Siemens CF110 Service Manual

Release 1.0

Service Repair Documentation

Level 3 CF110

Release Date Department Notes to change

R 1.0 29.11.2005 BenQ Mobile CC S CES New document

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Table of Content

1 Introduction ...............................................................................................................................4

1.1 PURPOSE...............................................................................................................................4

1.2 SCOPE ...................................................................................................................................4

1.3 TERMS AND ABBREVIATIONS ...................................................................................................4

2 List of available level 4 (Level 2.5e) parts...............................................................................5

3 Required Equipment for Level 4 (level 2,5e)...........................................................................5

4 Required Software for Level 4 (level 2,5e) ..............................................................................6

5 Radio Part ..................................................................................................................................7

5.1 BLOCK DIAGRAM RF PART.......................................................................................................8

5.2 POWER SUPPLY RF-PART ......................................................................................................9

5.3 FREQUENCY GENERATION.......................................................................................................9

5.4 RECEIVER ............................................................................................................................13

5.5 TRANSMITTER.......................................................................................................................14

5.6 BRIGHT IC OVERVIEW...........................................................................................................15

5.7 ANTENNA SWITCH (ELECTRICAL/MECHANICAL) .......................................................................17

6 Logic / Control.........................................................................................................................20

6.1 OVERVIEW OF HARDWARE STRUCTURE CF110.....................................................................20

6.2 EGOLDLITE .........................................................................................................................21

6.3 SRAM..................................................................................................................................27

6.4 FLASH ................................................................................................................................27

6.5 SIM......................................................................................................................................27

6.6 VIBRATION MOTOR ...............................................................................................................27

6.7 MAGNETIC SWITCH...............................................................................................................27

6.8 DISPLAY MODULES ...............................................................................................................28

6.9 ILLUMINATION – KEYBOARD...................................................................................................31

7 Acoustic...................................................................................................................................32

8 Power Supply, Battery and Charging....................................................................................32

8.1 POWER SUPPLY ASIC ..........................................................................................................33

8.2 BATTERY..............................................................................................................................40

8.3 CHARGING CONCEPT............................................................................................................41

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9 Interfaces .................................................................................................................................44

9.1 VIBRA (XG220)....................................................................................................................44

9.2 EARPIECE (XG243)..............................................................................................................45

9.3 MICROPHONE.......................................................................................................................46

9.4 BATTERY (X181) ..................................................................................................................46

9.5 IO CONNECTOR (X211) WITH ESD PROTECTION (Z211)........................................................47

9.6 SIM......................................................................................................................................49

10 Keyboard..................................................................................................................................50

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1 Introduction

1.1 Purpose

This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3.

1.2 Scope

This document is the reference document for all BenQ authorised Service Partners which are
released to repair BenQ Mobile mobile phones up to level 3.

1.3 Terms and Abbreviations

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2 List of available level 3 parts

(according to Component Matrix V1.1 - check C-market for updates)

Product RF Chipset ID Order Number Description CM

CF110 HIT D171 L50610-L6150-D670 IC EGOLDLITE PMB7860
CF110 HIT D361 L50645-J4682-Y55 IC ASIC SALZBURG75 TWIGO3+75
CF110 HIT D902 L50645-K280-Y303 IC FEM HITACHI GSM900 1800 1900 (Fem-Type5)
CF110 HIT D903 L50620-L6170-D670 IC TRANCEIVER HD155165BP PB Free
CF110 HIT L1302 L36151-F5103-M7 COIL 10U (Co-Type2)
CF110 HIT L1303 L36140-F2100-Y6 COIL 0603 (Co-Type4)
CF110 HIT N1304 L36820-C6 250-D670 IC DC DC BOOST CONVERTER
CF110 HIT N308 L506810-C6153-D670 IC ANA RE 2.9V USMD5 PB FREE
CF110 HIT N901 IC MODUL PA PF0814 (PA-Type3) PB Free
CF110 HIT S851 L36197-F5008-F63 IC PER HALL SENSOR (Hs-Type1)

