USB Register Definition 15.19. INMAX: USB0 IN Endpoint n Maximum Packet Size 160
USB Register Definition 15.20. EINCSRL: USB0 IN Endpoint Con trol Low Byte . . . . 163
USB Register Definition 15.21. EINCSRH: USB0 IN Endpoint Control High Byte . . . 164
USB Register Definition 15.22. OUTMAX: USB0 Out Endpoint Max Packet Size . . . 165
USB Register Definition 15.23. EOUTCSRL: USB0 OUT Endpoint Control High Byte 166
USB Register Definition 15.24. EOUTCSRH: USB0 OUT Endpoint Control Low Byte 167
USB Register Definition 15.25. EOUTCNTL: USB0 OUT Endpoint Count Low . . . . .167
USB Register Definition 15.26. EOUTCNTH: USB0 OUT Endpoint Count High . . . . 167
•Universal Serial Bus (USB) Function Controller with eight flexible endpoint pipes, integrated transceiver, and 1 k FIFO RAM
•Supply Voltage Regulator (5-to-3 V)
•True 10-bit 200 ksps 17-channel single-ended/differential ADC with analog multiplexer
•On-chip Voltage Reference and Temperature Sensor
•On-chip Voltage Comparators (2)
•Precision programmable 12 MHz internal oscillator and 4x clock multiplier
•16 kB of on-chip Flash memory
•2304 total bytes of on-chip RAM (256 + 1k + 1 k USB FIFO)
•SMBus/I2C, Enhanced UART, and Enhanced SPI serial interfaces implemented in hardware
•Four general-purpose 16-bit timers
•Programmable Counter/Timer Array (PCA) with five capture/compare modules and Watchdog Timer
function
•On-chip Power-On Reset, VDD Monitor, and Missing Clock Detector
•25/21 Port I/O (5 V tolerant)
With on-chip Power-On Reset, VDD monitor, Voltage Regulator, Watchdog Timer, and clock oscillator,
C8051F320/1 devices ar e truly stand-alo ne Sy s tem -on- a- Chip sol uti ons. T he Flas h mem ory can be repr o
grammed in-circuit, prov iding non -volatile data stor age, and also al lowing fiel d upgrades of the 8051 firmware. User software has c omplete control of all peripherals, and may individually shut down an y or all
peripherals for power savings.
Table 1.1 for specific product feature selection.
-
The on-chip Silicon Labs 2-Wire (C2) Development Interface allows non-intrusive (uses no on-chip
resources), full speed, in-circuit debugging using the production MCU installed in the final application. This
debug logic supports inspection and modification of memory and registers, setting breakpoints, single
stepping, run and halt commands. All a nalog and digital peripheral s are fully function al while debugging
using C2. The two C2 interface pins can be shared with user functions, allowing in-system debugging with
out occupying package pins.
Each device i s specifi ed for 2.7- to-3.6 V ope ration ove r the industr ial temper ature range (–4 0 to +85 °C).
(Note that 3.0-to-3.6
input signals up to 5
V is required for USB commu nication.) The Port I/O and /RST pins are tolerant of
V. C8051F320/1 are available in a 32-pin LQFP or a 28-pin QFN package.
The C8051F320/1 fami ly utilize s Silico n Labs' pr oprietary CIP-5 1 microcontr oller cor e. The CIP-51 is fully
compatible with the MCS-51™ instruction set; standard 803x/805x assemblers and compilers can be used
to develop software. The CIP-51 core offers all the perip herals included with a standard 8052, including
four 16-bit counter/time rs, a full-duplex UART with extended b aud rate configuration, an enha nced SPI
port, 2304
pins.
1.1.2. Improved Throughput
The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all ins truction s except for MU L and DIV take 12 or 24 syste m
clock cycles to execute wi th a maxi mum sys tem clo ck of 12-t o-24
cutes 70% of its instructions in one or two system clock cycles, with only four instructions taking more than
four system clock cycles.
The CIP-51 has a total of 109 instructions. The table below shows the total number of instructions that
require each execution time.
