Sony 6220501-BV Users Guide

GM 47/GM 48

Design Guidelines

The product described in this manual conforms to the TTE directive 91/263/EEC and EMC directive 89/336/EEC. The product fulfils the requirements according to ETS 300 342-1.

The information contained in this document is the proprietary information of Sony Ericsson Mobile Communications. The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Sony Ericsson Mobile Communications, is strictly prohibited.

Further, no portion of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, without the prior written consent of Sony Ericsson Mobile Communications, the copyright holder.

First edition (January 2002)

Sony Ericsson Mobile Communications. publishes this manual without making any warranty as to the content contained herein. Further Sony Ericsson Mobile Communications. reserves the right to make modifications, additions and deletions to this manual due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this manual.

Publication number:

Printed in UK

Trademarks

AIX is a trademark owned by International Business Machines Corporation

GM47/48 Design Guidelines

Contents


1	INTRODUCTION ...........................................................................................................			5
	1.1	OVERVIEW ...............................................................................................................		5
	1.2	PRECAUTIONS...........................................................................................................		5
	1.3	ABBREVIATIONS ........................................................................................................		5
2	MECHANICAL INTEGRATION.......................................................................................			7
	2.1	PHYSICAL DIMENSIONS...............................................................................................		7
3	ELECTRICAL INTEGRATION........................................................................................			8
	3.1	GENERAL.................................................................................................................		8
	3.2	GROUNDING .............................................................................................................		9
	3.2.1		The Analogue Ground.......................................................................................	9
	3.2.2 The Digital Ground (DGND)...............................................................................			9
	3.3	EXTERNAL SUPPLY TO MODULE.................................................................................		10
	3.3.1		Power Supply (VCC).......................................................................................	10
	3.4	GENERAL RECOMMENDATIONS ..................................................................................		11
	3.5	SIM CONNECTIONS ..................................................................................................		13
	3.6	AUDIO CONNECTIONS...............................................................................................		14
	3.6.1		Analogue Audio ..............................................................................................	14
	3.6.2 Advanced Portable Hands Free Functionality...................................................			15
	3.7	RF AND ANTENNA INTEGRATION.................................................................................		16
	3.8	INTERFACING TO A 3.3V μPROCESSOR.......................................................................		17
	3.9	SOFTWARE DOWNLOAD AND LOGGING CIRCUITRY .........................................................		17
4	DEVELOPERS BOARD...............................................................................................			18
	4.1	POWER CIRCUIT......................................................................................................		18
	4.2	SIM CIRCUIT..........................................................................................................		18
5	PART NUMBERS ........................................................................................................			20
	5.1	SYSTEM CONNECTOR ...............................................................................................		20
	5.2	RF CONNECTOR......................................................................................................		20
	5.3	SIM CARD HOLDER..................................................................................................		20
	5.4	SUPPLIERS .............................................................................................................		20
	5.4.1		Imperial connectors ........................................................................................	20
	5.4.2		IMS connectors ..............................................................................................	21
6	TYPE APPROVAL.......................................................................................................			22
	6.1	DOCUMENTATION REQUIRED......................................................................................		22
	6.2	POWER SUPPLY ......................................................................................................		22
	6.3	SIM TESTING..........................................................................................................		23
	6.4	EMC/ESD & SAFETY ..............................................................................................		23
	6.5	RF TESTING ...........................................................................................................		23
	6.5.1		GM47.............................................................................................................	23
	6.5.2		GM48.............................................................................................................	23
	6.6	SAR WARNING........................................................................................................		24
	6.7	OTHER TA ISSUES ...................................................................................................		24
	6.7.1		External Application software...........................................................................	24
	6.7.2		GM47 software updates ..................................................................................	24
APPENDIX I - TECHNICAL DATA ......................................................................................				25
APPENDIX II – GM47/48 PIN OUT......................................................................................				27

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GM47/48 Design Guidelines

APPENDIX III GSM TRANSMIT WAVEFORM CHARACTERISTICS.....................................

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GM47/48 Design Guidelines

1 Introduction

1.1Overview

The GM47/48 belong to a new generation of Sony Ericsson Mobile Communications GSM modules. This document describes the main characteristics and functionality of the GM 47/48, two dual band products for 900/ 1800 MHz and 850/1900 MHz GSM bands respectively.

This document should be used in conjunction with either the GM 47/48 Integrators Manual or GM47/48 Technical Description and is intended to aid the system integrator both designing the module into their application and gaining the correct approvals.

