DP-RF6000
SERVICE MANUAL
Canadian Model
Ver. 1.0 2006. 02
Korea Model
• The DP-RF6000 is the digital surround
processor that comprises the MDR-DS6000.
* The digital surround processor for this system incorporates the Dolby Digital decoder, the Dolby Pro Logic II
decoder, the DTS decoder and the MPEG-2 AAC decoder.
Manufactured under licence from Dolby Laboratories and Digital Theater Systems, Inc.
“Dolby,” “Pro Logic,” the “AAC” logo and the double-D symbol are trademarks of Dolby Laboratories.
“DTS” and “DTS VIRTUAL ” are trademarks of Digital Theater Systems, Inc.
• MDR-DS6000 consists of the following models respectively.
Cordless stereo headphone MDR-RF6000
Digital surround processor DP-RF6000
SPECIFICATIONS
Decoder functions Dolby Digital
Dolby Pro Logic II
DTS
MPEG-2 AAC
Virtual surround function OFF
CINEMA
MUSIC
Compression function OFF
ON
Modulation System DSSS
Carrier wave frequency 2.412 ~ 2.462 GHz (US, Canadian)
2.412 ~ 2.472 GHz (AEP)
2.417 ~ 2.467 GHz (Korea)
Transmission distance Approx. 30 m (100 ft) of longest
Frequency response 12 – 22,000 Hz
(digital input, sampling frequency 48 kHz)
Distortion rate 1% or less (1 kHz)
Audio inputs Optical digital input
(rectangular-type) × 1
Analog input (pin jack left/right) × 1
Audio output Optical digital output
(rectangular-type) × 1
Power requirements DC 9 V
(from the supplied AC power adaptor)
Dimensions Approx. 182 × 38 × 182 mm
(7 1/4 × 1 1/2 × 7 1/4 in) (w/h/d)
Mass Approx. 345 g
(12.17 oz)
US Model
AEP Model
9-887-076-01
2006B02-1
© 2006.02
Design and specifications are subject to change without notice.
DIGITAL SURROUND PROCESSOR
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
DP-RF6000
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40° C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
Specifications ............................................................................ 1
1. GENERAL ................................................................... 3
2. DIAGRAMS ................................................................. 4
2-1. Block Diagrams ............................................................... 5
2-2. Printed Wiring Board – TX Board Section (Side A) – .... 6
2-3. Printed Wiring Board – TX Board Section (Side B) – .... 7
2-4. Printed Wiring Board
– FUNCTION, CHARGE Boards Section – ................... 8
2-5. Schematic Diagram – TX Board Section (1/4) – ............ 9
2-6. Schematic Diagram – TX Board Section (2/4) – ............ 10
2-7. Schematic Diagram – TX Board Section (3/4) – ............ 11
2-8. Schematic Diagram – TX Board Section (3/4) – ............ 12
2-9. Schematic Diagram
– TX (4/4), FUNCTION, CHARGE Boards Section – ... 13
2-10. IC Pin Function Descriptions .......................................... 15
3. EXPLODED VIEWS
3-1. Processor Section ............................................................ 20
4. ELECTRICAL PARTS LIST .................................. 21
• Repaier DP-RF6000 with MDR-RF6000.
2
DP-RF6000
LOCATING THE CONTROLS
Front Panel of the Processor
SECTION 1
GENERAL
1
2
C
O
O
M
F
P
F
R
E
S
S
I
O
N
O
N
3
CHG RF DTS
I
N
P
A
N
A
A
M
T
E
C
N
E
I
F
C
F
E
F
F
O
C
I
S
U
T
C
U
E
L
T
E
S
L
A
T
I
L
G
O
I
G
D
M
45
DOLBY DIGITAL DOLBY PRO LOGIC MPEG-2 AAC
This section is extracted
from instruction manual.
6
7 8
1 Contact pin
2 Charging lever
3 COMPRESSION switch
4 INPUT SELECT switch
5 EFFECT switch
Rear Panel of the Processor
TUNE/ID SET
0dB -8dB
12 3 456
R
ATT
L LINE IN
DIGITAL IN DIGITAL OUT
6 CHG indicator
! " #!!
7 RF indicator
! $ " %! & !#
8 DECODE MODE indicators
DC IN 9V
(THROUGH)
1 TUNE/ID SET button
Use this button when reception
deteriorates, or when using additional
headphones.
2 ATT (attenuator) switch
Set this switch to Ò0 dBÓ if the volume is
too low for analog input. Normally, this
switch should be set to ÒÐ8 dB.Ó
3 LINE IN jacks
Connect the audio output jacks on an
audio or video component (sold
separately), such as a video cassette
player or TV, to these jacks.
