SONY DSC-T10 Service Manual L3 V1.1
DSC-T10
SERVICE MANUAL
Ver 1.1 2006.09
Revision History
Revision History
How to use
How to use
Acrobat Reader
Acrobat Reader
Internal memory
Internal memory
ON BOARD
ON BOARD
Photo: Silver
Link
Link
SERVICE NOTE
PRINTED WIRING BOARDS
LEVEL 3
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Japanese Model
Tourist Model
REPAIR PARTS LIST
SCHEMATIC DIAGRAMS
The components identified by
mark 0 or dotted line with
mark 0 are critical for safety .
Replace only with part number specified.
Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
DIGITAL STILL CAMERA
DSC-T10_L3
Sony EMCS Co.
2006I0500-1
© 2006.9
Published by Kohda TEC9-852-129-11
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
CAUTION
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. FLEXIBLE Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
DSC-T10_L3
— 2 —
TABLE OF CONTENTS
Section Title Page
1. SERVICE NOTE
1-3. Method for Copying or Erasing the Data in Internal
Memory (Internal Memory/Music) ·································1-2
4. PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS
4-2. Schematic Diagrams························································ 4-3
4-3. Printed Wiring Boards ···················································4-15
4-4. Mounted Parts Location ················································4-21
5. REPAIR PARTS LIST
5-2. Electrical Parts List ·························································5-6
DSC-T10_L3
— 3 —
1. SERVICE NOTE
1-3. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
(INTERNAL MEMORY/MUSIC)
The data can be copied/erased by the operations on the Setup screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-163 board, erase the data in internal memory of the board before replacement.
Note 2: When replacing the SY-163 board or the IC401 on the SY-163 board, execute formatting and initialize the internal memory after
replacement.
Method for Copying the Data in Internal Memory
Copy
Copies all images in the internal memory to a “M em ory Stick Duo”.
1 Insert a “Memory Stick Duo” having 64 MB or la rger capac ity.
2 Select [OK] with v on the control button, then press z.
The messag e “All data in internal memory will be copied Ready?” appears.
3 Select [OK] with v, then press z.
Copying starts.
To ca ncel the copying
Select [Cancel] in step 2 or 3, then pr ess z.
•Use a fully charged battery pack or the AC Adaptor (not supplied). If you attempt to copy image files
using a battery pack with little remaining charge, the battery pack may run out, causing copying to fail or
possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in
(Internal Memory Tool).
•You cannot select a folder copied on a “Memory Stick Duo”.
•Even if you copy data, a (Print order) mark is not copied.
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Format
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1 Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be erased Ready?” appears.
2 Select [OK] with v, then press z.
The format is complete.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
Method for Formatting the Music
Format Music
If you cannot play back a M usic file for the Slide Show, the Music file might be corrupted. If
this happens, perform [Format Music].
When [Format Music] is performed, all the Music files are erased. Use the supplied software
“Music Transfer” to activate [Download Music].
1 Sel ec t [OK] with v on the control button, then press z.
The message “All data will be erased Ready?” appears.
2 Sel ec t [OK] with v, then press z.
All the Music files are erased.
To canc el the formatting
Select [Cancel] in step 1 or 2, then press z.
DSC-T10_L3
1-2
Link
Link
4-2. SCHEMATIC DIAGRAMS
SY-163 BOARD (1/6)
(CCD SIGNAL PROCESS)
SY-163 BOARD (2/6)
(LENS DRIVE, OIS DRIVE)
SY-163 BOARD (3/6) (CAMERA DSP)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
SY-163 BOARD (4/6) (SDRAM, SUPER AND)
SY-163 BOARD (5/6) (AUDIO, VIDEO)
SY-163 BOARD (6/6) (DC/DC CONVERTER)
DSC-T10_L3
4-2. SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in µF unless otherwise noted. pF : µ
µF. 50 V or less are not indicated except f or electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
kΩ=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example C541 L452
22U 10UH
TA A 2520
Kinds of capacitor
External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
•Parts with ★ differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors ha ve characteristic
curve B, unless otherwise noted.
• Signal name
XEDIT→ EDIT PB/XREC → PB/REC
• 2: non flammable resistor
• 5: fusible resistor
• C: panel designation
• A: B+ Line
• B: B– Line
• J : IN/OUT direction of (+,–) B LINE.
