SystemCompact disc digital audio system
Laser diode propertiesMaterial: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block.
Frequency response10 – 20,000 Hz
Wow and flutterBelow the measurable limit
Signal-to-noise ratio94 dB
OutputsBUS control output (8 pins)
Analog audio output (RCA pin)
US Model
Canadian Model
AEP Model
UK Model
E Model
Model Name Using Similar MechanismNEW
CD Drive Mechanism TypeMG-250B-137
Optical Pick-up NameKSS-521A/J2N
Currnet drain800 mA (during CD playback)
800 mA (during loading or ejecting a disc)
Operating temperature–10˚C to +55˚C (14˚F to 131˚F)
DimensionsApprox. 262 × 90 × 181.5 mm
(10 3/8× 3 5/8× 7 1/4 in.)
(w/h/d)
not incl. projecting parts and controls
MassApprox. 2.1 kg (4 lb. 10 oz.)
Power requirement12 V DC car battery (negative ground)
Supplied accessoriesDisc magazine (1)
Parts for installation and connections (1 set)
Design and specifications subject to change without notice.
9.ELECTRICAL PARTS LIST ............................... 52
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body .
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
– 2 –
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE !
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Page 3
DISC MAGAZINE GETTING OUT PROCEDURE ON
Lever (stop) ass’y
Magazine ass’y
THE POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) ass’y to arrow direction.
2) Removal the magazine ass’y.
Note: Take out the magazine only when the tray is completely within the
magazine. If the disc or tray is sticking out, turn on the power and
eject the magazine.
– 3 –– 4 –
Page 4
This section is extracted from
instruction manual.
SECTION 2
GENERAL
– 5 –– 6 –
Page 5
– 7 –
Page 6
SECTION 3
)
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER), FRONT PANEL ASS’Y
1
screw
(PTT2.6 × 6)
3
lever (FL)
1
screw
(PTT2.6 × 6)
1
screw
(PTT2.6 × 6)
2
case (upper)
3
1
screw
(PTT2.6 × 6)
lever (FL)
4
front panel ass’y
MECHANISM DECK (MG-250B-137)
2
spring (FL)
1
two dampers (250)
1
screw
(PTT2.6 × 6)
4
mechanism deck (MG-250B-137
2
spring (FL)
3
jack flexible board
(CN901)
– 8 –
1
two dampers (250)
Page 7
JACK BOARD
Remove the JACK board of
the arrow.
1
ground point screw
(+PTT2.6 × 6)
2
JACK board
MAIN BOARD
5
screw
(P1.4
×
3.0)
1
main flexible board
(CNJ12)
6
three screws
7
MAIN board
2
connector
(CNP301)
3
screw
(BVTT2
×
4)
5
screw
(P1.7
×
2.5)
– 9 –
4
heat sink
Page 8
ELEVATOR MOTOR ASS’Y (M104)
1
screw
(P2 × 2.2)
2
bracket (ELV motor)
3
elevator motor ass’y
ESCUTCHEON
2
Remove the claw
of the arrow
4
Remove the ditch
of the arrow
5
Remove the escutcheon
of the arrow
A
B
C
3
two claws
.
A
.
.
B
4
C
ditch
1
screw
(M2
– 10 –
×
3)
Page 9
CASE (UPPER) ASS’Y
4
three screws
(B2 × 3)
7
Remove the case
(upper) ass’y of
the arrow B.
4
screw
(B2 × 3)
3
spring (stopper. upper)
4
two screws
(B2 × 3)
6
Remove the edge
of the arrow A.
2
bracket (stopper upper)
1
screw
(P2 × 2.2)
5
A
B
r
CHASSIS ASS’Y
5
chassis ass’y
4
4
3
polyethylene washe
1
stop ring 2.0
(E type)
2
washer
– 11 –
6
spring (stopper. lower)
Page 10
RF BOARD
)
5
connector
(CNP52)
2
two screws
(PS2
1
×
4)
OP flexible board
(CNJ11)
3
two screws
(PS2
×
4)
4
RF board
SLED MOTOR ASS’Y (M102), OPTICAL PICK-UP (KSS-512A/J2N)
1
4
Turn at the direction of the
arrow, then remove
shaft (sled) ass’y
two screws
(P2 × 3)
2
sled motor ass’y
(M102)
5
two connectors
(CNP11, 503)
3
optical pick-up
(KSS-521A/J2N
– 12 –
Page 11
SW BOARD, SPINDLE MOTOR ASS’Y (M101)
8
two screws
(P1.7
×
2.2)
1
screw
×
2.2)
(P2
2
SW board
7
3
spring (chucking)
6
retainer (disc)
4
screw
×
(P2
5
bracket (CP)
9
Remove the spindle motor ass’y (M101)
of the arrow.
