Siemens SFG75 Service Manual
Release 1.0
Service Repair Documentation
Level 3 (basic)
S80/82/SFG75
Release Date Department Notes to change
R 1.0 22.12.2005 BenQ CC S CES New document
Technical Documentation
TD_Repair_L2.5L_S80_R1.0.pdf Page 1 of 18
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2005©BenQ
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Release 1.0
Table of Content
1 Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2 List of available level 3 basic parts..........................................................................................4
3 Hardware requirements ............................................................................................................4
4 S80 Board layout.......................................................................................................................5
5 SIM Card Problems ...................................................................................................................7
6 IO Connector Problems ............................................................................................................8
7 B to B connector (upper slider part) problems.....................................................................10
8 Main keypad illumination problems.......................................................................................11
9 Connector Battery...................................................................................................................12
10 Connector RF Internal Antenna .............................................................................................13
11 Connector Mini SD ..................................................................................................................14
12 Connector Vibra ......................................................................................................................15
13 Fuse..........................................................................................................................................16
14 Connector Sidekeys................................................................................................................17
15 Connector MMI ........................................................................................................................18
Technical Documentation
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1 Introduction
This document describes the performance description for Siemens service partners.
1.1 Purpose
This Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3
basic. The described failures shall be repaired in Siemens authorized local workshops only,
The level 3(former Level 2.5e) partners are obliged to repair level 2 classified boards, up to their
repair level, under consideration of the information given by level 3 repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S80 Level 2 repair documentation.
It has to be ensured that every repaired mobile Phone is checked according to the latest released
General Test Instruction document (both documents are available in the Technical Support section
of the C-market).
Check at least weekly C-market for updates and consider all S80 related Customer Care Information
S80 Part number on IMEI label:
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication
market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are
released to repair BenQ mobile phones up to level 2.5 light.
1.3 Terms and Abbreviations
Technical Documentation
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2 List of available level 3 basic parts
(According to Component Matrix V1.11 - check C-market for updates)
Product ID Order Number Description CM
S80 J200 L50334-Z97-C522
S80 U800 L50851-Z1901-A62 ANT 3*5.1*5 56E12 BQ20.M0007.021
S80 J302 L50334-Z97-C523
S80 J301 L50334-Z97-C524
S80 U852 L50334-Z97-C525
S80 J250 L50334-Z97-C526
S80 J351 L50334-Z97-C527
S80 J350 L50334-Z97-C528
S80 J201 L50334-Z97-C529 CONN BTB D1.5 18P BQ21.N1003.011
S80 J202 L50315-Z77-C261 SWI VOLUME KEY 5P BQ21.P0004.005
S80 J300 L50158-A185-A16-1
S80 J251 L50158-A185-A17-1
S80
S80
S80
S80 U801 L50145-K280-Y415
S80 L50851-Z1901-A63
MMI
board
MMI
board
F250
F300
L50840-L2133-D670
L50810-U6228-D670 IC PER HALL A3212ELH BQ74.03212.09Y
L50145-A820-Y23
CONNECT SKT60P AXK7L60227
BQ20.L1096.060
CONNECTOR DC PWR 2P
BQ20.N2002.021
CON BATT3P CBE-4517-2904H
BQ21.N0036.011
CONN SPRING SBS23-2K30F00
BQ21.N0045.011
CONN I/O 10P ACT/916-2941
BQ2K.N0083.001
CONN SIM 6P D2.54 302-368
BQ21.N0050.001
CONN MINI SD 9P 500525
BQ21.N0058.011
ASS LOUD SPEAK. CONN.
S80_BQ60.H0916.001
ASSY CONN. MIC WHITE
S80_BQ65.G0101.004
DISDIODE LED BL-HB536G
BQ83.00536.071
FUSE 1A 24V F0603 1608FF
BQ69.41004.001
SWITCH ANT MS-147 HIROSE
BQ69.50017.001
ANT 2.4GHz AT5020-B2R8HAA
BQ69.F0005.021
3 Hardware requirements
(According to General soldering information V1.3 - check C-market for updates)
Jigs, Tools and working materials for all described repairs:
hot air blower
soldering gun
tweezers
flux
solder
Technical Documentation
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4 S80 Board layout
Upper board side
J350:
Mini SD
Connect
or
U852:
Bluetooth
Antenna
Contact
J201
MMI
Connector
Switch
volume Keys
J300:
Vibra Contact
Lower board side
J250:
IO Connector
J301:
Battery
Connector
J302:
Connector
Fuse 1A
J251:
Microphone
U800:
Antenna
Contact
U801:
Antenna
Switch
J200:
Connector
BTB
J351:
SIM Card
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Release 1.0
MMI Board
Disdiode
Technical Documentation
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