(Recommended Exposure
Index) set to Auto): approx. 0.1 to 3.0 m
(4 inches to 9 feet 10 1/8 inches) (W)/
approx. 0.25 to 2.5 m (9 7/8 inches to
8 feet 2 1/2 inches) (T)
[Input and Output connectors]
Multi connector
USB communication : Hi-Speed USB (USB 2.0
: Video output
Audio output (Monaural)
USB communication
compliant)
[LCD screen]
LCD panel: Wide (16:9), 7.5 cm (3.0 type) TFT drive
Total number of dots: 230 400 (960×240) dots
[Power, general]
Power: Rechargeable battery pack NP-BD1, 3.6 V
NP-FD1 (not supplied), 3.6 V
AC-LS5K AC Adaptor (not supplied), 4.2 V
Power consumption (during shooting): 1.0 W
Operating temperature: 0 to 40 ºC (32 to 104 ºF)
Storage temperature: –20 to +60 ºC(–4 to +140 ºF)
Dimensions: 90.0×56.4×20.7 mm (3 5/8×
2 1/4×27/32 inches) (W/H/D, excluding
protrusions)
Mass (including NP-BD1 battery pack, paint pen
2.2 W
Output voltage: DC 4.2 V, 0.33 A
Operating temperature: 0 to 40 ºC (32 to 104 ºF )
Storage temperature: –20 to +60 ºC (–4 to +140 ºF)
Dimensions: Approx. 62×24×91 mm (2 1/2×
31/32×3 5/8 inches) (W/H/D)
Mass: Approx. 75 g (2.7 oz)
Rechargeable battery pack NP-BD1
Used battery: Lithium-ion battery
Maximum voltage: DC 4.2 V
Nominal voltage: DC 3.6 V
Capacity : 2.4 Wh (680 mAh)
Design and specifications are subject to change
without notice.
DSC-T70/T75_L2
— 2 —
Page 3
Model information table
Model
Destination
US, CND, AEP, UK, E, AUS,
HK, CH, KR, AR, BR, J, JE
DSC-T70
AEP, UK, E, KR
HD Output
Adaptor Cable
•Abbreviation
AR : Argentine model
AUS: Australian model
BR : Brazilian model
CH : Chinese model
CND: Canadian model
EE : East European model
HK : Hong Kong model
J: Japanese model
JE: Tourist model
KR : Korea model
MX : Mexican model
NE : North European model
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
CAUTION
DSC-T75
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1.Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
4.Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.Check the B+ voltage to see it is at the values specified.
6.FLEXIBLE Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
DSC-T70/T75_L2
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
— 3 —
Page 4
ENGLISHJAPANESE
1. SERVICE NOTE
ENGLISHJAPANESE
1-1. PRECAUTION ON REPLACING THE SY-183 BOARD
DESTINATION DATA
When you replace to the repairing board, the written destination data of repairing board also might be changed to original setting.
Refer to Service Manual ADJ, and perform “DESTINATION DATA WRITE”.
USB SERIAL No.
The set is shipped with a unique ID (USB Serial No.) written in it.
This ID has not been written in a new board for service, and therefore it must be entered after the board replacement.
Refer to Service Manual ADJ, and perform “USB SERIAL No. INPUT”.
1-2. SELF-DIAGNOSIS FUNCTION
1-2-1. Self-diagnosis Function
When problems occur while the unit is operating, the self-diagnosis
function starts working, and displays on the LCD screen what to
do.
Details of the self-diagnosis functions are provided in the Instruction
manual.
LCD screen
Blinks at 3.2 Hz
0 0
Refer to “1-2-3. Self-diagnosis Code Table”.
Repaired by:
C : Corrected by customer
E : Corrected by service
engineer
3 2C
Block
Indicates the appropriate
step to be taken.
E.g.
13 ....Form a t t h e “ Memory Stick Duo”.
32 ....Turn o n power again.
1-2-2. Self-diagnosis Display
When problems occur while the unit is operating, the LCD screen
shows a 4-digit display consisting of an alphabet and numbers, which
blinks at 3.2 Hz. This 5-character display indicates the “repaired
by:”, “block” in which the problem occurred, and “detailed code”
of the problem.
Detailed Code
DSC-T70/T75_L2
1-1
Page 5
1-2-3. Self-diagnosis Code Table
Self-diagnosis Code
ENGLISHJAPANESE
ENGLISHJAPANESE
Function
Repaired by:
C
C
Block
13
32
Detailed
Code
01
01
Symptom/State
The internal memory has experienced a
format error.
