Sony CDX-60X Service manual
CDX-60X
SERVICE MANUAL
Ver 1.1 2000. 08
SPECIFICATIONS
US Model
Model Name Using Similar Mechanism CDX-636
CD Drive Mechanism Type MG-251A-137
Optical Pick-up Name KSS-720A/K1NP
COMPACT DISC CHANGER
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 3
2. GENERAL ................................................................... 3
Installation....................................................................... 4
Connections ..................................................................... 4
3. DISASSEMBLY ......................................................... 5
4. MECHANISM DECK ASSEMBLY.................... 11
5. MECHANICAL ADJUSTMENT .......................... 13
6. ELECTRICAL CHECK .......................................... 14
7. DIAGRAMS
7-1. Block Diagram – RF SERVO/
DA CONVERTER Section – .......................................... 17
7-2. Block Diagram – BUS CONTROL/
POWER SUPPLY Section – ........................................... 18
7-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
7-4. Printed Wiring Boards – RF/LSW Boards – ................. 20
7-5. Schematic Diagram – RF/LSW Boards –...................... 21
7-6. Printed Wiring Boards
– MAIN Board (Component Side) – .............................. 22
7-7. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 23
7-8. Schematic Diagram – MAIN Board (1/2) – .................. 24
7-9. Schematic Diagram – MAIN Board (2/2) – .................. 25
7-10. Printed Wiring Boards – JACK/SWITCH Boards – ..... 26
7-11. Schematic Diagram – JACK/SWITCH Boards – .......... 26
7-12. IC Pin Function Description ........................................... 32
8. EXPLODED VIEWS ................................................ 35
9. ELECTRICAL PARTS LIST ............................... 40
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMA TIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
2
Ver 1.1 2000. 08
L
SECTION 1
SERVICING NOTES
SECTION 2
GENERAL
This section is extracted from
instruction manual.
NOTES ON HANDLING THE OPTICAL PICKUP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body .
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation exposure.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
DISC MAGAZINE GETTING OUT PROCEDURE
ON THE POWER SUPPLY IS OFF
Remove the COVER (LOWER T) beforehand
1) Press the lever (ML.S) assy in the direction of arrow A.
2) Removal the magazine assy.
Note: T ak e out the magazine only w hen the tray is completely within the
magazine. If the disk or tray is sticking out, turn on the power and
eject the magazine.
Lever (ML.S)
A
Magazine ass’y
OPTICA
PICK-UP
BLOCK
SEMI-FIXED
RESISTOR
33
44
SECTION 3
)
)
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER T), FRONT PANEL ASS’Y
1 screw
(PTT2.6 × 6)
3 screw
(PTT2.6 × 6)
4 lever (FLT)
3 screw (PTT2.6 × 6)
5 cover (upper T)
3 screw (PTT2.6 × 6
4 lever (FLT)
2 front panel ass’y
MECHANISM DECK (MG-251A-137)
2 tension coil spring (FL)
1 two dampers (250T)
filament tape
1 screw (PTT2.6 × 6)
4 mechanism deck (MG-251A-137)
2 tension coil spring (FL)
3 jack flexible board
(CNJ901)
1 two dampers (250T
5
JACK BOARD
Remove the jack board of
the arrow.
1 ground point screw
(PTT2.6 × 6)
2 jack board
MAIN BOARD, SLIDE VARIABLE RESISTOR (ELEVATOR HEIGHT SENSOR) (RV202)
1 main flexible board
(CNJ101)
5 screw (FP)
2 Remove three solders of
the slide variable resistor
(RV202).
5 two screws (FP)
6 main board
2 Remove two solders of
the elevator motor leads (M104).
2 Remove two solders of
the switch board leads.
7 screw
(PTT2 × 4)
8 slide variable resistor
(elevator height sensor)
(RV202)
4 heat sink (T)
3 screw (PTT2 × 4)
6
ELJ MOTOR ASS’Y (ELEVATOR) (M104)
2 bracket (EVM.S)
1 screw
(PTT2 × 4)
3 ELJ motor ass’y (elevator)
(M104)
ESCUTCHEON (T)
2 Remove the claw
in the direction of arrow A.
4 Remove the ditch
in the direction of arrow B.
5 Remove the escutcheon (T)
3 two claws
A
B
in the direction of arrow C.
3 claw
C
4 ditch
1 screw (T)
7
CHASSIS (U.S) SUB ASS’Y
1 three screws
(PTT2 × 4)
2
3 Remove the edge
in the direction
A
of arrow A.
4 Remove the chassis (U.S)
sub ass’y in the direction
of arrow B.
CHASSIS ASS’Y
1 screw
(PTT2 × 4)
B
5 spring (SUT)
1 two screws
(PTT2 × 4)
4 Remove the chassis ass’y
5 spring (stopper.lower)
1 Turn the gear (EVD.S) fully
in the direction of arrow A.
in the direction of arrow B.
B
3
2
A
3
8
RF BOARD
3 two screws
(PS2 × 4)
3 two screws
(PS2 × 4)
2 Remove four solders
of the LSW board leads
and spindle motor leads (M102).
2 Remove two solders
of the sled motor leads
(M101).
