Siemens S68 Service Manual

Release 1.0
Service Manual
S68
Level 1-3
Release Date Department Notes to change
R 1.0 22.02.2006 BenQ Mobile S CC CES New document
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Table of Content
1 Key Feature................................................................................................................................3
2 S68 Interface to Accessories....................................................................................................4
3 Unit Description of S68.............................................................................................................5
4 Exploded View of S68 ...............................................................................................................6
5 Disassembly of S68...................................................................................................................7
6 Assembly of S68......................................................................................................................14
7 BenQ Service Equipment User Manual.................................................................................19
8 GRT Software: Functionality Configuration..........................................................................20
9 GRT Software: Regular Usage ...............................................................................................22
10 JPICS (Java based Product Information Controlling System)............................................27
11 International Mobile Equipment Identity, IMEI......................................................................33
12 General Testing Information...................................................................................................34
13 Introduction of Service Repair Documentation for Level 3 Basic Repairs – S68..............40
14 List of available Level 3 Basic Parts.....................................................................................41
15 Hardware Requirements.........................................................................................................41
16 S68 Board Layout...................................................................................................................42
17 SIM Card Problems .................................................................................................................43
18 IO Connector Problems .........................................................................................................44
19 B to B Connector (upper slider part) Problems....................................................................45
20 Battery Connector Problems.................................................................................................. 46
21 Filter EMI Problems.................................................................................................................47
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1 Key Feature

Standard Systems
Stand-by Time Talk Time Battery Technology Battery Capacity Weight Volume Length Width Thickness Storage SIM Functionality / Security Controls
Antenna Data Services
Display / Display Illumination
Camera
Connectivity Features
Tri-band GSM 900/1800/1900 EGSM (GSM phase 2/phase 2+) GPRS class 10 Vocoders FR, HR, EFR, AMR Up to 300 h (standard battery)
Up to 300 min (standard battery) Battery: Li-Ion 660 mAh
Charging time: Less than 2 h for 100%
78,5 g 44 cm³ 107 mm 46 mm 13,2 mm 8 MB user memory SIM Application Toolkit (class 3)
SIM lock, various levels PIN 1 & 2 control Ciphering A5.1, A5.2 and A5.3 SIM plug-in (3/1.8 V), SAT class 3 Integrated
Mobile Internet access (WAP 1.2.1 plus parts of 2.0) Data download OTA via SMS or WAP MMS release 98 EMS rel. 4.3 Data services (CSD) at 9.6 Kbps and GPRS (up to 53.6 Kbps) E-mail client 132 x 176 pixels, 262,144 colors, enhanced TFT, transflective, high-end flat PMMA window n / a
USB cable / Bluetooth® Basic organizer (including day, week, and month) with
Outlook® and Lotus Notes® synchronization, PIM SMS, voice messaging (via MMS) EMS and MMS, e-mail client Pop3 MMS supporting text, still images, voice and animations SyncML 1.2.1 (or higher via OBEX and OTA) Handsfree operation Dual-speaker system for outstanding sound quality 64-chord polyphonic ringtones, MIDI Very slim appearance Real metal keypad and housing (brushed aluminum) WAP 2.0 stack Java MIDP 2.x Wide range of headset and car kit solutions with Bluetooth® technology
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2 S68 Interface to Accessories

Original Accessories
Fashion & Carry
Leather Case FCL-720
Energy
Li-Ion Battery 660 mAh EBA-120 Travel Charger (EU & UK) ETC-100/110 Car Charger Plus ECC-100 Desk Top Stand EDS-100
Handsfree Portable
Headset Basic HHS-100 Headset HHS-110 Headset Purestyle HHS-120 Headset Bluetooth® HHB-100 Headset Bluetooth® Clip HHB-130/131 Headset Bluetooth® Comfort HHB-160/161 Headset Bluetooth® HHB-700/710 Charger Adapter ECA-500 (for HS BT HHB-700/710) Charger Adapter ECA-100 (for HS BT HHB-130/131/160/161)
Car Solutions
Car Kit Bluetooth® Easy HKW-100 Car Kit Bluetooth® Portable HKW-700 Car Kit Bluetooth® HKW-710 (successor of HKW-600) Car Kit Bluetooth® SIM HKW-720 Car Kit Portable HKP-100 Mobile Holder HMH-100
Office
Data Cable DCA-100 (RS232) Data Cable USB DCA-140 Sync Station DSC-100
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3 Unit Description of S68