Number of Instructions265051473121
bytes of on-chip RAM, 128 by te Special Function Reg is ter ( SFR) ad dr ess s pace, a nd 2 5/2 1 I/O
MHz. By contrast, the CIP- 51 core exe-
Clocks to Execute122/333/444/558
1.1.3. Additional Features
The C8051F320/1 SoC family in cludes several key enha ncements to the CIP-51 core and peripher als to
improve performance and ease of use in end applications.
The extended interrupt handler provides 16 interrupt sources into the CIP-51 (as opposed to 7 for the standard 8051), allowing numerous analog and digital peripherals to interrupt the controller. An interrupt driven
system requires less intervention by the MCU, giving it more effective throughput. The extra interrupt
sources are very useful when building multi-tasking, real-time systems.
Nine reset sources are av ailable: power-on reset circuitry (PO R), an on-chip VDD monitor (forces rese t
when power supply vo ltage drops below V
(USB bus reset or a VB US tr an si tio n), a Watchdog Timer, a Missing Clock Detec tor, a voltage leve l d ete ction from Comparator0, a forc ed software reset, an extern al reset pi n, and an err ant Flash read /write protection circuit. Each reset source except for the POR, Reset Inpu t Pin, or Flash error ma y be disabled by
the user in software. The W DT may be permanently enabled in softw are after a power-on reset during
MCU initialization.
The internal oscillator is factory calibrated to 12 MHz ±1.5%, and the internal oscillator period may be user
programmed in ~0.2 5% incremen ts. A clock r ecovery mechani sm allo ws the int ernal osc illator to b e used
with the 4x Clock Multiplier as the USB clock source in Full Speed mode; the internal oscillator can also be
used as the USB clock source in Low Speed mode. External oscillators may also be used with the 4x Clock
Multiplier. An external oscillato r driv e circ uit is also incl uded, a llowin g an ex terna l crys tal, cer amic reso na
tor, capacitor, RC, or CMOS clock source to generate the system clock. The system clock may be configured to use the internal oscill ator, external oscillator, or the Clock Multip lier ou tput divid ed by 2. If desir ed,
the system clock s our ce may be switched on-the-fly between os c illato r sour c es. A n ex te rn al osci ll ato r ca n
be extremely useful in low power appl ications , allowi ng the MCU to run from a slow (pow er saving ) exter
nal clock source, while periodically switching to the internal oscillator as needed.
as given in Table 10.1 on page 104), the USB controller
RST
-
-
18Rev. 1.2
XTAL1
XTAL2
Internal
Oscillator
Clock
Multiplier
External
Oscillator
Drive
Px.x
Px.x
System
Clock
Clock Select
Comparator 0
+
-
Missing
Clock
Detector
(one-
shot)
EN
MCD
Enable
Microcontroller
Extended Interrupt
VDD
C0RSEF
CIP-51
Core
Handler
PCA
WDT
EN
WDT
Enable
Supply
Monitor
+
-
System Reset
Enable
Power On
Reset
Software Reset (SWRSF)
Errant
FLASH
Operation
C8051F320/1
'0'
(wired-OR)
Reset
Funnel
Enable
USB
Controller
VBUS
Transition
/RST
Figure 1.3. On-Chip Clock and Reset
1.2.On-Chip Memory
The CIP-51 has a standa rd 8051 program and data addr ess configuration. It inc ludes 256 bytes of data
RAM, with the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general
purpose RAM, and direct add ressing acce sses the 128 byte SF R address space. The lower 128 bytes of
RAM are accessible via direct and indirect addressing. The first 32 bytes are addressable as four banks of
general purpose registers, and the next 16 bytes can be byte addressable or bit addressable.
Program memory consists of 16 kB of Flash. This m emory may be r eprogrammed in-s ystem in 512 byte
sectors, and requir es no speci al off-chip progr amming vol tage. See
ory map.
