Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
CAUTION
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1.Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4.Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.Check the B+ voltage to see it is at the values specified.
6.FLEXIBLE Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
DSC-W200_L3
— 2 —
TABLE OF CONTENTS
SectionTitlePage
1.SERVICE NOTE
1-4. Method for Copying or Erasing the Data in Internal
5-2. Electrical Parts List ························································· 5-8
DSC-W200_L3
— 3 —
1. SERVICE NOTE
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
(INTERNAL MEMORY/MUSIC)
The data can be copied/erased by the operations on the Setup screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-178 board, erase the data in internal memory of the board before replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “Memory Stick Duo”.
1 Insert a “Memory Stick Duo” having 64 MB or larger capacity.
2 Select [Copy] with / / / on the control button, then press .
The message “All data in internal memory will be copied” appears.
3 Select [OK] with , then press .
Copying starts.
To cancel the copying
Select [Cancel] in step 3, then press .
•Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in
[ Internal Memory Tool ] .
•When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied.
Yo u cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be
copied.
•Even if you copy data, a DPOF (Print order) mark is not copied.
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Format
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1 Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be erased Ready?” appears.
2 Select [OK] with v, then press z.
The format is complete.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
Method for Formatting the Music
Format Music
If you cannot play back a Music file for the Slide Show, the Music file might be corrupted. If
this happens, perform [Format Music].
When [Format Music] is performed, all the Music files are erased. Use the supplied software
“Music Transfer” to activate [Download Music].
1 Select [OK] with v on the control button, then press z.
The message “All data will be erased Ready?” appears.
2 Select [OK] with v, then press z.
All the Music files are erased.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
DSC-W200_L3
1-3
Link
Link
4-2. SCHEMATIC DIAGRAMS
CD-705 FLEXIBLE BOARD (CCD IMAGER)
SY-178 BOARD (1/8) (DC/DC CONVERTER)
SY-178 BOARD (2/8)
(POWER/ENABLE SIG CONTROLLER)
SY-178 BOARD (3/8)
(CAMERA DSP, MODE CONTROL)
SY-178 BOARD (4/8)
(CAMERA DSP, LENS CONTROL, FRONT CONTROL)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
SY-178 BOARD (5/8)
(CCD SIGNAL PROCESS, TIMING GENERATOR)
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in µF unless otherwise noted. pF : µ
µF. 50 V or less are not indicated except for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
kΩ=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
ExampleC541L452
22U10UH
TA A2520
Kinds of capacitor
External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
•Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic
curve B, unless otherwise noted.
• Signal name
XEDIT → EDITPB/XREC → PB/REC
• 2: non flammable resistor
• 5: fusible resistor
• C: panel designation
• A: B+ Line
• B: B– Line
•J : IN/OUT direction of (+,–) B LINE.
• C: adjustment for repair.
• A: not use circuit
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the
measurement points and ground when camera shoots
color bar chart of pattern box. They are reference values
and reference waveforms.
(VOM of DC 10 MΩ input impedance is used)
•Voltage values change depending upon input
impedance of VOM used.)
1. Connection
Pattern box
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
L = 24 cm (PTB-450)
L = 11 cm (PTB-1450)
Pattern box
Color bar chart
L
For PTB-450:
J-6020-250-A
For PTB-1450:
J-6082-559-A
Front of the lens
Camera
2. Adjust the distance so that the output waveform of
Fig. a and the Fig. b can be obtain.
H
Yellow
Cyan
White
Magenta
Green
AABBA=B
Fig. a (Video output terminal output waveform)
Fig.b (Picture on monitor TV)
Red
Blue
Electronic beam
scanning frame
CRT picture frame
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
DSC-W200_L3
When indicating parts by reference number, please
include the board name.
The components identified by mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro
spécifie.
4-2
1
2
3
4
56
7
8
9
10
11
12
:Voltage measurement of the CSP ICs
CD-705 FLEXIBLE BOARD
A
CCD IMAGER
and the Transistors with mark,are
not possible.
