NPN Silicon Darlington Transistor SMBT 6427
● For general amplifier applications
● High collector current
● High current gain
Type Ordering Code
SMBT 6427 Q68000-A8320s1V SOT-23
Marking
(tape and reel)
Pin Configuration
1 2 3
B E C
Package
Maximum Ratings
Parameter Symbol Values Unit
Collector-emitter voltage V
CE0 40 V
Collector-base voltage VCB0 40
Emitter-base voltage VEB0 12
Collector current I
C 500 mA
Peak collector current ICM 800
tot 360 mW
Total power dissipation, T
S =74˚C
Junction temperature T
Storage temperature range T
P
j 150 ˚C
stg – 65 … + 150
Thermal Resistance
1)
Junction - ambient
2)
Rth JA ≤ 280 K/W
Junction - soldering point Rth JS ≤ 210
1)
For detailed information see chapter Package Outlines.
2)
Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group 1
5.91
Electrical Characteristics
A = 25 ˚C, unless otherwise specified.
at T
SMBT 6427
Parameter Symbol
UnitValues
min. typ. max.
DC characteristics
C = 10 mA
Collector-base breakdown voltage
C = 100 µA
Emitter-base breakdown voltage, I
V
(BR)CE0 40 – –
V
(BR)CB0 40 – –
E = 10 µA V(BR)EB0 12 – –
VCollector-emitter breakdown voltage
Collector-base cutoff current
CB = 30 V, IE = 0
V
CB = 30 V, IE = 0, TA = 150 ˚C
V
CE = 30 V, IB = 0
V
EB = 10 V, IC = 0
V
C = 10 mA, VCE = 5 V
C = 100 mA, VCE = 5 V
C = 500 mA, VCE = 5 V
C = 50 mA, IB = 0.5 mA
C = 500 mA, IB = 0.5 mA
Base-emitter saturation voltage
C = 500 mA, IB = 0.5 mA
Base-emitter voltage
C = 50 mA, VCE = 5 V
1)
1)
CB0
I
–
–
I
CE0 ––1
I
EB0 ––50
–
–
50
10
hFE
10000
20000
14000
CEsat
V
–
–
V
BEsat – – 2.0
V
BE(on) – – 1.75
–
–
–
–
–
100000
200000
140000
1.2
1.5
nA
µA
µACollector cutoff current
nAEmitter-base cutoff current
–DC current gain
VCollector-emitter saturation voltage
AC characteristics
C = 50 mA, VCE = 5 V, f = 100 MHz
CB = 10 V, f = 1 MHz
V
Input capacitance
EB = 0.5 V, f = 1 MHz
V
C = 1 mA, VCE = 5 V, RS = 100 kΩ
f
T 130 – –
C
obo ––7
C
ibo ––25
NF ––10
MHzTransition frequency
pFOutput capacitance
dBNoise figure
f = 1 kHz to 15 kHz
1)
Pulse test conditions: t ≤ 300 µs, D ≤ 2 %.
Semiconductor Group 2