Highly attractive premium design: very slim phone (13 mm) with real metal (brushed aluminum) surface and keypad. Focusing on the core and most convenient business functions, PIM, Bluetooth®, Fax and Document Viewer, and other business applications that enrich professional life. New simplified and intuitive menu structure. Fast Dialing™ key, voice messaging (via MMS), dictaphone, and e-mail client. Excellent overall ergonomics. Superb sound quality (including handsfree talking). Optimal visibility of content display under all lighting conditions.
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4 Exploded View of S68

Without illustration:
Shielding Cover RF Shielding Cover BB Top Shielding Cover BB BOT Shielding Cover BT
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Disassembly of S68

All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered. For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Step 2
Remove Battery Cover and Battery.
Remove screws with the Torque –
Screwdriver.
T5+
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Step 3
Step 4
Disassemble Upper Case from Lower Case.
Step 5
Technical Documentation
To avoid scratches, it is mandatory to place
a protection foil onto the display!
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Step 6
Step 7
Remove Keypad MMI by using Tweezers
carefully.
Remove Keypad by using Tweezers
carefully.
Step 8
Use Tweezers to remove Earpiece.
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Step 9
Step 10
.Remove PCB from Lower Case.
Step 11
Disconnect Flex Cable from PCB socket by
using Tweezers.
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Step 12
Step 13
Loosen Display Module from PCB with
Alternative Opening Tool.
Step 14
Remove Ringer.
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Step 15
Step 16
Remove Vibramotor by using Tweezers.
Use Tweezers to remove Microphone.
Step 17
Use Tweezers to remove Side Keys and
Side Keys MMI.
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ypad
r
yp
y
p
Step 18
Overview Lower Parts
Ringer
Side Keys
Side Switch
Overview Upper Parts
Ke
Upper Case Shell
Lower Case
Battery Cover
Batter
Vibramoto
Microphone
Display Module
RF Control
Ke
ad MMI
Ear
iece
Board S68
Screws
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6 Assembly of S68

Step 1
Step 2
Assemble Ringer by using Tweezers.
Assemble Microphone by using Tweezers
Step 3
Assemble Vibramotor by using Tweezers.
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Step 4
Step 5
Assemble Side Keys and Side Keys MMI
Assemble Display Module on PCB.
Step 6
Technical Documentation
Connect Flex Cable with PCB socket.
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Step 7
Step 8
Assemble Keypad.
Assemble Keypad MMI.
Step 9
Assemble Earpiece.
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Step 10
Step 11
Attention! Before assembling the Display
Module it is mandatory to remove the
Display Foil!
Place PCB with assembled Display in the
Upper Case.
Step 12
Assemble Lower Case onto the Upper
Case.
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Step 13
Step 14
Place screws with the Torque –
Screwdriver.
T5+
Assemble Battery.
Step 15
Assemble Battery Cover.
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7 BenQ Service Equipment User Manual

Introduction
Every LSO repairing BenQ handset must ensure that the quality standards are observed. BenQ has developed an automatic testing system that will perform all necessary measurements. This testing system is known as:
BenQ Mobile Service Equipment
For disassembling / assembling
Torque – Screwdriver
Part Number: F 30032 – P 228 – A1
Opening tool
(Case opening without destroying)
Part Number: F 30032 – P 38 – A1
Alternative Opening tool
Part Number: F30032 – P583 – A1
Tweezers
For testing
All mobile phones have to be tested with the GRT – Software. The service partner is responsible to ensure that all required hardware is available.
For additional Software and Hardware options as well as the supported GRT equipment, please check the GRT User manual.
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8 GRT Software: Functionality Configuration