Figure 1.4 for the MCU syst em mem-
Rev. 1.219
C8051F320/1
t
0
PROGRAM/DATA MEMORY
(Flash)
0x3E00
x3DFF
RESERVED
16 K Flash
(In-System
Programm ab le in 512
Byte Sectors)
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
INTERNAL DATA ADDRESS SPACE
Upper 128 RAM
(Indirect Addressing
(Direct and Indirect
Bit Addressable
General Purp os e
DATA MEMORY (RAM)
Only)
Addressing)
Registers
(Direct Addre ss ing Only)
Special Function
Register's
Lower 128 RAM
(Direct and Indirec
Addressing )
EXTERNAL DATA ADDRESS SPACE
0x0000
0xFFFF
Same 2048 bytes as from
0x0000 to 0x07FF, wrapped
on 2 kB boundaries
0x0800
0x07FF
USB FIFOs
0x0400
0x03FF
0x0000
1024 Bytes
XRAM - 1024 Bytes
(accessable using MOVX
instruction)
Figure 1.4. On-Board Memory Map
1.3.Universal Serial Bus Controller
The Universal Ser ial Bus Co ntroller (USB 0) is a US B 2.0 co mpliant Full or Low Speed function with integrated transceiver and endpoint FIFO RAM. A total of eight en dpoint pipes are available: a bi -directional
control endpoint (Endpoint0) and three pairs of IN/OUT endpoints (Endpoints1-3 IN/OUT).
A 1 k block of XRAM is used as dedicated USB FIFO space. This FIFO space is distributed among
Endpoints0–3; Endpoint1–3 FIFO slots can be c onfigured as IN, OUT, or both IN and OUT (split mode).
The maximum FIFO size is 512 bytes (Endpoint3).
USB0 can be operated as a Full or Low Speed function. On-chip 4x Clock Multiplier and clock recovery circuitry allow both Full and Low Speed options to be implemented with the on-chip precision oscillator as the
USB clock source. An ex ternal oscill ator sourc e can also be used with the 4x Cl ock Multi plier to generat e
the USB clock. The CPU clock source is independent of the USB clock.
20Rev. 1.2
C8051F320/1
The USB Transceiver is USB 2.0 compliant, and includes on-chip matching and pull-up resistors. The pullup resistors can be enabled/disabled in software, and will appear on the D+ or D– pin according to the soft
ware-selected speed setting (Full or Low Speed).
TransceiverSerial Interface Engine (SIE)
-
VDD
D+
Data
Transfer
Control
D-
Endpoint0
IN/OUT
Endpoint1
Endpoint2
Endpoint3
INOUT
INOUT
INOUT
USB FIFOs
(1k RAM)
USB
Control,
Status, and
Interrupt
Registers
CIP-51 Core
Figure 1.5. USB Controller Block Diagram
1.4.Voltage Regulator
C8051F320/1 devices include a 5-to-3 V voltage regulator (REG0). When enabled, the REG0 output
appears on the VDD pin and can be us ed to power external devices. REG 0 can be enabled/disabled by
software.
1.5.On-Chip Debug Circuitry
The C8051F320/1 devices include on-chip Silicon Labs 2-Wire (C2) debug circuitry that provides non-intrusive, full speed, in-circuit debugging of the production part installed in the end application.
Silicon Labs' debugging system supports inspection and modification of memory and registers, breakpoints, and single stepping. No additi onal target RAM , progra m memory, timers, or communication s channels are required. A ll th e digital and analog peri pher a ls ar e func ti ona l a nd work co rre ctl y whi le deb ugg ing .
All the peripherals (ex cep t for the US B, AD C, a nd S MBu s) are stall ed whe n the MCU is halted, during sin
gle stepping, or at a breakpoint in order to keep them synchronized.
The C8051F320DK development kit provides all the hardware and software necessary to develop application code and pe rform in- circuit debuggin g with the C8051F320/ 1 MCUs. T he kit in cludes software with a
developer's studio and debugger, 8051 assembler and linker, evaluation ‘C’ compiler, and a debug
adapter. It also has a target application board with the C8051F320 MCU installed, the necessary cables for
connection to a PC, and a wall-mount power supply. The development kit c ontents may also be used to
program and debug the de vi ce on the production PCB using the appro priat e c onn ec tio ns for th e pr og ram
ming pins.
