SONY DSC-T70, DSC-T75 Service Manual Level 3
DSC-T70/T75
SERVICE MANUAL
Ver. 1.0 2007.08
Revision History
Revision History
Internal memory
Internal memory
ON BOARD
ON BOARD
Photo: Silver
Link
Link
SERVICE NOTE
SCHEMATIC DIAGRAMS
LEVEL 3
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Japanese Model
Tourist Model
REPAIR PARTS LIST
MODEL INFORMATION TABLE
The components identified by
mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
PRINTED WIRING BOARDS
DIGITAL STILL CAMERA
DSC-T70/T75_L3
Sony EMCS Co.
2007H0800-1
© 2007.08
Published by Kohda TEC9-852-216-11
Model information table
Model
Destination
US, CND, AEP, UK, E, AUS,
HK, CH, KR, AR, BR, J, JE
DSC-T70
AEP, UK, E, KR
HD Output
Adaptor Cable
•Abbreviation
AR : Argentine model
AUS: Australian model
BR : Brazilian model
CH : Chinese model
CND: Canadian model
EE : East European model
HK : Hong Kong model
J: Japanese model
JE : Tourist model
KR : Korea model
MX : Mexican model
NE : North European model
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
CAUTION
DSC-T75
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. FLEXIBLE Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
DSC-T70/T75_L3
— 2 —
1. SERVICE NOTE
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
The data can be copied/erased by the operations on the HOME screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-183 board, erase the data in internal memory of the board before replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “Memory Stick Duo”.
1 Insert a “Memory Stick Duo” with sufficient capacity.
2 Touch [Copy].
The message “All data internal memory will be erased” appears.
3 Touch [OK].
Copy starts.
To cancel the copying
Touch [Cancel] or [BACK] in step 3.
•Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in
[ Internal Memory Tool ] .
•When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied.
You cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be
copied.
•Even if you copy data, a DPOF (Print order) mark is not copied.
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Format
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1
Touch [Format].
The message “All data internal memory will be copied” appears.
2
Touch [OK].
The format is completed.
To cancel the formatting
Touch [Cancel] or [BACK] in step 2.
DSC-T70/T75_L3
1-3
1-5. HOW TO WRITE DATA TO INTERNAL MEMORY
Usually, the camera has been set so as to disable the data writing from the PC to the internal memory of the camera.
This setting must be changed temporarily when the data is to be written to the internal memory such as a case after the board replacement.
To change the setting, use the write enable tool “WriteEnableTool.exe”.
Data writing method
1) Connect the PC to the camera (USB mode: Mass Storage), and switch the driver to the “Sony Seus USB Driver”.
2) Start the Write Enable Tool and the SeusEX.
3) Click the [Activate Write Enable Mode] button of the Write Enable Tool.
4) Upon completion of the setting change, the following message will be displayed.
5) Return the driver to the original one, and connect the PC to the camera (USB mode: Mass Storage).
6) Write the data read out into the PC to the internal memory of the camera.
7) Disconnect the PC from the camera, and turn off the camera.
Note: By turning off the camera, the write enable setting is reset.
DSC-T70/T75_L3
1-4
Link
Link
4-2. SCHEMATIC DIAGRAMS
CD-710 FLEXIBLE BOARD (CCD IMAGER)
SY-183 BOARD (1/10) (DC/DC CONVERTER)
SY-183 BOARD (2/10)
(BATTERY AUTHENTICATION/CLOCK GENERATOR)
SY-183 BOARD (3/10)
(CPU (SIGNAL PROCESS 1))
SY-183 BOARD (4/10)
(CPU (SIGNAL PROCESS 2))
SY-183 BOARD (5/10)
(CPU (SIGNAL PROCESS 3))
COMMON NOTE FOR SCHEMATIC DIAGRAMS
SY-183 BOARD (6/10)
(CCD SIGNAL PROCESS)
SY-183 BOARD (7/10) (LENS DRIVE)
SY-183 BOARD (8/10) (OIS DRIVE)
SY-183 BOARD (9/10) (AUDIO/VIDEO AMP)
SY-183 BOARD (10/10) (CONNECTOR)
DSC-T70/T75_L3
4-2. SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in µF unless otherwise noted. pF : µ
µF. 50 V or less are not indicated e xcept for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
kΩ=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example C541 L452
22U 10UH
TA A 2520
Kinds of capacitor
External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
•Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors ha ve characteristic
curve B, unless otherwise noted.
• Signal name
XEDIT → EDIT PB/XREC → PB/REC
• 2: non flammable resistor
• 5: fusible resistor
• C: panel designation
• A: B+ Line
• B: B– Line
• J : IN/OUT direction of (+,–) B LINE.