Sep 1: Select „Settings >> SWUP / JPICS”
Step 2: Proceed as follows:
¾ Select all required Variants you need to repair (click onto the “+” in
front of the product name.
¾ Check Com-Port setting. If necessary change it ¾ Check speed setting. Select always the lowest speed if your PC
does not have a fast serial card
¾ Enter the value for “JPICS Server Timeout”. Be careful, this value
defines how long GRT tries to reach the server until you get an error message. Do not select a very long time
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Step 3: Connect to GRM Server
Choose in the section „GRM” the „Connect to GRM Database“ functionality
Enter your GRT-Username and Password into this fields
Activate always both boxes if you connect to the database. Start with “Connect”
It you IT infrastructure parameter have changed, use this button to move to the configuration mask
End the connection with a click onto the „Exit button“ (appearing after successful data exchange)
GRT Software has now finished all required settings and configuration tasks. All
files have been down- and uploaded. In dependency of the selected number of mobile phones and variants the volume of transferred date could be (~100MB)
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9 GRT Software: Regular Usage

Step 1: Select the section SWUpdate
Step 2: Choose the area you want to work with
Personal Repair
Personal Repair is always accessible. Basis for the decision if a SW-Update is authorised by Siemens is the so called
Example: Mobile Phone has already SW50. SW50
In this case SW-Update is not necessary and therefore not
authorised
In any case customer data can be erased on request. (xfs and mapping have to be activated) Of course JPICS hardware and authorisation have to be available.
Operator SWAP
This area is only accessible if you are released by the service management to perform SW-Updates for Net-Operators. Basis for the decision if a SW­Update is authorised by Siemens is the so called
Customer data will be erased without any exception and any chance to influence by the user. JPICS hardware and authorisation have to be available.
Operator SWUpdate
This area is only accessible if you are released by the service management to perform SW-Updates for Net-Operators. Basis for the decision if a SW­Update is authorised by Siemens is the so called Master-Table .
Service Release-Table .
Service -Release-Table shows
Master-Table .
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)
A
dow above
Like in “Personal Repair” customer data can be erased on request. (xfs and mapping have to be activated) Of course JPICS hardware and authorisation have to be available.

9.1 Window explanation

This general explanation is valid for all SW-Update channels (Personal Repair, Operator SWAP, Operator SWUpdate)
1.1.1.1.1.1.3 Automatic read out function of phone type/Variant. Appearing in the win
.
Remarks:
In case of malfunction please check
o Is the correct phone type selected o Is the correct COM-Port selected o If a variant is missing, move back to Settings select the missing variant and
conncet the GRM Server. Then continue with SW-Update.
After using „Check Variant“ Phone IMEI­Number will be shown here
Select boxes for: Content = xfs Settings = mapping
Attention:
ctivation of the boxes will cause erase of customer date while SW­Update
Window to select the mobile phone CPU
Shows the different SW –Versions a) SW inside the mobile phone b) Version of Service Release Table SW
Version of Master Table SW
c
Start button for SW­Update
Stop / leave SW-Update
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9.2 Case 1: Personal Repair (green)

Step 1: Carry out step 1 – 4 to start SW-Update.
Remarks:
1.1.1.1.1.1.2 Read out phone type/Variant. >>Appears in the window above .
- The decision about a Siemens authorised SW-Update depends only on the Service Release-Table .
- The SW which is booted by GRT can be below the SW mentioned in the Service Release Table, if this SW is not released for the Net-Operator
- If xfs and mapping are activated, GRT will erase in any case the customer data even if the action is cancelled.
- If the user wants to download an other variant then the automatically identified one, he has simply to select an other variant from the list. Afterwards he has to start the SW-Update
Select the mobile phone CPU type
Start SW-Update
Choose if customer data shall be erased. If “Yes” activate the boxes in front of xfs and mapping
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9.3 Case 2: Operator SWAP (red)

Step 1: Carry out step 1 – 4 to start SW-Update.
Remarks:
1.1.1.1.1.1.1 Read out phone type/Variant. >>Appears in the window above.
- The decision about a Siemens authorised SW-Update depends only on the Master-Table .
- The user has no chance to influence the decision
- Xfs and mapping are always activated there is no chance to deactivate them.
GRT will erase in any case the customer data even if the action is cancelled.
- If the user wants to download an other variant then the automatically identified one, he
has simply to select an other variant from the list. Afterwards he has to start the SW-
Update
Select the mobile phone CPU type
Start SW-Update
Choose if customer data shall be erased. If “Yes” activate the boxes in front of xfs and mapping
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9.4 Case 3 Operator SWUPdate (blue)