CF110 HIT S852 L36197-F5008-F63 IC PER HALL SENSOR (Hs-Type1)
CF110 HIT V1303 L36840-D5076-D670 DIODE SOD323 (Di-Type7)
CF110 HIT V1400 L36840-D66-D670 DIODE BAV99T (Di-Type5)
CF110 HIT V211 L36830-C1097-D670 TRANSISTOR FDG313N (Tra-Type1)

CF110 HIT V220 L36851-Z9105-Z981 DIODE 1SS355 (Di-Type6)
CF110 HIT V222 L36840-C4014-D670 TRANSISTOR BC847BS BC846S (Tra-Type7)
CF110 HIT V2302 L36840-C4014-D670 TRANSISTOR BC84 7BS BC846S (Tra-Type7)
CF110 HIT V2303 L36840-C4014-D670 TRANSISTOR BC84 7BS BC846S (Tra-Type7)
CF110 HIT V361 L36830-C1110-D670 TRANSISTOR SI3911 (Tra-Type3)
CF110 HIT X3800 L36334-Z97-C334 CONNECTOR COAX SOCKET SWITCHED

CF110 HIT Z171 L50645-F102-Y40 QUARZ 32,768KHZ (Q-Type4)
CF110 HIT Z211 L50640-U6034-D670 FILTER EMI (Fi-Type3) PB Free

3 Required Equipment for Level 3

 GSM-Tester (CMU200 or 4400S incl. Options)
 PC-incl. Monitor, Keyboard and Mouse
 Bootadapter 2000/2002 (L36880-N9241-A200)
 Adapter cable for Bootadapter due to
 Troubleshooting Frame CF110 (F30032-P588-A1)
 Power Supply
 Spectrum Analyser
 Active RF-Probe incl. Power Supply
 Oscilloscope incl. Probe
 RF-Connector (N<>SMA(f))
 Power Supply Cables
 Dongle (F30032-P28-A1) if USB-Dongle is used a special driver for NT is required
 BGA Soldering equipment

Reference: Equipment recommendation V1.6
(downloadable from the technical support page)

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new Lumberg connector (F30032-P226-A1)

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4 Required Software for Level 3

 Windows XP
 X-Focus version 1.68 or higher
 GRT Version 3 or higher
 Internet unblocking solution (JPICS)

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5 Radio Part

The radio part is realizes the conversion of the GMSK-HF-signals from the antenna to the
baseband and vice versa.

In the receiving direction, the signals are split in the I- and Q-component and led to the D/A­converter of the logic part. In the transmission direction, the GMSK-signal is generated in an
Up Conversion Modulation Phase Locked Loop by modulation of the I- and Q-signals which
were generated in the logic part. After that the signals are amplified in the power amplifier.

Transmitter and Receiver are never active at the same time. Simultaneous receiving in the
EGSM900 and GSM1800 band is impossible. Simultaneous transmission in the EGSM900
and GSM1800 band is impossible, too. However the monitoring band (monitoring timeslot)
in the TDMA-frame can be chosen independently of the receiving respectively the
transmitting band (RX- and TX timeslot of the band).

The RF-part is dimensioned for triple band operation (EGSM900, DCS1800, PCS19000)
supporting GPRS functionality up to multiclass 8.

The RF-circuit consists of the following components:

• Hitachi Bright VI E chip set (HD155165BP) with the following functionality:

o PLL for local oscillator LO1 and LO2 and TxVCO
o Integrated local oscillators LO1, LO2
o Integrated TxVCO
o Direct conversion receiver including LNA, DC-mixer, channel filtering and

PGC-amplifier

o 26 MHz reference oscillator

• Hitachi LTCC transmitter power amplifier with integrated power control circuitry

• Hitachi Frontend-Module including RX-/TX-switch and EGSM900 / DCS1800 /

PCS 1900 receiver SAW-filters

• Quartz and passive circuitry of the 26MHz VCXO reference oscillator

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5.1 Block diagram RF part

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5.2 Power Supply RF-Part

The voltage regulator for the RF-part is located inside the ASIC D361.It generates the
required 2,8V “RF-Voltages” named VDD_RF1 and VDD_RF2. VDD_RF2 is passed via a
0Ω resistor and renamed as VDD_BRIGHT as operating voltage for the BRIGHT. The
voltage regulator is activated as well as deactivated via SLEEPQ

VCXOEN_UC

(M4) provided by the EGOLDlite. The temporary deactivation is used to extend

the stand by time.