“Memory Stick Duo” is unformatted.
“Memory Stick Duo” is broken.
“Memory Stick Duo” type error
The camera cannot read or write data
on the “Memory Stick Duo”.
Trouble with hardware
Format the internal memory.
Format the “Memory Stick Duo”.
Insert a new “Memory Stick Duo”.
Insert a supported “Memory Stick Duo”.
Turn the power off and on again, or taking out and inserting the
“Memory Stick Duo” several times.
Turn the power off and on again.
Retry turn the power on by the power switch. If it does not
E
61
00
Difficult to adjust focus
(Cannot initialize focus)
recover, check the focus reset sensor of lens block (pin ea of
CN401 on the SY-183 board). If it is OK, check the focus motor
drive IC (IC401 on the SY-183 board).
Retry turn the power on by the power switch. Check the zoom
reset sensor of lens block (pin wk of CN401 on the SY-183
board), if zooming is performed when the zoom button is
operated. If it is OK, check the zoom motor drive IC (IC401 on
Check or replacement of the IC for steadyshot (IC503 on the SY183 board).
Check or replacement of the IC for steadyshot (IC503 on the SY183 board).
Check the HALL element (PITCH) of optical image stabilizer
E
62
11
Lens overheating (PITCH).
(pin 1, 2 of CN401 on the SY-183 board). If it is OK, check
PITCH angular velocity sensor (SE502 on the SY-183 board)
peripheral circuits.
Check the HALL element (YAW) of optical image stabilizer (pin
E
62
12
Lens overheating (YAW).
6, 7 of CN401 on the SY-183 board). If it is OK, check YAW
angular velocity sensor (SE501 on the SY-183 board) peripheral
circuits.
E
E
E
62
91
92
20
01
00
Abnormality of thermistor.
Abnormality when flash is being charged.
Non-standard battery is used.
Check the OIS temp sensor of optical image stabilizer (pin 5 of
CN401 on the SY-183 board).
Checking of flash unit or replacement of flash unit. (Note)
Use the compatible battery only.
Note: After repair, be sure to perform “1-3. PROCESS AFTER FIXING FLASH ERROR”.
Correction
1-3. PROCESS AFTER FIXING FLASH ERROR
When “FLASH error” (Self-diagnosis Code E : 91 : 01) occurs, to prevent any abnormal situation caused by high voltage, settin g of the flash
is changed automatically to disabling charge and flash setting.
After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the HOME screen.
Method for Initializing the Flash Error Code
Initialize
Initializes the setting to the default setting. Even if you execute this function, the images
stored in the internal memory are retained.
1 Touch [Initialize].
The message “Initialize all settings” appears.
2 Touch [OK].
The settings are reset to the default setting.
To cancel the resetting
Touch [Cancel] or [BACK] in step 2.
•Make sure that the power is not disconnected during resetting.
DSC-T70/T75_L2
1-2
Page 6
ENGLISHJAPANESE
ENGLISHJAPANESE
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
The data can be copied/erased by the operations on the HOME screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-183 board, erase the data in internal memory of the board before replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “Memory Stick Duo”.
1 Insert a “Memory Stick Duo” with sufficient capacity.
2 Touch [Copy].
The message “All data internal memory will be copied” appears.
3 Touch [OK].
Copy starts.
To cancel the copying
Touch [Cancel] or [BACK] in step 3.
•Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in
[ Internal Memory Tool ] .
•When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied.
You cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be
copied.
•Even if you copy data, a DPOF (Print order) mark is not copied.
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Format
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1
Touch [Format].
The message “All data internal memory will be erased” appears.
2
Touch [OK].
The format is completed.
To cancel the formatting
Touch [Cancel] or [BACK] in step 2.
DSC-T70/T75_L2
1-3
Page 7
ENGLISHJAPANESE
ENGLISHJAPANESE
1-5. HOW TO WRITE DATA TO INTERNAL MEMORY
Usually, the camera has been set so as to disable the data writing from the PC to the internal memory of the camera.
This setting must be changed temporarily when the data is to be written to the internal memory such as a case after the board replacement.
To change the setting, use the write enable tool “WriteEnableTool.exe”.
Data writing method
1)Connect the PC to the camera (USB mode: Mass Storage), and switch the driver to the “Sony Seus USB Driver”.
