Sony CDX-715 Service manual

Page 1
CDX-715
SERVICE MANUAL
SPECIFICATIONS
System Compact disc digital audio system Laser diode properties Material: GaAlAs
Wavelength: 780 nm Emission Duration: Continuous Laser out-put Power: Less than 44.6 µW* * This output is the value measured at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block. Frequency response 10 – 20,000 Hz Wow and flutter Below the measurable limit Signal-to-noise ratio 94 dB Outputs BUS control output (8 pins)
Analog audio output (RCA pin)
US Model
Canadian Model
AEP Model
UK Model
E Model
Model Name Using Similar Mechanism NEW CD Drive Mechanism Type MG-250B-137 Optical Pick-up Name KSS-521A/J2N
Currnet drain 800 mA (during CD playback)
800 mA (during loading or ejecting a disc)
Operating temperature –10˚C to +55˚C (14˚F to 131˚F) Dimensions Approx. 262 × 90 × 181.5 mm
(10 3/8 × 3 5/8 × 7 1/4 in.) (w/h/d)
not incl. projecting parts and controls Mass Approx. 2.1 kg (4 lb. 10 oz.) Power requirement 12 V DC car battery (negative ground) Supplied accessories Disc magazine (1)
Parts for installation and connections (1 set)
Design and specifications subject to change without notice.
MICROFILM
COMPACT DISC CHANGER
Page 2
SECTION 1
SERVICE NOTE
TABLE OF CONTENTS
1. SERVICE NOTE ........................................................ 2
2. GENERAL
Installation....................................................................... 5
Connections ..................................................................... 6
3. DISASSEMBLY ......................................................... 8
4. MECHANISMDECK ASSEMBLY...................... 14
5. MECHANICAL ADJUSTMENTS....................... 18
6. ELECTRICAL ADJUSTMENTS......................... 19
7. DIAGRAMS
7-1. Block Diagram
– SERVO Section – ......................................................... 21
– MAIN Section – ........................................................... 23
7-2. Printed Wiring Boards – RF Section – .......................... 25
7-3. Schematic Diagram – RF Section –................................ 27
7-4. Printed Wiring Board
– MAIN Section – MAIN Board (Component side) ...... 29
– MAIN Section – MAIN Board (Conductor side)........ 31
7-5. Schematic Diagram
– MAIN Section – MAIN Board (1/2) ........................... 33
– MAIN Section – MAIN Board (2/2) ........................... 35
7-6. Printed Wiring Board – JACK Section –....................... 37
7-7. Schematic Diagram – JACK Section –........................... 38
7-8. IC Pin Function Description ........................................... 45
8. EXPLODED VIEWS ................................................ 47
9. ELECTRICAL PARTS LIST ............................... 52
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro­static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body . During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW* * This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra­diation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
– 2 –
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB­LISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE ! SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM­POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Page 3
DISC MAGAZINE GETTING OUT PROCEDURE ON
Lever (stop) ass’y
Magazine ass’y
THE POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) ass’y to arrow direction.
2) Removal the magazine ass’y.
Note: Take out the magazine only when the tray is completely within the
magazine. If the disc or tray is sticking out, turn on the power and eject the magazine.
– 3 – – 4 –
Page 4
This section is extracted from instruction manual.
SECTION 2

GENERAL

– 5 – – 6 –
Page 5
– 7 –
Page 6
SECTION 3
)

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER), FRONT PANEL ASS’Y
1
screw (PTT2.6 × 6)
3
lever (FL)
1
screw (PTT2.6 × 6)
1
screw (PTT2.6 × 6)
2
case (upper)
3
1
screw (PTT2.6 × 6)
lever (FL)
4
front panel ass’y
MECHANISM DECK (MG-250B-137)
2
spring (FL)
1
two dampers (250)
1
screw (PTT2.6 × 6)
4
mechanism deck (MG-250B-137
2
spring (FL)
3
jack flexible board (CN901)
– 8 –
1
two dampers (250)
Page 7
JACK BOARD
Remove the JACK board of the arrow.
1
ground point screw (+PTT2.6 × 6)
2
JACK board
MAIN BOARD
5
screw (P1.4
×
3.0)
1
main flexible board (CNJ12)
6
three screws
7
MAIN board
2
connector (CNP301)
3
screw (BVTT2
×
4)
5
screw (P1.7
×
2.5)
– 9 –
4
heat sink
Page 8
ELEVATOR MOTOR ASS’Y (M104)
1
screw (P2 × 2.2)
2
bracket (ELV motor)
3
elevator motor ass’y
ESCUTCHEON
2
Remove the claw of the arrow
4
Remove the ditch of the arrow
5
Remove the escutcheon of the arrow
A
B
C
3
two claws
.
A
.
.
B
4
C
ditch
1
screw (M2
– 10 –
×
3)
Page 9
CASE (UPPER) ASS’Y
4
three screws (B2 × 3)
7
Remove the case (upper) ass’y of the arrow B.
4
screw (B2 × 3)
3
spring (stopper. upper)
4
two screws (B2 × 3)
6
Remove the edge of the arrow A.
2
bracket (stopper upper)
1
screw (P2 × 2.2)
5
A
B
r
CHASSIS ASS’Y
5
chassis ass’y
4
4
3
polyethylene washe
1
stop ring 2.0 (E type)
2
washer
– 11 –
6
spring (stopper. lower)
Page 10
RF BOARD
)
5
connector (CNP52)
2
two screws (PS2
1
×
4)
OP flexible board (CNJ11)
3
two screws (PS2
×
4)
4
RF board
SLED MOTOR ASS’Y (M102), OPTICAL PICK-UP (KSS-512A/J2N)
1
4
Turn at the direction of the arrow, then remove shaft (sled) ass’y
two screws (P2 × 3)
2
sled motor ass’y (M102)
5
two connectors (CNP11, 503)
3
optical pick-up (KSS-521A/J2N
– 12 –
Page 11
SW BOARD, SPINDLE MOTOR ASS’Y (M101)
8
two screws (P1.7
×
2.2)
1
screw
×
2.2)
(P2
2
SW board
7
3
spring (chucking)
6
retainer (disc)
4
screw
×
(P2
5
bracket (CP)
9
Remove the spindle motor ass’y (M101) of the arrow.
2.2)
CHUCKING MOTOR ASS’Y (M103)
3
bracket (load motor)
2
two screws (P2 × 2.5)
1
connector (CNP51)
4
chucking motor ass’y (M103)
– 13 –
Page 12
SECTION 4

MECHANISMDECK ASSEMBLY

Note: Follow the assembly procedure in the numerical order given.
OPTICAL PICK-UP COMPLETE ASS’Y
1
Move the lever (LOCK 3) in direction A, and return it a little in
direction to the lower limit.
chuck plate
B
from the position where the chuck plate is moved down
B
shaft (A)
A
3
4
stop ring 2.0 (E type)
5
tension spring (DH)
2
polyethylene washer
optical pick-up complete ass’y
Note: Insert the shaft (A) first.
GEAR (LOMINI) / (LOAD 1) ASS’Y
gear (LOAD 2)
gear (LOMINI)
marking Fig. A.
3
Attach the gear (LOAD 1) ass’y
with its facing inside.
chuck plate
slit
2
Attach the gear (LOMINI) at the position
shown in Fig. A.
shaft (rotary prevention C)
1
B
4
stop ring 1.5 (E type)
Move the lever (LOCK 3)
fully in direction B to move the chuck plate up.
– 14 –
Page 13
OPERATION CHECK
1
Confirm that the slider moves in direction C to move down the chuck plate if the gear (LOAD 1) is rotated in direction A or the chuck plate moves up and the slider mo ves in direction D if the gear is rotated in direction B.
chuck plate
slider
D
C
A
gear (LOAD 1) ass’y
B
– 15 –
Page 14
SLIDER (L)
1
Move the lever (STOP) ass’y in direction
until it gets stopped.
3
washer
A
2
slider (L)
SLIDER (R)
3
washer
4
polyethyelene slider
1
slider (R)
5
polyethyelene washer
case (lower) ass’y
2
Engage the slots of slider (R)
with the shafts.
slider (R)
– 16 –
Page 15
ADJUSTING PHASE OF SLIDERS (L, R)
y
1
Sliding the sliders (L, R) in the arrow direction, meet holes and b of the sliders (L, R) with holes c and d of the case (LOWER) ass’y
a
a
b
slider (R)
d
GEAR (ELV2) / (ELV3)
3
5
tension spring
(STOP LEVER)
c
4
retaining ring
gear (ELV 2)
slider (L)
case (LOWER) ass’
2
retaining ring
1
gear (ELV 3)
Note:After mounting the gear, confirm
that the holes for phase adjustment are not shifted.
– 17 –
Page 16

