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SX-SDMAC-2832S
User Manual
27 pgs1.52 Mb0

Silex technology SX-SDMAC-2832S User Manual

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© silex technology, Inc.
SX-SDMAC-2832S/SX-SDMAC-2832S+
User’s Manual
JW204430XX
July 13, 2017
Drawing No.：JW204430XX
Date：July 13, 2017
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CONFIDENTIAL
© silex technology, Inc.
Revision history
Rev.
Description
Date
Prepared by
Checked by
Approved by
XX
The 1st draft version.
Jul.13,17
K.Yoshikawa
Y.Kuroda
Y.Shibuya
Drawing No.：JW204430XX
Date：July 13, 2017
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© silex technology, Inc.
Index
1. Product introduction ....................................................................................................................................................................................... 4
2. Hardware block diagram................................................................................................................................................................................ 6
3. Board specifications ....................................................................................................................................................................................... 7
3.1. General specifications .....................................................................................................................................................7
3.2. Environmental conditions ................................................................................................................................................7
3.3. Electrical specifications ...................................................................................................................................................8
3.4. Current consumption specifications .......................................................................................................................... 10
3.5. Wireless LAN general specifications ......................................................................................................................... 11
3.6. Wireless LAN transmitter specifications ................................................................................................................... 13
3.7. Wireless LAN Receiver specifications ....................................................................................................................... 14
3.8. Bluetooth general specifications ................................................................................................................................ 16
3.9. Bluetooth Transmitter specifications ......................................................................................................................... 16
3.10. Bluetooth Receiver specifications .............................................................................................................................. 16
4. Signal pin specifications .............................................................................................................................................................................. 17
4.1. Pin locations.................................................................................................................................................................... 17
4.2. Signal specifications...................................................................................................................................................... 18
5. Mechanical Specifications .......................................................................................................................................................................... 20
6. Indication specifications .............................................................................................................................................................................. 21
7. System requirements and quick start guide .......................................................................................................................................... 22
8. Notifications .................................................................................................................................................................................................... 24
Drawing No.：JW204430XX
Date：July 13, 2017
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© silex technology, Inc.
This document describes about SX-SDMAC-2832S and SX-SDMAC-2832S+. Hereinafter called “SX-SDMAC-2832”.
1. Product introduction
The SX-SDMAC-2832S is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac Wave2 WLAN + Bluetooth 4.2 BR/EDR/LE SDIO3.0 combo radio module based on Qualcomm QCA9377-3 chipset. The SX-SDMAC-2832 highly integrates MAC, Base band, RF, RF front end and peripheral circuitry like power unit, reference clock, etc. The SX-SDMAC-2832 has a MHF-I connector as connection interface for an add-on antenna.
SX-SDMAC-2832S/SX-SDMAC-2832S+
Drawing No.：JW204430XX
Date：July 13, 2017
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© silex technology, Inc.
Features
￭ IEEE802.11a/b/g/n/ac Wave2 compliant (2.4 GHz, 5 GHz)
￭ 1 spatial data stream system (1T1R)
￭ 5 GHz : Support 20/40/80 MHz bandwidth mode (PHY Data rate 433 Mbps)
2.4 GHz : Support 20/40 MHz bandwidth mode (PHY Data rate 150 Mbps,Extra PHY Data rate 200Mbps) *20/40MHz Co-existence is not supported.
PHY Data Rate
￭ 802.11b/g 1-54 Mbps ￭ 802.11a 6-54 Mbps ￭ 802.11n MCS0-7 High Speed mode (HT mode) ￭ 802.11ac MCS0-9 Very High Speed mode (VHT mode)
￭ Bluetooth 4.2 BR/EDR/LE(Class2). Backward-compatible to Bluetooth 1.x, 2.x, 3.0, 4.0 (Support LE Data Length Extension)
￭ SDIO3.0 as the Wireless LAN host interface
￭ UART as the Bluetooth host interface
￭ +3.3V main power supply and selectable +1.8V/+3.3V IO power supply
￭ EU RoHS directive 2011/65/EC (Lead Free), (EU)/2015/863 compliant
Drawing No.：JW204430XX
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© silex technology, Inc.