2)Start the Write Enable Tool and the SeusEX.
3)Click the [Activate Write Enable Mode] button of the Write Enable Tool.
4)Upon completion of the setting change, the following message will be displayed.
5)Return the driver to the original one, and connect the PC to the camera (USB mode: Mass Storage).
6)Write the data read out into the PC to the internal memory of the camera.
7)Disconnect the PC from the camera, and turn off the camera.
Note: By turning off the camera, the write enable setting is reset.
• Make sure that the flat cable and flexible board are not cracked of bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
• When remove a connector, don’t pull at wire of connector. It is possible that a wire is snapped.
• When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
• Do not apply excessive load to the gilded fle xible board.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
DISCHARGING OF THE ST-172 BOARD’S CHARGING CAPACITORS (C901, C902)
The charging capacitors (C901, C902) of the ST-172 board is
charged up to the maximum 315 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by
the charged voltage which is kept without discharg ing when the
main power of the unit is simply turned off. Therefore, the
remaining voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of
a resistor of 1 kΩ /1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to
prevent electrical shock.
1 kΩ/1 W
Wrap insulating tape.
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the
short jig about 10 seconds.
To avoid the spark with the metal plate,
wrap the short jig with the insulation tape.
C902
C901
R:1 kΩ/1 W
(Part code: 1-215-869-11)
DSC-T70/T75_L2
2-1
Page 13
2-1. IDENTIFYING PARTS
SY-183 Board
MC-185 Flexible Board
Cabinet (Rear) Assy
Control Switch Block
(RL60570)
LCD Block
Battery Holder Assy
⋅ BT-039 Flexible Board
⋅ ST-172 Flexible Board
Cabinet (Front) Assy
- DISASSEMBLY FLOW -
2-2-1. OVERALL SECTION
- Cabinet (Front) Assy
- Cabinet (Rear) Assy
- LCD Block
2-2-2. SY-183 BOARD SECTION
- Lens Block
- MC-185 Flexible Board
- SY-183 Board
2-2-3. BATTERY HOLDER SECTION
- Flash Block
- BT-039 Flexible Board
- Battery Holder Assy
Lens Block
⋅ CD-710 Flexible Board
DSC-T70/T75_L2
2-2
Page 14
HELP
EXPLODED VIEW
HELP
2-2. DISASSEMBLY
2-2-1. OVERALL SECTION
Follow the disassembly in the numerical order given.
1 Cabinet (Front) Assy (1-1 to 1-9)
2 Cabinet (Rear) Assy (2-1 to 2-3)
3 LCD Block (3-1 to 3-4)
1-9
1-7
(#82)
3 LCD Block
3-1
3-2
3-3
2-2
2 Cabinet (Rear)
Assy
1-2
(#18/#29)
2-3
1-4
(Claws)
HARDWARE LIST
1-1
(#18/#29)
1-5
1-8
(Claws)
1-6
1-3
(#18/#29)
3-4
(Claws)
1 Cabinet (Front)Assy
2-1
(#18/#29)
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the
short jig about 10 seconds.
To avoid the spark with the metal plate,
wrap the short jig with the insulation tape.
DSC-T70/T75_L2
C902
C901
R:1 kΩ/1 W
(Part code: 1-215-869-11)
2-3
Page 15
EXPLODED VIEW
2-2-2. SY-183 BOARD SECTION
k
Follow the disassembly in the numerical order given.
1 Lens Block (1-1 to 1-2)
2 MC-185 Flexible Board (2-1 to 2-3)
3 SY-183 Board (3-1 to 3-3)
3 SY-183 Board
HARDWARE LIST
3-3
(Claw)
3-1
2-1
(#18/#29)
3-2
HELP
2-3
1-2
2-2
2 MC-185
Flexible Board
1-1
1 Lens Bloc
DSC-T70/T75_L2
2-4
Page 16
2-2-3. BATTERY HOLDER SECTION
EXPLODED VIEW
Follow the disassembly in the numerical order given.
( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
CN001
MULTI
CONNECTOR
BH001
BATTERY
TERMINAL
( )
BOARD
+
S
-
CONTROL SWITCH
BLOCK (RL60570)
D001
(POWER)
S002
POWER
S001
BOARD
SY-183 BOARD (1/2)MC-185 FLEXIBLE
F001
ACV_UNREG
23, 25
BATT_XEXT
19
CHARGE_V
17, 21
XPOWER_ON
77
BT-039 FLEXIBLE
BOARD
BATT_UNREGCHARGE_V
BATT_SIGBATT_SIG
BATT_GNDREG_GND
A
POWER (2/2)
(PAGE 3-4)
B
POWER (2/2)
(PAGE 3-4)
CN710
D_3.0V
5
XPWR_ONXPWR_ON
7
XDIRECT_PB
6
CN703
ACV_UNREG
34 - 3929 - 33
XACV_DET
10
CHARGE_V
XPWR_ON
CN704
7-10
6
1-5
XDD_SYS_RST
XIC_211_RST_REQ
XPWR_OFF
D002
Q001, 002
D001
IC202
BATTERY
AUTHENTICATION
(2/10)
P144_SOA0
P143_SIA0
TXRXE4
P142_XSCKA0
P120_INTP0
XRESETB2
D5
C5
XIC_211_1_SCK
B5
B1
IC_211_1_SI
IC_211_1_SO
XCS_IC_202
XACV_IN
D_3.0V
F002
C
POWER (2/2)
(PAGE 3-4)
F003
XDD_SYS_RST
XIC_211_RST_REQ
XDIRECT_PB
L004
XPWR_OFF
DDCBL_LX
F10
XSYS_RST
C9
XRESET_REQ
D6
C10
XPWR_OFF
XPWR_ON1
D7
XPWR_ON3
D9
DC/DC CONVERTER
IC001
(1/10)
MS_PWR_OUT
RTCBAT
DDC5_LX_1
DDC5_LX_2J3K3
DDC5_VO_1
DDC5_VO_2J2K2
LD03P1U_IN
DDC5_PSW
XPWR_ON2
LD03P1E_OUT
DDC1P8_LX
DDC1P8_VFB
DDC1P2_LX
DDC1P2_VFB
DDC12_LX_1
DDC12_LX_2J9K9
DDC12_PWR_OUT_1
DDC12_PWR_OUT_2J8K8
DDC12_VFB
DDCM7P5_LX
DDCM7P5_VFB F8
LD03P4_OUT H3
JD03P1U_OUT J5
LD01P5_OUT A6
LD01P8_OUT A7
DDCBL_VO F9
DDCBL_VL
DDC2P9_VO_1
DDC2P9_VO_2F1F2
DDC2P9_VFB
F3
H5
H4
H1
D8
F5
A8
B6
A4
B2
H8
J10
E10
G1
L001
L009
L008
XLV_ON
L002
D008
D006
B+ SWITCH
B+ SWITCH
D007
Q003
Q004
R008
IC002
SHUTTER DOOR DETECT
(1/10)
VDD 1
OUT
2
Q005
3.0V/1.8V
DISCHARGE
R005
D004
MS_VCC
L006
CN702
CN701
(2/2)
VL_3V
ST_UNREG
M_5.0V
EVER
D_1.8V
D_1.2V
CAM_13V
CAM_-7.5V
CAM_3.5V
USB_3.1V
D_1.5V
DDR_1.8V
BL_H
BL_L
D_3.0V
A_3.0V
9
2
MEMORY
STICK
DUO
ST-172 FLEXIBLE
BOARD (1/2)
BT001
LITHIUM
SECONDARY
BATTERY
E
POWER (2/2)
(PAGE 3-4)
MS_PWR_ON
G3
MS_PWR_ON
D
POWER (2/2)
(PAGE 3-4)
DSC-T70/T75_L2
3-3
Page 22
3-4. POWER BLOCK DIAGRAM (2/2)
( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
SY-183 BOARD (2/2)
ST_UNREG
CAM_13V
CAM_-7.5V
BL_H
BL_L
A_3.0V
D_3.0V
M_5.0V
CAM_3.5V
D_1.8V
E
POWER (1/2)
(PAGE 3-3)
D_1.2V
DDR_1.8V
EVEREVER
B
POWER (1/2)
(PAGE 3-3)
C
POWER (1/2)
(PAGE 3-3)
D
POWER (1/2)
(PAGE 3-3)
IC507
2.8V REG
A_3.0VIC_503_2.8V
D_1.8V
D_1.5VD_1.5V
D_3.0V
M_5.0V
(8/10)
4VOUT 3
VDD
CE
1
A
POWER (1/2)
(PAGE 3-3)
D_1.8V
D_3.0V
M_5.0V
L601
A_3.0V
D_3.0V
D_1.8V
D_1.2V
DDR_1.8V
XIC_211_RST_REQ
XPWR_OFF
XACV_IN
IC_211_1_SI
IC_211_1_SO
XIC_211_1_SCK
XCS_IC_202
MS_PWR_ON
R252
R253
L231
FB292
FB293
R255
XDD_SYS_RST
XIC_211_IC_503_RST
XDD_SYS_RST
H10
AB18
AU_AVCC
L211USB_3.1V
W12
G18
B24
H18
W20
T7
GPE_09
XRESET
IC211
CPU
(3/10)
(4/10)
(5/10)
XRESET_REQ
GPE_00G8
GPE_05K8
SIO1_RXD
SIO1_TXD
SIO1_SCK
GPS_04
GPE_15
AU_AVCC
GPS_13
IC503
OPTICAL
IMAGE
STABILIZATION