MECHANICAL ADJUSTMENTS

5
• Elevator Height (Address) Adjustment
SECTION 5
Note: This adjustments is necessary when the system controller (IC201),
variable resistor (RV201), slider (R), slider (L), or chassis (ELV) was replaced for any repair.
Connection:
power supply
master unit
+
GND
BUS cable
CDX-715
Adjustment Method:
1. Connect this set to the master unit (e.g. MDX-C670/
C670RDS), load a disc magazine, and place the set vertically as shown below.
2. Connect the regulated power supply to the master unit, and
turn the power on.
3. Press the DISC button on the master unit and select DISC 5.
4. At this time, if the elevator shaft does not position between
comb teeth A and B at addresses 5 and 6 as shown below, adjust the following.
5. Press repeatedly the DISC + and – buttons on the master unit
so that the elevator shafts moves from address 6 to address 5, or from 5 to 6. At this time, adjust RV201 on the main board so that the elevator shaft positions smoothly between comb teeth A and B.
6. Further, place the set horizontally and make same adjustment
as mentioned above.
7. After adjustment at addresses 5 to 6 is finished, check all op-
erations from addresses 1 to 10 with the set placed vertically and horizontally respectively to confirm that the ele v ator shaft positions in a range between comb teeth A to B.
comb tooth at address 5
comb tooth at address 6
A B
comb tooth at address 6
elevator shaft
A B
OK NG
elevator shaft
comb tooth at address
RV201
– 18 –
Page 17
SECTION 6
MIN side (low gain)
MAX side (high gain)
RV14 standard position

ELECTRICAL ADJUSTMENTS

Note:
1. Perform adjustments as given.
2. Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, but only when indicated.
3. Power supply voltage: DC14.4 V (more than 3A).
• FOCUS BIAS CHECK
[RF BOARD] – Conductor Side –
oscilloscope
CNJ12
TP (RF)
IC51
TP
(VC)
IC11
+ –
Procedure:
1. Connect the oscilloscope to RF board test point RF.
2. Put the set into play mode by loading the disc.
3. Confirm that oscilloscope waveform is clear and check RF sig­nal level is correct or not.
Note:
Clear RF signal waveform means that the shape “” can be clearly distin­guished at the center of the waveform.
RF signal waveform
VOLT/DIV: 200 mV TIME/DIV: 500 nsec
• TRACKING OFFSET CHECK
[RF BOARD] – Conductor Side –
oscilloscope
CNJ12
+ –
BP11
IC51
(TE)
TP
(VC)
IC11
Procedure:
1. Connect the oscilloscope to RF board bridge point TE.
2. Put the set into play mode by loading the disc.
3. Press the = AMS + button, then, c heck the traverse wa ve­form.
4. Confirm that the oscilloscope waveform is symmetrical on the top and bottom in relation to 0 V dc, and check this level. * Traverse waveform: This is the tracking error wave form
appears when crossing the track.
VOLT/DIV : 500 mV TIME/DIV : 2 msec Center : 0 V
A
0 V
B
• FOCUS GAIN ADJUSTMENT (COARSE ADJUSTMENT)
This adjustment is to be performed when replacing the following parts.
• Optical Pick-up Block
• RV14
[RF BOARD] – Conductor Side –
CNJ12
IC51
RV14
IC11
Procedure:
1. Set RV14 (RF board) to the standard position.
2. Check that there is not an abnormal amount of operation noise (white noise) from the 2-axis devise. If there is, turn RV14 slightly clockwise.
[RF BOARD] – Conductor Side –
• When gain is lowered...
The set does not play because of no focus operation.
• When gain is highered...
Operation noise is heard due to a scratch or a dust, then opera­tion will be unstable.
level: 1.4 ± 0.3 Vp-p
A=B
traverse waveform (100 track jump waveform)
– 19 – – 20 –
Page 18
CDX-715
7-1. BLOCK DIAGRAM – SERVO Section –
SECTION 7

DIAGRAMS

DETECTOR
ABD
C
F
E
OPTICAL PICK-UP
(KSS-521A)
LASER DIODE
PD
I-V AMP
LD
PD1 I-V AMP
PD1
38
PD2 I-V AMP
PD2
39
AUTOMATIC
POWER CONTROL
Q11
F
41
E
42
LD
36
RF
+
SUMMING
AMP
RF AMP,
FOCUS/TRACKING
SERVO

IC11 (1/2)

I-V
AMP
LD
AMPPDAMP
FOCUS
ERROR
AMP
TRACKING
ERROR
AMP
PD
37
RFO
33
RFI
32
FOCUS OK
COMPARATOR
MIRR
AMP
DEFECT
AMP
FEO
FE BIAS
TEO
DIGITAL SIGNAL PROCESSOR,
CLV SERVO

IC101

RF
ASYI ASYO
FOK
DATO CLKO XLTO
SEIN CNIN

IC201 (1/2)

ASYMMETRY CORRECTION
CD.DATA
SERVO AUTO SEQUENCER
DIGITAL CLV
MON
26
52
SUBQ
51
SCLK
23
SENS
67
65
CD.CLK
66
CD.XLT
63
SCOR
24
GFS
44
46 47
FOK
DATA
CLK
XLT
LOCK
XRST
SENS1
C.OUT
SENS2
FEO
TAO
27
22 20 21 19 23
25 24 26
6
13
FOCUS OK
AMP
TTL
IIL
1
RV14 FOCUS
40
GAIN
45
FEI
2
TEI
47
TTL
IIL
IIL
IIL DATA REGISTER
TTL
FOCUS PHASE
COMPENSATION
TRACKING PHASE
COMPENSATION
23
15 17 16
13 14
SYSTEM CONTROLLER
C.OUT
54
FOK
22
SENS2
8
FILTER
39
42
FILO
CLTV
DIGITAL PLL
XROF
MDS29LOCK64SQSO
MDP
28
27
PCO
4038
FILI
SQCK
8 7
EFM
DEMODULATOR
SUB-CODE
PROCESSOR
CPU INTERFACE
SENS
XLAT
CLOCK
DATA
91012
117576
SCOR
SBSO
EXCK
77
INTERNAL BUS
GFS
XRST
100
89
61
D/A
16K
RAM
ERROR
CORRECTOR
CLOCK
GENERATOR
XTAI
EDGE DETECT
PCMD
BCKO LRCK
C2PO
INTERFACE
RFCK
WDCK
GTOP WFCK
EMPH

IC403 (1/2)

C4M
52 54 50
63 62 49

IC403 (2/2)

2
1
58 74 72
70
DATI
11
9
BCKI LRCI
12
7
RFCK
7
WDCI
13
8
GTOP
3
WFCK
5
C4M
6
XROI
D-RAM
CONTROLLER
IC401
47
SDTI
48
SCK
61
SCOR
DATA
BCK
LRCK
XTAI
18 17 19
16
C4M
A
(Page 23)
B
(Page 23)
21
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
2-AXIS DEVICE
(FOCUS)
(TRACKING)
05

M102

M
(SLED)

M101

(SPINDLE)
M
OUT+
2
OUT–
1
OUT+
12
OUT–
13
OUT+
26
OUT–
27
OUT+
17
OUT–
16

IC51

TRACKING
COIL DRIVE
FOCUS
COIL DRIVE
SLED
MOTOR DRIVE
SPINDLE
MOTOR DRIVE
IN
4
IN
10
SLED SERVO

IC11 (2/2)

IN
24
IN
19
SLO
16 14
SLED
AMP
(CHUCKING)

M103

SLP
M
CHUCKING MOTOR DRIVE

IC52

OUT1
1 7
OUT2
CHUCKING
MOTOR DRIVE
RIN
FIN
4 5
CH.F
4
CH.R
5
XRST
GRSRT
GRSCOR
XQOK
SDTI
XSOE
ESPXLT
XRDE
XWRE
LOAD1
LOAD2
LIM.SW 9
25 46 26
27
28
29 41 42

SW12

(SAVE END DETECT)
7

SW11

(CHUCKING END DETECT)
6
SW1
(LIMIT)
GRSRT
1
60
XRDE
SDTO
GSCR
59
XLT
XQOK
XSOE
50
494645
ON : When completion of the disc
chucking operation.
ON : When completion of the disc
chucking operation.
ON : When the optical pick-up
is inner position.
44
XWRE
A0 – A9
25 – 22, 40 – 36, 27
9 – 12, 14 – 18, 5
A0 – A9
D1 – D4
31, 30, 33, 32
1, 2, 24, 25
D1 – D4
D-RAM

IC402

XRAS
XCAS
342835
23422
XCAS
XRAS
XOE
XWE
29
3
XOE
XWE
• SIGNAL PATH
XRST
: CD PLAY
C
(Page 23)
– 21 – – 22 –
Page 19
CDX-715
– MAIN Section –
A
(Page 22)
XRST
C
(Page 22)
C4M
B
(Page 22)
DIGITAL FILTER,
XO
HS 21
LINEAR POSITION
D/A CONVERTER,
LOW-PASS FILTER

