Silex Technology SXPCEACDB User Manual
CONFIDENTIAL
Title:
PCI Express Half mini card WLAN module
SX-PCEAC-DB
Drawing Type : User’s manual
Date : March 18, 2016
© silex technology, Inc.
(1/18)
CONFIDENTIAL
Revision History
Rev.
1
Description Date Prepared Checked Approved
The first edition. Mar.18,16 K.Yoshikawa Y.Shibuya T.Kometani
© silex technology, Inc.
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CONFIDENTIAL
Table of Contents
1. Introduction ............................................................................. 4
2. Overview ................................................................................. 4
3. Hardware system block diagram ............................................................ 5
4. Board specifications ..................................................................... 6
4.1. General specifications ......................................................... 6
4.2. Environmental specifications ................................................... 6
4.3. Electrical specifications ...................................................... 7
4.4. Wireless LAN general specifications .............................................. 8
5. Connector interface specifications ....................................................... 10
5.1. PCI Express Mini Card edge pin assignments .................................... 10
6. Mechanical Specifications ............................................................... 12
7. System requirements and quick start guide ................................................ 13
8. Notifications ........................................................................... 15
© silex technology, Inc.
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1. Introduction
This document describes about hardware specifications of “SX-PCEAC-DB”.
2. Overview
SX-PCEAC-DB is the radio module which supports Dual Band IEEE802.11ac/a/b/g/n and PCI express
1.1. This module complies with EU RoHS Directive 2011/65/EC(Lead Free). This module is made up
of an Chipset QCA9880-BR4A (Qualcomm Atheros) which contains a MAC/BBP, 2.4GHz RF front end
circuits and a 5GHz RF front end module AWL9581(Anadigics). Also this module supports high speed
3x3 SU-MIMO and 80MHz bandwidth.
Features
❑ IEEE 802.11ac/a/b/g/n conformity (2.4GHz & 5GHz)
❑ Supports the 3 streams 3 x 3 SU-MIMO system and 80MHz band width for 5GHz.
❑ Data rates of 1 - 54 Mbps for 802.11b/g, 6 - 54 Mbps for 802.11a, MCS0-7 for 802.11n and
❑ Supports IEEE802.11e, IEEE 802.11h and IEEE 802.11i.
❑ Supports PCI express 1.1 as the host IF of wireless LAN
* Not supported MU-MIMO and 160MHz bandwidth.
(Throughput up to 1300Mbps)
MCS0-9 for 802.11ac.
© silex technology, Inc.
Date：March 18, 2016
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3. Hardware system block diagram
① QCA9880 Wireless Lan base band IC. Generates base band signal.
② Low pass filter Cuts off signal above 2.5GHz.
③ Band pass filter Cuts off signal under 5GHz and above 6GHz.
④ Single pole double throw switch Switches Tx and Rx of 2.4GHz.
⑤ Fron end module Integrates a 5GHz power amplifier, a 5GHz low noise and
Tx/Rx select swtich.
⑥ Single pole double throw switch Switches 2.4GHz and 5GHz.
⑦ Co-axial connector
⑧ Crystal driver Generates 40MHz system clock.
⑨ Voltage stabilizer
⑩ Switching regulator
NOTE1
Antenna port. MHF4 type.
NOTE2
Stabilize +3.3VDC for RF.
NOTE2
Coverts +3.3VDC to +1.2VDC.
NOTE1
Any signals of 1 stream data, 2 stream data and 3 stream data is output from three antennas.
NOTE2
Any voltage source for RF parts are generated/stabilized on the module.(RF +3.3V, RF +1.2V)
RF performance shown in the product spec is not affected by any behaviors of external +3.3V supply.
© silex technology, Inc.
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4. Board specifications
4.1. General specifications
Items Specifications Units
Connector Type PCI express mini card edge －
Antenna connectors MHF4 Alternative connector x 3 pcs
Device Interfaces PCI Express Mini Card v1.2 －
RF Interface
MTBF 90,000 h Min.
IEEE802.11ac/a/b/g/n -
Signal definitions : PCI
Express v1.1
4.2. Environmental specifications
Remarks
Items
Operating Temperature
Operating humidity 20 － 80 %RH
Assembled storage
temperature
Storage humidity 20 － 85 %RH
Specifications
Units
Min. Typ. Max.
-20 － +60 ℃
-20 － +85 ℃ After assembled with no-powered
Remarks
Case temperature
After assembled with powered
Non condensing
After assembled with powered
Non condensing
After assembled with no-powered
© silex technology, Inc.
Date：March 18, 2016
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