Siemens L5L, S75 Service Manual
Release 1.0
Service Repair Documentation
Level 3 (2.5 light) – S75
Release Date Department Notes to change
R 1.0 04.10.2005 BenQMobile S CC CES New document
Technical Documentation
TD_Repair_L2.5L_S75_R1.0.pdf Page 1 of 15
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2005©BenQ
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Release 1.0
Table of Content
1 Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2 List of available level 2.5light parts.........................................................................................4
3 Hardware requirements ............................................................................................................4
4 S75 Board layout.......................................................................................................................5
5 SIM Card Problems ...................................................................................................................6
6 IO Connector Problems ............................................................................................................7
7 B to B connector (upper slider part) Problems ......................................................................9
8 Battery Connector Problems.................................................................................................. 10
9 MMC Connector Problems......................................................................................................11
10 Camera Connector Problems.................................................................................................12
11 IRDA Problems........................................................................................................................13
11 Display Problems ....................................................................................................................14
12 Main keypad illumination Problems ......................................................................................15
Technical Documentation
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Company Confidential
2005©BenQ
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Release 1.0
1 Introduction
1.1 Purpose
This Service Repair Documentation is intended to support Service partners to carry out repairs on
BenQ repair level 3 (former level 2,5light). The described failures shall only be repaired in BenQ
authorized local workshops.
The level 3 (former Level 2.5light) partners are obliged to repair level 3 classified boards, up to their
repair level, under consideration of this repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S75 Level 1-2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according to the
latest released General Test Instruction document (both documents are available in the Technical
Support section of the C-market).
Check at least weekly C-market for updates and consider all S75 related Customer Care Information
S75 Partnumber on IMEI label: S30880-S7700-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication
market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are
released to repair BenQ mobile phones up to level 3 (2.5 light).
1.3 Terms and Abbreviations
Technical Documentation
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2 List of available level 3 (2.5light) parts
(according to Component Matrix V1.09 - check C-market for updates)
Product ID Order Number Description CM
S75 V2631 L36197-F5008-F492 IRDA 115.2 KBIT
S75 V4902 L50640-L2108-D670 FLASH-LED HIGH BRIGHTN. WHITE
S75 X1400 L36334-Z97-C213 CONNECTOR BATTERY 3-POL
S75 X1504 L36334-Z93-C303 IO-JACK SLIM 12-POL
S75 X1604 L36334-Z97-C337 CONNECTOR SIM CARD READER K1
S75 X2200 L50634-Z97-C380 CONNECTOR DISPLAY 20POL
S75 X2705 L50634-Z97-C363 CONNECTOR BOARD TO BOARD 14-POL. X75
S75 X3500 L50634-Z97-C379 CONNECTOR CAMERA-SOCKET
S75 X3800 L36334-Z93-C297 CONNECTOR ANTENNA 6mm
S75 X4800 L50634-Z97-C348 CONNECTOR RS-MMC-READER X75
S75 Z1601 L50620-U6029-D670 FILTER EMI (Fi-Type7) PB Free
3 Hardware requirements
(according to L3-4 (L2.5L-L2.5) General soldering information V1.3 - check C-market for updates)
Jigs, Tools and working materials for all described repairs:
hot air blower
soldering gun
tweezers
flux
solder
S75 dome sheet jig
Technical Documentation
10/2005
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2005©BenQ
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r
4 S75 Board layout
Upper board side
Lower board side
IRDA
IO Jack
Slim
Connector
MMC
MMI
Connector
Connector
SIM Card
Reade
Connector
Display
Connector
Battery
Connector
Connector
Antenna
Technical Documentation
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Company Confidential
2005©BenQ
10/2005
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