2.2)
CHUCKING MOTOR ASS’Y (M103)
3
bracket
(load motor)
2
two screws (P2 × 2.5)
1
connector
(CNP51)
4
chucking motor ass’y
(M103)
– 13 –
Page 12
SECTION 4
MECHANISMDECK ASSEMBLY
Note: Follow the assembly procedure in the numerical order given.
OPTICAL PICK-UP COMPLETE ASS’Y
1
Move the lever (LOCK 3) in direction A, and return it a little in
direction
to the lower limit.
chuck plate
B
from the position where the chuck plate is moved down
B
shaft (A)
A
3
4
stop ring 2.0 (E type)
5
tension spring (DH)
2
polyethylene washer
optical pick-up complete ass’y
Note: Insert the shaft (A) first.
GEAR (LOMINI) / (LOAD 1) ASS’Y
gear (LOAD 2)
gear (LOMINI)
marking
Fig. A.
3
Attach the gear (LOAD 1) ass’y
with its facing inside.
chuck plate
slit
2
Attach the gear (LOMINI) at the position
shown in Fig. A.
shaft (rotary prevention C)
1
B
4
stop ring 1.5 (E type)
Move the lever (LOCK 3)
fully in direction B to
move the chuck plate up.
– 14 –
Page 13
OPERATION CHECK
1
Confirm that the slider moves in direction C to move down the
chuck plate if the gear (LOAD 1) is rotated in direction A or the
chuck plate moves up and the slider mo ves in direction D if the
gear is rotated in direction B.
chuck plate
slider
D
C
A
gear (LOAD 1) ass’y
B
– 15 –
Page 14
SLIDER (L)
1
Move the lever (STOP) ass’y in direction
until it gets stopped.
3
washer
A
2
slider (L)
SLIDER (R)
3
washer
4
polyethyelene slider
1
slider (R)
5
polyethyelene washer
case (lower) ass’y
2
Engage the slots of slider (R)
with the shafts.
slider (R)
– 16 –
Page 15
ADJUSTING PHASE OF SLIDERS (L, R)
y
1
Sliding the sliders (L, R) in the arrow direction, meet holes
and b of the sliders (L, R) with holes c and d of the case
(LOWER) ass’y
a
a
b
slider (R)
d
GEAR (ELV2) / (ELV3)
3
5
tension spring
(STOP LEVER)
c
4
retaining ring
gear (ELV 2)
slider (L)
case (LOWER) ass’
2
retaining ring
1
gear (ELV 3)
Note:After mounting the gear, confirm
that the holes for phase adjustment
are not shifted.
– 17 –
Page 16
MECHANICAL ADJUSTMENTS
5
• Elevator Height (Address) Adjustment
SECTION 5
Note: This adjustments is necessary when the system controller (IC201),
variable resistor (RV201), slider (R), slider (L), or chassis (ELV)
was replaced for any repair.
Connection:
power supply
master unit
+
GND
BUS cable
CDX-715
Adjustment Method:
1. Connect this set to the master unit (e.g. MDX-C670/
C670RDS), load a disc magazine, and place the set vertically
as shown below.
2. Connect the regulated power supply to the master unit, and
turn the power on.
3. Press the DISC button on the master unit and select DISC 5.
4. At this time, if the elevator shaft does not position between
comb teeth A and B at addresses 5 and 6 as shown below,
adjust the following.
5. Press repeatedly the DISC + and – buttons on the master unit
so that the elevator shafts moves from address 6 to address 5,
or from 5 to 6. At this time, adjust RV201 on the main board
so that the elevator shaft positions smoothly between comb
teeth A and B.
6. Further, place the set horizontally and make same adjustment
as mentioned above.
7. After adjustment at addresses 5 to 6 is finished, check all op-
erations from addresses 1 to 10 with the set placed vertically
and horizontally respectively to confirm that the ele v ator shaft
positions in a range between comb teeth A to B.
comb tooth at address 5
comb tooth at address 6
A
B
comb tooth at address 6
elevator shaft
A
B
OKNG
elevator shaft
comb tooth at address
RV201
– 18 –
Page 17
SECTION 6
MIN side
(low gain)
MAX side
(high gain)
RV14 standard position
ELECTRICAL ADJUSTMENTS
Note:
1. Perform adjustments as given.
2. Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, but
only when indicated.