The Silicon Labs IDE interf ace is a vas tly superio r developing and debuggi ng configur ation, compared t o
standard MCU emulators that use on-b oard "ICE Chips" and require the MCU in the application board t o
Rev. 1.221
-
-
C8051F320/1
be socketed. Silico n Labs' debug paradigm inc reases ease of use and p reserves the perfor mance of the
precision analog peripherals.
AC/DC
PC
Adapter
Target Board
PWR
SILICON LABORATORIES
MCU
P1.6
Port 2Port 0
Port 4Port 3Port 1
USB
Cable
USB Debug Adapter
USB DEBUG ADAPTER
Silicon Laboratories
StopPower
Run
P3.7RESET
Figure 1.6. Development/In-System Debug Diagram
1.6.Programmable Digital I/O and Crossbar
C8051F320 devices include 25 I/O pins (three byte-wide Ports and one 1-bit-wide Port); C8051F321
devices include 21 I/O pins (two byte-wide Ports, one 4-bit-wide Port, and one 1-bit-wide Port). The
C8051F320/1 Ports behave like typical 8051 Ports with a few enhancements. Each Port pin may be config
ured as an analog inp ut o r a di gital I/ O pin . Pi ns s ele ct ed a s d ig ital I/Os may a ddi tio nal ly be co nfi gured for
push-pull or open-dr a in outp ut. Th e “weak pull-ups” that are fix ed on ty pic al 80 51 dev ices m ay be globally
disabled, providing power savings capabilities.
The Digital Crossbar all ows m apping of internal digital sys tem r eso urces to Port I/O pins ( Se e Fig ur e 1.7).
On-chip counter/tim ers, serial buses, HW inter rupts, comparator outputs, and other d igital signals in the
controller can be configured to appear on the Port I/O pins specified in the Crossbar Control registers. This
allows the user to select the exact mix of general purpose Po rt I/O and digital resources needed fo r the
particular application.
-
22Rev. 1.2
C8051F320/1
Highest
Priority
Lowest
Priority
XBR0, XBR1,
PnSKIP Registers
PnMDOUT,
PnMDIN Registers
Priority
Decoder
(P0.0-P0.7)
(P1.0-P1.7)
(P2.0-P2.7)
(P3.0)
2
P0
4
2
2
2
6
2
8
8
8
8
Digital
Crossbar
8
I/O
Cells
P1
8
I/O
Cells
P2
8
I/O
Cells
P3
1
I/O
Cells
Note: P2.4-P2.7 only available
on the C8051F320
P0.0
P0.7
P1.0
P1.7
P2.0
P2.7
P3.0
UART
SPI
SMBus
CP0
Outputs
CP1
Outputs
SYSCLK
(Internal Dig it al Sign al s)
PCA
T0, T1
P0
P1
P2
(Port Latches)
P3
Figure 1.7. Digital Crossbar Diagram
1.7.Serial P orts
The C8051F320/1 F amily inc ludes an SM Bus/I2C interface, a full-duplex UA RT with enhanced baud rate
configuration, an d an Enhanced S PI interface. Eac h of the serial buses is fully implemented in hardware
and makes extensive use of the CIP-51's interrupts, thus requiring very little CPU intervention.
1.8.Programmable Counter Array
An on-chip Programmable Counter/Timer Array (PCA) is included in addition to the four 16-bit general purpose counter/timers. The PCA consists of a dedicated 16-bit counter/timer time base with five programmable capture/compare modules. The PCA clock is derived from one of six sources: the system clock divided
by 12, the system clock divided by 4, Timer 0 overflows, an External Clock Input (ECI), the system clock, or
the external oscilla tor c lock s ourc e di vi de d by 8 . T he ext er nal cloc k sour c e s ele ct ion is u sef ul for real - tim e
clock functional ity, where the PCA is cl ocked by an ext ernal sou rce while the int ernal osc illator d rives the
system clock.
Each capture/compare module can be configured to operate in one of six modes: Edge-Triggered Capture,
Software Timer, High Speed Output, 8- or 16-bit Pulse Width Modulator, or Frequency Output. Additionally,
Capture/Compare Module 4 offers watchdog timer (WDT) capabilities. Following a system reset, Module 4
is configured and enabled in WDT mode. The PCA Capture/Compare Module I/O and External Clock Input
may be routed to Port I/O via the Digital Crossbar.
