Sony DR-BT21G Service Manual
DR-BT21G
SERVICE MANUAL
Ver. 1.1 2007.06
SPECIFICATIONS
General
Communication System
Bluetooth Specification version 2.0
Output
Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (30 ft)
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS
Compatible Bluetooth Profiles
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HSP (Headset Profile)
HFP (Hands-free Profile)
Supported Codecs
SBC*4, MP3
Transmission range (A2DP)
20 - 20,000 Hz (Sampling frequency 44.1KHz)
Supplied accessory
AC power adaptor (1)
Operating instruction (1)
*1
The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, reception sensitivity, aerial’s performance, operating
system, software application, etc.
*2
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
*3
Codec: Audio signal compression and conversion format
*4
Subband Codec
*3
*1
*2
US Model
Canadian Model
UK Model
E Model
Australian Model
Chinese Model
Headset
Power source
DC 3.7 V: Built-in lithium-ion
rechargeable battery
Mass
Approx. 63 g (2.3 oz)
Rated power consumption
1.5 W
Receiver
Type
Open air, dynamic
Driver unit
30 mm dome type
Reproduction frequency range
14 – 24,000 Hz
Microphone
Type
Omni directional, electret condenser
Effective frequency range
100 – 4,000 Hz
Design and specifications are subject to change without notice.
9-887-599-02
2007F02-1
© 2007.06
WIRELESS STEREO HEADSET
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
DR-BT21G
TABLE OF CONTENTS
1. GENERAL........................................................................... 2
2. DISASSEMBLY
2-1. Disassembly Flow ························································ 3
2-2. Driver (R-CH) ······························································ 3
2-3. Housing Upper (R) Sub Assy······································· 4
2-4. Main Board ·································································· 4
2-5. Driver (L-CH) ······························································ 5
2-6. Housing Upper (L) Sub Assy ·······································5
2-7. Charger Board ······························································ 6
3. DIAGRAMS
3-1. Block Diagram ····························································· 8
3-2. Printed Wiring Boards·················································· 9
3-3. Schematic Diagram ···················································· 10
4. EXPLODED VIEWS
4-1. Housing (R) Section ···················································· 11
4-2. Housing (L) Section ···················································· 12
5. ELECTRICAL PARTS LIST........................................ 13
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
• IC101 (CXN1450-2ABL) on MAIN board cannot be
replaced individually.
Replace it with “MAIN BOARD, COMPLETE”.
Location and Function of Parts
SECTION 1
Indicator (blue)
1
Indicates the communication
status of the unit.
Indicator (red)
2
Indicates the power status of
the unit.
Multi function button
3
Controls various call functions.
Press the button on the tactile
dots.
Jog switch
4
Controls various functions
when listening to music.
RESET button
5
Push this button when this unit
does not operate properly.
Pairing information is not
deleted by this operation.
GENERAL
6
7
8
9
q;
qa
qs
qd
qf
qg
* This button has a tactile dot.
This section is extracted
from instruction manual.
VOL (volume) +*⁄–
buttons
Neckband
(right) indication
Left unit
(left) indication
Ear pad
Right unit
POWER button
Microphone
DC IN 3 V jack
2
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET
DR-BT21G
SECTION 2
DISASSEMBLY
2-2. DRIVER (R-CH)
(Page 3)
2-3. HOUSING UPPER (R) SUB ASSY
(Page 4)
2-4. MAIN BOARD
(Page 4)
Note: Follow the disassembly procedure in the numerical order given.
2-2. DRIVER (R-CH)
1
2-5. DRIVER (L-CH)
(Page 5)
2-6. HOUSING UPPER (L) SUB ASSY
(Page 5)
2-7. CHARGER BOARD
(Page 6)
ear pad
Note : Plus terminal is marking
with felt tip pen.
(The position uncertainty)
BLK
3
Remove the solder at 2 places.
Marking (+ side)
RED
4
driver sub assy
2
3
DR-BT21G
y
2-3. HOUSING UPPER (R) SUB ASSY
1
screw
3
button (VOL)
2
housing upper (R) sub ass
2-4. MAIN BOARD
1
two claws
2
3
Remove the solder at 8 places.
GRN/NAT
WHT
BLK
BLK
RED
RED
4
RED/NAT
GRN
MAIN board
4
2-5. DRIVER (L-CH)
w
3
Remove the solder at 2 places.
Note : Plus terminal is marking
with felt tip pen.
(The position uncertainty)
Marking (+ side)
DR-BT21G
2
4
2-6. HOUSING UPPER (L) SUB ASSY
BLACK
driver sub assy
RED
1
ear pad
2
housing upper (L) sub assy
1
scre
5
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