3. Power supply voltage: DC14.4 V (more than 3A).
• FOCUS BIAS CHECK
[RF BOARD] – Conductor Side –
oscilloscope
CNJ12
TP (RF)
IC51
TP
(VC)
IC11
+
–
Procedure:
1. Connect the oscilloscope to RF board test point RF.
2. Put the set into play mode by loading the disc.
3. Confirm that oscilloscope waveform is clear and check RF signal level is correct or not.
Note:
Clear RF signal waveform means that the shape “≈” can be clearly distinguished at the center of the waveform.
RF signal waveform
VOLT/DIV: 200 mV
TIME/DIV: 500 nsec
• TRACKING OFFSET CHECK
[RF BOARD] – Conductor Side –
oscilloscope
CNJ12
+
–
BP11
IC51
(TE)
TP
(VC)
IC11
Procedure:
1. Connect the oscilloscope to RF board bridge point TE.
2. Put the set into play mode by loading the disc.
3. Press the = AMS + button, then, c heck the traverse wa veform.
4. Confirm that the oscilloscope waveform is symmetrical on the
top and bottom in relation to 0 V dc, and check this level.
* Traverse waveform: This is the tracking error wave form
appears when crossing the track.
VOLT/DIV : 500 mV
TIME/DIV : 2 msec
Center : 0 V
A
0 V
B
• FOCUS GAIN ADJUSTMENT
(COARSE ADJUSTMENT)
This adjustment is to be performed when replacing the following
parts.
• Optical Pick-up Block
• RV14
[RF BOARD] – Conductor Side –
CNJ12
IC51
RV14
IC11
Procedure:
1. Set RV14 (RF board) to the standard position.
2. Check that there is not an abnormal amount of operation noise
(white noise) from the 2-axis devise. If there is, turn RV14
slightly clockwise.
[RF BOARD] – Conductor Side –
• When gain is lowered...
The set does not play because of no focus operation.
• When gain is highered...
Operation noise is heard due to a scratch or a dust, then operation will be unstable.
level: 1.4 ± 0.3 Vp-p
A=B
traverse waveform
(100 track jump waveform)
– 19 –– 20 –
Page 18
CDX-715
7-1. BLOCK DIAGRAM – SERVO Section –
SECTION 7
DIAGRAMS
DETECTOR
ABD
C
F
E
OPTICAL PICK-UP
(KSS-521A)
LASER DIODE
PD
I-V AMP
LD
PD1 I-V AMP
PD1
38
PD2 I-V AMP
PD2
39
AUTOMATIC
POWER CONTROL
Q11
F
41
E
42
LD
36
RF
+
SUMMING
AMP
RF AMP,
FOCUS/TRACKING
SERVO
IC11 (1/2)
I-V
AMP
LD
AMPPDAMP
FOCUS
ERROR
AMP
TRACKING
ERROR
AMP
PD
37
RFO
33
RFI
32
FOCUS OK
COMPARATOR
MIRR
AMP
DEFECT
AMP
FEO
FE BIAS
TEO
DIGITAL SIGNAL PROCESSOR,
CLV SERVO
IC101
RF
ASYI
ASYO
FOK
DATO
CLKO
XLTO
SEIN
CNIN
IC201 (1/2)
ASYMMETRY
CORRECTION
CD.DATA
SERVO AUTO SEQUENCER
DIGITAL CLV
MON
26
52
SUBQ
51
SCLK
23
SENS
67
65
CD.CLK
66
CD.XLT
63
SCOR
24
GFS
44
46
47
FOK
DATA
CLK
XLT
LOCK
XRST
SENS1
C.OUT
SENS2
FEO
TAO
27
22
20
21
19
23
25
24
26
6
13
FOCUS OK
AMP
TTL
IIL
1
RV14
FOCUS
40
GAIN
45
FEI
2
TEI
47
TTL
IIL
IIL
IIL DATA REGISTER
TTL
FOCUS PHASE
COMPENSATION
TRACKING PHASE
COMPENSATION
23
15
17
16
13
14
SYSTEM CONTROLLER
C.OUT
54
FOK
22
SENS2
8
FILTER
39
42
FILO
CLTV
DIGITAL PLL
XROF
MDS29LOCK64SQSO
MDP
28
27
PCO
4038
FILI
SQCK
8 7
EFM
DEMODULATOR
SUB-CODE