Voltage of IC002 and IC003 can not
Note:
be measured, because they are mounted
by the side of the lens.
XX MARK:NO MOUNT
LND045
LND044
LND043
B
C
D
SY-178
(5/8)
CN301
PAGE 4-8
of LEVEL3
E
F
G
LND042
LND041
LND040
LND039
LND038
LND037
LND036
LND035
LND034
LND033
LND032
LND031
LND030
LND029
LND028
LND027
LND026
LND025
LND024
LND023
LND022
LND021
LND020
LND019
LND018
LND017
LND016
LND015
LND014
LND013
LND012
LND011
LND010
LND009
LND008
LND007
LND006
LND005
LND004
LND003
LND002
LND001
CAM_VL_CD
CAM_VH_CD
HGND
LH1
HGND
HGND
HGND
H2A
H1B
H1A
HGND
HGND
CONT
VGND
VHLD1
CSUB
VHLD2
SHT
VGND
VGND
VGND
V1A
V1B
V3A
V3B
V3C
V5A
V5B
V5C
V6S1
V6S2
VST2
VST1
TEST
VGND
VGND
AGND
AGND
CCD_OUT
CCD_GND
AGND
45
44
43
RG
42
41
40
39
38
37
36
35
34
33
32
LV
31
30
29
28
27
26
25
24
23
22
21
V2
20
19
18
V4
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
LV
VHLD1
VHLD2
V1A
V1B
V2
V3A
V3B
V3C
V4
V5A
V5B
V5C
V6S1
V6S2
VST2
VST1
C007
0.1u
C003
0.22u
C005
0.1u
C008
0.22u
VST1
VST2
LV
26
AGND
LH1
27
28
AGND
29
HGND
30
VDD2
31
CSUB
24RG25
23
NC
VDD
22
VOUT
21
32H333
CONT
34
H2
H1
35VL36
37
LV
NC
VHLD1
VHLD2
SUB
VHLD1
38
VHLD2
39
40
IC003
CCD IMAGER
IC003
ICX612CQZ-13
AGND
20
VST1
19
VST2
18
V5C
12
V5B
V5AV4V3C
V5A13V5B14V5C15V6S1
V3B
V3AV2V1B
V6S2
NC
16
17
V6S2
V6S1
5
V1A
V1A6V1B7V28V3A9V3B10V3C11V4
3
VGND
1
TEST
2
NC4VOG
H
I
08
DSC-W200_L3
IN
1
GND
2
R006
0
OUT
3
IC002
HIGH SPEED BUFFER AMP
CXA3691EN-T9
IC002
ISF
VCC
IDRV
C006
0.01u
6
R007
180k
5
4
C001
0.01u
R003
220k
4-3
CD-705
Ver. 1.1 2007.05
• Refer to page 4-2 for mark 0.
