Siemens SIMATIC CPU 410, SIMATIC 410 SMART, SIMATIC PCS 7 System Manual

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SIMATIC

PCS 7 process control system CPU 410 Process Automation/CPU 410 SMART

System Manual

05/2017

A5E31622160

Preface

Introduction to the CPU 410

Configuration of the CPU 410

PROFIBUS DP

PROFINET IO

I/O configuration variants

System and operating states of the CPU 410

Link-up and update

Special functions of the CPU 410

Time synchronization and time stamping

Plant changes in RUN - CiR

Plant changes during redundant operation - H-CiR

Replacement of failed components during redundant operation

Synchronization modules

System expansion card

Technical data

Properties and technical specifications of CPU 410 SMART

Supplementary information

Characteristic values of redundant automation systems

Function and communication modules that can be used in a redundant configuration

Connection examples for redundant I/Os

-AC

Siemens AG Division Process Industries Postfach 48 48 90026 NÜRNBERG GERMANY

A5E31622160-AC

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06/2017 Subject to change

1 Preface ................................................................................................................................................. 17

2 Introduction to the CPU 410 .................................................................................................................. 23

3 Configuration of the CPU 410 ................................................................................................................ 35

4 PROFIBUS DP ..................................................................................................................................... 49

5 PROFINET IO ....................................................................................................................................... 51

6 I/O configuration variants ...................................................................................................................... 55

1.1 Preface .................................................................................................................................... 17

1.2 Security information ................................................................................................................ 20

1.3 Documentation ........................................................................................................................ 21

2.1 Area of application of the CPU 410 in SIMATIC PCS 7 ......................................................... 23

2.2 Possible applications .............................................................................................................. 25

2.3 The CPU 410 basic system for stand-alone operation ........................................................... 27

2.4 The basic system for redundant operation ............................................................................. 28

2.5 Rules for H station assembly .................................................................................................. 30

2.6 I/O for the CPU 410 ................................................................................................................ 30

2.7 I/O configuration variants of the fault-tolerant system ............................................................ 31

2.8 Configuration tools (STEP 7 HW Config, SIMATIC PCS 7) ................................................... 31

2.9 The SIMATIC PCS 7 project ................................................................................................... 31

2.9.1 Scaling and licensing (scaling concept) .................................................................................. 32

3.1 Operator controls and indicators on the CPU 410 .................................................................. 35

3.2 CPU 410 monitoring functions ................................................................................................ 39

3.3 Status and error displays ........................................................................................................ 41

3.4 PROFIBUS DP interface (X1) ................................................................................................. 45

3.5 PROFINET IO interfaces (X5, X8) .......................................................................................... 45

3.6 Summary of parameters for CPU 410 .................................................................................... 48

4.1 CPU 410 as PROFIBUS DP master ....................................................................................... 49

4.2 Diagnostics of the CPU 410 as PROFIBUS DP master ......................................................... 49

5.1 Introduction ............................................................................................................................. 51

5.2 PROFINET IO systems ........................................................................................................... 52

5.3 Device replacement without exchangeable medium / ES ...................................................... 53

6.1 Stand-alone operation............................................................................................................. 55

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Table of contents

7 System and operating states of the CPU 410 ....................................................................................... 101

8 Link-up and update .............................................................................................................................. 119

6.2 Fail-safe operation ................................................................................................................. 58

6.3 Fault-tolerant automation systems (redundancy operation) .................................................. 61

6.3.1 Redundant SIMATIC automation systems ............................................................................. 61

6.3.2 Increase of plant availability, reaction to errors ..................................................................... 62

6.4 Introduction to the I/O link to fault-tolerant system ................................................................ 65

6.5 Using single-channel switched I/O ......................................................................................... 66

6.6 Versions of I/O connection to the PROFINET IO interface .................................................... 73

6.6.1 Use of I/O connected to the PROFINET IO interface, system redundancy ........................... 73

6.6.2 Redundant I/O in an ET 200SP HA ....................................................................................... 76

6.7 Connection of two-channel I/O to the PROFIBUS DP interface ............................................ 80

6.7.1 Connecting redundant I/O ...................................................................................................... 80

6.7.2 Signal modules for redundancy ............................................................................................. 83

6.7.3 Evaluating the passivation status ........................................................................................... 97

6.8 Media redundancy ................................................................................................................. 97

7.1 CPU 410 operating modes ................................................................................................... 101

7.1.1 RUN mode ........................................................................................................................... 101

7.1.2 STOP mode ......................................................................................................................... 102

7.1.3 STARTUP mode .................................................................................................................. 103

7.1.4 HOLD mode ......................................................................................................................... 104

7.1.5 LINK-UP and UPDATE modes ............................................................................................ 105

7.1.6 ERROR-SEARCH mode ...................................................................................................... 105

7.1.7 DEFECTIVE state ................................................................................................................ 106

7.2 System states of the redundant CPU 410 ........................................................................... 107

7.2.1 Introduction .......................................................................................................................... 107

7.2.2 The system states of the fault-tolerant system .................................................................... 109

7.2.3 Displaying and changing the system state of a fault-tolerant system .................................. 110

7.2.4 System status change from the STOP system state ........................................................... 110

7.2.5 System status change from the standalone mode system status ....................................... 111

7.2.6 System status change from the redundant system state ..................................................... 111

7.2.7 System diagnostics of a fault-tolerant system ..................................................................... 112

7.3 Self-test ................................................................................................................................ 114

7.4 Performing a memory reset ................................................................................................. 117

8.1 Effects of link-up and updating ............................................................................................. 119

8.2 Link-up and update via an ES command ............................................................................. 120

8.3 Time monitoring ................................................................................................................... 120

8.3.1 Time response ..................................................................................................................... 123

8.3.2 Determining the monitoring times ........................................................................................ 123

8.3.3 Performance values for link-up and update ......................................................................... 130

8.3.4 Influences on time response ................................................................................................ 130

8.4 Special features in link-up and update operations ............................................................... 131

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9 Special functions of the CPU 410 ........................................................................................................ 133

10 Time synchronization and time stamping ............................................................................................. 151

11 Plant changes in RUN - CiR ................................................................................................................ 155

9.1 Security functions of the CPU 410 ........................................................................................ 133

9.2 Security levels ....................................................................................................................... 134

9.3 Security event logging........................................................................................................... 136

9.4 Field Interface Security ......................................................................................................... 139

9.5 Access-protected blocks ....................................................................................................... 139

9.6 Retentive load memory ......................................................................................................... 140

9.7 Type update with interface change in RUN .......................................................................... 141

9.8 Resetting the CPU 410 to delivery condition (reset to factory setting) ................................. 142

9.9 Reset during operation.......................................................................................................... 143

9.10 Response to fault detection .................................................................................................. 144

9.11 Reading service data ............................................................................................................ 145

9.12 Updating firmware in stand-alone operation ......................................................................... 146

9.13 Updating firmware in redundant mode.................................................................................. 148

11.1 Motivation for CiR via PROFINET IO .................................................................................... 155

11.2 Permitted changes over PROFINET IO ................................................................................ 157

