Sony DSC-HX50,DSC-HX50V Service Manual

SERVICE MANUAL

DSC-HX50/HX50V_L3

LEVEL 3

Check the SERVICE NOTE (LEVEL 2) before the service.

Revision History

Published by Sony Techno Create Corporation

Sony Corporation

983472811.pdf

Ver. 1.0 2013.04

DIGITAL STILL CAMERA

The components identified by mark
0 or dotted line with mark 0 are
critical for safety.
Replace only with part number
specified.

Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.

DSC-HX50/HX50V

9-834-728-11

US Model

Canadian Model

AEP Model

UK Model

Russian Model

E Model

Australian Model

Hong Kong Model

Chinese Model

Korea Model

Brazilian Model

Japanese Model

Photo: DSC-HX50V/Black

Ver. Date History Contents

S.M. Rev.

issued

1.0 2013.04 Official Release — —

2013D08-1

© 2013.04

– 2 –

DSC-HX50/HX50V_L3

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO­NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM­PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.

Caution

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.

注意

電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。

SAFETY CHECK-OUT

After correcting the original service problem, perform the following

safety checks before releasing the set to the customer.

1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.

2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.

3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.

4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.

5. Check the B+ voltage to see it is at the values specified.

6. Flexible Circuit Board Repairing

• Set the soldering iron tip temperature to 350 °C approximately.

• Do not touch the soldering iron on the same conductor of the circuit

board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

1. 注意事項をお守りください。

 サービスのとき特に注意を要する個所については，キャビ

ネット，シャーシ，部品などにラベルや捺印で注意事項を
表示しています。これらの注意書き及び取扱説明書等の注
意事項を必ずお守り下さい。

2. 指定部品のご使用を

 セットの部品は難燃性や耐電圧など安全上の特性を持った

ものとなっています。従って交換部品は，使用されていた
ものと同じ特性の部品を使用して下さい。特に回路図，部
品表に0印で指定されている安全上重要な部品は必ず指定
のものをご使用下さい。

3. 部品の取付けや配線の引きまわしはもとどおりに

 安全上，チューブやテープなどの絶縁材料を使用したり，

プリント基板から浮かして取付けた部品があります。また
内部配線は引きまわしやクランパによって発熱部品や高圧
部品に接近しないよう配慮されていますので，これらは必
ずもとどおりにして下さい。

4. サービス後は安全点検を

 サービスのために取外したネジ，部品，配線がもとどおり

になっているか，またサービスした個所の周辺を劣化させ
てしまったところがないかなどを点検し，安全性が確保さ
れていることを確認して下さい。

5. チップ部品交換時の注意

 ・ 取外した部品は再使用しないで下さい。
 ・ タンタルコンデンサのマイナス側は熱に弱いため交換時

は注意して下さい。

6. フレキシブルプリント基板の取扱いについて

 ・ 半田こてのこて先温度は約350℃に設定してください。
 ・ 同一パターンに何度もコテ先を当てないで下さい。（3回

以内）

 ・ パターンに力が加わらないよう注意して下さい。

サービス，点検時には次のことにご注意ください。

– ENGLISH – – JAPANESE –

UNLEADED SOLDER

This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the

lead free mark due to their particular size.)

: LEAD FREE MARK

Be careful to the following points to solder or unsolder.

• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.

• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un­leaded solder and leaded solder will cause detachment phenomenon.

無鉛半田について

本機には無鉛半田が使用されています。
無鉛半田を使用している基板には，無鉛（Lead Free）を意味する
レッドフリーマークがプリントされています。

（注意：基板サイズによっては，無鉛半田を使用していてもレッ

ドフリーマークがプリントされていないものがありま
す）

：レッドフリーマーク

無鉛半田は，下記の点に注意して使用してください。

・ 半田こてのこて先温度は約350℃に設定してください。

温度調節が無理な場合は，高温短時間で作業を行ってくだ
さい。

注意：半田こてを長く当てすぎると，基板のパターン（銅

箔）がはがれてしまうことがありますので，注意して
ください。また，従来の半田よりも粘性が強いため，
IC端子などが半田ブリッジしないように注意してく
ださい。

・ 半田こてのこて先は，必ず無鉛半田用と有鉛半田用に分け

て管理してください。
無鉛半田と有鉛半田が混在すると剥離現象が発生してしま
います。

DSC-HX50/HX50V_L3

2-1

Ref. No. Part No. DescriptionRef. No. Part No. Description

2. REPAIR PARTS LIST

(ENGLISH)

NOTE:

• -XX, -X mean standardized parts, so they may have some differ­ences from the original one.

• Items marked “*” are not stocked since they are seldom required for
routine service. Some delay should be anticipated when ordering
these items.

• The mechanical parts with no reference number in the exploded
views are not supplied.

• Due to standardization, replacements in the parts list may be dif­ferent from the parts specified in the diagrams or the components
used on the set.

• CAPACITORS:

uF: μF

• COILS

uH: μH

• RESISTORS

All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

• SEMICONDUCTORS

In each case, u: μ, for example:
uA...: μA... , uPA... , μPA... ,
uPB... , μPB... , uPC... , μPC... ,
uPD..., μPD...

When indicating parts by reference num­ber, please include the board name.

The components identified by mark 0
or dotted line with mark 0 are critical
for safety.
Replace only with part number speci­fied.

Les composants identifiés par une mar­que 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.

Caution

Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.

Note : Be sure to read “Precautions for Replacement

of Imager” on page 6-1.

(JAPANESE)

【使用上の注意】

• ここに記載されている部品は,補修用部品であるため,回路図及び
セットに付いている部品と異なる場合があります。

• -XX,-Xは標準化部品のため,セットに付いている部品と異なる場
合があります。

•*印の部品は常備在庫しておりません。

• コンデンサの単位でuFはμFを示します。

• 抵抗の単位Ωは省略してあります。

 金  被：金属被膜抵抗。
 サンキン：酸化金属被膜抵抗。

• インダクタの単位でuHはμHを示します。

• 半導体の名称でuA...,uPA...,uPB...,uPC...,uPD...等はそれぞれμA...,
μPA...,μPB...,μPC...,μPD...を示します。

図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。

お願い

0

印の部品，または0印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。

注意

電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。

Note :



イメージャの交換時は

6

-1ページの“イメージャ

交換時の注意”を必ずお読みください。

A-1940-468-A BT-2006 FLEXIBLE BOARD, COMPLETE
*******************************
(BT001 is not included in BT-2006 FLEXIBLE COMPLETE BOARD (SERVICE).)

< BATTERY >

 BT001 1-756-813-11 LITHIUM RECHARGEABLE BATTERY

< CAPACITOR >

C101 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C102 1-116-713-11 CERAMIC CHIP 22uF 20% 10V

* C104 1-116-456-11 CERAMIC CHIP 0.047uF 10% 350V
 C105 1-100-761-21 CERAMIC CHIP 0.01uF 10% 250V

< CONNECTOR >

* CN101 1-816-650-51 FFC/FPC CONNECTOR (LIF) 24P

< DIODE >

* D001 6-501-861-01 DIODE CL-360S-TD4-X-TL

* D101 6-503-901-01 DIODE DA2JF6500L
* D102 6-503-001-01 DIODE RR255M-400FJTR

< IC >

IC101 6-716-806-01 IC R2J20071DNS

< COIL >

* L101 1-400-820-11 INDUCTOR 2.2uH

< TRANSISTOR >

 Q101 6-552-987-01 TRANSISTOR RJP4010AGE-01

< RESISTOR >

R001 1-218-945-11 METAL CHIP 220 5% 1/16W
R101 1-218-871-11 METAL CHIP 10K 0.5% 1/10W
R102 1-208-889-11 METAL CHIP 1.2K 0.5% 1/16W
R103 1-208-643-11 METAL CHIP 22 0.5% 1/16W
R104 1-218-941-11 METAL CHIP 100 5% 1/16W

 R105 1-216-121-11 METAL CHIP 1M 5% 1/10W
R106 1-216-097-11 METAL CHIP 100K 5% 1/10W

< TRANSFORMER >

* T101 1-445-749-21 D.C.-D.C.CONVERTER TRANSFORMER

A-1940-465-A CD-1005 FLEXIBLE BOARD, COMPLETE
*******************************
(All mounted parts are not supplied, but they are included in CD-1005 FLEXIBLE
COMPLETE BOARD.)