Circuit diagram

(TDMA-Timer R11) and

VDD_RF1
VDD_RF2

5.3 Frequency generation

Synthesizer: The discrete VCXO (26MHz)
The AX75 mobile is using a reference frequency of 26MHz. The generation of the 26MHz
signal is done via a VCO (Z950).
TP (test point) of the 26MHz signal is the TP 820
The oscillator output signal 26MHz_RF is directly connected to the BRIGHT IC
be used as reference frequency inside the Bright (PLL). The signal leaves the Bright IC as

RF_SIN26M

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(ball G9) to be further used from the EGOLDlite (D171 (C8)).

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Bright 6E

VCXO Out

EGOLD In

To compensate frequency drifts (e.g. caused by temperature) the oscillator frequency is
controlled by the (RF_AFC) signal, generated through the internal EGOLDlite (D171

(A10))

PLL. Reference for the “EGOLD-PLL” is the base station frequency received via the
Frequency Correction Burst.

The required voltage VDD_RF2 is provided by the ASCI D361

Waveform of the AFC_PNM signal from EGOLDlite to Oscillator

Signalform

EGOLD+

1 2 3

1

RF_AFC

R1

AFC_PNM

C1

2

R2

C2

R3

3

C3

GND

GND

GND

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Synthesizer: LO1
First local oscillator (LO1) consists of a PLL and VCO inside Bright (D903) and an internal

loop filter
RF PLL

The frequency-step is 400 kHz in GSM1800 mode and 800kHz in EGSM900 mode due to
the internal divider by two for GSM1800 and divider by four for EGSM900. To achieve the
required settling-time in GPRS operation, the PLL can operate in fastlock-mode a certain
period after programming to ensure a fast settling. After this the loopfilter and currents are
switched into normal-mode to get the necessary phasenoise-performance. The PLL is
controlled via the tree-wire-bus of Bright VI E.

RFVCO (LO1)
The first local oscillator is needed to generate frequencies which enable the transceiver IC
to demodulate the receiver signal and to perform the channel selection in the TX part. The
VCO module is switched on with the signal PLLON. The full oscillation range is divided into
256 sub-bands To do so, a control voltage for the LO1 is used, gained by a comparator.
This control voltage is a result of the comparison of the divided LO1 and the 26MHz
reference Signal. The division ratio of the dividers is programmed by the EGOLDlite,
according to the network channel requirements.

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Matrix to calculate the TX and RX frequencies AX75:

Band RX / TX Channels RF frequencies LO1 frequency IF freq.

EGSM 900 Receive: 0..124 935,0 - 959,8 MHz LO1 = 4*RF
EGSM 900 Transmit: 0..124 890,0 - 914,8 MHz LO1 = 4*(RF+IF) 80,0 MHz

EGSM 900 Receive: 975..1023 925,2 - 934,8 MHz LO1 = 4*RF
EGSM 900 Transmit: 975..1023 880,2 - 889,8 MHz LO1 = 4*(RF+IF) 82,0 MHz
GSM 1800 Receive: 512..661 1805,2 - 1835,0 MHz LO1 = 2*RF
GSM 1800 Transmit: 512..661 1710,2 - 1740,0 MHz LO1 = 2*(RF+IF) 80,0 MHz

GSM 1800 Receive: 661..885 1835,0 - 1879,8 MHz LO1 = 2*RF
GSM 1800 Transmit: 661..885 1740,0 - 1784,8 MHz LO1 = 2*(RF+IF) 82,0 MHz

GSM 1900 Receive: 512..810 1930,2 - 1989,8 MHz LO1 = 2*RF
GSM 1900 Transmit: 512..810 1850,2 - 1909,8 MHz LO1 = 2*(RF+IF) 80,0 MHz