Step 1: Carry out step 1 – 4 to start SW-Update.
Remarks:
1.1.1.1.1.1.4 Read out phone type/Variant. >>Appears in the window above.
- The decision about a Siemens authorised SW-Update depends only on the Master-Table .
- The user has no chance to influence the decision
- Xfs and mapping can be activated on demand. GRT will erase in any case
the customer data even if the action is cancelled.
- If the user wants to download an other variant then the automatically identified one, he has simply to select an other variant from the list. Afterwards he has to start the SW-Update
Select the mobile phone CPU type
Start SW-Update
Choose if customer data shall be erased. If “Yes” activate the boxes in front of xfs and mapping
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10 JPICS (Java based Product Information Controlling System)

10.1. Overview
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The following functions are available for the LSO:
General mobile information
Generate PINCODE
Generate SIMLOCK – UNLOCK – Code
Print IMEI labels
Lock, Unlock and Test the BF – Bus
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The access to the JPICS server which is located in Kamp – Lintfort is protected by chip card and in addition using secure socket layer (SSL) connection. The JPICS server is only available for authorized users with a specially coded smart card. These smart cards and the administration of the JPICS web server and the PICS database – server can only be provided by the JPICS – TRUST – Center of the
responsible department in Kamp – Lintfort. In case of any questions or requests concerning smart cards or administration of the databases please ask your responsible BenQ Customer Care Manager.
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10.2. Installation overview
The following installation description assumes that a web browser is already installed. JPICS is tested with the following browsers:
Internet Explorer Version 5.5 and higher
1. Netscape Version 6 and higher
2.
For further information regarding supported browsers, browser version and supported operating systems, see the
Sun FAQ’s.
Here is a step by step instruction to install all the required components:
It is necessary to follow this order!
Smart Card Reader (Omnikey: Cardman 2020 USB or Cardman 3121 USB)
1. CardOS interface (Siemens Version 3.0 B)
2. Java Runtime Environment (Sun)
3. Java additional components
4.
Every user is responsible for a proper installation matching the license agreements.
For installation and further access you need the following:
1. The JPICS Installation – CD
2. The Smart Card JPICS. These cards can be ordered via your responsible Customer Care Manager within Siemens or on
http://jpics.siemens.com/jpics/admin/request-
new_jpics.jsp
3. A supported Smart Card Reader (Omnikey Cardman) in order to access your Smart Card.
Remark: We recommend using Cardman 2020 USB or Cardman 3121 USB. Serial card readers are not supported!!
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10.3. Generate Codes
Masterphone codes
The Masterphone code is used to unlock blocked mobiles. Masterphone codes can only be supplied for mobiles which have been delivered in a
regular manner.
In the JPICS application you can choose to generate:
Masterphone codes
Simlock – Unlock – Codes
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Simlock – Unlock – Code
The Simlock – Unlock – Codes can only be generated if the following conditions are given:
Mobile must have an active Simlock inside.
The user must be given the authorization to obtain Simlock – Unlock – Codes for
the variant of the operator to which the mobile was delivered last time.
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10.4. Printing IMEI label
The module “printing IMEI label” offers the possibility to re-print IMEI labels for mobiles again.
You are able to print 1 label in just one step.
To prevent that misaligned labels are being printed, the setting “Print test labels =
9” is
activated by default. After having printed a well aligned test label you can uncheck the setting and print the correct label.
Hint:
For correct printing of IMEI labels you must have a Zebra – label printer with special material that fits for label printing. This printer has to be connected to local LPT1 printer port (also see Installation of IMPRINT) and MUST feature a printing resolution of 300dpi.
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11 International Mobile Equipment Identity, IMEI

The mobile equipment is uniquely identified by the International Mobile Equipment Identity, IMEI, which consists of 15 digits. Type approval granted to a type of mobile is allocated 6 digits. The final assembly code is used to identify the final assembly plant and is assigned with 2 digits. 6 digits have been allocated for the equipment serial number for manufacturer and the last digit is spare.
The part number for the S68 is S30880-S1150-#xxx where the last for letters specify the housing and software variant.
S68 series IMEI label is accessible by removing the battery.
Re – use of IMEI label is possible by using a hair – dryer to remove the IMEI label.
On this IMEI label, BenQ has also includes the data code for production or service, which conforms to the industrial standard DIN EN 60062. The data code comprises of 2 characters: first character denotes the year and the second character denotes the month.
For example: S5
CODE Year Month CODE
P 2 0 0 2 M A R C H 3
R 2 0 0 3 A P R I L 4
S
2 0 0 4 M A Y
5
T 2 0 0 5 J U N E 6 U 2 0 0 6 J U L Y 7
To display the IMEI number, exit code and SW/HW version, key: * # 0 6 #
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12 General Testing Information

