_1P8_EN
REG_GND
XPWR_ON
DIRECT_PB
XDD_SYS_RST
XMS_IN
USB_VBUS
D102
MA2SD32008S0
R119 470k
2
Q101
UP04216008S0
MEMORY STICK /USB DETECT
CL125
03.0
6
3
4
1
3.1
R103
R104
R102 470k
0
0
00
5
VOLTAGE DETECTOR
S-80822CNPF-B8HTFG
Out
1
Vss
2
R125
1k
C119
0.0022u
R105
47k
IC103
IC103
CL106
CL107
VDD
NC
XPOWER_ON0
B8
XPOWER_ON1
A8
XPOWER_ON2
B7
N.C.
A7
N.C.
B6
N.C.
A6
MS_IN
C6
EXT_IN
B5
XSYS_RST
B4
XNAND_RST
C4
TESTPIN
A3
TESTPIN
B3
GND
A4
BACK_UP_VCC
A5
N.C.
A2
XRESET_REQ
A1
R116
R114
47k
BACK_UP_VCC
H7
VSU_EN
CL110
C105
0.047u
CL109
G6
J7
TESTPIN
DDC1P8_AD
DDC2P9_AD
(RESET)
CL112
R109 100k
CL111
H6
TESTPIN
BACK_UP_VCC
R110 100k
TESTPIN
32KHZ_IN
32KHZ_OUT
DDC2P9_EN
DDC1P8_EN
DDC1P2_EN
XUSB_JACK
DDCPV_EN
D_1.8V
C106
0.1u
VSS
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
C109
0.0047u
X101
32.768kHz
CL113
J6
H4
J4
J5
H5
H1
G2
G1
F1
F2
F3
E9
E8
D9
D8
C9
C107
0.1u
R112
10M
R113
68k
3.7
4
3
C117
0.1u
R121 220k
H2
LDO1P8_EN
R120 220k
F9
F7
D7
J1
XRSTX
BL_EN2
SW1P8_EN
DDC5PSW_EN
POWER/ENABLE SIG CONTROLLER
MB89083LGA-G-133-ERE1
G8
F8
BL_EN1
AF_LED0
IC101
IC101
H9
H8
AVCCG9AVSS
BAAT_SENS
C116 0.1u
J8
J9
EVER_PSB
47k
R126
C110
47u
6.3V
0
0.0022u
C114
D101
MA2SD32008S0
VSS
1
3.1
VCH
2
2.8
VBAT
3
3.0
CS
4
IC102
BACKUP POWER REG
NJU7287ARB1(TE2)
R117
470
IC102
R118
33
VRO
VOUT
XRESET
VL_3V
EVER_3.0V
3.0
8
5.0
7
6
5
C108
C111
0.1u
3.0
3.0
XX
VIN
VL_3V
D_3.0V
(3/8)
(1/8)
D_1.8V
C112
12p
2
4
C113
1
3
12p
DDC2P9_EN
DDCPV_EN
@005
(1/8) (5/8)
@007
(1/8)
CAMDD_ENB1PANEL_ENC2DISW1P8_ENC1DISW2P9_END3N.C.D1FR_SID2FR_SOE1FR_SCKE2XCS_EXH3MOD0J3VCIJ2CPOG4MOD1A9CSB9XPOWER_OFF
B2
1800
0
0.1u
R107
R106
C103
8200
R108
0.01u
C104
DDC1P2_RESET
C8
CL124
CL122
1.2V_INT
XPWR_OFF
(1/8)
@015
(3/8)
B
C
D
(1/8)
@004
(1/8)
(4/8)
@008
(8/8)
@010
@011
E
F
G
(3/8) (4/8) (5/8) (7/8)
H
(8/8)
@012
I
J
K
08
DSC-W200_L3
(3/8) (7/8)
@013
(3/8)
@014
IC211_0_SO
IC211_0_SI
XIC211_0_SCK
XCS_FR
CL101
CL118
CL119
CL120
4-5
CL123
XIC211_RST_REQ
DDC1P8_EN
DDC1P2_EN
DISW2P9_EN
DISW1P8_EN
@016
(3/8)
@006
(1/8)

SY-178 (2/8)

1
SY-178 BOARD(3/8)
A
CAMERA DSP MODE CONTROL
XX MARK:NO MOUNT
NO MARK:REC/PB MODE R:REC MODE P:PB MODE
2
B
D_3.0V
C
(1/8)
D
E
D_1.2V
F
G
H
I
GEN_SYS_CLK
@017
J
(4/8)
@016
XIC211_RST_REQ
(2/8)
K
L
@011
M
(2/8) (4/8) (5/8) (7/8)
XDD_SYS_RST
N
REG_GND
D_3.0V
0.1u
ST-168
FLEXIBLE
LND001-LND016
PAGE 4-14 of LEVEL2
2017
3
C211
0.1u