IC601

DIGITAL FILTER
CIRCUIT
MICRO COMPUTER
INTERFACE
CIRCUIT
EMP
19

RV201

SENSOR
LOW-PASS
FILTER
CIRCUIT
LOW-PASS
FILTER
CIRCUIT
LO
9
RO
5
MUTING
CONTROL SWITCH
Q601, 602
MUTING

Q610

MUTING

Q620

CN901 (1/2)
AUDIO OUT L
AUDIO OUT R
• SIGNAL PATH : CD PLAY
COMPRESSOR

IC102

DATAI
3
BCKI
2
LRCKI
1
RST
6
INPUT
INTERFACE
CIRCUIT
SEQUENTIAL
CONTROL
DIGITAL
SIGNAL
PROCESSOR
MODE
CONTROL
MODE2
MODE1
14
15
16
MODE3
OUTPUT
INTERFACE
CIRCUIT
SYSTEM
CLOCK
75 74
SYSTEM CONTROLLER
MODE2 MODE1
DATAO
BCKO
LRCKO
CLK

IC201 (2/2)

9 10 11
4
ML
EMP
A.MUTE
MCK
DATA
22
BCK LRCK
MCK
45 44
43
38
INTERFACE
CIRCUIT
TIMING
GENERATOR
OSC
XI 15
16

X601

16.9344MHz
23 24
13

M104

(ELEVATOR)
EHS
AVREF
ELV.ON
CD.ON
BU.CHK
SCK
BUS.ON
RST
W.UP
39
37
69
68 61
SI
49
SO
50
48
55
30

D306

62

SW201

MAGAZINE EJECT
END DETECT

SW202

MAGAZINE IN/OUT
DETECT
ELEVATOR MOTOR DRIVE

IC301

EEPROM

IC202

FIN
RIN
SDA SCL
4 5
5 6
OUT1
1
M
7
OUT2
ELEVATOR
MOTOR DRIVE
57
60
70 58
12 11
MGLK
MAG.SW
ELV.R ELV.F
EE.DATA EE.CLK

RV202

ELEVATOR HEIGHT
SENSOR
REFERENCE VOLTAGE
SWITCH

Q201

MICON +5V
BUS INTERFACE
(FOR SONY BUS)

IC302

SO
10
SI
9
SCK
11
BUSON OUT
1
BUSON OUT
13
RESET
8
RESET SIGNAL
GENERATOR

IC304

RESET
SWITCH
DATA
CLK
LOF
BUSON IN
RST
MICON +5V
+9V
MICON +5V
DAC +5V,
SERVO +5V
6
4
12
2
7

D311

+5V
REGULATOR

IC305

BATTERY
CHECK
Q301, 302
+9V
REGULATOR

IC303

REGULATOR

Q303

B+ SWITCH
Q304, 305
LEVEL SHIFT

D307

D309

D313

D308

BUS CONTROL CONNECTOR
(FOR SONY BUS)
7
5 4 6 2
CN901 (2/2)
B.UP
DATA CLK
BUSON
RST
EJECT
05
XTAL
X201 8MHz
EXTAL
3132
64

SW301

6
MICON +5V
– 23 – – 24 –
Page 20
CDX-715
• Semiconductor Location
Ref. No. Location

IC11 C-6 IC51 B-7 IC52 G-4

Q11 D-6
Note on Printed Wiring Boards:
Y : parts extracted from the conductor side.
r
b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component Side) the parts face are indicated.
: Through hole.
7-2. PRINTED WIRING BOARDS – RF Section –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in and 1/ specified.
Note:
The components identi­fied by mark ! or dotted line with mark ! are criti­cal for safety. Replace only with part number specified.
U : B+ Line.
H : adjustment for repair.
• Power voltage is dc 14.4 V and fed with regulated dc power supply from CD changer controller.
• Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : PLAY
• Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal produc­tion tolerances.
• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc­tion tolerances.
• Circled numbers refer to waveforms.
• Signal path. J : CD
4
W or less unless otherwise
Note:
Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.
– 25 – – 26 –
Page 21
7-3. SCHEMATIC DIAGRAM – RF Section – • See page 25 for Note on Schematic Diagram. See page 39 for Waveforms. See page 41 and 42 for IC Block Diagrams.
CDX-715
– 27 – – 28 –
Page 22
CDX-715
• Semiconductor Location (Component Side)
Ref. No. Location

D301 F-4 D302 F-4 D303 F-4 D304 E-2 D305 E-2 D306 E-6 D307 G-4 D308 F-4 D309 E-2 D310 E-3 D311 F-5 D312 E-3 D313 C-2 D314 F-3

IC101 B-6 IC102 D-5 IC201 E-7 IC202 D-8 IC301 F-3 IC302 F-5 IC304 G-4 IC401 B-5 IC402 C-5 IC403 B-4 IC601 E-5

7-4. PRINTED WIRING BOARD – MAIN Section – MAIN Board (Component Side)
See page 32 for Note on Printed Wiring Board. See page 33 to 36 for Schematic Diagram.

Q201 E-8 Q301 G-4 Q302 G-4 Q303 F-4 Q304 B-2 Q601 C-3 Q602 C-3 Q610 D-3 Q620 C-3

– 29 – – 30 –
Page 23
– MAIN Section – MAIN Board (Conductor Side)
See page 33 to 36 for Schematic Diagram.
CDX-715
• Semiconductor Location (Conductor Side)
Ref. No. Location