4 DIGITAL IN jack
Connect a DVD device, digital satellite/
TV receiver, or other digital component
(sold separately) to this jack.
5 DIGITAL OUT jack
Connected components' digital signal
integrity retained when installed.
6 DC IN 9V jack
Connect the supplied AC power adaptor
to this jack. (Be sure to use the supplied
AC power adaptor. Using products with a
different plug polarity or other
characteristics can cause a malfunction.)
3
DP-RF6000
SECTION 2
DIAGRAMS
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
For schematic diagrams.
Note:
• All capacitors are in µ F unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise specified.
•%: indicates tolerance.
• f : internal component.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 9 V and fed with regulated dc power supply
from external power voltage jack.
•Voltages and waveforms are dc with respect to ground under nosignal conditions.
•Voltages are taken with a VOM (Input impedance 10 MΩ ).
Voltage variations may be noted due to normal production tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : ANALOG
J : DIGITAL
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• f : internal component.
• : Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• Indication of transistor.
C
Q
B
E
These are omitted.
• Waveforms
– TX BOARD –
IC201
1
0.5V/DIV, 0.1 µsec/DIV
2
1V/DIV, 20 nsec/DIV
i;
203 ns
IC4001 A
2
83.2 ns
XO
1.5Vp-p
3.8Vp-p
4
2-1. BLOCK DIAGRAM
DP-RF6000
J051
L
LINE IN
DIGITAL IN
DIGITAL OUT
(THROUGH)
DOLBY PRO
R
IC001
OPTICAL
RECEIVER
IC004
OPTICAL
TRANSMITTER
D522
DOLBY
DIGITAL
D523
LOGIC
D524
DTS
D521
CHG
D525
MPEG-2
AAC
D526
RF
VOUT
VIN
1
3
IC4001
CLOCK OSC
2
OUT
IN
X4000
12.288MHz
R-CH
4
S051
ATT
-8dB
0dB
Q202
LED DRIVER
Q203
LED DRIVER
Q204
LED DRIVER
Q205
LED DRIVER
Q206
LED DRIVER
Q207
LED DRIVER
• R-ch is omitted due to same as L-ch.
• SIGNAL PATH
: ANALOG
: DIGITAL
ANT4000
ANT
3
CHARGE
4
TERMINAL
5
(TO MDR-RF6000)
2
J301
DC IN 9V
+ -
IC052
LINE AMP
5 7
R-CH
IC002
DIR
22
DATAO
RXIN
12
XIN
24
100
99
98
97
96
95
BCK
LRCK
CKOUT
ERROR
PD
DO
E/INT
AUDIO
UGPI
P20
P17
P16
P21
P15
P14
CE
CL
DI
20
21
19
2
3
5
6
7
8
9
10
11
DIR_ERR
DIR_XRST
DIR_XCS
DIR_EMP
DIR_NAUD
DIR_XST
IC201(2/2)
SYSTEM
CONTROLLER
SCK2
SDO2
SDI2
P34
P35
P37
P36
P33
R-CH
DIRDATA
BCK
LRCK
MCKDIR
DSP_NOSG
DEC_INTREQ
SDI1
DSP_XINTREQ
DSP_HINBSY
MCK
12
13
15
14
11
AUDIO A/D
CONVERTER
8 LIN
7RIN
S502
INPUT SELECT
DIGITAL
ANALOG
S501
EFFECT
MUSIC
OFF
CINEMA
S503
COMPRSSION
ON
OFF
IC003
SDATO
BCK
ADCLRC
MCLK
IC1202(1/2)