Rev. 1.223
C8051F320/1
SYSCLK/12
SYSCLK/4
Timer 0 Overflow
ECI
SYSCLK
External Clock/8
PCA
CLOCK
MUX
16-Bit Counter/Timer
Capture/Compare
Module 0
ECI
CEX0
Capture/Compare
Module 1
CEX1
Capture/Compare
Module 2
CEX2
Capture/Compare
Module 3
CEX3
Capture/Compare
Module 4 / WDT
CEX4
Crossbar
Port I/O
Figure 1.9. PCA Block Diagram
1.9.10-Bit Analog to Digital Converter
The C8051F320/1 devices inclu de an on-chip 10-bit SAR ADC with a 17-channel differential input multiplexer. With a maximum throughput of 200 ksps, th e AD C offers tru e 10 -bit l in eari ty w ith an INL of ±1LSB.
The ADC system includ es a configurable ana log multiplexer that selects both positiv e and negative ADC
inputs. Ports1-3 are available as ADC inpu ts; additional ly, the on-chip Te mperat ure Sens or outpu t and the
power supply voltage (VDD) a re avai lable as ADC inputs. Us er firm ware ma y sh ut down the A DC to s ave
power.
Conversions can be started in six ways: a software command, an overflow of Timer 0, 1, 2, or 3, or an
external convert start signal. This flexibility allows the start of conversion to be triggered by software
events, a periodic sig nal (timer ove rflows), or e xternal HW sig nals. Convers ion completi ons are ind icated
by a status bit and an interrupt (if enable d). The resulting 10-bit data word is latched into the ADC da ta
SFRs upon completion of a conversion.
Window compare registers for the ADC data can be configured to interrupt the controller when ADC data is
either within or o utside of a specified range. Th e ADC can monitor a key v oltage continuously in back
ground mode, but not interrupt the controller unless the converted data is within/outside the specified
range.
C8051F320/1 devices include two on- chip voltage comparators tha t are enabled/disabled and configured
via user software. Port I/O pins may be configured as comparator inputs via a selection mux. Two compar
ator outputs may be routed to a Port pin if desired: a latched out put and/or an unlatch ed (asynchronous)
output. Comparator response tim e is programmable, allowin g the user to select between hig h-speed and
low-power modes. Positive and negative hysteresis are also configurable.
Comparator interrupts may be generated on rising, falling, or both edges. When in IDLE mode, these interrupts may be used as a “wake-up” source. Comparator0 may also be configured as a reset source.
Figure 1.11 shows the Comparator0 block diagram.
-
Rev. 1.225
C8051F320/1
CMX0N1
CMX0N0
CPT0MX
CMX0P1
CMX0P0
P1.0
P1.4
P2.0
P2.4
P1.1
P1.5
P2.1
P2.5
CP0EN
CP0OUT
CP0RIF
CP0FIF
CP0HYP1
CPT0CN
CP0HYP0
CP0HYN1
CP0HYN0
CP0 +
CP0 -
VDD
CP0
Interrupt
CP0
Rising-edg e
Interrupt
Logic
+
-
SET
D
(SYNCHRONIZER)
SET
D
Q
Q
CLR
CLR
Q
Q
Crossbar
GND
CP0
Falling-edge
CP0RIE
CP0FIE
CP0
CP0A
Reset
Decision
Tree
Note: P2.4 and P2.5 availab le
only on C8051F320
Figure 1.11. Comparator0 Block Diagram
CP0RIE
CP0FIE
CPT0MD
CP0MD1
CP0MD0
26Rev. 1.2
C8051F320/1
2.Absolute Maximum Ratings
Table 2.1. Absolute Maximum Ratings
ParameterConditionsMinTypMaxUnits
Ambient temperature under bias
Storage Temperature–65—150°C
Voltage on any Port I/O Pin or /RST with
respect to GND
Voltage on VDD with respect to GND–0.3—4.2V
Maximum Total current through VDD and
GND
Maximum output current sunk by /RST or any
Port pin
Note: Stresses above tho se list ed under “Abs olute Maximum Rating s” may ca use perm anent damage to the devic e.
