PNP Silicon Darlington Transistors BSP 60
… BSP 62
● High collector current
● Low collector-emitter saturation voltage
● Complementary types: BSP 50 … BSP 52 (NPN)
Type Ordering Code
Marking
(tape and reel)
BSP 60
BSP 61
BSP 62
BSP 60
BSP 61
BSP 62
Q62702-P1166
Q62702-P1167
Q62702-P1168
Pin Configuration
1 2 3 4
B C E C
Package
SOT-223
Maximum Ratings
Parameter Symbol Values Unit
BSP 60 BSP 6180BSP 62
Collector-emitter voltage VCER V
Collector-base voltage VCB0
Emitter-base voltage VEB0
45 60
60 80 90
5
Collector current IC A1
Peak collector current I
CM 2
Base current IB 0.1
Total power dissipation, T
S = 124 ˚C Ptot W
1.5
1)
Junction temperature Tj ˚C
Storage temperature range T
stg
150
– 65 … + 150
Thermal Resistance
Junction - ambient
2)
Junction - soldering point R
1)
For detailed information see chapter Package Outlines.
2)
Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group 1
Rth JA ≤ 72 K/W
th JS ≤ 17
5.91
Electrical Characteristics
A = 25 ˚C, unless otherwise specified.
at T
DC characteristics
BSP 60
… BSP 62
UnitValuesParameter Symbol
min. typ. max.
Collector-emitter breakdown voltage
C = 10 mA, R
= 150 Ω BSP 60
BE
Collector-base breakdown voltage
C = 100 µA, IB = 0 BSP 60
Emitter-base breakdown voltage
E = 100 µA, IB = 0
CE = VCERmax, VBE = 0
V
Emitter-base cutoff current
EB = 4 V, IC = 0
V
DC current gain
C = 150 mA, VCE = 10 V
C = 500 mA, VCE = 10 V
2)
Collector-emitter saturation voltage
C = 500 mA, IB = 0.5 mA
C = 1 A, IB = 1 mA
Base-emitter saturation voltage
C = 500 mA, IB = 0.5 mA
C = 1 A, IB = 1 mA
1)
BSP 61
BSP 62
BSP 61
BSP 62
2)
2)
45
60
80
(BR)CB0
V
60
80
90
V
(BR)EB0 5––
I
CES ––10
I
EB0 ––10
FE
1000
2000––
V
CEsat
–
–
V
BEsat
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1.3
1.8
1.9
2.2
VV(BR)CER
µACollector-emitter cutoff current
–h
V
AC characteristics
C = 100 mA, VCE = 5 V, f = 100 MHz
Switching times
C = 500 mA, IB1 = IB2 = 0.5 mA
(see diagrams)
f
T – 200 –
ton
toff
–
–
400
1500––
MHzTransition frequency
ns
ns
1)
Compare RBE for thermal stability.
2)
Pulse test conditions: t ≤ 300 µs, D = 2 %.
Semiconductor Group 2