 A-1955-498-A SERVICE (BLACK), ST BLOCK ASSY (BLACK)
 A-1955-499-A SERVICE (SILVER), ST BLOCK ASSY (SILVER)

(Not supplied) FL-2000 FLEXIBLE BOARD
***********************************
(FL-2000 FLEXIBLE BOARD are not supplied, but they are included in
ST BLOCK ASSY (SERVICE).

1-886-328-11 MS-505 FLEXIBLE BOARD
********************

A-1940-464-A MS-1013 BOARD, COMPLETE
***********************

< CONNECTOR >

* CN001 1-821-502-11 CONNECTOR, FPC (ZIF) 29P
CN002 1-843-088-12 CARD CONNECTOR

< RESISTOR >

R001 1-218-990-81 SHORT CHIP 0
R002 1-218-937-11 METAL CHIP 47 5% 1/16W

A-1940-736-A RL-1011 BOARD, COMPLETE (SERVICE) (HX50V)
A-1940-463-A RL-1011 BOARD, COMPLETE (HX50)
**********************
(ANT402, C108, C401, C416, C417, C427, C429, ET401, IC001, IC402, IC404, L403,
R412, S003, SE001 and SWF002 are not supplied, but they are included in RL-1011
COMPLETE BOARD (SERVICE).)

< ANTENNA >

ANT402 (Not supplied) GPS ANTENNA (HX50V)

< CAPACITOR >

* C101 1-118-407-11 CERAMIC CHIP 470PF 10% 50V
C102 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C103 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C104 1-118-388-11 CERAMIC CHIP 0.047uF 10% 25V
C105 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

C106 1-118-388-11 CERAMIC CHIP 0.047uF 10% 25V
* C107 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V
C108 (Not supplied) CERAMIC CHIP 4.7uF 10% 6.3V
C109 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V
C401 (Not supplied) CERAMIC CHIP 1.8PF 0.1PF 25V (HX50V)

C403 1-116-741-11 CERAMIC CHIP 0.47uF 20% 10V (HX50V)
C404 1-116-743-11 CERAMIC CHIP 0.22uF 10% 16V (HX50V)
C408 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V (HX50V)
C409 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V (HX50V)
C410 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V (HX50V)

C411 1-128-605-11 CERAMIC CHIP 12PF 5% 25V (HX50V)
C412 1-128-605-11 CERAMIC CHIP 12PF 5% 25V (HX50V)
C413 1-116-153-11 CERAMIC CHIP 18PF 1% 50V (HX50V)
C414 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V (HX50V)
* C415 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V (HX50V)

C416 (Not supplied) CERAMIC CHIP 0.01uF 10% 16V (HX50V)
C417 (Not supplied) CERAMIC CHIP 2.2PF 0.1PF 50V (HX50V)
* C418 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V (HX50V)
C419 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V (HX50V)
C420 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V (HX50V)

C421 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V (HX50V)
C423 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V (HX50V)
C424 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V (HX50V)
C425 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V (HX50V)
C426 1-127-991-91 CERAMIC CHIP 2PF 0.25PF 25V (HX50V)

C427 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V (HX50V)

2-2. ELECTRICAL PARTS LIST

BT-2006 CD-1005 FL-2000 MS-505 MS-1013 RL-1011

DSC-HX50/HX50V_L3

2-2

Ref. No. Part No. Description

Ref. No. Part No. Description

Ref. No. Part No. DescriptionRef. No. Part No. Description

* C428 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V (HX50V)
C429 (Not supplied) CERAMIC CHIP 1PF 0.1PF 50V (HX50V)

< CONNECTOR >

CN001 1-822-769-21 CONNECTOR, FPC (ZIF) 27P
CN003 1-816-654-61 FFC/FPC CONNECTOR (LIF) 6P

< DIODE >

D401 8-719-024-69 DIODE 1SS361 (T5LS (HX50V)

< SHIELD CASE >

ET401 (Not supplied) SHIELD CASE (HX50V)

< IC >

IC001 (Not supplied) IC NJM3232MG2 (TE2)
IC401 6-718-365-01 IC S-80928CNPF-G8YTFG (HX50V)
IC402 (Not supplied) IC MM3534C42RRE (HX50V)
* IC403 6-715-228-01 IC SN74AUP2G126YFPR (HX50V)
IC404 (Not supplied) IC MT3339 (HX50V)

* IC405 6-717-043-01 IC NJG1143UA2 (TE1) (HX50V)

< COIL >

L402 1-469-232-21 INDUCTOR 56nH (HX50V)
L403 (Not supplied) INDUCTOR 9.1nH (HX50V)
L404 1-481-981-11 INDUCTOR 4.7uH (HX50V)
L405 1-481-887-11 INDUCTOR 8.2nH (HX50V)

< TRANSISTOR >

Q401 6-550-601-01 TRANSISTOR UNRF2A300AS0 (HX50V)

< RESISTOR >

R102 1-218-969-11 METAL CHIP 22K 5% 1/16W
R103 1-218-969-11 METAL CHIP 22K 5% 1/16W
* R106 1-250-523-11 METAL CHIP 15K 1% 1/16W
R107 1-250-519-11 METAL CHIP 10K 1% 1/16W
R108 1-250-547-11 METAL CHIP 150K 1% 1/16W

R402 1-240-695-91 METAL CHIP 1K 5% 1/20W (HX50V)
R406 1-240-695-91 METAL CHIP 1K 5% 1/20W (HX50V)
R407 1-240-735-91 METAL CHIP 3.3M 5% 1/20W (HX50V)
R408 1-240-718-91 METAL CHIP 100K 5% 1/20W (HX50V)
R412 (Not supplied) METAL CHIP 680K 5% 1/20W (HX50V)

R413 1-240-707-91 METAL CHIP 10K 5% 1/20W (HX50V)
R414 1-240-718-91 METAL CHIP 100K 5% 1/20W (HX50V)

< COMPOSITION CIRCUIT BLOCK >

RB001 1-234-376-11 RES, NETWORK 2.2K (1005X4)
RB002 1-234-376-11 RES, NETWORK 2.2K (1005X4)
RB003 1-234-376-11 RES, NETWORK 2.2K (1005X4)

< SWITCH >

S002 1-786-914-31 SWITCH, TACTILE
S003 (Not supplied) SWITCH, TACTILE (ZOOM SWITCH)
S004 1-798-035-61 ROTARY SWITCH

< SENSOR >

SE001 (Not supplied) SENSOR, ANGULAR VELOCITY

< SAW FILTER >

SWF001 1-814-589-11 FILTER, SAW (HX50V)
SWF002 (Not supplied) FILTER, SAW (HX50V)

< VIBRATOR >

X401 1-781-525-11 VIBRATOR, CRYSTAL (32.768kHz) (HX50V)
* X402 1-814-554-11 OSCILLATOR, CRYSTAL (16.368MHz) (HX50V)

1-887-951-11 RL-1012 FLEXIBLE BOARD
********************

A-1940-466-A SH-1006 FLEXIBLE BOARD, COMPLETE (BLACK)
A-1940-467-A SH-1006 FLEXIBLE BOARD, COMPLETE (SILVER)
*******************************
(All mounted parts are not supplied, but they are included in SH-1006 FLEXIBLE
COMPLETE BOARD.)

A-1940-469-A ST-1014 FLEXIBLE BOARD, COMPLETE
******************************

< CONNECTOR >

* CN001 1-820-031-71 CONNECTOR, FPC (LIF) 14P

< SENSOR >

* SE001 1-480-627-11 SENSOR, MAGNETIC

A-1940-461-A SW-1006 BOARD, COMPLETE
***********************
(ANT901, C913, C914, CP901 and IC905 are not supplied, but they are included in SW­1006 COMPLETE BOARD.)

