Sony 1000RF - CDX CD Player Service Manual

1

Model Name Using Similar Mechanism CDX-2500R
CD Drive Mechanism Type MG-363X-121
Optical Pick-up Name KSS-521A

SERVICE MANUAL

US Model

CDX-1000RF

COMPACT DISC PLAYER

AUDIO POWER SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION
13 watts per channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more
than 1% total harmonic distortion.

Other Specifications
CD player section

System Compact disc digital audio

system
Signal-to-noise ratio 90 dB
Frequency response 10 – 20,000 Hz
Wow and flutter Below measurable limit
Laser Diode Properties

Material GaAs+GaAlAs
Wavelength 785 – 815 nm (Typ. 800 nm)
Emission Duration Continuous
Laser output power Less than 0.5 mW*

* This output is the value measured at a distance

of 0.7 mm from the objective lens surface on the
Optical Pick-up Block.

SPECIFICATIONS

General

Outputs Line outputs
Power requirements 12 V DC car battery

(negative ground)

Current drain 2A (at disc loading)
Dimensions Approx. 178 × 50 × 173 mm

(7 1/8 × 2 × 6 7/8 in.)
(w/h/d)

Mounting dimensions Approx. 182 × 53 × 159 mm

(7 1/4 × 2 1/8 × 6 3/8 in.)

(w/h/d)
Mass Approx. 1.1 kg (2 lb. 7 oz.)
Supplied accessories Parts for installation and

connections (1 set)

Design and specifications are subject to change without
notice.

2

TABLE OF CONTENTS

1. GENERAL

Location of controls................................................................. 3

Getting Started......................................................................... 3

Operation ................................................................................. 3

Connections ............................................................................. 4

2. DISASSEMBLY

2-1. Panel Assy, Front ................................................................. 5

2-2. CD Mechanism Block ......................................................... 5

2-3. Main Board ......................................................................... 6

2-4. Chassis (Rear) ..................................................................... 6

2-5. Chassis (T) Sub Assy .......................................................... 7

2-6. Lever Assy ........................................................................... 7

2-7. Servo Board......................................................................... 8

2-8. Roller Assy.......................................................................... 8

2-9. Chassis (OP) (O/S) Assy ..................................................... 9

2-10. Optical Pick-up Block ......................................................... 9

3. ELECTRICAL ADJUSTMENTS

CD Section ............................................................................10

4. DIAGRAMS

4-1. IC Pin Description............................................................. 11

4-2. Block Diagram –CD Section (1/2)– .................................. 12

4-3. Block Diagram –CD Section (2/2)– .................................. 13

4-4. Block Diagram –Display, Power Supply Section– ............ 14

4-5. Circuit Boards Location .................................................... 15

4-6. Printed Wiring Boards –CD Mechanism Section–............ 16

4-7. Schematic Diagram –CD Mechanism Section– ................ 17

4-8. Printed Wiring Board –Main Section– .............................. 18

4-9. Schematic Diagram –Main Section (1/2)– ........................ 19

4-10. Schematic Diagram –Main Section (2/2)– ........................ 20

4-11. Schematic Diagram –Display Section–............................. 21

4-12. Printed Wiring Board –Display Section– .......................... 22

5. EXPLODED VIEWS

5-1. Chassis Section ................................................................. 26

5-2. Front Panel Section ........................................................... 27

5-3. CD Mechanism Section (1) ............................................... 28

5-4. CD Mechanism Section (2) ............................................... 29

5-5. CD Mechanism Section (3) ............................................... 30

6. ELECTRICAL PARTS LIST ........................................ 31

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
P ART NUMBERS APPEAR AS SHOWN IN THIS MANU AL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

SERVICE NOTE

CAUTION

Use of controls or adjustments or performance of proce­dures other than those specified herein may result in haz­ardous radiation exposure.

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick­up block. Therefore, when checking the laser diode emission, ob­serve from more than 30 cm away from the objective lens.

NOTES ON PICK-UP FLEXIBLE BOARD

The pick-up flexible board in this set is secured to the optical pick­up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick­up flexible board with a new one.

3

SECTION 1

GENERAL

This section is extracted
from instruction manual.