PROCESSOR
CPU INTERFACE
SENS
XLAT
CLOCK
DATA
91012
117576
SCOR
SBSO
EXCK
77
INTERNAL BUS
GFS
XRST
100
89
61
D/A
16K
RAM
ERROR
CORRECTOR
CLOCK
GENERATOR
XTAI
EDGE DETECT
PCMD
BCKO
LRCK
C2PO
INTERFACE
RFCK
WDCK
GTOP
WFCK
EMPH
IC403 (1/2)
C4M
52
54
50
63
62
49
IC403 (2/2)
2
1
58
74
72
70
DATI
11
9
BCKI
LRCI
12
7
RFCK
7
WDCI
13
8
GTOP
3
WFCK
5
C4M
6
XROI
D-RAM
CONTROLLER
IC401
47
SDTI
48
SCK
61
SCOR
DATA
BCK
LRCK
XTAI
18
17
19
16
C4M
A
(Page 23)
B
(Page 23)
21
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
2-AXIS
DEVICE
(FOCUS)
(TRACKING)
05
M102
M
(SLED)
M101
(SPINDLE)
M
OUT+
2
OUT–
1
OUT+
12
OUT–
13
OUT+
26
OUT–
27
OUT+
17
OUT–
16
IC51
TRACKING
COIL DRIVE
FOCUS
COIL DRIVE
SLED
MOTOR DRIVE
SPINDLE
MOTOR DRIVE
IN
4
IN
10
SLED SERVO
IC11 (2/2)
IN
24
IN
19
SLO
1614
SLED
AMP
(CHUCKING)
M103
SLP
M
CHUCKING MOTOR DRIVE
IC52
OUT1
1
7
OUT2
CHUCKING
MOTOR DRIVE
RIN
FIN
4
5
CH.F
4
CH.R
5
XRST
GRSRT
GRSCOR
XQOK
SDTI
XSOE
ESPXLT
XRDE
XWRE
LOAD1
LOAD2
LIM.SW 9
25
46
26
27
28
29
41
42
SW12
(SAVE END DETECT)
7
SW11
(CHUCKING END DETECT)
6
SW1
(LIMIT)
GRSRT
1
60
XRDE
SDTO
GSCR
59
XLT
XQOK
XSOE
50
494645
ON : When completion of the disc
chucking operation.
ON : When completion of the disc
chucking operation.
ON : When the optical pick-up
is inner position.
44
XWRE
A0 – A9
25 – 22, 40 – 36, 27
9 – 12, 14 – 18, 5
A0 – A9
D1 – D4
31, 30, 33, 32
1, 2, 24, 25
D1 – D4
D-RAM
IC402
XRAS
XCAS
342835
23422
XCAS
XRAS
XOE
XWE
29
3
XOE
XWE
• SIGNAL PATH
XRST
: CD PLAY
C
(Page 23)
– 21 –– 22 –
Page 19
CDX-715
– MAIN Section –
A
(Page 22)
XRST
C
(Page 22)
C4M
B
(Page 22)
DIGITAL FILTER,
XO
HS
21
LINEAR POSITION
D/A CONVERTER,
LOW-PASS FILTER
IC601
DIGITAL FILTER
CIRCUIT
MICRO COMPUTER
INTERFACE
CIRCUIT
EMP
19
RV201
SENSOR
LOW-PASS
FILTER
CIRCUIT
LOW-PASS
FILTER
CIRCUIT
LO
9
RO
5
MUTING
CONTROL SWITCH
Q601, 602
MUTING
Q610
MUTING
Q620
CN901 (1/2)
AUDIO OUT L
AUDIO OUT R
• SIGNAL PATH
: CD PLAY
COMPRESSOR
IC102
DATAI
3
BCKI
2
LRCKI
1
RST
6
INPUT
INTERFACE
CIRCUIT
SEQUENTIAL
CONTROL
DIGITAL
SIGNAL
PROCESSOR
MODE
CONTROL
MODE2
MODE1
14
15
16
MODE3
OUTPUT
INTERFACE
CIRCUIT
SYSTEM
CLOCK
75
74
SYSTEM CONTROLLER
MODE2
MODE1
DATAO
BCKO
LRCKO
CLK
IC201 (2/2)
9
10
11
4
ML
EMP
A.MUTE
MCK
DATA
22
BCK
LRCK
MCK
45
44
43
38
INTERFACE
CIRCUIT
TIMING
GENERATOR
OSC
XI
15
16
X601
16.9344MHz
23
24
13
M104
(ELEVATOR)
EHS
AVREF
ELV.ON
CD.ON
BU.CHK
SCK
BUS.ON
RST
W.UP
39
37
69
68
61
SI
49
SO
50
48
55
30
D306
62
SW201
MAGAZINE EJECT
END DETECT
SW202
MAGAZINE IN/OUT
DETECT
ELEVATOR MOTOR DRIVE
IC301
EEPROM
IC202
FIN
RIN
SDA
SCL
4
5
5
6
OUT1
1
M
7
OUT2
ELEVATOR
MOTOR DRIVE
57
60
70
58
12
11
MGLK
MAG.SW
ELV.R
ELV.F
EE.DATA
EE.CLK
RV202
ELEVATOR HEIGHT
SENSOR
REFERENCE VOLTAGE
SWITCH
Q201
MICON +5V
BUS INTERFACE
(FOR SONY BUS)
IC302
SO
10
SI
9
SCK
11
BUSON OUT
1
BUSON OUT
13
RESET
8
RESET SIGNAL
GENERATOR
IC304
RESET
SWITCH
DATA
CLK
LOF
BUSON IN
RST
MICON +5V