< ANTENNA >

ANT901 (Not supplied) WLAN ANTENNA

< CAPACITOR >

C901 1-117-730-81 CERAMIC CHIP 1.2PF 0.1PF 16V
C907 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V
C908 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V
C909 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V
C910 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V

C911 1-116-732-11 CERAMIC CHIP 2.2uF 20% 6.3V
C913 (Not supplied) CERAMIC CHIP 0.1uF 10% 10V
C914 (Not supplied) CERAMIC CHIP 0.1uF 10% 10V

< CONNECTOR >

CN901 1-822-245-61 CONNECTOR, FPC (LIF (NON-ZIF)) 20P

< COMPOSITION CIRCUIT BLOCK >

CP901 (Not supplied) WLAN MODULE

< IC >

IC905 (Not supplied) IC BDS2DJ22GUL-E2

< COMPOSITION CIRCUIT BLOCK >

RB801 1-234-376-11 RES, NETWORK 2.2K (1005X4)
RB802 1-234-376-11 RES, NETWORK 2.2K (1005X4)

< SWITCH >

S801 1-786-914-31 SWITCH, TACTILE
S802 1-786-914-31 SWITCH, TACTILE
* S804 1-786-914-51 SWITCH, TACTILE
S805 1-786-914-31 SWITCH, TACTILE
S806 1-786-914-31 SWITCH, TACTILE

S807 1-798-417-11 SWITCH, ROTARY

1-887-953-11 SW-1007 FLEXIBLE BOARD
*********************

A-1940-895-A SY-1018 BOARD, COMPLETE (SERVICE)
*******************************
(C015, C212, C213, C225, C232, C233, C359, C366, C367, C371, C449, C451, C504,
C505, C706, C708, C709, C710, C713, C716, C717, C718, C719, C720, C722, C723,
C824, CN704, CN711, CN712, D002, D709, IC001, IC002, IC051, IC201, IC402, IC801,
IC805, L002, L003, L005 and L701 are not supplied, but they are included in SY-1018
COMPLETE BOARD (SERVICE).)

< CAPACITOR >

* C001 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V
* C002 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V

C004 1-116-717-11 CERAMIC CHIP 10uF 20% 10V

* C005 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V
* C006 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V

C007 1-116-734-11 CERAMIC CHIP 1uF 20% 16V
C009 1-116-737-11 CERAMIC CHIP 1uF 20% 10V
C010 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C011 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C012 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

* C013 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V
* C014 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V

C015 (Not supplied) CERAMIC CHIP 1uF 10% 25V
C016 1-116-717-11 CERAMIC CHIP 10uF 20% 10V

* C018 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

* C019 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

C020 1-116-737-11 CERAMIC CHIP 1uF 20% 10V
* C023 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
C025 1-116-717-11 CERAMIC CHIP 10uF 20% 10V
C027 1-128-608-91 CERAMIC CHIP 22PF 5% 25V

C028 1-128-608-91 CERAMIC CHIP 22PF 5% 25V
* C051 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
C052 1-116-737-11 CERAMIC CHIP 1uF 20% 10V
C053 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C054 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V

* C056 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C109 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C110 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C112 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

C113 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

C114 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C115 1-164-852-11 CERAMIC CHIP 12PF 5% 50V

C201 1-116-729-11 CERAMIC CHIP 2.2uF 20% 10V

* C208 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C209 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C212 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V
C213 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V

* C216 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C218 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C220 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C222 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C225 (Not supplied) CERAMIC CHIP 2.2uF 10% 25V

* C227 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C228 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C229 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C230 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V
C231 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C232 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V
C233 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V
* C254 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C258 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C259 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C260 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C261 1-164-856-81 CERAMIC CHIP 18PF 5% 50V

* C263 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C265 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C266 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C269 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C270 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C271 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C272 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C273 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C274 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C275 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C276 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C277 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C278 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C279 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C280 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C281 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C282 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C283 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C284 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C285 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C352 1-116-713-11 CERAMIC CHIP 22uF 20% 10V

C354 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C355 1-116-713-11 CERAMIC CHIP 22uF 20% 10V

* C356 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C357 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C358 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C359 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V

* C360 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C361 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C363 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C364 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C365 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C366 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V
C367 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V

* C368 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C369 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

RL-1011 RL-1012 SH-1006 ST-1014 SW-1006 SW-1007 SY-1018

DSC-HX50/HX50V_L3

2-3

Ref. No. Part No. Description

Ref. No. Part No. Description

Ref. No. Part No. DescriptionRef. No. Part No. Description

C371 (Not supplied) CERAMIC CHIP 0.001uF 10% 25V
C404 1-165-897-91 TANTAL. CHIP 22uF 20% 10V

* C405 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C406 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C407 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C408 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C437 1-118-029-11 CERAMIC CHIP 0.0022uF 10% 16V
C438 1-118-029-11 CERAMIC CHIP 0.0022uF 10% 16V
C439 1-116-737-11 CERAMIC CHIP 1uF 20% 10V
C440 1-116-737-11 CERAMIC CHIP 1uF 20% 10V

C442 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C443 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C449 (Not supplied) CERAMIC CHIP 0.047uF 10% 6.3V
C450 1-118-399-11 CERAMIC CHIP 0.0022uF 10% 50V
C451 (Not supplied) CERAMIC CHIP 0.047uF 10% 6.3V

* C452 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C453 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C454 1-118-399-11 CERAMIC CHIP 0.0022uF 10% 50V

* C455 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C457 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C458 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C462 1-116-737-11 CERAMIC CHIP 1uF 20% 10V
C463 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C464 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C465 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V

C466 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V

* C501 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C502 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C503 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

C504 (Not supplied) CERAMIC CHIP 0.01uF 10% 25V

C505 (Not supplied) CERAMIC CHIP 0.01uF 10% 25V
C506 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C507 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

* C511 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C513 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

* C514 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C515 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

C516 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V
C519 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

* C520 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

* C521 1-118-407-11 CERAMIC CHIP 470PF 10% 50V
* C523 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C701 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C702 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C703 1-118-462-11 CERAMIC CHIP 1uF 10% 10V

C705 1-118-041-11 CERAMIC CHIP 4.7uF 10% 10V
C706 (Not supplied) CERAMIC CHIP 1uF 10% 16V
C708 (Not supplied) CERAMIC CHIP 4.7uF 10% 6.3V
C709 (Not supplied) CERAMIC CHIP 2.2uF 10% 6.3V
C710 (Not supplied) CERAMIC CHIP 2.2uF 10% 6.3V

C711 1-118-041-11 CERAMIC CHIP 4.7uF 10% 10V
C713 (Not supplied) CERAMIC CHIP 0.01uF 10% 25V
C714 1-118-041-11 CERAMIC CHIP 4.7uF 10% 10V
C715 1-118-041-11 CERAMIC CHIP 4.7uF 10% 10V
C716 (Not supplied) CERAMIC CHIP 1uF 10% 16V

C717 (Not supplied) CERAMIC CHIP 1uF 10% 25V
C718 (Not supplied) CERAMIC CHIP 1uF 10% 25V
C719 (Not supplied) CERAMIC CHIP 1uF 10% 25V
C720 (Not supplied) CERAMIC CHIP 1uF 10% 16V

C721 1-118-462-11 CERAMIC CHIP 1uF 10% 10V

C722 (Not supplied) CERAMIC CHIP 2.2uF 10% 6.3V
C723 (Not supplied) CERAMIC CHIP 2.2uF 10% 6.3V
C724 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C725 1-164-856-81 CERAMIC CHIP 18PF 5% 50V

* C727 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C728 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C730 1-118-041-11 CERAMIC CHIP 4.7uF 10% 10V
C734 1-128-608-91 CERAMIC CHIP 22PF 5% 25V
C801 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V

* C803 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C810 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
* C811 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C813 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C814 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V

* C815 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C816 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C817 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V

* C818 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C820 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C821 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

* C822 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C823 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V

C824 (Not supplied) CERAMIC CHIP 1uF 20% 6.3V

* C825 1-118-458-11 CERAMIC CHIP 0.1uF 10% 6.3V
* C827 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V

C901 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V
C902 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V
C903 1-118-417-11 CERAMIC CHIP 0.1uF 10% 16V

< CONNECTOR >

* CN405 1-821-503-11 CONNECTOR, FPC (ZIF) 39P
* CN701 1-821-501-11 CONNECTOR, FPC (ZIF) 51P

CN702 1-822-245-61 CONNECTOR, FPC (LIF (NON-ZIF)) 20P
CN703 1-822-769-21 CONNECTOR, FPC (ZIF) 27P
CN704 (Not supplied) CONNECTOR, FPC (ZIF) 55P

CN707 1-821-858-61 CONNECTOR, FPC (LIF (NON-ZIF)) 24P
CN708 1-843-066-11 CONNECTOR, HDMI
* CN709 1-821-502-11 CONNECTOR, FPC (ZIF) 29P
CN711 (Not supplied) CONNECTOR, FPC (ZIF) 4P
CN712 (Not supplied) SOCKET, USB CONNECTOR