11.3 Procedure for PROFINET IO ................................................................................................ 158

11.3.1 Overview ............................................................................................................................... 158

11.3.2 Add IO devices or I/O modules ............................................................................................. 159

11.3.3 Rebuild hardware when adding an IO device ....................................................................... 160

11.3.4 Change process image partition assignment ....................................................................... 160

11.3.5 Re-configuring existing I/O modules in IO devices ............................................................... 161

11.3.6 Replacing IO devices or I/O modules ................................................................................... 161

11.4 Re-configuring I/O modules and ports in IO devices ............................................................ 161

11.4.1 Requirements for Reconfiguration ........................................................................................ 161

11.4.2 I/O module response to re-configuration .............................................................................. 162

11.4.3 CPU response during reconfiguration ................................................................................... 162

11.4.4 Reconfiguration Procedure ................................................................................................... 164

11.4.4.1 Using a Previously Unused Channel .................................................................................... 164

11.4.4.2 Reconfiguring an already used channel. .............................................................................. 164

11.4.4.3 Delete an already used channel. .......................................................................................... 166

11.4.4.4 Change the update time ....................................................................................................... 166

11.5 Motivation for CiR via PROFINET DP .................................................................................. 166

11.6 Permitted changes over PROFIBUS DP .............................................................................. 168

11.7 CiR objects and CiR modules for PROFINET DP ................................................................ 170

11.7.1 Basic Requirements .............................................................................................................. 170

11.7.2 Types of CiR Elements ......................................................................................................... 170

11.7.3 CiR Elements and I/O Address Areas .................................................................................. 171

11.8 Procedure for PROFIBUS DP ............................................................................................... 172

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12 Plant changes during redundant operation - H-CiR ............................................................................... 197

11.8.1 Basic Procedures in STOP Mode ........................................................................................ 172

11.8.1.1 Overview .............................................................................................................................. 172

11.8.1.2 Defining CiR Elements ......................................................................................................... 174

11.8.1.3 Deleting CiR Elements ......................................................................................................... 176

11.8.2 Basic Procedure in RUN Mode ............................................................................................ 177

11.8.2.1 Overview .............................................................................................................................. 177

11.8.2.2 add slaves or modules ......................................................................................................... 178

11.8.2.3 Reconfigure the hardware when adding a slave .................................................................. 179

11.8.2.4 change process image partition assignment ....................................................................... 179

11.8.2.5 reconfigure existing modules in ET200M / ET200iSP stations ............................................ 179

11.8.2.6 Undo previous changes (Undo function): ............................................................................ 180

11.8.2.7 Replacing Slaves or Modules .............................................................................................. 180

11.8.2.8 Using CiR Elements in RUN Mode ...................................................................................... 181

11.8.2.9 Undoing Previous Changes ................................................................................................. 184

11.9 Reconfigure existing modules in ET200M / ET200iSP stations .......................................... 185

11.9.1 Requirements for Reconfiguration ....................................................................................... 185

11.9.2 Module Response During a Reconfiguration ....................................................................... 186

11.9.3 CPU response during reconfiguration .................................................................................. 186

11.9.4 Reconfiguration Procedure .................................................................................................. 188

11.9.4.1 Using a Previously Unused Channel ................................................................................... 188

11.9.4.2 Reconfiguring an already used channel. ............................................................................. 188

11.9.4.3 Delete an already used channel. ......................................................................................... 189

11.10 Notes on Reconfiguration in RUN Mode Depending on the I/O .......................................... 190

11.10.1 Modules in IO devices of the type ET 200SP HA ................................................................ 190

11.10.2 DP and PA Slaves ............................................................................................................... 190

11.10.3 Modules in ET 200M Modular Slaves .................................................................................. 193

11.10.4 Modules in ET200iSP Modular Slaves ................................................................................ 194

11.11 Effects on the process when re-configuring in RUN ............................................................ 194

11.11.1 Effects on Operating System Functions During the CiR Synchronization Time .................. 194

11.11.2 Behavior of the CPU after download of the configuration in RUN ....................................... 195

11.11.2.1 Overview .............................................................................................................................. 195

11.11.2.2 Error displays ....................................................................................................................... 196

12.1 The H-CiR wizard ................................................................................................................. 197

12.2 Replacing central components ............................................................................................. 198

12.3 Addition of interface modules ............................................................................................... 199

12.4 Motivation for H-CiR via PROFINET IO ............................................................................... 201

12.5 Permitted changes over PROFINET IO ............................................................................... 202

12.6 Motivation for H-CiR via PROFIBUS DP ............................................................................. 204

12.7 Permitted changes over PROFIBUS DP ............................................................................. 205

12.8 Adding components ............................................................................................................. 207

12.8.1 Modify hardware................................................................................................................... 207

12.8.2 Change hardware configuration offline ................................................................................ 208

12.8.3 Opening the H-CiR wizard ................................................................................................... 209

12.8.4 Modify and download the user program .............................................................................. 210

12.8.5 Use of free channels on an existing module ........................................................................ 211

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13 Replacement of failed components during redundant operation ........................................................... 223

14 Synchronization modules .................................................................................................................... 239

15 System expansion card ....................................................................................................................... 251

16 Technical data .................................................................................................................................... 253

17 Properties and technical specifications of CPU 410 SMART ................................................................ 283

12.9 Removal of components ....................................................................................................... 211

12.9.1 Change hardware configuration offline ................................................................................. 212

12.9.2 Modify and download the user program ............................................................................... 213

12.9.3 Opening the H-CiR wizard .................................................................................................... 214

12.9.4 Modify hardware ................................................................................................................... 215

12.9.5 Removal of interface modules .............................................................................................. 216

12.10 Editing CPU parameters ....................................................................................................... 217

12.10.1 Editing CPU parameters ....................................................................................................... 217

12.10.2 Changing CPU parameters offline ........................................................................................ 219

12.10.3 Opening the H-CiR wizard .................................................................................................... 219

12.11 Re-parameterization of a module ......................................................................................... 220

12.11.1 Re-configuring a module/PDEV submodule ......................................................................... 220

12.11.2 Editing parameters offline ..................................................................................................... 221

12.11.3 Opening the H-CiR wizard .................................................................................................... 221

13.1 Replacement of central components .................................................................................... 223

13.1.1 Replacement of a CPU during redundant operation ............................................................. 223

13.1.2 Replacement of a power supply module............................................................................... 225

13.1.3 Replacement of an input/output module or function module ................................................ 226

13.1.4 Replacement of a communication module............................................................................ 227

13.1.5 Replacement of synchronization module or fiber-optic cable ............................................... 228

13.1.6 Replacement of an IM 460 and IM 461 interface module ..................................................... 231

13.2 Replacement of components of the distributed I/O on PROFINET IO ................................. 231

13.2.1 Replacement of a PROFINET IO device .............................................................................. 231

13.2.2 Replacement of PROFINET IO cables ................................................................................. 232

13.3 Replacement of components of the distributed I/O on PROFIBUS DP ................................ 233

13.3.1 Replacement of a PROFIBUS DP master ............................................................................ 234