1 OP flexible board (CN102).
4 RF board
SLED MOTOR ASS’Y (251) (M101), OPTICAL PICK-UP (KSS-720A/K1NP)
4 Turn shaft (feed) ass’y
in the direction
of the arrow,
then remove it.
1 two precision screws
(P2 × 3)
2 sled motor ass’y (251)
(M101)
3 optical pick-up
(KSS-720A/K1NP)
OP flexible board
Note: After connecting OP flexible board,
fix it with adhesive sheet
to optical pick-up.
adhesive
sheet
optical
pick-up
9
LSW BOARD, SPINDLE MOTOR (S) SUB ASS’Y (M102)
)
w
8 two precision screws
(P1.7 × 2.2)
7
3 spring (chucking)
6 retainer (disc
1 precision screw
(P2 × 2.5)
2 LSW board
ELJ MOTOR ASS’Y (CHUCKING) (M103)
2 two screws
(PTT2 × 4)
4 precision scre
5 bracket (CP)
9 Remove the spindle motor (S) sub ass’y (M102)
in the direction of the arrow.
1 Remove two solders of
the chucking motor leads (M103).
(P2 × 2.2)
10
3 retainer (CHM)
4 ELJ motor
ass’y
(chucking)
(M103)
SECTION 4
)
MECHANISM DECK ASSEMBLY
Note: Follow the assembly procedure in the numerical order given.
OPTICAL PICK-UP COMPLETE ASS’Y
1 Move the lever (LOCK 3A) in the direction of arrow A,
and return it a little in the direction of arrow B
chuck plate
from the position where the chuck plate is moved
down to the lower limit.
B
A
3 stop ring 2.0 (E type
shaft (A)
GEAR (LOMINI)/(LOAD 1) ASS’Y
gear (LOAD 2)
gear (LOMINI)
chuck plate
4 tension spring (DH)
2 optical pick-up complete ass’y
Note: Insert the shaft (A) first.
2 Attach the gear (LOMINI) at the position
shown in Fig. A.
shaft (rotary prevention C)
B
1 Move the lever (LOCK 3A)
fully in the direction of arrow B
to move the chuck plate up.
marking
Fig. A
3 Attach the gear (LOAD 1) ass’y
with its facing inside.
slit
4 stop ring 1.5 (E type)
11
OPERATION CHECK
1
Confirm that the slider moves in the direction of arrow C to move down
the chuck plate if the gear (LOAD 1) is rotated in the direction of arrow
or the chuck plate moves up and the slider mov es in the direction of arrow
D
if the gear is rotated in the direction of arrow B.
chuck plate
A
slider
D
C
A
gear (LOAD 1) ass’y
B
12
MECHANICAL ADJUSTMENT
• Elevator Height (Address) Adjustment
SECTION 5
Note: This adjustments is necessary when the system controller (IC201),
variable resistor (RV201), slider (R), slider (L), or chassis (ELV)
was replaced for any repair.
Connection:
power supply
(DC 14.4 V)
master unit
+
GND
BUS cable
compact disc changer
CONTROL connector
(CN901)
Adjustment Method:
1. Connect this set to the master unit (e.g. XR-C5300X), load a
disc magazine, and place the set vertically as shown below.
2. Connect the regulated power supply to the master unit, and
turn the power on.
3. Press the DISC button on the master unit and select DISC 5.
4. At this time, if the elevator shaft does not position between
comb teeth A and B at addresses 5 and 6 as shown below,
adjust the following.
5. Press repeatedly the DISC + and – buttons on the master unit
so that the elevator shafts moves from address 6 to address 5,
or from 5 to 6. At this time, adjust RV201 on the main board
so that the elevator shaft positions smoothly between comb
teeth A and B.
6. Further, place the set horizontally and make same adjustment
as mentioned above.
7. After adjustment at addresses 5 to 6 is finished, check all operations from addresses 1 to 10 with the set placed vertically
and horizontally respectively to confirm that the elevator shaft
positions in a range between comb teeth A to B.
comb tooth at address 6
comb tooth at address 5
comb tooth at address 6
elevator shaft
A
B
OK NG
A
elevator shaft
B
comb tooth at address 5
RV201
13
SECTION 6
)
ELECTRICAL CHECK
Note:
1. This adjustment is performed with the set placed horizontally.
2. Power supply voltage: DC14.4 V (more than 3 A).
3. Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, b ut only
when indicated.
Connection:
power supply
(DC 14.4 V)
master unit
+
GND
BUS cable
FOCUS BIAS CHECK
– RF BOARD –
(Component Side)
oscilloscope
(AC range)
+
–
TP (VC)
IC101
TP
(RFO)
compact disc changer
CONTROL connector
(CN901)
Procedure:
1. Connect the oscilloscope to TP (RFO) and TP (VC) on the RF
board.
2. Put the set into play mode by loading the disc (YEDS-18).
3. Confirm that oscilloscope waveform is clear and check RF
signal level is correct or not.
Note:
Clear RF signal waveform means that the shape “◊” can be clearly distinguished at the center of the waveform.
RF signal waveform
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
(10 : 1 probe in use
level: 1.4 ± 0.3 Vp-p
When observing the eye pattern, set the oscilloscope to AC range
and raise the vertical sensitivity so that it may be easily seen.
14
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