* CN713 1-822-768-21 CONNECTOR, FPC (ZIF) 25P

< DIODE >

* D001 6-502-629-01 DIODE 1SS420 (TL3SONY.F)
D002 (Not supplied) DIODE RBE05SM20AGJT2R
* D201 6-502-988-01 DIODE RB480Y-40T2R
D251 6-503-126-01 DIODE DA2S10100K8
D701 6-503-579-01 DIODE RB521SM-30GJT2R

D702 6-503-579-01 DIODE RB521SM-30GJT2R
D703 6-503-579-01 DIODE RB521SM-30GJT2R
D704 6-503-579-01 DIODE RB521SM-30GJT2R
D705 6-503-126-01 DIODE DA2S10100K8
D706 6-502-193-01 DIODE SML-D12V8WT86SN

D707 6-502-934-01 DIODE DB2S31100K8
D708 6-502-934-01 DIODE DB2S31100K8
D709 (Not supplied) DIODE SML-R12D8TT86
D801 6-502-934-01 DIODE DB2S31100K8

D804 6-503-126-01 DIODE DA2S10100K8

< FUSE >

* F001 1-576-842-31 FUSE (0.63A/32V)
 F051 1-576-415-31 FUSE (2A/32V)
 F052 1-576-415-31 FUSE (2A/32V)
* F053 1-576-843-31 FUSE (0.8A/32V)

< FERRITE BEAD >

FB254 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB255 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB256 1-481-984-21 EMI FERRITE (SMD)(1005)
* FB257 1-481-250-11 INDUCTOR, FERRITE BEAD (1005)
FB351 1-481-912-21 EMI FERRITE (SMD) (1005)

FB802 1-481-361-21 FERRITE, EMI (SMD)
FB803 1-481-361-21 FERRITE, EMI (SMD)
* FB805 1-481-250-11 INDUCTOR, FERRITE BEAD (1005)

< IC >

IC001 (Not supplied) IC MB44C031PW-G-ER2E1
IC002 (Not supplied) IC MM3376A50RRE
IC003 6-716-873-01 IC RP109L111DA-TR
IC051 (Not supplied) IC MAX14648EWA+TG1A
IC101 6-716-838-01 IC BU76381GUW-E2

IC201 (Not supplied) IC AVY2G2G05E
IC401 6-716-760-01 IC R2J30503LG
IC402 (Not supplied) IC MM3411A28URE
IC501 6-718-156-01 IC BU76312GUW-E2
IC801 (Not supplied) IC TC7SZ32FU, RSONYJ

IC804 6-713-357-01 IC TC7MBL3257CFTG
IC805 (Not supplied) IC CXD4909GG-T2

< COIL >

L001 1-481-926-11 INDUCTOR 2.2uH
L002 (Not supplied) INDUCTOR 4.7uH
L003 (Not supplied) INDUCTOR 4.7uH
L004 1-481-926-11 INDUCTOR 2.2uH
L005 (Not supplied) INDUCTOR 1.5uH

L006 1-460-369-11 INDUCTOR 33uH
L701 (Not supplied) INDUCTOR 10uH

< TRANSISTOR >

Q051 6-552-999-01 TRANSISTOR RW1E025RPT2CR
Q201 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF
Q202 6-551-202-01 TRANSISTOR LM6K1FS8T2R
Q251 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF
Q701 8-729-050-32 TRANSISTOR 2SC5585TL

* Q801 6-552-354-01 TRANSISTOR DRC3144E0L
Q802 8-729-053-57 TRANSISTOR RN1902FE
Q806 6-552-975-01 TRANSISTOR RW1A030APT2CR
Q807 6-551-630-01 TRANSISTOR RN1102MFV (TL3S
* Q809 6-552-354-01 TRANSISTOR DRC3144E0L

Q810 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF
Q811 6-552-975-01 TRANSISTOR RW1A030APT2CR

< RESISTOR >

R002 1-211-969-11 METAL CHIP 10 0.5% 1/10W

* R052 1-250-543-11 METAL CHIP 100K 1% 1/16W

* R202 1-250-477-11 METAL CHIP 180 1% 1/16W

R203 1-250-515-11 METAL CHIP 6.8K 1% 1/16W
R205 1-218-945-11 METAL CHIP 220 5% 1/16W

R208 1-218-965-11 METAL CHIP 10K 5% 1/16W
R210 1-240-695-91 METAL CHIP 1K 5% 1/20W
R211 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R212 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R213 1-218-945-11 METAL CHIP 220 5% 1/16W

R214 1-218-970-11 METAL CHIP 27K 5% 1/16W
R216 1-218-956-11 METAL CHIP 1.8K 5% 1/16W
R217 1-218-956-11 METAL CHIP 1.8K 5% 1/16W
R251 1-240-683-91 METAL CHIP 100 5% 1/20W
R252 1-240-683-91 METAL CHIP 100 5% 1/20W

R261 1-240-683-91 METAL CHIP 100 5% 1/20W
R270 1-240-683-91 METAL CHIP 100 5% 1/20W
R274 1-240-683-91 METAL CHIP 100 5% 1/20W
R275 1-240-685-91 METAL CHIP 150 5% 1/20W
R276 1-218-961-11 METAL CHIP 4.7K 5% 1/16W

R277 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R283 1-240-687-91 METAL CHIP 220 5% 1/20W
R284 1-240-681-91 METAL CHIP 68 5% 1/20W
R285 1-240-681-91 METAL CHIP 68 5% 1/20W
R292 1-240-695-91 METAL CHIP 1K 5% 1/20W

R293 1-240-695-91 METAL CHIP 1K 5% 1/20W
* R294 1-250-543-11 METAL CHIP 100K 1% 1/16W
R295 1-218-965-11 METAL CHIP 10K 5% 1/16W
* R296 1-250-543-11 METAL CHIP 100K 1% 1/16W
R297 1-218-973-11 METAL CHIP 47K 5% 1/16W

R298 1-250-551-11 METAL CHIP 220K 1% 1/16W
R299 1-250-551-11 METAL CHIP 220K 1% 1/16W
R302 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R303 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R304 1-218-965-11 METAL CHIP 10K 5% 1/16W

R351 1-208-668-11 METAL CHIP 240 0.5% 1/16W
* R408 1-248-350-11 RES-CHIP 1.5 1% 1/3W
R418 1-208-711-11 METAL CHIP 15K 0.5% 1/16W
R431 1-218-952-11 METAL CHIP 820 5% 1/16W
R439 1-218-952-11 METAL CHIP 820 5% 1/16W

* R463 1-245-671-11 METAL CHIP 39K 0.5% 1/20W
* R464 1-245-671-11 METAL CHIP 39K 0.5% 1/20W

R465 1-240-794-11 METAL CHIP 2.7K 0.5% 1/20W
R466 1-240-794-11 METAL CHIP 2.7K 0.5% 1/20W
R467 1-240-794-11 METAL CHIP 2.7K 0.5% 1/20W

R468 1-240-794-11 METAL CHIP 2.7K 0.5% 1/20W
R471 1-240-808-11 METAL CHIP 10K 0.5% 1/20W
R472 1-218-848-11 METAL CHIP 1.1K 0.5% 1/10W
R473 1-218-973-11 METAL CHIP 47K 5% 1/16W
R477 1-240-707-91 METAL CHIP 10K 5% 1/20W

R478 1-240-707-91 METAL CHIP 10K 5% 1/20W
R495 1-218-947-11 METAL CHIP 330 5% 1/16W
R505 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R507 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R508 1-218-945-11 METAL CHIP 220 5% 1/16W

R513 1-218-971-11 METAL CHIP 33K 5% 1/16W
R514 1-218-945-11 METAL CHIP 220 5% 1/16W
R701 1-240-699-91 METAL CHIP 2.2K 5% 1/20W
R702 1-240-699-91 METAL CHIP 2.2K 5% 1/20W
R705 1-218-959-11 METAL CHIP 3.3K 5% 1/16W

SY-1018

DSC-HX50/HX50V_L3

2-4E

Ref. No. Part No. Description

R706 1-218-945-11 METAL CHIP 220 5% 1/16W
R710 1-240-695-91 METAL CHIP 1K 5% 1/20W
R735 1-218-953-11 METAL CHIP 1K 5% 1/16W
R801 1-240-718-91 METAL CHIP 100K 5% 1/20W
R802 1-240-701-91 METAL CHIP 3.3K 5% 1/20W

