Sony DNF-340, DNF-341 Service manual

D-NF340/NF341
SERVICE MANUAL
Ver. 1.3 2007.07
Photo: D-NF340
SPECIFICATIONS
CD player
System
Compact disc digital audio system
Laser diode properties
Emission duration: Continuous Laser output: Less than 44.6 µW (This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.)
Radio
Frequency range
FM: 87.5 MHz 108.0 MHz
Antenna
FM: Headphones cord antenna
General
Power requirements
Two LR6 (size AA) batteries: 1.5 V DC × 2
AC power adaptor (DC IN 4.5 V jack):
100 - 240 V, 50/60 Hz
Battery life* (approx. hours)
(When the CD player is used on a flat and stable place.) Playing time varies depending on how the CD player is used.
When using two Sony alkaline batteries LR6 (SG) (produced in Japan)
G-PROTECTION G-on G-off
Audio CD 20 14 MP3 CD (Recorded at 128 kbps) 30 30 RADIO ON 50
* Measured value by the standard of JEITA (Japan Electronics and
Information Technology Industries Association).
The indicator sections of battery power. One section does not always indicate one-fourth of the battery power.
roughly show the remaining
US Model
AEP Model
UK Model
D-NF340/NF341
Model Name Using Similar Mechanism NEW CD Mechanism Type CDM-3525A
Dimensions (w/h/d) (without projecting parts and controls)
Approx. 140.0 × 32.7 × 140.0 mm (5 5/8 5/16 5/8 in.)
Mass (excluding accessories)
Approx. 210 g (7.5 oz.)
Operating temperature
5°C - 35°C (41°F - 95°F) MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson. Design and specifications are subject to change without notice.
Supplied accessories
AC power adaptor (1) (NF340: AEP, East European, Russian/NF341) Headphones (1) Remote control (1) (NF340: US/NF341)
15
××
D-NF340
E Model
2007G05-1 © 2007.07
FM PORTABLE CD PLAYER
Sony Corporation
Personal Audio Division Published by Sony Techno Create Corporation
D-NF340/NF341
SECTION 1

SERVICING NOTES

TABLE OF CONTENTS

1. SERVICING NOTES ............................................... 2
2. GENERAL ................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 5
3-2. Cabinet (Lower) Assy...................................................... 5
3-3. MAIN Board, CD Mechanism (CDM-3525A) ............... 6
3-4. Cabinet (Inner) Assy, SWITCH Board............................ 6
4. DIAGRAMS
4-1. Schematic Diagram – MAIN Board (1/3) – .................... 9
4-2. Schematic Diagram – MAIN Board (2/3) – .................... 10
4-3. Schematic Diagram – MAIN Board (3/3) – .................... 11
4-4. Printed Wir ing Board
– MAIN Board (Component Side) – ............................... 12
4-5. Printed Wir ing Board
– MAIN Board (Conductor Side) – ................................. 13
4-6. Printed Wiring Board – SWITCH Board – ..................... 14
4-7. Schematic Diagram – SWITCH Board – ........................ 15
5. EXPLODED VIEWS
5-1. Upper Lid and Cabinet (Inner) Section ........................... 20
5-2. Cabinet Lower Section .................................................... 21
6. ELECTRICAL PARTS LIST................................ 22
Notes on chip component replacement
Nev er reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 ˚C during repairing.
Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
OPERATION CHECK WHEN THE LID IS OPEN
In performing the repair with the power supplied to the set, removing the MAIN board causes the set to be disabled. In such a case, make a solder bridge to short SL801 (OPEN/CLOSE) on the MAIN board in advance.
– MAIN Board (Conductor Side) –
On the AC power adaptor
Use only the AC power adaptor supplied. If your player is not supplied with an AC power adaptor, use an AC-E45HG AC power adaptor*. Do not use any other AC power adaptor. It may cause a malfunction. * Not available in Australia and some other
regions. Ask your dealer for detailed information.
Connect the AC power adaptor to an easily accessible AC outlet. Should you notice an abnormality in the AC power adaptor, disconnect it from the AC outlet immediately.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Polarity of the plug
2
SL801
(OPEN/CLOSE)
D-NF340/NF341
Ver. 1.3
NOTE OF REPLACING THE IC001 AND IC801 ON THE MAIN BOARD
IC001 and IC801 on the MAIN board cannot exchange with single. When IC001 and IC801 on the NAIN board is damaged, exchange the entire mounted board.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning on the S802. (push switch type) The following checking method for the laser diode is operable.
• Method: Emission of the laser diode is visually checked.
1. Open the upper lid.
2. W ith a disc not set, turn on the S802 with a screwdriver ha ving a thin tip as shown in Fig.1.
3. Press the u ENTER button.
4. Observing the objectiv e lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will mov e up and down 4 times along with inward motion for the focus search.
COLOR VARIATION
Model Destination
US zz
D-NF340
D-NF341 E92 z
Abbreviation C4E :Chilean, Peruvian, Bolivian and Argentina models E18 : South African, United Arab Emirates, Singapore, Malaysia,
Vietnam and Indian models E92 : Panama, Venezuelan and Caribbean models EE : East European model MX : Mexican model RU : Russian model
AEP, EE, RU zz
UK z C4E z E18 z
MX z
BLACK SILVER BLUE
COLOR
S802
S802
MAIN board
Fig. 1 Method to push the S802
3
D-NF340/NF341
Ver. 1.1
SECTION 2

