Siemens BSP452 Datasheet

MiniPROFET
High-side switch
Short-circuit protection
Overtemperature protection with hysteresis
Overload protection
Overvoltage protection
Switching inductive load
Clamp of negative output voltage with inductive loads
Undervoltage shutdown
Maximum current internally limited
Electrostatic discharge (ESD) protection
Reverse battery protection
Package: SOT 223
1)
Mini PROFET® BSP 452
4
3
2
1
Type
BSP 452
Ordering code
Q67000-S271
Application
µC compatible power switch for 12 V DC grounded loads
All types of resistive, inductive and capacitive loads
Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
+ V
bb
Voltage
source
ESD­Diode
R
in
IN
3
ESD
V
Logic
Voltage
sensor
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
Current
limit
Gate
protection
Limit for
unclamped
ind. loads
Temperature
sensor
4
OUT
1
Load
GND
MINI-PROFET
2
Load GND
1)
With resistor R
limited by connected load.
=150 Ω in GND connection, resistor in series with IN connections reverse load current
GND
Signal GND
Semiconductor Group 1 08.96
Mini PROFET® BSP 452
)
)
Pin Symbol Function
1 OUT O Output to the load 2 GND - Logic ground 3 IN I Input, activates the power switch in case of logical high signal 4 Vbb + Positive power supply voltage
at
= 25 °C unless otherwise specified
T
Maximum Ratings Parameter Symbol Values Unit
Supply voltage Load current self-limited Maximum input voltage Maximum input current Inductive load switch-off energy dissipation, single pulse (not tested, specified by design) Load dump protection
=2 ,
R
I
=400ms, IN= low or high,
t
d
(not tested, specified by design) Electrostatic discharge capability (ESD
Operating temperature range Storage temperature range Max. power dissipation (DC)
j
2)
)
3
V
I
= 0.5A ,
L
LoadDump
6)
=
U
A
U
T
A
+
V
s RL
=12V
A
5)
PIN 1,2,4
T
A
= 150°C
= 24
= 80
R
L
PIN 3
= 25 °C
V
bb
I
L
V
IN
I
IN
E
AS
V
Load dump
V
ESD
T
j
T
stg
P
tot
)
4
40 V
I
L(SC
-5.0...
V
bb
±5 mA
0.5 J
47 67
±1 ±2
-40 ...+150
-55 ...+150
1.8 W
A V
V
kV
°C
Thermal resistance chip - soldering point:
chip - ambient:
2)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
3)
Supply voltages higher than V
A resistor for the protection of the input is integrated.
4)
V
Load dump
5)
HBM according to MIL-STD 883D, Methode 3015.7
6)
BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection
bb(AZ)
R
6)
R
Semiconductor Group 2
thJS thJA
70
7
K/W
Mini PROFET® BSP 452
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
T
at
= 25 °C,
j
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
I
= 0.5 A,
L
Nominal load current (pin 4 to 1) ISO Standard:
T
= 85 °C
S
Turn-on time to 90% Turn-off time to 10%
R
= 24
L
Slew rate on 10 to 30% Slew rate off
70 to 40%
V
= 13.5V unless otherwise specified
bb
V
= high
in
7)
V
V
V
OUT
OUT
ON
R
,
,
=
= 24
L
R
L
V
-
bb
= 24
V
OUT
= 0.5 V
T
= 25°C
j
T
= 150°C
j
V V
OUT OUT
R
ON
I
L(ISO)
t
on
t
off
dV /dt
-dV/dt
on
off
min typ max
--
--
0.16
--
0.2
0.4
1.7 -- -- A
--
--
60 60
100 150
-- 2 4 V/µs
-- 2 4 V/µs
µs
Input
Allowable input voltage range, (pin 3 to 2) Input turn-on threshold voltage
T
= -40...+150°C
j
Input turn-off threshold voltage
T
= -40...+150°C
j
Input threshold hysteresis Off state input current (pin 3)
On state input current (pin 3)
V
IN(on)
IN(off)
V
= -40...+150°C
T
j
= 3.0 V to
= -40...+150°C
T
j
Input resistance
= 1.2 V
V
bb
V
IN
V
IN(T+)
V
IN(T-)
V I
IN(off)
I
IN(on)
R
IN
IN(T)
-3.0 --
V
bb
-- -- 3.5 V
1.5 -- -- V
-- 0.5 -- V
10 -- 60
10 -- 100
1.5 2.8 3.5 k
V
A
µ
A
µ
7
)
characterizes the MOSFET part of the device and may be higher than the shortcircuit current
I
L(ISO)
Semiconductor Group 3
of the whole device
I
L(SC)
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