1
SY-178 BOARD(1/8)
A
DC/DC CONVERTER
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
B
C
D
(8/8)
(3/8)
(4/8)
2
(8/8)
(3/8)
@001
@002
@003
E
F
@004
G
(2/8)
H
(2/8) (5/8)
@005
I
(3/8) (4/8) (6/8)
(7/8) (8/8)
@006
(2/8)
J
(2/8) (3/8) (4/8) (5/8)
(6/8) (7/8) (8/8)
(4/8) (6/8) (7/8) (8/8)
K
ACV_UNREG
BATT_UNREG
XACV_DET
XACV_IN
REG_GND
BL_H
BL_L
BL_EN1
BL_EN2
EVER_PSB
VSU_EN
DDC5PSW_EN
CAMDD_EN
DDC2P9_EN
MAX_5.0V
DDC1P8_EN
DDC1P2_EN
DISW2P9_EN
DISW1P8_EN
D_3.0V
A_3.0V
16
ST_UNREG
UNREG
TI_5.0V
DDCPV_EN
17
(3/8)
(2/8)
(2/8) (3/8)
(4/8) (5/8)
@007
(2/8)
CAM_12V
CAM_-7.5V
D_1.2V
EVER_3.0V
(5/8)
(3/8) (4/8)
(2/8)
1.2V_INT
D_1.8V
(2/8) (4/8) (7/8)
R038
2200
0
3.0
DDR_1.8V
SW_1P8_EN
(4/8)
@008
LDO_1P8_EN
(2/8)
3.0
5.0
3
0.5
6
R074
4700
3.0
1
2
1.9
15
R075
47k
6
5
2
1
4
1.8
DTC144TMT2L
1.8V SELECT SW
C037
XX
Q012
C063
0.0047u
0
3
R037
220k
P_GND
10
SW
9
PS
8
LBI
7
VBAT
6
L008
4.7uH
D010
MA2SD32008S0
D_1.2V
12
IC002
DC/DC CONVERTER
IC002
SN0510064DRCR
P_PAD
11
C027
4.7u
L009
4.7uH
C028
C024
22u
10u
IC003
1.8V REG
IC003
TK63718AB1G0B
C046
13
3.7
EN
1
5.0
VOUT
2
FB
3
LBO
4
C032
GND
C030
4.7u
C026
1u
R028
22u
2.2u
5
R030
R031
120k
C044
4.7u
24k
R029
100k
3.0
1.2
C034
C061
0.1u
0.1u
B2
Vin
Vcont
A2
GND
A1
TI_5.0V
C033
47u
10V
20k
VOLTAGE DETECTOR
Vin
4
Vsen
3
Vout
1411
5.0
0.5
IC007
IC007
XC6108C10BGR
Vss
5
1.8V SELECT SW
B1
Q014
SSM6E01TU
SW
4
5
1
2
Vout
NC
Q010
SCH1302-TL-E
C035
4.7u
10
1u
C016
3.7
12.0
12.0
3.7
30
31
32
33
PG2
LXLED
LXBST
SWBST
IC001
DC/DC CONVERTER
IC001
MAX8611VETM+TG069
1.8
3.0
L006
4.7uH
C048
10u
D007
MA2SD32008S0
C021
10u
1.0
0
26
27
28GD29
25
FBINV
FBBST
PVBST
SEQCCD
0
1.0
3.7
3.0
D_1.8V
R019
47k
C018
1u
C019
22u
Q007
MCH6604-K-TL-E
1.8V/3.0V DISCHARGE
C020
0
2
22u
C022
10u
CCAUX
ONBST
DRVAUX
ONAUX
R020
100
3.1
L002
4.7uH
FBAUX
LXINV
PVINV
PGSD
LXSD
ONSD
PVSD
C047
22u
3.7
3.0
3.7
R042
680k
R049
51k
R024
2700
24
CAM_-7.5V
23
3.0
22
-7.5
21
5.0
20
19
PG1
18
17
1.2
16
3.7
15
14
3.7
13
R022
56k
R021
100
1.9
6
3
0
5
1
4
R050
C009
C008
4.7u
47u
R014
7
0
XX
C011
MA2SD32008S0
Q006
3LN01SS-TL
SW
R015
0.2
R016
100k
C012
22u
D006
C010
22u
A_3.0V
27
20
0.22u
3
R002
470k
R003
1M
MA2SD32008S0
5.15.1
4
MAZS120008SO
C004
1u
2.5
D002
MA2SD32008S0
D003
Q003
SSM6E01TU
5V LOAD SW
4
5
1
2
ACV POWER SELECT SW
D004
R009
470k
0
3
0.60.6
6
R008
470k
R005
3.0
47k
5
Q013
FDW2508PB
3.8
2
3
7
6
Q004
SSM3K03FE(TPL3)
ACV DETECT SW
C060
0.22u
6
:Voltage measurement of the CSP ICs
and the Transistors with mark,are
not possible.