• C: adjustment for repair.
• A: not use circuit
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the
measurement points and ground when camera shoots
color bar chart of pattern box. They are reference values
and reference wave forms.
(VOM of DC 10 MΩ input impedance is used)
•Voltage values change depending upon input
impedance of VOM used.)
1. Connection
Pattern box
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
L = 24 cm (PTB-450)
L = 11 cm (PTB-1450)
Pattern box
Color bar chart
L
For PTB-450:
J-6020-250-A
For PTB-1450:
J-6082-559-A
Front of the lens
Camera
2. Adjust the distance so that the output wavefor m of
Fig. a and the Fig. b can be obtain.
H
Yellow
Cyan
White
Magenta
Green
AABBA=B
Fig. a (Video output terminal output waveform)
Fig.b (Picture on monitor TV)
Red
Blue
Electronic beam
scanning frame
CRT picture frame
DSC-T10_L3
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
When indicating parts by reference number, please
include the board name.
The components identified by mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro
spécifie.
4-3
1 165
SY-163 BOARD (1/6)
A
CCD SIGNAL PROCESS
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
R:REC MODE
P:PB MODE
B
C
D
E
F
CD-656
FLEXIBLE
LND001-LND033
Page 4-5
of Level 2
G
H
I
J
K
CN101
CAM_12V_CD
REG_GND
REG_GND
CCD_OUT
CCD_GND
REG_GND
REG_GND
REG_GND
CAM_-7.5V_CD
REG_GND
REG_GND
REG_GND
VHLD
CSUB
9
R119
HVSS2
AVSS2
B10
0
0.1u
C108
HVSS1
TPADCK
A10
CL104
4.7
4.7
R107
R108
0
1
R134
R133
H2A
HVDD1
HVDD2
HVDD3
IC101
TIMING GENERATOR
IC101
VSP00M21ZWDR
CL107
CL106
C127
0.1u
R118
100k
H1A
HVSS1
CCD SIGNAL PROCESS,
TPDMA9TPSHPB9TPSHDB8PVSSB7PVCCA8VLA7VHA6VMA5VMB6DVDD1B5DVDD1B4DVDD1E5DVSS1E6DVSS1F5DVSS1F6GNDS1
CL105
R111
R135
C110
10
15
4.7
4.7
R109
R110
0
0
1
R137
R136
0.1u
C111
RG
H2B
H1B
LASTH
GNDS2
DRVDD
C119
0.1u
CAM_-7.5V
FB101
22u
10V
C128
0.01u
DRVDD
DRVSS
CA_AD13
J1J2K1K2K3J3J4J5J6K4K5K6J7K7J8K10K9K8J9G7H7H6G6G5H5
DRVSS
B15
SOUT(CLPOB)
TK11100CSCB-G
C134
100p
R139
39k
±0.5%
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
SCLK
CS
RESET
SDATA
SDL
MCK
VR
HR
TRIG
IC102
12V REG
IC102
R140
15k
±0.5%
CA_AD12
CA_AD11
CA_AD10
CA_AD9
CA_AD8
CA_AD7
CA_AD6
CA_AD5
CA_AD4
CA_AD3
CA_AD2
CA_AD1
CA_AD0
CL103
CL108
CL115
CL116
A1 A2 A3 A4 B1 B2 B3 C1 C2 C3 D3 D2 D1 E3 E2 E1 F3 F2 F1 G3 G2 G1 H3 H2 H1
C133
0.001u
R138
330k
±0.5%
C131
0.1u
R1.3
R12.5
/P0
6
Np
Vout2FB3Vin
1
/P0
R141
C126
R1.3/P0
XX
GND
R129
1k
R130
R13/P0
45
R13/P0
0
Vcont
XX
C132
1u
VHLD
V10
V5B
V5A
VST
V3A
V3B
V9
V8
V7
V6
V2
V1
V4
SWITCH
Q102
4
: Voltage measurement of the CSP ICs
and the Transistors with mark, are
not possible.