LEVEL SHIFT
18
16
14
12
9
2
3
12
13
DIR_ERR
DIR_XRST
DIR_XCS
SCK2
SDO2
SDI2
DIR_EMP
DIR_NAUD
DIR_XST
2
4
6
8
11
DSP_NOSG
DEC_INTREQ
SDI1
DSP_XINTREQ
DSP_HINBSY
x201
131
FSDATAN1
111
FSCLKN2
134
FSCLKN1,STCCLK2
119
FLRCLKN1
117
FLRCLKN2
98
SCLK1
87
LRCLK1
FSDATAN2
118
SCLK0
104
LRCLK0
108
MCLK
99
GPIO15
31
XFINTREQ
16
FHS2,FSCDOUT
7
XINTREQ
3
HINBSY
141
CLKIN
127
P73
28
P74
29
16
SIN2
30
P75
31
P76
P56
74
P57
76
P54
73
SCK1
58
SDO1
57
56
SIN1
72
P54
PA3
67
PA2
66
x0
80
x1
81
IC1201
DECODER,DSP
XRESET
SCCLK
144
142 136 135
P62
SCK2
IC201(1/2)
SYSTEM
CONTROLLER
SCDIN
SOT2
SCCS
15 4
32 17 39 38 18
P63
AFCS
P77
FSCDIN
FSCCLK
6
XRST
DTO
P13
P12
P10
P11
P07
P02
AN1
AN0
P01
P00
IC1202(2/2)
LEVEL SHIFT
110
UNREG_9V
5V ON
CHG_ON
VBATT2
BATT_TEMP
BATT_DET
BATT_TEMP
MAPOW
INRST
ID STATE
CH_SYNC
TXON
5V ON
CHG_ON
VBATT2
BATT_DET
IC202
RESET
1
IN OUT
2
94
93
91
92
90
85
37
36
84
83
75
VCC
17
+5V REGULATOR
3
4
REG3.3V
REG_5V
REG_9V
REG2.5V
VDD3.8V
IC4006
+3.3V REGULATOR
5
VIN
VOUT
3
SWITCHING
IC4002
ID4000
VINCEEXT
VOUT
IC304
+3.3V REGULATOR
3
D302
D4000
D205
1
Q4001
1
7
IN OUT
D4001
2
Q301
SWITCHING
Q4000
SWITCHING
S504
TUNE/ID SET
IC302
+5V REGULATOR
1
+2.5V REGULATOR
1
5
+3.8V REGULATOR
1
5
EXT
VOUT
IC4004
EXT
VOUT
IN OUT
IC305
VDD
VDD
INRST
ID STATE
CH_SYNC
TXON
Q4002,4003
CHARGE SWITCH
3
2
MAPOW
2
CH/ID SYNC_BUTTON
VDD3.8V
UNREG_9V
+9V REGULATOR
2
+5V REGULATOR
1
DSPOUT
ID STATE
RXON (CH_SYNC)
IC301
IN OUT
1
CE
4
IC303
IN OUT
3
INRST
TXON
BCK
LRCK
VDD3.8
BATT_TEMP
BATT_DET
BATT2
TX-RF
BLOCK
CN601
DP-RF6000
5 5
DP-RF6000
2-2. PRINTED WIRING BOARD – TX BOARD SECTION (SIDE A) –
1
A
2
TX BOARD (SIDE A)
B
C517
L052
R062
R301
R063
C310
C301
C305
C074
C060
C308
R059
C077
1
IC052
4
C
R055
R053
R051
C052
D
E
F
D053
G
L055
L054
D052
D057
D055
054
D
C001
L001
R001
C003
LF301
R002
D051
L062
C014
L002
C303
D056
R052
C051
R054
R056
L053
D301
LF051
1
H
34567
L1204
73
C1222
L051
R068
C072
R057
C068
7
8
C070
R058
C078
C057
8
5
R065
C069
IC003
IC4001
C080
C056
L056
C066
C059
R060
R069
C315
C311
R067
L063
1
14
C4011
C064
R061
IC305
1
3
4
6
1
3
R066
1
3
R024
L008
L005
R013
R009
C002
C316
Q301
IC304
C312
C075
X4000
C4009
5
4
R4002
L4005
R020
24
1
IC002
R010
L303
C318
5
4
3
D302
1
L006
R4009
L301
L007
R4001
C4010
R021
R017
13
12
R004
R005
R4000
C1210
C1208
R4003
R023
R022
C009
C008
C005
R014
5
1
IC4004
Q4000
C4007
C015
C4004
R4008
108
C222
4
C4001
3
R1202
L009
L003
109
L1202
D205
C217
72
C206
C4002
D4000
C1217
C229
SL201
L202
C216
L4001
R1249
C1201
R228
C4000
: Uses unleaded solder.
