GM 47/GM 48
Design Guidelines
CE
The product described in this manual conforms to the TTE directive 91/263/EEC and EMC directive 89/336/EEC. The product fulfils the requirements according to ETS 300 342-1.
The information contained in this document is the proprietary information of Sony Ericsson Mobile Communications. The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Sony Ericsson Mobile Communications, is strictly prohibited.
Further, no portion of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, without the prior written consent of Sony Ericsson Mobile Communications, the copyright holder.
First edition (January 2002)
Sony Ericsson Mobile Communications. publishes this manual without making any warranty as to the content contained herein. Further Sony Ericsson Mobile Communications. reserves the right to make modifications, additions and deletions to this manual due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this manual.
All rights reserved.
© Sony Ericsson Mobile Communications., 2002
Publication number:
Printed in UK
Trademarks
AIX is a trademark owned by International Business Machines Corporation
GM47/48 Design Guidelines
Contents
1 |
INTRODUCTION ........................................................................................................... |
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1.1 |
OVERVIEW ............................................................................................................... |
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1.2 |
PRECAUTIONS........................................................................................................... |
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1.3 |
ABBREVIATIONS ........................................................................................................ |
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2 |
MECHANICAL INTEGRATION....................................................................................... |
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2.1 |
PHYSICAL DIMENSIONS............................................................................................... |
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3 |
ELECTRICAL INTEGRATION........................................................................................ |
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3.1 |
GENERAL................................................................................................................. |
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3.2 |
GROUNDING ............................................................................................................. |
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3.2.1 |
The Analogue Ground....................................................................................... |
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3.2.2 The Digital Ground (DGND)............................................................................... |
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3.3 |
EXTERNAL SUPPLY TO MODULE................................................................................. |
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3.3.1 |
Power Supply (VCC)....................................................................................... |
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3.4 |
GENERAL RECOMMENDATIONS .................................................................................. |
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3.5 |
SIM CONNECTIONS .................................................................................................. |
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3.6 |
AUDIO CONNECTIONS............................................................................................... |
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3.6.1 |
Analogue Audio .............................................................................................. |
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3.6.2 Advanced Portable Hands Free Functionality................................................... |
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3.7 |
RF AND ANTENNA INTEGRATION................................................................................. |
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3.8 |
INTERFACING TO A 3.3V μPROCESSOR....................................................................... |
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3.9 |
SOFTWARE DOWNLOAD AND LOGGING CIRCUITRY ......................................................... |
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4 |
DEVELOPERS BOARD............................................................................................... |
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4.1 |
POWER CIRCUIT...................................................................................................... |
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4.2 |
SIM CIRCUIT.......................................................................................................... |
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5 |
PART NUMBERS ........................................................................................................ |
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5.1 |
SYSTEM CONNECTOR ............................................................................................... |
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5.2 |
RF CONNECTOR...................................................................................................... |
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5.3 |
SIM CARD HOLDER.................................................................................................. |
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5.4 |
SUPPLIERS ............................................................................................................. |
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5.4.1 |
Imperial connectors ........................................................................................ |
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5.4.2 |
IMS connectors .............................................................................................. |
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6 |
TYPE APPROVAL....................................................................................................... |
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6.1 |
DOCUMENTATION REQUIRED...................................................................................... |
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6.2 |
POWER SUPPLY ...................................................................................................... |
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6.3 |
SIM TESTING.......................................................................................................... |
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6.4 |
EMC/ESD & SAFETY .............................................................................................. |
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6.5 |
RF TESTING ........................................................................................................... |
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6.5.1 |
GM47............................................................................................................. |
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6.5.2 |
GM48............................................................................................................. |
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6.6 |
SAR WARNING........................................................................................................ |
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6.7 |
OTHER TA ISSUES ................................................................................................... |
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6.7.1 |
External Application software........................................................................... |
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6.7.2 |
GM47 software updates .................................................................................. |
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APPENDIX I - TECHNICAL DATA ...................................................................................... |
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APPENDIX II – GM47/48 PIN OUT...................................................................................... |
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BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
APPENDIX III GSM TRANSMIT WAVEFORM CHARACTERISTICS..................................... |
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BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
1 Introduction
1.1Overview
The GM47/48 belong to a new generation of Sony Ericsson Mobile Communications GSM modules. This document describes the main characteristics and functionality of the GM 47/48, two dual band products for 900/ 1800 MHz and 850/1900 MHz GSM bands respectively.
This document should be used in conjunction with either the GM 47/48 Integrators Manual or GM47/48 Technical Description and is intended to aid the system integrator both designing the module into their application and gaining the correct approvals.
1.2Precautions
The GM47/48 should be handled like any mobile station. In the Integrators’ Manual you will find more information about safety and product care. Never exceed these limits to ensure the module is not damaged.