+9V
MICON +5V
DAC +5V,
SERVO +5V
6
4
12
2
7
D311
+5V
REGULATOR
IC305
BATTERY
CHECK
Q301, 302
+9V
REGULATOR
IC303
REGULATOR
Q303
B+ SWITCH
Q304, 305
LEVEL SHIFT
D307
D309
D313
D308
BUS CONTROL CONNECTOR
(FOR SONY BUS)
7
5
4
6
2
CN901 (2/2)
B.UP
DATA
CLK
BUSON
RST
EJECT
05
XTAL
X201
8MHz
EXTAL
3132
64
SW301
6
MICON +5V
– 23 –– 24 –
Page 20
CDX-715
• Semiconductor
Location
Ref. No. Location
IC11C-6
IC51B-7
IC52G-4
Q11D-6
Note on Printed Wiring Boards:
• Y : parts extracted from the conductor side.
r
•
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
: Through hole.
7-2. PRINTED WIRING BOARDS – RF Section –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
Note:
The components identified by mark ! or dotted
line with mark ! are critical for safety.
Replace only with part
number specified.
• U : B+ Line.
• H : adjustment for repair.
• Power voltage is dc 14.4 V and fed with regulated dc power
supply from CD changer controller.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J: CD
4
W or less unless otherwise
Note:
Les composants identifiés par
une marque ! sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
– 25 –– 26 –
Page 21
7-3. SCHEMATIC DIAGRAM – RF Section – • See page 25 for Note on Schematic Diagram. • See page 39 for Waveforms. • See page 41 and 42 for IC Block Diagrams.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
– 31 –– 32 –
Page 24
CDX-715
7-5. SCHEMATIC DIAGRAM – MAIN Section – MAIN Board (1/2)
• See page 39 and 40 for Waveforms. • See page 42 to 44 for IC Block Diagrams. • See page 45 and 46 for IC Pin Function Description. • See page 36 for Note on Schematic Diagram. • See page 29 to 32 for Printed Wiring Board.
– 33 –– 34 –
Page 25
– MAIN Section – MAIN Board (2/2)
• See page 40 for Waveforms. • See page 43 and 44 for IC Block Diagrams. • See page 29 to 32 for Printed Wiring Board.
CDX-715
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
¢
•
• U : B+ Line.
• H : adjustment for repair.
• Power voltage is dc 14.4 V and fed with regulated dc power
• Voltages and waveforms are dc with respect to ground
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
: internal component.
supply from CD changer controller.
under no-signal conditions.
no mark : PLAY
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
J: CD
: Impossible to measure
∗
4
W or less unless otherwise
– 35 –– 36 –
Page 26
CDX-715
7-6. PRINTED WIRING BOARD – JACK Section –7-7. SCHEMATIC DIAGRAM – JACK Section –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
• C : panel designation.
• U : B+ Line.
• Signal path.
J: CD
• Abbreviation
G: German model.
4
W or less unless otherwise
Note on Printed Wiring Board:
• X : parts extracted from the component side.
•p: parts mounted on the conductor side.
r
•
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Abbreviation
: Through hole.
G: German model.