1.2Precautions

The GM47/48 should be handled like any mobile station. In the Integrators’ Manual you will find more information about safety and product care. Never exceed these limits to ensure the module is not damaged.

1.3Abbreviations

Abbreviation	Explanation
BT	Bluetooth

CBS	Cell Broadcast Service

CBM	Cell Broadcast Messaging

CSD	Circuit Switch Data

DCE	Data Circuit Terminating Equipment

DTE	Data Terminal Equipment

DTMF	Dual Tone Multi Frequency

EFR	Enhanced Full Rate codec

EMC	Electro-Magnetic Compatibility

ETSI	European Telecommunications Standards Institute

FR	Full Rate codec

GPRS	General Packet Radio Service

GPS	Global Positioning System

GSM	Global System for Mobile Comunication

HR	Half Rate codec

HSCSD	High Speed Circuit Switched Data

ITU-T	International Telecommunication Union – Telecommunications
	Standardisation Sector

ME	Mobile Equipment

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GM47/48 Design Guidelines

MO	Mobile Originated

MS	Mobile Station

MT	Mobile Terminated

PCM	Pulse Code Modulation

PDU	Protocol Data Unit

RLP	Radio Link Protocol

RF	Radio Frequency

RTC	Real Time Clock

SDP	Service Discovery Protocol

SMS	Short Message Service

SIM	Subscriber Identity Module

TBD	To Be Defined

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2 Mechanical Integration

The GM 47/48 are protected with AISI 304 Stainless Steel covers suitable to fulfil the environmental and EMC requirements. Dimensions, the position of the different connectors and mounting holes are shown in figure 2.1.

2.1Physical Dimensions

Figure 2.1 Physical dimensions of GM 47/48

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3 Electrical Integration

3.1General

The electrical connections to the module (except the antenna), are set through the System Connector Interface.

The connector shall allow the following connections: board to board and board to cable.

See section 5 for suppliers and part numbers.

The figure 3.1 below indicates the pin numbering scheme.

Figure 3.1 GM 47/48. View from the underside

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GM47/48 Design Guidelines

3.2 Grounding

Pins	Name	Description
2, 4, 6, 8, 10, 12	DGND	Digital Ground

60	AGND	Analogue Ground

There are two ground signals in GM 47/48, Analogue Ground (AGND) and Digital Ground (DGND). The analogue Ground is connected to pin number 60, and the Digital Ground is connected to the System Connector Interface through pin numbers 2, 4, 6, 8, 10 and 12.

Note: All the Ground pins have to be connected to the application. The AGND is connected to the DGND in the ME, and only there. It is important that the AGND and the DGND are separated in the application.

3.2.1 The Analogue Ground

The AGND lead is the analogue audio reference ground. It is the return signal for Audio To Mobile Station (ATMS) and Audio From Mobile Station (AFMS).

It is connected to the Digital Ground (DGND) inside the module and only there. The application shall not connect DGND and AGND.

Parameter	Limit

Imax	12.5mA

3.2.2 The Digital Ground (DGND)

	DGND is the reference for all digital signals in the System Interface.
	It shall also be the DC return for the power supply on VCC and
	SERVICE. Each DGND pin is rated at 0.5 A. All DGND pins are
	connected internally in the module.

Parameter	Limit

Iaverage	< 0.5 A No DGND pin can withstand over 0.5 A

Imax	< 600 mA (100 mA each)

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3.3External Supply to Module

Pins	Name	Description
1, 3, 5, 7, 9, 11	VCC	Regulated Power Supply

Connect all of the pins together in the application in order to carry the current drawn by the module.

3.3.1 Power Supply (VCC)

The VCC supplies the module with external power. Any other voltage needed is generated internally.

Parameter	Mode	Limit

Voltage to be applied	Nominal	3.6 Volts

	Tolerance	3.4 Volts - 4.0 Volts

	Maximum voltage drop during	200mV
	transmit burst

	Over voltages	5.5 Volts

Current Drive capability at TX Full Power		< 600 mA (average))

		< 2 A (Peak)

GM 47/48 does not have internal capacitance to supply the large current peaks during GSM transmission. Therefore on burst transmission the application DC source is responsible for providing the appropriate current.

Recommendations to the design of power supplies are given in the following sections.

'RLINE' represents resistance

of circuit between PSU and

GM47/GM48.

3.6V

RLINE

Vcc

33uH

100mohm

577usec

CBULK

1:8 Duty Cycle

2 Amp

220uF

100uF

1000uF

RRX

RTX

Low ESR

120ohm

1.8ohm

30mA Load

2A Load

Figure 3.2 - Simplified Power Supply Reference Model

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