Siemens SFG75 Service Manual

Page 1
Release 1.0
Level 3 (basic) S80/82/SFG75
Release Date Department Notes to change
R 1.0 22.12.2005 BenQ CC S CES New document
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 1 of 18
Company Confidential
2005©BenQ
10/2005
Page 2
Release 1.0
Table of Content
1 Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2 List of available level 3 basic parts..........................................................................................4
3 Hardware requirements ............................................................................................................4
4 S80 Board layout.......................................................................................................................5
5 SIM Card Problems ...................................................................................................................7
6 IO Connector Problems ............................................................................................................8
7 B to B connector (upper slider part) problems.....................................................................10
8 Main keypad illumination problems.......................................................................................11
9 Connector Battery...................................................................................................................12
10 Connector RF Internal Antenna .............................................................................................13
11 Connector Mini SD ..................................................................................................................14
12 Connector Vibra ......................................................................................................................15
13 Fuse..........................................................................................................................................16
14 Connector Sidekeys................................................................................................................17
15 Connector MMI ........................................................................................................................18
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 2 of 18
Company Confidential
2005©BenQ
10/2005
Page 3
Release 1.0
1 Introduction
This document describes the performance description for Siemens service partners.
1.1 Purpose
This Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3 basic. The described failures shall be repaired in Siemens authorized local workshops only,
The level 3(former Level 2.5e) partners are obliged to repair level 2 classified boards, up to their repair level, under consideration of the information given by level 3 repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S80 Level 2 repair documentation. It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document (both documents are available in the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all S80 related Customer Care Information
S80 Part number on IMEI label:
Scrap Handling: All Scrap information given in this manual are related to the SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 2.5 light.
1.3 Terms and Abbreviations
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 3 of 18
Company Confidential
2005©BenQ
10/2005
Page 4
Release 1.0

2 List of available level 3 basic parts

(According to Component Matrix V1.11 - check C-market for updates)
Product ID Order Number Description CM
S80 J200 L50334-Z97-C522
S80 U800 L50851-Z1901-A62 ANT 3*5.1*5 56E12 BQ20.M0007.021
S80 J302 L50334-Z97-C523
S80 J301 L50334-Z97-C524
S80 U852 L50334-Z97-C525
S80 J250 L50334-Z97-C526
S80 J351 L50334-Z97-C527
S80 J350 L50334-Z97-C528
S80 J201 L50334-Z97-C529 CONN BTB D1.5 18P BQ21.N1003.011 S80 J202 L50315-Z77-C261 SWI VOLUME KEY 5P BQ21.P0004.005
S80 J300 L50158-A185-A16-1
S80 J251 L50158-A185-A17-1
S80
S80
S80
S80 U801 L50145-K280-Y415
S80 L50851-Z1901-A63
MMI board MMI board F250 F300
L50840-L2133-D670
L50810-U6228-D670 IC PER HALL A3212ELH BQ74.03212.09Y
L50145-A820-Y23
CONNECT SKT60P AXK7L60227 BQ20.L1096.060
CONNECTOR DC PWR 2P BQ20.N2002.021 CON BATT3P CBE-4517-2904H BQ21.N0036.011 CONN SPRING SBS23-2K30F00 BQ21.N0045.011 CONN I/O 10P ACT/916-2941 BQ2K.N0083.001 CONN SIM 6P D2.54 302-368 BQ21.N0050.001 CONN MINI SD 9P 500525 BQ21.N0058.011
ASS LOUD SPEAK. CONN. S80_BQ60.H0916.001 ASSY CONN. MIC WHITE S80_BQ65.G0101.004 DISDIODE LED BL-HB536G BQ83.00536.071
FUSE 1A 24V F0603 1608FF BQ69.41004.001 SWITCH ANT MS-147 HIROSE BQ69.50017.001 ANT 2.4GHz AT5020-B2R8HAA BQ69.F0005.021
3 Hardware requirements
(According to General soldering information V1.3 - check C-market for updates)
Jigs, Tools and working materials for all described repairs:
hot air blower soldering gun tweezers flux solder
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 4 of 18
Company Confidential
2005©BenQ
10/2005
Page 5
Release 1.0

4 S80 Board layout

Upper board side
J350: Mini SD
Connect
or
U852: Bluetooth Antenna Contact
J201 MMI Connector
Switch volume Keys
J300: Vibra Contact
Lower board side
J250: IO Connector
J301: Battery Connector
J302: Connector
Fuse 1A
J251: Microphone
U800: Antenna Contact
U801: Antenna Switch
J200: Connector BTB
J351: SIM Card
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 5 of 18
Company Confidential
2005©BenQ
Page 6
Release 1.0
MMI Board
Disdiode
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 6 of 18
Company Confidential
2005©BenQ
Page 7
Release 1.0
y
r
y
y
5 SIM Card Problems
Okay
Okay
Not oka
Okay
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
Exchange the
damaged Filter
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Fault Symptoms
Customer: GRT: Handset does not accept SIM card SIM Card Problems

