Siemens S68 Service Manual

Release 1.0
Service Manual
S68
Level 1-3
Release Date Department Notes to change
R 1.0 22.02.2006 BenQ Mobile S CC CES New document
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 1 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Table of Content
1 Key Feature................................................................................................................................3
2 S68 Interface to Accessories....................................................................................................4
3 Unit Description of S68.............................................................................................................5
4 Exploded View of S68 ...............................................................................................................6
5 Disassembly of S68...................................................................................................................7
6 Assembly of S68......................................................................................................................14
7 BenQ Service Equipment User Manual.................................................................................19
8 GRT Software: Functionality Configuration..........................................................................20
9 GRT Software: Regular Usage ...............................................................................................22
10 JPICS (Java based Product Information Controlling System)............................................27
11 International Mobile Equipment Identity, IMEI......................................................................33
12 General Testing Information...................................................................................................34
13 Introduction of Service Repair Documentation for Level 3 Basic Repairs – S68..............40
14 List of available Level 3 Basic Parts.....................................................................................41
15 Hardware Requirements.........................................................................................................41
16 S68 Board Layout...................................................................................................................42
17 SIM Card Problems .................................................................................................................43
18 IO Connector Problems .........................................................................................................44
19 B to B Connector (upper slider part) Problems....................................................................45
20 Battery Connector Problems.................................................................................................. 46
21 Filter EMI Problems.................................................................................................................47
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 2 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0

1 Key Feature

Standard Systems
Stand-by Time Talk Time Battery Technology Battery Capacity Weight Volume Length Width Thickness Storage SIM Functionality / Security Controls
Antenna Data Services
Display / Display Illumination
Camera
Connectivity Features
Tri-band GSM 900/1800/1900 EGSM (GSM phase 2/phase 2+) GPRS class 10 Vocoders FR, HR, EFR, AMR Up to 300 h (standard battery)
Up to 300 min (standard battery) Battery: Li-Ion 660 mAh
Charging time: Less than 2 h for 100%
78,5 g 44 cm³ 107 mm 46 mm 13,2 mm 8 MB user memory SIM Application Toolkit (class 3)
SIM lock, various levels PIN 1 & 2 control Ciphering A5.1, A5.2 and A5.3 SIM plug-in (3/1.8 V), SAT class 3 Integrated
Mobile Internet access (WAP 1.2.1 plus parts of 2.0) Data download OTA via SMS or WAP MMS release 98 EMS rel. 4.3 Data services (CSD) at 9.6 Kbps and GPRS (up to 53.6 Kbps) E-mail client 132 x 176 pixels, 262,144 colors, enhanced TFT, transflective, high-end flat PMMA window n / a
USB cable / Bluetooth® Basic organizer (including day, week, and month) with
Outlook® and Lotus Notes® synchronization, PIM SMS, voice messaging (via MMS) EMS and MMS, e-mail client Pop3 MMS supporting text, still images, voice and animations SyncML 1.2.1 (or higher via OBEX and OTA) Handsfree operation Dual-speaker system for outstanding sound quality 64-chord polyphonic ringtones, MIDI Very slim appearance Real metal keypad and housing (brushed aluminum) WAP 2.0 stack Java MIDP 2.x Wide range of headset and car kit solutions with Bluetooth® technology
Technical Documentation
02/2006
TD_Repair_L2.5L_S68_R1.0.pdf Page 3 of 47
Company Confidential
2005©BenQ
Release 1.0

2 S68 Interface to Accessories

Original Accessories
Fashion & Carry
Leather Case FCL-720
Energy
Li-Ion Battery 660 mAh EBA-120 Travel Charger (EU & UK) ETC-100/110 Car Charger Plus ECC-100 Desk Top Stand EDS-100
Handsfree Portable
Headset Basic HHS-100 Headset HHS-110 Headset Purestyle HHS-120 Headset Bluetooth® HHB-100 Headset Bluetooth® Clip HHB-130/131 Headset Bluetooth® Comfort HHB-160/161 Headset Bluetooth® HHB-700/710 Charger Adapter ECA-500 (for HS BT HHB-700/710) Charger Adapter ECA-100 (for HS BT HHB-130/131/160/161)
Car Solutions
Car Kit Bluetooth® Easy HKW-100 Car Kit Bluetooth® Portable HKW-700 Car Kit Bluetooth® HKW-710 (successor of HKW-600) Car Kit Bluetooth® SIM HKW-720 Car Kit Portable HKP-100 Mobile Holder HMH-100
Office
Data Cable DCA-100 (RS232) Data Cable USB DCA-140 Sync Station DSC-100
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 4 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0

3 Unit Description of S68

Highly attractive premium design: very slim phone (13 mm) with real metal (brushed aluminum) surface and keypad. Focusing on the core and most convenient business functions, PIM, Bluetooth®, Fax and Document Viewer, and other business applications that enrich professional life. New simplified and intuitive menu structure. Fast Dialing™ key, voice messaging (via MMS), dictaphone, and e-mail client. Excellent overall ergonomics. Superb sound quality (including handsfree talking). Optimal visibility of content display under all lighting conditions.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 5 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0

4 Exploded View of S68

Without illustration:
Shielding Cover RF Shielding Cover BB Top Shielding Cover BB BOT Shielding Cover BT
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 6 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0

Disassembly of S68

All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered. For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Step 2
Remove Battery Cover and Battery.
Remove screws with the Torque –
Screwdriver.
T5+
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 7 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Step 3
Step 4
Disassemble Upper Case from Lower Case.
Step 5
Technical Documentation
To avoid scratches, it is mandatory to place
a protection foil onto the display!
02/2006
TD_Repair_L2.5L_S68_R1.0.pdf Page 8 of 47
Company Confidential
2005©BenQ
Release 1.0
Step 6
Step 7
Remove Keypad MMI by using Tweezers
carefully.
Remove Keypad by using Tweezers
carefully.
Step 8
Use Tweezers to remove Earpiece.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 9 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Step 9
Step 10
.Remove PCB from Lower Case.
Step 11
Disconnect Flex Cable from PCB socket by
using Tweezers.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 10 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Step 12
Step 13
Loosen Display Module from PCB with
Alternative Opening Tool.
Step 14
Remove Ringer.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 11 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Step 15
Step 16
Remove Vibramotor by using Tweezers.
Use Tweezers to remove Microphone.
Step 17
Use Tweezers to remove Side Keys and
Side Keys MMI.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 12 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
ypad
r
yp
y
p
Step 18
Overview Lower Parts
Ringer
Side Keys
Side Switch
Overview Upper Parts
Ke
Upper Case Shell
Lower Case
Battery Cover
Batter
Vibramoto
Microphone
Display Module
RF Control
Ke
ad MMI
Ear
iece
Board S68
Screws
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 13 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0

6 Assembly of S68

Step 1
Step 2
Assemble Ringer by using Tweezers.
Assemble Microphone by using Tweezers
Step 3
Assemble Vibramotor by using Tweezers.
Technical Documentation TD_Repair_L2.5L_S68_R1.0.pdf Page 14 of 47
Company Confidential
2005©BenQ
02/2006
Release 1.0
Step 4
Step 5
Assemble Side Keys and Side Keys MMI
Assemble Display Module on PCB.
Step 6
Technical Documentation
Connect Flex Cable with PCB socket.
02/2006
TD_Repair_L2.5L_S68_R1.0.pdf Page 15 of 47
Company Confidential
2005©BenQ
Loading...
+ 32 hidden pages