Siemens BUP309 Datasheet

IGBT
Preliminary data
• High switching speed
• Low tail current
• Latch-up free
• Low forward voltage drop Remark: The TO-218 AB case doesn't solve the standards VDE 0110 and UL 508 for creeping distance
BUP 309
Pin 1 Pin 2 Pin 3
G C E
Type
V
CE
I
C
Package Ordering Code
BUP 309 1700V 25A TO-218 AB Q67078-A4204-A2
Maximum Ratings Parameter Symbol Values Unit
Collector-emitter voltage Collector-gate voltage
R
= 20 k
GE
Gate-emitter voltage DC collector current
T
= 25 °C
C
T
= 90 °C
C
Pulsed collector current,
T
= 25 °C
C
T
= 90 °C
C
t
= 1 ms
p
V
CE
V
CGR
V
GE
I
C
I
Cpuls
1700 V
1700
± 20
A 25 16
50 32
Avalanche energy, single pulse
I
= 15 A,
C
L
= 200 µH,
V
CC
T
= 50 V,
= 25 °C
j
R
GE
= 25
Power dissipation
T
= 25 °C
C
Chip or operating temperature Storage temperature
Semiconductor Group
E
AS
mJ
23
P
tot
W
310
T
j
T
stg
-55 ... + 150 °C
-55 ... + 150
1 Jul-30-1996
BUP 309
Maximum Ratings Parameter Symbol Values Unit
DIN humidity category, DIN 40 040 - E ­IEC climatic category, DIN IEC 68-1 - 55 / 150 / 56
Thermal Resistance
Thermal resistance, chip case
R
thJC
0.4 K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Gate threshold voltage
V
=
GE
V
CE, IC
= 1 mA
Collector-emitter saturation voltage
V V V
GE GE GE
= 15 V, = 15 V, = 15 V,
I
= 15 A,
C
I
= 15 A,
C
I
= 15 A,
C
T
= 25 °C
j
T
= 125 °C
j
T
= 150 °C
j
Zero gate voltage collector current
V
= 1700 V,
CE
V
GE
= 0 V,
T
= 25 °C
j
V
GE(th)
V
CE(sat)
I
CES
4.5 5.5 6.5
-
-
-
-
3.5
-
4.5
1
4.2
-
-
250
V
µA
V
= 1700 V,
CE
V
GE
= 0 V,
T
Gate-emitter leakage current
V
= 20 V,
GE
V
CE
= 0 V
AC Characteristics
Transconductance
V
= 20 V,
CE
I
= 15 A
C
Input capacitance
V
= 25 V,
CE
V
= 0 V, f = 1 MHz
GE
Output capacitance
V
= 25 V,
CE
V
= 0 V, f = 1 MHz
GE
Reverse transfer capacitance
V
= 25 V,
CE
Semiconductor Group
V
= 0 V, f = 1 MHz
GE
= 125 °C
j
I
GES
-
-
1000
nA
- - 100
g
fs
S
- - -
C
iss
pF
- 2000 2700
C
oss
- 160 240
C
rss
- 65 100
2 Jul-30-1996
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