DRIVE
(8/10)
RESET_NA7
XDLA6
W7
D_3.0V
R712
D_1.8V
L602
D_1.8V
D_3.0V
M_5.0V
IC506
PITCH/YAW
SENSOR AMP
(8/10)
SE502
PITCH
SENSOR
SE501
YAW
SENSOR
IC601
AUDIO/VIDEO
AMP
(9/10)
D706
(MS ACCESS)
IC201
CLOCK
GENERATOR
(2/10)
D_1.8V
D_3.0V
XDD_SYS_RST
D_1.8V
D_3.0V
2.3V REG
IC303
(6/10)
4 VDD VOUT 3
6 Vin Vout 4
IC304
1.8V REG
(6/10)
BL_H
BL_L
ST_UNREG_ON
CAM_13V
CAM_-7.5V
LDO_2.3V
FE_1.8V
Q709,710
B+ SWITCH
CAM_3.5V
FB303
FB306
FB302
L702
L701
ST_UNREGST_UNREG
FB301FB308
IC301
CCD SIGNAL
PROCESS,
TIMING GENERATOR
(6/10)
CN709
VDDL
VDD
XRESET
CN708
BL_H
BL_L
CN701
(2/2)
M_5.0V
D_3.0V
LCD901
22
23
3
1, 25, 6
3.0 inch
COLOR
LCD MONITOR
LCD
BACKLIGHT
ST-172 FLEXIBLE BOARD (2/2)
L001
12 - 15
7
6
DISCHARGE
R405
C355
Q303
-7.5V
D002
AF illuminator/
self-timer lamp
L303
L302
CN301
CAM_13V
CAM_-7.5V
CN401
ZM_SENS_VCC
FLASH CONTROL,
CHARGE CONTROL
T001
IC001
CD-710 FLEXIBLE
BOARD
16
25
29
CCD IMAGER
BUFFER AMP
LENS BLOCK
ZOOM
RESET
SENSOR
D001
IC001
IC002
HIGH SPEED
FLASH
UNIT
DSC-T70/T75_L2
3-4E
XDD_SYS_RST
D_3.0V
M_5.0V
Q305
3.0V/3.5V
DISCHARGE
E11
RSTB
R404
IRIS MOTOR DRIVER,
FOCUS MOTOR DRIVER,
ZOOM MOTOR DRIVER
FC_SENS_VCC
IC401
LENS DRIVE,
(7/10)
FOCUS
32
RESET
SENSOR
Page 23
4-1. FRAME SCHEMATIC DIAGRAM
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
FLASH UNIT
C901
(CHARGING CAPACITOR)
C902
(CHARGING CAPACITOR)
D002
AF illuminator/
( )
self-timer lamp
ST-172 FLEXIBLE
BOARD
SP901
(SPEAKER)
BT001
LITHIUM SECONDARY
( )
BATTERY
110
CN702
MEMORY STICK
( )
11
CONNECTRO
12
LEVEL3
SY-183 BOARD
(SIDE B)
BH001
(BATTERY TERMINAL)
+
10
S
-
BT-039 FLEXIBLE
BOARD
LCD901
BACKLIGHT
3.0 inch
COLOR
LCD MONITOR
TOUCH
PANEL
1
1
2
44
45
1616
CN707CN708CN709
CONTROL SWITCH BLOCK
(RL60570)
IC211
(Not supplied)
CN710
112
CN704
1211
110
LEVEL3
SY-183 BOARD
(SIDE A)
238
139
CN703
19
CN701
218
1
238
139
CN301
238
139
CN401
119
LENS BLOCK
DSC-T70/T75_L2
MC-185
FLEXIBLE
BOARD
25
CN001
(MULTI CONNECTOR)
4-1
139
139
226
2728
1
LEVEL3
CD-710 FLEXIBLE
BOARD
IC001
(Not supplied)
FRAME
Page 24
Link
Link
4-2. SCHEMATIC DIAGRAMS
MC-185 FLEXIBLE BOARD
(MULTI CONNECTOR)
BT-039 FLEXIBLE BOARD
(BATTERY IN)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
CONTROL SWITCH BLOCK
(RL60570)
ST-172 FLEXIBLE BOARD
(FLASH DRIVE)
DSC-T70/T75_L2
Page 25
4-2. SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in µF unless otherwise noted. pF : µ
µF. 50 V or less are not indicated e xcept for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
kΩ=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
ExampleC541L452
22U10UH
TA A2520
Kinds of capacitor
External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
•Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic
curve B, unless otherwise noted.
