Siemens BSP62, BSP61, BSP60 Datasheet

PNP Silicon Darlington Transistors BSP 60
… BSP 62
High collector current
Low collector-emitter saturation voltage
Complementary types: BSP 50 … BSP 52 (NPN)
Marking
(tape and reel)
BSP 60 BSP 61 BSP 62
BSP 60 BSP 61 BSP 62
Q62702-P1166 Q62702-P1167 Q62702-P1168
Pin Configuration
1 2 3 4
B C E C
Package
SOT-223
Maximum Ratings Parameter Symbol Values Unit
BSP 60 BSP 6180BSP 62
Collector-emitter voltage VCER V Collector-base voltage VCB0 Emitter-base voltage VEB0
45 60 60 80 90
5 Collector current IC A1 Peak collector current I
CM 2
Base current IB 0.1 Total power dissipation, T
S = 124 ˚C Ptot W
1.5
1)
Junction temperature Tj ˚C Storage temperature range T
stg
150
– 65 … + 150
Thermal Resistance
Junction - ambient
2)
Junction - soldering point R
1)
For detailed information see chapter Package Outlines.
2)
Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group 1
Rth JA 72 K/W
th JS 17
5.91
Electrical Characteristics
I I
I
I
I I
I
I
I
I I
A = 25 ˚C, unless otherwise specified.
at T
DC characteristics
BSP 60
… BSP 62
UnitValuesParameter Symbol
min. typ. max.
Collector-emitter breakdown voltage
C = 10 mA, R
= 150 BSP 60
BE
Collector-base breakdown voltage
C = 100 µA, IB = 0 BSP 60
Emitter-base breakdown voltage
E = 100 µA, IB = 0
CE = VCERmax, VBE = 0
V
Emitter-base cutoff current
EB = 4 V, IC = 0
V
DC current gain
C = 150 mA, VCE = 10 V C = 500 mA, VCE = 10 V
2)
Collector-emitter saturation voltage
C = 500 mA, IB = 0.5 mA C = 1 A, IB = 1 mA
Base-emitter saturation voltage
C = 500 mA, IB = 0.5 mA C = 1 A, IB = 1 mA
1)
BSP 61 BSP 62
BSP 61 BSP 62
2)
2)
45 60 80
(BR)CB0
V
60 80 90
V
(BR)EB0 5––
I
CES ––10
I
EB0 ––10
FE
1000 2000––
V
CEsat
– –
V
BEsat
– –
– – –
– – –
– – –
– – –
– –
– –
– –
1.3
1.8
1.9
2.2
VV(BR)CER
µACollector-emitter cutoff current
h
V
AC characteristics
C = 100 mA, VCE = 5 V, f = 100 MHz
Switching times
C = 500 mA, IB1 = IB2 = 0.5 mA
(see diagrams)
f
T 200
ton toff
– –
400 1500––
MHzTransition frequency
ns ns
1)
Compare RBE for thermal stability.
2)
Pulse test conditions: t 300 µs, D = 2 %.
Semiconductor Group 2
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