GENERAL

This section is extracted from instruction manual.
u (play/pause)ENTER
./>
(group) /+TUNE /+
DISPLAY
P MODE/
SOUND/AVLS
RADIO ON/MEMORY
VOL /+
x (stop)RADIO OFF
MP3 indicator
Disc indicator
Remaining battery power
Group indicator
Bookmark
Headphone jack (rear)
u (play/pause)
Display
Remote control (NF340: US/NF341)
Connect your headphones to the
(TUNE /+)
remote control securely.
DC IN 4.5 V
to an AC outlet
AC power adaptor
OPEN
i (headphones) jack
Headphones
HOLD (rear)
Track number/Preset number/Playing time/Frequency
MONO/LOCAL
Sound mode
Play mode
HOLD
./> x (stop)
RADIO ON/OFF
VOL /+
Note
Use only the supplied remote control. You cannot operate this player with any other remote control.
4
This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET

3-2. CABINET (LOWER) ASSY

(Page 5)
D-NF340/NF341
SECTION 3

DISASSEMBLY

3-3. MAIN BOARD, CD MECHANISM (CDM-3525A)
(Page 6)
Note: Follow the disassembly procedure in the numerical order given.
3-2. CABINET (LOWER) ASSY
3
four screws
3-4. CABINET (INNER) ASSY, SWITCH BOARD
(Page 6)
2
two screws
5
screw
4
Open the battery case lid.
7
flexible flat cable (CN803)
0
cabinet (lower) assy
8
five claws
6
Lift up the CD mechanism.
knob (hold)
1
Open the upper lid.
9
MAIN board block
S801
knob (hold)
Note: On installation of MAIN board,
adjust the position of slide switch (S801) and knob (hold).
S801
5
D-NF340/NF341
s

3-3. MAIN BOARD, CD MECHANISM (CDM-3525A)

3
insulator
3
insulator
4
CD mechanism (CDM-3525A)
2
flexible board (CN501)
3
insulator
5
MAIN board

3-4. CABINET (INNER) ASSY, SWITCH BOARD

qs
upper lid sub assy
5
battery case lid
4
two bosses
gray
orange
red
black
1
qa
SWITCH board
Remove four solders.
6
2
spring (L)
1
two bosses
3
spring (R)
6
cabinet (inner) assy
0
liquid crystal display panel (LCD1001) (CN1001)
8
9
flexible flat cable (10 core) (CN1002)
cover (upper lid)
7
eight screw
SECTION 4
e