C212
0.1u
C213
0.1u
D_1.2V
C214
0.1u
C215
0.1u
C216
0.1u
C217
0.1u
R225
0
C227
XX
CL208
C201
4
IC211(1/5) IC211(2/5)
CAMERA DSP, LENS CONTROL,
V4
V5
R4
R5
B16
L14
AE24
AF24
AB22
AC23
AC4
Y7
AD1
AD2
AC1
AC2
T10
T11
U10
U11
P10
P11
R10
R11
T12
T13
U12
U13
K16
K17
L16
L17
K15
L15
M16
M17
N16
N17
A20
B20
D21
E21
A22
B22
Y12
AB18
W12
G10
K19
L19
B2
C2
D2
E2
A3
B3
IOVDD
IOVDD
GND
GND
IOVDD
GND
IOVDD
IOVDD
GND
GND
GND
GND
COREVDD
COREVDD
GND
GND
COREVDD
COREVDD
COREVDD
COREVDD
GND
GND
GND
GND
GND
GND
GND
GND
COREVDD
COREVDD
COREVDD
COREVDD
GND
GND
GND
GND
GND
GND
COREVDD
COREVDD
COREVDD
COREVDD
GND
GND
CLK_SYS_IN
XRESET
XRESET_REQ
SIR_RXD
SCLK
SDATA
XRESET
FLMD0
VDD
P14_RXD6
ANIO_P20
P10
FRONT CONTROL
UPD79F0043FC-401-2N1-E2-A
C205
1u
D_3.0V
56
:Voltage measurement of the CSP ICs and the Transistors with mark,are not possible.
IC211 (1/5) IC211 (2/ 5) PRX515101B
D1
E1
A2
P11
VDD
P121_X1
IC201
DSC CONTROL
IC201
REGCD3VSSE3P13_TXD6A4AVSSB4AVREFC4P16
C3
GPS_14
GPS_13
GPS_12
GPS_11
GPS_10
GPS_09
GPS_08
GPS_07
GPS_06
GPS_05
GPS_04
GPS_03
GPS_02
GPS_01
GPS_00
GPE_15
GPE_14
GPE_13
GPE_12
GPE_11
GPE_10
GPE_09
GPE_08
GPE_07
GPE_06
GPE_05
GPE_04
GPE_03
GPE_02
GPE_01
GPE_00
UART0_TXD
UART0_RXD
UART0_CTS
UART0_RTS
UART1_TXD
UART1_RXD
UART1_CTS
UART1_RTS
SID0_SCK
SIO0_SCS
SIO0_TXD
SIO0_RXD
SIO1_SCK
SIO1_TXD
SIO1_RXD
SIO2_SCK
SIO2_TXD
SIO2_RXD
SIO3_SCK
SIO3_TXD
SIO3_RXD
TPU0_OUT
TPU1_OUT
TPU2_OUT
TPU3_OUT
TPU0_INA
TPU0_INB
B1
C1
A1
P120_INTP0
P122_X2_EXCLK
P15
P144_SOA0
P143_SIA0
P142_XSCKA0
P30_INTP1
Y19
W7
Y20
V7
W19
V8
V19
U8
U19
U7
W20
P19
T19
N19
R19
T7
R8
R7
T8
H11
P8
H10
N8
H9
G9
K8
M8
J8
L8
H8
G8
J19
D20
H19
C26
G19
D26
E20
D25
G17
A23
H17
A24
H18
B24
G18
B23
E18
B25
D19
C25
E19
E15
G14
G15
H15
G16
H16
P17
AVREF
TXRX
C228
0.047u
E5
D5
C5
B5
A5
E4
D4
R226
R227
R228 0
R212
10k
CL222
CL219
XCS_IC201
C229
0.047u
0
0
XIC211_1_SCK
IC211_1_SO
IC211_1_SI
C220
0.1u
XCS_IC201
IC211_1_SI
IC211_1_SO
XIC211_1_SCK
MAZS068008SO
7
R213 3300
R214 3300
D201
XHD_EN
XCS_AUDIO
XCS_PANEL
TEST
XAE_LOCK_SW
XSHUT_SW
MS_PWR_ON
VSUB_CONT_PRE
MSHUT_DIR
XLENS_DRIVER_PS
XCS_IC503
XIC211_IC503_RST
XACC_IN
XACV_IN
XFC_RST_LED
XZM_RST_LED
XZM_FG_LED
XPWR_OFF
IC211_1_UO
IC211_1_UI
BOOT_MODE3
XCS_FR
XIC211_0_SCK
IC211_0_SO
IC211_0_SI
XIC211_2_SCK
IC211_2_SO
XCS_FE
XCS_TG
XIC211_3_SCK
IC211_3_SO
IC211_3_SI
8
@018
@019
@020
@022
@015