13.3.2 Replacement of a redundant PROFIBUS DP interface module ........................................... 236

13.3.3 Replacement of a PROFIBUS DP slave ............................................................................... 236

13.3.4 Replacement of PROFIBUS DP cables ................................................................................ 237

14.1 Synchronization modules for the CPU 410. .......................................................................... 239

14.2 Installation of fiber-optic cables ............................................................................................ 243

14.3 Selecting fiber-optic cables ................................................................................................... 245

15.1 Variants of the system expansion card ................................................................................. 251

16.1 Technical specifications of CPU 410-5H; (6ES7410-5HX08-0AB0) ..................................... 253

16.2 Technical specifications of CPU 410E (6ES7410-5HM08-0AB0) ........................................ 263

16.3 Technical specifications of the system expansion card ........................................................ 273

17.1 CPU 410 SMART .................................................................................................................. 283

17.2 Technical specifications of the CPU 410 SMART; (6ES7 410-5HN08-0AB0) ...................... 285

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18 Supplementary information .................................................................................................................. 297

17.3 Technical specifications of the SEC PO 800 ....................................................................... 295

18.1 Supplementary information on PROFIBUS DP ................................................................... 297

18.2 Supplementary information on diagnostics of the CPU 410 as PROFIBUS DP master ...... 298

18.3 System status lists for PROFINET IO .................................................................................. 301

18.4 Configuring with STEP 7 ...................................................................................................... 302

18.4.1 Rules for arranging fault-tolerant station components ......................................................... 302

18.4.2 Configuring hardware ........................................................................................................... 303

18.4.3 Assigning parameters to modules in a fault-tolerant station ................................................ 304

18.4.4 Recommendations for setting CPU parameters, fixed settings ........................................... 304

18.4.5 Networking configuration ..................................................................................................... 305

18.5 The STEP 7 user program ................................................................................................... 306

18.5.1 The user program................................................................................................................. 306

18.6 Programming device functions in STEP 7 ........................................................................... 308

18.7 Communication services ...................................................................................................... 308

18.7.1 Overview of communication services................................................................................... 308

18.7.2 PG communication ............................................................................................................... 310

18.7.3 OP communication ............................................................................................................... 310

18.7.4 S7 communication ............................................................................................................... 310

18.7.5 S7 routing ............................................................................................................................. 312

18.7.6 Data set routing .................................................................................................................... 316

18.7.7 SNMP network protocol ....................................................................................................... 317

18.7.8 Open Communication Via Industrial Ethernet ...................................................................... 318

18.8 Basics and terminology of fault-tolerant communication ..................................................... 321

18.9 Usable networks................................................................................................................... 325

18.10 Communication via S7 connections ..................................................................................... 325

18.10.1 Communication via S7 connections - one-sided mode........................................................ 326

18.10.2 Communication via redundant S7 connections ................................................................... 328

18.10.3 Communication via point-to-point CP on the ET 200M ....................................................... 329

18.10.4 Custom connection to single-channel systems .................................................................... 331

18.11 Communication via fault-tolerant S7 connections ................................................................ 332

18.11.1 Communication between fault-tolerant systems .................................................................. 334

18.11.2 Communication between fault-tolerant systems and a fault-tolerant CPU .......................... 337

18.11.3 Communication between fault-tolerant systems and PCs ................................................... 338

18.12 Consistent data .................................................................................................................... 340

18.12.1 Consistency of communication blocks and functions .......................................................... 340

18.12.2 Consistency rules for SFB 14 "GET" or read variable, and SFB 15 "PUT" or write

variable ................................................................................................................................. 340

18.12.3 Consistent reading and writing of data from and to DP standard slaves/IO devices ........... 341

18.13 Link-

up and update sequence .............................................................................................. 343

18.13.1 Link-up sequence ................................................................................................................. 346

18.13.2 Update sequence ................................................................................................................. 347

18.13.3 Switch to CPU with modified configuration .......................................................................... 351

18.13.4 Disabling of link-up and update ............................................................................................ 352

18.14 The user program................................................................................................................. 353

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A Characteristic values of redundant automation systems ...................................................................... 379

B Function and communication modules that can be used in a redundant configuration .......................... 389

C Connection examples for redundant I/Os ............................................................................................. 391

18.15 Other options for connecting redundant I/Os ........................................................................ 354

18.16 CPU 410 cycle and reaction times ........................................................................................ 357

18.16.1 Cycle time ............................................................................................................................. 357

18.16.2 Calculating the cycle time ..................................................................................................... 359

18.16.3 Cycle load due to communication ......................................................................................... 362

18.16.4 Response time ...................................................................................................................... 364

18.16.5 Calculating cycle and response times .................................................................................. 369

18.16.6 Examples of calculating the cycle and response times ........................................................ 370

18.16.7 Interrupt response time ......................................................................................................... 373

18.16.8 Example of calculation of the interrupt response time .......................................................... 375

18.16.9 Reproducibility of delay and watchdog interrupts ................................................................. 376

18.17 Runtimes of the FCs and FBs for redundant I/Os ................................................................ 377

A.1 Basic concepts ...................................................................................................................... 379

A.2 Comparison of MTBF for selected configurations ................................................................ 383

A.2.1 System configurations with redundant CPU 410 .................................................................. 383

A.2.2 System configurations with distributed I/Os .......................................................................... 384

A.2.3 Comparison of system configurations with standard and fault-tolerant communication ...... 388

C.1 MTA terminal modules (Marshalled Termination Assemblies) ............................................. 391

C.2 Interconnection of output modules ........................................................................................ 391

C.3 8-channel HART analog input MTA ...................................................................................... 393

C.4 8-channel HART analog output MTA .................................................................................... 394

C.5 SM 321; DI 16 x DC 24 V, 6ES7 321–1BH02–0AA0 ............................................................ 395

C.6 SM 321; DI 32 x DC 24 V, 6ES7 321–1BL00–0AA0 ............................................................. 396

C.7 SM 321; DI 16 x AC 120/230V, 6ES7 321–1FH00–0AA0 .................................................... 397

C.8 SM 321; DI 8 x AC 120/230 V, 6ES7 321–1FF01–0AA0 ...................................................... 398

C.9 SM 321; DI 16 x DC 24V, 6ES7 321–7BH00–0AB0 ............................................................. 399

C.10 SM 321; DI 16 x DC 24V, 6ES7 321–7BH01–0AB0 ............................................................. 400

C.11 SM 326; DO 10 x DC 24V/2A, 6ES7 326–2BF01–0AB0 ...................................................... 401

C.12 SM 326; DI 8 x NAMUR, 6ES7 326–1RF00–0AB0 ............................................................... 402

C.13 SM 326; DI 24 x DC 24 V, 6ES7 326–1BK00–0AB0 ............................................................ 403

C.14 SM 421; DI 32 x UC 120 V, 6ES7 421–1EL00–0AA0 ........................................................... 404

C.15 SM 421; DI 16 x DC 24 V, 6ES7 421–7BH01–0AB0 ............................................................ 405

C.16 SM 421; DI 32 x DC 24 V, 6ES7 421–1BL00–0AB0 ............................................................. 406

C.17 SM 421; DI 32 x DC 24 V, 6ES7 421–1BL01–0AB0 ............................................................. 407

C.18 SM 322; DO 8 x DC 24 V/2 A, 6ES7 322–1BF01–0AA0 ...................................................... 408

C.19 SM 322; DO 32 x DC 24 V/0,5 A, 6ES7 322–1BL00–0AA0 ................................................. 409

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Index ................................................................................................................................................... 429