General Information
The technical instruction for testing GSM mobile phones is to ensure the best repair quality.
Validity
This procedure is to apply for all from Siemens AG authorized level 2 up to 2.5e workshops.
Procedure
All following checks and measurements have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered.
Get delivery:
¾ Ensure that every required information like fault description, customer data a.s.o. is
available.
¾ Ensure that the packing of the defective items is according to packing requirements. ¾ Ensure that there is a description available, how to unpack the defective items and
what to do with them.
Enter data into your database: (Depends on your application system)
¾ Ensure that every data, which is required for the IRIS-Reporting is available in your
database.
¾ Ensure that there is a description available for the employees how to enter the data.
Incoming check and check after assembling:
!! Verify the customers fault description!!
¾ After a successful verification pass the defective item to the responsible
troubleshooting group.
¾ If the fault description can not be verified, perform additional tests to save time and to
improve repair quality.
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- Switch on the device and enter PIN code if necessary unblock phone.
- Check the
- Check the display for error in
function of all keys including side keys.
line and row, and for illumination.
- Check the ringer/loudspeaker acoustics by individual validation.
- Perform a GSM Test as described on page 36.
Check the storage capability:
¾ Check internal resistance and capacity of the battery. ¾ Check battery charging capability of the mobile phone. ¾ Check charging capability of the power supply. ¾ Check current consumption of the mobile phone in different mode.
Visual inspection:
¾ Check the entire board for liquid damages. ¾ Check the entire board for electrical damages. ¾ Check the housing of the mobile phone for damages.
SW update:
¾ Carry out a software update and data reset according to the master tables and
operator/customer requirements.
Repairs:
The disassembling as well as the assembling of a mobile phone has to be carried out by considering the rules mentioned in the dedicated manuals. If special equipment is required the service partner has to use it and to ensure the correct function of the tools. If components and especially soldered components have to be replaced all rules mentioned in dedicated manuals or additional information e.g. service information have to be considered
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GSM Test:
With the availability of the GRT Test /Alignment software, this tool has to be used to perform the outgoing test!
>Connect the mobile/board via internal antenna (antenna coupler) and external antenna (Car cradle/universal antenna clip) to a GSM tester >Use a Test SIM
For Triple Band phones use a separate test case, if the test software allows only one handover. Skip the GSM Band test cases if not performed by the mobile phone
Example: 1. Test file Band 1 = GSM900 / Band 2 = GSM1800
2. Test file Band 1 = GSM1900
Internal Antenna
Test case Parameter Measurements Limits
1 Location Update • GSM Band 1
• BS Power = -55 dBm
• middle BCCH
2 Call from BS • low TCH
• highest PCL
• BS Power = -75 dBm
• middle BCCH
3 TX GSM Band 1 • low TCH
• highest PCL
• BS Power = -75 dBm
• middle BCCH
4 Handover to GSM Band 2
Including Handover Check
5 TX GSM Band 2 • low TCH
6 Call release from BS
• highest PCL0
• BS Power = -75 dBm
• middle BCCH
• Display check • individual check
• Ringer/Loudspeaker
check
• Frequency Error
• Phase Error RMS
• Phase Error Peak
• Average Power