Synthesizer: LO2
The second local oscillator (LO2) consists of a PLL and VCO inside Bright (D903) and an

internal loop filter. Due to the direct conversion receiver architecture, the LO2 is only used
for transmit-operation. The LO2 covers a frequency range of at least 16 MHz (640MHz –
656MHz).
Before the LO2-signal gets to the modulator it is divided by 8. So the resulting TX-IF
frequencies are 80/82 MHz (dependent on the channel and band). The LO2 PLL and power­up of the VCO is controlled via the tree-wire-bus of Bright (EGOLDLite signals RF_DAT;

RF_CLK; RF_STR). To ensure the frequency stability, the 640MHz VCO signal is compared

by the phase detector of the 2

nd

PLL with the 26Mhz reference signal. The resulting control

signal passes the external loop filter and is used to control the 640/656MHz VCO.
The required voltage VDD_BRIGHT is provided by the ASIC D361

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5.4 Receiver

Receiver: Filter to Demodulator
The band filters are located inside the frontend module (D902). The filters are centred to the

band frequencies. The symmetrical filter output is matched to the LNA input of the Bright
.The Bright 6E incorporates three RF LNAs for GSM850/EGSM900, GSM1800 and
GSM1900 operation. The LNA/mixer can be switched in High- and Low-mode to perform an
amplification of ~ 20dB. For the “High Gain“ state the mixers are optimised to conversion
gain and noise figure, in the “Low Gain“ state the mixers are optimised to large-signal
behavior for operation at a high input level. The Bright performs a direct conversion mixers
which are IQ-demodulators. For the demodulation of the received GSM signals the LO1 is
required. The channel depending LO1 frequencies for 1800MHz/1900MHz bands are
divided by 2 and by 4 for 850MHG/900MHz band. Furthermore the IC includes a
programmable gain baseband amplifier PGA (90 dB range, 2dB steps) with automatic DC­offset calibration. LNA and PGA are controlled via EGOLDlite signals RF_DAT; RF_CLK;

RF_STR

baseband filter for both IQ chains. Only two capacitors which are part of the first passive
RC-filters are external. The second and third filters are active filters and are fully integrated.
The IQ receive signals are fed into the A/D converters in the EGAIM part of EGOLDlite. The
post-switched logic measures the level of the demodulated baseband signal and regulates
the level to a defined value by varying the PGA amplification and switching the appropriate
LNA gains.

From the antenna switch, up to the demodulator the received signal passes the following
blocks to get the demodulated baseband signals for the EGOLDlite:

Filter

D903 Bright(D903)

The required voltage VDD_BRIGHT is provided by the ASIC D361

(RF Contr N6, R6, N4). The channel-filtering is realized inside the chip with a three stage

LNA

Demodulator

PGC

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5.5 Transmitter

Transmitter: Modulator and Up-conversion Loop
The generation of the GMSK-modulated signal in Bright (D903) is based on the principle of

up conversion modulation phase locked loop. The incoming IQ-signals from the baseband
are mixed with the divided LO2-signal. The modulator is followed by a lowpass filter (corner
frequency ~80 MHz) which is necessary to attenuate RF harmonics generated by the
modulator. A similar filter is used in the feedback-path of the down conversion mixer.
With help of an offset PLL the IF-signal becomes the modulated signal at the final transmit
frequency. Therefore the GMSK modulated rf-signal at the output of the TX-VCOs is mixed
with the divided LO1-signal to a IF-signal and sent to the phase detector. The I/Q modulated
signal with a center frequency of the intermediate frequency is send to the phase detector
as well.
The output signal of the phase detector controls the TxVCO and is processed by a loop filter
whose components are external to the Bright. The TxVCO which is realized inside the Bright
chip generates the GSMK modulated frequency.

Modulator

Filter

PD

Bright(D903)

The required voltage VDD_BRIGHT is provided by the ASIC D361

TxVCO

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5.6 Bright IC Overview

BRIGHT 6E
IC Overview

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