Tables

C.20 SM 322; DO 8 x AC 230 V/2 A, 6ES7 322–1FF01–0AA0 .................................................... 410

C.21 SM 322; DO 4 x DC 24 V/10 mA [EEx ib], 6ES7 322–5SD00–0AB0 .................................. 411

C.22 SM 322; DO 4 x DC 15 V/20 mA [EEx ib], 6ES7 322–5RD00–0AB0 .................................. 412

C.23 SM 322; DO 8 x DC 24 V/0.5 A, 6ES7 322–8BF00–0AB0 .................................................. 413

C.24 SM 322; DO 16 x DC 24 V/0.5 A, 6ES7 322–8BH01–0AB0 ................................................ 414

C.25 SM 332; AO 8 x 12 Bit, 6ES7 332–5HF00–0AB0 ................................................................ 415

C.26 SM 332; AO 4 x 0/4...20 mA [EEx ib], 6ES7 332–5RD00–0AB0 ......................................... 416

C.27 SM 422; DO 16 x AC 120/230 V/2 A, 6ES7 422–1FH00–0AA0 .......................................... 417

C.28 SM 422; DO 32 x DC 24 V/0.5 A, 6ES7 422–7BL00–0AB0 ................................................ 418

C.29 SM 331; AI 4 x 15 Bit [EEx ib]; 6ES7 331–7RD00–0AB0 .................................................... 419

C.30 SM 331; AI 8 x 12 Bit, 6ES7 331–7KF02–0AB0 .................................................................. 420

C.31 SM 331; AI 8 x 16 Bit; 6ES7 331–7NF00–0AB0 .................................................................. 421

C.32 SM 331; AI 8 x 16 Bit; 6ES7 331–7NF10–0AB0 .................................................................. 422

C.33 AI 6xTC 16Bit iso, 6ES7331-7PE10-0AB0 .......................................................................... 423

C.34 SM331; AI 8 x 0/4...20mA HART, 6ES7 331-7TF01-0AB0 ................................................. 424

C.35 SM 332; AO 4 x 12 Bit; 6ES7 332–5HD01–0AB0 ................................................................ 426

C.36 SM332; AO 8 x 0/4...20mA HART, 6ES7 332-8TF01-0AB0 ................................................ 427

Table 3- 1 LED displays on the CPUs ........................................................................................................... 36

Table 3- 2 Possible states of the RUN and STOP LEDs .............................................................................. 41

Table 3- 3 Possible states of the MSTR, RACK0 and RACK1 LEDs ............................................................ 42

Table 3- 4 Possible states of the INTF and EXTF LEDs ............................................................................... 42

Table 3- 5 Possible states of the BUS1F, BUS5F, and BUS8F LEDs .......................................................... 42

Table 3- 6 Possible states of the IFM1F and IFM2F LEDs ........................................................................... 43

Table 3- 7 Possible states of the LINK and RX/TX LEDs ............................................................................. 43

Table 3- 8 Possible states of the REDF LED ................................................................................................ 43

Table 3- 9 Possible states of the LINK1 OK and LINK2 OK LEDs ............................................................... 44

Table 4- 1 Meaning of the "BUSF" LED of the CPU 410 as DP master ....................................................... 49

Table 6- 1 System modifications during operation ........................................................................................ 56

Table 6- 2 Measures in PROFIsafe for error avoidance ............................................................................... 60

Table 6- 3 Interface modules for use of single-channel switched I/O configuration at the PROFIBUS

DP interface ................................................................................................................................. 67

Table 6- 4 Bus modules for hot swapping ..................................................................................................... 68

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Table 6- 5 Interface module for use of single-channel switched I/O configuration at the PROFINET

IO interface ................................................................................................................................... 71

Table 6- 6 Signal modules for redundancy ................................................................................................... 84

Table 7- 1 Causes of error leading to redundancy loss .............................................................................. 102

Table 7- 2 Overview of system states of the fault-tolerant system ............................................................. 109

Table 7- 3 Response to errors during the self-test ...................................................................................... 114

Table 7- 4 Response to a recurring comparison error ................................................................................ 115

Table 7- 5 Reaction to checksum errors ..................................................................................................... 115

Table 7- 6 Hardware fault with one-sided OB 121 call, checksum error, 2nd occurrence .......................... 116

Table 8- 1 Properties of link-up and update functions ................................................................................ 119

Table 8- 2 PG commands for link-up and update ....................................................................................... 120

Table 8- 3 Typical values for the user program part ................................................................................... 130

Table 9- 1 Protection levels of a CPU ......................................................................................................... 134

Table 9- 2 CPU properties in the factory settings ....................................................................................... 142

Table 9- 3 LED patterns .............................................................................................................................. 142

Table 12- 1 Modifiable CPU parameters ....................................................................................................... 218

Table 14- 1 Accessory fiber-optic cable ........................................................................................................ 246

Table 14- 2 Specification of fiber-optic cables for indoor applications .......................................................... 247

Table 14- 3 Specification of fiber-optic cables for outdoor applications ........................................................ 248

Table 18- 1 Reading the diagnostics data with STEP 7 ................................................................................ 298

Table 18- 2 Event detection of the CPU 41xH as a DP master .................................................................... 300

Table 18- 3 Comparison of the system status lists of PROFINET IO and PROFIBUS DP........................... 301

Table 18- 4 Communication services of the CPUs ....................................................................................... 308

Table 18- 5 Availability of connection resources ........................................................................................... 309

Table 18- 6 SFBs for S7 Communication ...................................................................................................... 311

Table 18-

7 Job lengths and "local_device_id" parameter ............................................................................ 320

Table 18- 8 For the monitoring times with redundant I/O .............................................................................. 357

Table 18- 9 Cyclic program processing ......................................................................................................... 358

Table 18- 10 Factors influencing cycle time .................................................................................................... 359

Table 18- 11 Portion of the process image transfer time, CPU 410-5H.......................................................... 360

Table 18- 12 Extending the cycle time ............................................................................................................ 361

Table 18- 13 Operating system execution time at the cycle control point ...................................................... 361

Table 18- 14 Extended cycle time due to nested interrupts ............................................................................ 361

Table 18- 15 Direct access of the CPUs to I/O modules in the central controller ........................................... 368

Table 18- 16 Direct access of the CPUs to I/O modules in the expansion unit with local link ........................ 368

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Figures

Table 18- 17 Direct access of the CPUs to I/O modules in the expansion unit with remote link, setting

100 m ......................................................................................................................................... 369

Table 18- 18 Example of calculating the response time ................................................................................. 370

Table 18- 19 Hardware and interrupt response times; maximum interrupt response time without com-

munication .................................................................................................................................. 373