SIM Card Problems

Watch for oxidation and
damaged pads of the
SIM Card reader
Check the status of the
EMI Filter visually
Exchange
SIM Card reade
Connector SIM Card Reader
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50634-Z97-C406 E-commerce order name: CONNECTOR SIM CARD READER R65 (B) Soldering temperature: ~ 360°C TIP Temp.
Not oka
Not oka
Check the status of the
SIM Card reader visually
Okay
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts.
The value must be ~0
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 7 of 18
Company Confidential
2005©BenQ
Page 8
Release 1.0
y
r
y
y
6 IO Connector Problems
Fault Symptoms
Customer: GRT: Charging Problems No connection to GRT Problems with external loudspeaker or microphone when using a car kit Problems with accessories connected at the IO connector

IO connector Problems

Watch for oxidation and
damaged pads of the
IO connector
Okay
Not oka
Not oka
Check the dust inside
the IO connector
Okay
Check the status of the
IO connector visually
Exchange
IO connecto
Connector IO Jack
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50334-Z97-C526 E-commerce order name: CONN I/O 10P ACT/916-2941 BQ2K.N0083.001 Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts.
The value must be ~0
Okay
47300 Interface/Data Interface/Mechanical Damage 4B100 Interface/Headset Connector/Mechanical Damage
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
Clean IO connector
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 8 of 18
Company Confidential
2005©BenQ
Page 9
Release 1.0
Important additional soldering hints
The MMC Reader is located on the opposite of the SLIM-Lumberg connector. Therefore the risk to damage the plastic material of this MMC-Reader is potentially high if excessive heat is used while removal or soldering of the SLIM-Lumberg connector.
Please follow these instructions:
a) Remove the SLIM-Lumberg connector with a soldering iron and Resolder Wick b) Clean the Pads afterwards c) Solder the new connecter by using soldering iron under consideration of the max. allowed
temperature range.
Samples of critical area:
Lock mechanism damaged Lock mechanism OK
Lock mechanism damaged Lock mechanism OK
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 9 of 18
Company Confidential
2005©BenQ
10/2005
Page 10
Release 1.0
y
y

7 B to B connector (upper slider part) problems

Fault Symptoms
Customer: GRT: Upper slider keyboard malfunction Keyboard malfunction Upper slider keypad illumination does not work Current measured failed Display problems
B to B connector problems
Watch for oxidation and
damaged pads of the
B to B connector
Okay
Not oka
Check the status of the
B to B connector visually
Okay
Exchange
B to B
connector
Not oka
Continue with
higher repair level
Connector Board to Board
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50334-Z97-C529 E-commerce order name: CONN BTB D1.5 18P BQ21.N1003.011 Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 32100 Keys / Main / No Function
32200 Keys / Main / Reduced Functionality 36000 Keys / Illumination
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- check for twisted or bent contacts
- check for dry joints
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 10 of 18
Company Confidential
2005©BenQ
Page 11
Release 1.0
y
r
y
y

8 Main keypad illumination problems

Fault Symptoms
Customer: GRT: Main keypad illumination does not work Current measured failed
LED Problems
Watch for oxidation and
damaged pads of the
LED’s
Okay
Not oka
Check the status of the
battery connector
visuall
Exchange
keypad LED’s
Not oka
Use the diode test
function of a multimete
to check the status of the diode. The typical
voltage drop on the
diode is 1.7 V when
testing the diode function with the
multimeter.
Okay
LED WHITE TOP
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
Attention: Remove Metal Dome Sheet before!!!
E-commerce order number: L50840-L2133-D670 E-commerce order name: DISDIODE LED BL-HB536G BQ83.00536.071 Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 36000 Keys / Illumination
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 11 of 18
Company Confidential
2005©BenQ
Page 12
Release 1.0
y
y
y
9 Connector Battery
Okay
Okay
Okay
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Fault Symptoms
Customer: GRT:
Mobile does not switch on No connection to GRT
Not oka
Exchange
battery
connector

Connector BATTERY

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number:
E-commerce order name: CON BATT3P CBE-4517-2904H BQ21.N0036.011
Soldering temperature: 240 - 255°C IRIS Diagnose Code: 13000 Battery/Mechanical Damage
Battery connector problems
Watch for oxidation and
damaged pads of the
battery connector
Check the status of the
battery connector
visuall
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts. The value
must be ~ 0.
L50334-Z97-C524
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 12 of 18
Company Confidential
2005©BenQ
Page 13
Release 1.0
y
r
y
y

