Sony DP-1000 Service manual

DP-1000

SERVICE MANUAL

Canadian Model

Ver. 1.0 2006. 01

• The DP-1000 is the digital surround
processor that comprises the MDR­DS1000.

* The digital surround processor for this system incorporates the Dolby Digital decoder, the Dolby Pro Logic II

decoder and the DTS decoder.

Manufactured under licence from Dolby Laboratories and Digital Theater Systems, Inc.
“Dolby,” “Pro Logic,” and the double-D symbol are trademarks of Dolby Laboratories.
“DTS” and “DTS VIRTUAL ” are trademarks of Digital Theater Systems, Inc.

• MDR-DS1000 consists of the following models respectively.

Stereo headphone MDR-XD050

Digital surround processor DP-1000

US Model

AEP Model

SPECIFICATIONS

Decoder functions Dolby Digital

Virtual surround function OFF

Frequency response 12 – 22,000 Hz
Distortion rate 1% or less (1 kHz)
Audio inputs Optical digital input

Audio outputs Headphone jacks (stereo mini-jack) × 2
Power requirements DC 9 V (from the supplied AC power

Dimensions Approx. 120 × 35 × 120 mm

Mass Approx. 200 g

Design and specifications are subject to change without notice.

Dolby Pro Logic II
DTS

CINEMA
MUSIC

(rectangular-type) × 1
Analogue input (stereo mini-jack) × 1

adaptor)

(4 3/4 × 1 7/16 × 4 3/4 in) (w/h/d)

(7.06 oz)

9-887-050-01

2006A02-1

© 2006.01

DIGITAL SURROUND PROCESSOR

Sony Corporation

Personal Audio Division
Published by Sony Techno Create Corporation

DP-1000

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

TABLE OF CONTENTS

Specifications ............................................................................ 1

1. GENERAL ................................................................... 3

2. DISASSEMBLY

2-1. Upper Cabinet.................................................................. 5

2-2. Front Panel, Panel Board ................................................. 5

3. DIAGRAMS

3-1. Block Diagrams ............................................................... 7

3-2. Printed Wiring Board – DP Board (Side A) – ................. 8

3-3. Printed Wiring Board – DP Board (Side B) – ................. 9

3-4. Schematic Diagram – DP Board (1/3) – .......................... 10

3-5. Schematic Diagram – DP Board (2/3) – .......................... 11

3-6. Schematic Diagram – DP Board (3/3) – .......................... 12

3-7. Printed Wiring Board – Panel Board – ............................ 13

3-8. Schematic Diagram – Panel Board – ............................... 13

3-9. IC Pin Function Descriptions .......................................... 14

4. EXPLODED VIEWS

4-1. Processor Section ............................................................ 15

5. ELECTRICAL PARTS LIST .................................. 16

2

DP-1000

LOCATING THE CONTROLS

Front Panel of the Processor

SECTION 1

DOLBY DIGITAL DOLBY PRO LOGIC

POWER 1 PHONES 2

GENERAL

DTS

INPUT SELECT

DIGITAL ANALOG

EFFECT

CINEMA

OFF

MUSIC

This section is extracted
from instruction manual.

LEVEL

MIN

MAX

1 DECODE MODE indicators
2 POWER indicator

Lights green when the processor is turned
on.

POWER (power) switch

Press to turn the processor on/off.

3 PHONES jack

Connect the supplied headphones.

4 INPUT SELECT switch

Slide to select the input source
(ANALOG/DIGITAL).

5 EFFECT switch

Slide to select the sound field (CINEMA/
OFF/MUSIC).

6 Volume control

Adjusts the volume of the headphones
connected to the PHONES

3

DP-1000

Rear Panel of the Processor

ATT

0dB -8dB

1 ATT (attenuator) switch

Set this switch to “0 dB” if the volume is
too low for analogue input. Normally, this
switch should be set to “–8 dB.”

2 LINE IN jack

Connect the audio output jacks on an
audio or video component (sold
separately), such as a video cassette
player or TV, to these jacks.

LINE IN

DC IN9V

DIGITAL IN

3 DIGITAL IN jack

Connect a DVD device or other digital
component (sold separately) to this jack.

4 DC IN 9V jack

Connect the supplied AC power adaptor
to this jack. (Be sure to use the supplied
AC power adaptor. Using products with a
different plug polarity or other
characteristics can cause a malfunction.)

4

• This set can be disassembled in the order shown below.

t

2-1. UPPER CABINET

5

two claws

6

two claws

SECTION 2

DISASSEMBLY

7

3

three claws

4

two claws

8

upper cabine

DP-1000

2-2. FRONT PANEL, PANEL BOARD

6

two screws

7

PANEL board

3

claw

(+P2)

2

two screws

1

two rubber foots

4

(+B2.6)

5

front panel

1

volume knob

2

claw

5

DP-1000

SECTION 3

DIAGRAMS

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

For schematic diagrams.
Note:

• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise specified.

•%: indicates tolerance.

• f : internal component.

• C : panel designation.

• A : B+ Line.

• Power voltage is dc 9 V and fed with regulated dc power supply
from battery terminal.

•Voltages and waveforms are dc with respect to ground under no­signal conditions.

•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler­ances.

•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler­ances.

• Circled numbers refer to waveforms.

• Signal path.

F : ANALOG
J : DIGITAL

• Waveforms

1

IC602

i;

XO

For printed wiring boards.
Note:

• X : parts extracted from the component side.

• f : internal component.

• : Pattern from the side which enables seeing.

Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.

• Indication of transistor.

C

Q

B

E

These are omitted.

206 ns

0.5V/DIV, 0.1 µsec/DIV

IC103 OUT

2

1V/DIV, 20 nsec/DIV

4

83.2 ns

• IC Block Diagrams

IC305 XC6365A253MR

EXT/

1.6Vp-p

3.9Vp-p

1

BUFFER,
DRIVER

PWM

COMPARATOR

+

-

PHASE

COMPENSATION

ERROR AMP.

+

-

5

V OUT

VDD

GND

2

3

RAMP WAVE
GENERATOR

OSC

PWM/PFM

CONTROLLER

VREF WITH

SOFT START,

CE

4

CE

6