• Signal name
XEDIT → EDITPB/XREC → PB/REC
• 2: non flammable resistor
• 5: fusible resistor
• C: panel designation
• A : B+ Line
• B : B– Line
•J : IN/OUT direction of (+,–) B LINE.
• C: adjustment for repair.
• A : not use circuit
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the
measurement points and ground when camera shoots
color bar chart of pattern box. They are reference values
and reference waveforms.
(VOM of DC 10 MΩ input impedance is used)
•Voltage values change depending upon input
impedance of VOM used.)
1. Connection
Pattern box
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
L = 24 cm (PTB-450)
L = 11 cm (PTB-1450)
Pattern box
Color bar chart
L
For PTB-450:
J-6020-250-A
For PTB-1450:
J-6082-559-A
Front of the lens
Camera
2. Adjust the distance so that the output waveform of
Fig. a and the Fig. b can be obtain.
H
Yellow
Cyan
White
Magenta
Green
AABBA=B
Fig. a (Video output terminal output waveform)
Fig.b (Picture on monitor TV)
Red
Blue
Electronic beam
scanning frame
CRT picture frame
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
DSC-T70/T75_L2
When indicating parts by reference number, please
include the board name.
The components identified by mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro
spécifie.
4-2
Page 26
Schematic diagrams of the CD-710 flexible board and the SY-183 board are not shown.
Pages from 4-3 to 4-13 are not shown.
DSC-T70/T75_L2
Page 27
186
2
3
4
57
A
Pin
1
LND001
LND002
LND003
LND004
LND005
LND006
LND007
LND008
LND009
LND010
LND011
LND012
LND013
LND014
LND015
LND016
LND017
LND018
LND019
LND020
LND021
LND022
LND023
LND024
LND025
LND026
LND027
LND028
LND029
LND030
LND031
LND032
LND033
LND034
LND035
LND036
LND037
LND038
LND039
ACV_GND
ACV_GND
ACV_GND
ACV_GND
ACV_GND
ACV_GND
XPOWER_ON
UART_Tx
UART_Rx
BATT/XEXT
HD_Pr
HD_Pb
USB_VBUS
USB_GND
USB_GND
USB_DP
N.C.
USB_DM
USB_GND
USB_GND
USB_GND
AU_LINE_OUT
A_GND
V_LINE_OUT
V_GND
V_GND
HD_Y
XAV_JACK_IN
CHARGE_V
CHARGE_V
CHARGE_V
CHARGE_V
CHARGE_V
ACV_UNREG
ACV_UNREG
ACV_UNREG
ACV_UNREG
ACV_UNREG
ACV_UNREG
HD_Y
XPOWER_ON
UART_RX
BATT/XEXT
V_OUT
XAV_JACK_IN
UART_TX
USB_DP
USB_DM
A_LINE_OUT
ACV_UNREG
HD_PB
USB_VBUS
HD_PR
Note:CN001(MULTI CONNECTOR) is not supplied, but this is
included in MC-185 flexible complete board.