4

5

3 claw

1 claws

4 CNP801

5 panel assy, front

2 claws

7 PTT 2.6x6

3 PTT 2.6x6

6 PTT 2.6x

6

2 PTT 2.6x6

4 CNP701

8 bracket (M/D)

5 CD mechanism block

1 PTT 2.6x6

SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. PANEL ASSY, FRONT

2-2. CD MECHANISM BLOCK

6

2 PTT 2.6x6

4 chassis (rear)

1 PTT 2.6x6

3 PTT 2.6x

6

4 ground point screws
(PTT 2.6x6)

5 ground point screw
(PTT 2.6x6)

1 PTT 2.6x6

6 MAIN board

3 PTT 2.6x

6

2 PTT 2.6x6

2-3. MAIN BOARD

2-4. CHASSIS (REAR)

7

4 claws

2 DISC IN SW board

7 lever (L) assy

3 tension spring (LR)

6 lever (R) assy

5 guide (disc)

1 PS 2x4

5 chassis (T) sub assy

3 P 2x3

4 P 2x3

1 Unsolder the

lead wires.

red

white

black

2 P 2x3

2-5. CHASSIS (T) SUB ASSY

2-6. LEVER ASSY

8

Fig. 1

4 PS 2x3

5 LOAD SW board

1 tension spring (RA)

2 arm (roller)

3 roller assy

washer

arm

arm

ring (roller), retaining

spacer, insulating

7 PS 2x4

1 CN3

3 Removal the solders.

4 Removal the solders.

5 P 2x3

6 loading motor assy

9 SERVO board

2 CN2

8 PS 2x4

2-7. SERVO BOARD

2-8. ROLLER ASSY

• When installing, take note of the positions

arm (roller) and washers. (Fig. 1)

9

1 tension spring (KF1)

8 compression spring (FL)

7 chassis (OP) (O/S) assy

9 compression spring (FL)

2 tension spring (KR1)

5 Fit lever (D) in the

direction of the arrow.

3 damper (T)

4 damper (T)

6 Turn loading ring in the

direction of the arrow.

1 P 2x3

2 sled motor assy

3 optical pick-up block

2-9. CHASSIS (OP) (O/S) ASSY

2-10. OPTICAL PICK-UP BLOCK

10

IC3

CN1

IC1

CN2

FOCUS GAIN ADJ

RV4

TP

(RF. GND)

IC2

TP

(RF)

CN3

RV1

FOCUS BIAS ADJ

RF signal waveform

VOLT/DIV: 200 mV
TIME/DIV: 500 nS

level: 1.0 – 1.5 Vp-p

SERVO board

TP (RF)

TP (RF. GND)

oscilloscope

+
–

CD SECTION

Note:

1. CD Block basically constructed to operate without adjustment.
Therefore, check each item in order given.

2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.

3. Use the oscilloscope with more than 10 MΩ impedance.

4. Clean an objective lens by an applicator with neutral detergent
when the signal level is low than specif ied value with the f ollowing
checks.

Focus Bias Adjustment

Setting: This adjustment is performed with the set placed

horizontally.

Focus Gain Adjustment (Coarse adjustment)

This adjustment is not required unless the following parts are re placed:

• Optical pick-up

• RV4

Procedure:

1. Set RV4 to the standard position. (mechanical center)

2. Check whether operation noise (while noise type) caused by
the 2-axis device (lens section of the optical pick-up) is
abnormally loud.
If the operation noise is too loud, turn RV4 slightly counter­clockwise.

• If the gain is too low:
Focus does not function and no music is selected.

• If the gain is too high:
Noise caused by scratches and dust is heard and the operation
becomes unstable.

Adjustment Location: servo board

Adjustment Location: servo board (component side)

Procedure:

1. Connect an oscilloscope between TP (RF) and TP (RF. GND)
on the SERVO board.

2. Connect the power supply.

3. Push the RESET button (S900) on the MAIN board.

4. Insert the disc (YEDS-18) and playback.

5. Adjust RV1 so that the oscilloscope w aveform is clear and check
RF signal level is correct or not.

Note: Clear RF signal waveform means that the sharp “ ” can be

clearly distinguished at the center of the waveform.

• When observing the ey e pattern, set the oscilloscope to A C range

and raise the vertical sensitivity so that it may be easily seen.

Adjustment Location: servo board

SECTION 3

ELECTRICAL ADJUSTMENTS

11 11

4-1. IC PIN DESCRIPTION

• IC801 µPD17705GC-547-3B9 (SYSTEM CONTROL)

Pin No. Pin Name I/O Pin Description

1 NC — Not used. (Connect to ground in this set.)
2 IN_SW I Disc insertion detection input L: IN_SW
3 D_SW I DOWN switch detection input L: D_SW
4 SELF_SW I Disc self store detection input L: SELF_SW
5 L_SW I Sled limit switch detection input L: L_SW
6 LM_EJ O Loading motor control output (Eject direction)
7 LM_LD O Loading motor control output (Loading direction)
8 RY_ON O Relay control output

9, 10 NC — Not used. (Open)

11 BAND_SW I BAND select input 0: US

12 – 20 NC — Not used. (Open)

21 GND3 — Ground
22 NC — Not used. (Open)
23 ADKI2 I A/D key input 2
24 ADKI1 I A/D key input 1
25 ROTCOM I Rotary commander shift key input
26 NC — Not used. (Open)
27 TEST_SW I Test mode initial setting detection input L: TEST_SW

28, 29 NC — Not used. (Open)

30 VDD2 — Power supply pin (+5 V)
31 FMIN I PLL local oscillator frequency input
32 NC — Not used. (Open)
33 GND2 — Ground
34 NC — Not used. (Open)
35 EO1 O PLL error 1 output
36 TEST0 — Connect to GND line.