Table 18- 20 Reproducibility of time-delay and cyclic interrupts of the CPUs ................................................ 376

Table 18- 21 Runtimes of the blocks for redundant I/Os ................................................................................. 377

Table C- 1 Interconnecting digital output modules with/without diodes ....................................................... 391

Figure 2-1 Purpose of redundant automation systems ................................................................................. 23

Figure 2-2 Overview ...................................................................................................................................... 26

Figure 2-3 Hardware of the S7-400H basic system ...................................................................................... 27

Figure 2-4 Hardware of the S7-400H basic system ...................................................................................... 28

Figure 3-1 Arrangement of the operator controls and indicators on the CPU 410 ........................................ 35

Figure 6-1 Processing chain: acquire, process, output ................................................................................. 58

Figure 6-2 Safety-related communication ..................................................................................................... 59

Figure 6-3 Operating objectives of redundant automation systems .............................................................. 61

Figure 6-4 Example of redundancy in a network without error ...................................................................... 63

Figure 6-5 Example of redundancy in a 1-out-of-2 system with error ........................................................... 64

Figure 6-6 Example of redundancy in a 1-out-of-2 system with total failure ................................................. 65

Figure 6-7 Single-channel switched distributed I/O configuration at the PROFIBUS DP interface............... 67

Figure 6-8 Single-channel switched distributed I/O configuration at the PROFINET IO interface ................ 70

Figure 6-9 System redundancy ..................................................................................................................... 74

Figure 6-10 IO devices in multiple cabinets..................................................................................................... 76

Figure 6-11 S7-400 H-system with sensors and actuators on module pairs (redundant signal pro-

cessing) ........................................................................................................................................ 78

Figure 6-12 AS 410 with redundant module pairs ........................................................................................... 79

Figure 6-13 Redundant I/O in the switched DP slave ..................................................................................... 80

Figure 6-14 Fault-tolerant digital input module in 1-out-of-2 configuration with one encoder ......................... 89

Figure 6-15 Fault-tolerant digital input modules in 1-out-of-2 configuration with two encoders ...................... 90

Figure 6-16 Fault-tolerant digital output modules in 1-out-of-2 configuration.................................................. 90

Figure 6-17 Fault-tolerant analog input modules in 1-out-of-2 configuration with one encoder ...................... 92

Figure 6-18 Fault-tolerant analog input modules in 1-out-of-2 configuration with two encoders .................... 94

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Figure 6-19 Fault-tolerant analog output modules in 1-out-of-2 configuration ................................................ 95

Figure 7-1 Synchronizing the subsystems .................................................................................................. 108

Figure 8-1 Meanings of the times relevant for updates ............................................................................... 122

Figure 8-2 Correlation between the minimum I/O retention time and the maximum inhibit time for

priority classes > 15 ................................................................................................................... 125

Figure 14-1 Synchronization modules 6ES7 960-1AA08-0XA0 and 6ES7 960-1Ax06-0xA0 ....................... 240

Figure 14-2 Fiber-optic cables, installation using distribution boxes ............................................................. 249

Figure 15-1 SEC ............................................................................................................................................ 252

Figure 18-1 Diagnostics with CPU 410 ......................................................................................................... 299

Figure 18-2 S7 routing ................................................................................................................................... 313

Figure 18-3 S7 routing gateways: PROFINET IO - DP - PROFINET IO ....................................................... 314

Figure 18-4 S7 routing: TeleService application example ............................................................................. 315

Figure 18-5 Data set routing .......................................................................................................................... 316

Figure 18-6 Example of an S7 connection .................................................................................................... 322

Figure 18-7 Example that shows that the number of resulting partial connections depends on the con-

figuration .................................................................................................................................... 324

Figure 18-8 Example of linking standard and fault-tolerant systems in a simple bus system ....................... 326

Figure 18-9 Example of linking standard and fault-tolerant systems in a redundant bus system ................. 327

Figure 18-10 Example of linking of standard and fault-tolerant systems in a redundant ring ......................... 327

Figure 18-11 Example of linking standard and fault-tolerant systems in a single bus system ........................ 328

Figure 18-12 Example of redundancy with fault-tolerant systems and a redundant bus system with re-

dundant standard connections ................................................................................................... 329

Figure 18-13 Example of connecting a fault-tolerant system to a single-channel third-party system via

switched PROFIBUS DP ............................................................................................................ 330

Figure 18-14 Example of connecting a fault-tolerant system to a single-channel third-party system via

PROFINET IO with system redundancy .................................................................................... 330

Figure 18-15 Example of linking a fault-tolerant system to a single-channel third-party system .................... 331

Figure 18-16 Example of redundancy with fault-tolerant system and redundant ring .....................................

335

Figure 18-17 Example of redundancy with fault-tolerant system and redundant bus system ........................ 335

Figure 18-18 Example of fault-tolerant system with additional CP redundancy .............................................. 336

Figure 18-19 Example of redundancy with fault-tolerant system and fault-tolerant CPU ............................... 337

Figure 18-20 Example of redundancy with fault-tolerant system and redundant bus system ........................ 339

Figure 18-21 Example of redundancy with a fault-tolerant system, redundant bus system and redun-

dant connection to the PC. ......................................................................................................... 339

Figure 18-22 Sequence of link-up and update ................................................................................................ 344

Figure 18-23 Update sequence ....................................................................................................................... 345

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Figure 18-24 Example of minimum signal duration of an input signal during the update ............................... 346

Figure 18-25 Redundant one-sided and switched I/O ..................................................................................... 354

Figure 18-26 Flow chart for OB 1 .................................................................................................................... 356

Figure 18-27 Elements and composition of the cycle time .............................................................................. 358

Figure 18-28 Formula: Influence of communication load ................................................................................ 362

Figure 18-29 Distribution of a time slice .......................................................................................................... 362

Figure 18-30 Dependency of the cycle time on communication load .............................................................. 363

Figure 18-31 DP cycle times on the PROFIBUS DP network ......................................................................... 365

Figure 18-32 Shortest response time .............................................................................................................. 366

Figure 18-33 Longest response time ............................................................................................................... 367

Figure A-1 MDT ............................................................................................................................................ 380

Figure A-2 MTBF .......................................................................................................................................... 381

Figure A-3 Common Cause Failure (CCF) .................................................................................................. 382

Figure A-4 Availability .................................................................................................................................. 383

Figure C-1 Interconnection example for SM 331, Al 8 x 0/4...20mA HART ................................................. 393

Figure C-2 Interconnection example for SM 322, Al 8 x 0/4...20mA HART ................................................. 394

Figure C-3 Example of an interconnection with SM 321; DI 16 x DC 24 V.................................................. 395

Figure C-4 Example of an interconnection with SM 321; DI 32 x DC 24 V.................................................. 396

Figure C-5 Example of an interconnection with SM 321; DI 16 x AC 120/230 V ......................................... 397

Figure C-6 Example of an interconnection with SM 321; DI 8 x AC 120/230 V ........................................... 398

Figure C-7 Example of an interconnection with SM 321; DI 16 x DC 24V................................................... 399

Figure C-8 Example of an interconnection with SM 321; DI 16 x DC 24V................................................... 400

Figure C-9 Example of an interconnection with SM 326; DO 10 x DC 24V/2A ........................................... 401

Figure C-10 Example of an interconnection with SM 326; DI 8 x NAMUR .................................................... 402

Figure C-11 Example of an interconnection with SM 326; DI 24 x DC 24 V.................................................. 403

Figure C-12 Example of an interconnection with SM 421; DI 32 x UC 120 V................................................ 404

Figure C-13 Example of an interconnection with SM 421; DI 16 x 24 V ........................................................ 405

Figure C-14 Example of an interconnection with SM 421; DI 32 x 24 V ........................................................