LND040
STATIC_GND
CN001
26P
ACV_GND
ACV_GND
XPOWER_ON
CHARGE_V
BATT_XEXT
CHARGE_V
ACV_UNREG
ACV_UNREG
CHARGE_V
2HD_Pr
4HD_Pb
USB_VBUS
6
USB_GND
8
USB_DP
10
USB_DM
12
USB_GND
14
A_OUT_L
16
18 A_GND
20 V_OUT
22 V_GND
HD_Y
24
XAV_JACK_IN
26
(MULTI CONNECTOR)
1
3ACV_GND
5
7
9UART_Tx
15UART_Rx
17
19
21
23
25
2
3
B
SY-183
(10/10)
CN703
C
PAGE 4-13
of LEVEL3
D
37
38
39
A
B
C
D
E
F
08
DSC-T70/T75_L2
4-14
MC-185 FLEXIBLE BOARD
MULTI CONNECTOR
E
F
MC-185
Page 28
• Refer to page 4-2 for mark 0.
241
3
A
Pin
LND001
1
LND002
2
3
LND003
SY-183
(10/10)
CN704
PAGE 4-13
of LEVEL3
BB
LND004
LND005
LND006
LND007
8
LND008
9
LND009
10
LND010
BATT_GND
BATT_GND
BATT_GND
BATT_GND
BATT_GND
BATT_SIG
BATT_UNREG
BATT_UNREG
BATT_UNREG
BATT_UNREG
BATT_GND
BATT_SIG
BATT_UNREG
BATT_GND
BATT_SIG
BATT_UNREG
Note: BH001 is not included in
LND011
LND012
LND013
BT-039 flexible complete board.
BH001
s
BATTERY
TERMINAL
BOARD
241
A
A
Pin
1
LND001
MIC_SIG
MIC_GND
LND002
2
3
SY-183
(10/10)
CN710
PAGE 4-13
BB
of LEVEL3
10
11
12
LND003
LND004
LND005
LND006
LND007
LND008
LND009
LND010
LND011
LND012
REG_GND
XPWR_LED
D_3.0V
DIRECT_PB
XPWR_ON
XSHUTTER_SW
XAE_LOCK_SW
KEY_AD1
REG_GND
REG_GND
D001
SML-412MWT86
(POWER)
3
A
CL001
CL002
S001
S002
POWER
S005
(SHUTTER)
NO
3
2
R001
2200
1
4
(MICROPHONE)
CC
BT-039 FLEXIBLE BOARD
BATTERY IN
08
CC
S004
(ZOOM)
LND021
STATIC_GND
D002
(TL3SONY)
(TL3SONY)
D003
32
1
D004
MAZW068H0LS0
D005
(TL3SONY)
S003
TW
D
E
D
E
DSC-T70/T75_L2
4-15
CONTROL SWITCH BLOCK
F
(RL60570)
CONTROL SWITCH BLOCK(RL60570) is replaced as block,
so that PRINTED WIRING BOARD is omitted.
08
F
BT-039, RL60570
Page 29
• Refer to page 4-2 for mark 0.
LND020
LND021
3
2518
2.2uH
L001
C001
22u
6.3V
2012
C
R008 33
SP901
(SPEAKER)
R007
4700
1/10W
1608
C005
XX
4
5
6
C007
50V
B
220p
D003
RB520S-40TE61
C002
1u
B
10V
4
BT001
LITHIUM SECONDARY
BATTERY
3
2
1
D002
DOR5352
AF illuminator/
self-timer lamp
3.7
1
3.7
2
5.0
3
0
4
1
2
SW
SW
VCC
F_ON
T001
4
3
17
FLASH CONTROL,
CHARGE CONTROL
21.9u
CHARGING
CAPACITOR
3.7
15
16
N.C
HGND
IC001
TPS65552RGTR
C902
315V
VBATT
57
A
R002
1M
+
-
0
LND030
LND031
5
6
7
8
R003
100
1005
260.0
1
2
3
TIG030TS-S-TL-E
FLASH DRIVE
4
Q001
LND026
TRIGGER
TRIG_GND
LND027
LND028
XE_A(H)
LND029
XE_K(L)
FLASH
UNIT
B
C
D001
FT02P80TP
C+
LND022
LND023
C-
13
14
N.C
N.C
PGND
12
PGND
11
CHG
10
XFULL
9
0
3.1
C901
21.9u
315V
CHARGING
CAPACITOR
C+
LND024
LND025
C-
R004
1M
2012
C004
0.033u
186
Pin
1
A
SY-183
(10/10)
CN701
PAGE 4-13
of LEVEL3
B
LND001
2
LND002
3
LND003
LND004
LND005
LND006
LND007
LND008
LND009
LND010
LND011
LND012
LND013
LND014
LND015
LND016
17
LND017
LND018
18
19
LND019
2
REG_GND
VL_3V
SP+
SP-
XAF_LED
AF_ANODE
M_5V
STRB_ON
STRB_CHG
XSTRB_FULL
STRB_CHG_CONT
ST_UNREG
ST_UNREG
ST_UNREG
ST_UNREG
REG_GND
REG_GND
REG_GND
REG_GND
SPEKER+
SPEAKER-
C
D
CL001
N.C
5
I_PEAK7G_IGBT
6
0
E
N.C
8
0
D
E
ST-172 FLEXIBLE BOARD
F
08
FLASH DRIVE
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
F
DSC-T70/T75_L2
4-16
ST-172
Page 30
Link
Link
4-3. PRINTED WIRING BOARDS
MC-185 FLEXIBLE BOARD
BT-039 FLEXIBLE BOARD
COMMON NOTE FOR PRINTED WIRING BOARDS
ST-172 FLEXIBLE BOARD
DSC-T70/T75_L2
Page 31
4-3. PRINTED WIRING BOARDS
21321321
3
345
21
123
654
EB
C
3152
46
123
654
3152
46
123
54
43
12
312
45
534
12
14
23
4625
31
12
4
3
14
23
4-3. PRINTED WIRING BOARDS
4-3. PRINTED WIRING BOARDS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
•: Uses unleaded solder.