• Power Time Template
• Frequency Error
• Phase Error RMS
• Phase Error Peak
• Average Power
• Power Time Template
• individual check
• GSM Spec.
• GSM Spec.
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External Antenna
7 Call from MS • GSM900
• high TCH
• second highest PCL
• BS Power = -75 dBm
• middle BCCH
8 TX GSM Band 1 • high TCH
• second highest PCL
• BS Power = -75 dBm
• middle BCCH
9 RX GSM Band 1 • high TCH
• BS Power = -102 dBm
• 50 Frames
• middle BCCH
10 Handover to GSM Band 2
Including Handover Check
11 TX GSM Band 2 • high TCH
12 RX GSM Band2 • high TCH
13 Call release from MS
• second highest PCL
• BS Power = -75 dBm
• middle BCCH
• BS Power = -102 dBm
• 50 Frames
• middle BCCH
• Keyboard check • individual check
• Frequency Error
• Phase Error RMS
• Phase Error Peak
• Average Power
• Power Time Template
• RX Level
• RX Qual
• BER Class Ib
• BER Class II
• BER Erased Frames
• Frequency Error
• Phase Error RMS
• Phase Error Peak
• Average Power
• Power Time Template
• RX Level
• RX Qual
• BER Class Ib
• BER Class II
• BER Erased Frames
• GSM Spec.
• GSM Spec.
• GSM Spec.
• GSM Spec.
Final Inspection:
The final inspection contains:
1) A 100% network test (location update, and set up call).
2) Refer to point 3.3.
3) A random sample checks of:
- Data reset (if required)
- Optical appearance
- complete function
4) check if PIN-Code is activated (delete the PIN-Code if necessary). Basis is the international standard of DIN ISO 2859. Use Normal Sample Plan Level II and the Quality Border 0, 4 for LSO. Remark: All sample checks must be documented.
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Annex 1
Test SIM Card There are two different “Test SIM Cards” in use:
1) Test SIM Card from the company “ORGA” Pin 1 number: 0000
PUK 1 : 12345678 Pin 2 number: 0000
PUK 2 : 23456789
2) Test SIM Card from the company “T-D1” Pin 1 number: 1234
PUK : 76543210 Pin 2 number: 5678
PUK 2 : 98765432
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Annex 2
Battery Date Code overview
Varta
Date code example N 9 A VA
Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
Hitachi / Maxwell
Date code example N 9 A MX
Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
Sanyo
Date code example N 9 A SY
Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
NEC
Date code example N 8 A NT
Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
Panasonic
Date code example O N A PAN
Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
Sony
Date code example P N A SO
Year (O:2002, P:2003...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…)
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13 Introduction of Service Repair Documentation
for Level 3 Basic Repairs – S68
This part of Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3basic (only for workshops without level 3 equipment (special agreement required). The described failures shall be repaired in BenQ authorized local workshops only.
The level 3basic partners are obliged to send exchanged boards (SWAP) to the next higher Service Repair Partner.
All repairs have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S68 Level 1-2 repair documentation. It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document (both documents are available in the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all S68 related Customer Care Information
S68 Part number on IMEI label: S30880-S1150-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication market), avoid excessive heat.
13.1 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 3 basic.
13.2 Terms and Abbreviations
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14 List of available Level 3 Basic Parts

