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Sony Mobile Communications AB – Company Internal
- electrical -
D6603, D6643, D6653
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Sony Mobile Communications AB – Company Internal
CONTENTS
1 Replaceable Components ............................................................. 3
2 Component Placing ........................................................................ 5
3 Additional Repair info .................................................................... 6
4 Revision History ........................................................................... 10
For general information about electrical repair related issues, refer to
1220-1336: Generic Repair Manual - electrical
Test after electrical replacement: refer to 1273-1772 Mechanical Test Instruction
Do not remove shield can lids (Heat pasta are added and RF performance will be damaged)
1291-5740 Rev 2
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Sony Mobile Communications AB – Company Internal
1 Replaceable Components
EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN ‘COMMENTS’ BELOW
COMPONENT LOCATION
P = Primary side
S = Secondary side
REPAIR METHOD
HA = Hot Air (removal & mounting)
ST = Soldering Tool (removal & mounting)
HA/ST = Hot Air for removal - Soldering Tool for mounting
BGA = BGA Station
BH = Bottom Heater
ADDITIONAL INFORMAT ION
1 (2,3,4, etc.) = Proceed to ‘Additional Repair Info’ for further instructions in the indicated section(s).
1291-5740 Rev 2