– 37 –– 38 –
Page 27
• Wavef orms
6 Vp-p
472 ns
– RF Board –
1 IC11 1 (FEO)
500 mV/DIV, 500 nsec/DIV
2 IC11 2 (FEI)
50 mV/DIV, 1 µsec/DIV
1.4 ±0.3 Vp-p
– MAIN Board (1/2) –
1 IC101 @¶ MDP
3.8
2 IC101 $ª WDCK
2.5 Vp-p
µ
s
3 IC11 $¶ (TEI)
200 mV/DIV, 500 µsec/DIV
Approx. 110 mVp-p
Approx. 280 mVp-p
5 Vp-p
11.4 µs
3 IC101 %º LRCK
5 Vp-p
22.5 µs
4 IC101 %¢ BCKO
5 IC101 ^™ RFCK
5 Vp-p
136.5 µs
– 39 –
Page 28
6 IC101 &¢ WFCK
!¡ IC102 0 BCKO
137 µs
7 IC101 *ª XTAI
59 ns
8 IC201 #¡ EXTAL
5 Vp-p
4.5 Vp-p
3.3 Vp-p
5.3 Vp-p
472 ns
!™ IC102 !¡ LRCKO
5.3 Vp-p
22.6 µs
– MAIN Board (2/2) –
!£ IC601 !∞ XI
124.5 ns
9 IC401 !¶ BCK
472 ns
0 IC401 !ª LRCK
2.9 Vp-p
59 ns
5.9 Vp-p
5.8 Vp-p
22.8 µs
– 40 –
Page 29
• IC Block Diagrams
IC11 CXA1992BR (RF BOARD)
FE_BIAS
LPFI
ATSC
TDFCT
VEE
TEO
TZC
FZC
PD2
PD1
RF_O
PD
LD
RFTC
RF_M
RF_I
CP
CB
CC1
CC2
FOK
27282930313233343536373839
VEE
+
–
+
–
–
+
RF SUMMING
AMP
FOH
FOL
TGH
TGL
BALH
BALL
ATSC
TZC
FZC
+
–
–
+
–
+
–
–
+
VEE
MIRR
VCC
–
+
–
–
+
+
–
–
+
VEE
LEVEL S
VCC
–
+
FOK
LDON
LPCL
LPC
TGFL
IIL DATA REGISTER
INPUT SHIFT REGISTER
ADDRESS DECODER
SENS SELECTOR
OUTPUT DECODER
• MAIN BOARD IC201 CXP84332-088Q (SYSTEM CONTROLLER)
Pin No.Pin NameI/OFunction
1 to 3—ONot used (open)
4CH.FOMotor drive signal (load chucking direction) output to the chucking motor drive (IC52) *1
5CH.ROMotor drive signal (save direction) output to the chucking motor drive (IC52) *1
6LOAD2I
Chucking end detect switch (SW11) input
“L”: When completion of the disc chucking operation
7LOAD1I
8SENS2IInternal status signal (sense signal) input from the CXA1992AR (IC11)
9LIM.SWI
10EE.INITIInitialize signal input for the EEPROM (IC202) “H”: format Fixed at “L” in this set
11EE.CLKOSerial data transfer clock signal output to the EEPROM (IC202)
12EE.DATAI/OTwo-way data bus with the EEPROM (IC202)
13 to 19—ONot used (open)
20SINGLEI
21XRSTO
22FOKIFocus OK signal input from the CXA1992AR (IC11) “L”: NG, “H”: OK
23SENSIInternal status signal (sense signal) input from the CXD2530Q (IC101)
24GFSIGuard frame sync signal input from the CXD2530Q (IC101) “L”: NG, “H”: OK
25GRSRTOReset signal output to the CXD2522Q (IC401) “L”: reset
26XQOKOSubcode Q OK pulse signal output to the CXD2522Q (IC401) “L” active
27SDTIIESP status signal input from the CXD2522Q (IC401)
28XSOEOESP status read enable signal output to the CXD2522Q (IC401) “L” active
29ESPXLTOESP latch pulse signal output to the CXD2522Q (IC401) “L” active
Save end detect switch (SW12) input
“L”: When completion of the disc chucking operation
Sled limit in detect switch (SW1) input
“L”: When the optical pick-up is inner position
Setting terminal for the single disc/multiple discs mode
“L”: single mode, “H”: multiple discs mode (fixed at “H”)
System reset signal output to the CXA1992AR (IC11), CXD2530Q (IC101) and SM5852FS
(IC102) “L”: reset
System reset signal input from the SONY bus interface (IC302) and reset signal generator
30RSTI
31EXTALIMain system clock input terminal (8 MHz)
32XTALOMain system clock output terminal (8 MHz)
33VSS—Ground terminal
34TXOSub system clock output terminal Not used (open)
35TEXISub system clock input terminal Not used (fixed at “L”)
36AVSS—Ground terminal (for A/D converter)
37AVREFIReference voltage (+5V) input terminal (for A/D converter)
38MCKI
39EHSIElevator height position detect input from the RV202 (elevator height sensor) (A/D input)