1.3Abbreviations
Abbreviation |
Explanation |
BT |
Bluetooth |
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CBS |
Cell Broadcast Service |
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CBM |
Cell Broadcast Messaging |
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CSD |
Circuit Switch Data |
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DCE |
Data Circuit Terminating Equipment |
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DTE |
Data Terminal Equipment |
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DTMF |
Dual Tone Multi Frequency |
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EFR |
Enhanced Full Rate codec |
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EMC |
Electro-Magnetic Compatibility |
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ETSI |
European Telecommunications Standards Institute |
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FR |
Full Rate codec |
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GPRS |
General Packet Radio Service |
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GPS |
Global Positioning System |
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GSM |
Global System for Mobile Comunication |
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HR |
Half Rate codec |
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HSCSD |
High Speed Circuit Switched Data |
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ITU-T |
International Telecommunication Union – Telecommunications |
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Standardisation Sector |
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ME |
Mobile Equipment |
BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
MO |
Mobile Originated |
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MS |
Mobile Station |
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MT |
Mobile Terminated |
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PCM |
Pulse Code Modulation |
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PDU |
Protocol Data Unit |
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RLP |
Radio Link Protocol |
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RF |
Radio Frequency |
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RTC |
Real Time Clock |
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SDP |
Service Discovery Protocol |
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SMS |
Short Message Service |
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SIM |
Subscriber Identity Module |
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TBD |
To Be Defined |
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BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
2 Mechanical Integration
The GM 47/48 are protected with AISI 304 Stainless Steel covers suitable to fulfil the environmental and EMC requirements. Dimensions, the position of the different connectors and mounting holes are shown in figure 2.1.
2.1Physical Dimensions
Figure 2.1 Physical dimensions of GM 47/48
BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
3 Electrical Integration
3.1General
The electrical connections to the module (except the antenna), are set through the System Connector Interface.
The connector shall allow the following connections: board to board and board to cable.
See section 5 for suppliers and part numbers.
The figure 3.1 below indicates the pin numbering scheme.
Figure 3.1 GM 47/48. View from the underside
BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
3.2 Grounding
Pins |
Name |
Description |
2, 4, 6, 8, 10, 12 |
DGND |
Digital Ground |
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60 |
AGND |
Analogue Ground |
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There are two ground signals in GM 47/48, Analogue Ground (AGND) and Digital Ground (DGND). The analogue Ground is connected to pin number 60, and the Digital Ground is connected to the System Connector Interface through pin numbers 2, 4, 6, 8, 10 and 12.
Note: All the Ground pins have to be connected to the application. The AGND is connected to the DGND in the ME, and only there. It is important that the AGND and the DGND are separated in the application.
3.2.1 The Analogue Ground
The AGND lead is the analogue audio reference ground. It is the return signal for Audio To Mobile Station (ATMS) and Audio From Mobile Station (AFMS).
It is connected to the Digital Ground (DGND) inside the module and only there. The application shall not connect DGND and AGND.
Parameter |
Limit |
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Imax |
12.5mA |
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3.2.2 The Digital Ground (DGND)
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DGND is the reference for all digital signals in the System Interface. |
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It shall also be the DC return for the power supply on VCC and |
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SERVICE. Each DGND pin is rated at 0.5 A. All DGND pins are |
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connected internally in the module. |
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Parameter |
Limit |
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Iaverage |
< 0.5 A No DGND pin can withstand over 0.5 A |
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Imax |
< 600 mA (100 mA each) |
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BA/SEM/MSC 02:0006 Rev PA1 |
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GM47/48 Design Guidelines
3.3External Supply to Module
Pins |
Name |
Description |
1, 3, 5, 7, 9, 11 |
VCC |
Regulated Power Supply |
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Connect all of the pins together in the application in order to carry the current drawn by the module.
3.3.1 Power Supply (VCC)
The VCC supplies the module with external power. Any other voltage needed is generated internally.
Parameter |
Mode |
Limit |
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Voltage to be applied |
Nominal |
3.6 Volts |
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Tolerance |
3.4 Volts - 4.0 Volts |
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Maximum voltage drop during |
200mV |
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transmit burst |
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Over voltages |
5.5 Volts |
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Current Drive capability at TX Full Power |
< 600 mA (average)) |
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< 2 A (Peak) |
GM 47/48 does not have internal capacitance to supply the large current peaks during GSM transmission. Therefore on burst transmission the application DC source is responsible for providing the appropriate current.
Recommendations to the design of power supplies are given in the following sections.
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'RLINE' represents resistance |
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of circuit between PSU and |
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GM47/GM48. |
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L1 |
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3.6V |
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RLINE |
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Vcc |
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33uH |
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100mohm |
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J1 |
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577usec |
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V1 |
+ |
C1 |
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CF |
+ |
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CBULK |
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1:8 Duty Cycle |
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2 Amp |
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220uF |
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100uF |
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1000uF |
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RRX |
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RTX |
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Low ESR |
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Low ESR |
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120ohm |
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1.8ohm |
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30mA Load |
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2A Load |
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Figure 3.2 - Simplified Power Supply Reference Model
BA/SEM/MSC 02:0006 Rev PA1 |
10 |