C1216
C1215
C1214
IC1201
C1205
C1202
C1207
R1214
C1206
SL202
R236
R271
SL203
4
5
IC202
Q4002
R221
R223
R206
C223
C226
3
1
R4020
C4023
R4010
C4021
C4018
C4016
R4007
L4002
L4003
L1201
C224
R222
51
75
C212
X201
R286
R4017
R4006
C1204
R1215
R220
50
76
R4011
C1203
SL204
R273
C210
C228
R289
B
R4019
R4005
IC201
R288
C
Q4003
C4017
D4001
37
144
L1210
R1255
Q207
5
C4015
8
36
R1254
R1245
R1244
R1243
C1211
R1240
R1238
R1236
R1235
R1233
L1207
1
R1252
R1227
C1220
E
D4003
C1209
L1206
R1216
C227
R4015
C4013
L1209
R1217
100
Q206
D4002
R4004
4
IC4002
1
26
Q204
R1219
C207
R269
C225
R4028
L1203
R1228
R1220
C209
25
1
C201
Q202
C220
C4027
Q4001
L1208
R224
R270
C218
L4007
C4014
R1253
C211
C202
C1221
1
10
R210
SL205
SL206
C1218
R229
R276
C205
R275
C204
R274
C203
Q203
C219
C1224
L1213
Q205
C221
R4024
L1205
20
11
C208
L551
C4042
L4004
R4027
IC1202
R1258
R4030
R4031
L552
L553
L554
L555
R1251
L1211
R1256
L1212
R1257
C4032
R1261
L1214
R1259
R1262
IC4006
C4038
5
1
L1215
R1260
8
91 0
• Semiconductor Location
Ref. No. Location
D051 E-2
D052 D-2
R501
C515
R503
C513
C512
R4033
R504
C514
R517
C511
1-868-111-
R502
C518
R519
C516
31
(31)
4
3
C4033
R4032
R287
R4013
C4039
R4014
C4040
D053 F-1
D054 F-1
D055 F-1
D056 E-2
D057 E-1
D205 E-4
D301 G-2
D302 G-4
D4000 G-4
D4001 H-5
D4002 G-6
D4003 G-6
IC002 D-4
IC003 B-3
IC052 D-3
IC201 D-5
IC202 E-5
IC304 H-4
IC305 G-3
IC1201 B-5
IC1202 B-7
IC4001 C-3
IC4002 G-6
IC4004 F-4
IC4006 D-7
Q202 E-6
Q203 E-6
Q204 F-6
Q205 E-6
Q206 E-6
Q207 E-6
Q301 G-3
Q4000 G-4
Q4001 H-6
Q4002 G-5
Q4003 F-5
DP-RF6000
6 6
DP-RF6000
2-3. PRINTED WIRING BOARD – TX BOARD SECTION (SIDE B) –
1
2
A
B
C
D522
DOLBY DIGITAL
D
3 4 5 6 7
TX BOARD (SIDE B)
D525
MPEG-2 AAC
D523
DOLBY PRO LOGIC
C4031
C4034
: Uses unleaded solder.
C1212
CN202
C010
C1213
C073
8
C058
C065
C076
C071
9 10 11
S504
TUNE / ID SET
C055
C067
C063
C062
C053
C054
S051
ATT
0dB
t
-8dB
• Semiconductor Location
Ref. No. Location
D521 G-2
D522 D-2
D523 C-3
D524 E-2
D525 B-4
D526 F-2
IC001 G-10
IC004 H-10
IC301 H-10
IC302 H-9
IC303 H-9
E
F
G
H
A
FUNCTION
BOARD
(Page 8)
ANT4000
D526
RF
D521
CHG
D524
DTS
1
6
CNP201
CNP4002
TX-RF BLOCK
CNP4001
2
1
23
24
C4012
C4020
C213
C4003
C4008
C214
C314
C317
C309
C307
IC303
1
3
C061
C302
IC302
3
C304
IC301
4
1
J051
R
LINE IN
L
3
IC001
1
3
IC004
1
DIGITAL IN
DIGITAL OUT
(THROUGH)
J301
DC IN 9V
DP-RF6000
6
I
1
C313
CN203
CHARGE
BOARD
B
(Page 8)
C306
1
1-868-111-
31
(31)
7 7
DP-RF6000
2-4. PRINTED WIRING BOARD – FUNCTION, CHARGE BOARDS SECTION –
2
C555
A
1
FUNCTION BOARD (SIDE A)
B
: Uses unleaded solder.
3 4 5 6 7
TX
A
BOARD
(Page 7)
CN501
6
R555
R551
C554
R553
R552
R554
1
1-868-112-
C551
C553
C552
31
CHRGE BOARD
CNP601
CN601
(31)
8
C
D
FUNCTION BOARD (SIDE B)
t
OFF ON
S503
COMPRESSION
ANALOG DIGITAL
t
S502
INPUT SELECT
S501
EFFECT
BOARD
(Page 7)
MUSIC
TX
B
t
OFF CINEMA
1-868-112-
t
31
(31)
1-868-110-
CHARGE
TERMINAL
(TO MDR-RF6000)
31
(31)
DP-RF6000
8 8