(1/8) (8/8)
(4/8)
@021
@023
@024
@025
@026 @002 @027
@028
@014
@013
@029
@030
(2/8)
(8/8)
(4/8)
(8/8)
(8/8)
(8/8)
(1/8)
(6/8)
(8/8)
(2/8)
(2/8) (7/8)
(4/8) (8/8)
(5/8)
BATT_UNREG
(5/8)
(6/8)
(7/8)
9
R723 820
CL-271HR-C-TS
(MS ACCESS)
(5/8)
10
D706
L211
CAM_3.5V
BATT_UNREG
BATT_SIG
REG_GND
CAM_3.5V
R224
XX
LND704
LND705
LND706
10uH
BT-037
FLEXIBLE
LND001-LND003
PAGE 4-15
of LEVEL2
12 19
B12
L13
D_3.0V
C225
0.1u
A12
K13
C226
XX
E8
D8
R215
R216
100
620
W1
V1
AA4
AB2
AA2
C223
AB4
0.1u
AB1
C222
22u
6.3V
Y2
W4
Y4
AB5
W2
W5
C224
0.1u
E22
E23
D23
D22
F22
H13
AB15
AB16
A21
B21
D15
H14
13
CAMERA DSP, LENS CONTROL,
FRONT CONTROL
PRX515101B
MS_IOVDD
GND
MSX_IOVDD
GND
SD_IOVDD
GND
RREF
NC
GNDS
AVDD1
AGND1
AVDD2
AGND2
AVDD3
AGND3
ADVDD
AGND
DVDD
DVSS
BOOT_MODE_4
BOOT_MODE_3
BOOT_MODE_2
BOOT_MODE_1
BOOT_MODE_0
TEST
EXT_CK_PLL2
EXT_CK_PLL3
EXT_SEL_1
EXT_SEL0
PLL_BYPASS
PCV
1411
Note : IC211 is not supplied,
but this is included in SY-178 complete board.
B10
MS_BS
A9
MS_B_3
B11
MS_B_2
A10
MS_B_1
B9
MS_B_0
A11
MS_CLK
MSX_BS
MSX_B_3
MSX_B_2
MSX_B_1
MSX_B_0
MSX_CLK
SD_CLKOUT
SD_CMD
SD_DAT_3
SD_DAT_2
SD_DAT_1
SD_DAT_0
SD_WP
SD_XCD
USB_ID
USB_VBUS_EN
SA_TDO
SA_TD1
NTRST
JTAG_SEL1
JTAG_SEL0
VBUS
RTCK
DM
TDI
TCK
TMS
TDO
DP
A14
A13
B14
B13
A15
B15
D11
E10
D10
E11
D9
E9
E12
D12
AA5
Y5
V2
Y1
AA1
U4
U5
D13
G11
E13
G12
G13
D14
E14
H12
@033
(4/8)
@034
(4/8)
(1/8)
(1/8)
FB230
FB231
FB232
FB233
FB234
CL220
CL221
CL211
CL212
CL213
CL214
CL215
CL216
CL217
CL218
(2/8)
XAE_LOCK_LED
VL_3V
ST_UNREG
TI_5.0V
STRB_ON1
XSTRB_LED
MAX_5.0V
R217
R218
R219
R220
R221
R222
15
100
150
150
150
150
150
Q711 SSM3J09FU(TE85L) AF LOCK LED SW
0
3.1
3.1
AF LOCK LED SW
R769
10k
16
MSX_BS
MSX_D3
MSX_D2
MSX_D1
MSX_D0
MSX_CLK
USB_DP
USB_DM
Q713
DTC114EMT2L
R733
1800
R735 7500
@031
(8/8)
@032
(8/8)
R701
D707
MA2SD32008S0
R767
68
1.6
R730
C726
100k
100p
5.0 5.0
0
2
220
R731
820
Q712
SSM3J09FU(TE85L)
STRBE LED SW
000
3.1
3.1
Q714
R770
DTC114EMT2L
10k
STRBE LED SW
6
3
0
5
R734
Q704
1
4
EMX1T2R
AF LED DRIVE
0
R732
R768
68
5.0
2SA2029T2LQ/R
AF LED DRIVE
15
15
1.7
0.15.0
Q710
18
CN714 16P
REG_GND
16
VL_3V
15
ST_UNREG
14
ST_UNREG
13
TI_5.0V
12
STRB_ON
11
STB_CHG_CNT
10
STRB_CHG
9
XSTRB_FULL
8
D_3.0V
7
XAE_LOCK_LED
6
XSTRB_LED
5
AF_5.0V
4
XAF_LED
3
REG_GND
2
REG_GND
1
O
08
DSC-W200_L3
4-6

SY-178 (3/8)

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