11 BUFFER CAPACITOR C906 (ONLY HIT VERSION).......................................................................33
V1.2 Page 2 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
1 Introduction
ME/S45 product family, consists of 2 different dualband handsets (GSM-900 and GSM-
1800), which can easily be distinguished from the second block of the partnumber printed on
the IMEI label.
This product is developed with different HW in the radio part, which can not be distinguished
on the IMEI label. The HITACHI (HIT) as the INFINEON (IFX) boards have the same logic
part. For all described Level 2.5 components you find a board type identification in the
document as shown below.
HIT component used only in HITACHI version
IFX component used only in INFINEON version
HIT/IFX component used in HITACHI and INFINEON versions
Partnumber on IMEI label:
1) ME45: S30880-S4600-#xxx
2) S45: S30880-S4500-#xxx
,while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
3) 3618/ME45 S30880-S4600-#xxx
4) 6618/S45 S30880-S4500-#xxx
,while # may be any letter (A-Z) and xxx may be any number from 800, 801, 802....
The information in this manual applies to both types, ME45 and S45, unless otherwise noted.
This manual is intended to help you carry out repairs on level 2.5, meaning limited
component repairs. Failure highlights are documented and should be repaired in the local
workshops.
It must be noted that all repairs have to be carried out in an environment set up according to
the ESD (Electrostatic Discharge Sensitive Devices) regulations defined in international
standards.
If you have any questions regarding the repair procedures or technical questions about the
spare parts do not hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Charging problems.
Problems with external loudspeaker or microphone
when using a car kit.
Problems with accessories connected at the I/O
connector.
Problems with SW booting.
4.2.2 Fault Symptom on GSM-Tester:
This fault cannot be detected with a GSM-Tester
4.3 Priority:
p ........ Mandatory
x
p
........ Repair
........ Optional
p........ Not Yet Defined
4.4 Repair Documentation
4.4.1 Description of procedure:
V1.2 Page 10 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
4.4.1.1 Diagnosis
Visually check the bottom connector. Watch for dry joints!
4.4.1.2 Repair by component change
Use hot air blower remove defective I/O connector.
Avoid excessive heat!
Watch surrounding components!
Output power problems on the external and internal
antenna
No location update possible
6.2.3 Component Information:
The Antenna Connector is a mechanical switch operated by the RF plug of a carkit.
Normally the RF signal goes to and comes from the internal antenna. Whenever an RF plug
is plugged into the antenna connector the connection to the internal antenna is opened and
the connection to the external antenna socket is made. When the antenna connector is
blocked without RF plug the connection to the internal antenna is also opened. See drawing
below.
V1.2 Page 17 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
From Power
Amplifier/
To Receiver
To / From
Internal
Antenna
6.3 Priority:
p ........ Mandatory
x
p
........ Repair
........ Optional
p........ Not Yet Defined
6.4 Repair Documentation
6.4.1 Description of procedure:
6.4.1.1 Diagnosis
Check the output power of the handset with the LSO testprogram.
Especially watch the external antenna power!
6.4.1.2 Repair by component change
Use hot air to remove defective antenna connector.
Avoid excessive heat!
Watch surrounding components!!
Resolder new module afterwards
6.4.1.3 Repair by SW-Booting
Not possible!
V1.2 Page 18 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
6.4.1.4 Test
Retest handset after repair
6.4.2 List of needed material
6.4.2.1 Components
Antenna connector S45, ME45, 3618, 6618 HIT/IFX
Part-Number: L36334-Z93-C272
6.4.2.2 Jigs and Tools
Soldering Iron
Hot Air Blower
6.4.2.3 Special Tools
None
6.4.2.4 Working materials
Desolder Wick / Braid
Solder
V1.2 Page 19 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
6.4.3 Drawings
Figure 1: S45, ME45, 3618, 6618 board Antenna connector side
Use the diode test function of a multimeter to check the status of the
diode.
The typical voltage drop on the diode is 1.7V when testing the diode
function with the multimeter
9.4.1.2 Repair by component change
Use soldering iron to remove defective diode.
Avoid excessive heat!
Watch surrounding components!!
Use the diode test function of a multimeter to check the status of the
diode.
The typical voltage drop on the diode is 1.7V when testing the diode
function with the multimeter
10.4.1.2 Repair by component change
Use soldering iron to remove defective diode.
Avoid excessive heat!
Watch surrounding components!!
Resolder new diode afterwards
10.4.1.3 Repair by SW-Booting
Not possible!
10.4.1.4 Test
Retest handset after repair
10.4.2 List of needed material
10.4.2.1 Components
Keyboard LEDs S45, ME45, 3618, 6618 HIT/IFX
Part-Number: L36840-L2056-D670
10.4.2.2 Jigs and Tools
Soldering Iron
Hot Air Blower
10.4.2.3 Special Tools
None
10.4.2.4 Working materials
Desolder Wick / Braid
Solder
V1.2 Page 31 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
10.4.3 Drawings
Figure 1: S45, ME45, 3618, 6618 board keyboard LEDs side
V1.2 Page 32 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
11 Buffer Capacitor C906 (only HIT Version)
11.1 Affected Units
11.1.1 Type: S45, ME45, 3618, 6618 HIT
11.1.2 Affected IMEIs / Date Codes: All / All
11.1.3 Affected SW-Versions: All
11.2 Fault Description
11.2.1 Fault Symptoms for customers:
Mobile does not switch on.
Network Search
No location update possible
11.2.2 Fault Symptom on GSM-Tester:
Output power problems on the external and internal
antenna
No location update possible
11.3 Priority:
p ........ Mandatory
x
p
........ Repair
........ Optional
p........ Not Yet Defined
11.4 Repair Documentation
11.4.1 Description of procedure:
V1.2 Page 33 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
11.4.1.1 General Information
The purpose of the 150µF capacitor C906 is to buffer the battery
voltage. This is especially necessary during the Tx burst, when a high
current is taken from the battery.
If the cap is defective it is most likely burned and may cause a short
from the battery to ground.
11.4.1.2 Diagnosis
Check the status of the capacitor with a multimeter.
11.4.1.3 Repair by component change
Use soldering iron to remove defective capacitor.
Avoid excessive heat!
Watch surrounding components!!
IMPORTANT: DON`T USE A HOT AIR BLOWER FOR SOLDERING!
(The new component could be damaged by overheating)
Resolder new capacitor afterwards.
11.4.1.4 Repair by SW-Booting
Not possible!
11.4.1.5 Test
Retest handset after repair
11.4.2 List of needed material
11.4.2.1 Components
Buffer Capacitor C906 S45, ME45, 3618, 6618 HIT
Part-Number: L36385-F2157-M
11.4.2.2 Jigs and Tools
Soldering Iron
11.4.2.3 Special Tools
None
V1.2 Page 34 of 35 ICM MP CCQ S T
10/02
Information and Communication Mobile
Mobile Phones
11.4.2.4 Working materials
Desolder Wick / Braid
Solder
11.4.3 Drawings
Figure 1: S45, ME45, 3618, 6618 board capacitor side