IC303 E-8 IC305 D-8

Q305 C-8

Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
r
b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
: Through hole.
¢
: internal component.
Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component Side) the parts face are indicated.
– 31 – – 32 –
Page 24
CDX-715
7-5. SCHEMATIC DIAGRAM – MAIN Section – MAIN Board (1/2)
See page 39 and 40 for Waveforms. See page 42 to 44 for IC Block Diagrams. See page 45 and 46 for IC Pin Function Description. See page 36 for Note on Schematic Diagram. See page 29 to 32 for Printed Wiring Board.
– 33 – – 34 –
Page 25
– MAIN Section – MAIN Board (2/2)
See page 40 for Waveforms. See page 43 and 44 for IC Block Diagrams. See page 29 to 32 for Printed Wiring Board.
CDX-715
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in and 1/ specified.
¢
U : B+ Line.
H : adjustment for repair.
• Power voltage is dc 14.4 V and fed with regulated dc power
• Voltages and waveforms are dc with respect to ground
• Voltages are taken with a VOM (Input impedance 10 M).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
: internal component.
supply from CD changer controller. under no-signal conditions.
no mark : PLAY
Voltage variations may be noted due to normal produc­tion tolerances.
Voltage variations may be noted due to normal produc­tion tolerances.
J : CD
: Impossible to measure
4
W or less unless otherwise
– 35 – – 36 –
Page 26
CDX-715
7-6. PRINTED WIRING BOARD – JACK Section – 7-7. SCHEMATIC DIAGRAM – JACK Section –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in and 1/ specified.
C : panel designation.
U : B+ Line.
• Signal path. J : CD
• Abbreviation G : German model.
4
W or less unless otherwise
Note on Printed Wiring Board:
X : parts extracted from the component side.
p : parts mounted on the conductor side.
r
b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component Side) the parts face are indicated.
• Abbreviation
: Through hole.
G : German model.
– 37 – – 38 –
Page 27
• Wavef orms
6 Vp-p
472 ns
– RF Board –
1 IC11 1 (FEO)
500 mV/DIV, 500 nsec/DIV
2 IC11 2 (FEI)
50 mV/DIV, 1 µsec/DIV
1.4 ±0.3 Vp-p
– MAIN Board (1/2) –
1 IC101 MDP
3.8
2 IC101 WDCK
2.5 Vp-p
µ
s
3 IC11 (TEI)
200 mV/DIV, 500 µsec/DIV
Approx. 110 mVp-p
Approx. 280 mVp-p
5 Vp-p
11.4 µs
3 IC101 LRCK
5 Vp-p
22.5 µs
4 IC101 BCKO
5 IC101 ^™ RFCK
5 Vp-p
136.5 µs
– 39 –
Page 28
6 IC101 WFCK
IC102 0 BCKO
137 µs
7 IC101 XTAI
59 ns
8 IC201 EXTAL
5 Vp-p
4.5 Vp-p
3.3 Vp-p
5.3 Vp-p
472 ns
!™ IC102 LRCKO
5.3 Vp-p
22.6 µs
– MAIN Board (2/2) –
IC601 !∞ XI
124.5 ns
9 IC401 BCK
472 ns
0 IC401 LRCK
2.9 Vp-p
59 ns
5.9 Vp-p
5.8 Vp-p
22.8 µs
– 40 –
Page 29
• IC Block Diagrams IC11 CXA1992BR (RF BOARD)
FE_BIAS
LPFI
ATSC
TDFCT
VEE
TEO
TZC
FZC
PD2
PD1
RF_O
PD
LD
RFTC
RF_M
RF_I
CP
CB
CC1
CC2
FOK
27282930313233343536373839
VEE
+
+
– +
RF SUMMING AMP
FOH FOL TGH
TGL BALH BALL ATSC
TZC
FZC
+ –
– + –
+ –
+
VEE
MIRR
VCC
+
+
+
+
VEE LEVEL S
VCC
+
FOK
LDON
LPCL
LPC
TGFL
IIL DATA REGISTER INPUT SHIFT REGISTER ADDRESS DECODER SENS SELECTOR OUTPUT DECODER
DFCTO
IFB1-6
FS1-4 TG1-2 TM1-7 PS1-4 BAL1-4 TOG1-4
+
SENS2
26
+
IIL
VCC
+
VEE
+
+
TTL
DFCT
+
IIL
MIRR
TTL
DFCT1
CC1
TTL
IIL
VCC
ISET
VCC VCC
SENS1
25
C. OUT
24
XRST
23
DATA
22
XLT
21
CLK
20
LOCK
19
VCC
18
ISET
17
SL_O
16
TM4 TM6
SL_M
VCC
FS1
FS2
Charge
up
TG2
TM7
FSET
TM3
TM5
VEEVEE
+
15
SL_P
14
+
TM2
+
PD2 IV AMP
40
F
41
E
42
– +
– +
F IV AMP
PD1 IV AMP
+
VCC
APC
+
+
+
VEE
LASER POWER CONTROL
VCC
FE AMP
+
E IV AMP
+
43
EI
BAL1
BAL2
BAL3
BAL4
VEE
44
TOG4
TOG3
TOG2
TOG1
TGFL
+
45
+ –
E-F BALANCE
VCC
VEE
WINDOW COMP.
+ –
DFCT
TM1
– +
– +
+ –
ATSC WINDOW COMP.
– +
46
47
TEI
48
49
TZC COMP.
50
51
VC
+ –
VCC
52
+ –
IFB4
IFB2
IFB3
IFB1
VEE
+ –
+
TRK. GAIN
WINDOW COMP.
+ –
TG1
IFB5
IFB6
FOCUS PHASE COMPENSATION
FO. BIAS WINDOW COMP.
TRACKING PHASE COMPENSATION
DFCT
FZC COMP.
FS4
VEE
1
2 3
FEO
FEI
4
FDFCT
5 6 7 8 9 10
FGD
FLB
FE_O
FE_M
SRCH
TGU
TG2
FSET
TA_M
131211
TA_O
– 41 –
Page 30
IC52, 301 BA6287F (RF BOARD, MAIN BOARD)
1
OUT1
VCC
VM
FIN
2
DRIVER DRIVER
TSD
3
POWER
SAVE
4
CONTROL LOGIC
8
GND
7
OUT2
6
VREF
5
RIN
IC101 CXD2530Q (MAIN BOARD)
TES6
VDD
VSS
EXCK
SBSO
SCOR
WFCK
TES5
EMPH
DOUT
C4M
FSTT
XTSL
MNT0
MNT1
66 65 64
67
ERROR
CORRECTOR
16K RAM
SERVO
AUTO
MNT3
VSS
VDD
TES7
VSS
XVDD
XTAI XTAO XVSS
VSS
TES8
VDD
VSS
XRST
79 78
80
NC
81 82 83
NC
84 85 86
NC
87 88 89 90 91 92
NC
93 94
NC
95 96 97 98
NC NC
99 100
TIMING
LOGIC
76 75 74
77
73 72
DEMODULATOR
SUB CODE
PROCESSOR
CPU
INTERFACE
EFM
69 68
70
71
SEQUENCER
XROF
C2PO
63 62 61
RFCK
GFS
XPCK
59 58
60
D / A
INTERFACE
DIGITAL OUT
DIGITAL CLV
XUGF
GTOP
57
VDD
VSS
56 55 54
TES4
BCK
TES3
53 52 51
ASYMMETRY CORRECTOR
DIGITAL
PLL
CLOCK
GENERATOR
PCMD
OSC
TES9
LRCK
50 49
WDCK
48
ASYE
47
ASYO ASYI
46
BIAS
45
RF
44
AVDD
43 42
CLTV AVSS
41 40
FILI
39
FILO PCO
38
VCTL
37
V16M
36 35
VCKI
34
VPCO1
33
VPCO2
32
TES1
31
TES0
1 234
VSS
VDD
56789 10
TES2
LMUT
RMUT
CKOUT
SQCK
SQSO
SENS
11
DATA
XLAT
12 13
CLOK
14
SEIN
15 16 17
CNIN
IC102 SM5852FS-E2 (MAIN BOARD)
LRCI BCKI
CLK VSS
RSTN
TESTN
MUTEN
1 2 3
DI
4 5
6 7 8
INPUT
INTERFACE
SYSTEM
CLOCK
SEQUENTIAL
CONTROL
MUTE
CONTROL
DIGITAL
SIGNAL
PROCESSOR
OUTPUT
INTERFACE
MODE
CONTROL
DATO
XLTO
18 19 20
CLKO
SPOA
DB/DS
16
MOD2
15
MOD1
14
OPT
13
VDD
12
LRCO
11
BCKO
10
DOUT
9
SPOB
21
SPOC
22 23
SPOD
24
FOK
XLON
– 42 –
25 26 27
VSS
VDD
MON
28 29 30
MDP
MDS
LOCK
PWMI
Page 31
IC202 AT24C16N-10SI-TR (MAIN BOARD) IC302 BA8272F-E2 (MAIN BOARD)
VCC
8
NC
SCL
D OUT
SDA
8 7
6
5
VCC
2 3
1
BUS ON OUT
BUS ON
LINK OFF
GND
BUS ON IN
CLK OUT
DATA OUT
5 6 7
4
VREF
BUS CLK
BUS DATA
DATA IN
RESET
891014 13 12 11
RESET
SWITCH
BUS RESET
START CYCLE
START/
STOP LOGIC
CONTROL
R/W
LOGIC
LOAD
WORD ADDRESS COUNTER
INC
SLAVE ADDRESS
REGISTER &
A0
1
A1
2
A2
3
4
VSS
COMPARATOR
DEVICE
ADDRESS
BITS
D OUT
ACK
H.V. GENERATOR
TIMING & CONTROL
EEPROM
X
DECODER
128 x 16 x 8
416
16
4
D IN
CK
Y
DECODER
8
DATA
REGISTER
IC401 CXD2522Q (MAIN BOARD)
XLT
WRITE
BASE
RFCK
XRDE
GTOP
XWRE
43444546
SPSL
VWA
BCKI
DSP
I/F
VSS
DATI
XWIH
AM4 AM3 AM2 AM1 AM0 VDD
XQOK
GSCR SCOR
XEMP
SDTO
XSOE
SCK
CPU I/F
ADDRESS MONITOR
READ
BASE
COUNTER
DATA
LINKING
CONTROL
DIN
C4M
WFCK
SDTI
COUNTER
XROI
51 50 49 48 47
52 53 54 55 56 57 58 59
60 61
NC
62
NC
63
NC
64
2 345 6 7 8 9 10
1
XRST
GRST
VSS
LRCI
WDCI
OSCE
TEST
XTAO
A4
XTAI
A6
A5
DRAM
SELECTOR
TIMING
GEN.
DAC
I/F
BCK
A7
I/F
191817161514131211
DATA
A8
LRCK
XCAS
XOE
DIGITAL
OUT
D2
33343536373839404142
D3
32
D0
31
D1
30
XWE
29
XRAS
28
A9
27 26
VDD A0
25 24
A1 A2
23
A3
22
21
C176
DOUT
20
– 43 –
Page 32
IC402 MB814400C-70PFTN
CLOCK OSC
COLUMN DECODER
SENSE REFRESH AMP
INPUT/OUTPUT
CONTROL SWITCH