• C: adjustment for repair.
• A: not use circuit
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the
measurement points and ground when camera shoots
color bar chart of pattern box. They are reference values
and reference waveforms.
(VOM of DC 10 MΩ input impedance is used)
•Voltage values change depending upon input
impedance of VOM used.)
1. Connection
Pattern box
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
L = 24 cm (PTB-450)
L = 11 cm (PTB-1450)
Pattern box
Color bar chart
L
For PTB-450:
J-6020-250-A
For PTB-1450:
J-6082-559-A
Front of the lens
Camera
2. Adjust the distance so that the output wavefor m of
Fig. a and the Fig. b can be obtain.
H
Yellow
Cyan
White
Magenta
Green
AABBA=B
Fig. a (Video output terminal output waveform)
Fig.b (Picture on monitor TV)
Red
Blue
Electronic beam
scanning frame
CRT picture frame
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
DSC-T70/T75_L3
When indicating parts by reference number, please
include the board name.
The components identified by mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro
spécifie.
4-2
1 86
2
3
4
57
Note :
IC001 (CCD imager) and CD-710 flexible complete board
are not supplied, but there are included in CCD block assy.
A
9
10IN11
12
B
Pin
LND039
39
LND038
38
37
LND037
LND036
LND035
LND034
LND033
LND032
LND031
C
SY-183
(6/10)
CN301
PAGE 4-9
of LEVEL3
D
E
LND030
LND029
LND028
LND027
LND026
LND025
LND024
LND023
LND022
LND021
LND020
LND019
LND018
LND017
LND016
LND015
LND014
LND013
LND012
LND011
LND010
LND009
LND008
LND007
LND006
LND005
LND004
3
LND003
2
LND002
1
LND001
VST1
VST2
V10
V9
V8
V7
V6
V5B
V5A
V4
V3B
V3A
V2
V1
CAM_-7.5V
SUB
power_save
CD_GND
CD_GND
CCD_OUT
CD_GND
CD_GND
CD_GND
CAM_13V
CD_GND
VHLD2
VHLD1
LV
SUB_CONT
CD_GND
CD_GND
LH1
CD_GND
H3
H2
H1
CD_GND
RG
CD_GND
CAM_-7.5
SUB
P_S
CCD_OUT
VST1
VST2
V10
V5B
V5A
V3B
V3A
VHLD2
VHLD1
13
R006 0
V9
V8
V7
V6
V4
V2
V1
LV
HL1
H3
H2
H1
RG
14
15
16
17
NC
OUT
GND
DRVCNT
GND
NC
CXA3741UR-T9
HIGH SPEED BUFFER AMP
1
C007
1005
16V
0.01u
GND
GND
IC002
SFCNT2IDRV03IDRV14GND
C009
1005
0.01u
R010 150k
R009470k
16V
ISF1
ISF0
VCC
8
NC
R007 150k
7
6
5
C008
16V
0.01u
1005
B
R008 390k
C001
16V
0.01u
1005
SUB_CONT
B
Note:Voltage of IC001 and IC002 can not be measured,
because there are mounted by the side of the lens.
V8V7V6
11
12
V7
V8
VSS23NC
22
C010
0.1u
16V
1005
V5B
9
10
V6
V5B
IC001
IC X636EQZ-H
CCD IMAGER
CSUB25SUB_CONT26DGND
24
C
C011
0.22u
16V
1608
V9
V10
VST2
VST1
V9
13
V10
14
VST2
15
VST1
16
NC
17
VOUT
18
VDD
19
RG
20
AGND
21
C003
0.22u
16V
B
1608
B
V5AV4V3B
6
7V48
V5A
LH1
27
28
V3A
5
V3B
H129H2
V3A
SUB
VHLD2
VHLD1
V2
V1
VL
NC
LV
H3
C005
0.1u B
10V
1005
A
4
3
2
1
34
33
32
31
30
V2
V1
B
VHLD2
VHLD1
LV
C
D
E
F
08
DSC-T70/T75_L3
4-3
F
CD-710 FLEXIBLE BOARD
CCD IMAGER
CD-710
• Ref er to page 4-2 for mark 0.