R804 1-240-701-91 METAL CHIP 3.3K 5% 1/20W
R809 1-240-718-91 METAL CHIP 100K 5% 1/20W
R810 1-240-703-91 METAL CHIP 4.7K 5% 1/20W
R813 1-240-683-91 METAL CHIP 100 5% 1/20W
R814 1-240-718-91 METAL CHIP 100K 5% 1/20W

R815 1-240-714-91 METAL CHIP 47K 5% 1/20W
R817 1-240-729-91 METAL CHIP 1M 5% 1/20W
R822 1-250-495-11 METAL CHIP 1K 1% 1/16W
R823 1-220-803-81 METAL CHIP 4.7 5% 1/16W
R825 1-218-941-81 METAL CHIP 100 5% 1/16W

R826 1-218-941-81 METAL CHIP 100 5% 1/16W
R838 1-218-953-11 METAL CHIP 1K 5% 1/16W
R839 1-218-977-11 METAL CHIP 100K 5% 1/16W
R840 1-218-985-11 METAL CHIP 470K 5% 1/16W
R841 1-218-985-11 METAL CHIP 470K 5% 1/16W

< COMPOSITION CIRCUIT BLOCK >

RB251 1-234-702-11 RES, NETWORK 68 (1005X4)
RB252 1-234-702-11 RES, NETWORK 68 (1005X4)
RB253 1-234-702-11 RES, NETWORK 68 (1005X4)
RB254 1-234-702-11 RES, NETWORK 68 (1005X4)
RB255 1-234-702-11 RES, NETWORK 68 (1005X4)

RB256 1-234-702-11 RES, NETWORK 68 (1005X4)
RB257 1-234-381-11 RES, NETWORK 100K (1005X4)
RB258 1-234-378-21 RES, NETWORK 10K (1005X4)
RB259 1-234-371-11 RES, NETWORK 47 (1005X4)
RB260 1-234-371-11 RES, NETWORK 47 (1005X4)

RB261 1-234-373-21 RES, NETWORK 220 (1005X4)
RB262 1-234-372-11 RES, NETWORK 100 (1005X4)

< SENSOR >

SE401 8-826-002-51 GYRO SENSOR GSU-X370D/N-S(1) (PITCH/YAW)
SE901 1-490-064-22 SENSOR 3 AXIAL ACCELERATION

< THERMISTOR >

TH251 1-805-194-21 THERMISTOR, NTC (SMD)

< VIBRATOR >

X101 1-795-602-61 VIBRATOR, CRYSTAL (32.768kHz)
X201 1-487-897-31 SILICON OSCILLATOR (12MHz)

SY-1018

4-1

DSC-HX50/HX50V_L3

4. BLOCK DIAGRAMS

4-1. OVERALL BLOCK DIAGRAM (1/2)( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

BL_L

BL_H

CN405

LENS

LENS BLOCK

IRIS

(METER)

IRIS

MOTOR

MR_+/-

SHUTTER

MOTOR

PITCH+/-

LENS_TEMP

XZM_RST_LED

OPTICAL IMAGE STABILIZER

FOCUS_+/-

IRIS_A/B/XA/XB

ZOOM+/-

MSHUT+/-

XZM_FG_LED

ZM_DC_FG_A/B

ZM_SENS_1ST

X201

12MHz

G3

L1

IMGR_RST

CN701

CD-1005 FLEXIBLE BOARD

GEN_CLK_OUT

SDI, SDO

CMOS

IMAGER

CP001

SCK, XCE

SY-1018 BOARD (1/2)

MSHUT_EN/DIR

IRIS_DIR_A/B, IRIS_BRK_A/B, ZM_BRK_A

XSYS_RESET

CLK_IC_401, XCS_IC_401,
CAM_V, IC_401_INT_REQ,
IC_401_EXPOSE, IC_401_P_LIMIT

IC_401_SI/SO/SCK

XIC_401_RST

CMOS_CLK_OUT

IMGR_RST

SENS_HD

SENS_SI/SO
SENS_SCK/XCS

IC_401_VD

ZM_DC_FG_A/B, XZM_FG_LED,
ZM_SENS_1ST, XZM_RST_LED,
LENS_TEMP

SE401
PITCH_AD
YAW_AD

AH2

D1

08

DOAP - DOJP, DOAM - DOJM,
DCKP, DCKM

PITCH_HALL+/-, PITCH_BIAS-

YAW_HALL+/-, YAW_BIAS-

YAW+/-

OIS DRIVE,

IRIS/FOCUS/

ZOOM/SHUTTER

MOTOR DRIVE

(7/11)

SENS_DATA_P1 - P10, SENS_DATA_M1 - M10, SENS_CLK_P/M

SENS_VD

XHS

H3

20 - 41

10

11
2, 3
5, 7

8

5 - 8
1 - 4

36 - 39

22
23

24, 27

25

34, 35

29, 31

32

19, 20

13 - 15

17, 18

10 - 12

14

XVS

H2

W1
W2

AK29
AK28

E3

P25

F5

IC401

PITCH/YAW

SENSOR

(7/11)

SE001
POP-UP
DETECT

M

M

ZOOM

MOTOR

FOCUS

MOTOR

YAW

MOTOR

ZOOM
RESET

SENSOR

FOCUS

MR

SENSOR

LENS TEMP

SENSOR

HALL

ELEMENT

ZOOM

FG

PITCH

MOTOR

HALL

ELEMENT

3.0 INCH
COLOR

LCD

BACKLIGHT

LCD901

(LCD MODULE)

CN704

CN711

30 - 45

26
25
28
52

50, 51

1, 2
3, 4

BL_L

BL_H

AFLED_ON

XAF_LED

XRESET_REQ

XCS_DD

AFLED_ON

XRESET_REQ

XCS_DD

XSYS_RESET

XCS_LCDXCS_LCD

LCD_HS
LCD_VS

LCD_HS
LCD_VS

LCD_CLK_OUTLCD_CLK_OUT

AV_SO /SC KAV_SI/SO/SCK

LCD_R_D0 - D7, LCD_G_D0 - D7, LCD_B_D0 - D7 LCD_G_D0 - D7, LCD_B_D0 - D7

AV_SI/SO/SCK

AV_SI/SO/SCK

XDIRECT_PB

XMS_IN, XEXT_IN

I2C_SDA,
I2C_SCK

I2C_SDA,
I2C_SCK

I2C_SDA,
I2C_SCK

XUSB_LED

XCS_AUDIO

DC/DC

CONVERTER

(1/11)

IC001

FRONT

CONTROL

(3/11)

IC101

IC201

(1/2)

USB INTERFACE

(2/11)

3 AXIAL

ACCELERATION

SENSOR

(11/11)

IC051

SE901

D7

XSYS_RESET

XSYS_RESET

C3

MULTI

2,4,7,8,10,11,

13,16,17,20

1,3,6,

15,21,23

14

HDMI

3,5,6,8,9,

11,12,14

1

15

17, 18

HDMI_DATA0P/N - HDMI_DATA2P/N, HDMI_CLOCKP/N

HDMI_SDA/SCL

HDMI_CEC

XEXT_IN

XMS_IN

XEXT_IN

XMS_IN

TE0_XSDCD

MSX_INS_HIZ_MPU

D708

D707

TE0_SDWP

TE0_SDWP

MSX_D0 - 7, MSX_CLK/BS

SD_DAT0 - 3, SD_CLK/CMD

MSX_D0 - 7,
MSX_CLK/BS

SD_DAT0 - 3,
SD_CLK/CMD

HDMI_SDA/SCL

CEC_INOUT

HPD

2, 3

15

CN712

CN002CN001

1,4,10 - 12,

18 - 20,26,27

3,22,23,

25,28,29

5

9

8

1,4,10 - 12,

18 - 20,26,27

3,22,23,

25,28,29

5

9

8

CN709

USB_CN_DP/DMUSB_DP/DM

9

8

UART0_DBG_ACC_TXD
UART0_DBG_ACC_RXD

12

11

XAE_LOCK_SW
XSHUT_SW

UART0_DBG_ACC_TXD
UART0_DBG_ACC_RXD
BOOT_SERIAL_IN

ACC_INT

XPWR_ON_ACC

XPWR_ON_ACC

10

AD_JACK_IN

AD_JACK_IN

LEVEL SHIFT

Q202

LEVEL SHIFT

Q201

XEXT_IN

XMS_IN

TE0_SDWP

MEMORY

STICK

PRO DUO

SD

: VIDEO SIGNAL
: VIDEO/AUDIO SIGNAL

TH251

AV_SO/SCK

X101

32.768kHz

E1

D1

AC29
AC30

AF2

AB17

XPWR_ON

XDIRECT_PB
XPWR_ON

7

XRESET_REQ

HPD

CN708

CPU,

CAMERA DSP,

AV SIGNAL PROCESS,

LENS CONTROL,
MODE CONTROL,
HDMI PROCESS

(4/11 - 6/11)