DIAGRAMS

Note for Printed Wiring Boards and Schematic Diagrams
D-NF340/NF341
Ver. 1.3
Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
z : Through hole.
f : internal component.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component Side) the parts face are indicated.
Lead Layouts
surfac
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.
All resistors are in and 1/ specified.
f : internal component.
C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety. Replace only with part number specified.
A : B+ Line.
Power voltage is dc 3 V and f ed with regulated dc power
supply from battery teminal.
Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : CD PLAY (): FM
Voltages are taken with a V OM (Input impedance 10 M). Voltage variations may be noted due to normal produc­tion tolerances.
Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc­tion tolerances.
Circled numbers refer to waveforms.
Signal path.
J : CD PLAY F : FM
Abbreviation C4E : Chilean, Peruvian, Bolivian and Argentina
models
E18 : South African, United Arab Emirates, Singapore,
Malaysia, Vietnam and Indian models E92 : Panama, Venezuelan and Caribbean models EE : East European model MX : Mexican model RU : Russian model
The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different from that of conventional IC.
4
W or less unless otherwise
7
D-NF340/NF341
Waveforms – MAIN Board –
IC601 th (CLK88)
1
(CD play mode)
IC601 ya (XO)
2
(CD play mode)
500 mV/DIV, 20 ns/DIV
IC601 i; (EQO)
3
(CD play mode)
500 mV/DIV, 200 ns/DIV
11.3 µs
1 V/DIV, 5 µs/DIV
59.1 ns
3 Vp-p
1.5 Vp-p
1.3 Vp-p
Q403 (Base)
5
(CD play mode)
11.3 µs
500 mV/DIV, 5 µs/DIV
Q403 (Base)
5
(FM mode)
16.4 µs
500 mV/DIV, 5 µs/DIV
Q403/Q404 (Collector)
6
(CD play mode)
11.3 µs
2 V/DIV, 5 µs/DIV
0.8 Vp-p
0.8 Vp-p
3.7 Vp-p
IC801 7 (TU_X2)
8
(FM mode)
30.5 µs
1 V/DIV, 10 µs/DIV
IC801 q; (X2/UCK)
9
125 ns
1 V/DIV, 50 ns/DIV
IC801 yf (TU_32K_O)
q;
(FM mode)
30.5 µs
1 V/DIV, 10 µs/DIV
2.9 Vp-p
2.4 Vp-p
3 Vp-p
IC403 wl (CT)
4
(CD play mode)
100 mV/DIV, 5 µs/DIV
IC403 wl (CT)
4
(FM mode)
100 mV/DIV, 5 µs/DIV
11.3 µs
24.1 µs
270 mVp-p
400 mVp-p
Q403/Q404 (Collector)
6
(FM mode)
16.4 µs
2 V/DIV, 5 µs/DIV
Q404 (Base)
7
(CD play mode)
11.3 µs
2 V/DIV, 5 µs/DIV
Q404 (Base)
7
(FM mode)
16.4 µs
3.7 Vp-p
4.2 Vp-p
4.2 Vp-p
2 V/DIV, 5 µs/DIV
8
D-NF340/NF341
Ver. 1.3

