Siemens SMBT6427 Datasheet

NPN Silicon Darlington Transistor SMBT 6427
For general amplifier applications
High collector current
High current gain
Type Ordering Code
SMBT 6427 Q68000-A8320s1V SOT-23
Marking
(tape and reel)
Pin Configuration
1 2 3
B E C
Package
Maximum Ratings Parameter Symbol Values Unit
Collector-emitter voltage V
CE0 40 V
Collector-base voltage VCB0 40 Emitter-base voltage VEB0 12 Collector current I
C 500 mA
Peak collector current ICM 800
tot 360 mW
Total power dissipation, T
S =74˚C
Junction temperature T Storage temperature range T
P
j 150 ˚C stg – 65 … + 150
Thermal Resistance
Junction - ambient
Rth JA 280 K/W
Junction - soldering point Rth JS 210
1)
For detailed information see chapter Package Outlines.
2)
Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group 1
5.91
Electrical Characteristics
I
I
I I I
I I
I
I
I
I
A = 25 ˚C, unless otherwise specified.
at T
SMBT 6427
Parameter Symbol
UnitValues
min. typ. max.
DC characteristics
C = 10 mA
Collector-base breakdown voltage
C = 100 µA
Emitter-base breakdown voltage, I
V
(BR)CE0 40
V
(BR)CB0 40
E = 10 µA V(BR)EB0 12
VCollector-emitter breakdown voltage
Collector-base cutoff current
CB = 30 V, IE = 0
V
CB = 30 V, IE = 0, TA = 150 ˚C
V
CE = 30 V, IB = 0
V
EB = 10 V, IC = 0
V
C = 10 mA, VCE = 5 V C = 100 mA, VCE = 5 V C = 500 mA, VCE = 5 V
C = 50 mA, IB = 0.5 mA C = 500 mA, IB = 0.5 mA
Base-emitter saturation voltage
C = 500 mA, IB = 0.5 mA
Base-emitter voltage
C = 50 mA, VCE = 5 V
1)
1)
CB0
I
– –
I
CE0 ––1
I
EB0 ––50
– –
50 10
hFE
10000 20000 14000
CEsat
V
– –
V
BEsat 2.0
V
BE(on) 1.75
– – –
– –
100000 200000 140000
1.2
1.5
nA
µA µACollector cutoff current
nAEmitter-base cutoff current
DC current gain
VCollector-emitter saturation voltage
AC characteristics
C = 50 mA, VCE = 5 V, f = 100 MHz
CB = 10 V, f = 1 MHz
V
Input capacitance
EB = 0.5 V, f = 1 MHz
V
C = 1 mA, VCE = 5 V, RS = 100 k
f
T 130
C
obo ––7
C
ibo ––25
NF ––10
MHzTransition frequency
pFOutput capacitance
dBNoise figure
f = 1 kHz to 15 kHz
1)
Pulse test conditions: t 300 µs, D 2 %.
Semiconductor Group 2
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