This is a stress rating only and f unctional operation of the d evices a t those or a ny other c onditions ab ove tho se
indicated in the o peration l istings of this spe cificati on is not implied . Exposur e to max imum rati ng condi tions for
extended periods may affect device reliability.
–55—125°C
–0.3—5.8V
——500mA
——100mA
Rev. 1.227
C8051F320/1
3.Global Electrical Characteristics
Table 3.1. Global Electrical Characteristics
–40 to +85 °C, 25 MHz system clock unless otherwise noted.
ParameterConditionsMinTypMaxUnits
1,2
Digital Supply Voltage
Digital Supply RAM Data
V
RST
-1.5—V
Retention Voltage
SYSCLK (System Clock)
T
(SYSCLK High Ti me)
SYSH
T
(SYSCLK Low Time)
SYSL
Specificed Operating Tem-
3
0—25MHz
18——ns
18——ns
–40—+85°C
perature Range
Digital Supply Current - CPU Active (Normal Mode, fetching instructions from Flash)
IDD
4
VDD = 3.6 V; F = 25 MHz—12.313.6mA
VDD = 3.3 V, F = 24 MHz—10.611.5mA
VDD = 3.3 V, F = 6 MHz—3.2—mA
VDD = 3.3 V, F = 32 kHz—38—uA
VDD = 3.0 V, F = 24 MHz—9.09.8mA
VDD = 3.0 V, F = 6 MHz—2.7—mA
VDD = 3.0 V, F = 32 kHz—32—uA
IDD Supply Sensitivity
4
F = 24 MHz—0.66—%/V
F = 6 MHz—0.63—%/V
4,5
IDD Frequency Sensitivity
VDD = 3.0 V, F < 15 MHz, T = 25 °C—0.45—mA/MHz
VDD = 3.0 V, F > 15 MHz, T = 25 °C—0.26—mA/MHz
VDD = 3.3 V, F < 15 MHz, T = 25 °C—0.53—mA/MHz
VDD = 3.3 V, F > 15 MHz, T = 25 °C—0.29—mA/MHz
Digital Supply Current - CPU and USB Active (USB Transceiver Enabled and Connected to PC)
IDD
4
VDD = 3.3 V, F = 24 MHz, Full Speed—16.8—mA
VDD = 3.0 V, F = 24 MHz, Full Speed—14.4—mA
VDD = 3.3 V, F = 6 MHz, Low Speed—7.2—mA
VDD = 3.0 V, F = 6 MHz, Low Speed—6.0—mA
3.03.6V
Digital Supply Current - CPU Inactive (Idle Mode, not fetching instructions from Flash)
IDD
4
VDD = 3.6 V; F = 25 Mhz—5.86.5mA
VDD = 3.3 V, F = 24 MHz—5.25.9mA
VDD = 3.3 V, F = 6 MHz—1.7—mA
VDD = 3.3 V, F = 32 kHz—14—uA
VDD = 3.0 V, F = 24 MHz—4.65.2mA
VDD = 3.0 V, F = 6 MHz—1.5—mA
VDD = 3.0 V, F = 32 kHz—11—uA
28Rev. 1.2
C8051F320/1
Table 3.1. Global Electrical Characteristics (Continued)
–40 to +85 °C, 25 MHz system clock unless otherwise noted.
