‘H’ Part Number |
Last updated: May. 2012 |
H M T X XX X X X X X X X - XX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
HYNIX MEMORY
PRODUCT FAMILY
M: DRAM MODULE
PRODUCT MODE
T: DDR3 SDRAM
COMPONENT DENSITY
5: 512Mb
1: 1Gb
3: 2Gb
4: 4Gb
8 : 8Gb
A: 16Gb
MEMORY DEPTH
16 |
: 16Mb |
51 |
: 512Mb |
32 |
: 32Mb |
1G |
: 1Gb |
64 |
: 64Mb |
2G |
: 2Gb |
12 |
: 128Mb |
4G |
: 4Gb |
25 |
: 256Mb |
8G |
: 8Gb |
MODULE TYPE
U : 240 pin Unbuffered DIMM
R: 240 pin Registered DIMM
V : 240 pin VLP Registered DIMM
S : 204 pin Unbuffered SO-DIMM
L: 240 pin LRDIMM
A: 204 pin ECC SO-DIMM
B : 204 pin SO-DIMM (Single Side)
E : 240 pin VLP ECC UDIMM
M: 244 pin ULP Mini UDIMM
DATA WIDTH
6: x64
7: x72
DIE GENERATION
M |
: 1st |
D |
: 5th |
A |
: 2nd |
E |
: 6th |
B |
: 3rd |
F |
: 7th |
C |
: 4th |
G |
: 8th |
Note:
1)Refer to respective datasheet for more module options
2)Commercial Temperature: 0°C ~ 85°C
3)Extended Temperature: -25°C ~ 85°C
4)Industrial Temperature: -40°C ~ 85°C
5)ROHS : Restriction Of Hazardous Substances
SPEED(tCL-tRCD-tRP)
TE |
: DDR3-2133 14-14-14 |
RD |
: DDR3-1866 13-13-13 |
PB |
: DDR3-1600 11-11-11 |
H9 |
: DDR3-1333 9-9-9 |
G7 |
: DDR3-1066 7-7-7 |
S6 |
: DDR3-800 6-6-6 |
OPERATING TEMPERATURE & POWER CONSUMPTION
C : Commercial Temp2) & Normal Power L : Commercial Temp2) & Low Power
E : Extended Temp3) & Normal Power
I: Industrial Temp4) & Normal Power
A: Commercial Temp1) & 1.35 VDD Power
R: Commercial Temp1)& 1.35 VDD Power & Reduced IDD6
U: Commercial Temp1) & 1.25 VDD Power
ORGANIZATION
4 : x4 Based
8 : x8 Based
6 : x16 Based
PACKAGE MATERIAL
L: Leaded
P : Lead Free (RoHS5) Compliant)
R : Lead Free & Halogen Free
(RoHS5) Compliant)
PACKAGE TYPE
F: FBGA SDP
(Single Die Package)
L : FBGA DDP 1CS
(Dual Die Package)
M : FBGA DDP 2CS
(Dual Die Package)
H: FBGA QDP
(Quad Die Package)
Loading...