11 BUFFER CAPACITOR C906 (ONLY HIT VERSION).......................................................................33
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Information and Communication Mobile
Mobile Phones
1 Introduction
ME/S45 product family, consists of 2 different dualband handsets (GSM-900 and GSM-
1800), which can easily be distinguished from the second block of the partnumber printed on
the IMEI label.
This product is developed with different HW in the radio part, which can not be distinguished
on the IMEI label. The HITACHI (HIT) as the INFINEON (IFX) boards have the same logic
part. For all described Level 2.5 components you find a board type identification in the
document as shown below.
HIT component used only in HITACHI version
IFX component used only in INFINEON version
HIT/IFX component used in HITACHI and INFINEON versions
Partnumber on IMEI label:
1) ME45: S30880-S4600-#xxx
2) S45: S30880-S4500-#xxx
,while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
3) 3618/ME45 S30880-S4600-#xxx
4) 6618/S45 S30880-S4500-#xxx
,while # may be any letter (A-Z) and xxx may be any number from 800, 801, 802....
The information in this manual applies to both types, ME45 and S45, unless otherwise noted.
This manual is intended to help you carry out repairs on level 2.5, meaning limited
component repairs. Failure highlights are documented and should be repaired in the local
workshops.
It must be noted that all repairs have to be carried out in an environment set up according to
the ESD (Electrostatic Discharge Sensitive Devices) regulations defined in international
standards.
If you have any questions regarding the repair procedures or technical questions about the
spare parts do not hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Charging problems.
Problems with external loudspeaker or microphone
when using a car kit.
Problems with accessories connected at the I/O
connector.
Problems with SW booting.
4.2.2 Fault Symptom on GSM-Tester:
This fault cannot be detected with a GSM-Tester
4.3 Priority:
p ........ Mandatory
x
p
........ Repair
........ Optional
p........ Not Yet Defined
4.4 Repair Documentation
4.4.1 Description of procedure:
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Information and Communication Mobile
Mobile Phones
4.4.1.1 Diagnosis
Visually check the bottom connector. Watch for dry joints!
4.4.1.2 Repair by component change
Use hot air blower remove defective I/O connector.
Avoid excessive heat!
Watch surrounding components!