406

Figure C-15 Example of an interconnection with SM 421; DI 32 x 24 V ........................................................ 407

Figure C-16 Example of an interconnection with SM 322; DO 8 x DC 24 V/2 A ........................................... 408

Figure C-17 Example of an interconnection with SM 322; DO 32 x DC 24 V/0.5 A ...................................... 409

Figure C-18 Example of an interconnection with SM 322; DO 8 x AC 230 V/2 A.......................................... 410

Figure C-19 Example of an interconnection with SM 322; DO 16 x DC 24 V/10 mA [EEx ib] ....................... 411

Figure C-20 Example of an interconnection with SM 322; DO 16 x DC 15 V/20 mA [EEx ib] ....................... 412

Figure C-21 Example of an interconnection with SM 322; DO 8 x DC 24 V/0.5 A ........................................ 413

Figure C-22 Example of an interconnection with SM 322; DO 16 x DC 24 V/0.5 A ...................................... 414

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Figure C-23 Example of an interconnection with SM 332, AO 8 x 12 Bit ...................................................... 415

Figure C-24 Example of an interconnection with SM 332; AO 4 x 0/4...20 mA [EEx ib] ............................... 416

Figure C-25 Example of an interconnection with SM 422; DO 16 x 120/230 V/2 A ...................................... 417

Figure C-26 Example of an interconnection with SM 422; DO 32 x DC 24 V/0.5 A ...................................... 418

Figure C-27 Example of an interconnection with SM 331, AI 4 x 15 Bit [EEx ib] ........................................... 419

Figure C-28 Example of an interconnection with SM 331; AI 8 x 12 Bit ........................................................ 420

Figure C-29 Example of an interconnection with SM 331; AI 8 x 16 Bit ........................................................ 421

Figure C-30 Example of an interconnection with SM 331; AI 8 x 16 Bit ........................................................ 422

Figure C-31 Example of an interconnection AI 6xTC 16Bit iso ...................................................................... 423

Figure C-32 Interconnection example 1 SM 331; AI 8 x 0/4...20mA HART ................................................... 424

Figure C-33 Interconnection example 2 SM 331; AI 8 x 0/4...20mA HART ................................................... 425

Figure C-34 Example of an interconnection with SM 332, AO 4 x 12 Bit ...................................................... 426

Figure C-35 Interconnection example 3 SM 332; AO 8 x 0/4...20mA HART ................................................. 427

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CPU 410 Process Automation/CPU 410 SMART

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1.1

Preface

Purpose of this manual

Changes compared with the previous version

Scope of the manual

The information in this manual enables you to look up operator inputs, function descriptions and technical specifications of the CPU 410-5H Process Automation, CPU 410E Process Automation and CPU 410 SMART.

For information on installing and wiring this and other modules in order to set up an automation system, refer to Manual

Changes compared with the previous version of the SIMATIC PCS 7 Process Control System CPU 410-5H Process Automation/CPU 410 SMART, 09/2014 edition (A5E32631620-AB):

Automation System S7-400, Hardware and Installation

● CPU 410E has been added.

● The connection of redundant I/O via the PROFINET interface is described.

● The "Configuration changes during operation" functionality via the PROFINET interface is

● The "Configuration changes during redundant operation" functionality via the PROFINET

● The retentive load memory is described.

● A two-step firmware update procedure is described.

● Time synchronization for purposes of time stamping via PROFINET is described.

● The signaling of security events via SysLog is described.

The manual is relevant to the following components:

● CPU 410-5H Process Automation; 6ES7 410-5HX08-0AB0 as of Firmware Version V8.2

● CPU 410E Process Automation; 6ES7410-5HM08-0AB0 as of Firmware Version V8.2

● CPU 410 SMART; 6ES7 410-5HN08-0AB0 as of firmware version V8.2

described.

interface is described.

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

Preface

Note CPU 410-5H and CPU 410E

Except for different technical specifications and quantity frameworks, the CPU 410E behaves the same as a CPU 410 CPU 410 apply to both the CPU 410

Note CPU 410 and CPU 410 SMART

Except for the special features described in the s specifications of CPU 410 SMART While taking this section into co 410 also apply to the CPU 410 SMART.

Basic knowledge required

Approvals

Online help

1.1 Preface

Use of the current version of PCS 7 or the engineering tools is only required if the current CPU has new functions compared to the last firmware version and you want to use these functions. The same applies when an old CPU is replaced by a CPU with current firmware: If you do not want to use any properties beyond the scope of the replaced CPU, you can use the CPU with the old article number and old firmware version when configuring in HW Config.

-5H. For this reason, the statements made in this manual about a

-5H and the CPU 410E.

ection Properties and technical

(Page 283), CPU 410 SMART reacts like a CPU 410.

nsideration, the statements made in this manual about CPU

This manual requires general knowledge of automation engineering.

Knowledge of the use of computers or PC-like tools such as programming devices with a Windows operating system is also required. The SIMATIC PCS 7 readme includes information on which operating system is suitable for your SIMATIC PCS 7 configuration. The CPU 410 is configured using the SIMATIC PCS 7 software, and you should therefore be familiar with this software.

In particular when operating a CPU 410 in potentially explosive atmospheres, please always observe the information on the safety of electronic control systems provided in the appendix

Automation System S7-400, Hardware and Installation

to the

For details on certifications and standards, refer to Manual

Module Data

specification for the entire S7-400.

You will need the SIMATIC PCS 7 Programming Package V9.0 or higher to work with CPU

410.

In addition to the manual, you will find detailed support on how to use the software in the integrated online help system of the software.

manual.

S7-400 Automation System,

, section 1.1, Standards and Certifications. Here you will also find the technical

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Preface

Help

Contents

Configuring fault-tolerant systems

Using Help

Recycling and disposal

Additional support

Functional Safety Services

1.1 Preface

The help system can be accessed using various interfaces:

● The help on fault-tolerant systems in

●

● The context-sensitive help system provides information on the current context, for

example, on an open dialog or active window. You can call this help by clicking "Help" or using the F1 key.

● The status bar provides a further form of context-sensitive help. It shows a short description of each menu command when you position the mouse pointer over a command.

● A short info text is also shown for the toolbar buttons when you hold the mouse pointer briefly over a button.

If you prefer to read the information of the online help in printed form, you can print individual topics, books or the entire help system.