LCD_HS
LCD_VS

LCD_R_D0 - D7,
LCD_G_D0 - D7,
LCD_B_D0 - D7

OVERALL (2/2)

(PAGE 4-2)

1

OVERALL (2/2)

(PAGE 4-2)

2

7

8
9

10

BT-2006 FLEXIBLE BOARD (1/2)

ST_UNREG

Q101

FLASH
DRIVE

IC101

XE_A

XE_K

XE_A

XE_K

XE_A

XE_K

D101

T101

XSTRB_FULL

CN707
(1/2)

CN101
(1/2)

STRB_CHG

STRB_ON

+

D705

C901, C902
CHARGING
CAPACITOR

FLASH

UNIT

STRB_CHG_CNT

XSTRB_FULL

STRB_CHG
STRB_CHG_CNT

STRB_ON

+

FLASH

CONTROL,

CHARGE

CONTROL

(2/2)

D706

(ACCESS)

XMS_ACC_LED

22

15 - 17

2 - 4

ST-1014
FLEXIBLE
BOARD (1/2)

MS-505
FLEXIBLE
BOARD

MS-1013 BOARD

FL-2000
FLEXIBLE
BOARD

CN001

12 - 14

1 - 3

D001

SELF-TIMER,
SMILE SHUTTER,
AF ILLUMINATOR

12

3

XAF_LED

STRB_POPUP_SENSSTRB_POPUP_SENS

D009

(CHARGE)

M

M

M

M

4-2

DSC-HX50/HX50V_L3

4-2. OVERALL BLOCK DIAGRAM (2/2)( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

EVF/STROBE

SWITCH

(10/11)

IC804

LEVEL
SHIFT

Q802

VIDEO

TRANSMITTER

(10/11)

IC805

AUDIO

PROCESSOR

(8/11)

IC501

STROBE SWITCH

(10/11)

IC801

SH-1006 FLEXIBLE BOARD

SY-1018 BOARD (2/2)

MIC_R/GVIF_SDATA_P

1 - 3

ID1 - ID3

22

X_contact

CN001

CN713

CN901CN702

MULTI

INTERFACE

SHOE

18, 19

20 - 226, 7

12

F2/EXT_EVF_SI,
F3/EXT_EVF_SCK

F1/EXT_EVF_SO

GVIF_SDATA_P/MIC_R

IHS_ID1 - ID3IHS_ID1 - ID3

LCD_HS
LCD_VS

LCD_DATEN

X_CONTACT

IHS_SIO_SEL

Q807

F1/EXT_EVF_SO_R

18

5

5

20

F2/EXT_EVF_SI,

F3/EXT_EVF_SCK

EXT_EVF_SI/SO/SCK

EXT_STRB_SI

EXT_STRB_SO

MIC_L/GVIF_SDATA_NGVIF_SDATA_N/MIC_L

SHOE_MIC_R

SHOE_MIC_L

14

6

Q801

EXT_STRB_SCK
EXT_STRB_CONT

EXT_STRB_ON

F2_IC_201,
F3_IC_201,
EXT_STRB_ON

LCD_R_D0 - D7,
LCD_G_D0 - D7,
LCD_B_D0 - D7

D7

E7

MIC002

(MICROPHONE) (L)

MIC_SIG_L

MIC_SIG_R

INT_MIC_L
INT_MIC_R

INT_MIC_L

INT_MIC_R

25

1

MIC001

(MICROPHONE) (R)

OVERALL (1/2)

(PAGE 4-1)

1

1, 2

SP901

(SPEAKER)

BT-2006
FLEXIBLE
BOARD (2/2)

ST-1014
FLEXIBLE
BOARD (2/2)

SW-1007
FLEXIBLE
BOARD

SW-1006 BOARD

IC_201_I2S_SDI0

IC_201_I2S_SDO

IC_201_I2S_BCLK/WCLK,
IC_201_AUDIO_MCLK

BEEP_PWM_P

XCS_IC_501_2

CN707

(2/2)

23, 34

SP+/- SP+/- SP+/-

IC201

(2/2)

CPU,

CAMERA DSP,

AV SIGNAL PROCESS,

LENS CONTROL,
MODE CONTROL,

HDMI PROCESS

(4/11 - 6/11)

08

AV_SO /SC K

ANT901

WLAN_SD_CLK/CMD

WLAN_RST

WLAN_SD_D0 - D3

WIRELESS LAN

MODULE

(2/2)

CP901

CONTROL

SWITCHES

S801, S802,
S804 - S807

WIRELESS LAN

ANTENNA

31

K16

: VIDEO SIGNAL
: AUDIO SIGNAL
: VIDEO/AUDIO SIGNAL

CN101

(2/2)

19

15 - 18

XDIRECT_PB

5

13, 14

JOGDIAL_A/B

1, 2

KEY_AD1/AD2

3, 4

19

15 - 18

5

13, 141, 2 3, 4

WLAN_SD_CLK/CMD

XWLAN_RST

WLAN_SD_D0 - D3

XDIRECT_PB

JOGDIAL_A/B

KEY_AD_1/2

WLAN_SD_CLK/CMD

XWLAN_RST

WLAN_SD_D0 - D3

JOGDIAL_A/B

KEY_AD_1/2

CONTROL
SWITCHES

S002 - S004

XPWR_ON

14

7, 8

XSHUT_SW

9

XAE_LOCK

MODE_DIAL0,
MODE_DIAL1

10

4, 5

4, 5

EV_DIAL_0/1EV_DIAL_0/1 EV_DIAL_0/1

CN001 CN703

CN003

RL-1012
FLEXIBLE
BOARD

RL-1011 BOARD

RF AMP

(3/3)

IC405

SAW

FILTER

SWF002

ANT402

(GPS ANTENNA)

SAW

FILTER

SWF001

GPS

RECEIVER

(3/3)

IC404

LEVEL SHIFT

(3/3)

IC403

Q401

25

13
11

19

18

17

GPS_TX_M
GPS_RTS_M

IC_201_GPS_UI
IC_201_GPS_CTS

IC_201_RDY

GPS_RST

IC_201_GPS_UO
IC_201_GPS_RTS

21

20

14

7, 8

9

10

4, 5

25

13
11

19

18

17

21

20

GPS_RX_M
GPS_CTS_M

BUF_ENABLE

GPS_RST_M

ROLL_AD
VST_C_RESET_R

AE16

A4

D1

X401

32.768kHz

X402

16.368MHz

H5

H4

HX50V

CONTROL

SWITCH
BLOCK

(SW63470)

XPWR_ON

XSHUT_SW
XAE_LOCK_SW

MODE_DIAL_0,
MODE_DIAL_1

ROLL_AD
VST_C_RESET_R

KEY_AD0

3 3

KEY_AD_0

ROLL SENSOR

AMP
(2/3)

IC001

ROLL

SENSOR

(2/3)

SE001

XAE_LOCK_SW

XSHUT_SW

XDIRECT_PB

XPWR_ON

OVERALL (1/2)

(PAGE 4-1)

2

4-3

DSC-HX50/HX50V_L3

4-3. POWER BLOCK DIAGRAM (1/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

21,26,28

BT901

BATTERY

TERMINAL

SY-1018 BOARD (1/2)

BATT_UNREG

BATT_UNREG

REG_UNREG

REG_UNREG

ST_UNREG

BATT_TEMP

BATT_UNREG

BATT_TEMP

BATT_TEMP

REG_GND

CN712

Q051

F051

S

HDMI_5.0V

USB_VBUS

19

1

USB_VBUS_DET

USB_VBUS_DET

08

15

XPWR_ON_ACC

CN704

CN711

D701

CN701

CN405

A_3.3V

A_3.3V

DD_3.3V

VINT1

VDD

VDDIO

DRV

ST_UNREG
REG_UNREG

CD-1005 FLEXIBLE BOARD

MULTI

HDMI

F052

NEGATIVE
VOLTAGE

PROTECTOR

VB

NVP

D3

SFOUTC4

THM

C1

PVCC1

A_VID, D_VID

B1

A5, B5

BATT

A3, B3

F053

PVCC2A3

PVCC3A4

PVCC4E8

LX5G1

AUX_PWR_ON

SD_PWR_ON

C5

A4, B4

SYS

LX1

C1

IN1

D2

USB

INTERFACE

(2/11)

