Last updated: Jun. 2017
H M A X XX X X X X X X X - XX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SK Hynix MEMORY
PRODUCT FAMILY
M : DRAM MODULE
PRODUCT MODE
A : DDR4 SDRAM
COMPONENT DENSITY
4 |
: 4Gb |
8 |
: 8Gb |
A: 16Gb
B: 32Gb
MEMORY DEPTH
25 |
: 256Mb |
51 |
: 512Mb |
1G |
: 1Gb |
2G |
: 2Gb |
4G |
: 4Gb |
8G |
: 8Gb |
AG |
: 16Gb |
BG |
: 32Gb |
MODULE TYPE
U : 288 pin Unbuffered DIMM S : 260 pin Small Outline DIMM R : 288 pin Registered DIMM
L : 288 pin Load Reduction DIMM
DATA WIDTH & MODULE HEIGHT
6 |
: x64/LP |
7 |
: x72/LP |
1 |
: x64/VLP |
8 |
: x72/VLP |
2 |
: x64/ULP |
9 |
: x72/ULP |
DIE GENERATION
M |
: 1st |
D |
: 5th |
A |
: 2nd |
E |
: 6th |
B |
: 3rd |
F |
: 7th |
C |
: 4th |
G |
: 8th |
SPEED(tCL-tRCD-tRP)
TF |
: DDR4-2133 15-15-15 |
UH |
: DDR4-2400 17-17-17 |
UL |
: DDR4-2400 20-18-18 |
VK |
: DDR4-2666 19-19-19 |
VN |
: DDR4-2666 22-19-19 |
WM |
: DDR4-2933 21-21-21 |
XN |
: DDR4-3200 22-22-22 |
OPERATING TEMPERATURE & VDD
N: Commercial Temp(0°C ~ 85°C) & 1.2V
B: Commercial Temp(0°C ~ 85°C) & 1.2V & Reduced IDD6
ORGANIZATION
4 |
: x4 |
8 |
: x8 |
6 |
: x16 |
PACKAGE MATERIAL
R : Lead Free & Halogen Free
(RoHS Compliant)
PACKAGE TYPE
F : FBGA SDP
J : Flipchip SDP
M : FBGA DDP
P : Flipchip Planar DDP 2 : TSV 2 high stack
4 : TSV 4 high stack
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