MEMORY CELL
ROW DECODER
XWE
XRAS
VDD
1
D1
2
D2
3
4
A9
5
6
NC
7
NC
8
NC
9
A0 A1
10 11
A2
12
A3
13
A0–A9
A0–A9
ADDRESS BUFFER
IC601 TC9464FN-EL (MAIN BOARD)
INPUT
BUFFER
BUFFER
OUTPUT
GND
26
D4
25
D3
24
XCAS
23
XOE
22
NC
21
NC
20 19
NC A8
18 17
A7 A6
16 15
A5 A4
14
LRCK
BCK
DATA
INTERFACE
CIRCUIT
DIGITAL FILTER CIRCUIT
ATTENUATOR OPERATIONAL CIRCUIT
DEEMPHASIS FILTER CIRCUIT
D- MODULATION CIRCUIT
TEST
CIRCUIT
2 3
1
T1
VDD
P/S
ATT
HS
(SM)
20 19 18 17 16 15 14 13
21222324
MICROCOMPUTER
INTERFACE
CIRCUIT
OUTPUT CIRCUIT
ANALOG
FILTER
5 6 7 8 9 10
4
RO
VDA
SH
(EMP)
GNDA
(BS)
VR
LA
VDXXOXI
TIMING
GENERATOR
OUTPUT CIRCUIT
ANALOG
FILTER
GNDA
OSC
GNDX
MCK
1211
LO
VDA
ZD
GNDD
– 44 –
Page 33
7-8. IC PIN FUNCTION DESCRIPTION
MAIN BOARD IC201 CXP84332-088Q (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Function
1 to 3 O Not used (open)
4 CH.F O Motor drive signal (load chucking direction) output to the chucking motor drive (IC52) *1 5 CH.R O Motor drive signal (save direction) output to the chucking motor drive (IC52) *1
6 LOAD2 I
Chucking end detect switch (SW11) input “L”: When completion of the disc chucking operation
7 LOAD1 I
8 SENS2 I Internal status signal (sense signal) input from the CXA1992AR (IC11)
9 LIM.SW I
10 EE.INIT I Initialize signal input for the EEPROM (IC202) “H”: format Fixed at “L” in this set 11 EE.CLK O Serial data transfer clock signal output to the EEPROM (IC202) 12 EE.DATA I/O Two-way data bus with the EEPROM (IC202)
13 to 19 O Not used (open)
20 SINGLE I
21 XRST O
22 FOK I Focus OK signal input from the CXA1992AR (IC11) “L”: NG, “H”: OK 23 SENS I Internal status signal (sense signal) input from the CXD2530Q (IC101) 24 GFS I Guard frame sync signal input from the CXD2530Q (IC101) “L”: NG, “H”: OK 25 GRSRT O Reset signal output to the CXD2522Q (IC401) “L”: reset 26 XQOK O Subcode Q OK pulse signal output to the CXD2522Q (IC401) “L” active 27 SDTI I ESP status signal input from the CXD2522Q (IC401) 28 XSOE O ESP status read enable signal output to the CXD2522Q (IC401) “L” active 29 ESPXLT O ESP latch pulse signal output to the CXD2522Q (IC401) “L” active
Save end detect switch (SW12) input “L”: When completion of the disc chucking operation
Sled limit in detect switch (SW1) input “L”: When the optical pick-up is inner position
Setting terminal for the single disc/multiple discs mode “L”: single mode, “H”: multiple discs mode (fixed at “H”)
System reset signal output to the CXA1992AR (IC11), CXD2530Q (IC101) and SM5852FS (IC102) “L”: reset
System reset signal input from the SONY bus interface (IC302) and reset signal generator
30 RST I
31 EXTAL I Main system clock input terminal (8 MHz) 32 XTAL O Main system clock output terminal (8 MHz) 33 VSS Ground terminal 34 TX O Sub system clock output terminal Not used (open) 35 TEX I Sub system clock input terminal Not used (fixed at “L”) 36 AVSS Ground terminal (for A/D converter) 37 AVREF I Reference voltage (+5V) input terminal (for A/D converter)
38 MCK I
39 EHS I Elevator height position detect input from the RV202 (elevator height sensor) (A/D input) 40 H.TEMP I High temperature sensor input terminal Not used (open) 41 XRDE O D-RAM read enable signal output to the CXD2522Q (IC401) “L” active 42 XWRE O D-RAM write enable signal output to the CXD2522Q (IC401) “L” active 43 A.MUTE O Audio line muting on/off control signal output terminal “H”: muting on 44 EMP O Emphasis mode output to the D/A converter (IC601) “H”: emphasis on 45 ML O Fast speed dubbing control signal output to the D/A converter (IC601) “L”: fast speed 46 GRSCOR I Subcode sync (S0+S1) detection signal input from the CXD2522Q (IC401) 47 D/A.RESET O Reset signal output terminal “L”: reset Not used (open)
(IC304) “L”: reset For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”
Input of signal for the fine adjustment (linear position sensor adjustment; RV201) of elevator position (A/D input)
– 45 –
Page 34
Pin No. Pin Name I/O Function
48 SCK I Serial data transfer clock signal input from the SONY bus interface (IC302) 49 SI I Serial data input from the SONY bus interface (IC302) 50 SO O Serial data output to the SONY bus interface (IC302) 51 SCLK O Subcode Q data reading clock signal output to the CXD2530Q (IC101) 52 SUBQ I Subcode Q data input from the CXD2530Q (IC101) 53 O Not used (open) 54 C.OUT I Track number count signal input from the CXA1992AR (IC11) 55 BUS.ON I Bus on/off control signal input from the SONY bus interface (IC302) “H”: bus on 56 A/D.SW O Analog/digital out selection signal output terminal “L”: digital out Not used (open) 57 MGLK I Magazine eject operation completion detect switch (SW201) input “L”: eject completed 58 ELV.F O Motor drive signal (elevator up direction) output to the elevator motor drive (IC301) *2 59 O Not used (open) 60 MAG.SW I Magazine in/out detect switch (SW202) input “L”: magazine detected 61 BU.CHK I 62 W.UP I Bus on or eject switch (SW301) input terminal “H”: bus on or eject switch pushing 63 SCOR I Subcode sync (S0+S1) detection signal input from the CXD2530Q (IC101) 64 EJECT I Eject switch (SW301) input terminal “H” active 65 CD.CLK O Serial data transfer clock signal output to the CXD2530Q (IC101) and CXD2522Q (IC401) 66 CD.XLT O Serial data latch pulse signal output to the CXD2530Q (IC101) 67 CD.DATA O Serial data output to the CXD2530Q (IC101) and CXD2522Q (IC401) 68 CD.ON O D/A converter and servo section power supply on/off control signal output “H”: power on 69 ELV.ON O Mechanism deck section power supply on/off control signal output “H”: power on 70 ELV.R O Motor drive signal (elevator down direction) output to the elevator motor drive (IC301) *2 71 O Not used (open) 72 VDD Power supply terminal (+5V) 73 NC (VDD) Connected to the power supply (+5V) 74 MODE1 O D-BASS control signal output to the SM5852FS (IC102) “L” active 75 MODE2 O D-BASS control signal output to the SM5852FS (IC102) “L” active 76 REQ O Data request signal output terminal Not used (open) 77 CCCLK O Command clock signal output terminal Not used (open) 78 CSI O Command data input terminal Not used (open) 79 CSO O Command data output terminal Not used (open) 80 ADJ O Auto adjust selection terminal Not used (open)
Battery detection signal input terminal “H”: battery on
*1 chucking motor (M103) control
MODE
TERMINAL
CH.F (pin 4) “H” “L” “H” “L” CH.R (pin 5) “H” “H” “L” “L”
*2 elevator motor (M104) control
MODE
TERMINAL
ELV.F (pin %•) “H” “L” “H” “L” ELV.R (pin ) “H” “H” “L” “L”
STOP
STOP
LOAD
CHUCKING
ELEVATORUPELEVATOR
SAVE BRAKE
DOWN
– 46 –
BRAKE
Page 35
SECTION 8