40H.TEMPIHigh temperature sensor input terminal Not used (open)
41XRDEOD-RAM read enable signal output to the CXD2522Q (IC401) “L” active
42XWREOD-RAM write enable signal output to the CXD2522Q (IC401) “L” active
43A.MUTEOAudio line muting on/off control signal output terminal “H”: muting on
44EMPOEmphasis mode output to the D/A converter (IC601) “H”: emphasis on
45MLOFast speed dubbing control signal output to the D/A converter (IC601) “L”: fast speed
46GRSCORISubcode sync (S0+S1) detection signal input from the CXD2522Q (IC401)
47D/A.RESETOReset signal output terminal “L”: reset Not used (open)
(IC304) “L”: reset
For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”
Input of signal for the fine adjustment (linear position sensor adjustment; RV201) of elevator
position (A/D input)
– 45 –
Page 34
Pin No.Pin NameI/OFunction
48SCKISerial data transfer clock signal input from the SONY bus interface (IC302)
49SIISerial data input from the SONY bus interface (IC302)
50SOOSerial data output to the SONY bus interface (IC302)
51SCLKOSubcode Q data reading clock signal output to the CXD2530Q (IC101)
52SUBQISubcode Q data input from the CXD2530Q (IC101)
53—ONot used (open)
54C.OUTITrack number count signal input from the CXA1992AR (IC11)
55BUS.ONIBus on/off control signal input from the SONY bus interface (IC302) “H”: bus on
56A/D.SWOAnalog/digital out selection signal output terminal “L”: digital out Not used (open)
57MGLKIMagazine eject operation completion detect switch (SW201) input “L”: eject completed
58ELV.FOMotor drive signal (elevator up direction) output to the elevator motor drive (IC301) *2
59—ONot used (open)
60MAG.SWIMagazine in/out detect switch (SW202) input “L”: magazine detected
61BU.CHKI
62W.UPIBus on or eject switch (SW301) input terminal “H”: bus on or eject switch pushing
63SCORISubcode sync (S0+S1) detection signal input from the CXD2530Q (IC101)
64EJECTIEject switch (SW301) input terminal “H” active
65CD.CLKOSerial data transfer clock signal output to the CXD2530Q (IC101) and CXD2522Q (IC401)
66CD.XLTOSerial data latch pulse signal output to the CXD2530Q (IC101)
67CD.DATAOSerial data output to the CXD2530Q (IC101) and CXD2522Q (IC401)
68CD.ONOD/A converter and servo section power supply on/off control signal output “H”: power on
69ELV.ONOMechanism deck section power supply on/off control signal output “H”: power on
70ELV.ROMotor drive signal (elevator down direction) output to the elevator motor drive (IC301) *2
71—ONot used (open)
72VDD—Power supply terminal (+5V)
73NC (VDD)—Connected to the power supply (+5V)
74MODE1OD-BASS control signal output to the SM5852FS (IC102) “L” active
75MODE2OD-BASS control signal output to the SM5852FS (IC102) “L” active
76REQOData request signal output terminal Not used (open)
77CCCLKOCommand clock signal output terminal Not used (open)
78CSIOCommand data input terminal Not used (open)
79CSOOCommand data output terminal Not used (open)
80ADJOAuto adjust selection terminal Not used (open)
Battery detection signal input terminal “H”: battery on
R1011-216-105-00 RES, CHIP220K5%1/10W
R1021-216-121-00 RES, CHIP1M5%1/10W
R1031-216-113-00 METAL CHIP470K5%1/10W
R1041-216-061-00 METAL CHIP3.3K5%1/10W
R1051-216-061-00 METAL CHIP3.3K5%1/10W
R1061-216-073-00 METAL CHIP10K5%1/10W