1
ACV_UNREG
A
CHARGE_V
CHARGE_V
XACV_DET
B
XACV_IN
REG_GND
XPWR_ON
C
3.1
C055
0.1u
B
10V
1
VDD
IC002
TK60011CS8
SHUTTER DOOR DETECT
XIC_211_RST_REQ
E
F F
G
2 8
R001
470k
R002
D001
1M
MA2SD32008S0
D002
MA2SD32008S0
R069
0
0603
R068
XX
XPWR_ON
0
2
OUT
GND
3
XDIRECT_PB
XPWR_OFF
MS_PWR_ON
XDD_SYS_RST
XIC_211_0_SCK
IC_211_0_SO
10V
1u
C052
VL_3V
USB_VBUS
XMS_IN
BATT_SENS
XCS_DD
IC_211_0_SI
B
R046
100k
0
XLV_ON
0
Q004
2SK3019TL
B+ SWITCH
XDIRECT_PB
XPWR_OFF
XIC_211_RST_REQ
USB_VBUS
XMS_IN
MS_PWR_ON
BATT_SENS
XDD_SYS_RST
XCS_DD
XIC_211_0_SCK
IC_211_0_SI
IC_211_0_SO
C001
1u
MAZS120008SO
R004
470k
2.7
3
D003
SSM3K03FE(TPL3)
0
R059
XX
BATT_SENS
4.1
Q001
SWITCH
5
ACV_UNREG
0
4
4.1
2
1
3
4.0
7
6
5
0
8
Q002
FDW2508PB
SWITCH
D004
MA2SD32008S0
470
R005
VL_3V
R058
F001
(0.8A/32V)
F002
(2A/32V)
5.0
MCH3306-TL-E-S
5.0
10u
C007
XX
R008
4700
C002
4.7u
R056
XX
C005
C009
0.001u
1u
10u
C003
C010
R013
C011
12p
1M
1u
C004
C008
47u
L001
10V
4.3uH
B
10V
B
6.3V
4
3
X001
10p
32.768kHz
C013
4.7u
25V
C014
0
Q003
B+ SWITCH
D006
MA2ZD02001SO
R016
10M
R015
330k
12
XX
R057
D007
MA2SD32008S0
0.01u
R009
33k
ST_UNREG
L002
10uH
C016
DDC5_VO_1
J2
DDC5_VO_2
K2
DDC5_LX_1
J3
DDC5_LX_2
K3
DDC5_PG_1
J4
DDC5_PG_2
K4
LDO3P1U_IN
H4
LDO3P1U_OUT
J5
RTCBAT
H5
OSCI
K6
OSCO
K7
AGND_1
J6
CLK_OUT_32K
H6
DDC12_RF
J7
DDC12_INM
H7
DDC12_VFB
H8
UNREG_MON
F6
UNREG
G6
DDC12_PWR_IN1
G8
DDC12_PWR_IN2
G7
DDC12_PWR_OUT_1
J8
DDC12_PWR_OUT_2
K8
DDC12_LX_1
J9
DDC12_LX_2
K9
DDC12_PG
H9
10u
J10
L003
H
08
6
C018
220p
E6
K1
J1
H2
H3
TRIM_EN
DDC5_RF
DDC5_INM
LDO3P4_OUT
DDCM7P5_LX
DDCM7P5_PWRF8DDCM7P5_VFBG9DDCM7P5_REFE8DDCM7P5_INME9DDCM7P5_RF
H10
XX
47k
4.7uH
R053
R024
MA2SD32008S0
1M
D008
4.7u
C020
C017
1u
4.7u
B
C019
XX
R054
(0.63A/32V)
DGND
10V
B
F003
H1
R025
10u
C023
F5
G2
DDC5_PSW
DDC5_LDOUT
DDCBL_PG
G10
F10
0.0047u
MA2SD32008S0
C021
10uH
L004
1u
C022
MS_PWR_ON
C024
10u
F4
G3
MS_PWR_IN
MS_PWR_ON
LDO3P1E_OUT
DC/DC CONVERTER
DDCBL_LXF9DDCBL_VO
DDCBL_VLF7DDCBL_RSE7VBUS_IN
E10
D009
C025
4.7u
22u
C026
XX
R048
F2
G1
F3
DDC2P9_VFB
MS_PWR_OUT
IC001
SC901572VOR2
D10
0.5%
R029
10
4.7u
C027
USB_VBUS
CAM_13V
XMS_IN
7 12
L006
22uH
CL009
M_5.0V
22u
C029
L005
10uH
E2
E1
D1
F1
DDC2P9_LH_1
DDC2P9_LH_2
DDC2P9_PG_3
DDC2P9_VO_1
DDC2P9_VO_2
XMS_ING5XEXT_IND9XPWR_ON3D8XPWR_ON2D7XPWR_ON1
C10
XX
1k
R032
R031
C028
0
R070
0.01u
C057
CL008
XPWR_ON
XDIRECT_PB
XLV_ON
25V
C056
0.1u
B
C034
22u
6.3V
C
XX
R047
4.7u