EXPLODED VIEWS

NOTE:
• -XX and -X mean standardized parts, so they may have some difference from the original one.
• Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED)
↑↑
Parts Color Cabinet's Color
(1) CASE SECTION
7
#2
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
• The mechanical parts with no reference num­ber in the exploded views are not supplied.
• Hardware (# mark) list and accessories and packing materials are given in the last of the electrical parts list.
13
#3
#2
12
11
9
#2
The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.
Les composants identifiés par une marque ! sont critiquens pour la sécurité. Ne les remplacer que par une pièce portant le neméro spécifié.
14
#2
13
MG-250B-137
10
#2
24
8
5
4
19
3
1
17
22
22
Ref. No. Part No. Description Remark
1 3-010-104-01 DAMPER (250)
* 2 3-010-097-01 CASE (LOWER)
3 1-664-628-11 JACK FLEXIBLE BOARD
* 4 1-668-857-11 JACK BOARD
5 X-3373-217-1 DOOR ASSY
12
15
16
18
#9
#1
25
6
1
2
Ref. No. Part No. Description Remark
12 3-010-103-01 SPRING (FL), TENSION 13 3-010-101-01 LEVER (FL)
* 14 3-010-096-01 CASE (UPPER) * 15 A-3313-512-A MAIN BOARD, COMPLETE
16 1-664-627-11 MAIN FLEXIBLE BOARD
6 X-3373-986-1 ARM (FR) ASSY 7 3-010-098-81 PANEL, FRONT 8 3-012-388-01 SCREW (M2X3)
* 9 3-010-105-01 ESCUTCHEON * 10 3-010-106-01 BUTTON (EJ) (6)
* 11 3-010-107-01 HEAT SINK
17 3-350-124-01 CUSHION (EJECT) 18 X-3373-215-1 ARM (FL) ASSY 19 3-918-103-11 SCREW
* 22 3-013-658-01 SHEET (FJ), PROTECTION
24 3-376-464-11 SCREW(+PTT 2.6X6), GROUND POINT
25 4-941-475-01 CUSHION, BATTERY
– 47 –
Page 36
(2) MECHANISM DECK SECTION-1 (MG-250B-137)
54
#6
#6
66
53
55
56
#5
57
#6
58
51
59
61
60
62
#12
51
Ref. No. Part No. Description Remark
51 4-965-759-01 WASHER, POLYETHYLENE
* 52 X-3373-239-1 SLIDER (R) ASSY
53 3-010-244-01 SPRING (STOPPER. UPPER)
* 54 X-3373-243-1 CASE (UPPER) ASSY
55 3-010-217-01 SPRING (EJ), TENSION
63
52
Ref. No. Part No. Description Remark * 58 3-010-240-01 SLIDER (L)
59 3-011-997-01 SPRING (STOPPER. LOWER) 60 3-014-603-01 WASHER 61 3-736-073-01 SLIDER, POLYETHYLENE 62 3-701-438-21 WASHER, THRUST
* 56 3-010-162-01 LEVER (EJECT) * 57 3-011-998-01 BRACKET (STOPPER. UPPER)
63 3-578-224-00 WASHER 66 3-013-503-01 SPRING (EJ1), TENSION
– 48 –
Page 37
(3) MECHANISM DECK SECTION-2 (MG-250B-137)
113
111
#14
#10
M104
112
115
116
104
105
107
#5
103
106
109
110
108
102
114
Ref. No. Part No. Description Remark * 101 X-3373-223-1 CASE (LOWER) ASSY
102 3-010-266-01 SPRING (STOP LEVER), TENSION
* 103 3-010-250-01 BRACKET (ELV MOTOR)
104 3-736-073-01 SLIDER, POLYETHYLENE 105 3-010-211-01 GEAR (WORM ELV)
106 3-336-319-01 RING, RETAINING 107 3-010-175-01 GEAR (ELV 1) 108 3-010-239-01 GEAR (ELV 2) 109 3-362-579-01 RING, RETAINING
101
Ref. No. Part No. Description Remark
110 3-010-249-01 GEAR (ELV 3)
* 111 3-016-916-01 BRACKET (WORM RETAINER) * 112 3-014-681-01 SHAFT (WORM RETAINER) * 113 3-014-685-01 SPACER (MO) * 114 3-014-389-01 SPACER (LSW)
* 115 3-014-683-01 SPACER (PB)
116 3-315-483-00 SPACER M104 A-3301-123-A ELJ MOTER ASSY (ELEVATOR)
– 49 –
Page 38
(4) MECHANISM DECK SECTION-3 (MG-250B-137)
159
#8
168 167
#12
172
M103
151
152
170
153
#4
#7
171
r
154
A
155
(including rA)
156
#8
157
#7
160
158
#7
#7
Ref. No. Part No. Description Remark
* 151 3-010-269-01 BRACKET (LOAD MOTOR) * 152 X-3373-230-1 BASE (WORM) ASSY * 153 3-010-270-01 COVER (MOTOR L)
154 3-321-813-01 WASHER, COTTER POLYETHYLENE 155 X-3375-496-1 GEAR (L) ASSY (INCLUDING rA)
156 3-573-936-00 STOPPER, REEL 157 3-010-255-01 ARM (LSW)
* 158 A-3313-586-A RF BOARD, COMPLETE
Ref. No. Part No. Description Remark
159 A-3290-155-A CHASSIS (EVT) (MAIN) ASSY 160 3-701-438-11 WASHER, 2.5 167 3-010-254-01 SHAFT (ROTARY PREVENTION C) 168 3-010-253-01 GEAR (LOMINI) 170 3-911-215-02 SHEET (LEAD RETAINER)
171 3-010-252-01 ROLLER (CRE) 172 3-010-268-01 SPRING (DH), TENSION M103 A-3291-953-A MOTOR ASSY, EL (CHUCKING)
– 50 –
Page 39
(5) MECHANISM DECK SECTION-4 (MG-250B-137)
205
#11
207
202
204
203
#4
#9
201
212
206
#5
M102
209
M101
210
211
#5
Ref. No. Part No. Description Remark
201 X-3373-229-1 BASE (SLED) ASSY 202 3-010-258-01 GEAR (SLED MID) 203 3-573-936-00 STOPPER, REEL 204 A-3291-958-A SHAFT (SLED) ASSY
* 205 1-664-104-11 SW BOARD
206 3-010-263-01 DETENT (SHAFT THRUST)
* 207 A-3301-077-A BASE (OP) (J) ASSY
Ref. No. Part No. Description Remark ! 209 8-820-010-05 OPTICAL PICK-UP KSS-521A/J2RP
210 1-664-626-11 OP FLEXIBLE BOARD 211 3-010-262-01 DETENT (SLED) 212 3-920-362-01 SCREW (ESCUTCHEON) M101 A-3291-956-A MOTOR SUB ASSY, SPINDLE
M102 A-3291-955-A MOTOR SUB ASSY, SLED
The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part num­ber specified.
Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le neméro spécifié.
– 51 –
Page 40
JACK MAIN
SECTION 9