Because it is constructed from environmentally compatible materials, the CPU 410 can be recycled. For ecologically compatible recycling and disposal of your old device, contact a certificated disposal service for electronic scrap.

menu contains several commands:

provides detailed instructions on using the online help system.

opens the Help index. You will find

If you have any questions relating to the products described in this manual, and do not find the answers in this documentation, please contact your Siemens partner at our local offices.

You will find information on who to contact at:

Contact partners (http://www.siemens.com/automation/partner)

A guide to the technical documents for the various SIMATIC products and systems is available at:

Documentation (http://www.automation.siemens.com/simatic/portal/html_76/techdoku.htm)

You can find the online catalog and order system under:

Catalog (http://mall.automation.siemens.com/)

Siemens Functional Safety Services is a comprehensive performance package that supports you in risk assessment and verification all the way to plant commissioning and modernization. We also offer consulting services for the application of fail-safe and faulttolerant SIMATIC S7 automation systems.

Additional information is available at:

Functional Safety Services (http://www.siemens.com/safety-services)

Submit your requests to:

Mail Functional Safety Services (mailto:safety-services.industry@siemens.com)

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

Preface

Training center

Technical Support

Service & Support on the Internet

1.2

Security information

1.2 Security information

We offer a range of relevant courses to help you to get started with the SIMATIC S7 automation system. Please contact your local training center or the central training center.

Training (http://www.sitrain.com/index_en.html)

For technical support of all Industry Automation products, fill in and submit the online Support Request:

Support Request (http://www.siemens.de/automation/support-request)

In addition to our documentation, we offer a comprehensive online knowledge base on the Internet at:

Service & Support (http://www.siemens.com/automation/service&support)

There you will find:

● The newsletter containing the latest information on your products.

● The latest documents via our search function in Service & Support.

● A forum for global information exchange by users and specialists.

● Your local Automation representative.

● Information on field service, repairs and spare parts. Much more can be found under

"Services".

Siemens provides products and solutions with industrial security functions that support the secure operation of plants, systems, machines, and networks.

In order to protect plants, systems, machines and networks against cyber threats, it is necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial security concept. Siemens’ products and solutions only form one element of such a concept.

Customer is responsible to prevent unauthorized access to its plants, systems, machines and networks. Systems, machines and components should only be connected to the enterprise network or the internet if and to the extent necessary and with appropriate security measures (e.g. use of firewalls and network segmentation) in place.

Additionally, Siemens’ guidance on appropriate security measures should be taken into account. For more information about industrial security, please visit:

http:/www.siemens.com/industrialsecurity.

Siemens’ products and solutions undergo continuous development to make them more secure. Siemens strongly recommends to apply product updates as soon as available and to always use the latest product versions. Use of product versions that are no longer supported, and failure to apply latest updates may increase customer’s exposure to cyber threats.

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Preface

1.3

Documentation

User documentation

Topic

Documentation

1.3 Documentation

To stay informed about product updates, subscribe to the Siemens Industrial Security RSS Feed under http://www.siemens.com/industrialsecurity.

The table below provides an overview of the descriptions of the various components and options in the S7-400 automation system.

Setting up an automation system

Data of the standard modules of an automation system

IM 155-6 PN HA ET 200SP HA Distributed I/O

IM 152 ET 200iSP Distributed I/O Sys-

IM 153-2 IM 153-4 PN

IM 157

S7-400, Hardware and Installation

S7-400 Module Data SIMATIC S7-400 S7-400 Auto-

tem

ET 200M Distributed I/O Device SIMATIC ET 200M Distributed

DP/PA Link and Y Link Bus Links

S7-400 Automation System Hardware and Installation (http://support.automation.sieme

mation System Module Data (http://support.automation.sieme

SIMATIC Distributed I/O System ET 200iSP (https://support.industry.siemen

s.com/cs/ww/de/view/28930789/

I/O Device, HART Analog Modules (http://support.automation.sieme

SIMATIC Bus Links DP/PA Coupler, Active Field Distributors, DP/PA Link and Y Link (http://support.automation.sieme

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

IM 153-2 FF FF Link Bus Links SIMATIC Bus Links - FF Link

Bus Link (https://support.industry.siemen

s.com/cs/ww/de/view/47357205/

Compact FF Link Compact FF Link Bus Links SIMATIC Bus Link Compact FF

Link (https://support.industry.siemen

s.com/cs/ww/de/view/10973957

Preface

Topic

Documentation

Area of application of the CPU 410 in SIMATIC PCS 7

Purpose of redundant automation systems

Why use fault-tolerant automation systems?

In practice, redundant automation systems are used to achieve fault-tolerant or fail-safe systems.

Figure 2-1 Purpose of redundant automation systems

Please note the difference between fail-tolerant and fail-safe systems. The AS 410 H is a fault-tolerance automation system. You may only use it for controlling safety-related processes if you program and configure it in accordance with the rules for F systems. You can find information on this in following manual: SIMATIC Industrial Software S7 F/FH Systems (http://support.automation.siemens.com/WW/view/en/2201072)

The purpose of fault-tolerance automation systems is to reduce production downtime caused by faults or by maintenance work.

The greater the costs of downtime, the more worthwhile a fault-tolerant system. The costs of investing in a fault-tolerant system are generally higher, but are rapidly recovered by the avoidance of production downtime.

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

Introduction to the CPU 410

SIMATIC PCS 7 and CPU 410-5H Process Automation

The SIMATIC PCS 7 project

SIMATIC PCS 7 applications

2.1 Area of application of the CPU 410 in SIMATIC PCS 7

SIMATIC PCS 7 uses selected standard hardware and software components from the TIA building block system for the process control system in the company-wide automation network called Totally Integrated Automation. It offers an open basis for automation solutions with its consistent data management, communication and configuration.

You can use SIMATIC PCS 7 to create customized and project-specific solutions tailored to specific requirements. Further information about these customized solutions can be found in the configuration manuals.

The CPU 410-5H Process Automation is a controller of the latest generation. This controller is specifically designed for the SIMATIC PCS 7 control system. As with previous controllers of the SIMATIC PCS 7 system, the CPU 410-5H Process Automation can be used in all Process Automation industries. Highly flexible scalability based on SIMATIC PCS 7 process objects makes it possible to cover the entire performance range from the smallest to the largest controller in standard, fault-tolerant and fail-safe applications with just one hardware.

You must create a new configuration for use of a CPU 410-5H. The parameters of a CPU 410-5H are set to SIMATIC PCS 7 default values when a new configuration is created. Some parameters that were previously freely assignable cannot be changed in the CPU 410-5H. You can apply charts from existing SIMATIC PCS 7 projects.

A SIMATIC PCS 7 project includes the following objects:

● Hardware configuration

● Blocks

● CFCs and SFCs

These objects are always present - regardless of the number of operator stations and modules and their networking.

You create a SIMATIC PCS 7 project on an engineering station (ES for short). A variety of applications are available on the ES:

● SIMATIC Manager - the central application of SIMATIC PCS 7. From here, you can open all other applications in which you need to make settings for the SIMATIC PCS 7 project. You will set up your entire project from SIMATIC Manager.