37 – 40 NC — Not used. (Open)

41 ACC_IN I Accessory power detection input L: ACC_IN
42 SCOR I SCOR signal detection input
43 MUTE O Mute control output
44 LEVEL D O Level control output
45 NC — Not used. (Open)
46 PH2 I Connect to +5 V line.
47 LEVEL 1 O Volume control output

48, 49 NC O Not used. (Open)

50 EMPH_O O Emphasis control output
51 PW_ON O System power control output
52 LM_ON O Loading motor power control output
53 CD_ON O CD power control output
54 ILLON O Illumination power control output

55 – 57 NC — Not used. (Open)

58 LCD_CE O LCD chip enable output
59 EZ_SEL I Rotary commander shift key input L: EZ_SEL
60 SENS I CD SENS signal detection input
61 FOK I Focus OK signal detection input
62 LD_ON O Laser ON/OFF control output L: LD_ON

63, 64 NC — Not used. (Open)

65 LCD_CLK O LCD serial clock output
66 LCD_DAT O LCD serial data output
67 LCD_INH O LCD inhibition output L: LCD_INH
68 SQCK0 O Sub Q read clock output

SECTION 4
DIAGRAMS

Pin No. Pin Name I/O Pin Description

69 CD_RST O Reset output to CD signal processor IC.
70 SQ_SI I Sub Q data input
71 CD_SO0 O CD signal serial data output
72 CD_LAT O CD signal processing data latch output
73 CD_CK0 O CD signal processing serial clock output
74 NC — Not used. (Open)
75 GND1 — Ground
76 XOUT O ceramic oscillator output (4.5 MHz)
77 XIN I ceramic oscillator input (4.5 MHz)
78 BU_IN I Backup power detection input
79 VDD1 — Power supply pin (+5 V)
80 RESET I Reset input L: RESET

12 12

35 31
36
39
38

PD1 RF

CLKO
XLTO
DATO
SEIN
FOK
CNIN

RF 0

21

PCMD

22

BCK

20

LRCK

34

XTAI

19

CLK

20

XLT

21

DATA

24

SENS

25

FOK

23

14

DIN

59
57
56
54

1

55

C. OUT

37

FE BIAS

22 50

XRST

16

SL O

6

FE O

13

TA O

PD2
E
F

1

FEO

2

FEI

34

PD

33

LD

XRST

MDP

RF AMP, SERVO CONTROL

IC2

OPTICAL PICK-UP

KSS-521A

DIGITAL SIGNAL PROCESSOR

IC1

D/A CONVERTER

IC701

FOCUS

GAIN

RV4

FOCUS

BIAS

RV1

LD POWER

CONTROL

Q1, 2

PD

LD

FOCUS/TRACKING COIL DRIVE,

MOTOR DRIVE

IC3

CH2 IN

LEVEL
SHIFT

22

16

15

TRACKING

CH1 IN

LEVEL
SHIFT

19

18

17

FOCUS

M902

(SLED)

CH2+

CH2–

CH1+

CH1–

CH3 IN

LEVEL
SHIFT

24

13

14

CH3+

CH3–

M

M901

(SPINDLE)

CH4 IN

LEVEL
SHIFT

3

CTL2

5

12

CH4+

M

M903

(LOADING)

FWD

LEVEL
SHIFT

6

REV

7

10

CH5+

M

49

SENS

46

SQSO

47

SQCK

51

DATA

52

XLAT

53

CLOK

43

SCOR

5

BCKIN

6

LRCIN

4

CLKO

19

XTI

1

XTO

20

RSTB

15

12

VOUTL

9

VOUTR

17

MC/DM1

X701

16.9344MHz

3

SCOR

CD_CK0

CD_LAT

CD_SO0

SQCK0

SQ_SI

SENS

CD_RST

FOK
LD_ON

LM_EJ

LM_LD

L_SW

IN_SW

D_SW

SELF_SW

SW3

(LIMIT)

SW1

(DISC IN)

SW4

(DOWN)

SW2

(SELF)

61
62

42

5

2

3

4

73

72

71

68

70

60

69

EMPH_O

50

SYSTEM CONTROL

IC801 (1/3)

CD L-CH

CD R-CH

CD

SECTION

(2/2)

A

I-V

AMP

04

• Signal path
: CD

• R-ch : same as L-ch.

6

7

CDX-1000RF

4-2. BLOCK DIAGRAM — CD SECTION (1/2) —

(Page 13)