IC051

DC/DC CONVERTER

(1/11)

IC001

FRONT CONTROL

(3/11)

IC101

Q251

L001

DD_1.2V

LX2 A2
IN2

C3

L002

DD_1.8V, A_1.8V

LX3 A5
IN3

B6

L003

L006

D002

L005

F001

DD_3.3V, A_3.3V

MT_5.0V

VO4 B7

VL6

F8

PSWOUT5

G3

BL_H

BL_L

LX6 G7

OVP6

F7

IN4

C7

DD_1.8V
DD_3.3V

MS_PWR_ON

MS_PWR_ON

C6

PWM6

CABC_PWM

F6

XCTRL

XWAKE

D3

XWAKE

F1

EXT_VCC

AUX_PSW

A7

MS_VCC

MS_PSW

A8

DDR_1.2V

VOUT2

B3

DDR_1.8V

VOUT3

B4

DD_1.2V

DD_1.8V, A_1.8V

DD_3.3V, A_3.3V

EXT_VCC
DDR_1.2V
DDR_1.8V

EVER_VDD

EVER_VDD

BACKUP_VDD

VOUT1

C4

D251

D001

FRC_RTG_IN1

SD_PWR_ON

GPIO_S_6

MS_PWR_ON

P24

LCD_CABC_PWM

CABC_PWM

UNREG_MON

BATT_SENS

F2

ADC0_IN0

A11

XPWR_OFF

XPWR_OFF

BATT_SENS
XPWR_OFF

USB_CUR_LIM

D4

XPWR_ON4

XUSB_PWR_ON

F4

XPWR_ON2

XPWR_ON_ACC

G3

XPWR_ON3

XDIRECT_PB

F3

XPWR_ON1E3

USB_VBUS

A2

GPIO_SB_1

V25

MT_5.0V
HDMI_5V_ON

HDMI_5V_ON

TPU5_OUT

AJ8

CTYP

USB_PWR_EN

AF21

XUSB_PWR_EN

IRIS1

A16

XINT_CHG

DC_PLATE_JUDGE

USB_VBUS_DET

GPIO_SB__4

U24

ADC1_IN0

USB_CUR_LIM

IDEFA1

CTYP

CTYP

A2

6

DD_3.3V

XUSB_PWR_EN

STDBB1

XUSB_PWR_ON

UOK1C3

XINT_CHG

nINT

E1

DC PLATE

JUDGE
SWITCH

TPU3_OUT

USB_VBUS

AJ20

5.0V REG
(1/11)

IC002

VOUT

4VDD3

CE

2

DD_3.3V

FRC_RTG_OUT2

A_VID
D_VID

DD_3.3V

DD_3.3V

DD_3.3V
DD_1.2V
MT_5.0V

LDO_1.125V

GVIF_ON

IC_401_2.8V

2.8V REG
(7/11)

IC402

VDD

4

CE

1

VOUT

3

MIC_REG_L

D6

MIC_REG_R

E6

OIS DRIVE,

IRIS/FOCUS/

ZOOM/SHUTTER

MOTOR DRIVE

(7/11)

IC401

AUDIO PROCESSOR

(8/11)

IC501

VIDEO TRANSMITTER

(10/11)

IC805

CE

G7

FB351

FOR

MICROPHONE

CIRCUIT

A_3.3V

A_2.8V

2.8V REG

LENS

BLOCK

3 AXIAL

ACCELERATION

SENSOR

(11/11)

SE901

IC001

CMOS

IMAGER

CP001

VDD

4

CE

3

VOUT

1

DD_1.8V

DD_1.8V

DD_3.3V
DD_1.8V

MIC_REG_R

1.125V REG
(1/11)

IC003

VDD

3

CE

4

GPIO_E__0

L14

Vout1

3.0 INCH
COLOR

LCD

BACKLIGHT

LCD901

(LCD MODULE)

48

16, 1748, 4944, 45

20

18

8

30

BL_H

BL_L

IO_1.8V

D_LGC_1.2V

LVDS_1.8V

DD_1.2V

DD_1.8V

DD_3.3V

SE401

PITCH/YAW

SENSOR

(7/11)

IC_401_2.8V

CN708

D709

(CHARGE)

XPWR_ON

AB10

AF10
Y10

G9

AL7

IC_401_2.8V

BACKUP_VDD

DD_1.2V

DD_1.8V

PSWIN3 B5
PSWIN2

B2

POWER (2/2)

(PAGE 4-4)

B

CN707
(1/2)

BT-2006
FLEXIBLE
BOARD
(1/2)

20

21 - 24

L701

Q701

DISCHARGE

1, 23, 4

CPU, CAMERA DSP,

AV SIGNAL PROCESS, LENS CONTROL,

MODE CONTROL, HDMI PROCESS

(4/11 - 6/11)

IC201

(1/2)

D_3.3V,

A_3.1V

MT_5.0V

MS_VCC

EXT_VCC

EVER_VDD

DD_1.8V

IC_401_2.8V

POWER (2/2)

(PAGE 4-4)

A

FB805

DSC-HX50/HX50V_L3

4-4E

2.8V REG
(3/3)

IC401

VDD

4

ND_DIR_B

H17

ND_DIR_A

H18

OUT 2

GPS_UNREG

CN001

GPS_EN_M

1.8V

A_3.1V

CN003

EVER_VDD

4.2V REG
(3/3)

IC402

D401

VDD

4

EN3

GPS

RECEIVER

(3/3)

IC404

RF AMP

(3/3)

IC405

LEVEL SHIFT

(3/3)

IC403

TIMER

G5

OUT

1

T101

CN707

(2/2)

BT-2006 FLEXIBLE BOARD (2/2) FL-2000

FLEXIBLE
BOARD

ST_UNREGST_UNREG

IC101

XE_A XE_A

CN001

D101

+ +

FLASH CONTROL,

CHARGE CONTROL

(2/2)

C901, C902
CHARGING
CAPACITOR

IC804

EVF/STROBE

SWITCH

(10/11)

IC801

STROBE
SWITCH

(10/11)

5

14, 15

23

24

A_3.1V

6

IC_401_2.8V

12

12 - 14

26, 27

1, 2

BT001
LITHIUM
BATTERY

D_3.3VD_3.3V

MT_5.0V

D_3.3V

13

11

BACKUP_VDD

MT_5.0V

BACKUP_VDD

ST_UNREG

D_3.3V,

A_3.1V

MT_5.0V

BACKUP_VDD

FLASH

UNIT

ST-1014 FLEXIBLE
BOARD

SW-1007
FLEXIBLE
BOARD

SW-1006 BOARD

CN001

15 - 17

RL-1011 BOARDRL-1012
FLEXIBLE
BOARD

CONTROL

SWITCH

BLOCK

(SW63470)

XPWR_ON

14

20

ROLL SENSOR

AMP
(2/3)

IC001

ROLL SENSOR

SE001

POP-UP

DETECT

SE001

S002

ON/OFF

23

24

6

12

26, 27

14

REG_UNREG

CN703

GPS_ON

GPS_ON

EVER_VDD

A_3.3V

IC_401_2.8V

XPWR_ON

XPWR_ON

SY-1018 BOARD (2/2)

D001

SELF-TIMER,
SMILE SHUTTER,
AF ILLUMINATOR

MS-505
FLEXIBLE
BOARD

MS-1013
BOARD

15, 166, 7

CN002

CN001

MS_VCC

19

EXT_VCC

15, 166, 7

CN709

12

MS_VCC

MS_VCC

EXT_VCC

EXT_VCC

MEMORY

STICK

PRO DUO

SD

DD_1.8V

WLAN_VH_ON

WLAN_VL_ON

XDIRECT_PB

B+ SWITCH

(2/2)

IC905

WIRELESS LAN

MODULE

(2/2)