(According to Component Matrix V1.09 - check C-market for updates)
Product ID Order Number Description CM
S68 X1400 L50634-Z97-C467 CONNECTOR BATTERY 3-POL X85 S68 X1504 L50634-Z93-C364 IO-JACK NANO 12-POL S68 X1605 L50634-Z97-C406 CONNECTOR SIM CARD READER R65 (B) S68 X2201 L50697-F5008-F340 CONNECTOR BOARD TO BOARD 20-POL B S68 X2705 L50634-Z97-C363 CONNECTOR BOARD TO BOARD 14-POL. X75 S68 Z1601 L50620-U6029-D670 FILTER EMI (Fi-Type6) PB Free

15 Hardware Requirements

(According to L2.5L-L2.5 General soldering information V1.3 - check C-market for updates) Jigs, Tools and working materials for all described repairs:
hot air blower soldering gun tweezers flux solder
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16 S68 Board Layout

Upper board side
LCD - Module
BB-shielding top
BTB-connector 14pin
Lower board side
BT-shieldin
Battery-contact for
SIM – card reader with fla
RF-shielding
BB-shielding bottom
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 42 of 47
New nano - I/O - connecto
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17 SIM Card Problems

Fault Symptoms
Customer: GRT:
Handset does not accept SIM card
SIM Card Problems
Watch for oxidation and
damaged pads of the
SIM Card reader
Check the status of the
EMI Filter visually
Not oka
Check the status of the
SIM Card reader visually
Okay
Exchange
SIM Card reader
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring contacts
and soldering contacts.
The value must be ~0
Connector SIM Card Reader Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50634-Z97-C406 E-commerce order name: CONNECTOR SIM CARD READER R65 (B) Soldering temperature: ~ 360°C TIP Temp.
EMI Filter Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50620-U6029-D670 E-commerce order name: FILTER EMI (Fi-Type6) PB Free Soldering temperature: ~ 360°C TIP Temp IRIS Diagnose Code: 43300 Interface/SIM Card reader/Mechanical Damage
SIM Card Problems
Not oka
Okay
Okay
Not oka
Okay
Back to customer without
SCRAP - has to be send
Continue with higher
repair
Caused by customer
separately to WSC
Exchange the
dama
ed Filter
- check for twisted or bent contacts
- check for dry joints
repair level
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18 IO Connector Problems

Fault Symptoms
Customer: GRT:
Charging Problems Problems with external loudspeaker or microphone when using a
car kit Problems with accessories connected at the IO connector
IO connector Problems
Watch for oxidation and
damaged pads of the
IO connector
Not oka
Okay
Not oka
Not oka
Check the dust inside the
IO connector
Okay
Check the status of the
IO connector visually
Exchange
IO connector
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring contacts
and soldering contacts.
The value must be ~0
Okay
Connector IO Jack Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50634-Z93-C364 E-commerce order name: IO-JACK NANO 12-POL Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage
47300 Interface/Data Interface/Mechanical Damage 4B100 Interface/Headset Connector/Mechanical Damage
No connection to GRT
Back to customer without
Caused by customer
SCRAP - has to be send
separately to WSC
Clean IO connector
- check for twisted or bent contacts
- check for dry joints
Continue with higher
repair level
repair
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19 B to B Connector (upper slider part) Problems

Fault Symptoms
Customer: GRT:
Upper slider keyboard malfunction Upper slider keypad illumination does not work Display problems
B to B connector problems
Watch for oxidation and
damaged pads of the
B to B connector
Okay
Not oka
Check the status of the B
to B connector visually
Okay
Exchange
B to B connector
Not oka
Continue with higher
repair level
Connector Board to Board Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50697-F5008-F340 L50634-Z97-C363 E-commerce order name: CONNECTOR BOARD TO BOARD 20-POL
CONNECTOR BOARD TO BOARD 14-POL. X75
Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 32200 Keys / Main / Reduced Functionality
36000 Keys / Illumination D TO BOARD 30-POL
Keyboard malfunction Current measured failed
Back to customer without
Not oka
SCRAP - has to be send
repair
Caused by customer
separately to WSC
- check for twisted or bent contacts
- check for dry joints
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20 Battery Connector Problems

Okay
Okay
Not oka
Okay
Back to customer without
SCRAP - has to be send
Continue with higher
repair
Caused by customer
separately to WSC
- check for twisted or bent contacts
- check for dry joints
repair level
Fault Symptoms
Customer: GRT:
Mobile does not switch on No connection to GRT
Battery connector problems
Watch for oxidation and
damaged pads of the
battery connector
Not oka
Check the status of the
battery connector visually
Exchange battery
connector
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring contacts
and soldering contacts.
The value must be ~ 0.
Connector BATTERY Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards.
E-commerce order number: L50634-Z97-C467 E-Commerce name: CONNECTOR BATTERY 3-POL X85 Soldering temperature: 240 - 255°C IRIS Diagnose Code: 13000 Battery/Mechanical Damage
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21 Filter EMI Problems

Fault Symptoms
Customer: GRT:
Handset does not allow data communication via I/O connector
EMI Filter Problems
Watch for oxidation and
damaged pads of the
EMI Filter
Okay
Not oka
Check the status of the
EMI Filter visually
Okay
Exchange
EMI Filter
Not oka
Use the resistor test
function of a multimeter
to check connection
between spring contacts
and soldering contacts.
EMI Filter Use hot air blower to remove defective component. Avoid excessive heat! Watch
surrounding components! Resolder new component afterwards. E-commerce order number:
E-commerce order name:
FILTER EMI (Fi-Type6) PB Free
L50620-U6029-D670
Soldering temperature: ~ 360°C TIP Temp IRIS Diagnose Code: 47000 Data connectivity
No service mode possible No software update possible
Not oka
Okay
Back to customer without
Caused by customer
SCRAP - has to be send
separately to WSC
Exchange the
damaged Filter
Continue with higher
repair level
repair
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TD_Repair_L1-L3_SC120_R1.0.pdf Page 47 of 47
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