ParameterConditionsMinTypMaxUnits
IDD Supply Sensitivity
IDD Frequency Sensitivity
4
4,6
VDD = 3.0 V, F < 1 MHz, T = 25 °C—0.25—mA/MHz
VDD = 3.0 V, F > 1 MHz, T = 25 °C—0.17—mA/MHz
VDD = 3.3 V, F < 1 MHz, T = 25 °C—0.29—mA/MHz
VDD = 3.3 V, F > 1 MHz, T = 25 °C—0.20—mA/MHz
Digital Supply Current
(Stop Mode)
Notes:
1. Given in Table 10.1, “Reset Electrical Characteristics,” on page 104.
2. USB requires a minimum supply voltage of 3.0 V.
3. SYSCLK must be at least 32 kHz to enable debugging.
4. Based on device characterization data; Not production tested.
5. IDD can be estimated for frequencies < 15 MHz by simply multiplying the frequency of interest by the
frequency sensitivity number for that range. When using these numbers to estimate IDD for >15
estimate should b e the cur rent at 24
number. For example: VDD
20 MHz) x 0.26 mA/MHz = 7.96 mA.
6. Idle IDD can be estimated for frequencies < 1 MHz by simply multiplying the frequency of interest by the
frequency sensitivity number for that range. When using these numbers to estimate Idle IDD for >1
estimate should b e the cur rent at 24
number. For example: VDD
5 MHz) x 0.17 mA/MHz = 1.37 mA.
= 3.0 V; F = 20 MHz, IDD = 9.0 mA – (24 MHz –
= 3.0 V; F = 5 MHz, Idle IDD = 4.6 mA – (24 MHz –
F = 24 MHz—0.47—%/V
F = 6 MHz—0.50—%/V
Oscillator not running,
Monitor disabled
V
DD
MHz minus the d if fere nce i n curre nt ind icated by th e frequ ency sens itivit y
MHz minus the d if fere nce i n curre nt ind icated by th e frequ ency sens itivit y
—<0.1—uA
MHz, the
MHz, the
Table 3.2. Index to Electrical Characteristics Tables
Peripheral Electrical CharacteristicsPage #
ADC0 Electrical Characteristics
Voltage Reference Electrical Characteristics
Comparator Electrical Characteristics
Voltage Regulator Electrical Characteristics
Reset Electrical Characteristics
Flash Electrical Characteristics
Internal Oscillato r Elec tri cal Char ac teri st ic s
Port I/O DC Electrical Characteristics
53
55
65
67
104
106
124
137
Rev. 1.229
C8051F320/1
4.Pinout and Package Definitions
Table 4.1. Pin Definitions for the C8051F320/1
Name
VDD66
GND33Ground.
/RST/
C2CK
P3.0/
C2D
REGIN
VBUS88D In
D+44D I/OUSB D+.
D-55D I/OUSB D–.
P0.022D I/OPort 0.0. See Section 14 for a complete description of Port 0.
P0.111D I/OPort 0.1.
P0.2/
Pin Numbers
‘F320‘F321
99
1010
77
TypeDescription
Power In
Power
Out
D I/O
D I/O
D I/O
D I/O
Power In 5 V Regulator Input. This pin is the input to the on-chip volt-
D I/O
2.7-3.6 V Power Supply Voltage Input.
3.3 V Voltage Regulator Output. See Section 8.
Device Reset. Open-drain output of internal POR or VDD
monitor. An external source can initiate a system reset by
driving this pin low for at least 15
Clock signal for the C2 Debug Interface.
Port 3.0. See Section 14 for a complete description.
Bi-directional data signal for the C2 Debug Interface.
age regulator.
VBUS Sense Input. This pin should be connected to the
VBUS signal of a USB network. A 5
cates a USB network connection.
Port 0.2.
µs. S ee Section 10.
V signal on this pin indi-
3228
XTAL1
P0.3/
3127
XTAL2
P0.43026D I/OPort 0.4.
P0.52925D I/OPort 0.5.
P0.6/
2824
CNVSTR
P0.7/
2723
VREF
P1.02622
30Rev. 1.2
A In
D I/O
A I/O or
D In
D I/O
A I/O
D I/O or
A In
External Clock Input. This pin is the external oscillator return
for a crystal or resonator. See
Port 0.3.
External Clock Output. This pin is the excitation driver for an
external crystal or resonator, or an external clock input for
CMOS, capacitor, or RC oscillator configurations. See
tion 13.
Port 0.6.
ADC0 External Convert Start Input. See Section 5.
Port 0.7.
External VREF input or output. See Section 6.
Port 1.0. See Section 14 for a complete description of Port 1.
Section 13.
Sec-
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