R1071-216-121-00 RES, CHIP1M5%1/10W
R1081-216-073-00 METAL CHIP10K5%1/10W
R1091-216-097-00 RES, CHIP100K5%1/10W
R1101-216-073-00 METAL CHIP10K5%1/10W
R1111-216-049-11 RES, CHIP1K5%1/10W
R1131-216-049-11 RES, CHIP1K5%1/10W
R1141-216-821-11 METAL CHIP1K5%1/16W
R1151-216-813-11 METAL CHIP2205%1/16W
R1161-216-813-11 METAL CHIP2205%1/16W
IC1018-752-384-15 IC CXD2530Q
IC1028-759-473-70 IC SM5852FS-E2
IC2018-752-894-40 IC CXP84332-088Q
IC2028-759-253-82 IC AT24C16N-10SI-TR
IC3018-759-040-83 IC BA6287F
IC3028-759-444-86 IC BA8272F-E2
IC3038-759-054-12 IC PQ09RA1
IC3048-759-443-41 IC RH5VL40AA-T1C
IC3058-759-324-40 IC KIA7805PI
IC4018-752-374-09 IC CXD2522Q
IC4028-759-427-15 IC MB814400C-70PFTN
R1171-216-813-11 METAL CHIP2205%1/16W
R2021-216-089-00 RES, CHIP47K5%1/10W
R2031-216-089-00 RES, CHIP47K5%1/10W
R2041-216-089-00 RES, CHIP47K5%1/10W
R2051-216-081-00 METAL CHIP22K5%1/10W
R3041-216-089-00 RES, CHIP47K5%1/10W
R3051-216-057-00 METAL CHIP2.2K5%1/10W
R3061-216-077-00 METAL CHIP15K5%1/10W
R3071-216-049-11 RES, CHIP1K5%1/10W
R3081-216-073-00 METAL CHIP10K5%1/10W
R3121-216-073-00 METAL CHIP10K5%1/10W
R3131-216-295-00 SHORT0
R3141-216-295-00 SHORT0
R3151-216-295-00 SHORT0
R3161-216-073-00 METAL CHIP10K5%1/10W
R3181-216-813-11 METAL CHIP2205%1/16W
R4021-216-105-00 RES, CHIP220K5%1/10W
R4031-216-033-00 METAL CHIP2205%1/10W
R6011-216-029-00 METAL CHIP1505%1/10W
R6021-216-033-00 METAL CHIP2205%1/10W
R6101-216-033-00 METAL CHIP2205%1/10W
R6111-216-097-00 RES, CHIP100K5%1/10W
R6201-216-033-00 METAL CHIP2205%1/10W
R111-216-844-11 METAL CHIP82K5%1/16W
R121-216-839-11 METAL CHIP33K5%1/16W
R131-216-839-11 METAL CHIP33K5%1/16W
R141-216-844-11 METAL CHIP82K5%1/16W
R161-216-857-11 METAL CHIP1M5%1/16W
R171-216-837-11 METAL CHIP22K5%1/16W
R181-216-841-11 METAL CHIP47K5%1/16W
R221-216-857-11 METAL CHIP1M5%1/16W
R251-216-851-11 METAL CHIP330K5%1/16W
R261-216-845-11 METAL CHIP100K5%1/16W
R271-216-295-00 SHORT0
R281-216-295-00 SHORT0
R301-216-829-11 METAL CHIP4.7K5%1/16W
R311-216-829-11 METAL CHIP4.7K5%1/16W
R321-216-837-11 METAL CHIP22K5%1/16W
R331-216-158-00 RES, CHIP225%1/8W
R341-216-855-11 METAL CHIP680K5%1/16W
R351-216-835-11 METAL CHIP15K5%1/16W
R361-216-836-11 METAL CHIP18K5%1/16W
– 54 –
Page 43
RF SW
Ref. No.Part No.DescriptionRemark
R371-216-851-11 METAL CHIP330K5%1/16W
R381-216-837-11 METAL CHIP22K5%1/16W
R391-216-847-11 METAL CHIP150K5%1/16W
R401-218-273-11 RES, CHIP510K5%1/16W
R411-218-296-11 RES, CHIP75K5%1/16W
R421-202-930-11 RES, CHIP750K5%1/16W
R431-216-849-11 METAL CHIP220K5%1/16W
R441-216-846-11 METAL CHIP120K5%1/16W
R451-216-837-11 METAL CHIP22K5%1/16W
R461-216-847-11 METAL CHIP150K5%1/16W
R471-216-834-11 METAL CHIP12K5%1/16W
R481-216-845-11 METAL CHIP100K5%1/16W
R491-216-093-00 METAL CHIP68K5%1/10W
R501-216-841-11 METAL CHIP47K5%1/16W
R511-216-073-00 METAL CHIP10K5%1/10W
R521-216-093-00 METAL CHIP68K5%1/10W
R531-216-073-00 METAL CHIP10K5%1/10W
R541-216-073-00 METAL CHIP10K5%1/10W
R551-216-073-00 METAL CHIP10K5%1/10W
R561-216-093-00 METAL CHIP68K5%1/10W
R571-216-081-00 METAL CHIP22K5%1/10W
R581-216-093-00 METAL CHIP68K5%1/10W
R591-216-073-00 METAL CHIP10K5%1/10W
R601-216-073-00 METAL CHIP10K5%1/10W
R611-216-073-00 METAL CHIP10K5%1/10W
R621-216-085-00 METAL CHIP33K5%1/10W
R631-216-073-00 METAL CHIP10K5%1/10W
R641-216-073-00 METAL CHIP10K5%1/10W
R651-216-073-00 METAL CHIP10K5%1/10W