4-1. SCHEMATIC DIAGRAM – MAIN Board (1/3) –

(1/3)
DTA114TUA-T106
C502
0.01
R501
2.2
C501
47
6.3V
FOCUS/TRACKING
COIL DRIVE,
SLED/SPINDLE
MOTOR DRIVE,
DC/DC CONVERTER
IC403
BH6575FV
(SPINDLE)
(SLED)
CN502
CN503
CN504
CN505
CN501
16P
C
E
A
B
F
VCC
VC
GND
GND
PD
LD
NC
F+
T+
T-
F-
See page 8 for Waveforms. • See page 16 for IC Block Diagrams.
Q405
B+ SWITCH
L402
L403
Q601
ISA1602AM
1TP-1EF
AUTOMATIC
POWER
CONTROL
47µH
47µH
TP616
RU, C4E/NF341
NF340:US,AEP,EE,
FB1401
0
FB1401
R604 100k
TP615
R603
4.7
Q901
DTA114TUA-T106
SWITCHING
FO-
FO+
DPG1
TRK-
TRK+
SPIND-
DPG2
SLED+
SPIND+
SLED-
PVCC
C604
6.3V
FIL4
VDR1406
47
CB414
0.022
SPRT
R905 100k
FIL3
(NF340:UK)
C606
0.1
FIL2
FIL1
DCIN
CT
SOFT
C612
0.1
R610
10k
R607
10k
0.1 47 6.3V
C605 C607
R615
68k
4.7 50V
100k
22k
47k
22k
RESET
R428
R427
R429
R430
CLV
TRK
SLED
VREF
FOCUS
REGO
PGND
REGB
PRGND
R609
10k
C613R612
2200p68k
C609
2200p
R613
220k
C610
0.22
C603
0.1
CLK
CKE
TP619
0(NF340:US,AEP,EE,RU, C4E/NF341)
1k(NF340:UK)
MUTE12
MUTE34
RESET
MUTE1
MUTE34
SW
VG
LG
R608
10k
R616C611
470
TP617
TP618
R617
100
R929
R929,930
OP_PCON0
P_OFF
WAKE
WP
OFF
CLK
EO
EI
VSYS
TP620
R906 100k
C428
0.022
R431
47k
TP611
AVDD1
AC
BD
VBIAS
AGND1
E
F
PD
LD
ASY
PCO
FCO
FDOUT
TDOUT
SDOUT
CLVOUT
RCLK
RCKE
A13
A12
C616 470p
A11
C601
10
16V
R619
TP622
TP623
TP624
RFI
EQO
AD_MONI1
ANA_MONI1
ANA_MONI0
RF AMP,DSP,SD-RAM CONTROLLER,D/A CONVERTER
A07
A08
A11
A09
A10
A07
A08
A09
A10
FB601
220
A06
TP625
VDD_RD
AD_MONI0
A05
A06
A05
C617
0.1
A04
C633
0.1
HPRDACO
A04
A03
C618R629
0.110
C615
0.1
VSS_LD
VSS_RD
IC601
BU9542JKV
A03
A02
A02
A01
C632
10
16V
C620
47
6.3V
HPLDACO
A01
A00
VDD_LD
A00
2.2k
R321
AVDD2
RDACO
RASX
VDD_COREI
RAS
C332C333 470p470p
C619
0.1
C629
0.1
TP626
2.2k
C634
1000p
R322
R433
2.2
TP601
FLAG0
VCDAC
LDACO
DVDD2
AGND2
LDQM
DQ07
WEX
UDQM
CASX
DQ07
UDQM
LDQM
WE
CAS
R323
R324
XO
SUBSYQ
DIN/DOUT
VDD_CORE2
DGND1
C621
0.1
3.3k
3.3k
(NF340:UK)
DGND2
TEST
RESTB
CLK88
CLK
BUSY
MCK
R/W
DQ00
DQ01
DQ02
DQ03
DQ04
DQ05
DQ06
DVDD1
XI
C335 C334 470p 470p
C627 C628
10 0.1
FB628
TP627
FB628
0
R622
1M
NF340:US,AEP,EE,
RU, C4E/NF341
R623
220
16.9344MHz
C623 R624
0.1 100k
TP628
R876
R930
(NF340:UK)
VDR1404
C622
4.7
X601
100k
VDR1405
(NF340:UK)
RIN
LIN
SD-RAM
IC602
XRESET
C624
0.1
DQ00
DQ01
DQ02
DQ03
DQ04
DQ05
DQ06
(NF340:UK)
FB435
VDR1407
SUBSYQ
BUSY
SISO
DQ00
DQ01
DQ02
SCK
DQ03
RW
DQ04
DQ05
DQ06
DQ07
LDQM
WE
CAS
RAS
A11
A10
A00
A01
A02
A03
C630
0.1
FB435
0
M12L16161A-71(J)
NF340:US,AEP,EE,
RU, C4E/NF341
VCC
VSS
DQ0
DQ15
DQ1
DQ14
VSSQ
VSSQ
DQ2
DQ13
DQ3
DQ12
VCCQ
VCCQ
DQ4
DQ11
DQ5
DQ10
VSSQ
VSSQ
DQ6
DQ9
DQ7
DQ8
VCCQ
VCCQ
LDQM
NC
XWE
UDQM
CAS
CLK
RAS
CKE
XCS
NC
A11
A9
A10
A8
A0
A7
A1
A6
A2
A5
A3
A4
VCC
VSS
DQ00
DQ01
DQ02
DQ03
DQ04
DQ05
DQ06
DQ07
C631
4.7
UDQM
CLK
CKE
A09
A08
A07
A06
A05
A04
DGND
A
B
(Page 10)
(Page 11)
D-NF340/NF341
C415 C412
10 0.1
C425 R415
L408
330µH
1
0.1
470p
0.1
C410
C422
22
C423
C424
C409
10V
UZDSTE-176.2B
-2
-1
Q402
UMH8N
DC IN DETECT
0.022 10k
27k
R417
12k
R414
0.1
C407
10 16V
C417
D405
R403
1k
C406C405
1220
6.3V
D404
MA2YD2300LS0
Q401
2SB1132-T100-Q
B+ SWITCH
1000p
C413
100
R408
VCC+1.5V
VCC_DSP
FIFO
A+3V
SW
VG
GND
+3V
+4.5V
(Page 11)
99
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