● HW Config – configuration of all hardware of a system, e.g., CPUs, power supply, communications processors.

● CFC editor and SFC editor - creation of continuous function charts (CFC) and sequential control systems.

● SIMATIC PCS 7 OS in conjunction with various editors - Implementation of OS configuration

Every application has a graphic user interface for easy operation and clear representation of your configuration data.

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Introduction to the CPU 410

Important information on configuration

WARNING

Open equipment

Additional information

2.2 Possible applications

Risk of death or serious injury.

S7–400 modules are classified as open equipment, meaning you must install the S7–400 in an enclosure, cabinet, or switch room that can only be accessed by means of a key or tool. Only instructed or authorized personnel are permitted to access these enclosures, cabinets, or switch rooms.

The components of the standard S7-400 system, e.g., power supplies, I/O modules, CPs, and FMs, are also used in the high availability S7-400H automation system. For a detailed description of all hardware components for S7-400, refer to Reference Manual

Automation System, Module Data

S7-400

For the S7-400H high availability automation system, the same rules apply for planning the user program and for using blocks as for a standard S7-400 system. Please observe the descriptions in the

Programming with STEP 7

300/400 System and Standard Functions

Summary of parameters for CPU 410 (Page 48)

manual and the

reference manual.

System Software for S7-

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

The following figure shows an example of an S7–400H configuration with shared distributed I/O and connection to a redundant plant bus. The next pages deal with the hardware and software components required for the installation and operation of the S7–400H.

Introduction to the CPU 410

Additional information

2.2 Possible applications

Figure 2-2 Overview

The components of the S7–400 standard system are also used in connection with the CPU 410-5H Process Automation. For a detailed description of all hardware components for S7400, refer to Reference Manual

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Introduction to the CPU 410

2.3

The CPU 410 basic system for stand-alone operation

Definition

Note

Rack number "0" must be set on the CPU.

Hardware of the basic system

Central controller and expansion units

Power supply

2.3 The CPU 410 basic system for stand-alone operation

Stand-alone operation refers to the use of a CPU 410 in a standard SIMATIC-400 station.

The basic system consists of the required hardware components of a controller. The following figure shows the components in the configuration.

You can expand the basic system with standard S7-400 modules. There are limitations in the case of function and communication modules. See Appendix Function and communication modules that can be used in a redundant configuration (Page 389).

Figure 2-3 Hardware of the S7-400H basic system

The rack containing the CPU is called the central controller (CC). The racks in the system that are equipped with modules and connected to the CC are the expansion units (EU).

For the power supply you need a power supply module from the standard S7-400 system spectrum.

To increase availability of the power supply, you can also use two redundant power supplies. In this case, you use the power supply modules PS 405 R / PS 407 R.

A combination of these can also be used in redundant configurations (PS 405 R with PS 407 R).

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

Introduction to the CPU 410

Operation

2.4

The basic system for redundant operation

Hardware of the basic system

Central processing units

on the rear

Rack for S7-400H

2.4 The basic system for redundant operation

The basic system consists of the hardware components required for a fault-tolerant controller. The following figure shows the components in the configuration.

The basic system can be expanded with standard modules of the S7-400. There are restrictions for the function modules and communication processors. See Appendix Function and communication modules that can be used in a redundant configuration (Page 389).

Figure 2-4 Hardware of the S7-400H basic system

The two CPUs are the heart of the S7-400H. Use the switch the rack numbers. In the following sections, we will refer to the CPU in rack 0 as CPU 0, and to the CPU in rack 1 as CPU 1.

of the CPU to set

The UR2-H rack supports the installation of two separate subsystems with nine slots each, and is suitable for installation in 19" cabinets.

You can also set up the S7-400H in two separate racks. The racks UR1, UR2, and CR3 are available for this purpose.

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Introduction to the CPU 410

Power supply

Synchronization modules

Fiber-optic cable

Operation

2.4 The basic system for redundant operation

You require a power supply module from the standard system range of the S7-400 for each of the two subsystems of the S7-400H.

To increase availability of the power supply, you can also use two redundant power supplies in each subsystem. In this case, you use the power supply modules PS 405 R / PS 407 R.

A combination (PS 405 R with PS 407 R) can also be used.

The synchronization modules are used to link the two CPUs. They are installed in the CPUs and interconnected by means of fiber-optic cables.

Two types of synchronization modules are available:

● Synchronization modules for synchronization cables up to 10 meters long

● Synchronization modules for synchronization cables up to 10 kilometers long

You must use 4 synchronization modules of the same type in a fault-tolerant system. For a description of the synchronization modules, refer to the section Synchronization modules for the CPU 410. (Page 239).

The fiber-optic cables are used to interconnect the synchronization modules for the redundant link between the two CPUs. They interconnect the upper and lower synchronization modules in pairs.

You will find the specification of the fiber-optic cables you can use in an S7-400H in the section Selecting fiber-optic cables (Page 245).

You need a system expansion card for operation of a CPU 410. The system expansion card specifies the maximum number of process objects that can be loaded to the CPU and saves the license information in case of a system expansion. The system expansion card forms a hardware unit with the CPU 410. In redundant operation, each CPU 410 must have a system expansion card with identical quantity framework and scope of functions.

CPU 410 Process Automation/CPU 410 SMART System Manual, 05/2017, A5E31622160-AC

Introduction to the CPU 410

2.5

Rules for H station assembly

2.6

I/O for the CPU 410

2.5 Rules for H station assembly

The following rules have to be complied with for a fault-tolerant station, in addition to the rules that generally apply to the arrangement of modules in the S7-400:

● The CPUs have to be inserted in the same slots.

● Redundantly used external CP443-5DX DP master interfaces or communication modules

must be inserted in the same slots in each case.

● External DP master interface modules for redundant DP master systems may only be inserted in central controllers and not in expansion units.

● Redundantly used CPUs must be identical, which means they must have the same article number, product version and firmware version. It is not the marking on the front side that is decisive for the product version, but the revision of the "Hardware" component ("Module status" dialog mask) to be read using STEP 7.

● Redundantly used other modules must be identical, i.e. they must have the same article number, product version and - if available - firmware version.

● Two CPU 410-5H must have system expansion cards with the same configuration size and the same functional scope.

You can use SIMATIC S7 input/output modules with the CPU 410. The I/O modules can be used in the following devices:

● Central controllers

● Expansion units

● Distributed via PROFIBUS DP

● Distributed via PROFINET IO

The function modules (FM) and communication modules (CP) that can be used with CPU 410 are listed in the appendix Function and communication modules that can be used in a redundant configuration (Page 389).

CPU 410 Process Automation/CPU 410 SMART

30 System Manual, 05/2017, A5E31622160-AC

+ 404 hidden pages

Siemens SIMATIC CPU 410, SIMATIC 410 SMART, SIMATIC PCS 7 System Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Table of contents

Preface

1.2 Security information

1.3 Documentation

Area of application of the CPU 410 in SIMATIC PCS 7

2.2 Possible applications

2.3 The CPU 410 basic system for stand-alone operation

2.4 The basic system for redundant operation

I/O for the CPU 410

2.5 Rules for H station assembly