R131
R101
1800
R9.5/P0R9.5/P0
6
3
1
4
FB104
0
5
R102
1M
D101
1SS387CT(TL3SONY)
C103
R103
0.1u
220k
R8.8/P0.3
0
Q101
UN9213J-(K8).SO
SWITCH
3
33P
V10
33
CL111
V9
32
V8
31
CL112
V7
30
V6
29
CL113
V5B
28
CL114
V5A
27
V2
26
VST
25
CL109
V1
24
23
V3A
22
CL110
V3B
21
V4
20
19
18
17
16
15
14
13
12
RG
11
10
SHT
9
8
7
H2B
6
H1B
5
4
H2A
3
H1A
2
1
R132
3300
00
2
RN1904AFS(TLR3SONY)
C102
4.7u
10V
R106
100k
R112
R122
6122
V1
V2
V3B
V3A
V4
V3A
V3B
CMD9L
BYPDE8AVDD1D8AVDD2C8AVSS1C9AVSS2
D10
XX
0.1u
0.1u
C124
C129
V9
0.1u
C109
V2
V1A
V1B
HVSS3
C10
C116
0.001u
V4
V5A
V5B
V6
V7
V10
V8
VST
VHLD
C105
1u
C125
R123
0.1u
0
C106
0.1u
0
C120
0.1u
0
C121
0.47u
C122
0.47u
C130
4.7u
C117
V5A
H4
V5B
G4
V6
F4
V7A
E4
V7B
D4
V8
D7
V9(Vst)
D6
V10(Vhld)
D5
V13
C7
V15
C6
VSUB
C4
SUBSW
C5
STROBE(R/T)
E7
MSHUT(P/S)
F7
FIELD
H8
DACB
G8
DACA
F8
AVDD
J10
AVDD
H9
CCDIN
H10
CCDGND
G10
AVSS
G9
AVSS
F9
REFN
F10
REFP
E10
E9
0.1u
C123
C115
6.3V
138
FB103
L104
10uH
D_3.2V
L102
10uH
L103
10uH
CAM_2.9V
CA_AD0
CA_AD1
CA_AD2
CA_AD3
CA_AD4
CA_AD5
CA_AD6
CA_AD7
CA_AD8
CA_AD9
CA_AD10
CA_AD11
CA_AD12
CA_AD13
14117
15
CA_AD0
CA_AD1
CA_AD2
CA_AD3
CA_AD4
CA_AD5
CA_AD6
CA_AD7
CA_AD8
CA_AD9
CA_AD10
CA_AD11
CA_AD12
CA_AD13
XCS_FE
CLKTGO
CA_HD
VSUB_CONT_PRE
VSUB_CONT_POST
XIC_301_RST_OUT
IC_301_1_SO
XIC_301_1_SCK
CA_FD
D_3.2V
CAM_2.9V
@04
@01
@02
@03
(2/6)
(3/6)
(3/6)
(3/6)
(5/6)
(2/6)
(3/6)
(4/6)
(6/6)
CAM_12V
C114
C113
47u
47u
47u
6.3V
6.3V
REG_GND
CAM_-7.5V
05
DSC-T10_L3
4-6
SY-163 (1/6)
1 914117
3
4
5
6122
8
10
13
15
16
SY-163 BOARD (2/6)
A
LENS DRIVE, OIS DRIVE
XX MARK:NO MOUNT
NO MARK:REC/PB MODE
B
C
D
E
F
G
H
I
J
K
@02
@05
(1/6)
(3/6)
@06
L
@07
M
(3/6)
N
O
(4/6)
@04
(3/6)
(6/6)
(6/6)
(5/6)
XIC_503_CPU_RESET
REG_GND
(P_GND)
XIC_301_RST_OUT
(1/6)
(3/6)
XIC_301_0_SCK
IC_301_0_SI
IC_301_0_SO
XKEY_IC_503
XCS_IC_503
IC_301_27M_CLKO
XCAM_DR_PS
ZOOM_B_DIR
ZOOM_EN
ZOOM_A_DIR
FOCUS_EN
FOCUS_B_DIR
FOCUS_A_DIR
IRIS_B_BRK
IRIS_B_DIR
IRIS_A_BRK
IRIS_A_DIR
XFC_RST_LED
FC_SENS
XZM_RST_LED
ZM_SENS
LENS_TEMP
OIS_TEMP
A_3.2V
D_3.2V
CA_FD
: Voltage measurement of the CSP ICs
and the Transistors with mark, are
not possible.
