Silicon Spreading Resistance Temperature Sensor in
Robust Threaded Metal Housing
Features
• Temperature dependent Resistor with Positive
Temperature Coefficient
• Selected at 25 ˚C,
• Corrosion resistant stainless steel housing with
connector socket
• Fast response
• High long-term stability
• excellent linearity
• Robust threaded housing
• Mating splash-proof connector set available
Test voltage: 1000 V ~
Isolation voltage: 100 V ~
Test duration: 1 s
Insertion torque: max. 30 Nm
R
= 2000 Ω± 1%
25
KTY 19-6 M/Z
Type Marking Thread Ordering
Code
KTY 19-6M KTY 19M ISO
M10x1
KTY 19-6Z KTY 19Z NPTF
1/8" × 27
Connector Set
– – Q62901-
(Splash-proof)
Q62705K271
Q62705K272
B80
Pin Configuration Package
12
electrical
contact
electrical
contact
electrical
contact
electrical
contact
BSS303
DIN 1.4305
stainless
steel
– – housing:
potential free
Absolute Maximum Ratings
Parameter Symbol Limit Values Unit
Maximum operating voltage
T
≤ 25 ˚C, t ≤ 10 ms
A
Maximum operating current
Peak operating current
T
≤ 25 ˚C, t ≤ 10 ms
A
1)
V
opmax
I
opmax
I
opp
25 V
5mA
7mA
Operating temperature range
Storage temperature range
1)
ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through
the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks.
Semiconductor Group 1 1997-10-01
T
op
T
stg
− 50 …+ 150 ˚C
− 50 …+ 150 ˚C
KTY 19-6 M/Z
Electrical Characteristics
at
T
= 25 ˚C unless otherwise specified
A
Parameter Symbol Limit Values Unit
min. typ. max.
Temperature sensor resistance
I
= 1 mA KTY 19-6M/Z
B
Thermal time constant (63 % of ∆
in still air
in still oil (Freon FC40/PP7)
T
A
R
25
)
τ
air
τ
oil
Package Outline
Stainless Steel Housing, BSS303 (equiv. DIN 1.4305)
±0.5
48.6
6
Plug-in socket
connects with
AMP Junior Timer
9
12
45˚
No undercut
SW17
Ø3.8
1980 2020
−
−
40
4
SW17
b
17
a
Spade terminals
A2.8x0.8
DIN 46244
without hole
−
−
12
Ω
s
5
M10x1
or NPTF 1/8x27
Weight approx. 20 g
13.5
5
30
GMX05639
Dimensions in mm
Exterior Packaging
I.e. tubes, trays, boxes are shown in our Data Book “Package Information”.
Semiconductor Group 2 1997-10-01