10 Connector RF Internal Antenna

Fault Symptoms
Customer: GRT:
Network search Failure by TX/RX measurements No location update possible No location update possible
RF connector Problems
Watch for oxidation and
damaged pads of the
RF connector
Okay
Check the dust inside
the RF connector
Not oka
Check the status of the
RF connector visually
Okay
Exchange
RF connecto
Not oka
Use the resistor test
function of a multimeter
to check connection
between input and
output contacts.
The value must be ~0
Okay
Connector RF
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50145-K280-Y415 E-commerce name: SWITCH ANT MS-147 HIROSE BQ69.50017.001 Soldering temperature: 240 - 255°C IRIS Diagnose Code: 81100 Radio / No Contact / Int. Antenna 81200 Radio / No Contact / Ext. Antenna 82100 Radio / Low Receiving Signal / Int. Antenna 82200 Radio / Low Receiving Signal / Ext. Antenna 83100 Radio / Dropped Calls / Int. Antenna 83200 Radio / Dropped Calls / Ext. Antenna 84100 Radios / Call Setup / Int. Antenna 84200 Radio / Call Setup / Ext. Antenna
Not oka
Okay
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
Clean RF
connector
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 13 of 18
Company Confidential
2005©BenQ
Page 14
Release 1.0
y
y

11 Connector Mini SD

Fault Symptoms
Customer: GRT:
MMC malfunction Tbd.
MMC connector problems
Watch for oxidation and
damaged pads of the
MMC connector
Okay
Not oka
Check the status of the
MMC connector visually
Okay
Exchange MMC
connector
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts. The value
must be ~ 0.
Connector MMC
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: E-commerce order name: CONN MINI SD 9P 500525 BQ21.N0058.011 Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 4E000 Interfaces/ Memory Card Reader
L50334-Z97-C528
Attention: Avoid excessive heat in order not to damage the plastic material of the connector (see problem SLIM-Lumberg connector)
Okay
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 14 of 18
Company Confidential
2005©BenQ
Page 15
Release 1.0
y
y
12 Connector Vibra
Fault Symptoms
Customer: GRT:
VIBRA does not work Supported in April
Not oka
Exchange vibra
connector
Not oka
VIBRA Connector
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: E-commerce order name: CONN SPRING SBS23-2K30F00 BQ21.N0045.011 Soldering temperature: IRIS Diagnose Code:
Vibra connector problems
Watch for oxidation and
damaged pads of the
vibra connector
Okay
Check the status of the
vibra connector visually
Okay
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts. The value
must be ~ 0.
L50334-Z97-C525
240 - 255°C. 75100: Acoustics / Vibra /No Function
Okay
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 15 of 18
Company Confidential
2005©BenQ
Page 16
Release 1.0
y
y
13 Fuse
Fault Symptoms
Customer: GRT:
Battery charging does not work Supported in April
Not oka
Exchange fuse

Fuse

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: E-commerce order name: FUSE 1A 24V F0603 1608FF BQ69.41004.001 Soldering temperature: IRIS Diagnose Code:
Charging/ Accessory problems
Watch for oxidation and
damaged pads of the
PCB (area of fuse)
Okay
Check the status of the
fuse visually
Okay
Not oka
Use the resistor test
function of a multimeter
to check fuse
resistance. The value
must be ~ 0.
L50145-A820-Y23
240 - 255°C 11000 Battery / No charging / deep discharge
Back to customer
without repair
Caused by customer
SCRAP - has to be send
separately to WSC
- Check for dry joints
Okay
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 16 of 18
Company Confidential
2005©BenQ
Page 17
Release 1.0
y
p
14 Connector Sidekeys
Fault Symptoms
Customer: GRT:
Pressing feeling is bad Supported in April No function while pressing Supported in April
Side keys switch problems
Watch for oxidation and
damaged pads on the
side keys switch
Not oka
Back to customer
without repair
Caused by customer
Okay
SCRAP - has to be send
separately to WSC
Exchange fuse
Not okay
Not okay
Check the status on the
side keys switch
Okay
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and . The
value must be ~ 0
when the switch is
ressed.
Okay
- check for twisted or bent contacts
- check for dry joints
Continue with
higher repair level
Side key switch
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: E-commerce order name: SWI VOLUME KEY 5P BQ21.P0004.005 Soldering temperature: IRIS Diagnose Code:
L50315-Z77-C261
240 - 255°C 34100 Keys / Side
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 17 of 18
Company Confidential
2005©BenQ
Page 18
Release 1.0
SC
15 Connector MMI
Okay
Okay
Not okay
Back to customer
without repair
Caused by customer
SCRAP has to be
send separately to W
- check for twisted or bent contacts
- check for dry joints
Fault Symptoms
Customer: GRT:
Keyboard malfunction Keyboard malfunction
Not okay
Exchange MMI connector

Connector MMI

Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50315-Z77-C261 E-commerce order name: SWI VOLUME KEY 5P BQ21.P0004.005 Soldering temperature: 240 - 255°C IRIS Diagnose Code: 34100 Keys / Side
MMI connection problems
Watch for oxidation and damaged of the MMI connector
Check the status of the MMI connector visually
Continue with
higher repair level
Technical Documentation
10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 18 of 18
Company Confidential
2005©BenQ
Loading...