XCS_IC_503
IC_301_0_SI
IC_301_0_SO
XIC_301_RST_OUT
VCCD15
OP_IN2
J9
0.01u
C521
YAW_HALL+
GNDD3
OP_IP1
OUT1A
J10
0.0022u
C523
R559
C549
VCCD3
OP_OUT1
R540
PS
EN7
IN7
BR6
EN6
IN6
BR5
EN5
IN5
BR4
EN4
0
XX
H9
0.001u
VCCD3
OP_IN1
30k
C542
IC_301_27M_CLKO
RESET_N
DA1
K9
J8
120k
R517
39k
R515
YAW_HALLBIAS-
C5 A5 A2 C4 B2 C3 A1 C2 G1 E4 D4 F2
CLK
IA1K8IB1
CL513
SI
G6
8200
R519
YAW_HALLBIAS+
C539
XX
A5B4A4A3A7A2A9A8D2D9H10B3B2C2E5D5D6
SO
XSCS
OP_IN3
OP_OUT3
J7
C525
YAW_HALL-
XCAM_DR_PS
ZOOM_B_DIR
ZOOM_EN
ZOOM_A_DIR
FOCUS_EN
R542
UDIDEBUG
PITCH_AD
0.01u
10k
IRIS_A
UDITDI
UDITDO
UTITMS
UDITCK
UDITRST
YAW_AD
PWM3
PWM2
R518
1800
C533
0.1u
1.4
2
R545
R536
100k
10k
REG_GND
(SIG_GND)
0R537
C547
10u
IRIS_B
IRIS_A
IRIS_A
IRIS_B
ZOOM_A
ZOOM_B
ZOOM_A
ZOOM_B
FOCUS_B
FOCUS_A
FOCUS_B
FOCUS_A
XIC_301_0_SCK
XIC_503_CPU_RESET
XKEY_IC_503
C526
0.1u
390R203
220R204
CA_FD
R524
560k
R525
560k
LENS BLOCK is replaced as block,
so that there PRINTED WIRING BOARD
and SCHEMATIC DIAGRAM are omitted.
CN201
39P
IRIS_B
39
IRIS_A
38
IRIS_A
37
36
IRIS_B
N.C
35
34
N.C
33
FC_SENS_GND
32
FC_SENS_VCC
31
FC_SENS
ZM_SENS_GND
30
29
ZM_SENS_VCC
ZM_SENS
28
LENS_TEMP
27
26
REG_GND
25
ZOOM_A
24
ZOOM_B
ZOOM_A
23
ZOOM_B
22
21 FOCUS_B
FOCUS_A
20
19
FOCUS_B
18
FOCUS_A
YAW-
17
PITCH_HALLBIAS-
16
PITCH_HALLBIAS+
15
14
REG_GND
YAW+
13
12
PITCH+
11
PITCH+
PITCH-
10
PITCH-
9
REG_GND
8
YAW_HALL-
7
YAW_HALL+
6
OIS_TEMP
5
YAW_HALLBIAS-
4
3
YAW_HALLBIAS+
PITCH_HALL-
2
PIYCH_HALL+
1
19 20
16 17 18
C550
0.33u
OUT1
NC
V+
CRST
OUT2
C551
0.33u
R560
15k
C555
22u
R523
10k
12345
HO1
AM1
VREF1
IC510
PITCH/YAW SENSOR AMP
IC510
NJM3230SE7
VREF2
HO2
AM2
R526
10k
C554
22u
R561
15k
1.4 1.2
C536
0.1u
LENS
BLOCK
HI1
LO1
HI2
LO2
1112131415
12
GND
PITCH SENSOR
0.047u
0.047u
SE501
SCK
XDL
PIO0
B6 A6 B5
PIO1
PIO2
PIO3
VD
VB
CH3
CH2
CH1
CH0
1800R512
R527
1k
CL515
R546
100k
R547
100k
R548
100k
R549
C540
100k
XX
R550
100k
CL502
R551
100k
CL503
K4 G5 K5 J5 J6 D4 D7 F7 E7 G1 F4 G10 E4 C9 B9 B8 B7
XFC_RST_LED
FC_SENS
XZM_RST_LED
ZM_SENS
LENS_TEMP
YAW-
