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‘H’ Part Number Last updated: May. 2012
H M T X XX X X X X X X X - XX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
HYNIX MEMORY
PRODUCT FAMILY
M
: DRAM MODULE
PRODUCT MODE
T
: DDR3 SDRAM
COMPONENT DENSITY
5
: 512Mb
1
: 1Gb
3
: 2Gb
4
: 4Gb
8
: 8Gb
A
: 16Gb
MEMORY DEPTH
16
32
64
12
25
: 16Mb
: 32Mb
: 64Mb
: 128Mb
: 256Mb
51
1G
2G
4G
8G
: 512Mb
: 1Gb
: 2Gb
: 4Gb
: 8Gb
OPERATING TEMPERATURE &
2
: Commercial Temp2) & Normal Power
C
2
: Commercial Temp
L
2
: Extended Temp
E
2
: Industrial Temp
I
2
A
: Commercial Temp
R
: Commercial Temp
& Reduced IDD6
U
: Commercial Temp
SPEED(tCL-tRCD-tRP)
TE
: DDR3-2133 14-14-14
RD
: DDR3-1866 13-13-13
PB
: DDR3-1600 11-11-11
H9
: DDR3-1333 9-9-9
G7
: DDR3-1066 7-7-7
S6
: DDR3-800 6-6-6
POWER CONSUMPTION
2)
& Low Power
3)
& Normal Power
4)
& Normal Power
1)
& 1.35 VDD Power
& 1.35 VDD Power
1)
1)
& 1.25 VDD Power
MODULE TYPE
: 240 pin Unbuffered DIMM
U
: 240 pin Registered DIMM
R
: 240 pin VLP Registered DIMM
V
: 204 pin Unbuffered SO-DIMM
S
: 240 pin LRDIMM
L
: 204 pin ECC SO-DIMM
A
: 204 pin SO-DIMM (Single Side)
B
: 240 pin VLP ECC UDIMM
E
: 244 pin ULP Mini UDIMM
M
DATA WIDTH
6
: x64
7
: x72
DIE GENERATION
M
: 1st
A
: 2nd
B
: 3rd
C
: 4th
Note:
1) Refer to respective datasheet for more module options
2) Commercial Temperature: 0°C ~ 85°C
3) Extended Temperature: -25°C ~ 85°C
4) Industrial Temperature: -40°C ~ 85°C
5) ROHS : Restriction Of Hazardous Substances
D
: 5th
E
: 6th
F
: 7th
G
: 8th
ORGANIZATION
4
8
6
PACKAGE MATERIAL
L
: Leaded
P
: Lead Free
: Lead Free & Halogen Free
R
(RoHS5) Compliant)
(RoHS5) Compliant)
PACKAGE TYPE
F
: FBGA SDP
(Single Die Package)
L
: FBGA DDP 1CS
(Dual Die Package)
M
: FBGA DDP 2CS
(Dual Die Package)
H
: FBGA QDP
(Quad Die Package)
: x4 Based
: x8 Based
: x16 Based
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