ELECTRICAL PARTS LIST

NOTE:
• Due to standardization, replacements in the parts list may be different from the parts speci­fied in the diagrams or the components used on the set.
• -XX and -X mean standardized parts, so they may have some difference from the original one.
• RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable
Ref. No. Part No. Description Remark
* 1-668-857-11 JACK BOARD
***********
< CAPACITOR >
C03 1-162-302-11 CERAMIC 0.0022uF 30% 16V
C901 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C902 1-163-038-00 CERAMIC CHIP 0.1uF 25V C903 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
CN901 1-779-077-11 PLUG, CONNECTOR (CONTROL/AUDIO OUT) CNJ901 1-778-775-21 CONNECTOR, FPC 13P
< FERRITE BEAD >
FB901 1-500-445-21 INDUCTOR 0uH FB902 1-500-445-21 INDUCTOR 0uH FB903 1-500-445-21 INDUCTOR 0uH
< IC LINK >
IC901 1-532-686-21 LINK, IC (2.7A)
************************************************************
* A-3313-512-A MAIN BOARD, COMPLETE
*********************
* 3-012-099-01 HOLDER (TR2)
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when order­ing these items.
• SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .
• CAPACITORS uF: µF
• COILS uH: µH
(AEP, UK, German, E)
The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.
Les composants identifiés par une marque ! sont critiquens pour la sécurité. Ne les remplacer que par une pièce portant le neméro spécifié.
When indicating parts by reference number, please include the board.
Ref. No. Part No. Description Remark
C116 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C201 1-163-038-00 CERAMIC CHIP 0.1uF 25V C202 1-163-038-00 CERAMIC CHIP 0.1uF 25V C203 1-163-038-00 CERAMIC CHIP 0.1uF 25V C204 1-163-038-00 CERAMIC CHIP 0.1uF 25V C205 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C206 1-164-232-11 CERAMIC CHIP 0.01uF 50V C301 1-163-038-00 CERAMIC CHIP 0.1uF 25V C302 1-163-038-00 CERAMIC CHIP 0.1uF 25V C303 1-163-038-00 CERAMIC CHIP 0.1uF 25V C304 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C305 1-163-029-11 CERAMIC CHIP 0.0047uF 50V C306 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C307 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C308 1-163-038-00 CERAMIC CHIP 0.1uF 25V C309 1-125-701-11 DOUBLE LAYER 0.047F 5.5V
C310 1-104-953-11 ELECT 47uF 20% 16V C311 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C312 1-104-953-11 ELECT 47uF 20% 16V C314 1-104-953-11 ELECT 47uF 20% 16V C315 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C316 1-115-466-00 ELECT 1000uF 20% 16V C317 1-126-382-11 ELECT 100uF 20% 16V C318 1-126-382-11 ELECT 100uF 20% 16V C320 1-163-038-00 CERAMIC CHIP 0.1uF 25V C322 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
< CAPACITOR >
C101 1-164-232-11 CERAMIC CHIP 0.01uF 50V C102 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C103 1-163-035-00 CERAMIC CHIP 0.047uF 50V C104 1-163-011-11 CERAMIC CHIP 0.0015uF 10% 50V C105 1-163-001-11 CERAMIC CHIP 220PF 10% 50V
C106 1-135-214-21 TANTAL. CHIP 4.7uF 20% 20V C107 1-164-232-11 CERAMIC CHIP 0.01uF 50V C108 1-163-038-00 CERAMIC CHIP 0.1uF 25V C109 1-163-038-00 CERAMIC CHIP 0.1uF 25V C111 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C112 1-164-360-11 CERAMIC CHIP 0.1uF 16V C113 1-164-360-11 CERAMIC CHIP 0.1uF 16V C114 1-164-360-11 CERAMIC CHIP 0.1uF 16V C115 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C323 1-163-038-00 CERAMIC CHIP 0.1uF 25V C324 1-163-001-11 CERAMIC CHIP 220PF 10% 50V C325 1-163-038-00 CERAMIC CHIP 0.1uF 25V C401 1-163-038-00 CERAMIC CHIP 0.1uF 25V C402 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C403 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C404 1-163-038-00 CERAMIC CHIP 0.1uF 25V C405 1-163-038-00 CERAMIC CHIP 0.1uF 25V C601 1-126-154-11 ELECT 47uF 20% 6.3V C602 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C603 1-163-038-00 CERAMIC CHIP 0.1uF 25V C604 1-126-154-11 ELECT 47uF 20% 6.3V C605 1-126-154-11 ELECT 47uF 20% 6.3V C606 1-163-038-00 CERAMIC CHIP 0.1uF 25V C608 1-163-038-00 CERAMIC CHIP 0.1uF 25V
– 52 –
Page 41
MAIN
Ref. No. Part No. Description Remark
C609 1-126-154-11 ELECT 47uF 20% 6.3V C610 1-126-157-11 ELECT 10uF 20% 16V C611 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C620 1-126-157-11 ELECT 10uF 20% 16V C621 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C630 1-126-157-11 ELECT 10uF 20% 16V C641 1-163-038-00 CERAMIC CHIP 0.1uF 25V C642 1-163-125-00 CERAMIC CHIP 220PF 5% 50V C643 1-163-125-00 CERAMIC CHIP 220PF 5% 50V C644 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
CN101 1-770-351-11 CONNECTOR, FPC 26P CN301 1-770-350-21 CONNECTOR, FPC 13P CN302 1-580-055-21 PIN, CONNECTOR 2P
< DIODE >
D301 8-719-975-40 DIODE RB411D D302 8-719-422-64 DIODE MA8062-M D303 8-719-422-64 DIODE MA8062-M D304 8-719-975-40 DIODE RB411D D305 8-719-975-40 DIODE RB411D
D306 8-719-801-78 DIODE 1SS184 D307 8-719-422-64 DIODE MA8062-M D308 8-719-801-78 DIODE 1SS184 D309 8-719-210-33 DIODE EC10DS2 D310 8-719-801-78 DIODE 1SS184
D311 8-719-038-48 DIODE 1SS319 (TE85R) D312 8-719-422-62 DIODE MA8062-L-TX D313 8-719-210-33 DIODE EC10DS2 D314 8-719-975-40 DIODE RB411D
Ref. No. Part No. Description Remark
IC403 8-759-242-76 IC TC7W08F IC601 8-759-494-78 IC TC9464FN-EL
< TRANSISTOR >
Q201 8-729-020-67 TRANSISTOR XN1A312-TX Q301 8-729-027-31 TRANSISTOR DTA124EKA-T146 Q302 8-729-230-49 TRANSISTOR 2SC2712-YG Q303 8-729-822-05 TRANSISTOR 2SD1622-ST-TD Q304 8-729-901-00 TRANSISTOR DTC124EK
Q305 8-729-016-83 TRANSISTOR 2SB1446 Q601 8-729-901-00 TRANSISTOR DTC124EK Q602 8-729-027-23 TRANSISTOR DTA114EKA-T146 Q610 8-729-015-39 TRANSISTOR DTC323TK Q620 8-729-015-39 TRANSISTOR DTC323TK
< RESISTOR >
R101 1-216-105-00 RES, CHIP 220K 5% 1/10W R102 1-216-121-00 RES, CHIP 1M 5% 1/10W R103 1-216-113-00 METAL CHIP 470K 5% 1/10W R104 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R105 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R106 1-216-073-00 METAL CHIP 10K 5% 1/10W R107 1-216-121-00 RES, CHIP 1M 5% 1/10W R108 1-216-073-00 METAL CHIP 10K 5% 1/10W R109 1-216-097-00 RES, CHIP 100K 5% 1/10W R110 1-216-073-00 METAL CHIP 10K 5% 1/10W
R111 1-216-049-11 RES, CHIP 1K 5% 1/10W R113 1-216-049-11 RES, CHIP 1K 5% 1/10W R114 1-216-821-11 METAL CHIP 1K 5% 1/16W R115 1-216-813-11 METAL CHIP 220 5% 1/16W R116 1-216-813-11 METAL CHIP 220 5% 1/16W
< FERRITE BEAD >
FB101 1-500-445-21 INDUCTOR 0uH FB102 1-500-445-21 INDUCTOR 0uH FB103 1-500-445-21 INDUCTOR 0uH FB111 1-500-445-21 INDUCTOR 0uH FB601 1-500-445-21 INDUCTOR 0uH
FB610 1-500-445-21 INDUCTOR 0uH FB611 1-216-295-00 SHORT 0 FB612 1-216-295-00 SHORT 0 FB613 1-216-295-00 SHORT 0 FB614 1-216-295-00 SHORT 0
FB620 1-500-445-21 INDUCTOR 0uH FB630 1-500-445-21 INDUCTOR 0uH
< IC >
IC101 8-752-384-15 IC CXD2530Q IC102 8-759-473-70 IC SM5852FS-E2 IC201 8-752-894-40 IC CXP84332-088Q IC202 8-759-253-82 IC AT24C16N-10SI-TR IC301 8-759-040-83 IC BA6287F
IC302 8-759-444-86 IC BA8272F-E2 IC303 8-759-054-12 IC PQ09RA1 IC304 8-759-443-41 IC RH5VL40AA-T1C IC305 8-759-324-40 IC KIA7805PI IC401 8-752-374-09 IC CXD2522Q
IC402 8-759-427-15 IC MB814400C-70PFTN
R117 1-216-813-11 METAL CHIP 220 5% 1/16W R202 1-216-089-00 RES, CHIP 47K 5% 1/10W R203 1-216-089-00 RES, CHIP 47K 5% 1/10W R204 1-216-089-00 RES, CHIP 47K 5% 1/10W R205 1-216-081-00 METAL CHIP 22K 5% 1/10W
R206 1-216-089-00 RES, CHIP 47K 5% 1/10W R207 1-216-049-11 RES, CHIP 1K 5% 1/10W R208 1-216-089-00 RES, CHIP 47K 5% 1/10W R211 1-216-089-00 RES, CHIP 47K 5% 1/10W R212 1-216-089-00 RES, CHIP 47K 5% 1/10W
R213 1-216-089-00 RES, CHIP 47K 5% 1/10W R214 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R215 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R216 1-216-295-00 SHORT 0 R217 1-216-295-00 SHORT 0
R218 1-216-295-00 SHORT 0 R219 1-216-049-11 RES, CHIP 1K 5% 1/10W R301 1-216-089-00 RES, CHIP 47K 5% 1/10W R302 1-216-089-00 RES, CHIP 47K 5% 1/10W R303 1-216-689-11 METAL CHIP 39K 0.5% 1/10W
R304 1-216-089-00 RES, CHIP 47K 5% 1/10W R305 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R306 1-216-077-00 METAL CHIP 15K 5% 1/10W R307 1-216-049-11 RES, CHIP 1K 5% 1/10W R308 1-216-073-00 METAL CHIP 10K 5% 1/10W
R309 1-216-089-00 RES, CHIP 47K 5% 1/10W R311 1-216-089-00 RES, CHIP 47K 5% 1/10W
– 53 –
Page 42
MAIN RF