PITCH_HALLBIAS-
PITCH_HALLBIAS+
YAW+
PITCH+
PITCH-
YAW_HALL-
YAW_HALL+
OIS_TEMP
YAW_HALLBIAS-
YAW_HALLBIAS+
PITCH_HALL-
PITCH_HALL+
YAW SENSOR
C529
C530
OUTVref
Vcc
SE502
LIA1
LIB1
GND
LIB2
LIA2
1.3 2.9
R557
22k
R556
22k
67
8910
R555
22k
R558
22k
4
3
2.9
1
Vref
GND
Vcc
OUT
3
4
C553
0.1u
C534
0.1u
C531
0.047u
C532
0.047u
C535
0.1u
C552
0.1u
B1
VOUT
IC504
1.5V REG
VIN
B2
C511
1u
B1
VOUT
A_3.2V
C512
1u
REG_GND
M_5V
XIC_301_RST_OUT
XIC_503_CPU_RESET
IC_301_27M_CLKO
XFC_RST_LED
XZM_RST_LED
VIN
B2
XIC_301_0_SCK
IC_301_0_SI
IC_301_0_SO
XKEY_IC_503
XCS_IC_503
XCAM_DR_PS
ZOOM_B_DIR
ZOOM_EN
ZOOM_A_DIR
FOCUS_EN
FOCUS_B_DIR
FOCUS_A_DIR
IRIS_B_BRK
IRIS_B_DIR
IRIS_A_BRK
IRIS_A_DIR
FC_SENS
ZM_SENS
LENS_TEMP
OIS_TEMP
CA_FD
IC506
2.9V REG
IC506
TK63129BCB-G
A1
VCONT
GND
IC504
TK63115BCB-G
A1
VCONT
GND
M_5V
C509
22u
10V
A2
C203
22u
10V
PITCH-
PITCH+
YAW-
YAW+
C516
1u
A2
VM5_0
C1
VM5_1
C10
C513
0.1u
PGND
A1
PGND
E1
PGND
A10
PGND
C548
0.1u
C201
D_3.2V
0.1u
C202
0.1u
E10
DVCC
F1
DGND
F10
OUT0A
D1
OUT0B
B1
OUT1A
D10
OUT1B
B10
MD_IN0
E2
MD_BR0
F2
MD_EN0
G2
MD_IN1
E9
MD_BR1
F9
MD_EN1
G9
CL517
xMD_PS
G7
TEST
G4
K1
VCC
DGND
VREF
VLIM
RNFS
RNF
VM1
VM2
VM3
VM4
PGND1
PGND1
C546
0.1u
ZOOM_B
OUT7A
OUT7B
PGND2E7PGND2F5IN1G6EN1E5BR1D3IN2E3EN2F1BR2D5IN3B6EN3A7BR3A6IN4
C7
C515
1u
G2
F7
F6
G7
G3
G4
D1
D7
A4
G5
C1
E1
VCCA3K6VCCA3
C541
0.001u
ZOOM_B
OUT6A
OUT6B
IRIS_A_DIR
CL516
CPU_PIO_1
GNDA3
GNDA3
K7
K10
H2
PITCH_HALL+
ZOOM_A
ZOOM_A
FOCUS_B
OUT5A
OUT5B
IC201
LENS DRIVE
IC201
M63067WG-DF0T
IRIS_A_BRK
IRIS_B_DIR
CL514
MARK
CPU_PIO_0
OP_IP0
OP_OUT0
J1
0.0022u
C517
FOCUS_B
OUT4A
OUT4B
TEST2
TEST3
STABILIZATION DRIVE
OP_IN0
DA0
H1
K2
43k
R539
39k
R509
FOCUS_A
FOCUS_A
OUT3A
OUT3B
FOCUS_A_DIR
IRIS_B_BRK
TEST1
GNDD15
IC503
OPTICAL IMAGE
IC503
R2J30500LG
IA0K3IB0
J2
J3
120k
8200
R513
R511
PITCH_HALLBIAS-
PITCH_HALLBIAS+
IRIS_A
IRIS_B
IRIS_B
E2D2B1D6E6B7C6B4B5B3A3F4F3
OUT2A
OUT2B
FOCUS_B_DIR
VCCD15
OP_OUT2
J4
10k
R541
PITCH_HALL-
OUT1B
DSC-T10_L3
05
4-7
SY-163 (2/6)
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