2. Hardware block diagram
Acronyms
PMU
Power Management Unit
IPD LPF
Integrated Passive Device type Low Pass Filter
IPD DPX
Integrated Passive Device type Diplexer
MHF-I
MHF-I co-axial connector (I-PEX) or compatible connector
NOTE1：WLAN and Bluetooth don’t work in the same time because of TDMA (Time Domain Multiple Access) protocol. NOTE2：All power input (+3.3V and +1.1V) used for RF are regulated/compensated in the module.
Drawing No.：JW204430XX
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© silex technology, Inc.
3. Board specifications
3.1. General specifications
Items
Specifications
Units
Remarks
Connection with the host board
44-pin Land Grid Array (Direct solder)
－
Antenna port
MHF1 connector x1
pc
Host interface
SDIO v3.0
－
For Wireless LAN
UART
－
For Bluetooth, up to 4Mbps
RF interface
IEEE802.11a/b/g/n/ac
－
IEEE802.11-2012 IEEE802.11ac-2013
Bluetooth 4.2 BR/EDR/LE
－
Dimensions
W x H x D
17.0 x 18.0 x 2.6
mm
3.2. Environmental conditions
Items
Specifications
Units
Remarks
Min.
Typ.
Max.
Recommended operating temperature
-20 － +85
℃
Ambient temperature
Recommended operating humidity
15 － 93
%RH
No condensing
Recommended strage temperature
-20 － +95
℃
Ambient temperature
Recommended strage humidity
10 － 95
%RH
No condensing
Drawing No.：JW204430XX
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© silex technology, Inc.
3.3. Electrical specifications
Absolute maximum rating
Items
Specifications
Units
Remarks
Min.
Typ.
Max.
Main power supply (VDD)
-0.30
－
+3.65
V
IO power supply voltage (VDD_GPIO_1, VDD_GPIO_2)
-0.30
－
+4.00
V
SDIO power supply voltage (VDD_SDIO)
-0.30
－
+4.00
V
Recommended operating conditions Main power supply/Bluetooth power supply
Items
Specifications
Units
Remarks
Min.
Typ.
Max.
Main power supply (VDD)
+3.135
+3.30
+3.465
V
IO power supply/SDIO power supply with +3.3V operation
Items
Specifications
Units
Remarks
Min.
Typ.
Max.
IO power supply voltage (VDD_GPIO_1, VDD_GPIO_2)
+3.14
+3.30
+3.46
V
SDIO power supply voltage (VDD_SDIO)
+3.14
+3.30
+3.46
V
IO power supply/SDIO power supply with +1.8V operation
Items
Specifications
Units
Remarks
Min.
Typ.
Max.
IO power supply voltage (VDD_GPIO_1, VDD_GPIO_2)
+1.71
+1.80
+1.89
V
SDIO power supply voltage (VDD_SDIO)
+1.71
+1.80
+1.89
V
※All voltage source for the analog RF power supply is internally regulated in the module, and RF performance described in this
document is not affected by any variation for external power source.
Drawing No.：JW204430XX
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© silex technology, Inc.
Digital logic signal level
1) VIO (VDD_GPIO_1, VDD_GPIO_2, VDD_SDIO) = +3.3V operation
Items
Parameters
Specifications
Units
Remarks
Output/Input
current
Min.
Typ.
Max.
VIH
Input High voltage
－
0.7 x VIO
+3.3
VIO + 0.3
V
VIL
Input Low voltage
－
-0.3
－
0.3 x VIO
V
VOH
Output High voltage
IOH = 3mA
VIO - 0.4
－ － V
VOL
Output Low voltage
IOL = -11mA
－
－
0.1 x VIO
V
2) VIO (VDD_GPIO_1, VDD_GPIO_2, VDD_SDIO) = +1.8V operation
Items
Parameters
Specifications
Units
Remarks
Output/Input
current
Min.
Typ.
Max.
VIH
Input High voltage
－
0.7 x VIO
+1.8
VIO + 0.2
V
VIL
Input Low voltage
－
-0.3
－
0.3 x VIO
V
VOH
Output High voltage
IOH = 3mA
VIO - 0.4
－
VIO
V
VOL
Output Low voltage
IOL = -11mA
－
－
0.1 x VIO
V
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