•
: Circuit board
: Flexible board
Pattern from the side which enables seeing.
: pattern of the rear side
(The other layers’ patterns are not indicated)
• Through hole is omitted.
• Circled numbers refer to waveforms.
• There are a few cases that the part printed on diagram
isn’t mounted in this model.
• C: panel designation
• Chip parts.
TransistorDiode
DSC-T70/T75_L2
4-17
Page 32
Printed wiring boards of the CD-710 flexible board and the SY-183 board are not shown.
Pages 4-18 and 4-20 are not shown.
NOTE: Characters A to Z of the electrical parts list indicate location of exploded views in which the desired part is shown.
Link
Link
AB
OVERALL SECTION
Link
Link
BT-039 FLEXIBLE BOARDST-172 FLEXIBLE BOARD
MC-185 FLEXIBLE BOARD
EXPLODED VIEWS
EXPLODED VIEWS
SY-183 BOARD SECTION
ELECTRICAL PARTS LIST
ELECTRICAL PARTS LIST
CC
B
C
BATTERY HOLDER SECTION
ACCESSORIES
ACCESSORIES
DSC-T70/T75_L2
Page 35
5. REPAIR PARTS LIST
5. REPAIR PARTS LIST
5. REPAIR PARTS LIST
NOTE:
• -XX, -X mean standardized parts, so they may have some differences from
the original one.
• Items marked “*” are not stocked since they are seldom required for routine
service. Some delay should be anticipated when ordering these items.
• The mechanical parts with no reference number in the exploded views are not
supplied.
• Due to standardization, replacements in the parts list may be different from
the parts specified in the diagrams or the components used on the set.
• CAPACITORS:
uF: µF
• COILS
uH: µH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , µPC... , µPC... ,
uPD..., µPD...
• Abbreviation
AR : Argentine model
AUS: Australian model
BR : Brazilian model
CH : Chinese model
CND : Canadian model
EE : East European model
HK : Hong Kong model
J: Japanese model
JE: Tourist model
KR : Korea model
NE : North European model
TW : Taiwan model
When indicating parts by reference number,
please include the board name.
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifié.
• Color Indication of Appearance Parts
Example:
(SILVER) : Cabinet’s Color
(Silver) : Parts Color
DSC-T70/T75_L2
5-1
Page 36
5. REPAIR PARTS LIST
DISASSEMBLY
5. REPAIR PARTS LIST
5-1. EXPLODED VIEWS
5-1-1. OVERALL SECTION
ns: not supplied
SY-183 board section
(See Page 5-3)
8
(6.5mm × 6.5mm)
2
1
HARDWARE LIST
#18/#29
5
4
LCD901
3
#82
7
(6mm × 14.5mm)
ns
6
#18
#29
#18
#29
#18/#29
CAUTION 1 :
For the part of 7 : CUSHION (RL MICROPHONE) (3-275-797-01),
cut NON WOVEN (T0.25) (3-076-631-01) into the desired length and use it.
CAUTION 2 :
For the part of 8 : SHEET (WATERPROOF SHEET) (3-280-761-01),
cut NON WOVEN (T0.25) (3-076-631-01) into the desired length and use it.