MiniPROFET
•
High-side switch
•
Short-circuit protection
•
Input protection
•
Overtemperature protection with hysteresis
•
Overload protection
•
Overvoltage protection
•
Switching inductive load
•
Clamp of negative output voltage with inductive loads
•
Undervoltage shutdown
•
Maximum current internally limited
•
Electrostatic discharge (ESD) protection
•
Reverse battery protection
Package: SOT 223
1)
Mini PROFET® BSP 452
4
3
2
1
Type
BSP 452
Ordering code
Q67000-S271
Application
•
µC compatible power switch for 12 V DC grounded loads
•
All types of resistive, inductive and capacitive loads
•
Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically
integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
+ V
bb
Voltage
source
ESDDiode
R
in
IN
3
ESD
V
Logic
Voltage
sensor
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
Current
limit
Gate
protection
Limit for
unclamped
ind. loads
Temperature
sensor
4
OUT
1
Load
GND
MINI-PROFET
2
Load GND
1)
With resistor R
limited by connected load.
=150 Ω in GND connection, resistor in series with IN connections reverse load current
GND
Signal GND
Semiconductor Group 1 08.96
Mini PROFET® BSP 452
Pin Symbol Function
1 OUT O Output to the load
2 GND - Logic ground
3 IN I Input, activates the power switch in case of logical high signal
4 Vbb + Positive power supply voltage
at
= 25 °C unless otherwise specified
T
Maximum Ratings
Parameter Symbol Values Unit
Supply voltage
Load current self-limited
Maximum input voltage
Maximum input current
Inductive load switch-off energy dissipation,
single pulse
(not tested, specified by design)
Load dump protection
=2Ω ,
R
I
=400ms, IN= low or high,
t
d
(not tested, specified by design)
Electrostatic discharge capability (ESD
Operating temperature range
Storage temperature range
Max. power dissipation (DC)
j
2)
)
3
V
I
= 0.5A ,
L
LoadDump
6)
=
U
A
U
T
A
+
V
s RL
=12V
A
5)
PIN 1,2,4
T
A
= 150°C
= 24Ω
= 80Ω
R
L
PIN 3
= 25 °C
V
bb
I
L
V
IN
I
IN
E
AS
V
Load dump
V
ESD
T
j
T
stg
P
tot
)
4
40 V
I
L(SC
-5.0...
V
bb
±5 mA
0.5 J
47
67
±1
±2
-40 ...+150
-55 ...+150
1.8 W
A
V
V
kV
°C
Thermal resistance chip - soldering point:
chip - ambient:
2)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
3)
Supply voltages higher than V
A resistor for the protection of the input is integrated.
4)
V
Load dump
5)
HBM according to MIL-STD 883D, Methode 3015.7
6)
BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection
bb(AZ)
R
6)
R
Semiconductor Group 2
thJS
thJA
70
7
K/W
Mini PROFET® BSP 452
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
T
at
= 25 °C,
j
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
I
= 0.5 A,
L
Nominal load current (pin 4 to 1)
ISO Standard:
T
= 85 °C
S
Turn-on time to 90%
Turn-off time to 10%
R
= 24 Ω
L
Slew rate on
10 to 30%
Slew rate off
70 to 40%
V
= 13.5V unless otherwise specified
bb
V
= high
in
7)
V
V
V
OUT
OUT
ON
R
,
,
=
= 24 Ω
L
R
L
V
-
bb
= 24 Ω
V
OUT
= 0.5 V
T
= 25°C
j
T
= 150°C
j
V
V
OUT
OUT
R
ON
I
L(ISO)
t
on
t
off
dV /dt
-dV/dt
on
off
min typ max
--
--
0.16
--
0.2
0.4
1.7 -- -- A
--
--
60
60
100
150
-- 2 4 V/µs
-- 2 4 V/µs
Ω
µs
Input
Allowable input voltage range, (pin 3 to 2)
Input turn-on threshold voltage
T
= -40...+150°C
j
Input turn-off threshold voltage
T
= -40...+150°C
j
Input threshold hysteresis
Off state input current (pin 3)
On state input current (pin 3)
V
IN(on)
IN(off)
V
= -40...+150°C
T
j
= 3.0 V to
= -40...+150°C
T
j
Input resistance
= 1.2 V
V
bb
V
IN
V
IN(T+)
V
IN(T-)
∆V
I
IN(off)
I
IN(on)
R
IN
IN(T)
-3.0 --
V
bb
-- -- 3.5 V
1.5 -- -- V
-- 0.5 -- V
10 -- 60
10 -- 100
1.5 2.8 3.5 k
V
A
µ
A
µ
Ω
7
)
characterizes the MOSFET part of the device and may be higher than the shortcircuit current
I
L(ISO)
Semiconductor Group 3
of the whole device
I
L(SC)