Ref. No. Part No. Description Remark
R312 1-216-073-00 METAL CHIP 10K 5% 1/10W R313 1-216-295-00 SHORT 0 R314 1-216-295-00 SHORT 0
R315 1-216-295-00 SHORT 0 R316 1-216-073-00 METAL CHIP 10K 5% 1/10W R318 1-216-813-11 METAL CHIP 220 5% 1/16W R402 1-216-105-00 RES, CHIP 220K 5% 1/10W R403 1-216-033-00 METAL CHIP 220 5% 1/10W
R601 1-216-029-00 METAL CHIP 150 5% 1/10W R602 1-216-033-00 METAL CHIP 220 5% 1/10W R610 1-216-033-00 METAL CHIP 220 5% 1/10W R611 1-216-097-00 RES, CHIP 100K 5% 1/10W R620 1-216-033-00 METAL CHIP 220 5% 1/10W
R621 1-216-097-00 RES, CHIP 100K 5% 1/10W
< VARIABLE RESISTOR >
RV201 1-223-834-11 RES, ADJ, CARBON 47K RV202 1-225-412-11 RES, VAR, SLIDE 10K
(ELEVATOR HEIGHT SENSOR)
< SWITCH >
SW201 1-762-108-31 SWITCH, PUSH (1 KEY)
(MAGAZIN EJECT END DETECT)
SW202 1-762-108-31 SWITCH, PUSH (1 KEY)
(MAGAZIN IN/OUT DETECT)
SW301 1-571-532-21 SWITCH, TACTIL (6)
< VIBRATOR >
X201 1-767-261-21 VIBRATOR, CERAMIC (8MHz) X601 1-767-511-11 VIBRATOR, CERAMIC (16.9344MHz)
************************************************************
* A-3313-586-A RF BOARD, COMPLETE
*******************
Ref. No. Part No. Description Remark
C34 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C35 1-104-700-11 CERAMIC CHIP 0.027uF 10% 16V C36 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C37 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C38 1-104-913-11 TANTAL. CHIP 10uF 20% 16V C39 1-163-038-00 CERAMIC CHIP 0.1uF 25V C40 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C41 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C42 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C43 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C51 1-163-019-00 CERAMIC CHIP 0.0068uF 10% 50V C52 1-163-038-00 CERAMIC CHIP 0.1uF 25V C53 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C54 1-163-038-00 CERAMIC CHIP 0.1uF 25V C55 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C56 1-163-038-00 CERAMIC CHIP 0.1uF 25V C57 1-163-038-00 CERAMIC CHIP 0.1uF 25V C58 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C59 1-163-038-00 CERAMIC CHIP 0.1uF 25V C60 1-104-914-11 TANTAL. CHIP 22uF 20% 16V
< CONNECTOR >
CNJ11 1-778-776-21 CONNECTOR, FPC 17P CNJ12 1-778-777-21 CONNECTOR, FPC 26P CNP11 1-580-055-21 PIN, CONNECTOR 2P CNP51 1-580-055-21 PIN, CONNECTOR 2P CNP52 1-580-055-21 PIN, CONNECTOR 2P
CNP53 1-580-055-21 PIN, CONNECTOR 2P
< IC >
IC11 8-752-082-14 IC CXA1992BR IC51 8-759-071-79 IC BA6297AFP IC52 8-759-040-83 IC BA6287F
< CAPACITOR >
C10 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C12 1-113-500-11 TANTAL. CHIP 100uF 20% 10V C13 1-163-038-00 CERAMIC CHIP 0.1uF 25V C14 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V C15 1-162-957-11 CERAMIC CHIP 220PF 5% 50V
C16 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C17 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C18 1-111-253-11 TANTAL. CHIP 100uF 20% 6.3V C19 1-163-038-00 CERAMIC CHIP 0.1uF 25V C21 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C22 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C23 1-113-682-11 TANTAL. CHIP 33uF 20% 10V C24 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C25 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C26 1-164-232-11 CERAMIC CHIP 0.01uF 50V
C27 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V C28 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V C29 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V C30 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C31 1-113-987-11 TANTAL. CHIP 4.7uF 20% 25V
C32 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V C33 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
< TRANSISTOR >
Q11 8-729-141-48 TRANSISTOR 2SB624-BV345
< RESISTOR >
R11 1-216-844-11 METAL CHIP 82K 5% 1/16W R12 1-216-839-11 METAL CHIP 33K 5% 1/16W R13 1-216-839-11 METAL CHIP 33K 5% 1/16W R14 1-216-844-11 METAL CHIP 82K 5% 1/16W R16 1-216-857-11 METAL CHIP 1M 5% 1/16W
R17 1-216-837-11 METAL CHIP 22K 5% 1/16W R18 1-216-841-11 METAL CHIP 47K 5% 1/16W R22 1-216-857-11 METAL CHIP 1M 5% 1/16W R25 1-216-851-11 METAL CHIP 330K 5% 1/16W R26 1-216-845-11 METAL CHIP 100K 5% 1/16W
R27 1-216-295-00 SHORT 0 R28 1-216-295-00 SHORT 0 R30 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R31 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R32 1-216-837-11 METAL CHIP 22K 5% 1/16W
R33 1-216-158-00 RES, CHIP 22 5% 1/8W R34 1-216-855-11 METAL CHIP 680K 5% 1/16W R35 1-216-835-11 METAL CHIP 15K 5% 1/16W R36 1-216-836-11 METAL CHIP 18K 5% 1/16W
– 54 –
Page 43
RF SW
Ref. No. Part No. Description Remark
R37 1-216-851-11 METAL CHIP 330K 5% 1/16W
R38 1-216-837-11 METAL CHIP 22K 5% 1/16W R39 1-216-847-11 METAL CHIP 150K 5% 1/16W R40 1-218-273-11 RES, CHIP 510K 5% 1/16W R41 1-218-296-11 RES, CHIP 75K 5% 1/16W R42 1-202-930-11 RES, CHIP 750K 5% 1/16W
R43 1-216-849-11 METAL CHIP 220K 5% 1/16W R44 1-216-846-11 METAL CHIP 120K 5% 1/16W R45 1-216-837-11 METAL CHIP 22K 5% 1/16W R46 1-216-847-11 METAL CHIP 150K 5% 1/16W R47 1-216-834-11 METAL CHIP 12K 5% 1/16W
R48 1-216-845-11 METAL CHIP 100K 5% 1/16W R49 1-216-093-00 METAL CHIP 68K 5% 1/10W R50 1-216-841-11 METAL CHIP 47K 5% 1/16W R51 1-216-073-00 METAL CHIP 10K 5% 1/10W R52 1-216-093-00 METAL CHIP 68K 5% 1/10W
R53 1-216-073-00 METAL CHIP 10K 5% 1/10W R54 1-216-073-00 METAL CHIP 10K 5% 1/10W R55 1-216-073-00 METAL CHIP 10K 5% 1/10W R56 1-216-093-00 METAL CHIP 68K 5% 1/10W R57 1-216-081-00 METAL CHIP 22K 5% 1/10W
R58 1-216-093-00 METAL CHIP 68K 5% 1/10W R59 1-216-073-00 METAL CHIP 10K 5% 1/10W R60 1-216-073-00 METAL CHIP 10K 5% 1/10W R61 1-216-073-00 METAL CHIP 10K 5% 1/10W R62 1-216-085-00 METAL CHIP 33K 5% 1/10W
R63 1-216-073-00 METAL CHIP 10K 5% 1/10W R64 1-216-073-00 METAL CHIP 10K 5% 1/10W R65 1-216-073-00 METAL CHIP 10K 5% 1/10W
Ref. No. Part No. Description Remark
**************
HARDWARE LIST
**************
#1 7-627-852-07 SCREW, PRECISION +P 1.7X2.5 #2 7-685-792-09 SCREW +PTT 2.6X6 (S) #3 7-685-851-04 SCREW +BVTT 2X4 (S) #4 7-627-553-27 SCREW, PRECISION +P 2X2.5 #5 7-627-554-07 SCREW, PRECISION +P 2X2.2
#6 7-621-772-05 SCREW +B 2X3 #7 7-628-253-00 SCREW +PS 2X4 #8 7-624-102-04 STOP RING 1.5, TYPE-E #9 7-627-850-28 SCREW, PRECISION +P 1.4X3 #10 7-627-553-18 SCREW, PRECISION +P 2X2
#11 7-627-000-00 SCREW, PRECISION +P1.7X2.2 TYPE3 #12 7-624-104-04 STOP RING 2.0, TYPE -E #14 7-621-255-45 SCREW +P 2X6
************************************************************
ACCESSORIES & PACKING MATERIALS
********************************
3-861-163-11 MANUAL, INSTRUCTION (ENGLISH, FRENCH,
SPANISH, CHINESE) (US, Canadian, E)
3-861-163-21 MANUAL, INSTRUCTION (ENGLISH, SPANISH,
SWEDISH, PORTUGUESE) (AEP, UK)
3-861-163-31 MANUAL, INSTRUCTION (FRENCH, GERMAN,
DUTCH, ITALIAN) (AEP, UK, German)
X-3373-241-1 MAGAZINE ASSY
************************************************************
PARTS FOR INSTALLATION AND CONNECTIONS
**************************************
< VARIABLE RESISTOR >
RV14 1-238-091-11 RES, ADJ, CERMET 22K
< SWITCH >
SW11 1-762-946-11 SWITCH, PUSH (1 KEY)
(CHUCKING END DETECT)
SW12 1-762-946-11 SWITCH, PUSH (1 KEY) (SAVE END DETECT)
************************************************************
* 1-664-104-11 SW BOARD
*********
< SWITCH >
SW1 1-572-688-11 SWITCH, PUSH (1 KEY) (LIMIT)
************************************************************
MISCELLANEOUS
**************
3 1-664-628-11 JACK FLEXIBLE BOARD 16 1-664-627-11 MAIN FLEXIBLE BOARD
! 209 8-820-010-05 OPTICAL PICK-UP KSS-521A/J2RP
210 1-664-626-11 OP FLEXIBLE BOARD M101 A-3291-956-A MOTOR SUB ASSY, SPINDLE
M102 A-3291-955-A MOTOR SUB ASSY, SLED M103 A-3291-953-A MOTOR ASSY, EL (CHUCKING) M104 A-3301-123-A ELJ MOTER ASSY (ELEVATOR)
************************************************************
501 3-011-778-01 BRACKET (705)
* 502 X-3369-824-1 SCREW ASSY
503 1-590-874-11 CORD, CONNECTION (RCA PIN CORD 5.5m) 504 1-590-519-21 CORD (WITH CONNECTOR) (BUS CABLE 5.5m)
501
502
503 504
– 55 –
The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part num­ber specified.
Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le neméro spécifié.
Page 44
CDX-715
Sony Corporation
Personal & Mobile Communication Company9-925-691-11
– 56 –
Published by Quality Assurance Dept.
Printed in Japan © 1998. 1
98A0575-1
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