6.3V
B
C031
10k
C2
C1
B1
D2
D3
E3
DDC2P9_LL_1
DDC2P9_LL_2
DDC2P9_PG_2
DDC2P9_PG_2
XPWR_OFFD6XRESET_REQD5XNAND_RESETC9XSYS_RESETC7SOC6SIC8SCKC5XCE
1k
XIC_211_RST_REQ
XPWR_OFF
0.01u
C058
XDD_SYS_RST
R062
XX
DDC2P9_PWR_1
DDC2P9_PWR_2
IC_211_0_SI
IC_211_0_SO
R035
100p
D4
E4
DDC2P9_RF
DDC2P9_INM
DDC1P2_INM
DDC1P2_RF
DDC1P2_VFB
DDC1P2_PWR
DDC1P2_LX
DDC1P2_PG
LDO1P5_OUT
LDO1P8_OUT
DDC1P8_PSW_IN
DDC1P8_VFB
DDC1P8_PWR
DDC1P8_LX
DDC1P8_PG
DDC1P8_INM
DDC1P8_RF
CL010
XIC_211_0_SCK
XCS_DD
C035
DEBUG
TEST1
LED_VCS
LED_PG
AGND_2
TEST2
VREF
NC
G4
NC
K5
K10
A1
220p
A2
C040
C3
B2
B3
A4
A3
C4
B4
IREF
A5
B5
E5
A6
A7
B7
B6
B8
A8
A9
B9
B10
A10
CAM_13V
CAM_-7.5V
BL_L
BL_H
R051
C038
R040
L008
10uH
L009
10uH
100k
0.5%
100pCH
XX
220p
C041
R049
XX
50V
911
6.3V
C042
B
4.7u
R050
XX
6.3V
6.3V
6.3V
B
22u
22u
C
C050
22u
C
C053
22u
C
C054
B
10u6.3V
C046
6.3V
C047
10u
B
C051
XX
R052
4.7u6.3V
C044
6.3V
B
XDD_SYS_RST
104
Q006
CAM_3.5V
MS_VCC
A_3.0V
REG_GND
D_3.0V
USB_3.1V
M_5.0V
5
XX
XDD_SYS_RST
D_1.2V
XAF_LED
D_1.5V
DDR_1.8V
D_1.8V
XDD_SYS_RST
R060
XX
XDD_SYS_RST
R063
220k
3.1
2
0
6
1
R066
XX
6
2
1
R064
68
1.8
3
5
0
MCH6604-K-TL-E
4
3.0V/1.8V DISCHARGE
Q005
R067
XX
3
4
SY-183 BOARD(1/10)
DC/DC CONVERTER
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
EVER
A
B
C
DD
E
G
H
DSC-T70/T75_L3
4-4
SY-183 (1/10)
1 86
2
3
4
57
A
CL202
D_3.0V
B
XDD_SYS_RST
C
REG_GND
R208
XX
R210
UPD79F0043FC-402-2N1-E2-A
BATTERY AUTHENTICATION
1k
C209
0.01u
IC202
XRESET
B2
FLMD0
C2
VDD
D2
P14_RXD6
E2
ANIO_P20
A3
P10
B3
E1
A2
P11
REGCD3VSSE3P13_TXD6A4AVSSB4AVREF
C3
C208
1u
D1
VDD
P121_X1
B1
C1
A1
P15
P120_INTP0
P122_X2_EXCLK
P142_XSCKA0
P16
C4
D_3.0V
C207
0.1u
P144_SDA0
P143_SIA0
AVREF
TXRX
P30_INTP1
P17
E5
D5
C5
B5
A5
E4
D4
D201
DF2S6.8CT(TL3SONY)
XCS_IC_202
IC_211_1_SI
IC_211_1_SO
XIC_211_1_SCK
BATT_SIG
A
B
C
D
IC201
C202
4.7u
R202
C201
XX
XX
R203
D_1.8V
XX
R211
E
D_3.0V
REG_GND
R209
D_1.8V
4V
C204
0.1u
XX
XX
C203
0.1u
1.9
1.9
1.0
R204
1005
33
ICS620AN-23LFT
CLOCK GENERATOR
8
VDD
GND
7
VDDO
6
SYS_OUT
5
GND
9
TG_OUT
ICLK
GEAR_ON
VDDO
4
1
C205
0.1u
10V
X201
36MHz
B
1005
1.0
1
1.5
2
3.1
3
1.9
4
3
2
C206
0.1u
10V
1005
B
GEN_TG_CLK
GEAR_ON
GEN_SYS_CLK
R207
R206
33
XX
D
E
SY-183 BOARD(2/10)
BATTERY AUTHENTICATION/
F
CLOCK GENERATOR
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
08
F
DSC-T70/T75_L3
4-5
SY-183 (2/10)
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