CP901

Vout1

Vin1B1
EN1

A2

Vout2

A4

Vin2

B4

EN2A3

VccB2

A1

DD_3.1V

DD_1.8V

WLAN_VH_ON
WLAN_VL_ON

DD_3.3V

CN901

CN702

11

9

10

7

11

5

9

10

7

S801

XDIRECT_PB

5

8, 9

SH-1006 FLEXIBLE
BOARD

UNREG ST UNREG

SHOE_UNREG_ON

CN001

CN713

17

LOGIC_VDD

13

11

MULTI

INTERFACE

SHOE

B+ SWITCH

Q806, Q809

DD_3.3V

ST UNREG_SHOE

ACC_3.1V_SHOE

ST_VCC_ON

DD_3.3V

08

B+ SWITCH

Q810, Q811

CPU, CAMERA DSP,

AV SIGNAL PROCESS, LENS CONTROL,

MODE CONTROL, HDMI PROCESS

(4/11 - 6/11)

IC201

(2/2)

TE1_DAT_6

K15

TE1_DAT_5

L16

EXTIN_CLK1

AD16

REG_UNREG

EVER_VDD

DD_1.8V

IC_401_2.8V

POWER (1/2)

(PAGE 4-3)

A

POWER (1/2)

(PAGE 4-3)

B

D706

(ACCESS)

HX50V

4-4. POWER BLOCK DIAGRAM (2/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

DSC-HX50/HX50V_L3

5-1E

5. FRAME SCHEMATIC DIAGRAMS

41

2

155

54

1

238

39

1

1

250

51

51

1

224

25

1

1

1

1

1

2

20

20

20

26

27

27

127

CN405

IC001

(Not supplied)

IC201

(Not supplied)

IC402

(Not supplied)

IC801

(Not supplied)

IC051

(Not supplied)

CN701

CN702

CN703

CN704

CN711

CN713

1

1

24

24

19 1

1

15

615

228

29

IC002

(Not supplied)

IC805

(Not supplied)

SE401

PITCH/YAW

SENSOR

CN707

CN708

CN709

CN712

IC501

(Not supplied)

1

1

24

24

CN101

CP001

(Not supplied)

126

27 28

1

228

29

CN002

CN001

S002

S003

S004

(MODE DIAL)

1

2

26
27

16

CN001

CN003

IC001

(Not supplied)

IC401

(Not supplied)

IC402

(Not supplied)

1121

25

23 24

22

CN001

MIC001

(MICROPHONE) (R)

MIC002

(MICROPHONE) (L)

114

CN001

S801

S802

S804

S805

(DELETE)

S806

S807

IC905

(Not supplied)

120

CN901

SY-1018 BOARD
(SIDE A)

SY-1018 BOARD
(SIDE B)

SW-1006 BOARD
(SIDE A)

SW-1007
FLEXIBLE
BOARD

RL-1012
FLEXIBLE
BOARD

SW-1006 BOARD
(SIDE B)

BT-2006 FLEXIBLE BOARD

SH-1006
FLEXIBLE
BOARD

ST-1014
FLEXIBLE
BOARD

CD-1005 FLEXIBLE BOARD

MS-1013 BOARD

RL-1011 BOARD (SIDE A)

RL-1011 BOARD (SIDE B)

291

291

MS-505
FLEXIBLE
BOARD

FL-2000
FLEXIBLE BOARD

1

14

FLASH

UNIT

LCD901

(LCD MODULE)

BACKLIGHT

3.0 INCH
COLOR

LCD

MOVIE

CUSTOM

MULTI

HDMI

CONTROL

WHEEL

MENU

SHUTTER,

ZOOM

ON/OFF

C901, C902

(CHARGING CAPACITOR)

C902

C901

S

BT901
BATTERY
TERMINAL

BT001

(LITHIUM BATTERY)

LENS BLOCK

CONTROL

SWITCH

BLOCK

(SW63470)

SP901

(SPEAKER)

RED

BLK

6-1

DSC-HX50/HX50V_L3

6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS

– ENGLISH – – JAPANESE –

THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS.
(In addition to this, the necessary note is printed in each block.)

For Schematic Diagrams

• All capacitors are in μF unless otherwise noted. pF : μ μF. 50
V or less are not indicated except for electrolytics and tantal­ums.

• Chip resistors are 1/10 W unless otherwise noted.

kΩ=1000 Ω, MΩ=1000 kΩ.

• Caution when replacing chip parts.

New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum capacitor,

Because it is damaged by the heat.

• Some chip part will be indicated as follows.

Example C541 L452
22U 10UH
TA A 2520

Kinds of capacitor External dimensions (mm)
Case size

• Constants of resistors, capacitors, ICs and etc with XX indicate
that they are not used.

In such cases, the unused circuits may be indicated.

• Parts with ★ differ according to the model/destination.

Refer to the mount table for each function.

• All variable and adjustable resistors have characteristic curve
B, unless otherwise noted.

• Signal name

XEDIT → EDIT PB/XREC → PB/REC

•

: non flammable resistor

•

: fusible resistor

•

: panel designation

•

: B+ Line

•

: B– Line

•

: IN/OUT direction of (+, –) B LINE.

•

: adjustment for repair.

For Printed Wiring Boards

•

: Uses unleaded solder.

• : Circuit board
: Flexible board

Pattern from the side which enables seeing.
: pattern of the rear side
(The other layers’ patterns are not indicated)

• Through hole is omitted.

• There are a few cases that the part printed on diagram isn’t

mounted in this model.

•

: panel designation

• Chip parts.

Transistor Diode

21321321

3

345

21

123

654

EB

C

3152

46

123

654

3152

46

123

54

43

12

312

45

534

12

14

23

4625

31

12

43

14

23

Precautions for Replacement of Imager

• If the imager has been replaced, carry out all the adjustments
for the camera section.

• As the imager may be damaged by static electricity from its
structure, handle it carefully like for the MOS IC.

In addition, ensure that the receiver is not covered with dusts

nor exposed to strong light.

When indicating parts by reference num­ber, please include the board name.

The components identified by mark 
or dotted line with mark  are critical
for safety.
Replace only with part number speci­fied.

Les composants identifiés par une mar­que  sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.

回路図，プリント図共通ノート

（他に必要なノートは各セクションに記載しています）

回路図ノート

・ ケミコン，タンタルを除くコンデンサで，耐圧50V以下のも

のはその耐圧を省略。単位はすべてμF（pはpF）。

・ チップ抵抗で指示のないものは，1/10W以下。

 kΩ＝1000Ω，MΩ＝1000kΩ

・ チップ部品交換時の注意

 取り外した部品は再使用せず，未使用の部品をご使用くだ

さい。

 タンタルコンデンサのマイナス側は熱に弱いため注意して

ください。

・ チップ部品には下記のように表示したものがあります。

  例 C541 L452
  22U 10UH
  TA A 2520

  種類      外形寸法（mm）
   ケースサイズ

・ 抵抗，コンデンサ，ICなど定数にXXがあるものは，使用し

ていない事を示しています。このため，使用していない回
路が記載されている事があります。

・ ★印のある部品は，機種などにより異なりますので機能別

マウント一覧表を参照してください。
・ 可変抵抗と半固定抵抗で，B特性の表示を省略。
・ 信号名表記について，下記のような場合があります。

 XEDIT → EDIT    PB/XREC → PB/REC

・ は不燃性抵抗。
・ はヒューズ抵抗。
・ はパネル表示名称。
・ はB＋ライン。
・ はB−ライン。
・ はBライン（＋，−）の入出力方向を示す。
・ は調整名称。

プリント図ノート

・ ：無鉛半田を使用しています。
・ ：基板

 ：フレキシブル配線板
 見ている面側のパターン。
 ：裏側のパターン

 （他のパターンについては表示されていません）
・ スルーホールは省略。
・ プリント図には，本機で使用していない部品が記載されて

いる場合があります。

・ はパネル表示名称。

• Chipparts.

 Transistor          Diode

21321321

3

345

21

123

654

EB

C

3152

46

123

654

3152

46

123

54

43

12

312

45

534

12

14

23

4625

31

12

4

3

14

23

イメージャ交換時の注意

・ イメージャを交換した場合は，カメラ部の全調整を行って

ください。

・ イメージャは構造上，静電気により破壊される恐れがある

ため，MOSICと同様に注意して取り扱ってください。

 また，受光部にはゴミの付着，および強い光がはいること

のないように注意してください。

図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。

お願い

印の部品，または印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。